Display device and electronic device

Abstract

The present disclosure relates to a display device, and more particularly, to a display device capable of effectively dissipating heat from a driver circuit and an electronic device including the same. According to one aspect of the present disclosure, there is provided a display device including: a display panel; a first driver circuit connected to the display panel; and a support plate overlapping the display panel. The support plate may have a slot or hole overlapping the first driver circuit.

Description

[0001] This application claims priority to and all benefits derived therefrom of Korean Patent Application No. 10-2024-0055158, filed on April 25, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This disclosure relates to a display device, and more specifically, to a display device capable of effectively dissipating heat from a driver circuit, and an electronic device including the display device. Background Technology

[0003] Unlike liquid crystal displays (LCDs), organic light-emitting diode (OLED) displays are self-emissive. Therefore, OLED displays can be manufactured without a separate light source, allowing them to be lighter and thinner. OLED displays offer high-quality characteristics such as low power consumption, high brightness, and fast response times, making them a promising next-generation display technology. Summary of the Invention

[0004] This disclosure provides a display device that can effectively dissipate heat from a driver circuit, and an electronic device including the display device.

[0005] According to one aspect of this disclosure, a display device is provided, comprising: a display panel; a first driver circuit connected to the display panel; and a support plate overlapping the display panel. The support plate may have a slot or hole overlapping the first driver circuit.

[0006] The slots or holes of the support plate may be defined by the sidewalls and bottom of the support plate, and the slots or holes and the sidewalls of the support plate may have different widths.

[0007] The width of the groove or hole in the support plate can be greater than the width of the side wall of the support plate.

[0008] The width of the groove or hole in the support plate can be smaller than the width of the side wall of the support plate.

[0009] The display device may further include: a second driver circuit connected to the display panel, and the slot or hole of the support plate may overlap with the second driver circuit.

[0010] The display device may further include: a circuit board connected to the display panel, and a first driver circuit may be disposed on the circuit board.

[0011] According to another aspect of this disclosure, a display device is provided, comprising: a display panel; a first driver circuit connected to the display panel; and a support plate overlapping the display panel. The support plate may have a slot or hole, which, when viewed from the top of the support plate, is disposed around the first driver circuit.

[0012] The slots or holes in the support plate may be defined by the sidewalls and bottom of the support plate, and the width of the slots or holes in the support plate may be different from the width of the sidewalls of the support plate.

[0013] The width of the groove or hole in the support plate can be greater than or less than the width of the side wall of the support plate.

[0014] The first driver circuit can overlap with the sidewall of the support plate.

[0015] The display device may further include: a second driver circuit connected to the display panel, and a slot or hole in the support plate may be disposed around the second driver circuit.

[0016] According to another aspect of this disclosure, a display device is provided, comprising: a display panel; a first driver circuit connected to the display panel; a support plate overlapping the display panel and having a slot or hole overlapping the first driver circuit; and a heat dissipation member disposed in the slot or hole of the support plate.

[0017] When viewed from the top of the support plate, the edges of the slots or holes in the support plate may surround the heat dissipation components and the first driver circuit.

[0018] The heat dissipation component may overlap with the first driver circuit.

[0019] The display device may further include a second driver circuit connected to the display panel, and when viewed from the top of the support plate, the edge of the slot or hole of the support plate may surround the first driver circuit, the second driver circuit, and the heat dissipation component.

[0020] The support plate may include sidewalls and bottom defining slots or holes, and the display device may further include a first adhesive layer disposed between the heat dissipation member and the bottom of the support plate.

[0021] The display device may further include: a circuit board connected to a display panel; and a second adhesive layer disposed between a heat dissipation member and the circuit board, wherein a first driver circuit is disposed on the circuit board.

[0022] The display device may further include: a reinforcing plate disposed between the support plate and the display panel; and a second adhesive layer disposed between the reinforcing plate and the heat dissipation component.

[0023] The second adhesive layer can be further disposed between the support plate and the reinforcing plate, and between the support plate and the circuit board.

[0024] According to another aspect of this disclosure, a display device is provided, comprising: a display panel; a driver circuit in a mounting area of ​​the display panel; a support plate disposed between the display area and the mounting area of ​​the display panel; a reinforcing plate disposed between the support plate and the mounting area of ​​the display panel; and a first adhesive layer between the reinforcing plate and the support plate, wherein the reinforcing plate has one of a groove, a hole, and a slit on a surface facing the support plate, and wherein the first adhesive layer is disposed between the surface of the reinforcing plate and the support plate such that the first adhesive layer does not overlap with one of the groove, hole, and slit.

[0025] The driver circuitry can overlap with one of the slots, holes, and slits in the reinforcing plate.

[0026] The display device may further include a second adhesive layer disposed between the opposite surface of the reinforcing plate and the mounting area of ​​the display panel.

[0027] The second adhesive layer may overlap with one of the slots, holes, and slits in the reinforcing plate.

[0028] The second adhesive layer may further overlap with the first adhesive layer.

[0029] According to another aspect of this disclosure, an electronic device is provided, comprising: a bottom cover; a cover window on the bottom cover; and a display device between the bottom cover and the cover window. The display device may include: a display panel; a first driver circuit connected to the display panel; and a support plate overlapping the display panel, wherein the support plate may have a slot or hole overlapping the first driver circuit.

[0030] The slots or holes in the support plate may be defined by the sidewalls and bottom of the support plate, and the width of the slots or holes in the support plate may be different from the width of the sidewalls of the support plate.

[0031] The width of the groove or hole in the support plate can be greater than the width of the side wall of the support plate.

[0032] The width of the groove or hole in the support plate can be smaller than the width of the side wall of the support plate.

[0033] The electronic device may further include: a second driver circuit connected to the display panel, and a slot or hole in the support plate may overlap with the second driver circuit.

[0034] The electronic device may further include: a circuit board connected to a display panel, and a first driver circuit may be disposed on the circuit board.

[0035] According to one embodiment of this disclosure, heat from the driver circuitry in the display device and electronic device can be effectively dissipated. Therefore, the heat dissipation effect of the display device can be improved.

[0036] The effects of embodiments according to this disclosure are not limited to those mentioned above, and many more effects are included in the following description of this disclosure. Attached Figure Description

[0037] The above and other aspects and features of this disclosure will become more apparent from the detailed description of exemplary embodiments thereof with reference to the accompanying drawings, in which:

[0038] Figure 1 This is a plan view of a display device according to an embodiment of the present disclosure.

[0039] Figure 2 For along Figure 1 A cross-sectional view taken from the I-I' line.

[0040] Figure 3 for Figure 1 and Figure 2 A perspective view of a portion of the support plate.

[0041] Figure 4 For example Figure 2 The view of the display panel.

[0042] Figure 5 This is a plan view of a support plate according to an embodiment of the present disclosure.

[0043] Figure 6 For along Figure 1 A cross-sectional view of another embodiment taken by the I-I' line.

[0044] Figure 7 This is a plan view of a support plate according to an embodiment of the present disclosure.

[0045] Figure 8 This is a plan view of a display device according to an embodiment of the present disclosure.

[0046] Figure 9 For along Figure 8 A cross-sectional view taken from line II-II'.

[0047] Figure 10 This is a plan view of a display device according to an embodiment of the present disclosure.

[0048] Figure 11 For along Figure 10 A cross-sectional view taken from line III-III'.

[0049] Figure 12 For along Figure 10 A cross-sectional view of another embodiment taken from line III-III'.

[0050] Figure 13 This is a plan view of a display device according to an embodiment of the present disclosure.

[0051] Figure 14 For along Figure 13 A cross-sectional view taken from the IV-IV' line.

[0052] Figure 15 This is a perspective view of a reinforcing plate and a second adhesive layer according to an embodiment.

[0053] Figure 16 This is a perspective view of a reinforcing plate according to one embodiment.

[0054] Figure 17 This is a cross-sectional view of an electronic device according to an embodiment of the present disclosure. Detailed Implementation

[0055] The advantages and features of this disclosure, as well as methods for achieving these advantages and features, will become apparent from the following description of exemplary embodiments with reference to the accompanying drawings. However, this disclosure is not limited to the exemplary embodiments disclosed herein, but can be implemented in various different ways. Exemplary embodiments are provided so that this disclosure will be thorough and fully convey the scope of this disclosure to those skilled in the art. It should be noted that the scope of this disclosure, as defined by the claims, is not limited thereto.

[0056] As used herein, the phrase "element A on element B" means that element A can be directly disposed on element B and / or element A can be indirectly disposed on element B via another element C. Throughout the specification, the same reference numerals denote the same elements. The numbers, dimensions, ratios, angles, and quantities of elements given in the figures are illustrative examples and not limitations.

[0057] The term “substantially” as used herein means approximately or actually. The term “substantially equivalent” means approximately or actually equivalent. The term “substantially identical” means approximately identical or actually identical.

[0058] Although terms such as first, second, etc., are used to describe various elements, these terms are not necessarily intended to indicate the timing or other priority of these elements. These terms are used to distinguish one element from another. Therefore, as used herein, within the scope of the art disclosed, a first element may be a second element.

[0059] Features of the various exemplary embodiments of this disclosure may be combined in whole or in part. As will be clearly recognized by those skilled in the art, various technical interactions and operations are possible. The various exemplary embodiments may be practiced individually or in combination.

[0060] In the following description, exemplary embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0061] Figure 1This is a plan view of a display device according to an embodiment of the present disclosure. Figure 2 For along Figure 1 A cross-sectional view taken from the I-I' line. Figure 3 for Figure 1 and Figure 2 A perspective view of a portion of the support plate 700.

[0062] refer to Figure 1 and Figure 2 The display device 10 can be employed by portable electronic devices, such as mobile phones, smartphones, tablet computers, mobile communication terminals, e-notebooks, e-readers, portable multimedia players (PMPs), navigation devices, and ultra-mobile PCs (UMPCs). For example, the display device 10 can be used as a display unit in a television, laptop computer, monitor, electronic billboard, or Internet of Things (IoT) device. In another example, the display device 10 can be applied to wearable devices, such as smartwatches, smartwatch phones, glasses displays, and head-mounted display (HMD) devices.

[0063] When viewed from above, the display device 10 may have a shape similar to a quadrilateral. For example, the display device 10 may have a shape similar to a rectangle, with a shorter side in the first direction DR1 and a longer side in the second direction DR2. The corner where the shorter side in the first direction DR1 intersects the longer side in the second direction DR2 may be rounded with a predetermined curvature, or it may be a right angle. When viewed from above, the shape of the display device 10 is not limited to a quadrilateral shape, but may be formed into a shape similar to other polygonal shapes, circular shapes, or elliptical shapes.

[0064] The display device 10 may include a display panel 100, a driver circuit (e.g., a display driver 200), a circuit board 300, and an intermediate board.

[0065] Display panel 100 may include a primary area MA and a secondary area SBA.

[0066] The main area MA of the display panel 100 may include a display area DA having pixels for displaying images and a non-display area NDA surrounding the display area DA. The display area DA may output light from multiple emitting areas or multiple open areas. For example, the display panel 100 may include pixel circuitry containing switching elements, a pixel defining layer defining the emitting area or open area, and self-emissive elements.

[0067] For example, self-emissive elements may include, but are not limited to, at least one of the following: organic light-emitting diodes including an organic emission layer, quantum dot light-emitting diodes (quantum LEDs) including a quantum dot emission layer, inorganic light-emitting diodes (inorganic LEDs) including inorganic semiconductors, and micro light-emitting diodes (micro LEDs).

[0068] The non-display area NDA may be located outside the display area DA. The non-display area NDA may be defined as the edge of the main area MA of the display panel 100. The non-display area NDA may include a gate driver (not shown) that applies gate signals to the gate lines and a fan-out line (not shown) that connects the display driver 200 to the display area DA.

[0069] The secondary area SBA may extend from one side of the primary area MA. The secondary area SBA may include a flexible material that can be bent, folded, or rolled. In an example where the secondary area SBA is bent, the secondary area SBA may overlap with the primary area MA in the thickness direction (e.g., third direction DR3). The secondary area SBA may include pads connected to the display driver 200 and the circuit board 300.

[0070] The sub-area SBA may include the bending area 100a and the mounting area 100b.

[0071] A bending region 100a may be located between the main region MA and the mounting region 100b. One side of the bending region 100a may contact the main region MA, and the opposite side of the bending region 100a may contact the mounting region 100b. The bending region 100a may have a U-shape (or U-shaped cross-section) protruding in the opposite direction to the second direction DR2. The main region MA and the mounting region 100b may be connected through the bending region 100a.

[0072] One side of the mounting area 100b may contact the bending area 100a. In an example where the display panel 100 is bent, the mounting area 100b may be located below the main area MA. For example, the mounting area 100b may be located below the main area MA, such that the mounting area 100b overlaps with the main area MA in the third direction DR3. According to one embodiment of this disclosure, the mounting area 100b may overlap with a portion of the non-display area NDA and the display area DA adjacent to the bending area 100a in the third direction DR3.

[0073] As described herein, the display panel 100 has a bent shape due to the bending area, and the bent display panel may have a U-shape (or U-shaped cross-section). In this document, the surface of the bent display panel 100 on which the image is displayed is defined as the outer surface of the display panel 100, while the surface opposite to the outer surface of the display panel 100 is defined as the inner surface of the display panel 100.

[0074] The display driver 200 can output signals and voltages for driving the display panel 100. The display driver 200 can supply data voltages to data lines. The display driver 200 can apply power supply voltages to voltage lines and supply gate control signals to the gate driver. The display driver 200 can be implemented as an integrated circuit (IC) and can be attached to the display panel 100 by chip-on-glass (COG) technology, chip-on-plastic (COP) technology, or ultrasonic bonding. For example, the display driver 200 can be disposed in a sub-region SBA and can overlap with the main region MA in the thickness direction (third direction DR3) when the sub-region SBA is bent. According to one embodiment of this disclosure, the display driver 200 described herein can be disposed in the mounting area 100b of the sub-region SBA. In another example, the display driver 200 can be mounted on a circuit board 300.

[0075] The circuit board 300 can be connected to the display panel 100. For example, the circuit board 300 can be electrically connected to the display panel 100 via a conductive adhesive member. For example, the terminals of the circuit board 300 can be physically and electrically connected to pads disposed in the mounting area 100b of the display panel 100 via the conductive adhesive member. The conductive adhesive member can be, for example, anisotropic conductive film (ACF).

[0076] According to one embodiment of the present disclosure, the circuit board 300 may be, for example, a flexible printed circuit board (FPCB), a rigid printed circuit board (PCB), or a flexible film such as, for example, a chip on film (COF).

[0077] At least a portion of the circuit board 300 may overlap with the sub-area SBA of the display panel 100 on the third-direction DR3. In an example where the display panel 100 is bent, at least a portion of the circuit board 300 may overlap with the mounting area 100b of the sub-area SBA on the third-direction DR3. According to one embodiment of the present disclosure, the circuit board 300 may overlap with the display driver 200 on the third-direction DR3.

[0078] Due to the horizontal difference between the mounting area 100b of the display panel 100 and the support plate 700, the circuit board 300 connected to the display panel 100 and disposed on the support plate 700 has a bent shape.

[0079] Driver circuitry, such as, for example, touch driver 400 and power supply unit 500, may be disposed on circuit board 300. For example, touch driver 400 and power supply unit 500 may be mounted on circuit board 300.

[0080] The touch driver 400 can be electrically connected to the touch sensing unit of the display panel 100. The touch driver 400 can supply touch drive signals to a plurality of touch electrodes of the touch sensing unit and can sense capacitance changes between the plurality of touch electrodes. For example, the touch drive signal can be a pulse signal with a predetermined frequency. The touch driver 400 can determine whether an input is present and can detect the coordinates of the input based on the amount of capacitance change between the touch electrodes. The touch driver 400 can be implemented as an integrated circuit (IC).

[0081] The power supply unit 500 can apply a power supply voltage to the display driver 200 and the display panel 100. The power supply unit 500 can generate a driving voltage and supply it to a driving voltage line, generate an initialization voltage and supply it to an initialization voltage line, and generate a common voltage and supply it to a common electrode shared by the light-emitting elements of multiple pixels. For example, the driving voltage can be a high-level voltage for driving the light-emitting elements, and the common voltage can be a low-level voltage for driving the light-emitting elements.

[0082] A reinforcing plate 800 may be disposed between the main area MA and the mounting area 100b of the display panel 100. One end of the reinforcing plate 800 may face the bending area 100a of the display panel 100. The reinforcing plate 800 may comprise a metallic material. For example, the reinforcing plate 800 may be formed of a material including at least one of stainless steel, aluminum (Al), and copper (Cu). An adhesive layer for attaching the reinforcing plate 800 to the display panel 100 may be further disposed between the reinforcing plate 800 and the display panel 100 (e.g., the portion corresponding to the mounting area 100b of the display panel 100).

[0083] A support plate 700 may be disposed between the main area MA of the display panel 100 and the mounting area 100b. For example, the support plate 700 may be disposed between the main area MA of the display panel 100 and the reinforcing plate 800 described herein. One end of the support plate 700 may face the bending area 100a of the display panel 100. An adhesive layer for attaching the support plate 700 to the reinforcing plate 800 may be further disposed between the support plate 700 and the reinforcing plate 800. An adhesive layer for attaching the support plate 700 to the display panel 100 may be further disposed between the support plate 700 and the display panel 100 (e.g., the portion corresponding to the display area DA of the display panel 100).

[0084] like Figure 1 and Figure 2 As illustrated, the support plate 700 may have an area larger than the main area MA of the display panel 100. The support plate 700 may include a metallic material. For example, the support plate 700 may be formed of a material including at least one of stainless steel, aluminum (Al), and copper (Cu).

[0085] The support plate 700 may have a channel (or air channel). In other words, the support plate 700 may have a channel in the form of a groove 70a. For example, the support plate 700 may have at least one groove 70a corresponding to at least one channel. According to one embodiment, the support plate 700 may have a plurality of grooves 70a. Each groove 70a may have a recessed shape along the thickness direction of the support plate 700. For example, as Figure 2 and Figure 3 As illustrated, the groove 70a may have a shape that is recessed from the lower surface of the support plate 700 in a third direction DR3. In an example in which multiple grooves 70a are located in this manner in the lower surface of the support plate 700, the lower surface of the support plate 700 in which the grooves 70a are located may have a pattern of peaks and valleys (i.e., undulations).

[0086] The slot 70a of the support plate 700 may overlap with at least one driver circuit on the circuit board 300. For example, as Figure 1 and Figure 2 As illustrated, slot 70a may overlap with touch driver 400 and power supply unit 500. In some respects, slot 70a may overlap with display driver 200 disposed in mounting area 100b of display panel 100.

[0087] exist Figure 1 In the plan view, a groove 70a may extend in a first direction DR1. The groove 70a extending in the first direction DR1 may penetrate the support plate 700 from one side surface to the opposite side surface. For example, each groove 70a may have two ends, and the two ends of the groove 70a in the first direction DR1 may penetrate the support plate 700 on one surface and the opposite surface in the first direction DR1, respectively. Specifically, one end of each of the grooves 70a may penetrate one surface of the support plate 700 in the first direction DR1, while the opposite end of each of the grooves 70a may penetrate the opposite surface of the support plate 700 in the opposite direction of the first direction DR1 (hereinafter referred to as the first opposite direction).

[0088] like Figure 1 As illustrated, multiple slots 70a can be arranged on a second direction DR2 intersecting the first direction DR1. The slots 70a can be spaced equally apart from each other.

[0089] The width W1 of the groove 70a may differ from the width W2 of the sidewall 722 between adjacent grooves 70a. For example, the groove 70a may be defined by adjacent sidewalls 722 and bottom 711 (also referred to herein as the bottom portion) of the support plate 700, and thus the width W1 of the groove 70a may be greater than the width W2 of the sidewall 722. However, it should be understood that embodiments of this disclosure are not limited thereto. The width W1 of the groove 70a may be equal to the width W2 of the sidewall 722. Alternatively, the width W1 of the groove 70a may be less than the width W2 of the sidewall 722.

[0090] An adhesive layer 37 may be disposed between the circuit board 300 and the support plate 700. The adhesive layer 37 may attach the circuit board 300 to the support plate 700. For example, one surface of the adhesive layer 37 may be attached to the circuit board 300, and the opposite surface of the adhesive layer 37 may be attached to the sidewall 722 of the support plate 700. The adhesive layer 37 may include a double-sided tape.

[0091] exist Figure 2 In the illustrated cross-sectional view, the driver circuitry on circuit board 300 may be positioned closer to support plate 700 (or slot 70a of support plate 700) than the driver circuitry on display panel 100. For example, power supply unit 500 (or touch driver 400) may be positioned closer to support plate 700 (or slot 70a of support plate 700) on third-party DR3 than display driver 200.

[0092] According to one embodiment, because the support plate 700 has multiple slots 70a as channels (e.g., air channels), the contact area between the channels of the support plate 700 and the air can be increased. Therefore, heat can be dissipated more effectively from the driver circuit.

[0093] Figure 4 For example Figure 2 The view of the display panel 100.

[0094] refer to Figure 4 The display panel 100 may include a display unit DU, a touch sensing unit TSU, and a color filter layer CFL. The display unit DU may include a substrate SUB, a transistor layer TRL, an emissive material layer EMTL, and an encapsulation layer ENC.

[0095] The substrate SUB can be a base substrate or a base member. The substrate SUB can be a flexible substrate that can be bent, folded, or rolled. For example, the substrate SUB can include, but is not limited to, polymer resins such as polyimide (PI). In another example, the substrate SUB can include glass or metal materials.

[0096] A transistor layer TRL may be disposed on a substrate SUB. The transistor layer TRL may include multiple thin-film transistors forming pixel circuitry for a pixel. The transistor layer TRL may include gate lines, data lines, voltage lines, gate control lines, fan-out lines for connecting the display driver 200 and the data lines, leads for connecting the display driver 200 and pads, and other lines or components. Each of the thin-film transistors may include a semiconductor region, a source electrode, a drain electrode, and a gate electrode. In an example where the gate driver is formed on one side of the non-display area NDA of the display panel 100, the gate driver may include a thin-film transistor.

[0097] The transistor layer TRL can be disposed in the display area DA, the non-display area NDA, and the sub-area SBA. The thin-film transistors, gate lines, data lines, and voltage lines in the thin-film transistor layer TRL for pixels can be disposed in the display area DA. The gate control lines and fan-out lines in the transistor layer TRL can be disposed in the non-display area NDA. The leads of the transistor layer TRL can be disposed in the sub-area SBA. The display driver 200, conductive adhesive components, and intermediate board can be disposed on the transistor layer TRL.

[0098] An emissive material layer (EMTL) may be disposed on a transistor layer (TRL). The EMTL may include multiple light-emitting elements and pixel-defining films for defining pixels. In each light-emitting element, a pixel electrode, an emissive layer, and a common electrode are sequentially stacked to emit light. The multiple light-emitting elements in the EMTL may be disposed in the display area (DA).

[0099] For example, the emitting layer may be an organic light-emitting layer containing organic materials. The emitting layer may include a hole transport layer, an organic light-emitting layer, and an electron transport layer. In an example where the pixel electrode receives voltage through a thin-film transistor in the transistor layer TRL and the common electrode receives a cathode voltage through a thin-film transistor in the transistor layer TRL, holes and electrons can move to the organic light-emitting layer through the hole transport layer and the electron transport layer, respectively, causing them to combine in the organic light-emitting layer to emit light. For example, the pixel electrode may be an anode electrode, and the common electrode may be a cathode electrode. However, it should be understood that the embodiments of this disclosure are not limited thereto.

[0100] As another example, the light-emitting element may include a quantum dot light-emitting diode, each of which includes a quantum dot emission layer, an inorganic light-emitting diode, or a micro light-emitting diode, each of which includes an inorganic semiconductor.

[0101] The encapsulation layer ENC may cover the upper and side surfaces of the EMTL (Emitting Material Layer) and protect the EMTL. The encapsulation layer ENC may include at least one inorganic film and at least one organic film for encapsulating the EMTL.

[0102] The touch sensing unit (TSU) may be disposed on the encapsulation layer (ENC). The TSU may include multiple touch electrodes for sensing a user's touch via capacitive sensing, and touch lines connecting the multiple touch electrodes and the touch driver 400. For example, the TSU may sense the user's touch via mutual capacitance sensing or self-capacitance sensing.

[0103] In another example, the touch sensing unit (TSU) may be disposed on a separate substrate, which in turn is disposed on the display unit (DU). In this case, the substrate supporting the touch sensing unit (TSU) may be a base component that encapsulates the display unit (DU).

[0104] Multiple touch electrodes of the touch sensing unit (TSU) can be disposed in the touch sensor area overlapping with the display area (DA). The touch lines of the touch sensing unit (TSU) can be disposed in the touch peripheral area overlapping with the non-display area (NDA).

[0105] A color filter layer (CFL) may be disposed on the touch sensing unit (TSU). The CFL may include multiple color filters, each associated with a plurality of emission regions. Each color filter selectively transmits light of a specific wavelength and blocks or absorbs light of other wavelengths. The CFL may absorb some light introduced from the outside of the display device 10 to reduce the reflection of external light. Therefore, the CFL prevents color distortion due to the reflection of external light.

[0106] Because the color filter layer CFL is directly disposed on the touch sensing unit TSU, the display device 10 can be implemented without a separate substrate for the color filter layer CFL. Therefore, the thickness of the display device 10 can be relatively reduced.

[0107] Figure 5 This is a plan view of a support plate 700 according to one embodiment.

[0108] like Figure 5 As illustrated, when viewed from above (e.g., when viewed in the third direction DR3), the groove 70a of the support plate 700 can be surrounded by the sidewall 722. In other words, when viewed from above, the two ends of the groove 70a that are opposite to each other in the first direction DR1 can be surrounded by the sidewall 722 without penetrating the surfaces of the support plate 700 that are opposite to each other in the first direction DR1.

[0109] Figure 5 The groove 70a of the support plate 700 can be described herein. Figure 1 The groove 70a of the support plate 700 is replaced.

[0110] Figure 6 For along Figure 1 A cross-sectional view of another embodiment taken by the I-I' line.

[0111] Figure 6 The display device 10 and Figure 2 The difference in the display device 10 is that the support plate 700 includes a hole 70b instead of a slot 70a. The following description will focus on this difference.

[0112] like Figure 6As illustrated, the support plate 700 may include holes 70b penetrating the support plate 700 in the thickness direction. For example, the support plate 700 may include a plurality of holes 70b penetrating the support plate 700 in the third direction DR3. The holes 70b may be defined by being surrounded by sidewalls 722 of the support plate 700. The width W1 of the hole 70b may be different from the width W2 of the sidewall 722 between adjacent holes 70b.

[0113] exist Figure 6 In the illustrated cross-sectional view, the driver circuitry on circuit board 300 may be positioned closer to the support plate 700 (or the hole 70b of the support plate 700) than the driver circuitry on display panel 100. For example, power supply unit 500 (or touch driver 400) may be positioned closer to the support plate 700 (or the hole 70b of the support plate 700) on third-party DR3 than the display driver 200.

[0114] According to one embodiment, because the support plate 700 has multiple holes 70b as channels (e.g., air channels), the contact area between the channels of the support plate 700 and the air can be increased. Therefore, heat can be dissipated more effectively from the driver circuit.

[0115] Figure 7 This is a plan view of a support plate 700 according to one embodiment.

[0116] like Figure 7 As illustrated, the support plate 700 may have a channel (or air channel). In other words, the support plate 700 may have a channel in the form of a hole 70b. For example, the support plate 700 may have at least one hole 70b corresponding to at least one channel.

[0117] The hole 70b of the support plate 700 can penetrate the support plate 700 in the third direction DR3. The hole 70b of the support plate 700 can be surrounded by the sidewall 722 of the support plate 700.

[0118] Figure 8 This is a plan view of a display device according to an embodiment of the present disclosure. Figure 9 For along Figure 8 A cross-sectional view taken from line II-II'.

[0119] Figure 8 and Figure 9 The display device 10 and Figure 1 and Figure 2 The difference in the display device 10 is that the slot 70a of the support plate 700 does not overlap with the driver circuit, but is instead positioned (for example, when viewed on a third-direction DR3) adjacent to the driver circuit. The following description will focus on this difference.

[0120] The support plate 700 may have a channel (or air channel). In other words, as... Figure 8 and Figure 9 As illustrated, the support plate 700 may have a channel in the form of a groove 70a. For example, the support plate 700 may have at least one groove 70a corresponding to at least one channel.

[0121] like Figure 8 and Figure 9 As illustrated, the slot 70a of the support plate 700 may be located near the driver circuitry. For example, the slot 70a may be located around each of the display driver 200, the power supply unit 500, and the touch driver 400. Figure 8 In the plan view, the driver circuitry (e.g., display driver 200, power supply unit 500, and touch driver 400) (e.g., when viewed on a third-direction DR3) can be surrounded by adjacent slots 70a.

[0122] According to one embodiment, such as Figure 8 and Figure 9 As illustrated, the sidewall 722 of the support plate 700 defining the slot 70a of the support plate 700 may overlap with the driver circuitry. For example, each of the display driver 200, the power supply unit 500, and the touch driver 400 may overlap with the sidewall 722 of the support plate 700. For example, the driver circuitry may overlap with the sidewall 722. In other words, the driver circuitry may overlap with the sidewall 722 but not with the slot 70a.

[0123] exist Figure 9 In the illustrated cross-sectional view, the driver circuitry on circuit board 300 may be positioned closer to support plate 700 (or sidewall 722 of support plate 700) than the driver circuitry on display panel 100. For example, power supply unit 500 (or touch driver 400) may be positioned closer to support plate 700 (or sidewall 722 of support plate 700) on third-party DR3 than display driver 200.

[0124] It should be noted, for example, when viewed from the top, Figure 8 and Figure 9 Both ends of the groove 70a can be surrounded by the sidewall 722, such as Figure 5 Example in.

[0125] In some respects, Figure 8 and Figure 9 The support plate 700 may have the features described herein. Figure 6 and Figure 7 The hole 70b is illustrated, instead of the slot 70a. In this case, the hole 70b of the support plate 700 may not overlap with the driver circuitry (e.g., display driver 200, touch driver 400, and power supply unit 500), but may overlap with the sidewall 722 defining the hole 70b.

[0126] According to one embodiment, because the support plate 700 has multiple slots 70a as channels (e.g., air channels), the contact area between the channels of the support plate 700 and the air can be increased. Therefore, heat can be dissipated more effectively from the driver circuit.

[0127] Figure 10 This is a plan view of a display device according to an embodiment of the present disclosure. Figure 11 For along Figure 10 A cross-sectional view taken from line III-III'.

[0128] Figure 10 and Figure 11 The display device 10 is similar to the support plate 700 and heat dissipation component 900 in terms of... Figure 1 and Figure 2 The display device 10 is different. The following description will focus on this difference.

[0129] The display device 10 according to one embodiment may further include a heat dissipation member 900.

[0130] The support plate 700 may have a channel (or air channel). In other words, the support plate 700 may have a channel in the form of a groove 70c. For example, the support plate 700 may have at least one groove 70c corresponding to at least one channel. The groove 70c may have a recessed shape along the thickness direction of the support plate 700. For example, as... Figure 10 and Figure 11 As illustrated, slot 70c may have a shape that is recessed from the lower surface of support plate 700 on third-direction DR3. Slot 70c may overlap with driver circuitry.

[0131] A heat dissipation component 900 may be disposed in a slot 70c. The slot 70c may be defined by the sidewalls 722 and bottom 711 of the support plate 700, and the heat dissipation component 900 may be surrounded by the sidewalls 722. For example, as... Figure 10 As illustrated, a heat dissipation member 900 may be surrounded by a sidewall 722 within a groove 70c. The heat dissipation member 900 may contact the bottom 711 of a support plate 700 within the groove 70c. The heat dissipation member 900 may be attached to the bottom 711 of the support plate 700. For this purpose, according to one embodiment, a first adhesive layer 79 may be further disposed between the bottom 711 of the support plate 700 and the heat dissipation member 900 in the groove 70c. For example, one surface of the first adhesive layer 79 may be attached to the bottom 711 of the support plate 700, and the opposite surface of the first adhesive layer 79 may be attached to the heat dissipation member 900.

[0132] The heat dissipation component 900 can overlap with the reinforcing plate 800 and the circuit board 300. One side of the heat dissipation component 900 can contact the reinforcing plate 800, and the opposite side of the heat dissipation component 900 can contact the circuit board 300.

[0133] The second adhesive layer 39 may be disposed between the heat dissipation component 900 and the circuit board 300 to attach the heat dissipation component 900 to the circuit board 300.

[0134] The heat sink 900 may overlap with the driver circuitry. For example, the heat sink 900 may overlap with at least one of the display driver 200, the power supply unit 500, and the touch driver 400.

[0135] The heat dissipation component 900 may include a heat-diffusing material. For example, the heat dissipation component 900 may be formed of a material including at least one of copper and graphite.

[0136] like Figure 10 As illustrated, when viewed from above, the driver circuitry can be surrounded by the slot 70c of the support plate 700. For example, when viewed from above, the display driver 200, power supply unit 500, and touch driver 400 can be surrounded by the slot 70c of the support plate 700. In other words, when viewed from above, the display driver 200, power supply unit 500, and touch driver 400 can be surrounded by the edge of the slot 70c of the support plate 700.

[0137] exist Figure 11 In the illustrated cross-sectional view, the driver circuitry on circuit board 300 may be positioned closer to heat sink 900 than the driver circuitry on display panel 100. For example, power supply unit 500 (or touch driver 400) may be positioned closer to heat sink 900 on third-party DR3 than display driver 200.

[0138] According to one embodiment, the heat dissipation efficiency of the support plate 700 can be further improved by distributing the heat dissipation component 900 in a channel (e.g., slot 70c) of the support plate 700. In some aspects, even with the addition of the heat dissipation component 900, the thickness of the display device 10 does not increase because the heat dissipation component 900 is disposed in the slot 70c of the support plate 700.

[0139] Figure 12 For along Figure 10 A cross-sectional view of another embodiment taken from line III-III'.

[0140] Figure 12 The display device 10 and Figure 11 The difference in the display device 10 lies in the second adhesive layer 39. The following description will focus on this difference.

[0141] like Figure 12 As illustrated, a second adhesive layer 39 disposed on the lower surface of the heat dissipation member 900 may be attached to the reinforcing plate 800 and the circuit board 300. For example, one surface of the second adhesive layer 39 may be attached to the heat dissipation member 900, and the opposite surface of the second adhesive layer 39 may be attached to the reinforcing plate 800 and the circuit board 300.

[0142] The surface of the second adhesive layer 39 can be further attached to the support plate 700. In other words, the second adhesive layer 39 can be further disposed between the support plate 700 and the reinforcing plate 800, and between the support plate 700 and the circuit board 300.

[0143] Figure 13 This is a plan view of a display device according to an embodiment of the present disclosure. Figure 14 For along Figure 13 A cross-sectional view taken from the IV-IV' line.

[0144] like Figure 13 and Figure 14 As illustrated, a support plate 700 and a reinforcing plate 800 may be disposed between the main area MA of the display panel 100 and the mounting area 100b. For example, the reinforcing plate 800 may be disposed between the mounting area 100b of the display panel 100 and the support plate 700, and the support plate 700 may be disposed between the reinforcing plate 800 and the main area MA of the display panel 100.

[0145] A first adhesive layer 18 may be disposed between the mounting area 100b of the display panel 100 and the reinforcing plate 800 (specifically, the lower surface of the reinforcing plate 800). The first adhesive layer 18 may attach the display panel 100 to the reinforcing plate 800.

[0146] The second adhesive layer 78 can be disposed between the reinforcing plate 800 and the supporting plate 700. The second adhesive layer 78 can attach the reinforcing plate 800 to the supporting plate 700.

[0147] The reinforcing plate 800 may have a channel (or air channel). In other words, the reinforcing plate 800 may have a channel in the form of a groove 80a. For example, the support plate 700 may have at least one groove 80a corresponding to at least one channel. According to one embodiment, the reinforcing plate 800 may have a plurality of grooves 80a. The groove 80a may have a shape that is recessed along the thickness direction of the reinforcing plate 800. For example, as Figure 14 As illustrated, the groove 80a may have a shape that is recessed from the upper surface of the reinforcing plate 800 facing the support plate 700 in the opposite direction to the third opposite direction DR3 (hereinafter referred to as the third opposite direction). In examples where multiple grooves 80a are located in this manner in the upper surface of the reinforcing plate 800, the upper surface of the reinforcing plate 800 where the grooves 80a are located may have a pattern of peaks and valleys (i.e., undulations).

[0148] The groove 80a of the reinforcing plate 800 may be defined by the sidewall 822 and the bottom 811 of the reinforcing plate 800. As described herein. Figure 2The groove 70a and sidewall 722 of the support plate 700 may have different widths, and the groove 80a and sidewall 822 of the reinforcing plate 800 may also have different widths. For example, the width of the groove 80a of the reinforcing plate 800 may be greater than the width of the sidewall 822 of the reinforcing plate 800. Alternatively, the width of the groove 80a of the reinforcing plate 800 may be equal to the width of the sidewall 822 of the reinforcing plate 800. Alternatively, the width of the groove 80a of the reinforcing plate 800 may be less than the width of the sidewall 822 of the reinforcing plate 800.

[0149] According to one embodiment, the second adhesive layer 78 may be disposed on the upper surface of the reinforcing plate 800 such that the second adhesive layer 78 does not overlap with the groove 80a of the reinforcing plate 800.

[0150] It should be noted that the first adhesive layer 18 may overlap with the groove 80a of the reinforcing plate 800. In some respects, the first adhesive layer 18 may overlap with the second adhesive layer 78. When viewed from above, the area of ​​the first adhesive layer 18 may be larger than the area of ​​the second adhesive layer 78.

[0151] In some respects, the display driver 200 may overlap with the slot 80a of the reinforcing plate 800.

[0152] According to one embodiment, because the reinforcing plate 800 has multiple slots 80a as channels (e.g., air channels), the contact area between the channels of the reinforcing plate 800 and the air can be increased. Therefore, heat can be dissipated more effectively from the driver circuit.

[0153] Figure 15 This is a perspective view of a reinforcing plate 800 and a second adhesive layer according to an embodiment.

[0154] The reinforcing plate 800 may have a groove 80a (hereinafter referred to as the main groove 80a) and an auxiliary groove 80b as the aforementioned channels.

[0155] Main slot 80a and the one described in this article Figure 13 and Figure 14 The slots 80a are essentially the same; therefore, for the sake of brevity, repeated descriptions of similar elements are omitted.

[0156] The auxiliary groove 80b can extend in a direction intersecting the extension direction of the main groove 80a. For example, the main groove 80a can extend in a first direction DR1, and the auxiliary groove 80b can extend in a second direction DR2. The auxiliary groove 80b can connect the main groove 80a to an adjacent main groove.

[0157] The second adhesive layer 78 may be disposed on the reinforcing plate 800. The second adhesive layer 78 may be disposed on the upper surface of the reinforcing plate 800 such that the second adhesive layer 78 does not overlap with the main groove 80a and the auxiliary groove 80b. For example, the second adhesive layer 78 may have an open area 78a such that it does not overlap with the bottom 811 of the reinforcing plate 800 or the sidewall 822 on the bottom 811. The open area 78a of the second adhesive layer 78 may overlap with the bottom 811, the main groove 80a, the auxiliary groove 80b, and the sidewall 822 (e.g., the sidewall 822 on the bottom 811) of the reinforcing plate 800.

[0158] Figure 16 This is a perspective view of a reinforcing plate 800 according to an embodiment.

[0159] like Figure 16 As illustrated, the reinforcing plate 800 may have a slit 80c that penetrates the reinforcing plate 800 in the thickness direction. For example, a plurality of slits 80c, serving as the aforementioned channels, may penetrate the reinforcing plate 800 in a third direction DR3. The slit 80c may extend in a second direction DR2. The slit 80c may extend in the second direction DR2 and penetrate the side surface of the reinforcing plate 800. In other words, the surface of the reinforcing plate 800 may be opened by the slit 80c.

[0160] Figure 17 This is a cross-sectional view of an electronic device according to an embodiment of the present disclosure.

[0161] like Figure 17 As illustrated, electronic device 3000 may include a bottom cover 2000, a display device 10, and a cover window 1000.

[0162] The bottom cover 2000 may form the bottom exterior of the electronic device 3000. The bottom cover 2000 may be made of plastic, metal, or a combination of plastic and metal.

[0163] The display device 10 may be disposed on the bottom cover 2000. For example, the display device 10 may be disposed between the bottom cover 2000 and the cover window 1000. Figure 17 The display device 10 can be connected with Figures 1 to 16 The above-described display device 10 is the same as the one shown in the example.

[0164] A cover window 1000 may be disposed on the display device 10 and cover the upper surface of the display device 10. The cover window 1000 can protect the upper surface of the display device 10.

[0165] The cover window 1000 may include a light-transmitting area 1000a consistent with the display device 10 and a light-blocking area 1000b inconsistent with the display device 10. The light-blocking area 1000b may be opaque. Alternatively, the light-blocking area 1000b may be formed as a patterned decorative layer that can be displayed to the user when no image is displayed.

[0166] In concluding this detailed description, those skilled in the art will recognize that many variations and modifications can be made to the exemplary embodiments without substantially departing from the principles of the invention. Therefore, the exemplary embodiments disclosed herein are used in a general and descriptive sense and are not intended for limiting purposes.

Claims

1. A display device, comprising: Display panel; A first driver circuit is connected to the display panel; as well as The support plate overlaps with the display panel. The support plate has a slot or hole that overlaps with the first driver circuit.

2. The display device according to claim 1, wherein: The slot or hole in the support plate is defined by the sidewall and the bottom of the support plate, and The width of the groove or hole in the support plate is different from the width of the sidewall of the support plate.

3. The display device according to claim 2, wherein the width of the groove or hole of the support plate is greater than or less than the width of the sidewall of the support plate.

4. The display device according to claim 1, further comprising: The second driver circuit is connected to the display panel. The slots or holes in the support plate overlap with the second driver circuit.

5. The display device according to claim 1, further comprising: The circuit board is connected to the display panel. The first driver circuit is disposed on the circuit board.

6. A display device, comprising: Display panel; A first driver circuit is connected to the display panel; as well as The support plate overlaps with the display panel. The support plate has a slot or hole, which is located around the first driver circuit when viewed from the top of the support plate.

7. The display device according to claim 6, wherein: The slot or hole in the support plate is defined by the sidewall and the bottom of the support plate, and The width of the groove or hole in the support plate is different from the width of the sidewall of the support plate.

8. The display device according to claim 7, wherein the width of the groove or hole of the support plate is greater than or less than the width of the sidewall of the support plate.

9. The display device according to claim 7, wherein the first driver circuit overlaps with the sidewall of the support plate.

10. The display device according to claim 6, further comprising: The second driver circuit is connected to the display panel. The slots or holes in the support plate are disposed around the second driver circuit.

11. A display device, comprising: Display panel; A first driver circuit is connected to the display panel; A support plate that overlaps with the display panel and has a slot or hole that overlaps with the first driver circuit. as well as A heat dissipation component is disposed in the groove or hole of the support plate.

12. The display device according to claim 11, wherein, When viewed from the top of the support plate, the edges of the slots or holes in the support plate surround the heat dissipation component and the first driver circuit.

13. The display device according to claim 11, wherein the heat dissipation component overlaps with the first driver circuit.

14. The display device according to claim 11, further comprising: The second driver circuit is connected to the display panel. When viewed from the top of the support plate, the edge of the slot or hole of the support plate surrounds the first driver circuit, the second driver circuit, and the heat dissipation component.

15. The display device according to claim 11, wherein: The support plate includes sidewalls and a bottom defining the slot or hole, and The display device further includes a first adhesive layer disposed between the heat dissipation member and the bottom of the support plate.

16. The display device according to claim 12, further comprising: Circuit board, connected to the display panel; as well as A second adhesive layer is disposed between the heat dissipation component and the circuit board. The first driver circuit is disposed on the circuit board.

17. The display device according to claim 16, further comprising: A reinforcing plate is disposed between the support plate and the display panel; and The second adhesive layer is further disposed between the reinforcing plate and the heat dissipation component.

18. The display device of claim 17, wherein the second adhesive layer is further disposed between the support plate and the reinforcing plate and between the support plate and the circuit board.

19. A display device, comprising: Display panel; The driver circuit is located in the mounting area of ​​the display panel; A support plate is disposed between the display area and the mounting area of ​​the display panel; A reinforcing plate is disposed between the support plate and the mounting area of ​​the display panel; as well as A first adhesive layer is formed between the reinforcing plate and the supporting plate. in: The reinforcing plate has one of a groove, a hole, and a slit on its surface facing the support plate, and The first adhesive layer is disposed between the surface of the reinforcing plate and the support plate, such that the first adhesive layer does not overlap with one of the groove, the hole and the slit.

20. The display device of claim 19, wherein the driver circuitry overlaps with one of the slot, the hole, and the slit of the reinforcing plate.

21. The display device according to claim 19, further comprising: A second adhesive layer is disposed between the opposite surface of the reinforcing plate and the mounting area of ​​the display panel.

22. The display device of claim 21, wherein the second adhesive layer overlaps with one of the groove, the hole and the slit of the reinforcing plate.

23. The display device of claim 22, wherein the second adhesive layer further overlaps the first adhesive layer.

24. An electronic device comprising: Bottom cover; Cover the window on the bottom cover; as well as The display device is located between the bottom cover and the cover window. The display device is the display device according to any one of claims 1-23.

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