A uniform temperature plate and an optical module

Abstract

The present application relates to the field of optical communication technology, in particular to a uniform temperature plate and an optical module. The present application first absorbs the heat generated by the heat source by the lower shell, then absorbs the heat absorbed by the lower shell by the heat dissipation working medium in the steam cavity, the heat dissipation working medium changes from liquid to gas after absorbing heat, the gaseous heat dissipation working medium is adsorbed on the inner surface of the upper shell, and is cooled to liquid and returns to the bottom of the steam cavity, so as to realize the heat dissipation of the heat source in the optical module; the interface contact thermal resistance in the present application is only between the heat source and the lower shell, and between the upper shell and the external environment, which greatly reduces the number of interface contact thermal resistance on the heat transfer path, by setting the uniform temperature plate as part of the optical module, an integrated reinforced heat dissipation structure is formed, the increase of interface contact thermal resistance caused by split design is avoided, the overall optical module heat dissipation performance is improved, and the heat dissipation demand of high-speed optical module is met.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of optical communication technology, in particular to a heat spreader and an optical module. BACKGROUND

[0002] With the continuous development of optical communication technology, super-speed optical modules with a speed of 400G and above have emerged. Due to the doubling of the number of channels, the multiplication of the speed and the far greater power consumption of super-speed optical modules than 100G speed optical modules, optical modules need to work within their defined temperature range. If the working temperature is too high, the device will age faster and the performance of the optical module will be affected. Therefore, the heat dissipation structure of the optical module is particularly important.

[0003] The heat spreader is a high-efficiency optical module heat dissipation solution that achieves rapid heat conduction and diffusion through the phase change process of the internal working liquid. This technology is widely used in electronic devices that require efficient heat dissipation management.

[0004] In the field of optical modules, the heat spreader is usually installed inside the optical module shell, and the heat dissipation element conducts heat to the heat spreader through the heat dissipation tungsten copper. After the heat spreader receives the heat, it transmits the heat to the upper cover, and then dissipates the heat through the heat sink welded on the upper cover. However, the contact thermal resistance between the heat dissipation element and the tungsten copper, the tungsten copper and the heat spreader, the heat spreader and the upper cover, and the upper cover and the heat sink will affect the heat dissipation efficiency of the heat dissipation element. Even with the high-efficiency heat dissipation solution of the heat spreader, the heat dissipation problem of the high-speed optical module cannot be effectively solved.

[0005] Therefore, it is urgent to overcome the defects of the prior art in the technical field. SUMMARY

[0006] The technical problem to be solved by the present application is how to solve the heat dissipation problem of high-speed optical modules.

[0007] The present application adopts the following technical solutions:

[0008] In a first aspect, a heat spreader is provided, which is arranged on an upper cover of an optical module. The heat spreader comprises: an upper shell 1 and a lower shell 2; the upper shell 1 and the lower shell 2 are used to form a sealed vapor cavity.

[0009] The bottom of the lower shell 2 is used to contact a heat source inside the optical module; a heat dissipation working medium is stored in the vapor cavity, and the heat dissipation working medium is used to absorb heat generated by the heat source.

[0010] Preferably, the bottom of the lower shell 2 is provided with a heat conduction groove 20 corresponding to the heat source, and the heat conduction groove 20 is used to abut the heat source inside the optical module to absorb heat generated by the heat source.

[0011] Preferably, the heat-conducting groove 20 comprises a first groove 200, a flow guide groove 201, and a second groove 202; one end of the flow guide groove 201 is connected with the first groove 200, and the other end of the flow guide groove 201 is connected with the second groove 202.

[0012] The lower bottom of the first groove 200 and the lower bottom of the second groove 202 are respectively in abutment with heat sources of different heat generation amounts.

[0013] Preferably, the inner surface of the upper shell 1 is provided with a flow guide slope 10, which is inclined at a preset angle relative to the inner surface of the lower shell 2, and the lowest point of the flow guide slope 10 corresponds to the projection area range of the first groove 200 on the upper shell 1, so that the liquid heat dissipation working medium preferentially returns to the first groove 200 along the flow guide slope 10.

[0014] Preferably, the inner surface of the upper shell 1 is provided with a flow guide protrusion 11, and the lowest point of the flow guide protrusion 11 corresponds to the projection area range of the second groove 202 on the upper shell 1, so that the liquid heat dissipation working medium preferentially returns to the second groove 202 along the flow guide protrusion 11.

[0015] Preferably, the inner surface of the upper shell 1 is provided with a heat-conducting support column 12, one end of which is in abutment with the inner wall of the lower shell 2.

[0016] Preferably, the heat-conducting support column 12 comprises a first support column 120, a second support column 121, and a third support column 122; the first support column 120 is in abutment with the bottom wall of the first groove 200, the second support column 121 is in abutment with the bottom wall of the second groove 202, and the third support column 122 is in abutment with other areas of the inner wall of the lower shell 2 except the first groove 200 and the second groove 202.

[0017] Preferably, the outer surface of the upper shell 1 is provided with a heat dissipation assembly 13 for absorbing heat.

[0018] Preferably, the heat dissipation assembly 13 comprises heat dissipation fins 130 and a heat dissipation cover plate 131, the heat dissipation cover plate 131 is arranged on the heat dissipation fins 130, and a heat dissipation flow channel 132 is formed between the heat dissipation fins 130 and the heat dissipation cover plate 131.

[0019] Preferably, a liquid-absorbing capillary core 21 is arranged on the inner surface of the lower shell 2, and the liquid-absorbing capillary core 21 is used for storing the heat dissipation working medium.

[0020] Preferably, the liquid-absorbing capillary core 21 is arranged on the inner surface of the lower shell 2 by sintering processing.

[0021] Preferably, the upper shell 1 and the lower shell 2 are fixedly connected by diffusion welding or brazing to form the steam cavity.

[0022] Preferably, the heat dissipation working medium is water or methanol.

[0023] In a second aspect, a light module is provided, comprising an upper cover 3, a base 4, a circuit board 5, and a vapor chamber as described in the first aspect arranged on the upper cover 3; the upper cover 3 and the base 4 are used to cooperate to form an inner cavity accommodating the circuit board 5; the bottom of the lower shell 2 is in contact with a heat source on the circuit board 5 to absorb heat generated by the heat source.

[0024] Preferably, the bottom of the upper cover 3 is provided with a fixing surface 30, the fixing surface 30 is provided with a window 31, the vapor chamber is arranged on the fixing surface 30, and the lower shell 2 is in contact with the heat source on the circuit board 5 through the window 31.

[0025] Compared with the prior art, the present application has the following beneficial effects:

[0026] In the present application, the vapor chamber is arranged on the upper cover 3 of the light module, a sealed steam cavity is formed by the upper shell 1 and the lower shell 2, the bottom of the lower shell 2 is in contact with the heat source inside the light module, the heat generated by the heat source is first absorbed by the lower shell 2, then the heat absorbed by the lower shell 2 is absorbed by the heat dissipation working medium in the steam cavity, the heat dissipation working medium changes from liquid state to gaseous state after absorbing heat, the gaseous heat dissipation working medium is adsorbed on the inner surface of the upper shell 1, and is cooled to liquid state again and returns to the bottom of the steam cavity, so that the heat dissipation of the heat source in the light module is realized; in the present application, the interface contact thermal resistance is only between the heat source and the lower shell 2, and between the upper shell 1 and the external environment, the number of interface contact thermal resistances in the heat transfer path is greatly reduced, by arranging the vapor chamber as part of the light module, an integrated enhanced heat dissipation structure is formed, the increase of interface contact thermal resistance caused by split design is avoided, the overall light module heat dissipation performance is improved, and the heat dissipation requirement of the high-speed light module is met.

[0027] On the other hand, the vapor chamber can be processed in various ways such as aluminum extrusion, die casting, mechanical processing and stamping, the production process is simple, and is suitable for batch production of light modules. BRIEF DESCRIPTION OF DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the following embodiment or prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0029] Figure 1 is a structural schematic diagram of an optical communication system provided by an embodiment of the present application;

[0030] Figure 2 is a mounting structure schematic diagram of a vapor chamber in an optical module provided by an embodiment of the present application;

[0031] Figure 3 is a structural schematic diagram of a vapor chamber provided by an embodiment of the present application;

[0032] Figure 4 is a structural schematic diagram of another vapor chamber provided by an embodiment of the present application;

[0033] Figure 5 is a structural schematic diagram of a liquid absorbing capillary provided by an embodiment of the present application;

[0034] Figure 6 is a structural schematic diagram of another liquid absorbing capillary provided by an embodiment of the present application;

[0035] Figure 7 is a structural schematic diagram of a heat conduction groove 20 provided by an embodiment of the present application;

[0036] Figure 8 is a structural schematic diagram of another heat conduction groove 20 provided by an embodiment of the present application;

[0037] Figure 9 is a structural schematic diagram of a first groove, a flow guiding groove and a second groove provided by an embodiment of the present application;

[0038] Figure 10 is a structural schematic diagram of a flow guiding inclined surface provided by an embodiment of the present application;

[0039] Figure 11 is a structural schematic diagram of another flow guiding inclined surface provided by an embodiment of the present application;

[0040] Figure 12 is a schematic diagram of liquid backflow on a flow guiding inclined surface provided by an embodiment of the present application;

[0041] Figure 13 is a structural schematic diagram of a flow guiding protrusion provided by an embodiment of the present application;

[0042] Figure 14 is a structural schematic diagram of another flow guiding protrusion provided by an embodiment of the present application;

[0043] Figure 15 is a schematic diagram of liquid backflow on a flow guiding protrusion provided by an embodiment of the present application;

[0044] Figure 16 is a structural schematic diagram of a flow guiding support column provided by an embodiment of the present application;

[0045] Figure 17 is a structural schematic diagram of a heat dissipation assembly provided by an embodiment of the present application;

[0046] Figure 18 is a structural schematic diagram of another heat dissipation assembly provided by an embodiment of the present application;

[0047] Figure 19 is a structural schematic diagram of an upper shell provided by an embodiment of the present application;

[0048] Figure 20 is a structural schematic diagram of an assembly structure of an upper shell in an upper cover provided by an embodiment of the present application;

[0049] Figure 21 is a structural schematic diagram of an assembly structure of an upper shell in an optical module provided by an embodiment of the present application;

[0050] Figure 22 is a structural schematic diagram of a heat dissipation fin and a heat dissipation cover plate provided by an embodiment of the present application;

[0051] Figure 23 is a structural schematic diagram of an optical module provided by an embodiment of the present application;

[0052] Figure 24 is a structural schematic diagram of another optical module provided by an embodiment of the present application;

[0053] Figure 25 is a structural schematic diagram of an installation structure of a uniform temperature plate on an upper cover provided by an embodiment of the present application.

[0054] In all the drawings, the same reference numbers represent the same structures, wherein:

[0055] upper shell 1, flow guide inclined surface 10, matching inclined surface 100, flow guide protrusion 11, first inclined surface 110, second inclined surface 111, third inclined surface 112, fourth inclined surface 113, heat conduction support column 12, first support column 120, second support column 121, third support column 122, heat dissipation assembly 13, heat dissipation fin 130, heat dissipation cover plate 131, heat dissipation flow channel 132, lower shell 2, heat conduction groove 20, first groove 200, flow guide groove 201, second groove 202, liquid absorption capillary core 21, upper cover 3, fixing surface 30, window 31, base 4, circuit board 5. DETAILED DESCRIPTION

[0056] In order to make the purpose, technical solutions and advantages of the present application more clear, the present application is further described in detail below in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application, and are not used to limit the present application.

[0057] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as openly inclusive, meaning "including, but not limited to." In the description of the specification, terms such as "one embodiment," "some embodiments," "exemplary embodiment," "example," "specific example," or "some examples" are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this disclosure. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics mentioned may be included in any suitable manner in any one or more embodiments or examples; that is, although they may be incorporated into embodiments or examples using the above terms for reasons such as order and position, it does not limit them to be incorporated in combination by a single embodiment or example.

[0058] In the description of this invention, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this disclosure, unless otherwise stated, "a plurality of" means two or more. Furthermore, for example, the description may use the prefix "A" or "B" to describe the same type of nouns as two independent entities. In this case, the corresponding features defined with "A" and "B" are used only to distinguish between similar entities and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features.

[0059] In describing some embodiments, the terms "coupled," "coupled," and "connected," and their derivative expressions, may be used. For example, the term "connected" may be used in describing some embodiments to indicate that two or more components have direct physical or electrical contact with each other. Similarly, the term "coupled" may be used in describing some embodiments to indicate that two or more components have direct physical or electrical contact. However, the terms "connected" or "coupled" may also refer to two or more components that do not have direct contact with each other but still cooperate or interact with each other, such as "optical coupling," "wireless connection," etc. The embodiments disclosed herein are not necessarily limited to the scope of this invention.

[0060] Furthermore, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other. Figure 1 This is a connection diagram of an optical communication system. (Example:) Figure 1 As shown, the optical communication system mainly includes an optical network terminal 60, a remote server 61, a local information processing device 62, an optical module 63, an optical fiber 64, and a network cable 65.

[0061] One end of the optical fiber 64 is connected to the remote server 61, and the other end is connected to the optical network terminal 60 through the optical module 63. The optical fiber itself can support long-distance signal transmission, for example, thousands of meters (6-8 kilometers) of signal transmission, and theoretically, ultra-long distance transmission can be achieved if a repeater is used. Therefore, in a general optical communication system, the distance between the remote server 61 and the optical network terminal 60 can usually reach thousands of meters, tens of kilometers, or hundreds of kilometers.

[0062] One end of the network cable 65 is connected to the local information processing device 62, and the other end is connected to the optical network terminal 60. The local information processing device 62 can be any one or several of the following devices: a router, an optical network terminal, a computer, a mobile phone, a tablet computer, and a television, etc.

[0063] The physical distance between the remote server 61 and the optical network terminal 60 is greater than the physical distance between the local information processing device 62 and the optical network terminal 60. The connection between the local information processing device 62 and the remote server 61 is completed by the optical fiber 64 and the network cable 65; and the connection between the optical fiber 64 and the network cable 65 is completed by the optical module 63 and the optical network terminal 60.

[0064] The optical module 63 includes an optical port and an electrical port. The optical port is configured to be connected to the optical fiber 64, so that the optical module 63 and the optical fiber 64 establish a bidirectional optical signal connection; the electrical port is configured to access the optical network terminal 60, so that the optical module 63 and the optical network terminal 60 establish a bidirectional electrical signal connection. The optical module 63 can realize the mutual conversion between optical signals and electrical signals, thereby establishing a connection between the optical fiber 64 and the optical network terminal 60. For example, the optical signal from the optical fiber 64 is converted into an electrical signal by the optical module 63 and then input into the optical network terminal 60, and the electrical signal from the optical network terminal 60 is converted into an optical signal by the optical module 63 and then input into the optical fiber 64.

[0065] The optical network terminal 60 includes a housing generally in the shape of a cuboid, and a network cable interface 65 and an optical module interface 67 provided on the housing. The optical module interface 67 is configured to access the optical module 63, so that the optical network terminal 60 establishes a bidirectional electrical signal connection with the optical module 63. The network cable interface 65 is configured to access the network cable 65, so that the optical network terminal 60 establishes a bidirectional electrical signal connection with the network cable 65. The connection between the optical module 63 and the network cable 65 is established through the optical network terminal 60. For example, the optical network terminal 60 transmits electrical signals from the optical module 63 to the network cable 65, and transmits signals from the network cable 65 to the optical module 63, so that the optical network terminal 60, as a host of the optical module 63, can monitor the operation of the optical module 63. The host of the optical module 63 can also include an optical line terminal (OLT) and the like in addition to the optical network terminal 60.

[0066] The remote server 61 establishes a bidirectional signal transmission channel with the local information processing device 62 through the optical fiber 64, the optical module 63, the optical network terminal 60, and the network cable 65.

[0067] The optical network terminal 60 further includes a PCB circuit board provided in the housing, a cage (not shown in the figure) provided on the surface of the PCB circuit board, an electrical connector provided inside the cage, and a heat sink on the surface of the cage. The electrical connector is configured to access the electrical port of the optical module 63. The heat sink has a fin or other protrusion that increases the heat dissipation area.

[0068] The optical module 63 is inserted into the cage of the optical network terminal 60, and the optical module 63 is fixed by the cage. The heat generated by the optical module 63 is conducted to the cage, and then diffused through the heat sink. After the optical module 63 is inserted into the cage, the electrical port of the optical module 63 is connected to the electrical connector inside the cage, so that the optical module 63 establishes a bidirectional electrical signal connection with the optical network terminal 60. In addition, the optical port of the optical module 63 is connected to the optical fiber 64, so that the optical module 63 establishes a bidirectional electrical signal connection with the optical fiber 64.

[0069] In some embodiments of the present application, the optical module 63 includes a housing composed of a top cover and a base, and a circuit board body. The top cover is covered on the base to form the above-mentioned housing with two openings. The outer contour of the housing generally presents a square body.

[0070] The direction of the line connecting the two openings can be consistent with the length direction of the optical module 63, or can be inconsistent with the length direction of the optical module 63. For example, one of the openings is located at the end of the optical module 63, and the other opening is located at the end of the optical module 63. Alternatively, one of the openings is located at the end of the optical module 63, and the other opening is located at the side of the optical module 63. One of the openings is an electrical port, and the gold fingers of the circuit board extend from the electrical port and are inserted into the host computer (such as the optical network terminal 60). The other opening is an optical port configured to access the external optical fiber 64, so that the optical fiber 64 is connected to the inside of the optical module 63.

[0071] The assembly method of combining the upper cover and the base facilitates the installation of the circuit board and other devices into the shell, and the upper cover and the base can form a packaging protection for these devices. In addition, when the circuit board and other devices are assembled, the deployment of the positioning components, heat dissipation components, and electromagnetic shielding components of these devices is facilitated, which is beneficial to the implementation of automated production.

[0072] In some embodiments, the upper cover and the base are generally made of metal materials, which is beneficial to realize electromagnetic shielding and heat dissipation.

[0073] In some embodiments, the optical module 63 further includes an unlocking component located on the outer wall of the shell of the optical module 63, and the unlocking component is configured to realize the fixed connection between the optical module 63 and the host computer, or to release the fixed connection between the optical module 63 and the host computer.

[0074] For example, the unlocking component is located on the outer wall of the two lower side plates of the base and includes a clamping component matched with the cage of the host computer (for example, the cage of the optical network terminal 60). When the optical module 63 is inserted into the cage of the host computer, the clamping component of the unlocking component fixes the optical module 63 in the cage of the host computer. When the unlocking component is pulled, the clamping component of the unlocking component moves, thereby changing the connection relationship between the clamping component and the host computer, so as to release the clamping relationship between the optical module 63 and the host computer, and the optical module 63 can be pulled out of the cage of the host computer.

[0075] The circuit board includes circuit traces, electronic components and chips. The electronic components and chips are connected together by the circuit traces according to circuit design to realize power supply, electrical signal transmission and grounding functions. The electronic components may include, for example, capacitors, resistors, transistors, metal oxide semiconductor field effect transistors (MOSFETs). The chips may include, for example, microcontroller units (MCUs), limiting amplifiers, clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0076] The circuit board is generally a hard circuit board. Due to its relatively hard material, the hard circuit board can also realize a bearing function, such as the hard circuit board can stably bear the chips; the hard circuit board can also be inserted into the electrical connector in the host computer cage.

[0077] The circuit board also includes a gold finger formed on the surface of the end thereof. The gold finger is composed of a plurality of independent pins. The circuit board is inserted into the cage, and the gold finger is connected in conduction with the electrical connector in the cage. The gold finger can be arranged only on one side of the surface of the circuit board, or can be arranged on the upper and lower surfaces of the circuit board to adapt to occasions requiring a large number of pins. The gold finger is configured to establish electrical connection with the host computer to realize power supply, grounding, I2C signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. The flexible circuit board is generally used in cooperation with the hard circuit board to serve as a supplement to the hard circuit board.

[0078] The present application is applicable to OSFP (full name: Octal Small Form-factor Pluggable, abbreviation: OSFP) packaging and OSFP-XD (full name: Octal Small Form-Factor Pluggable-Extra Density, abbreviation: OSFP-XD) packaging, and can also be extended to QSFP-56 (full name: Quad Small Form-factor Pluggable-56, abbreviation: QSFP-56) packaging, QSFP-112 packaging, QSFP-DD (full name: Quad Small Form-factor Pluggable-Double Density, abbreviation: QSFP-DD) packaging. Since the packaging of the optical module is more of a custom shell format to adapt to the scene size, therefore, the optical path structure and / or circuit structure theory proposed by the inventive labor should also be applicable to the possible packaging formats proposed in the future without explicit technical conflicts, and therefore should also be understood as being within the protection scope of the present application.

[0079] It should be noted that the foregoing is only an exemplary display of the structure of the optical module, in order to systematically introduce the optical module, and does not limit the structure of the optical module. In actual application scenarios, the structure of the optical module can be adaptively changed according to actual needs. For example, changing the form of the unlocking structure, changing the layout form of the light emitting assembly and the light receiving assembly, changing the structure of the optical module shell, changing the form of the optical fiber connector, etc.

[0080] Embodiment 1:

[0081] For high-speed optical modules, placing the uniform temperature plate inside the optical module shell can easily increase the interface contact thermal resistance, and the split design can cause poor heat dissipation effect, which cannot meet the heat dissipation requirements of high-speed optical modules. In order to solve the above problems, the present embodiment proposes a uniform temperature plate, as shown in Figure 2 The uniform temperature plate (i.e. VC) is arranged on the upper cover 3 of the optical module, and the optical module further comprises a base 4, and a heat source is arranged in the inner cavity composed of the upper cover 3 and the base 4.

[0082] In one embodiment, as shown in Figure 3 and Figure 4 The uniform temperature plate comprises: an upper shell 1 and a lower shell 2; the upper shell 1 and the lower shell 2 are used to form a sealed vapor cavity; the bottom of the lower shell 2 is used to contact with a heat source inside the optical module; a heat dissipation working medium is stored in the vapor cavity, and the heat dissipation working medium is used to absorb heat generated by the heat source.

[0083] Among them, the heat source is a chip that needs to be cooled.

[0084] The upper shell 1 and the lower shell 2 can be fixedly connected by diffusion welding or brazing to form the vapor cavity. The upper shell 1 and the lower shell 2 are made of materials with good thermal conductivity, such as copper or copper alloy, and are sealed together by brazing or diffusion welding. After a certain amount of heat dissipation working medium is added to the vapor cavity and vacuumized, a highly vacuumized vapor cavity is formed for the evaporation of the heat dissipation working medium and cooling. In an embodiment, the heat dissipation working medium is water or methanol.

[0085] The bottom of the lower shell 2 is in direct physical contact with the heat source, enhancing the conductivity of the heat emitted by the heat source and facilitating direct absorption of the heat. To further improve the heat absorption capacity of the lower shell 2, in an embodiment, a heat-conducting material such as heat-conducting silicone grease is applied between the top of the heat source and the bottom of the lower shell 2 to fill the tiny gaps between the heat source and the bottom of the lower shell 2, thereby maximizing the reduction of the thermal contact resistance between the bottom of the lower shell 2 and the heat source. The working principle of the vapor chamber includes:

[0086] The heat source in the optical module generates heat, which is conducted to the lower shell 2 of the vapor chamber through direct contact. The heat dissipation working medium inside the lower shell 2 gradually evaporates into vapor after absorbing heat. The vapor rapidly diffuses throughout the cavity (including the inner surface area of the upper shell 1 with lower temperature) under the action of the internal pressure difference in the vapor cavity. When the vapor contacts the cooler inner surface of the upper shell 1, it releases latent heat of vaporization by cooling the upper shell 1 or exchanging temperature with the environment, and condenses back into liquid. In this process, a large amount of heat is quickly transferred to the upper shell 1. The condensed heat dissipation working medium returns to the bottom of the lower shell 2, ready to start the next cycle.

[0087] The inside of the lower shell 2 can be selectively designed according to different working modes (referring to the installation state of the optical module, such as horizontal placement, inversion or oblique insertion, etc.) of the optical module, so that the condensed heat dissipation working medium returns to the bottom of the lower shell 2. When the optical module is not in a horizontal state (horizontal state refers to the upper cover being directly above and the base being directly below) after being inserted into the switch port, in an embodiment, as shown in Figure 5 and Figure 6 The inner surface of the lower shell 2 is provided with a liquid-absorbing capillary core 21 for storing the heat dissipation working medium.

[0088] In one embodiment, the wicking capillary 21 is provided on the inner surface of the lower shell 2 by sintering process. The wicking capillary 21 is a complex microstructure composed of extremely small pores, grooves or metal powder. These microstructures generate strong capillary forces (or capillary pumping forces). It is a physical phenomenon that liquid spontaneously penetrates into fine channels or pores under the action of surface tension. In a closed vapor chamber without external force, capillary force is the only driving force for liquid backflow. It must be strong enough to pull the heat transfer working fluid from the bottom to the top of the heat source, regardless of how the optical module is installed (especially the most unfavorable case of the base on top and the upper cover on the bottom). And when the vapor flows from the evaporation end (the inner surface of the lower shell 2) to the condensation end (the inner surface of the upper shell 1), it will generate a certain reverse resistance to the backflow of the liquid, and the capillary force needs to overcome this resistance.

[0089] Without the wicking capillary 21, the condensed liquid will only flow back to the bottom along the inner surface of the upper shell 1 under the action of gravity on the premise of installing the optical module horizontally. Once the heat source of the optical module is not at the lowest point, the liquid cannot effectively flow back to the heat source, the evaporation end will quickly dry out, causing the heat sink to fail, the temperature to rise sharply, and the optical module to be affected by heat dissipation.

[0090] In one embodiment, the wicking capillary 21 also has a large surface area. The heat transfer working fluid is not simply collected at the bottom, but is adsorbed and distributed on the entire large surface of the wicking capillary 21. This means that there is a large amount of liquid-vapor interface in the heat source area that can evaporate at the same time. This greatly improves the evaporation efficiency and enables the heat sink to handle very high heat flux. Heat can be quickly and uniformly absorbed by the heat transfer working fluid and converted into vapor.

[0091] Further, the inside of the heat sink is highly vacuumed, and the external atmospheric pressure will greatly press the shell, causing it to collapse. The wicking capillary 21 also acts as a certain support framework, effectively resisting external atmospheric pressure and preventing the upper shell 1 and the lower shell 2 from being crushed.

[0092] When the optical module is in a horizontal state (the upper cover 3 is directly above and the base 4 is directly below) after being inserted into the switch port, the wicking capillary 21 can be optionally provided on the inner surface of the lower shell 2. Because the optical module is placed horizontally, the condensed liquid heat transfer working fluid can directly flow back to the bottom of the lower shell 2 under the action of gravity, and the wicking capillary 21 can not be provided. However, considering the other functions of the wicking capillary 21 (such as increasing the evaporation area and supporting), the wicking capillary 21 can also be provided on the inner surface of the lower shell 2.

[0093] In one embodiment, the heat transferred to the upper shell 1 of the vapor chamber is eventually dissipated to the environment in two ways, the first way includes natural convection, that is, directly exchanging heat with air. The second way includes that after the optical module is inserted into the switch port, a forced air cooling radiator usually provided by the system will be above the optical module, the fins of the radiator will be in close contact with the upper shell 1 of the vapor chamber, and the high-speed airflow will quickly take away the heat. Regarding the two heat dissipation methods, the upper shell 1 can be designed differently, which will be described in more detail below.

[0094] In order to specifically describe the structure of the vapor chamber proposed in the present embodiment, the following embodiment is designed when the optical module is in a horizontal installation state (i.e., after the optical module is installed, the optical module cover is above, and the optical module base is directly below).

[0095] In order to further improve the heat dissipation effect, in one embodiment, as shown in Figure 7 , Figure 8 and Figure 9 , the bottom of the lower shell 2 is provided with a heat conduction groove 20 corresponding to the heat source, which is used to abut the heat source inside the optical module to absorb the heat generated by the heat source.

[0096] Among them, the heat conduction groove 20 is a sunken boss protruding from the bottom of the lower shell 2, which can be set according to the position of the heat source (such as power chip, etc.) on the circuit board, and the number and shape can be set according to the shape and number of the heat source. In this embodiment, taking a square as an example, in other embodiments, it can also be triangular, circular or other irregular shapes, but it needs to ensure that the contact surface between the heat conduction groove 20 and the heat source is a plane to better conduct heat. In order to further improve the heat absorption capacity of the lower shell 2, a heat-conducting material such as heat-conducting silicone grease is applied to the contact surface between the heat source and the bottom of the heat conduction groove 20 to fill the small gap between the heat source and the bottom of the heat conduction groove 20, so as to maximize the thermal resistance between the bottom of the heat conduction groove 20 and the heat source.

[0097] When two heat sources are provided on the circuit board 5, in one embodiment, referring to Figure 7 , Figure 8 and Figure 9 , the heat conduction groove 20 includes a first groove 200, a flow guide groove 201, and a second groove 202; one end of the flow guide groove 201 is connected with the first groove 200, and the other end of the flow guide groove 201 is connected with the second groove 202; the lower bottom of the first groove 200 and the lower bottom of the second groove 202 are respectively in abutment with heat sources with different heat dissipation amounts.

[0098] Among them, the present embodiment takes the circuit board provided with a first heat dissipation component and a second heat dissipation component as an example, and the first heat dissipation component and the second heat dissipation component have different heat dissipation amounts.

[0099] In one embodiment, the lower bottom of the first recess 200 is in abutment with the first heat-dissipating element, and the lower bottom of the second recess 202 is in abutment with the second heat-dissipating element. The flow guide groove 201 is in communication with the first recess 200 and the second recess 202, respectively. The depth of the first recess 200 and the second recess 202 can be set according to the height of the first heat-dissipating element and the second heat-dissipating element. In the present embodiment, the depth of the first recess 200 is greater than the depth of the second recess 202.

[0100] When the heat generation of the first heat-dissipating element is greater than that of the second heat-dissipating element, the heat-dissipating working medium stored in the first recess 200 needs to meet the heat-dissipating demand first. In order to achieve the above purpose, in one embodiment, as shown in Figure 10 、 Figure 11 and Figure 12 , the inner surface of the upper shell 1 is provided with a flow guide slope 10, which is inclined at a preset angle relative to the inner surface of the lower shell 2, and the lowest point of the flow guide slope 10 corresponds to the projection area range of the first recess 200 on the upper shell 1, so that the liquid heat-dissipating working medium returns to the first recess 200 along the flow guide slope 10 first.

[0101] Among them, the heat generation of the heat source corresponding to the first recess 200 (i.e. the first heat-dissipating element) is greater than the heat generation of the heat source corresponding to the second recess 202 (i.e. the second heat-dissipating element).

[0102] Among them, the preset angle can be 3°-10°. Referring to Figure 11 , the inclination angle of the flow guide slope 10 can be represented according to the shown horizontal and vertical coordinates. In one embodiment, in order to facilitate the flow guide of the flow guide slope 10 and considering the limited area of the inner surface of the upper shell 1, referring to Figure 10 、 Figure 11 and Figure 12 a matching slope 100 is designed on one side of the flow guide slope 10, and the junction of the flow guide slope 10 and the matching slope 100 is located in the projection area of the first recess 200 on the inner surface of the upper shell 1, and preferably above the center point of the first recess 200.

[0103] In one embodiment, according to the flow guide effect of the flow guide slope 10, when the heat-dissipating working medium absorbs heat and becomes gaseous, it liquefies at the top of the upper shell 1. Referring to Figure 12In the direction indicated by the arrow, the liquid heat dissipation working medium will flow along the guide slope 10 to return to the first groove 200, and as the amount of heat dissipation working medium in the first groove 200 increases, the heat dissipation working medium rises to the height of the guide groove 201, and then flows into the second groove 202 through the guide groove 201, so that in the steam chamber, the liquefied heat dissipation working medium will first fill the first groove 200 to meet the heat dissipation demand of the first heat dissipation element. Then, the heat dissipation working medium flows into the second groove 202 through the guide groove 201, and then fills the second groove 202 to meet the heat dissipation demand of the second heat dissipation element. Since the first heat dissipation element and the second heat dissipation element are the main heat sources, and the heat dissipation amount of the heat source cannot be estimated, after the liquid cooling working medium fills the first groove 200 and the second groove 202, it is impossible to control whether the liquid cooling working medium continues to overflow to other areas in the evaporation chamber or whether the cooled heat dissipation working medium falls on one side while the heat source continues to heat the heat dissipation working medium for secondary evaporation. In this embodiment, the above is not described in detail. The main purpose of the present application is to meet the heat dissipation demand of the first heat dissipation element and the second heat dissipation element which are the main heat sources.

[0104] When the heat dissipation amount of the second heat dissipation element is greater than that of the first heat dissipation element, the heat dissipation working medium stored in the second groove 202 needs to meet the heat dissipation demand. In order to achieve the above purpose, in one embodiment, as shown in Figure 13 、 Figure 14 and Figure 15 , the inner surface of the upper shell 1 is provided with a guide protrusion 11, and the lowest point of the guide protrusion 11 corresponds to the projection area of the second groove 202 on the upper shell 1, so that the liquid heat dissipation working medium flows along the guide protrusion 11 to return to the second groove 202.

[0105] Among them, the heat dissipation amount of the heat source corresponding to the first groove 200 is less than the heat dissipation amount of the heat source corresponding to the second groove 202.

[0106] Among them, referring to Figure 12 and Figure 13 , the guide protrusion 11 includes a first slope 110 and a second slope 111, and referring to Figure 14 , the inclination angles of the first slope 110 and the second slope 111 can be represented according to the shown horizontal and vertical coordinates. Further, one side of the second slope 111 abuts against the first slope 110, and the other end of the second slope 111 can be connected with the boundary of the inner surface of the upper shell 1. Considering the fullness efficiency of the liquid in the first groove 200 at this time, referring to Figure 13 、 Figure 14 and Figure 15The length of the second inclined surface 111 can be set shorter, and a third inclined surface 112 and a fourth inclined surface 113 are arranged on one side of the second inclined surface 111, and the junction of the third inclined surface 112 and the fourth inclined surface 113 is located within the projection area of the first groove 200 on the upper shell 1, and preferably directly above the center point of the first groove 200. At this time, most of the liquid heat dissipation working medium flows along the first inclined surface 110 and the second inclined surface 111 to the second groove 202, while a small part of the liquid heat dissipation working medium flows along the third inclined surface 112 and the fourth inclined surface 113 to the first groove 200, which can meet the heat dissipation demand of the second heat dissipation element corresponding to the second groove 202, while taking into account the heat dissipation demand of the first heat dissipation element corresponding to the first groove 200.

[0107] The junction of the first inclined surface 110 and the second inclined surface 111 is a top surface, which is closest to the inner surface of the lower shell 2. After the optical module is installed horizontally (i.e., corresponding to the horizontal placement of the uniform temperature plate), when the heat dissipation working medium absorbs heat and becomes gaseous, it is liquefied at the top of the upper shell 1. Referring to the direction indicated by the arrow in Figure 15 The liquid heat dissipation working medium will preferentially return to the second groove 202 along the first inclined surface 110 and the second inclined surface 111 on the flow guide protrusion 11 under the guidance of the flow, and as the amount of heat dissipation working medium in the second groove 202 increases, the height of the heat dissipation working medium rises to the height of the flow guide groove 201, and then flows to the first groove 200 through the flow guide groove 201. Therefore, in the vapor chamber, the liquefied heat dissipation working medium will preferentially fill the second groove 202 to meet the heat dissipation demand of the second heat dissipation element, and then flow into the first groove 200 through the flow guide groove 201, and then fill the first groove 200 to meet the heat dissipation demand of the first heat dissipation element.

[0108] If there are other heat sources on the circuit board 5, multiple grooves can be arranged in the heat conduction groove 20 according to the heat generation of the heat sources. Generally, the heat sources in the optical module are not particularly scattered, and the bottoms of the first groove 200 and the second groove 202 can be in contact with multiple heat sources at the same time, and only the area of the bottoms of the first groove 200 and the second groove 202 needs to be expanded to meet the heat dissipation demand of multiple heat sources. In addition, other flow guide structures of different shapes can be arranged on the inner surface of the upper shell 1 according to the heat generation of the heat sources corresponding to the grooves, so that the liquefied heat dissipation working medium preferentially returns to the groove corresponding to the heat source with the largest heat generation.

[0109] In the process of making the uniform temperature plate, the steam cavity needs to be vacuumized to meet the closed evaporation liquid cooling condition. For the upper shell 1 and the lower shell 2, they are made of materials with strong thermal performance, and generally have no high hardness. During the vacuumization process, the internal and external pressure difference can easily extrude the upper shell 1 or the lower shell 2, resulting in deformation. In order to solve the above problem, in one embodiment, as shown in Figure 16 , the inner surface of the upper shell 1 is provided with a heat-conducting support column 12, one end of the heat-conducting support column 12 abuts against the inner wall of the lower shell 2.

[0110] The heat-conducting support column 12 can be integrally formed on the inner surface of the upper shell 1 by pressure casting. The heat-conducting support column 12 mainly plays two roles. On the one hand, the heat-conducting support column 12 is made of a material with specific heat conductivity, which can serve as another heat dissipation channel to directly conduct the heat absorbed by the lower shell 2 to the upper shell 1 for direct heat dissipation. On the other hand, the heat-conducting support column 12 is connected to the inner surface of the upper shell 1 and the inner surface of the lower shell 2 at both ends, which supports the overall uniform temperature plate and prevents deformation of the upper shell 1 and the lower shell 2 caused by vacuumization operation or external force factors. In one embodiment, the shape, number and arrangement of the heat-conducting support column 12 are not limited in this embodiment.

[0111] Since the first groove 200 and the second groove 202 protrude from the bottom of the lower shell 2, in one embodiment, referring to Figure 16 , the heat-conducting support column 12 includes a first support column 120, a second support column 121 and a third support column 122; the first support column 120 abuts against the bottom wall of the first groove 200, the second support column 121 abuts against the bottom wall of the second groove 202, and the third support column 122 abuts against other regions on the inner wall of the lower shell 2 except the first groove 200 and the second groove 202.

[0112] In one embodiment, the first support column 120, the second support column 121 and the third support column 122 can also play a flow guiding role, and the liquefied heat dissipation working medium directly flows back to the inner surface of the lower shell 2 along the three support columns.

[0113] Next, the heat dissipation mode of the upper shell 1 will be introduced. In one embodiment, as shown in Figure 17 and Figure 18 , the outer surface of the upper shell 1 is provided with a heat dissipation assembly 13 for absorbing heat.

[0114] Wherein, the application cools the upper shell 1 by two ways, one of which is to directly set the heat dissipation assembly 13 on the upper surface of the upper shell 1, and to design the heat dissipation assembly 13 and the upper shell 1 in an integrated manner, and to cool the upper shell 1 by natural air flow. In an embodiment, as shown in Figure 19 、 Figure 20 and Figure 21 , the other way is to cool the upper shell 1 by an external heat dissipation device (such as a forced air cooling heat sink, not shown in the figure), which can also achieve the cooling effect of the gaseous heat dissipation working medium. The external heat dissipation device refers to a device other than the optical module, which is used to cool the entire optical module. Since the vapor chamber is arranged on the upper cover 3 of the optical module and is part of the optical module, the top of the upper shell 1 is exposed, so the upper shell 1 can also be directly cooled to liquefy the heat dissipation working medium on the inner surface of the upper shell 1.

[0115] In this scheme, the upper surface of the upper shell 1 is not designed with a heat dissipation structure, and the upper shell 1 is directly cooled by an external forced cooling, which further reduces the thermal resistance of the entire heat dissipation system, and further improves the overall heat dissipation efficiency of the vapor chamber.

[0116] Taking the integrated design as an example, in an embodiment, as shown in Figure 17 and Figure 18 , the heat dissipation assembly 13 includes heat dissipation fins 130 and a heat dissipation cover plate 131, the heat dissipation cover plate 131 is arranged on the heat dissipation fins 130, and a heat dissipation flow channel 132 is formed between the heat dissipation fins 130 and the heat dissipation cover plate 131.

[0117] Wherein, as shown in Figure 22 , the upper shell 1 can be made of aluminum alloy, the heat dissipation flow channel 132 can be processed by aluminum extrusion, and the heat conduction support column 12 is processed twice on the basis of aluminum extrusion; the upper shell 1 can also be made of zinc alloy, the heat conduction support column 12 and the heat dissipation fins 130 can be integrally formed on the upper shell 1 by pressure casting, and then a zinc heat dissipation cover plate 131 is welded on the heat dissipation fins 130 to form the heat dissipation flow channel 132; the upper shell 1 can also be made of copper alloy, the heat conduction support column 12 and the heat dissipation fins 130 can be integrally formed on the upper shell 1 by mechanical processing, and then a copper heat dissipation cover plate 131 is welded on the heat dissipation fins 130 to form the heat dissipation flow channel 132. The heat dissipation fins 130 and the heat dissipation flow channel 132 can cool the upper shell 1, thereby liquefying the heat dissipation working medium on the inner surface of the upper shell 1.

[0118] In summary, the uniform temperature plate is arranged on the upper cover 3 of the optical module in the embodiment, the sealed steam cavity is formed by the upper shell 1 and the lower shell 2, the heat source inside the optical module is contacted with the bottom of the lower shell 2, the heat generated by the heat source is first absorbed by the lower shell 2, then the heat absorbed by the lower shell 2 is absorbed by the heat dissipation working medium in the steam cavity, the heat dissipation working medium changes from liquid state to gaseous state after absorbing heat, the gaseous heat dissipation working medium is adsorbed on the inner surface of the upper shell 1, and is cooled to liquid state and returns to the bottom of the steam cavity, so that the heat source in the optical module is cooled; the interface contact thermal resistance in the application is only between the heat source and the lower shell 2 and between the upper shell 1 and the external environment, the number of interface contact thermal resistances in the heat transfer path is greatly reduced, the uniform temperature plate is arranged as part of the optical module, an integrated reinforced heat dissipation structure is formed, the increase of the interface contact thermal resistance caused by the split design is avoided, the heat dissipation performance of the whole optical module is improved, and the heat dissipation requirement of the high-speed optical module is met.

[0119] On the other hand, the uniform temperature plate can be processed in various ways such as aluminum extrusion, die casting, machining and stamping, the production process is simple, and is suitable for batch production of optical modules.

[0120] Embodiment 2:

[0121] In one embodiment, as shown in Figure 23 and Figure 24 , the optical module includes an upper cover 3, a base 4, a circuit board 5 and a uniform temperature plate (i.e. VC) arranged on the upper cover 3 as proposed in embodiment 1; the upper cover 3 and the base 4 are used to cooperate to form an inner cavity accommodating the circuit board 5; the bottom of the lower shell 2 is contacted with the heat source on the circuit board 5 to absorb the heat generated by the heat source.

[0122] In one embodiment, as shown in Figure 25 , a fixing surface 30 is arranged at the bottom of the upper cover 3, a window 31 is arranged on the fixing surface 30, the uniform temperature plate is arranged on the fixing surface 30, and the lower shell 2 is contacted with the heat source on the circuit board 5 through the window 31.

[0123] In summary, the uniform temperature plate is arranged on the upper cover 3 of the optical module in the embodiment, the sealed steam cavity is formed by the upper shell 1 and the lower shell 2, the heat source inside the optical module is contacted through the bottom of the lower shell 2, the heat generated by the heat source is first absorbed by the lower shell 2, then the heat absorbed by the lower shell 2 is absorbed by the heat dissipation working medium in the steam cavity, the heat dissipation working medium is changed from liquid to gas after absorbing heat, the gaseous heat dissipation working medium is adsorbed on the inner surface of the upper shell 1, is cooled to liquid again and returns to the bottom of the steam cavity, so that the heat dissipation of the heat source in the optical module is realized; the interface contact thermal resistance in the application is only between the heat source and the lower shell 2 and between the upper shell 1 and the external environment, the number of interface contact thermal resistances in the heat transfer path is greatly reduced, the uniform temperature plate is arranged as part of the optical module, the integrated reinforced heat dissipation structure is formed, the increase of the interface contact thermal resistance caused by the split design is avoided, the overall optical module heat dissipation performance is improved, and the heat dissipation requirement of the high-speed optical module is met.

[0124] On the other hand, the uniform temperature plate can be processed in various ways such as aluminum extrusion, die casting, machining and stamping, the production process is simple, and the batch production of the optical module is suitable.

[0125] The specific structure of the uniform temperature plate is described in embodiment 1, and will not be repeated in the embodiment.

[0126] The above only describes the preferred embodiment of the application, and is not used to limit the application, any modification, equivalent replacement and improvement within the spirit and principle of the application should be included in the protection scope of the application.

Claims

1. A vapor chamber, characterized by, The uniform temperature plate is arranged on the upper cover of the optical module, and comprises an upper shell (1) and a lower shell (2); the upper shell (1) and the lower shell (2) are used for forming a sealed steam cavity; The bottom of the lower shell (2) is used for being in contact with a heat source inside the optical module; a heat dissipation working medium is stored in the steam cavity, and the heat dissipation working medium is used for absorbing heat generated by the heat source; The bottom of the lower shell (2) is provided with a first groove (200), a flow guide groove (201) and a second groove (202); one end of the flow guide groove (201) is connected with the first groove (200), and the other end of the flow guide groove (201) is connected with the second groove (202); the lower bottom of the first groove (200) and the lower bottom of the second groove (202) are respectively in abutment with heat sources with different heat generation amounts; An inner surface of the upper shell (1) is provided with a flow guide protrusion (11), and a lowest point of the flow guide protrusion (11) corresponds to a projection area range of the second groove (202) on the upper shell (1), so that the liquid heat dissipation working medium preferentially returns to the second groove (202) along the flow guide protrusion (11); The heat generation amount of the heat source corresponding to the first groove (200) is less than the heat generation amount of the heat source corresponding to the second groove (202); as the heat dissipation working medium in the second groove (202) increases, the heat dissipation working medium rises to the height of the flow guide groove (201), flows to the first groove (200) through the flow guide groove (201), and preferentially meets the heat dissipation demand of the second heat dissipation component, and secondarily meets the heat dissipation demand of the first heat dissipation component.

2. The vapor chamber of claim 1, wherein, An inner surface of the upper shell (1) is provided with a flow guide inclined surface (10), the flow guide inclined surface (10) is arranged at a preset angle relative to an inner surface of the lower shell (2), and a lowest point of the flow guide inclined surface (10) corresponds to a projection area range of the first groove (200) on the upper shell (1), so that the liquid heat dissipation working medium preferentially returns to the first groove (200) along the flow guide inclined surface (10).

3. The vapor chamber of claim 1, wherein, An inner surface of the upper shell (1) is provided with a heat conduction support column (12), one end of the heat conduction support column (12) is in abutment with an inner wall of the lower shell (2).

4. The vapor chamber of claim 3, wherein, The heat conduction support column (12) comprises a first support column (120), a second support column (121) and a third support column (122); the first support column (120) is in abutment with a bottom wall of the first groove (200), the second support column (121) is in abutment with a bottom wall of the second groove (202), and the third support column (122) is in abutment with other regions of the inner wall of the lower shell (2) except the first groove (200) and the second groove (202).

5. The vapor chamber of claim 1, wherein, An outer surface of the upper shell (1) is provided with a heat dissipation assembly (13), and the heat dissipation assembly (13) is used for absorbing heat.

6. The vapor chamber of claim 5, wherein, The heat dissipation assembly (13) comprises heat dissipation fins (130) and a heat dissipation cover plate (131), the heat dissipation cover plate (131) is arranged on the heat dissipation fins (130), and a heat dissipation flow channel (132) is formed between the heat dissipation fins (130) and the heat dissipation cover plate (131).

7. The vapor chamber of any one of claims 1-6, wherein, A liquid absorption capillary core (21) is arranged on the inner surface of the lower shell (2), and the liquid absorption capillary core (21) is used for storing the heat dissipation working medium.

8. The vapor chamber of claim 7, wherein, The liquid absorption capillary core (21) is arranged on the inner surface of the lower shell (2) through sintering processing.

9. The vapor chamber of any one of claims 1-6, wherein, The upper shell (1) and the lower shell (2) are fixedly connected through diffusion welding or brazing to form the steam cavity.

10. The vapor chamber of any one of claims 1-6, wherein, The heat dissipation working medium is water or methanol.

11. An optical module characterized by comprising: The heat dissipation device comprises an upper cover (3), a base (4), a circuit board (5), and the uniform temperature plate as claimed in any one of claims 1-10 arranged on the upper cover (3); the upper cover (3) and the base (4) are used for cooperating to form an inner cavity for accommodating the circuit board (5); and the bottom of the lower shell (2) is in contact with a heat source on the circuit board (5) to absorb heat generated by the heat source.

12. The optical module of claim 11, wherein, The bottom of the upper cover (3) is provided with a fixing surface (30), the fixing surface (30) is provided with a window (31), the uniform temperature plate is arranged on the fixing surface (30), and the lower shell (2) is in contact with the heat source on the circuit board (5) through the window (31).

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