Insulating adhesive step printing method for photovoltaic module, photovoltaic module and cell

By using a step-by-step printing method for insulating adhesive, the thickness of the insulating adhesive in the solder strip and non-solder strip areas can be controlled differently, solving the problems of short circuits and warping in existing technologies, thereby improving the yield of photovoltaic modules and reducing costs.

CN120863227BActive Publication Date: 2026-06-26TIANJIN AIKO SOLAR ENERGY TECH CO LTD +4
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
TIANJIN AIKO SOLAR ENERGY TECH CO LTD
Filing Date
2025-09-25
Publication Date
2026-06-26

AI Technical Summary

Technical Problem

Existing technologies make it difficult to differentiate the thickness of the insulating adhesive in areas covered by solder strips and areas not covered by solder strips, leading to potential short circuit hazards and warping risks, which affect module yield and cost.

Method used

An insulating adhesive step-by-step printing method is adopted, with insulating adhesive printed separately for the solder ribbon-covered area and the non-solder ribbon-covered area. The thickness difference between the two areas is controlled by an independent curing process, using different screen parameters and types of insulating adhesive.

Benefits of technology

This technology ensures that the insulation thickness in the solder strip-covered area meets short-circuit protection requirements, while reducing the thickness in the non-solder strip-covered area to minimize warping and material waste, thus significantly improving component yield and overall performance.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application belongs to the technical field of solar cells, and relates to a step-by-step printing method of insulating glue for a photovoltaic module, a photovoltaic module and a cell. The step-by-step printing method of insulating glue comprises sequentially performed solder strip covered area insulating glue printing, first solidification, non-solder strip covered area insulating glue printing and second solidification. The thickness of the solder strip covered area insulating glue printing is greater than the thickness of the non-solder strip covered area insulating glue printing. The step-by-step printing method of insulating glue provided in the application realizes differentiated control of the insulating glue thickness of the solder strip covered area and the non-solder strip covered area, avoids short circuit hidden dangers, reduces hidden cracks caused by warping, improves the yield of the module, reduces the cost, and is conducive to large-scale popularization and application.
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