一种基于超软基体材料的导热垫片
By using a thermally conductive pad based on an ultra-soft substrate material, and by utilizing the uniform dispersion of liquid thermal conductive agent and the elastic deformation of thermally conductive sheet, the problem of existing thermally conductive pads being unable to quickly conduct and absorb heat in a timely manner is solved, achieving rapid and efficient heat dissipation and conduction.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- FUJIAN MEITEK THERMAL TECH CO LTD
- Filing Date
- 2025-08-19
- Publication Date
- 2026-07-17
AI Technical Summary
Existing thermal pads cannot quickly and efficiently conduct the heat generated by the heating element, leading to a decrease in the performance of the heating element or damage. They cannot absorb the heat buildup when the heating element first starts working in time, and they cannot continuously improve the heat conduction efficiency.
The thermally conductive pad, based on an ultra-soft substrate material, includes components such as a connecting frame, thermally conductive sheet, adhesive layer, thermally conductive plate, thermally conductive spring, liquid thermally conductive agent, thermally conductive wire, and thermally conductive powder. Through the uniform dispersion of the liquid thermally conductive agent and the elastic deformation of the thermally conductive spring, rapid heat conduction and absorption are achieved.
It enables rapid and efficient heat dissipation of the heating element during continuous operation, preventing performance degradation or damage, and absorbs heat promptly when it starts working, continuously improving heat conduction efficiency.
Smart Images
Figure CN120857446B_ABST