Chip stress measuring device

Abstract

The invention belongs to the technical field of stress measuring devices, and discloses a chip stress measuring device which is technically characterized by comprising a bottom plate, vertical rods are fixedly mounted on the periphery of the bottom plate, a top plate is fixedly mounted at the top ends of the vertical rods jointly, a transverse plate is slidably mounted on the vertical rods jointly, and a hydraulic cylinder is fixedly mounted on the surface of the top plate. A vertical cylinder is fixedly mounted on the bottom wall of the transverse plate, a baffle is arranged in an inner cavity of the vertical cylinder, an extrusion spring is fixedly mounted on the bottom wall of the baffle, a base plate is slidably mounted in the vertical cylinder, a pressure sensor is fixedly mounted on the bottom wall of the base plate, an extrusion column is arranged on the surface of the pressure sensor, and a bearing plate is arranged on the surface of the bottom plate. An anti-impact mechanism matched with the extrusion column is arranged in the vertical cylinder, the anti-impact mechanism comprises a clamping assembly and an adjusting assembly, and the problems that when existing extrusion equipment is not stopped in time, the extrusion equipment is prone to continuously extruding a chip, and the chip is prone to being broken, broken and damaged are solved.

Description

Technical Field

[0001] This invention relates to the field of stress measurement device technology, specifically a chip stress measurement device. Background Technology

[0002] A chip, also known as a microcircuit, microchip, or integrated circuit, refers to a silicon wafer containing integrated circuits. It is very small and often part of a computer or other electronic device. Chips are a general term for semiconductor components and are the carriers of integrated circuits, formed by dicing wafers. During chip manufacturing, various performance tests are required, among which stress testing is crucial. Chip stress reflects properties such as chip strength and flexibility.

[0003] When performing stress measurements on a chip, a pressure bar is typically used to press the chip, and the degree of bending is observed to test the chip's stress resistance.

[0004] Existing measuring equipment cannot precisely limit the extent of compression when extruding chips. If the extrusion equipment does not stop in time after the chip reaches the preset bending range, it will continue to compress the chip, causing the chip to continue to bend and break. Summary of the Invention

[0005] The purpose of this invention is to provide a chip stress measurement device to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: A chip stress measuring device includes a base plate, with vertical rods fixedly installed around its perimeter. A top plate is fixedly installed at the top of multiple sets of vertical rods, and a horizontal plate is slidably installed along the vertical direction from the multiple sets of vertical rods. A hydraulic cylinder is fixedly installed on the surface of the top plate, and the telescopic end of the hydraulic cylinder is connected to the horizontal plate. A vertical cylinder is fixedly installed on the bottom wall of the horizontal plate, and a baffle is provided inside the vertical cylinder. A compression spring is fixedly installed on the bottom wall of the baffle. A pad is slidably installed inside the vertical cylinder, and the telescopic end of the compression spring is connected to the pad. A pressure sensor is fixedly installed on the bottom wall of the pad, and the surface of the pressure sensor extends to the outside of the vertical cylinder. The extrusion column has two sets of oppositely distributed bearing plates on its base plate surface. An anti-impact mechanism that cooperates with the extrusion column is installed inside the vertical cylinder. The anti-impact mechanism includes a locking component and an adjusting component. The locking component is located on the inner wall of the vertical cylinder and above a baffle. The locking component is used to position the baffle within the vertical cylinder cavity. The adjusting component is located on the outer side of the vertical cylinder and connected to the locking component. The adjusting component, in cooperation with the locking component, is used to release the restriction on the baffle within the vertical cylinder cavity. A protective component is installed on the outer side of the vertical cylinder to seal the space outside the extrusion column.

[0007] As a further aspect of the present invention: the snap-fit ​​assembly includes two sets of oppositely distributed storage slots opened on the inner side wall of the vertical cylinder, a snap-fit ​​block is slidably installed in the storage slot, a return spring is fixedly installed in the storage slot, and the extension end of the return spring is connected to the snap-fit ​​block.

[0008] As a further embodiment of the present invention: the adjustment assembly includes a guide rod fixedly installed on the outer wall of the vertical cylinder, a control block slidably installed on the surface of the guide rod in the vertical direction, a guide wheel rotatably installed on the outer wall of the vertical cylinder via a bracket, a positioning rope fixedly installed at one end of the snap-fit ​​block located in the storage groove, the end of the positioning rope away from the snap-fit ​​block extending to the outside of the vertical cylinder, passing through the guide wheel and connecting to the control block, a fixing rod fixedly installed on the bottom wall of the control block, and a pressure rod provided at the bottom end of the fixing rod.

[0009] As a further aspect of the present invention: the protective component includes a fixed cover fixedly installed on the outside of the vertical cylinder, and a telescopic cover slidably installed on the outside of the fixed cover along the vertical direction. The telescopic cover has a ring structure and is sleeved on the outside of the extrusion column.

[0010] As a further embodiment of the present invention: a clamping plate is rotatably mounted on the top of the bearing plate, and a placement groove is formed on the surface of the clamping plate.

[0011] As a further aspect of the present invention: the fixing rod has a threaded hole from the bottom up, the pressure rod surface is provided with an external thread, and the pressure rod is screwed into the threaded hole through the external thread.

[0012] As a further embodiment of the present invention: the surface of the fixed cover is provided with limiting grooves distributed in the vertical direction, and the inner sidewall of the telescopic cover is fixedly installed with limiting blocks, which are slidably installed in the limiting grooves.

[0013] Compared with the prior art, the beneficial effects of the present invention are: by setting the snap-fit ​​component and the adjustment component to cooperate with each other, the position of the baffle can be conveniently adjusted in the inner cavity of the vertical cylinder, thereby adjusting the position of the extrusion column. When the chip reaches the preset bending amplitude and the vertical cylinder continues to move downward, the pressure of the extrusion column on the chip can be released or reduced in real time, effectively preventing the chip from breaking and shattering. This solves the problem that when the current extrusion equipment does not stop in time, the extrusion equipment will continue to extrude the chip, which will easily break and shatter. Attached Figure Description

[0014] Figure 1 This is a three-dimensional structural diagram of a chip stress measurement device provided in an embodiment of the present invention. Figure 1 .

[0015] Figure 2This is a three-dimensional structural diagram of a chip stress measurement device provided in an embodiment of the present invention. Figure 2 .

[0016] Figure 3 This is a schematic diagram of the front view structure of a chip stress measurement device provided in an embodiment of the present invention.

[0017] Figure 4 This is a schematic diagram of the internal cross-sectional structure of the vertical cylinder in a chip stress measuring device provided in an embodiment of the present invention.

[0018] Figure 5 This is a schematic diagram of the carrier plate and its connection structure in a chip stress measuring device provided in an embodiment of the present invention.

[0019] Figure 6 for Figure 3 A magnified structural diagram of A in the diagram.

[0020] The components are: 1-base plate, 11-vertical rod, 12-top plate, 2-hydraulic cylinder, 3-horizontal plate, 4-vertical cylinder, 41-baffle, 42-compression spring, 43-pad plate, 44-pressure sensor, 45-compression column, 5-bearing plate, 6-impact protection mechanism, 61-clamping assembly, 611-storage slot, 612-reset spring, 613-clamping block, 62-adjustment assembly, 621-guide rod, 622-control block, 623-guide wheel, 624-positioning rope, 625-fixed rod, 626-pressure rod, 7-protection assembly, 71-fixed cover, 72-telescopic cover, 8-clamping plate, 81-placement slot, 9-threaded hole, 91-external thread, 10-limiting slot, 101-limiting block. Detailed Implementation

[0021] It should be noted that, unless otherwise specified, the embodiments and features described in the present invention can be combined with each other.

[0022] The specific implementation of the present invention will be described in detail below with reference to specific embodiments.

[0023] like Figure 1 , Figure 2 , Figure 3 , Figure 4The diagram shows a structural diagram of a chip stress measuring device according to an embodiment of the present invention. It includes a base plate 1, with vertical rods 11 fixedly installed around its perimeter. A top plate 12 is fixedly installed at the top of multiple sets of vertical rods 11. A horizontal plate 3 is slidably installed along the vertical direction from the multiple sets of vertical rods 11. A hydraulic cylinder 2 is fixedly installed on the surface of the top plate 12, with its extension / retraction end connected to the horizontal plate 3. A vertical cylinder 4 is fixedly installed on the bottom wall of the horizontal plate 3. A baffle 41 is provided inside the vertical cylinder 4, and a compression spring 42 is fixedly installed on the bottom wall of the baffle 41. A pad 43 is slidably installed inside the vertical cylinder 4, with the extension / retraction end of the compression spring 42 connected to the pad 43. In a stable state, the pad 43 is at its lowest position inside the vertical cylinder 4. A pressure sensor 44 is fixedly installed on the bottom wall of the pad 43. The pressure sensor 44 has an extrusion column 45 extending to the outside of the vertical cylinder 4. The base plate 1 has two sets of oppositely distributed bearing plates 5. The vertical cylinder 4 has an anti-impact mechanism 6 that cooperates with the extrusion column 45. The anti-impact mechanism 6 includes a locking component 61 and an adjusting component 62. The locking component 61 is located on the inner wall of the vertical cylinder 4 and above the baffle 41. The locking component 61 is used to position the baffle 41 in the inner cavity of the vertical cylinder 4. The adjusting component 62 is located on the outside of the vertical cylinder 4 and connected to the locking component 61. The adjusting component 62 cooperates with the locking component 61 to release the restriction on the baffle 41 in the inner cavity of the vertical cylinder 4. The outside of the vertical cylinder 4 is provided with a protective component 7, which is used to seal the space outside the extrusion column 45.

[0024] In use, the chip to be measured is placed on top of the two sets of support plates 5, which stably support the chip. The hydraulic cylinder 2 pushes the horizontal plate 3 vertically downward, and the horizontal plate 3 drives the vertical cylinder 4 and the extrusion column 45 to move downward synchronously. When the extrusion column 45 contacts the chip, the horizontal plate 3 drives the vertical cylinder 4 to move downward synchronously. The clamping component 61 positions the baffle 41 in the inner cavity of the vertical cylinder 4. The vertical cylinder 4, the baffle 41, and the pad 43 cooperate to continuously apply downward thrust to the extrusion column 45. The extrusion column 45 presses the chip at the top of the support plate 5 into a bent state. Due to the interaction of forces, the pressure sensor 44 can monitor the thrust of the extrusion column 45 on the chip in real time. When the chip reaches the preset bending amplitude without breaking or being damaged, it indicates that the chip is of qualified quality. At this time, the hydraulic cylinder 2 should stop moving downward in time to prevent the extrusion column 45 from continuously increasing the pressure on the chip. When the hydraulic cylinder 2 does not stop in time, the horizontal plate 3 drives the vertical cylinder 4 to move downward continuously. The adjusting component 62 and the snap-fit ​​component 61 cooperate with each other, and the restriction on the baffle 41 can be released in time in the inner cavity of the vertical cylinder 4. Under the elastic thrust of the compression spring 42, the baffle 41 moves upward in the inner cavity of the vertical cylinder 4. During the upward movement of the baffle 41, the compression spring 42 extends in the inner cavity of the vertical cylinder 4. The compression spring 42 can quickly reduce the thrust on the pad 43 and the compression column 45, and prevent the compression column 45 from continuously increasing the thrust on the chip, effectively preventing the chip from being subjected to excessive compression and causing breakage damage.

[0025] like Figure 3 , Figure 4 , Figure 6 As shown, in a preferred embodiment of the present invention, the snap-fit ​​assembly 61 includes two sets of oppositely distributed storage slots 611 opened on the inner side wall of the vertical cylinder 4. A snap-fit ​​block 613 is slidably installed in the storage slot 611, and a return spring 612 is fixedly installed in the storage slot 611. The telescopic end of the return spring 612 is connected to the snap-fit ​​block 613.

[0026] The inner cavity of the vertical cylinder 4 supports the pad 43, which positions the compression spring 42. The compression spring 42 applies an upward thrust to the baffle 41. The locking block 613 further positions the baffle 41 above it, preventing the baffle 41 from continuously moving upward within the inner cavity of the vertical cylinder 4. During the compression measurement of the chip, the locking block 613 controls the baffle 41 to remain stable within the inner cavity of the vertical cylinder 4. When the chip reaches the pre-examination bending range and there is excessive compression, the adjusting component 62 controls the locking block 613 to move entirely into the receiving slot 611. At this time, the locking block 613 releases the restriction on the baffle 41 within the inner cavity of the vertical cylinder 4, and the baffle 41 moves vertically upward within the inner cavity of the vertical cylinder 4 under the elastic thrust of the compression spring 42.

[0027] like Figure 2 , Figure 3 , Figure 4 , Figure 6 As shown, in a preferred embodiment of the present invention, the adjustment assembly 62 includes a guide rod 621 fixedly installed on the outer wall of the vertical cylinder 4. A control block 622 is slidably installed on the surface of the guide rod 621 in the vertical direction. A guide wheel 623 is rotatably installed on the outer wall of the vertical cylinder 4 via a bracket. A positioning rope 624 is fixedly installed at one end of the snap-fit ​​block 613 located in the storage groove 611. The end of the positioning rope 624 away from the snap-fit ​​block 613 extends to the outside of the vertical cylinder 4, passes through the guide wheel 623, and is connected to the control block 622. A fixing rod 625 is fixedly installed on the bottom wall of the control block 622. A pressure rod 626 is provided at the bottom end of the fixing rod 625.

[0028] The guide rod 621 positions the control block 622 on the outside of the vertical cylinder 4, and the control block 622 positions the fixing rod 625 and the pressure rod 626. When the chip is being squeezed and measured, the vertical cylinder 4 moves the control block 622, the fixing rod 625, and the pressure rod 626 downwards synchronously. When the chip reaches the preset bending radius, the bottom end of the pressure rod 626 contacts the surface of the base plate 1. When the vertical cylinder 4 continues to move downwards and is about to over-squeeze the chip, the control block 622 moves upwards relative to the surface of the guide rod 621. The control block 622 and the positioning rope 624 cooperate to automatically pull the snap-fit ​​block 613 into the storage slot 611.

[0029] like Figure 1 , Figure 3 As shown, in a preferred embodiment of the present invention, the protective component 7 includes a fixed cover 71 fixedly installed on the outside of the vertical cylinder 4, and a telescopic cover 72 slidably installed on the outside of the fixed cover 71 along the vertical direction. The telescopic cover 72 has a ring structure and is sleeved on the outside of the extrusion column 45.

[0030] When the horizontal plate 3 drives the vertical cylinder 4 to move vertically downward to compress and measure the chip, it also drives the fixed cover 71 and the telescopic cover 72 to move downward synchronously. During the measurement process, the bottom end of the telescopic cover 72 contacts the surface of the base plate 1. The fixed cover 71 and the telescopic cover 72 cooperate with each other to control the entire compression measurement process to be in a closed state. When the chip breaks and shatters, the telescopic cover 72 can seal and block the chip fragments.

[0031] like Figure 2 , Figure 5 As shown, in a preferred embodiment of the present invention, a clamping plate 8 is rotatably mounted on the top of the bearing plate 5, and a placement groove 81 is formed on the surface of the clamping plate 8.

[0032] When in use, insert both ends of the chip into the placement slots 81 on the surface of the clamping plate 8. When the pressing column 45 presses the chip, the clamping plate 8 rotates synchronously to an inclined state at the top of the support plate 5, which can guide both ends of the chip and prevent the chip from breaking during the bending process.

[0033] like Figure 3 , Figure 4 As shown, in a preferred embodiment of the present invention, the fixing rod 625 has a threaded hole 9 from the bottom up, and the pressure rod 626 has an external thread 91 on its surface. The pressure rod 626 is screwed into the threaded hole 9 through the external thread 91.

[0034] During the measurement process, the pressure rod 626 rotates spirally within the threaded hole 9, allowing for convenient adjustment of the height of the pressure rod 626, which in turn allows for adjustment of the preset bending amplitude of the chip measurement.

[0035] like Figure 1 , Figure 3 As shown, in a preferred embodiment of the present invention, the surface of the fixed cover 71 is provided with a limiting groove 10 distributed in the vertical direction, and the inner sidewall of the telescopic cover 72 is fixedly installed with a limiting block 101, which is slidably installed in the limiting groove 10.

[0036] The working principle of this invention is as follows: During use, the chip to be measured is placed on top of two sets of support plates 5. The two sets of support plates 5 stably support the chip. The hydraulic cylinder 2 pushes the horizontal plate 3 vertically downwards. The horizontal plate 3 drives the vertical cylinder 4 and the extrusion column 45 to move downwards synchronously. When the extrusion column 45 contacts the chip, the horizontal plate 3 drives the vertical cylinder 4 to move downwards synchronously. The vertical cylinder 4, baffle 41, and pad 43 cooperate to continuously apply downward thrust to the extrusion column 45. The extrusion column 45 presses the chip at the top of the support plate 5 into a bent state. Due to the interaction of forces, the pressure sensor 44 can monitor the thrust of the extrusion column 45 on the chip in real time. When the chip reaches the preset bending amplitude without breakage or damage, it indicates that the chip is of qualified quality. At this time, the hydraulic cylinder 2 should stop moving downwards in time to prevent the extrusion column 45 from continuously increasing the pressure on the chip.

[0037] When the chip reaches the preset bending radius, the bottom end of the pressure rod 626 contacts the surface of the base plate 1. If the hydraulic cylinder 2 does not stop in time, the vertical cylinder 4 continues to move downward, which will cause excessive compression of the chip. At this time, the control block 622 moves upward relative to the surface of the guide rod 621. The control block 622 and the positioning rope 624 cooperate to automatically pull the locking block 613 into the storage slot 611. At this time, the locking block 613 releases the restriction on the baffle 41 in the inner cavity of the vertical cylinder 4. Under the elastic thrust of the compression spring 42, the baffle 41 moves vertically upward in the inner cavity of the vertical cylinder 4. Under the elastic thrust of the compression spring 42, the baffle 41 moves upward in the inner cavity of the vertical cylinder 4. During the upward movement of the baffle 41, the compression spring 42 extends in the inner cavity of the vertical cylinder 4. The compression spring 42 can quickly reduce the thrust on the pad 43 and the compression column 45, preventing the compression column 45 from continuously increasing the thrust on the chip, and effectively preventing the chip from being excessively compressed and broken.

[0038] The preferred embodiments of the present invention have been described in detail above. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention.

Claims

1. A chip stress measuring device, comprising a base plate, wherein vertical rods are fixedly installed around the base plate, a top plate is fixedly installed at the top of multiple sets of vertical rods, and a horizontal plate is slidably installed on the multiple sets of vertical rods along the vertical direction; a hydraulic cylinder is fixedly installed on the surface of the top plate, and the telescopic end of the hydraulic cylinder is connected to the horizontal plate, characterized in that, A vertical cylinder is fixedly installed on the bottom wall of the horizontal plate. A baffle is provided in the inner cavity of the vertical cylinder. A compression spring is fixedly installed on the bottom wall of the baffle. A pad is slidably installed inside the vertical cylinder. The extension end of the compression spring is connected to the pad. A pressure sensor is fixedly installed on the bottom wall of the pad. A compression column extending to the outside of the vertical cylinder is provided on the surface of the pressure sensor. Two sets of oppositely distributed bearing plates are provided on the surface of the bottom plate. The vertical cylinder is equipped with an anti-impact mechanism that cooperates with the extrusion column. The anti-impact mechanism includes a snap-fit ​​component and an adjustment component. The snap-fit ​​assembly is located on the inner wall of the vertical cylinder and above the baffle. The snap-fit ​​assembly is used to position the baffle in the inner cavity of the vertical cylinder. The adjustment component is located on the outside of the vertical cylinder and connected to the snap-fit ​​component. The adjustment component is used to release the restriction on the baffle in the inner cavity of the vertical cylinder by cooperating with the snap-fit ​​component. A protective component is provided on the outside of the vertical cylinder to seal off the space outside the extrusion column.

2. The chip stress measuring device according to claim 1, characterized in that, The snap-fit ​​assembly includes two sets of oppositely distributed storage slots opened on the inner side wall of the vertical cylinder. A snap-fit ​​block is slidably installed in the storage slot, and a return spring is fixedly installed in the storage slot. The extension end of the return spring is connected to the snap-fit ​​block.

3. The chip stress measuring device according to claim 2, characterized in that, The adjustment assembly includes a guide rod fixedly installed on the outer wall of the vertical cylinder, a control block slidably installed on the surface of the guide rod in the vertical direction, a guide wheel rotatably installed on the outer wall of the vertical cylinder via a bracket, a positioning rope fixedly installed at one end of the snap-fit ​​block located in the storage groove, the end of the positioning rope away from the snap-fit ​​block extending to the outside of the vertical cylinder, passing through the guide wheel and connecting to the control block, a fixing rod fixedly installed on the bottom wall of the control block, and a pressure rod provided at the bottom end of the fixing rod.

4. The chip stress measuring device according to claim 1, characterized in that, The protective assembly includes a fixed cover fixedly installed on the outside of the vertical cylinder, and a telescopic cover slidably installed on the outside of the fixed cover along the vertical direction. The telescopic cover has a ring structure and is sleeved on the outside of the extrusion column.

5. The chip stress measuring device according to claim 1, characterized in that, A clamping plate is rotatably mounted on the top of the bearing plate, and a placement groove is formed on the surface of the clamping plate.

6. The chip stress measuring device according to claim 3, characterized in that, The fixing rod has a threaded hole from the bottom up, and the pressure rod has an external thread on its surface. The pressure rod is installed in the threaded hole by the external thread.

7. A chip stress measuring device according to claim 4, characterized in that, The surface of the fixed cover is provided with limiting grooves distributed in the vertical direction, and the inner side wall of the telescopic cover is fixedly installed with limiting blocks, which are slidably installed in the limiting grooves.

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