Inorganic two-component binder as well as preparation method and application method thereof

Abstract

The invention provides an inorganic two-component binder as well as a preparation method and an application method thereof. The inorganic bi-component binder comprises a component A and a component B, wherein the component A comprises a first inorganic filler, a liquid inorganic binder and a first additive, and the component B comprises a second inorganic filler, a curing agent, a solvent and a second additive; wherein the first additive and the second additive respectively and independently comprise a thickening agent and / or a dispersing agent. The inorganic bi-component binder provided by the invention realizes breakthrough combination of high temperature resistance and construction convenience: compared with traditional organic AB glue, the inorganic bi-component binder is resistant to high temperature, and the long-term use temperature is greater than 300 DEG C; the problem that the solid phase and the liquid phase of the inorganic binder are packaged separately is solved, additional on-site ingredient adjustment is not needed during construction, flexible adjustment can be achieved according to working conditions in the using process, the construction difficulty is lowered, and the inorganic binder has extremely high application value.

Description

Technical Field

[0001] This invention belongs to the field of inorganic functional material preparation, specifically relating to an inorganic two-component binder and its preparation and application methods. Background Technology

[0002] Adhesives, as key functional materials for achieving material bonding, firmly combine similar or dissimilar materials through interfacial interactions. Their core properties must meet requirements for mechanical strength, temperature resistance, chemical stability, and ease of application under specific environments. Based on the essential differences in chemical composition, adhesives can be divided into inorganic adhesives based on inorganic compounds and organic adhesives based on polymers. The two complement each other in terms of temperature resistance, curing mechanism, and application scenarios, but each also faces its own technical bottlenecks.

[0003] Organic adhesives use high-molecular polymers such as epoxy resin, polyurethane, and acrylate as base materials, and achieve curing through free radical polymerization, condensation reaction, or solvent evaporation. They offer advantages such as rapid curing at room temperature, convenient application, and adaptability to all surfaces. Currently, organic adhesives (such as AB-type epoxy resin) widely adopt injection-type single-tube mixing mode (such as dual-chamber syringe + static mixing tube), which provides the convenience of "just apply and use," but has fatal flaws: low upper temperature resistance, with most organic adhesives having a temperature resistance of ≤300℃, and carbonization and decomposition occurring in environments above 600℃ (e.g., epoxy resin has a weight loss rate >50% at 400℃); high-temperature mechanical properties degrade, with the shear strength of organic adhesives decreasing by more than 70% above 300℃, failing to meet high-temperature reliability requirements.

[0004] Inorganic adhesives are widely used in bonding and fixing ceramic and metal parts of high-temperature equipment, as well as bonding, repairing, and sealing metal tools, glass, pipes, and shafts, due to their excellent temperature resistance, low curing shrinkage, simple preparation process, and low cost. Most inorganic adhesives are water-based, so high-temperature resistant inorganic adhesives are prone to sedimentation and short shelf life after mixing. Therefore, to prevent sedimentation and extend storage time, they are often packaged separately as solid phase (A phase) and liquid phase (B phase). However, this separate packaging method requires the inorganic adhesive to be mixed according to the specified proportions and using appropriate mixing equipment before use, which places certain demands on the surrounding environment and the operation of on-site personnel.

[0005] Therefore, how to prepare an adhesive with excellent high-temperature resistance, whose composition can be flexibly adjusted according to the bonding object and does not require on-site adjustment is an urgent technical problem to be solved. Summary of the Invention

[0006] To address the shortcomings of existing technologies, the present invention aims to provide an inorganic two-component adhesive, its preparation method, and its application method. The inorganic two-component adhesive provided by this invention achieves a breakthrough combination of high-temperature resistance and ease of application: compared to traditional organic AB adhesives, this inorganic two-component adhesive exhibits superior high-temperature resistance, with a long-term operating temperature exceeding 300°C; it solves the problem of separate packaging of the solid and liquid phases in inorganic adhesives, and eliminates the need for additional on-site mixing and adjustment during application. Furthermore, it allows for flexible adjustment based on working conditions, reducing application difficulty and demonstrating extremely high application value.

[0007] To achieve this objective, the present invention adopts the following technical solution:

[0008] In a first aspect, the present invention provides an inorganic two-component adhesive, the inorganic two-component adhesive comprising component A and component B.

[0009] Component A includes a first inorganic filler, a liquid inorganic binder, and a first additive, while component B includes a second inorganic filler, a curing agent, a solvent, and a second additive.

[0010] The first additive and the second additive each independently include a thickener and / or a dispersant.

[0011] This invention uses a combination of a first inorganic filler, a liquid inorganic binder, and a first additive to obtain a liquid component A, and a combination of a second inorganic filler, a curing agent, a solvent, and a second additive to obtain a liquid component B. The mixture of components A and B forms a thermal stress buffer mechanism, achieving the construction of a high-temperature resistant skeleton. Furthermore, the dual-liquid homogeneous system exhibits excellent stability and controllable reaction characteristics, allowing for immediate use. Therefore, the inorganic two-component adhesive provided by this invention achieves a breakthrough combination of high-temperature resistance and ease of application: compared to traditional organic AB adhesives, this inorganic two-component adhesive is more resistant to high temperatures, with a long-term operating temperature exceeding 300°C; it solves the problem of separate packaging of the solid and liquid phases of inorganic adhesives, and eliminates the need for additional on-site mixing and adjustment during application. It can be flexibly adjusted according to working conditions during use, reducing construction difficulty and possessing extremely high application value.

[0012] In this invention, the introduction of a liquid inorganic binder increases the wetting effect and bonding strength.

[0013] It should be noted that the selection of the first or second additive should be based on different construction performance and application conditions.

[0014] Preferably, component A comprises the following components by weight:

[0015] The first inorganic filler is 10-90 parts, for example, it can be 10 parts, 20 parts, 30 parts, 40 parts, 50 parts, 60 parts, 70 parts, 80 parts or 90 parts, etc.; the liquid inorganic binder is 10-90 parts, for example, it can be 10 parts, 20 parts, 30 parts, 40 parts, 50 parts, 60 parts, 70 parts, 80 parts or 90 parts, etc.; the first additive is 0.1-5 parts, for example, it can be 0.1 parts, 0.5 parts, 1 part, 2 parts, 3 parts, 4 parts or 5 parts, etc.

[0016] The A component prepared according to the above proportion has a certain fluidity, and at room temperature (e.g., 25°C), the inorganic filler and the first additive do not undergo any chemical reaction with the liquid inorganic binder.

[0017] Preferably, component B comprises the following components by weight:

[0018] The second inorganic filler is 7.5-50 parts, for example, 7.5 parts, 10 parts, 20 parts, 30 parts, 40 parts or 50 parts, etc.; the curing agent is 5-35 parts, for example, 5 parts, 10 parts, 15 parts, 20 parts, 25 parts, 30 parts or 35 parts, etc.; the solvent is 25-50 parts, for example, 25 parts, 30 parts, 35 parts, 40 parts, 45 parts or 50 parts, etc.; and the second additive is 0.1-5 parts, for example, 0.1 parts, 0.5 parts, 1 part, 2 parts, 3 parts, 4 parts or 5 parts, etc.

[0019] The B component prepared according to the above proportions has a certain fluidity and does not undergo any chemical reaction between the inorganic filler, curing agent, solvent and second additive at room temperature (e.g., 25°C).

[0020] Preferably, the first inorganic filler and the second inorganic filler each independently comprise inorganic non-metallic materials and / or metallic materials.

[0021] It should be noted that inorganic fillers are the main components of material expansion properties, temperature resistance / wear resistance, and different types can be selected according to different working conditions.

[0022] Preferably, the inorganic non-metallic material includes any one or a combination of at least two of oxides, carbides, or nitrides.

[0023] Preferably, the oxidant comprises aluminum oxide and / or silicon oxide.

[0024] Preferably, the silicon carbide comprises silicon carbide.

[0025] Preferably, the nitride includes boron nitride.

[0026] Preferably, the metallic material includes any one or at least a combination of two of copper powder, iron powder, or nickel powder.

[0027] Preferably, the particle size D50 of the oxide is 1-10 μm, for example, it can be 1 μm, 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm or 10 μm, etc.

[0028] Preferably, the particle size D50 of the carbide is 3-7 μm, for example, it can be 3 μm, 4 μm, 5 μm, 6 μm or 7 μm, etc.

[0029] Preferably, the particle size D50 of the nitride is 0.5-1.5 μm, for example, it can be 0.5 μm, 1 μm or 1.5 μm.

[0030] It should be noted that, depending on the operating conditions, at least one of oxides, carbides and nitrides can be selected in combination, or oxides, carbides or nitrides of different particle sizes can be selected in combination.

[0031] Preferably, the curing agent comprises any one or a combination of at least two of metal oxides, inorganic acid salts, or cement.

[0032] Preferably, the metal oxide includes any one or a combination of at least two of magnesium oxide, calcium oxide, or zinc oxide.

[0033] Preferably, the inorganic acid salt includes any one or a combination of at least two of magnesium chloride, magnesium sulfate, sodium fluorosilicate, aluminum tripolyphosphate, polyaluminum phosphate, or silicon phosphate.

[0034] Preferably, the cement comprises any one or a combination of at least two of silicate cement, aluminate cement, or sulfoaluminate cement. It should be noted that silicate cement is mainly composed of tricalcium silicate and dicalcium silicate, aluminate cement is mainly composed of calcium aluminate, and sulfoaluminate cement is mainly composed of calcium sulfoaluminate.

[0035] Preferably, the thickener comprises any one or a combination of at least two of sodium carboxymethyl cellulose, bentonite, silica, or ethyl cellulose.

[0036] Preferably, the dispersant includes any one or a combination of at least two of the following: defoamer, accelerator, retarder, or antisettling agent. For example, the defoamer may be polydimethylsiloxane or polyoxyethylene-polyoxypropylene block copolymer, the accelerator may be calcium chloride, sodium aluminate, or triethanolamine, the retarder may be citric acid, tartaric acid, sucrose, sodium lignosulfonate, or sodium phosphate, and the antisettling agent may include polycarboxylic acid thickener, nano-silica, stearamide, or aminotrimethylenephosphonic acid.

[0037] Preferably, the liquid inorganic binder includes any one or a combination of at least two of sodium silicate solution, potassium silicate solution, lithium silicate, aluminum dihydrogen phosphate, silica sol, or aluminum sol.

[0038] Preferably, the modulus of the liquid inorganic binder is 2-2.3, for example, it can be 2, 2.1, 2.2 or 2.3, etc. "Modulus" (if the liquid inorganic binder is a sodium silicate solution) refers to the molar ratio of silicon dioxide to sodium oxide.

[0039] Preferably, the Baumé degree of the liquid inorganic binder is 40-50 Be, for example, it can be 40 Be, 45 Be, or 50 Be. "Baumé degree" refers to the relative density of a solution measured by a Baumé meter, reflecting the solute content in the liquid inorganic binder.

[0040] Preferably, the solvent includes an aqueous solvent and / or an organic solvent.

[0041] Preferably, the organic solvent includes any one or a combination of at least two of anhydrous ethanol, methanol, ethylene glycol, toluene, or xylene.

[0042] Preferably, the inorganic two-component adhesive is used at a temperature of 300-1000℃, for example, 300℃, 400℃, 500℃, 600℃, 700℃, 800℃, 900℃ or 1000℃.

[0043] In a second aspect, the present invention provides a method for preparing an inorganic two-component binder as described in the first aspect, the method comprising the following steps:

[0044] The first inorganic filler, liquid inorganic binder and first additive are mixed to obtain component A.

[0045] The second inorganic filler, curing agent, solvent, and second additive are mixed in a second process to obtain component B.

[0046] Preferably, the first mixing step includes:

[0047] The first inorganic filler after granulation and the liquid inorganic binder are mixed to obtain a mixed slurry.

[0048] The mixed slurry is mixed with the first additive.

[0049] In this invention, the purpose of granulation is to ensure that the filler particle size is evenly distributed, so as to prevent large particles from clogging the outlet of the mixing tube and causing the rubber material to be unable to be extruded smoothly.

[0050] Preferably, the second mixing step includes:

[0051] The second inorganic filler and curing agent are mixed and granulated, then added to a solvent and mixed to obtain a mixed slurry.

[0052] The mixed slurry and the second additive are mixed.

[0053] In this invention, the effect of mixing the second inorganic filler and the curing agent for granulation is to obtain a mixed powder with uniform particle size.

[0054] Thirdly, the present invention provides a method for applying the inorganic two-component binder as described in the first aspect, the method comprising the following steps:

[0055] Components A and B are mixed in the liquid phase, then bonded to the target material and cured.

[0056] Preferably, the liquid phase mixing step includes:

[0057] A mixing device is provided, the mixing device comprising a dual-chamber syringe and a mixing tube communicating with the outlet of the dual-component syringe, the dual-chamber syringe comprising two independent injection syringes arranged side by side, denoted as syringe A and syringe B.

[0058] Component A and Component B are respectively introduced into the A and B chambers of the dual-chamber syringe, and then pushed into the mixing tube for liquid-phase mixing to obtain the inorganic two-component binder required for the target material.

[0059] This invention utilizes a mixing device commonly used in organic binders for inorganic two-component binders. This not only overcomes the problem of poor temperature resistance but also solves the problem of separate packaging of the solid and liquid phases of inorganic binders. No additional on-site mixing and adjustment is required during construction, and the process can be flexibly adjusted according to working conditions, reducing construction difficulty and demonstrating extremely high application value.

[0060] Preferably, the volume ratio of cylinder A to cylinder B is (1-10):1, for example, it can be 1:1, 2:1, 3:1, 4:1, 5:1, 6:1, 7:1, 8:1, 9:1 or 10:1, etc.

[0061] It should be noted that the appropriate volume ratio can be selected based on the required solidification time and strength for the task.

[0062] Preferably, the length of the mixing tube is 5-20cm, for example, it can be 5cm, 7cm, 10cm, 12cm, 15cm or 20cm, etc.

[0063] It should be noted that a suitable mixing tube can be selected based on the characteristics of the materials. For example, based on the flowability of components A and B, type I is used when the flowability difference is small and both are good; type III is used when the flowability difference is small and both are relatively high; and type II is used when the flowability difference is large.

[0064] The numerical range described in this invention includes not only the point values ​​listed above, but also any point values ​​within the numerical ranges not listed above. Due to space limitations and for the sake of brevity, this invention will not exhaustively list all the specific point values ​​included in the range.

[0065] Compared with the prior art, the present invention has the following beneficial effects:

[0066] This invention uses a combination of a first inorganic filler, a liquid inorganic binder, and a first additive to obtain a liquid component A, and a combination of a second inorganic filler, a curing agent, a solvent, and a second additive to obtain a liquid component B. The mixture of components A and B forms a thermal stress buffer mechanism, achieving the construction of a high-temperature resistant skeleton. Furthermore, the dual-liquid homogeneous system exhibits excellent stability and controllable reaction characteristics, allowing for immediate use. Therefore, the inorganic two-component adhesive provided by this invention achieves a breakthrough combination of high-temperature resistance and ease of application: compared to traditional organic AB adhesives, this inorganic two-component adhesive is more resistant to high temperatures, with a long-term operating temperature exceeding 300℃; it solves the problem of separate packaging of the solid and liquid phases of inorganic adhesives, reducing the operational requirements on the surrounding environment and on-site personnel. During use, it can be flexibly adjusted according to working conditions, reducing construction difficulty and possessing extremely high application value. Detailed Implementation

[0067] The technical solution of the present invention will be further illustrated below through specific embodiments. Those skilled in the art should understand that the embodiments described are merely illustrative of the present invention and should not be construed as limiting the invention in any way.

[0068] In one specific embodiment, the present invention provides an inorganic two-component adhesive, the inorganic two-component adhesive comprising component A and component B.

[0069] Component A comprises the following components by weight:

[0070] 7.5-25 parts of alumina with a particle size D50 of 10μm, 7.5-25 parts of alumina with a particle size D50 of 3μm, 35-50 parts of sodium silicate solution (modulus 2-2.3, Baumé degree 40-50Be), and 0.1-2 parts of silica (BET200).

[0071] Component B comprises the following components by weight:

[0072] 7.5-25 parts of alumina with a particle size D50 of 10 μm, 7.5-25 parts of alumina with a particle size D50 of 3 μm, 5-15 parts of sodium fluorosilicate (AR), 40-50 parts of anhydrous ethanol (mass fraction ≥99.5%), and 0.1-2 parts of ethyl cellulose ethanol solution (mass fraction 2%).

[0073] The present invention also provides a method for preparing the above-mentioned inorganic two-component binder, the preparation method comprising the following steps:

[0074] (1) The alumina material was granulated to obtain alumina with a particle size D50 of 10 μm and alumina with a particle size D50 of 3 μm.

[0075] Alumina with a particle size D50 of 10 μm, alumina with a particle size D50 of 3 μm and sodium silicate solution are mixed, and then silica is added to obtain component A.

[0076] (2) The alumina material and sodium fluorosilicate are mixed and granulated to obtain a mixture; the mixture includes alumina with a particle size D50 of 10 μm and alumina with a particle size D50 of 3 μm.

[0077] The mixture was added to anhydrous ethanol and mixed, and then ethyl cellulose ethanol solution was added to obtain component B.

[0078] This invention also provides a method for applying the above-mentioned inorganic two-component adhesive, wherein the inorganic two-component adhesive is used for fixing and bonding galvanized screws to aluminum plates in an ALD furnace (long-term operating temperature 350℃), and the application method includes the following steps:

[0079] (1) A mixing device is provided, the mixing device comprising a dual-chamber syringe and a type I mixing tube connected to the outlet of the dual-component syringe, the dual-chamber syringe comprising two independent injection syringes arranged side by side, denoted as syringe A and syringe B; the volume ratio of syringe A and syringe B is 1:1; the length of the mixing tube is 10cm.

[0080] (2) Component A and Component B are respectively introduced into the A and B cylinders of the dual-chamber syringe, and then pushed into the type I mixing tube for liquid-phase mixing to obtain the desired inorganic two-component binder; the viscosity of the inorganic two-component binder is 10,000-50,000 cps (for example, it can be 10,000 cps, 20,000 cps, 30,000 cps, 40,000 cps or 50,000 cps, etc.).

[0081] (3) The inorganic two-component adhesive is used to bond the connection between the galvanized screw and the aluminum plate in the ALD furnace and then cures it for 4-16 hours (e.g., 4 hours, 8 hours, 10 hours, 12 hours, 14 hours or 16 hours).

[0082] To verify the performance of the aforementioned inorganic two-component adhesive, its cured strength at 350℃ was tested. The specific method was as follows: after the inorganic two-component adhesive was bonded and cured using two high-temperature resistant stainless steel sheets, it was clamped in a high-temperature tensile testing machine, heated to 350℃, and held at that temperature for 10 minutes before a tensile test was conducted until fracture. The test results showed that the cured strength of the inorganic two-component adhesive at 350℃ was ≥30MPa. Furthermore, the deliquescence time was tested using boiling water, and the results showed that the deliquescence time was >24h, demonstrating the excellent deliquescence resistance of the inorganic two-component adhesive.

[0083] In another specific embodiment, the present invention provides an inorganic two-component adhesive comprising component A and component B.

[0084] Component A comprises the following components by weight:

[0085] 7.5-25 parts of silicon carbide with a particle size D50 of 5 μm, 7.5-25 parts of boron nitride with a particle size D50 of 1 μm, 2-5 parts of alumina with a particle size D50 of 1 μm, 40-50 parts of aluminum dihydrogen phosphate (modulus 2-2.3, Baume degree 40-50Be), and 0.1-2 parts of bentonite (AR).

[0086] Component B comprises the following components by weight:

[0087] 7.5-10 parts of alumina with a particle size D50 of 3μm, 5-15 parts of sulfoaluminate cement (strength grade 625), 40-50 parts of anhydrous ethanol (mass fraction ≥99.5%), and 0.1-1 parts of retarder.

[0088] The present invention also provides a method for preparing the above-mentioned inorganic two-component binder, the preparation method comprising the following steps:

[0089] (1) Silicon carbide, boron nitride and aluminum oxide are mixed and then granulated to obtain silicon carbide with a particle size D50 of 5 μm, boron nitride with a particle size D50 of 1 μm and aluminum oxide with a particle size D50 of 1 μm, respectively.

[0090] The silicon carbide with a particle size D50 of 5 μm, boron nitride with a particle size D50 of 1 μm, alumina with a particle size D50 of 1 μm and aluminum dihydrogen phosphate are mixed, and then bentonite is added to obtain component A.

[0091] (2) The alumina material and sulfoaluminate cement are mixed and granulated to obtain a mixture; the mixture includes alumina with a particle size D50 of 3μm.

[0092] The mixture was added to anhydrous ethanol and mixed, and then a retarder was added to obtain component B.

[0093] This invention also provides a method for applying the above-mentioned inorganic two-component adhesive, wherein the inorganic two-component adhesive is applied to the encapsulation and fixation of iron-chromium-aluminum heating alloy wire (long-term operating temperature 850℃), and the application method includes the following steps:

[0094] (1) A mixing device is provided, the mixing device comprising a dual-chamber syringe and a type II mixing tube connected to the outlet of the dual-component syringe, the dual-chamber syringe comprising two independent injection syringes arranged side by side, denoted as syringe A and syringe B; the volume ratio of syringe A and syringe B is 4:1; the length of the mixing tube is 7cm.

[0095] (2) Component A and Component B are respectively introduced into the A and B cylinders of the dual-chamber syringe, and then pushed into the type II mixing tube for liquid-phase mixing to obtain the desired inorganic two-component binder; the viscosity of the inorganic two-component binder is 100,000-500,000 cps (for example, it can be 100,000 cps, 200,000 cps, 300,000 cps, 400,000 cps or 500,000 cps, etc.).

[0096] (3) The inorganic two-component binder is applied to the part of the iron-chromium-aluminum heating alloy wire that is in contact with the substrate, and then cured for 0.2-0.5h (e.g., 0.2h, 0.3h, 0.4h or 0.5h).

[0097] To verify the performance of the aforementioned inorganic two-component adhesive, its curing strength at 850℃ was tested. The specific method was as follows: after the prepared adhesive was bonded and cured using two high-temperature resistant stainless steel sheets, it was clamped in a high-temperature tensile testing machine, heated to 850℃, and held at that temperature for 10 minutes before a tensile test was conducted until fracture. The test results showed that the cured strength of the inorganic two-component adhesive at 850℃ was ≥40MPa. Furthermore, the deliquescence time was tested using boiling water, and the results showed that the deliquescence time was ≥48h, demonstrating the excellent deliquescence resistance of the inorganic two-component adhesive.

[0098] In another specific embodiment, the present invention provides an inorganic two-component adhesive comprising component A and component B.

[0099] Component A comprises the following components by weight:

[0100] 7.5-25 parts of alumina with a particle size D50 of 10 μm, 7.5-25 parts of alumina with a particle size D50 of 3 μm, 35-50 parts of sodium silicate solution (modulus 2-2.3, Baumé degree 40-50 Be), and 0.1-1 parts of sodium carboxymethyl cellulose aqueous solution (mass fraction 2%).

[0101] Component B comprises the following components by weight:

[0102] 7.5-25 parts of alumina with a particle size D50 of 10μm, 7.5-25 parts of alumina with a particle size D50 of 3μm, 15-20 parts of aluminum tripolyphosphate (AR), 2-5 parts of sodium fluorosilicate (AR), 35-40 parts of water, and 0.1-1 parts of anti-settling agent.

[0103] The present invention also provides a method for preparing the above-mentioned inorganic two-component binder, the preparation method comprising the following steps:

[0104] (1) The alumina material was granulated to obtain alumina with a particle size D50 of 10 μm and alumina with a particle size D50 of 3 μm.

[0105] Alumina with a particle size D50 of 10 μm, alumina with a particle size D50 of 3 μm and sodium silicate solution are mixed, and then sodium carboxymethyl cellulose aqueous solution is added to obtain component A.

[0106] (2) Alumina material, aluminum tripolyphosphate and sodium fluorosilicate are mixed and granulated to obtain a mixture; the mixture includes alumina with a particle size D50 of 10 μm and alumina with a particle size D50 of 3 μm.

[0107] The mixture is added to water and mixed, and then an anti-settling agent is added to obtain component B.

[0108] This invention also provides a method for applying the above-mentioned inorganic two-component binder, wherein the inorganic two-component binder is applied to the stainless steel joint sealing of the sealing furnace door of a boron-oxygen sintering furnace (long-term operating temperature 400℃), and the application method includes the following steps:

[0109] (1) A mixing device is provided, the mixing device comprising a dual-chamber syringe and a type II mixing tube connected to the outlet of the dual-component syringe, the dual-chamber syringe comprising two independent injection syringes arranged side by side, denoted as syringe A and syringe B; the volume ratio of syringe A and syringe B is 1:1; the length of the mixing tube is 5cm.

[0110] (2) Component A and Component B are respectively introduced into the A and B cylinders of the dual-chamber syringe, and then pushed into the type II mixing tube for liquid-phase mixing to obtain the desired inorganic two-component binder; the viscosity of the inorganic two-component binder is 200,000-500,000 cps (for example, it can be 200,000 cps, 300,000 cps, 400,000 cps or 500,000 cps, etc.).

[0111] (3) The inorganic two-component adhesive is used to bond the stainless steel gap of the sealed furnace door of the boron-oxygen sintering furnace and cure it for 2-5 minutes (e.g., 2 minutes, 3 minutes, 4 minutes or 5 minutes).

[0112] To verify the performance of the aforementioned inorganic two-component adhesive, its curing strength at 400℃ was tested. The specific method was as follows: after the prepared adhesive was bonded and cured using two stainless steel sheets, it was clamped in a high-temperature tensile testing machine, heated to 400℃, held for 10 minutes, and then subjected to a tensile test until fracture. The test results showed that the curing strength of the inorganic two-component adhesive at 400℃ was ≥30MPa. Furthermore, the deliquescence time was tested using boiling water, and the results showed that the deliquescence time was >48h, demonstrating the excellent deliquescence resistance of the inorganic two-component adhesive.

[0113] Example 1

[0114] This embodiment provides an inorganic two-component adhesive, which includes component A and component B.

[0115] Component A comprises the following components by weight:

[0116] 15 parts of alumina with a particle size D50 of 10 μm, 15 parts of alumina with a particle size D50 of 3 μm, 40 parts of sodium silicate solution (modulus 2.1, Baumé degree 45Be), and 1 part of silica (BET200).

[0117] Component B comprises the following components by weight:

[0118] 15 parts of alumina with a particle size D50 of 10 μm, 15 parts of alumina with a particle size D50 of 3 μm, 10 parts of sodium fluorosilicate (AR), 45 parts of anhydrous ethanol (mass fraction ≥99.5%), and 1 part of ethyl cellulose ethanol solution (mass fraction 2%).

[0119] The present invention also provides a method for preparing the above-mentioned inorganic two-component binder, the preparation method comprising the following steps:

[0120] (1) The alumina material was granulated to obtain alumina with a particle size D50 of 10 μm and alumina with a particle size D50 of 3 μm.

[0121] Alumina with a particle size D50 of 10 μm, alumina with a particle size D50 of 3 μm and sodium silicate solution are mixed, and then silica is added to obtain component A.

[0122] (2) The alumina material and sodium fluorosilicate are mixed and granulated to obtain a mixture; the mixture includes alumina with a particle size D50 of 10 μm and alumina with a particle size D50 of 3 μm.

[0123] The mixture was added to anhydrous ethanol and mixed, and then ethyl cellulose ethanol solution was added to obtain component B.

[0124] This invention also provides a method for applying the above-mentioned inorganic two-component adhesive, wherein the inorganic two-component adhesive is used for fixing and bonding galvanized screws to aluminum plates in an ALD furnace (long-term operating temperature 350℃), and the application method includes the following steps:

[0125] (1) A mixing device is provided, the mixing device comprising a dual-chamber syringe and a type I mixing tube connected to the outlet of the dual-component syringe, the dual-chamber syringe comprising two independent injection syringes arranged side by side, denoted as syringe A and syringe B; the volume ratio of syringe A and syringe B is 1:1; the length of the mixing tube is 10cm.

[0126] (2) Component A and Component B are respectively introduced into the A and B cylinders of the dual-cavity injector, and then pushed into the type I mixing tube for liquid phase mixing to obtain the desired inorganic two-component binder; the viscosity of the inorganic two-component binder is 30000cps.

[0127] (3) The inorganic two-component adhesive is used to bond the connection between the galvanized screw and the aluminum plate in the ALD furnace and then cured for 10 hours.

[0128] To verify the performance of the aforementioned inorganic two-component adhesive, its curing strength at 350℃ was tested. The specific method was as follows: after the prepared adhesive was bonded and cured using two stainless steel sheets, it was clamped in a high-temperature tensile testing machine, heated to 350℃, and held at that temperature for 10 minutes before a tensile test was conducted until fracture. The test results showed that the curing strength of the inorganic two-component adhesive at 350℃ was 40 MPa. Furthermore, the deliquescence time was tested using boiling water, and the results showed a deliquescence time of 30 hours, demonstrating the excellent deliquescence resistance of the inorganic two-component adhesive.

[0129] Example 2

[0130] This embodiment provides an inorganic two-component adhesive, which includes component A and component B.

[0131] Component A comprises the following components by weight:

[0132] 15 parts of silicon carbide with a particle size D50 of 5 μm, 15 parts of boron nitride with a particle size D50 of 1 μm, 3 parts of alumina with a particle size D50 of 1 μm, 45 parts of aluminum dihydrogen phosphate (modulus 2.2, Baume degree 45Be), and 1 part of bentonite (AR).

[0133] Component B comprises the following components by weight:

[0134] 8 parts of alumina with a particle size D50 of 3μm, 10 parts of sulfoaluminate cement (strength grade 625), 45 parts of anhydrous ethanol (mass fraction ≥99.5%), and 0.5 parts of retarder.

[0135] The present invention also provides a method for preparing the above-mentioned inorganic two-component binder, the preparation method comprising the following steps:

[0136] (1) Silicon carbide, boron nitride and aluminum oxide are mixed and then granulated to obtain silicon carbide with a particle size D50 of 5 μm, boron nitride with a particle size D50 of 1 μm and aluminum oxide with a particle size D50 of 1 μm, respectively.

[0137] The silicon carbide with a particle size D50 of 5 μm, boron nitride with a particle size D50 of 1 μm, alumina with a particle size D50 of 1 μm and aluminum dihydrogen phosphate are mixed, and then bentonite is added to obtain component A.

[0138] (2) The alumina material and sulfoaluminate cement are mixed and granulated to obtain a mixture; the mixture includes alumina with a particle size D50 of 3μm.

[0139] The mixture was added to anhydrous ethanol and mixed, and then a retarder was added to obtain component B.

[0140] This invention also provides a method for applying the above-mentioned inorganic two-component adhesive, wherein the inorganic two-component adhesive is applied to the encapsulation and fixation of iron-chromium-aluminum heating alloy wire (long-term operating temperature 850℃), and the application method includes the following steps:

[0141] (1) A mixing device is provided, the mixing device comprising a dual-chamber syringe and a type II mixing tube connected to the outlet of the dual-component syringe, the dual-chamber syringe comprising two independent injection syringes arranged side by side, denoted as syringe A and syringe B; the volume ratio of syringe A and syringe B is 4:1; the length of the mixing tube is 7cm.

[0142] (2) Component A and Component B are respectively introduced into the A and B cylinders of the dual-cavity injector, and then pushed into the type II mixing tube for liquid phase mixing to obtain the desired inorganic two-component binder; the viscosity of the inorganic two-component binder is 200,000 cps.

[0143] (3) The inorganic two-component binder is applied to the part of the iron-chromium-aluminum electric heating alloy wire that is in contact with the substrate, and then cured for 0.3 hours.

[0144] To verify the performance of the aforementioned inorganic two-component adhesive, its curing strength at 850℃ was tested. The specific method was as follows: after the prepared adhesive was bonded and cured using two stainless steel sheets, it was clamped in a high-temperature tensile testing machine, heated to 850℃, and held at that temperature for 10 minutes before a tensile test was conducted until fracture. The test results showed that the curing strength of the inorganic two-component adhesive at 850℃ was 45 MPa. Furthermore, the deliquescence time was tested using boiling water, and the results showed a deliquescence time of 48 hours, demonstrating the excellent deliquescence resistance of the inorganic two-component adhesive.

[0145] Example 3

[0146] This embodiment provides an inorganic two-component adhesive, which includes component A and component B.

[0147] Component A comprises the following components by weight:

[0148] 15 parts of alumina with a particle size D50 of 10 μm, 15 parts of alumina with a particle size D50 of 3 μm, 40 parts of sodium silicate solution (modulus .1, Baume degree 45Be), and 0.5 parts of sodium carboxymethyl cellulose aqueous solution (mass fraction of 2%).

[0149] Component B comprises the following components by weight:

[0150] 15 parts of alumina with a particle size D50 of 10 μm, 15 parts of alumina with a particle size D50 of 3 μm, 17 parts of aluminum tripolyphosphate (AR), 3 parts of sodium fluorosilicate (AR), 37 parts of water, and 0.5 parts of anti-settling agent.

[0151] The present invention also provides a method for preparing the above-mentioned inorganic two-component binder, the preparation method comprising the following steps:

[0152] (1) The alumina material was granulated to obtain alumina with a particle size D50 of 10 μm and alumina with a particle size D50 of 3 μm.

[0153] Alumina with a particle size D50 of 10 μm, alumina with a particle size D50 of 3 μm and sodium silicate solution are mixed, and then sodium carboxymethyl cellulose aqueous solution is added to obtain component A.

[0154] (2) Alumina material, aluminum tripolyphosphate and sodium fluorosilicate are mixed and granulated to obtain a mixture; the mixture includes alumina with a particle size D50 of 10 μm and alumina with a particle size D50 of 3 μm.

[0155] The mixture is added to water and mixed, and then an anti-settling agent is added to obtain component B.

[0156] This invention also provides a method for applying the above-mentioned inorganic two-component binder, wherein the inorganic two-component binder is applied to the stainless steel joint sealing of the sealing furnace door of a boron-oxygen sintering furnace (long-term operating temperature 400℃), and the application method includes the following steps:

[0157] (1) A mixing device is provided, the mixing device comprising a dual-chamber syringe and a type II mixing tube connected to the outlet of the dual-component syringe, the dual-chamber syringe comprising two independent injection syringes arranged side by side, denoted as syringe A and syringe B; the volume ratio of syringe A and syringe B is 1:1; the length of the mixing tube is 5cm.

[0158] (2) Component A and Component B are respectively introduced into the A and B cylinders of the dual-cavity injector, and then pushed into the type II mixing tube for liquid phase mixing to obtain the desired inorganic two-component binder; the viscosity of the inorganic two-component binder is 300,000 cps.

[0159] (3) The inorganic two-component adhesive was used to bond the stainless steel gap of the sealed furnace door of the boron-oxygen sintering furnace and cured for 3 minutes.

[0160] To verify the performance of the aforementioned inorganic two-component adhesive, its curing strength at 400℃ was tested. The specific method was as follows: after the prepared adhesive was bonded and cured using two stainless steel sheets, it was clamped in a high-temperature tensile testing machine, heated to 400℃, held for 10 minutes, and then subjected to a tensile test until fracture. The test results showed that the curing strength of the inorganic two-component adhesive at 400℃ was 40 MPa. Furthermore, the deliquescence time was tested using boiling water, and the results showed a deliquescence time of 50 hours, demonstrating the excellent deliquescence resistance of the inorganic two-component adhesive.

[0161] Example 4

[0162] The difference between this embodiment and Embodiment 1 is that the sodium silicate solution in component A is 5 parts.

[0163] The remaining parameters and methods are consistent with those in Example 1.

[0164] Using the curing strength test method and boiling water test method shown in Example 1, it can be seen that the inorganic two-component adhesive provided in this example has a curing strength of 5 MPa at 350°C and a deliquescence time of 8 h.

[0165] Example 5

[0166] The difference between this embodiment and Embodiment 1 is that the sodium silicate solution in component A is 95 parts.

[0167] The remaining parameters and methods are consistent with those in Example 1.

[0168] Using the curing strength test method and boiling water test method shown in Example 1, it can be seen that the inorganic two-component adhesive provided in this example has a curing strength of 10 MPa at 350°C and a deliquescence time of 10 h.

[0169] Comparative Example 1

[0170] The difference between this comparative example and Example 1 is that sodium silicate solution is not added to component A, making component A a solid phase; the application method is replaced by the following steps: pre-mixing separately packaged components A and B at a 1:1 mass ratio, then bonding the joint between the galvanized screws and the aluminum plate in the ALD furnace, and curing for 10 hours.

[0171] The remaining parameters and methods are consistent with those in Example 1.

[0172] Using the curing strength test method and boiling water test method shown in Example 1, it can be seen that the inorganic two-component adhesive provided in this comparative example has a curing strength of 0 MPa at 350°C and a deliquescence time of 0.5 h.

[0173] It should be noted that the technical solution of the present invention is illustrated through the above embodiments, but the present invention is not limited to the above embodiments, that is, it does not mean that the present invention must rely on the above embodiments to be implemented. Those skilled in the art should understand that any improvements to the present invention, equivalent substitutions of the raw materials of the product of the present invention, addition of auxiliary components, selection of specific methods, etc., all fall within the protection scope and disclosure scope of the present invention.

Claims

1. An inorganic two-component adhesive, characterized in that, The inorganic two-component binder includes component A and component B; Component A includes a first inorganic filler, a liquid inorganic binder, and a first additive; Component B includes a second inorganic filler, a curing agent, a solvent, and a second additive. The first additive and the second additive each independently include a thickener and / or a dispersant.

2. The inorganic two-component binder according to claim 1, characterized in that, Component A comprises the following components by weight: 10-90 parts of first inorganic filler, 10-90 parts of liquid inorganic binder, and 0.1-5 parts of first additive; Preferably, component B comprises the following components by weight: The second inorganic filler consists of 7.5-50 parts, the curing agent consists of 5-35 parts, the solvent consists of 25-50 parts, and the second additive consists of 0.1-5 parts.

3. The inorganic two-component binder according to claim 1 or 2, characterized in that, The first inorganic filler and the second inorganic filler each independently comprise inorganic non-metallic materials and / or metallic materials; Preferably, the inorganic non-metallic material includes any one or a combination of at least two of oxides, carbides, or nitrides; Preferably, the metallic material includes any one or at least a combination of two of copper powder, iron powder, or nickel powder; Preferably, the particle size D50 of the oxide is 1-10 μm; Preferably, the particle size D50 of the carbide is 3-7 μm; Preferably, the particle size D50 of the nitride is 0.5-1.5 μm.

4. The inorganic two-component binder according to any one of claims 1-3, characterized in that, The curing agent includes any one or a combination of at least two of metal oxides, inorganic acid salts, or cement; Preferably, the metal oxide comprises any one or a combination of at least two of magnesium oxide, calcium oxide, or zinc oxide; Preferably, the inorganic acid salt includes any one or a combination of at least two of magnesium chloride, magnesium sulfate, sodium fluorosilicate, aluminum tripolyphosphate, polyaluminum phosphate, or silicon phosphate; Preferably, the cement includes any one or a combination of at least two of silicate cement, aluminate cement, or sulfoaluminate cement.

5. The inorganic two-component binder according to any one of claims 1-4, characterized in that, The thickener includes any one or a combination of at least two of sodium carboxymethyl cellulose, bentonite, silica, or ethyl cellulose. Preferably, the dispersant includes any one or a combination of at least two of the following: defoamer, coagulant, retarder, or antisettling agent.

6. The inorganic two-component binder according to any one of claims 1-5, characterized in that, The liquid inorganic binder includes any one or a combination of at least two of the following: sodium silicate solution, potassium silicate solution, lithium silicate, aluminum dihydrogen phosphate, silica sol, or aluminum sol. Preferably, the solvent includes an aqueous solvent and / or an organic solvent; Preferably, the organic solvent includes any one or a combination of at least two of anhydrous ethanol, methanol, ethylene glycol, toluene, or xylene; Preferably, the inorganic two-component adhesive is used at a temperature of 300-1000℃.

7. A method for preparing an inorganic two-component binder as described in any one of claims 1-6, characterized in that, The preparation method includes the following steps: The first inorganic filler, liquid inorganic binder, and first additive are mixed to obtain component A. The second inorganic filler, curing agent, solvent, and second additive are mixed in a second process to obtain component B.

8. The preparation method according to claim 7, characterized in that, The first mixing step includes: The first inorganic filler after granulation and the liquid inorganic binder are mixed to obtain a mixed slurry; The mixed slurry is mixed with the first additive; Preferably, the second mixing step includes: The second inorganic filler and curing agent are mixed and granulated, then added to a solvent and mixed to obtain a mixed slurry; The mixed slurry and the second additive are mixed.

9. A method for applying the inorganic two-component adhesive as described in any one of claims 1-5, characterized in that, The application method includes the following steps: Components A and B are mixed in the liquid phase, then bonded to the target material and cured.

10. The application method according to claim 9, characterized in that, The liquid phase mixing step includes: A mixing device is provided, the mixing device including a dual-chamber syringe and a mixing tube communicating with the outlet of the dual-component syringe, the dual-chamber syringe including two independent injection syringes arranged side by side, denoted as syringe A and syringe B; Component A and Component B are respectively introduced into the A and B chambers of the dual-chamber syringe, and then pushed into the mixing tube for liquid-phase mixing to obtain the inorganic two-component binder required for the target material. Preferably, the volume ratio of cylinder A to cylinder B is (1-10):1; Preferably, the length of the mixing tube is 5-20 cm.