Method for installing and leveling precision equipment

By coarsely grinding the ground and using a combination of leveling bolts and epoxy resin curing blocks, the problem of fine grinding of the ground during the installation of precision equipment was solved, achieving efficient and stable equipment installation.

CN120867496BActive Publication Date: 2026-06-23DUNSHI MAGNETIC ENERGY TECH

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
DUNSHI MAGNETIC ENERGY TECH
Filing Date
2025-07-17
Publication Date
2026-06-23

AI Technical Summary

Technical Problem

In existing technologies, the installation of precision equipment requires fine grinding of the ground, which results in high labor and material costs, long construction periods, difficulty in guaranteeing installation accuracy, and poor vibration reduction effect.

Method used

The ground is coarsely ground, the leveling bolts are used to adjust the level of the substrate and leave a gap, and epoxy resin curing blocks are poured to achieve a tight fit between the substrate and the ground, avoiding direct hard contact.

Benefits of technology

It saves on the labor and material costs of fine floor grinding, shortens the construction cycle, improves the stability and service life of the equipment, and ensures installation accuracy and shock absorption effect.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

The application provides a precision equipment installation leveling method, and belongs to the technical field of equipment installation, and comprises the following steps: S100, rough grinding is performed on the ground to preliminarily level the ground; S200, a base plate is placed at a specified position of the ground, leveling bolts are inserted into the base plate, the base plate is adjusted by using the leveling bolts, the base plate is parallel to a horizontal plane, a reserved gap is formed between the base plate and the ground, and the base plate is removed after leveling is completed; S300, a curing agent and an epoxy resin are mixed and uniformly stirred to obtain pouring liquid; S400, a pouring mold is constructed on the ground, and the pouring liquid is injected into the pouring mold; S500, the base plate is moved above the mold and slowly lowered down, and the pouring liquid fills the reserved gap between the base plate and the ground; S600, the pouring liquid is left to stand until the pouring liquid is completely cured to form a cured block, the mold is removed, and the cured block is shaped to make the outer surface of the cured block flat; and S700, the base plate and the cured block are fixed to the ground. The ground is not finely ground, construction time is saved, and construction difficulty is reduced.
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Description

Technical Field

[0001] This invention belongs to the technical field of equipment installation, and more specifically, relates to a method for leveling and installing precision equipment. Background Technology

[0002] The stable operation of precision equipment is highly dependent on its precise installation level. If precision equipment is not installed level, significant deviations will occur during operation, affecting not only equipment performance but also potentially causing production accidents or personal injury. Therefore, leveling is an indispensable and extremely critical step in the installation of precision equipment. In existing precision equipment installation methods, achieving precise leveling typically requires fine grinding of the installation surface.

[0003] Existing construction methods have the following drawbacks: Firstly, the fine grinding process requires a significant investment of manpower. Workers must perform this meticulous grinding operation for extended periods, resulting in high labor intensity and time consumption. Secondly, the grinding process consumes a large amount of grinding materials, such as sandpaper and grinding wheels, leading to a substantial increase in installation costs. This dual investment of manpower and materials directly results in a significant increase in installation costs. Summary of the Invention

[0004] The purpose of this invention is to provide a method for leveling and installing precision equipment, which aims to solve the defect in the prior art that requires fine grinding of the ground during construction.

[0005] To achieve the above objectives, the technical solution adopted by the present invention is: to provide a method for installing and leveling precision equipment, comprising the following steps:

[0006] S100. Roughly grind the ground to initially level it;

[0007] S200. Place the substrate at the designated position on the ground, insert the leveling bolt into the substrate, adjust the substrate using the leveling bolt so that the substrate is parallel to the horizontal plane and a reserved gap is formed between the substrate and the ground, and remove the substrate after leveling is completed.

[0008] S300. Mix the curing agent and epoxy resin and stir evenly to obtain the casting liquid;

[0009] S400. Construct a casting mold on the ground and inject the casting liquid into the casting mold;

[0010] S500. Move the substrate above the mold and slowly lower it so that the casting liquid fills the reserved gap between the substrate and the ground;

[0011] S600. Allow the casting liquid to stand until it completely solidifies and forms a solidified block. Remove the mold and reshape the solidified block to make its outer surface smooth.

[0012] S700. Fix the substrate and the curing block to the ground.

[0013] In one possible implementation, S100 includes:

[0014] The protrusions on the ground are ground down to prevent the height of the protrusions from being greater than the gap between the substrate and the ground.

[0015] In one possible implementation, the levelness of the substrate is not less than 1:500.

[0016] In one possible implementation, the distance between the substrate and the ground is 3-5 mm.

[0017] In one possible implementation, S200 includes:

[0018] S21a. Drill multiple mounting holes in the ground and drill positioning holes corresponding to the mounting holes in the substrate;

[0019] S22a. Insert positioning pins into at least two of the mounting holes;

[0020] S23a. The substrate is positioned using the positioning pins so that the positioning holes on the substrate correspond one-to-one with the mounting holes, and leveled using the leveling bolts.

[0021] In one possible implementation, a wrapping cloth is fixedly connected to the mold, and S500 includes:

[0022] S520. Move the substrate to directly above the mold so that the positioning holes correspond one-to-one with the mounting holes;

[0023] S530. Slowly lower the substrate to its lowest height;

[0024] S540. Wrap the mold and the substrate with the wrapping cloth to prevent the casting liquid from leaking.

[0025] In one possible implementation, the process before S520 includes:

[0026] S510. Use tape to seal the bottom of the positioning hole, the tape being able to break under pressure so that the positioning pin breaks the tape and passes through the positioning hole.

[0027] In one possible implementation, S700 includes:

[0028] S71a. Pull out the positioning pin and clean the solidified casting liquid from the positioning hole;

[0029] S72a. Expansion bolts are provided in the positioning hole and the mounting hole.

[0030] In one possible implementation, S200 includes:

[0031] S21b. Two mounting holes are made on the ground and two positioning holes are made on the substrate, with the two mounting holes and the two positioning holes corresponding one-to-one.

[0032] S22b. Insert a positioning pin into the mounting hole;

[0033] S23b. Position the substrate using the positioning pin and level it using the leveling bolt.

[0034] In one possible implementation, S700 includes:

[0035] S71b. Pull out the positioning pin and clean the solidified casting liquid from the positioning hole;

[0036] S72b. Open the remaining positioning holes and mounting holes;

[0037] S73b. Expansion bolts are provided in the positioning hole and the mounting hole.

[0038] The beneficial effects of the precision equipment installation and leveling method provided by this invention are as follows: Compared with the prior art, this invention's method only requires rough grinding of the ground when installing precision equipment, eliminating the need for fine grinding. Leveling bolts are used to level the substrate. After leveling, epoxy resin is poured between the substrate and the ground to form a curing block. This curing block ensures a tight fit between the substrate and the ground, achieving this tight fit even without fine grinding. Eliminating the need for fine grinding saves construction time and reduces construction difficulty. Furthermore, the epoxy resin curing block prevents direct hard contact between the substrate and the ground, buffering equipment vibration and improving the stability and lifespan of the precision equipment. Attached Figure Description

[0039] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0040] Figure 1 A schematic diagram illustrating the main steps of the precision equipment installation and leveling method provided in this embodiment of the invention;

[0041] Figure 2 This is a schematic diagram of one main step of S200 provided in an embodiment of the present invention;

[0042] Figure 3 A schematic diagram of another main step of S200 provided in an embodiment of the present invention;

[0043] Figure 4 This is a schematic diagram of the main steps of S500 provided in an embodiment of the present invention;

[0044] Figure 5 This is a schematic diagram of one main step of S700 provided in an embodiment of the present invention;

[0045] Figure 6 This is a schematic diagram of another main step of S700 provided in an embodiment of the present invention. Detailed Implementation

[0046] To make the technical problems to be solved, the technical solutions, and the beneficial effects of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and are not intended to limit the present invention.

[0047] In the field of equipment base plate installation, existing technologies mainly rely on grinding the cement floor to an extremely high degree of flatness to achieve base plate leveling. This traditional process has revealed many unsolvable problems in long-term application. High construction costs are its primary pain point. To achieve high-precision grinding standards, a large number of professional technicians are required to use equipment such as laser leveling instruments to perform multiple grinding passes. The floor grinding process for just 100㎡ base plate installation requires 4-6 workers to work continuously for 3-5 days, with labor costs accounting for 30%-40% of the total cost. At the same time, the consumption of consumables such as diamond grinding discs and sandpaper is large, and the depreciation cost of high-precision grinding machines is also quite significant. Multiple factors lead to a substantial increase in installation costs.

[0048] The long construction cycle is also a prominent issue in existing construction methods. The ground grinding process often accounts for 40%-50% of the overall installation time. Taking flywheel installation as an example, the traditional process takes approximately 15-20 days in total, with the grinding stage alone requiring 6-8 days. Furthermore, grinding must be performed under specific conditions, often forcing delays in water and electricity installation, pipeline installation, and other processes. This not only lengthens the construction cycle but may also lead to additional costs such as equipment downtime losses or contract penalties due to project delays, thus negatively impacting both project progress and economic benefits.

[0049] The lack of vibration damping is another major drawback of existing technology. With a rigid contact between the substrate and the ground, vibrations during equipment operation are directly transmitted to the substrate, easily leading to loosening of ground screws and substrate deformation. Statistics show that equipment installed using traditional methods requires substrate releveling 2-3 times per year, with each maintenance costing approximately 15%-20% of the initial installation cost. Simultaneously, the ground is prone to cracking due to long-term vibration, requiring regular repairs. Cumulative maintenance costs over the equipment's lifespan can reach more than 50% of the initial installation cost, severely impacting the equipment's stability and service life.

[0050] The difficulty in guaranteeing installation accuracy is also a shortcoming of existing technologies. Although high-precision grinding requires a surface flatness error of ≤0.5mm / m... 2 However, in practice, environmental factors such as the moisture content and temperature changes of the cement floor can affect the grinding accuracy, and the rework rate can be as high as 10%-15% during the rainy season or in humid environments. Moreover, the actual required levelness in some scenarios does not match the standards of traditional processes. For example, ordinary industrial flywheels only require a levelness of 1:500, but traditional processes grind them according to a standard of 1:1000. This not only causes "over-construction" but also makes it difficult to ensure the levelness and adhesion of the substrate due to insufficient flatness of the ground, making it difficult to meet the installation accuracy requirements of modern equipment.

[0051] Reference Figures 1 to 6 The precision equipment installation and leveling method provided by the present invention will now be described. The precision equipment installation and leveling method includes the following steps:

[0052] S100. Roughly grind the ground to initially level it;

[0053] S200. Place the substrate at the designated position on the ground, insert the leveling bolts into the substrate, adjust the substrate using the leveling bolts to make the substrate parallel to the horizontal plane, and make a reserved gap between the substrate and the ground. After leveling, remove the substrate.

[0054] S300. Mix the curing agent and epoxy resin and stir evenly to obtain the casting liquid;

[0055] S400. Construct a casting mold on the ground and inject the casting liquid into the casting mold;

[0056] S500. Move the substrate above the mold and slowly lower it so that the casting liquid fills the reserved gap between the substrate and the ground;

[0057] S600. Let it stand until the casting liquid is completely solidified to form a solidified block. Remove the mold and reshape the solidified block to make the outer surface of the solidified block flat.

[0058] S700. Fix the substrate and the curing block to the ground.

[0059] Compared with existing technologies, the precision equipment installation and leveling method provided by this invention only requires rough grinding of the ground, eliminating the need for fine grinding. By leveling the substrate with leveling bolts and leaving a gap, and then pouring in epoxy resin curing blocks, a tight fit between the substrate and the ground is achieved. This not only saves labor and material costs associated with fine grinding and shortens the construction cycle, but also provides shock absorption and cushioning by avoiding hard contact between the substrate and the ground, thus improving the stability and lifespan of the equipment. The rough grinding relaxes the ground preparation requirements, reducing construction difficulty, and the combination of leveling bolts and curing blocks ensures that the substrate's levelness is not less than 1:500, guaranteeing installation accuracy.

[0060] Between the casting and curing blocks, the substrate is positioned and leveled using leveling bolts. After leveling, the substrate is removed, and casting begins. Since the leveling bolts are mounted on the substrate, they are removed along with the substrate. After casting, the substrate is moved back to its original position. Because the leveling bolts have been properly adjusted, the substrate's levelness changes minimally after being moved back to its designated position, remaining within acceptable error limits.

[0061] The precision equipment mentioned in the embodiments of the present invention may be a flywheel device, a precision machine tool, or a generator set.

[0062] In flywheel installation, the ground is first roughly sanded to remove any obvious protrusions. Mounting holes are then drilled in the ground, and positioning pins are inserted. The substrate is placed on the ground, and its levelness is adjusted to no less than 1:500 using leveling bolts, leaving a 3-5mm gap between the substrate and the ground. After leveling, the substrate is removed. Next, a casting liquid is prepared by mixing the curing agent and epoxy resin. A casting mold is constructed on the ground, and the liquid is poured. The substrate is then moved above the mold according to its positioning and slowly lowered, allowing the casting liquid to fill the gap. After curing, the mold is removed, and the cured block is trimmed. Finally, expansion bolts are used to fix the substrate and cured block to the ground, achieving precise leveling for flywheel installation.

[0063] During the installation of the precision machine tool, the raised areas on the ground are roughly ground down to ensure their height does not exceed the gap between the base plate and the ground. Corresponding mounting holes and positioning holes are drilled in the ground and on the base plate. Positioning pins are inserted to position the base plate. The base plate is leveled using leveling bolts until the horizontality meets the requirement of not less than 1:500. After leaving a 3-5mm gap, the base plate is removed. A casting liquid is prepared by mixing the curing agent and epoxy resin. A mold is constructed and the casting liquid is poured. The base plate is moved above the mold and slowly lowered so that the positioning pin passes through the positioning hole. The mold and base plate are wrapped with a cloth to prevent leakage of the casting liquid. After the casting liquid has cured, the mold is removed, the positioning holes are cleaned, and expansion bolts are installed for fixation to ensure the stability of the precision machine tool installation.

[0064] During generator set installation, after rough grinding of the ground, two mounting holes are drilled in the ground, and corresponding positioning holes are drilled in the base plate. Positioning pins are inserted to position the base plate, and leveling bolts are used to level the base plate to a horizontal degree of not less than 1:500, maintaining a distance of 3-5mm between the base plate and the ground. After leveling, the base plate is removed. A casting liquid is prepared by mixing the curing agent and epoxy resin, a mold is constructed, and the casting liquid is poured. The base plate is moved above the mold and slowly lowered to fit the mold, allowing the casting liquid to fill the gaps. After settling and curing, the mold is removed, the positioning pins are pulled out, the positioning holes are cleaned, and the remaining mounting holes are drilled. Finally, expansion bolts are installed in the positioning holes and mounting holes to complete the leveling and installation of the generator set base plate, ensuring stable operation of the unit.

[0065] In one possible implementation, S100 includes:

[0066] Grind down any protrusions on the ground to prevent the protrusions from being higher than the gap between the substrate and the ground.

[0067] Specifically, during the rough grinding of the ground, special attention should be paid to the raised areas. These raised areas should be ground down to a certain height using grinding tools, ensuring that their height does not exceed the pre-existing gap between the substrate and the ground, such as 3-5mm. Dimples and smaller protrusions on the ground are left untreated. This ensures that the raised areas on the ground will not obstruct the placement and leveling of the substrate, guaranteeing that the substrate can be placed smoothly on the ground and that a suitable gap is formed between it and the ground. This lays the foundation for subsequent leveling and pouring of the casting grout.

[0068] By targeting and grinding ground protrusions, the entire surface can be ground without the need for extensive grinding, significantly reducing workload and time, and lowering labor and material consumption. Simultaneously, ensuring that the height of any protrusion does not exceed the gap between the substrate and the ground prevents it from affecting the substrate's leveling accuracy. This guarantees that the pre-reserved gap between the substrate and the ground meets requirements, allowing the subsequent pouring grout to fully fill the gap, achieving a tight fit between the substrate and the ground. This ensures the substrate's levelness is no less than 1:500, improving installation accuracy. Furthermore, it avoids hard contact between the substrate and the ground, enhancing shock absorption and cushioning, and improving the stability and lifespan of the equipment.

[0069] In one possible implementation, the levelness of the substrate is not less than 1:500.

[0070] In a preferred embodiment, in a precision machine tool installation scenario, the ground is first roughly ground to remove obvious protrusions. Then, mounting holes are drilled in the ground and positioning pins are inserted. The substrate is placed on the ground, and the leveling bolts are used to adjust the substrate's levelness. A level instrument is used for real-time monitoring to ensure the substrate's levelness reaches 1:600. In this embodiment, the fine adjustment of the leveling bolts and the real-time monitoring of the level instrument ensure a high degree of levelness for the substrate. This allows the precision machine tool to remain stable during operation, reducing processing errors caused by uneven substrate levelness, improving processing accuracy and product quality. Simultaneously, it also reduces machine tool vibration during operation and extends the machine tool's service life.

[0071] In a preferred embodiment, during generator set installation, after rough grinding of the ground, a casting mold is constructed on the ground. A casting liquid is obtained by mixing a curing agent and epoxy resin and poured into the mold. The substrate is moved above the mold and slowly lowered to allow the casting liquid to fill the gap between the substrate and the ground. After standing and curing, the mold is removed. At this point, the substrate's levelness is 1:550. In this embodiment, the casting liquid fills the gap and cures, forming a tight bond with the leveled substrate, further ensuring the substrate's levelness. This makes the generator set run more smoothly, reduces abnormal vibrations and noise caused by insufficient substrate levelness, improves the generator set's operational stability and reliability, and lowers the probability of failure.

[0072] In a preferred embodiment, during flywheel installation, after the ground is roughly ground, the substrate level is first adjusted to 1:520 using leveling bolts before subsequent operations such as pouring the curing block are performed, ultimately maintaining the substrate level at 1:520. In this embodiment, the initial leveling by the leveling bolts combined with the supporting effect of the cured curing liquid ensures that the substrate level meets the requirements, allowing the flywheel to maintain balance during high-speed rotation. This prevents flywheel instability due to insufficient substrate level, improves the flywheel's operational safety and efficiency, and reduces energy loss.

[0073] In one possible implementation, the distance between the substrate and the ground plane is 3-5 mm.

[0074] During flywheel installation, the ground is first roughly ground to remove obvious protrusions. Installation holes are then drilled in the ground, and positioning pins are inserted. After placing the substrate, it is leveled using leveling bolts, maintaining a 3mm gap between the substrate and the ground. After leveling, the substrate is removed. A curing agent and epoxy resin are mixed to obtain a casting liquid. A mold is constructed and poured. The substrate is moved above the mold according to its positioning and slowly lowered, allowing the casting liquid to fill the 3mm gap. After settling and curing, the mold is removed, and the substrate is fixed in place. In this embodiment, the 3mm gap ensures that the casting liquid fully fills the gap between the substrate and the ground, achieving a tight fit. It also avoids insufficient filling due to a too-small gap or instability due to a too-large gap, ensuring smooth operation of the flywheel after installation and reducing vibration.

[0075] During the installation of the precision machine tool, the raised areas on the ground are roughly ground down to ensure their height does not exceed the gap between the substrate and the ground. Corresponding mounting holes and positioning holes are made on both the ground and the substrate. Positioning pins are inserted to position the substrate, and leveling bolts are used to maintain a 4mm gap between the substrate and the ground. After removing the substrate, a casting liquid is prepared and a mold is constructed for casting. The substrate is moved above the mold and slowly lowered to fill the 4mm gap with the casting liquid. After curing, the substrate is fixed in place. In this embodiment, the 4mm gap provides suitable space for the filling of the casting liquid, ensuring a tight bond between the cured block and the substrate and the ground. This results in good levelness and stability of the precision machine tool after installation, guaranteeing the machining accuracy of the machine tool and reducing machining errors caused by substrate installation problems.

[0076] During generator set installation, after rough grinding of the ground, two mounting holes are drilled in the ground, and corresponding positioning holes are drilled in the base plate. Positioning pins are inserted to position the base plate, and leveling bolts are used to level it, maintaining a 5mm gap between the base plate and the ground. After leveling, the base plate is removed, and a curing agent and epoxy resin are mixed to obtain a casting liquid. A mold is constructed and poured, and the base plate is moved above the mold and slowly lowered to fill the 5mm gap with the casting liquid. After curing, the mold is removed and the base plate is fixed. In this embodiment, the 5mm gap ensures that the casting liquid can be fully filled, forming a sufficiently thick cured block, enhancing the stability of the connection between the base plate and the ground. It also provides good shock absorption and buffer space, effectively buffering vibrations during generator set operation, improving the stability and reliability of generator set operation, and reducing the occurrence of malfunctions.

[0077] In one possible implementation, S200 includes:

[0078] S21a. Drill multiple mounting holes in the ground and drill positioning holes corresponding to the mounting holes in the substrate;

[0079] S22a. Insert positioning pins into at least two mounting holes;

[0080] S23a. Position the substrate using locating pins so that the locating holes on the substrate correspond one-to-one with the mounting holes, and level it using leveling bolts.

[0081] By matching the mounting holes and positioning holes and using the positioning pins, the position of the substrate on the ground can be accurately determined, ensuring the accuracy of substrate installation. This provides a precise reference for substrate leveling, allowing the leveling bolts to accurately adjust the substrate's levelness, ensuring that the substrate's levelness meets the requirement of not less than 1:500. At the same time, this positioning method can reduce deviations during the leveling process, improve leveling efficiency and accuracy, lay a good foundation for subsequent operations such as pouring and curing blocks, ensure the stability and reliability of the entire installation process, and make the connection between the substrate and the ground more precise and firm, thereby ensuring the operational effect of precision equipment after installation.

[0082] By pre-drilling all the mounting holes and positioning holes, workers can skip the step of drilling the mounting holes and positioning holes after the curing block has fully cured, and can proceed directly to the subsequent steps, thus improving the smoothness of construction.

[0083] In one possible implementation, a wrapping cloth is fixedly connected to the mold, and S500 includes:

[0084] S520. Move the substrate directly above the mold so that the positioning holes correspond one-to-one with the mounting holes;

[0085] S530. Slowly lower the substrate to its lowest height;

[0086] S540. Wrap the mold and substrate with a wrapping cloth to prevent the casting liquid from leaking.

[0087] The mold specifically comprises four templates arranged along the four sides of a rectangle, forming a rectangular space in the center for pouring the casting liquid. The templates are 1 cm thick and can be made of wood, sponge board, or foam board. The wrapping cloth can be made of plastic or cotton cloth, with a rectangular opening in the center equal to the size of the mold. The wrapping cloth is directly adhered to the outer surface of the mold. A cover plate is located at the edge of the base plate, with a width equal to the thickness of the template. When the base plate is lowered to its lowest position, the cover plate covers the mold, and the wrapping cloth completely encloses the mold and base plate, preventing the casting liquid from leaking through the gap between the mold and the cover plate.

[0088] The wrapping cloth effectively prevents the pouring liquid from overflowing from the gap between the mold and the substrate during the pouring and substrate descent process, avoiding material waste and construction environment pollution, ensuring that the pouring liquid fully fills the gap between the substrate and the ground, ensuring that the solidified block is completely formed, thereby ensuring the tightness and stability of the connection between the substrate and the ground.

[0089] In one possible implementation, the following is included before S520:

[0090] S510. Use tape to seal the bottom of the positioning hole. The tape can be broken under pressure so that the positioning pin breaks the tape and passes through the positioning hole.

[0091] As the substrate moves above the mold and descends, it effectively prevents the casting liquid from leaking from the positioning holes, ensuring that the gap between the substrate and the ground is fully filled to guarantee the quality of the cured block molding and a tight fit. Simultaneously, the positioning pins allow the adhesive tape to easily pass through the positioning holes, ensuring the substrate is accurately placed according to the preset position, aligning the positioning holes with the mounting holes one-to-one, laying the foundation for subsequent leveling and casting. Furthermore, the adhesive tape is convenient to use, requiring no additional removal and not affecting the positioning pin passage process, thus improving construction convenience and efficiency.

[0092] In one possible implementation, S700 includes:

[0093] S71a. Pull out the locating pin and clean the solidified casting liquid from the locating hole;

[0094] S72a. Expansion bolts are installed in the positioning holes and mounting holes.

[0095] Removing the locating pin first prevents it from interfering with subsequent fixing. Cleaning the solidified casting liquid from the locating hole ensures cleanliness inside the hole, providing suitable space for the expansion bolt installation. Installing the expansion bolts firmly fixes the base plate and the solidified block to the ground, enhancing the stability and reliability of the overall connection, ensuring that the precision equipment is not easily loosened after installation, and guaranteeing stable operation of the equipment.

[0096] In one possible implementation, S200 includes:

[0097] S21b. Two mounting holes are made on the ground and two positioning holes are made on the substrate, with the two mounting holes and the two positioning holes corresponding one-to-one.

[0098] S22b. Insert the positioning pin into the mounting hole;

[0099] S23b. Position the substrate using locating pins and level it using leveling bolts.

[0100] By using only two mounting holes and positioning holes for leveling, the amount of initial drilling work is reduced, construction complexity is lowered, and time and labor costs are saved. The two positioning points can essentially determine the position and level of the substrate, ensuring basic accuracy in leveling and laying the foundation for subsequent operations. This simplified leveling method improves construction efficiency while maintaining a certain level of precision, making the installation process more convenient and efficient.

[0101] In one possible implementation, S700 includes:

[0102] S71b. Pull out the locating pin and clean the solidified casting liquid from the locating hole;

[0103] S72b. Drill the remaining positioning holes and mounting holes;

[0104] S73b. Expansion bolts are installed in the positioning holes and mounting holes.

[0105] First, remove the locating pin and clean the solidified material inside the hole. This provides a clean space for subsequent drilling and installation of expansion bolts, preventing the solidified material from affecting the operation. Drilling the remaining holes in stages allows for flexible arrangement of the drilling process while ensuring the accuracy of the initial positioning and leveling, reducing the number of holes drilled initially and lowering the complexity of construction. Using expansion bolts to firmly connect the base plate, solidified block, and ground enhances the overall structural stability, ensuring that the precision equipment is not easily loosened after installation. At the same time, the step-by-step operation facilitates construction, improves installation efficiency and quality, and allows for reasonable planning of the drilling sequence according to actual needs, optimizing the construction process.

[0106] The beneficial effects of the precision equipment installation and leveling method provided by this invention are as follows: Compared with the prior art, this invention's method only requires rough grinding of the ground when installing precision equipment, eliminating the need for fine grinding. Leveling bolts are used to level the substrate. After leveling, epoxy resin is poured between the substrate and the ground to form a curing block. This curing block ensures a tight fit between the substrate and the ground, achieving this tight fit even without fine grinding. Eliminating the need for fine grinding saves construction time and reduces construction difficulty. Furthermore, the epoxy resin curing block prevents direct hard contact between the substrate and the ground, buffering equipment vibration and improving the stability and lifespan of the precision equipment.

[0107] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A method for installing and leveling precision equipment, characterized in that, Includes the following steps: S100. Roughly grind the ground to initially level it; S200. Place the substrate at the designated position on the ground, insert the leveling bolt into the substrate, adjust the substrate using the leveling bolt so that the substrate is parallel to the horizontal plane and a reserved gap is formed between the substrate and the ground, and remove the substrate after leveling is completed. S300. Mix the curing agent and epoxy resin and stir evenly to obtain the casting liquid; S400. Construct a casting mold on the ground and inject the casting liquid into the casting mold; S500. Move the substrate above the casting mold and slowly lower it so that the casting liquid fills the reserved gap between the substrate and the ground; S600. Allow the casting liquid to stand until it completely solidifies into a solidified block. Remove the casting mold and reshape the solidified block to make its outer surface smooth. S700. Fix the substrate and the curing block to the ground; Wherein, S200 includes: S21a. Drill multiple mounting holes in the ground and drill positioning holes corresponding to the mounting holes in the substrate; S22a. Insert positioning pins into at least two of the said mounting holes; S23a. The substrate is positioned using the positioning pins so that the positioning holes on the substrate correspond one-to-one with the mounting holes, and leveled using the leveling bolts; Or S200 may include: S21b. Two mounting holes are made on the ground and two positioning holes are made on the substrate, with the two mounting holes and the two positioning holes corresponding one-to-one. S22b. Insert a positioning pin into the mounting hole; S23b. Position the substrate using the positioning pin and level it using the leveling bolt; A wrapping cloth is fixedly connected to the casting mold, and S500 includes: S510. Use tape to seal the bottom of the positioning hole, the tape being able to break under pressure so that the positioning pin breaks the tape and passes through the positioning hole; S520. Move the substrate directly above the casting mold so that the positioning holes correspond one-to-one with the mounting holes; S530. Slowly lower the substrate to its lowest height; S540. Wrap the casting mold and the substrate with the wrapping cloth to prevent the casting liquid from leaking; The S700 includes: S71a. Pull out the positioning pin and clean the solidified casting liquid from the positioning hole; S72a. Expansion bolts are provided in the positioning hole and the mounting hole; Alternatively, S700 includes: S71b. Pull out the positioning pin and clean the solidified casting liquid from the positioning hole; S72b. Open the remaining positioning holes and mounting holes; S73b. Expansion bolts are provided in the positioning hole and the mounting hole.

2. The precision equipment installation and leveling method as described in claim 1, characterized in that, S100 includes: The protrusions on the ground are ground down to prevent the height of the protrusions from being greater than the gap between the substrate and the ground.

3. The precision equipment installation and leveling method as described in claim 1, characterized in that, The levelness of the substrate is not less than 1:

500.

4. The precision equipment installation and leveling method as described in claim 1, characterized in that, The distance between the substrate and the ground is 3-5 mm.