Dispensing and packaging device and method for LED lamp bead production

Abstract

The invention discloses a dispensing and packaging device and method for LED lamp bead production, and relates to the field of LED lamp bead dispensing and packaging. The three-axis moving frame is fixedly arranged on a top plate of the base cabinet and is used for adjusting the dispensing position; the variable-pitch conveying belt is arranged between the three-axis moving frame and the base cabinet and used for conveying lamp bead positioning plates of different specifications; the glue dispensing assembly is arranged on the three-axis moving frame vertical moving module and used for dripping packaging glue to the center position of an LED lamp bead base; glue is automatically and uniformly leveled through vibration of the micro-vibration platform, the dispensing uniformity and quality control are improved, stirring and negative pressure suction are combined, and bubbles in the glue are effectively removed.

Description

Technical Field

[0001] This invention relates to the field of LED chip dispensing and encapsulation, specifically to a dispensing and encapsulation apparatus and method for LED chip production. Background Technology

[0002] LED chip encapsulation is a crucial step in LED lamp production. It protects the chip and gold wires from physical and chemical damage, ensuring reliability and long lifespan; it also improves light extraction efficiency and controls light distribution.

[0003] Existing LED chip dispensing and encapsulation devices still suffer from problems such as residual air bubbles, uneven dispensing, and adhesive stringing during actual production. These issues directly affect the final performance and product quality of LED lamps. During the dispensing process, air bubbles easily get trapped within the adhesive. These bubbles remain in the adhesive after encapsulation, causing light scattering, reduced luminous intensity, and uneven light spots, affecting luminous effect and product consistency. Furthermore, bubbles hinder heat dissipation, leading to excessively high local temperatures, accelerating LED light decay, shortening lifespan, and potentially becoming stress concentration points that cause adhesive cracking, reducing protective performance. Uneven dispensing shapes also result in variations in light output and poor appearance. Summary of the Invention

[0004] To solve the above problems, the present invention provides the following technical solution: a dispensing and encapsulation device for LED lamp bead production, comprising:

[0005] Base cabinet;

[0006] A three-axis motion frame is fixedly mounted on the top plate of the base cabinet and is used to adjust the dispensing position;

[0007] A variable-pitch conveyor belt is installed between the three-axis motion frame and the base cabinet to transport LED bead positioning plates of different specifications.

[0008] The dispensing assembly, which is located on the vertical movable module of the three-axis motion frame, is used to apply encapsulating adhesive to the center of the LED bead base.

[0009] Further, preferably, the variable-pitch conveyor belt includes:

[0010] Side panels;

[0011] Two conveyor belts are symmetrically arranged on the inner wall of the side plate, and the conveyor belts are equipped with positioning plates and micro-vibration platforms. The micro-vibration platforms are used to vibrate and diffuse the encapsulating adhesive dropped onto the center of the LED beads.

[0012] Further, preferably, the side plate includes:

[0013] A fixed side panel is fixedly installed on the top of the base cabinet;

[0014] A variable pitch side plate is symmetrically slidably disposed on one side of the fixed side plate, and the variable pitch side plate is provided with a variable pitch rocker wheel that is rotatably connected to the fixed side plate for adjusting the distance between the fixed side plate and the variable pitch side plate.

[0015] Furthermore, as a preferred embodiment, the positioning plate includes a first positioning plate and a second positioning plate, and the micro-vibration platform is disposed between the first positioning plate and the second positioning plate.

[0016] Further, as a preferred embodiment, the micro-vibration platform includes:

[0017] A vibrating plate is symmetrically slidably disposed on the inner side of the side plate;

[0018] A base plate is symmetrically and fixedly disposed on the inner side of the side plate;

[0019] Multiple vibrating cylinders are disposed between the vibrating plate and the base plate, and multiple adjustable springs are symmetrically arranged between adjacent vibrating cylinders;

[0020] A plate fixing device is disposed between adjacent adjustable springs.

[0021] Further, as a preferred embodiment, the plate fixing device includes:

[0022] Multiple photoelectric sensors are fixedly mounted inside the positioning plate;

[0023] Multiple suction cup limiting plates are fixedly connected to the vibrating plate, and the suction cup limiting plates and the photoelectric sensor are spaced apart. The suction cup limiting plates are provided with symmetrical sliding grooves at both ends.

[0024] The suction cup assembly is slidably disposed in the symmetrical groove;

[0025] An air pump is located at the lower center of the suction cup limiting plate, and the air pump is connected to the suction cup assembly by an air supply hose.

[0026] Further, preferably, the dispensing assembly includes:

[0027] A dispensing tube, which is clamped at the vertical sliding end of the three-axis motion frame, is a two-stage stepped tube;

[0028] A stirring motor is fixedly mounted on the upper end of the dispensing tube, and a stirring rod is connected to the output end of the stirring motor. The stirring rod is rotatably mounted inside the dispensing tube.

[0029] A material delivery pipe, which is connected to the thicker section of the dispensing tube;

[0030] A negative pressure valve port, which is connected to the dispensing tube above the conveying pipe;

[0031] A vision sensor is fixedly installed on one side of the dispensing tube to detect the position of the LED beads and adjust the dispensing position in real time.

[0032] A vibration clamp is mounted on the thin tube portion of the dispensing tube;

[0033] The edge of the stirring rod is in contact with the inner wall of the dispensing tube.

[0034] A method for dispensing and encapsulating LED chips in production includes the following steps:

[0035] S1. Adjust the spacing of the side plates and the initial height of the dispensing assembly according to the size of the LED bead board, and import the dispensing path program of the LED bead board into the control panel of the three-axis motion frame;

[0036] S2. Place the LED light board on the conveyor belt. When the LED light board moves to the position of the micro-vibration platform, the conveyor belt stops.

[0037] S3. The LED bead board covers and triggers the photoelectric sensor. The board fixing device adsorbs and fixes the LED bead board to the vibrating plate. The vibrating cylinder drives the LED bead board to vibrate vertically.

[0038] S4. The dispensing assembly dispenses a precise amount of adhesive to the center of the target LED bead, and the micro-vibration platform spreads the encapsulating adhesive evenly.

[0039] S5. After the dispensing assembly completes the dispensing according to the dispensing path program, the conveyor belt starts and transports the encapsulated LED bead board out of the device.

[0040] Compared with the prior art, the present invention provides a dispensing and encapsulation device for LED chip production, which has the following advantages:

[0041] This invention utilizes a micro-vibration platform to automatically and evenly flow and level the adhesive, accelerating curing. Independently adjustable springs and vibration units correct regional vibration frequency deviations, significantly improving product yield and eliminating air bubbles at the source. The combination of stirring, vibration, and negative pressure suction effectively removes air bubbles from the adhesive, preventing bubble defects after dispensing and improving LED light quality and device reliability.

[0042] It can quickly adapt to various specifications of LED light bead boards without disassembling any parts, reducing downtime and making it very suitable for multi-variety, small-batch production modes. Attached Figure Description

[0043] Figure 1 A three-dimensional structural diagram of a dispensing and encapsulation device for LED chip production;

[0044] Figure 2 This is a schematic diagram of the dispensing component in a dispensing and encapsulation device for LED chip production.

[0045] Figure 3 This is a schematic diagram of the operation of the dispensing component in a dispensing and encapsulation device for LED lamp bead production.

[0046] Figure 4 This is a schematic diagram of the variable-pitch conveyor belt in a dispensing and encapsulation device for LED chip production.

[0047] Figure 5 This is a detailed structural diagram of a variable-pitch conveyor belt;

[0048] Figure 6 This is an enlarged schematic diagram of the micro-vibration platform in a variable-pitch conveyor belt.

[0049] Figure 7 This is for the oscillation and diffusion effect of LED beads;

[0050] Figure 8 This diagram illustrates the steps of a dispensing and encapsulation method for LED chip production.

[0051] In the diagram: 1. Base cabinet; 2. Variable pitch conveyor belt; 21. Side plate; 211. Fixed side plate; 212. Variable pitch side plate; 213. Variable pitch rocker wheel; 22. Positioning plate; 221. First positioning plate; 222. Second positioning plate; 23. Micro-vibration platform; 231. Vibrating plate; 232. Vibrating cylinder; 233. Base plate; 234. Adjustable spring; 235. Photoelectric sensor; 236. Suction cup limiting plate; 237. Suction cup assembly; 238. Air pump; 24. Conveyor belt; 3. Three-axis motion frame; 4. Dispensing assembly; 41. Stirring motor; 42. Dispensing tube; 43. Stirring rod; 44. Feeding pipe; 45. Negative pressure valve port; 46. Vibration sensor; 47. Vibrating clamp. Detailed Implementation

[0052] The terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such terms are interchangeable where appropriate; this is merely a distinguishing method used to describe objects with the same attributes in the embodiments of this application. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion, so that a process, method, system, product, or apparatus that comprises a series of elements is not necessarily limited to those elements but may include other elements not explicitly listed or inherent to those processes, methods, products, or apparatuses.

[0053] Example: Please refer to Figures 1-8 In this embodiment of the invention, a dispensing and encapsulation device for LED chip production is provided, comprising:

[0054] Base cabinet 1;

[0055] The three-axis motion frame 3 is fixedly installed on the top plate of the base cabinet 1 and is used to adjust the dispensing position;

[0056] A variable-pitch conveyor belt 2 is disposed between the three-axis motion frame 3 and the base cabinet 1, and is used to transport LED bead positioning plates of different specifications.

[0057] The dispensing assembly 4 is located on the vertical movable module of the three-axis motion frame 3 and is used to apply encapsulating adhesive to the center of the LED bead base.

[0058] Before LED dispensing, adjust the spacing of the variable-pitch conveyor belt 2 according to the specifications of the LED bead board, import the dispensing path program of the LED bead board into the control panel of the three-axis motion frame 3, and then adjust the height of the dispensing assembly 4 to facilitate LED bead dispensing and encapsulation.

[0059] Specifically, such as Figure 4 The variable-pitch conveyor belt 2 includes:

[0060] Side panel 21;

[0061] Two conveyor belts 24 are symmetrically arranged on the inner wall of the side plate 21, and the conveyor belts 24 are provided with a positioning plate 22 and a micro-vibration platform 23.

[0062] The positioning plate 22 is used not only to support the conveyor belt in the conveyor belt 24 and improve the stability of the LED lamp bead board conveying, but also to position the micro-vibration platform 23 and correct the vertical vibration deviation of the micro-vibration platform 23.

[0063] Furthermore, such as Figure 5 The side plate 21 includes:

[0064] A fixed side panel 211 is fixedly installed on the top plate of the base cabinet 1;

[0065] A variable pitch side plate 212 is symmetrically slidably disposed on one side of the fixed side plate 211, and the variable pitch side plate 212 is provided with a variable pitch rocker wheel 213 rotatably connected to the fixed side plate 211 for adjusting the distance between the fixed side plate 211 and the variable pitch side plate 212.

[0066] In practice, the spacing of the side plate 21 can be changed by rotating the variable pitch rocker 213, so that LED lamp bead boards of different specifications can be clamped and transported without disassembling the components.

[0067] Preferably, the positioning plate 22 includes a first positioning plate 221 and a second positioning plate 222, and the micro-vibration platform 23 is disposed between the first positioning plate 221 and the second positioning plate 222.

[0068] like Figure 6 The micro-vibration platform 23 includes:

[0069] Vibration plate 231 is symmetrically slidably disposed inside the fixed side plate 211 and the variable pitch side plate 212;

[0070] The base plate 233 is symmetrically fixed inside the fixed side plate 211 and the variable pitch side plate 212;

[0071] Multiple vibrating cylinders 232 are disposed between the vibrating plate 231 and the base plate 233, and multiple adjustable springs 234 are symmetrically arranged between adjacent vibrating cylinders 232. Each of the adjustable springs 234 can be adjusted independently to assist the vibrating plate 231 in resetting.

[0072] A plate fixing device is disposed between adjacent adjustable springs 234.

[0073] Preferably, the plate fixing device includes:

[0074] Multiple photoelectric sensors 235 are fixedly disposed inside the positioning plate 233;

[0075] Multiple suction cup limiting plates 236 are fixedly connected to the vibration plate 231, and the suction cup limiting plates 236 and the photoelectric sensor 235 are distributed with gaps. The suction cup limiting plates 236 are provided with symmetrical sliding grooves at both ends.

[0076] The suction cup assembly 237 is slidably disposed in the symmetrical slide groove. All the suction cups in the suction cup assembly 237 are elastic suction cups, which are used to alleviate the impact of vibration deviation on the LED lamp bead board. The position of the suction cups in the suction cup assembly 237 can be adjusted independently to adapt to LED lamp bead boards of different specifications.

[0077] An air pump 238 is located at the lower middle part of the suction cup limiting plate 236, and the air pump is connected to the suction cup by an air delivery hose.

[0078] The photoelectric sensor 235 is used to trigger the air pump 238 and the vibrating cylinder 232.

[0079] During implementation, when the conveyor belt transports the LED bead board to the micro-vibration platform 23, the conveyor belt stops, the photoelectric sensor 235 covered by the LED bead board is triggered, and the corresponding air pump 238 starts. The suction cup assembly 237 adsorbs and fixes the LED bead board to the vibrating plate 231. The LED bead encapsulating adhesive is dripped onto the center of the target bead. The vibrating cylinder 232 starts, and the LED bead board vibrates at the same frequency as the vibrating plate 231. Under the vibration of the vibrating plate 231, the encapsulating adhesive spreads evenly around the bead. Figure 7Under the same frequency vibration, the LED lamp packages for dispensing and encapsulation are all of the same standard. When the vibration frequency of the vibrating cylinders 232 deviates, the vibration plate 231 will have regional vibration frequency differences, resulting in uneven diffusion of encapsulating glue in the LED lamp beads during the dispensing and encapsulation process. By independently adjusting the elasticity of the adjustable spring 234, the vibration frequency experienced by each area of ​​the LED lamp bead board is adjusted to the same frequency, improving the quality control of dispensing and encapsulation. As the LED lamp bead board vibrates, the solidification and setting speed of the encapsulating glue is accelerated, ensuring stability for subsequent processing operations.

[0080] In this embodiment, as Figure 2 , Figure 3 The dispensing assembly 4 includes:

[0081] The dispensing tube 42 is disposed at the vertical sliding end of the three-axis motion frame 3, and the dispensing tube 42 is a two-stage stepped tube;

[0082] A stirring motor 41 is fixedly mounted on the upper end of the dispensing tube 42, and a stirring rod 43 is connected to the output end of the stirring motor 41. The stirring rod 43 is rotatably mounted inside the dispensing tube 42.

[0083] The material delivery tube 44 is connected to the thicker section of the dispensing tube 42 and is used to deliver the encapsulating adhesive.

[0084] Negative pressure valve port 45, which is connected to the dispensing tube 42 above the conveying tube 44;

[0085] A vision sensor 46 is fixedly installed on one side of the dispensing tube 42 to detect the position of the LED beads and adjust the dispensing position in real time.

[0086] Vibration clamp 47 is clamped onto the thin tube portion of the dispensing tube 42;

[0087] The edge of the stirring rod 43 is attached to the inner wall of the thin tube of the dispensing tube 42, and the stirring motor 41 is also triggered by the photoelectric sensor 235.

[0088] During implementation, the encapsulating adhesive is injected into the dispensing tube 42 along the feed tube 44. Then, the gas above the encapsulating adhesive is extracted through the negative pressure valve port 45 to form a negative pressure chamber. Under the synergistic action of the reverse rotation of the stirring rod 43 and the vibration of the vibrating clamp 47, the air bubbles in the encapsulating adhesive are separated more quickly and discharged along the negative pressure valve port 45. As the stirring rod 43 rotates forward, the amount of encapsulating adhesive dispensed is determined by the motor angle / number of rotations, and is basically unaffected by changes in adhesive viscosity, pressure, and remaining amount of adhesive, thus greatly improving accuracy. After dispensing is completed, the reverse rotation (backflow) of the stirring rod 43 can effectively cut the adhesive filaments.

[0089] It should be noted that after the photoelectric sensor 235 is triggered, when the stirring motor 41 rotates forward, the vibrating cylinder 232 and the vibrating clamp 47 are in standby mode, and the encapsulating adhesive is dropped onto the center position of the target LED bead. After the dispensing is completed, as the dispensing assembly 4 moves to the center position of the next target LED bead, the stirring motor 41 reverses, and the vibrating cylinder 232 and the vibrating clamp 47 vibrate. This is used as a node until all LED beads are dispensed. During this process, the vacuum pump 238 is always in working mode.

[0090] A method for dispensing and encapsulating LED chips during production, such as Figure 8 This includes the following steps:

[0091] S1. Adjust the spacing of the side plates 211 and the initial height of the dispensing assembly 4 according to the size of the LED bead board, and import the dispensing path program of the LED bead board into the control panel of the three-axis motion frame 3;

[0092] S2. Place the LED light board on the conveyor belt 24. When the LED light board moves to the position of the micro-vibration platform 23, the conveyor belt 24 stops.

[0093] S3. The LED bead board covers the photoelectric sensor 235, and the board fixing device adsorbs and fixes the LED bead board to the vibrating plate 231. The vibrating cylinder 23 drives the LED bead board to vibrate vertically.

[0094] S4. The dispensing assembly 4 dispenses a quantitative amount of adhesive onto the center of the target LED bead, and the micro-vibration platform 23 spreads the encapsulating adhesive evenly.

[0095] S5. After the dispensing assembly 4 completes the dispensing according to the dispensing path program, the conveyor belt 24 starts and conveys the encapsulated LED lamp bead board out of the device.

[0096] The above description is merely a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A dispensing and encapsulation device for LED chip production, characterized in that, include: Base cabinet (1); The three-axis motion frame (3) is fixedly installed on the top plate of the base cabinet (1) for adjusting the dispensing position; A variable-pitch conveyor belt (2) is set between the three-axis motion frame (3) and the base cabinet (1) for conveying lamp bead positioning plates of different specifications; The dispensing assembly (4), which is located on the vertical movable module of the three-axis motion frame (3), is used to apply encapsulating adhesive to the center of the LED bead base.

2. The dispensing and encapsulation device for LED bead production according to claim 1, characterized in that, The variable pitch conveyor belt (2) includes: Side panel (21); Two conveyor belts (24) are symmetrically arranged on the inner wall of the side plate (21), and the conveyor belts (24) are provided with a positioning plate (22) and a micro-vibration platform (23). The micro-vibration platform (23) is used to vibrate and diffuse the encapsulating glue dropped at the center of the LED lamp bead.

3. The dispensing and encapsulation device for LED bead production according to claim 2, characterized in that, The side plate (21) includes: A fixed side panel (211) is fixedly installed on the top of the base cabinet (1); A variable pitch side plate (212) is symmetrically slidably disposed on one side of the fixed side plate (211), and the variable pitch side plate (212) is provided with a variable pitch rocker (213) rotatably connected to the fixed side plate (211) for adjusting the distance between the fixed side plate (211) and the variable pitch side plate (212).

4. The dispensing and encapsulation device for LED bead production according to claim 2, characterized in that, The positioning plate (22) includes a first positioning plate (221) and a second positioning plate (222), and the micro-vibration platform (23) is disposed between the first positioning plate (221) and the second positioning plate (222).

5. The dispensing and encapsulation device for LED bead production according to claim 4, characterized in that, The micro-vibration platform (23) includes: A vibrating plate (231) is symmetrically slidably disposed inside the side plate (21); The base plate (233) is symmetrically fixed inside the side plate (21); Multiple vibrating cylinders (232) are disposed between the vibrating plate (231) and the base plate (233), and multiple adjustable springs (234) are symmetrically arranged between adjacent vibrating cylinders (232). A plate fixing device is disposed between adjacent adjustable springs (234).

6. The dispensing and encapsulation device for LED bead production according to claim 5, characterized in that, The plate fixing device includes: Multiple photoelectric sensors (235) are fixedly disposed inside the positioning plate (233); Multiple suction cup limiting plates (236) are fixedly connected to the vibration plate (231), and the suction cup limiting plates (236) and the photoelectric sensor (235) are distributed with gaps. The suction cup limiting plates (236) are provided with symmetrical sliding grooves at both ends. The suction cup assembly (237) is slidably disposed in the symmetrical groove; An air pump (238) is located at the lower middle part of the suction cup limiting plate (236), and the air pump (238) is connected to the suction cup assembly (237) by an air delivery hose.

7. The dispensing and encapsulation device for LED bead production according to claim 1, characterized in that, The dispensing assembly (4) includes: The dispensing tube (42) is clamped at the vertical sliding end of the three-axis motion frame (3), and the dispensing tube (42) is a two-stage stepped tube; A stirring motor (41) is fixedly installed at the upper end of the dispensing tube (42), and a stirring rod (43) is connected to the output end of the stirring motor (41). The stirring rod (43) is rotatably installed inside the dispensing tube (42). The material delivery pipe (44) is connected to the thicker section of the dispensing pipe (42); Negative pressure valve port (45), which is connected to the dispensing tube (42) above the conveying tube (44); A vision sensor (46) is fixedly installed on one side of the dispensing tube (42) to detect the position of the LED beads and adjust the dispensing position in real time. Vibration clamp (47), which is clamped to the thin tube portion of the dispensing tube (42); The edge of the stirring rod (43) is in contact with the inner wall of the thin tube of the dispensing tube (42).

8. A method for dispensing and encapsulating LED beads in production, comprising using the encapsulation apparatus as described in any one of claims 1-7, characterized in that, Includes the following steps: S1. Adjust the spacing of the side plates (211) and the initial height of the dispensing assembly (4) according to the size of the LED bead board, and import the dispensing path program of the LED bead board into the control panel of the three-axis motion frame (3); S2. Place the LED light board on the conveyor belt (24). When the LED light board moves to the position of the micro-vibration platform (23), the conveyor belt (24) stops. S3. The LED bead board covers the trigger photoelectric sensor (235), the board fixing device adsorbs and fixes the LED bead board to the vibrating plate (231), and the vibrating cylinder (23) drives the LED bead board to vibrate vertically. S4. The dispensing assembly (4) dispenses a quantitative amount of adhesive to the center of the target LED bead, and the micro-vibration platform (23) spreads the encapsulating adhesive evenly. S5. After the dispensing assembly (4) completes the dispensing according to the dispensing path program, the conveyor belt (24) starts and conveys the encapsulated LED lamp bead board out of the device.

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