Array surface assembly monitoring and maintenance method, system, equipment and medium

Abstract

The invention discloses an array surface component monitoring and maintenance method, system, equipment and medium, and relates to the technical field of digital array surface monitoring, and the method comprises the following steps: dividing a digital array surface into a first plane grid region and a second plane grid region by taking half of the physical size of a component and a channel as step length; and forming an array plane layout description file for describing component and channel layout on the basis, parametrically configuring to-be-monitored component information, and monitoring the display layout of an interface. And performing polling monitoring on the component based on the description file, and displaying monitoring information on a monitoring interface. When a fault occurs, a fault component or channel can be shielded, and component information is updated after the component is replaced. According to the method, efficient management and precise maintenance of the digital array plane are realized, the component state can be monitored in real time, the fault component can be accurately positioned, the component information can be quickly updated, the reliability and maintenance efficiency of the system are improved, and the method has remarkable practicability and application value.

Description

Technical Field

[0001] This invention relates to the field of digital array panel monitoring technology, and in particular to a method, system, device and medium for monitoring and maintaining array panel components. Background Technology

[0002] Digital array panel monitoring and maintenance is a crucial function of digital array reconnaissance systems. Users can observe the real-time status of panel components and channels through a display interface and replace components or troubleshoot as needed. Currently, implementing digital array panel component monitoring requires customized development for specific systems, meaning that component monitoring information acquisition and display are based on a fixed component and channel layout. Existing digital array panel component monitoring systems cannot adapt to changes in panel layout without software modifications. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to address the shortcomings of the prior art, and specifically provides a method, system, equipment and medium for monitoring and maintaining array components, as detailed below: 1) In a first aspect, the present invention provides a method for monitoring and maintaining array components, the specific technical solution of which is as follows: Using half the physical size of the actual components in the digital array array to be maintained as the step size, the digital array array to be maintained is divided into planar grids to obtain a first planar grid region. Each vertex of each first grid corresponds to a component mounting point. In the first planar grid region, the row number and column number of the component mounting point are used to represent the coordinates of the component mounting point. Using half the physical size of the channel in the digital array to be maintained as the step size, the digital array to be maintained is divided into planar grids to obtain a second planar grid region. Each vertex of each second grid corresponds to a channel mounting point. In the second planar grid region, the row number and column number of the channel mounting point are used to represent the coordinates of the channel mounting point. Edit the array layout description file, which contains basic layout information of the digital array and layout information of all components; configure the display layout of the monitoring interface based on the array layout description file, poll each component in the array layout description file, summarize the monitoring information fed back by the polled components, and display it on the monitoring interface. When a channel fails, the array layout description file is re-edited, the channel status is marked as faulty, the channel is blocked, and the monitoring interface displays the channel fault. When all channels in a component fail, or the component itself fails, the array layout description file is re-edited, the component status is marked as faulty, the component is blocked, the monitoring information of the component is no longer polled, and the monitoring interface displays the component fault. After the actual component replacement, the array layout description file is re-edited, the component information is updated, and the component polling and monitoring information display is performed based on the new array layout description file.

[0004] The beneficial effects of the array component monitoring and maintenance method provided by this invention are as follows: By finely dividing the digital array array surface to be maintained into planar grids, the first and second planar grid areas are divided with a step size of half the physical size of the components and channels, respectively. The vertices of the first planar grid where the actual installed components are located and the vertices of the second planar grid where the actual installed channels are located are marked and labeled to describe the layout of the components and channels. At the same time, combined with polling monitoring to generate monitoring information associated with the grid vertices of the actual installed components or channels, efficient management and precise maintenance of the digital array array surface are achieved. It can monitor the component status in real time, accurately locate faulty components, and quickly update component information, thereby improving the reliability and maintenance efficiency of the system and having significant practicality and application value.

[0005] Based on the above solution, the present invention can be further improved as follows.

[0006] Furthermore, half of the physical size of the component is half the length and width of the projected area of ​​the installed component on the digital array surface.

[0007] Furthermore, half of the physical size of the channel is half the length and width of the channel in the digital array projection area of ​​the component.

[0008] Furthermore, the basic layout information of the digital array includes: the length and width of the digital array surface, the number of installed components, the length and width of the components in the projection area of ​​the digital array surface, and the length and width of the channels in the projection area of ​​the digital array surface.

[0009] Furthermore, the layout information of all components includes: the coordinates of the component installation point, the number of channels in the component, the component ID, the component status flag, and the layout information of all channels in the component, wherein the component status flag includes a normal flag and a fault flag.

[0010] Furthermore, the layout information of the channel includes: the coordinates of the channel installation point, the channel status flag, and the fiber number corresponding to the channel, wherein the channel status flag includes a normal flag and a fault flag.

[0011] 2) In a second aspect, the present invention also provides a monitoring and maintenance system for array components, the specific technical solution of which is as follows: The first partitioning module is used to: divide the digital array to be maintained into planar grids with half the physical size of the actual components in the digital array to be maintained as the step size, to obtain a first planar grid area, wherein each vertex of each first grid corresponds to a component mounting point, and the row number and column number of the component mounting point are used to represent the coordinates of the component mounting point in the first planar grid area. The second partitioning module is used to: divide the digital array to be maintained into planar grids with half the physical size of the channel in the digital array to be maintained as the step size, to obtain a second planar grid area, wherein each vertex of each second grid corresponds to a channel mounting point, and in the second planar grid area, the row number and column number of the channel mounting point are used to represent the coordinates of the channel mounting point; The monitoring and maintenance module is used to: edit the array layout description file, which contains basic layout information of the digital array and layout information of all components; configure the display layout of the monitoring interface based on the array layout description file; poll each component in the array layout description file; summarize the monitoring information fed back by the polled components; and display it on the monitoring interface. The processing module is used to: when a channel fails, re-edit the array layout description file, mark the channel status as faulty, block the channel, and fix the channel failure display on the monitoring interface; when all channels in a component fail, or the component itself fails, re-edit the array layout description file, mark the component status as faulty, block the component, stop polling the component's monitoring information, and fix the component failure display on the monitoring interface. The display module is used to: re-edit the array layout description file, update component information, and display component polling and monitoring information based on the new array layout description file after actual component replacement.

[0012] Based on the above solution, the present invention can be further improved as follows.

[0013] Furthermore, half of the physical size of the component is half the length and width of the projected area of ​​the installed component on the digital array surface.

[0014] Furthermore, half of the physical size of the channel is half the length and width of the channel in the digital array projection area of ​​the component.

[0015] Furthermore, the basic layout information of the digital array includes: the length and width of the digital array surface, the number of installed components, the length and width of the components in the projection area of ​​the digital array surface, and the length and width of the channels in the projection area of ​​the digital array surface.

[0016] Furthermore, the layout information of all components includes: the coordinates of the component installation point, the number of channels in the component, the component ID, the component status flag, and the layout information of all channels in the component, wherein the component status flag includes a normal flag and a fault flag.

[0017] Furthermore, the layout information of the channel includes: the coordinates of the channel installation point, the channel status flag, and the fiber number corresponding to the channel, wherein the channel status flag includes a normal flag and a fault flag.

[0018] 3) In a third aspect, the present invention also provides an electronic device, the electronic device including a processor coupled to a memory, the memory storing at least one computer program, the at least one computer program being loaded and executed by the processor to enable the electronic device to perform any of the above methods.

[0019] 4) In a fourth aspect, the present invention also provides a computer-readable storage medium storing at least one computer program, which is loaded and executed by a processor to enable a computer to implement any of the above methods.

[0020] It should be noted that the beneficial effects of the technical solutions of the second to fourth aspects of the present invention and their corresponding possible implementations can be found in the above description of the technical effects of the first aspect and its corresponding possible implementations, and will not be repeated here. Attached Figure Description

[0021] Other features, objects, and advantages of the invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings: Figure 1 This is a flowchart illustrating a method for monitoring and maintaining array components according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the array component layout in an embodiment of the present invention for a method of monitoring and maintaining array components; Figure 3 This is a schematic diagram of the component channel layout of a method for monitoring and maintaining array components according to an embodiment of the present invention; Figure 4 This is a structural framework diagram of an electronic device according to the present invention. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of the present invention clearer, the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.

[0023] like Figure 1As shown, S1, the digital array to be maintained is divided into planar grids with half the physical size of the actual components in the digital array as the step size, to obtain a first planar grid area. Each vertex of each first grid corresponds to a component mounting point. In the first planar grid area, the row number and column number of the component mounting point are used to represent the coordinates of the component mounting point. S2, the digital array to be maintained is divided into planar grids with half the physical size of the channel in the digital array to be maintained as the step size to obtain a second planar grid area. Each vertex of each second grid corresponds to a channel mounting point. In the second planar grid area, the row number and column number of the channel mounting point are used to represent the coordinates of the channel mounting point. S3, edit the array layout description file, which contains basic layout information of the digital array and layout information of all components; configure the display layout of the monitoring interface based on the array layout description file, poll each component in the array layout description file, summarize the monitoring information fed back by the polled components, and display it on the monitoring interface. S4. When a channel fails, the array layout description file is re-edited, the channel status is marked as faulty, the channel is blocked, and the monitoring interface displays the channel fault. When all channels in a component fail, or the component itself fails, the array layout description file is re-edited, the component status is marked as faulty, the component is blocked, the monitoring information of the component is no longer polled, and the monitoring interface displays the component fault. S5, after the actual component replacement, re-edits the array layout description file, updates the component information, and performs component polling and monitoring information display based on the new array layout description file.

[0024] The beneficial effects of the array component monitoring and maintenance method provided by this invention are as follows: By finely dividing the digital array array surface to be maintained into planar grids, the first and second planar grid areas are divided with a step size of half the physical size of the components and channels, respectively. The vertices of the first planar grid where the actual installed components are located and the vertices of the second planar grid where the actual installed channels are located are marked and labeled to describe the layout of the components and channels. At the same time, combined with polling monitoring to generate monitoring information associated with the grid vertices of the actual installed components or channels, efficient management and precise maintenance of the digital array array surface are achieved. It can monitor the component status in real time, accurately locate faulty components, and quickly update component information, thereby improving the reliability and maintenance efficiency of the system and having significant practicality and application value.

[0025] Furthermore, half of the physical size of the component is half the length and width of the projected area of ​​the installed component on the digital array surface.

[0026] Furthermore, half of the physical size of the channel is half the length and width of the channel in the digital array projection area of ​​the component.

[0027] Furthermore, the basic layout information of the digital array includes: the length and width of the digital array surface, the number of installed components, the length and width of the components in the projection area of ​​the digital array surface, and the length and width of the channels in the projection area of ​​the digital array surface.

[0028] Furthermore, the layout information of all components includes: the coordinates of the component installation point, the number of channels in the component, the component ID, the component status flag, and the layout information of all channels in the component, wherein the component status flag includes a normal flag and a fault flag.

[0029] Furthermore, the layout information of the channel includes: the coordinates of the channel installation point, the channel status flag, and the fiber number corresponding to the channel, wherein the channel status flag includes a normal flag and a fault flag.

[0030] Example 1, S10: Establish a parameterized layout description model for the digital array surface.

[0031] A digital array array is formed by arranging several components, each of which includes several channels.

[0032] like Figure 2 As shown, the digital array surface is divided into planar grid areas in increments of half the physical size of the components. Each vertex of each grid is a component mounting point. The mounting points of components that are actually installed are real nodes, and the mounting points of components that are not installed are virtual nodes. This is used to describe the layout and arrangement of the components.

[0033] like Figure 3 As shown, the digital array surface is divided into planar grid areas in increments of half the physical size of the channels. Each vertex of each grid is a channel mounting point. Channel mounting points where channels are actually installed are called "real nodes," and channel mounting points where no channels are installed are called "virtual nodes." This describes the channel layout.

[0034] The digital array array layout description model consists of the layout information of all components. Each component's layout information fields include the installation row number, installation column number, number of channels, installation status (installed / not installed), component ID, and layout information for all channels within the component. Each channel's layout information fields include the channel row number, channel column number, fiber number, and channel status (normal / faulty).

[0035] S20: Establish a monitoring and maintenance system for digital array array components.

[0036] The digital array array component monitoring and maintenance system consists of an array layout information management module, an array monitoring information collection module, and an array monitoring information display module. The array layout information management module provides a human-machine interface, allowing users to edit the layout information of digital array components and channels. It modifies the layout information when actual installed components change, generates a digital array array layout description model, and publishes it to other modules. The array monitoring information collection module polls the array components based on the digital array array layout description model, collects and summarizes the monitoring information, and sends it to the array monitoring information display module. The array monitoring information display module displays the array component and channel arrangement diagram based on the digital array array layout description model, and provides detailed display views of each component's information and monitoring data.

[0037] S30: Edit and publish the digital array array layout description model.

[0038] Users define the digital array array components and channel layout information through the array layout information management module, generate a digital array array layout description model, and publish it. The specific process is as follows: a) Input the geometric information parameters of the digital array surface plane, including the length and width of the surface plane; b) Input the planar geometric information parameters of the component, including the component length and width, and output the number of rows and columns of the planar grid area of ​​the digital array array component; c) Input the length and width of the area occupied by each channel, and output the number of rows and columns of the planar grid area where the digital array channels are arranged; d) Add component information, and enter the original values ​​for fields such as installation row number, installation column number, number of channels, installation status (installed / not installed), and component ID; e) Add channel information for all channels of this component, and enter the original values ​​for fields such as channel row number, channel column number, fiber number, and channel status; f) Repeat steps d) to e) until the layout information for all components and all channels has been added; g) Publish the edited digital array surface layout description model to the surface monitoring information collection module and the surface monitoring information display module.

[0039] S40: Collect and display the monitoring status of digital array array components.

[0040] After the digital array array layout description model is published, the array monitoring information collection module periodically polls for monitoring information of each component based on the component information in the digital array array layout description model. Each component's monitoring information includes a component ID field, which is identical to the component ID in the component's layout information and uniquely identifies a physical component. The array monitoring information collection module then summarizes the monitoring information of all components within the polling period and sends it to the array monitoring information display module.

[0041] The array monitoring information display module displays the component and channel layout diagram of the current digital array array on the interface according to the digital array array layout description model, receives the summarized component monitoring information, finds the position of the component in the layout diagram according to the component ID, displays the status data in the component monitoring information on the component at the corresponding position in the layout diagram, and can respond to user selection operations to display the detailed information of the selected component and a detailed display view of the monitoring data.

[0042] S50: Perform array component information maintenance and management.

[0043] By collecting and displaying the monitoring status of digital array array components, the health status of the components can be determined. For components that have failed, the installation status in the corresponding component layout information can be set to "not installed" by modifying the digital array array layout description model. After the update is released, the array monitoring information collection module will no longer collect monitoring information for that component, and the array monitoring information display module will no longer display its status information.

[0044] After replacing the faulty component, the new component can be included in the system monitoring scope by modifying the digital array array layout description model and republishing it, thereby achieving the maintenance and management of array component information.

[0045] In the above embodiments, although the steps are numbered S1, S2, etc., they are only specific embodiments given by the present invention. Those skilled in the art can adjust the execution order of S1, S2, etc. according to the actual situation, which is also within the protection scope of the present invention. It can be understood that in some embodiments, some or all of the above embodiments may be included.

[0046] The present invention also provides a monitoring and maintenance system for array components, the specific technical solution of which is as follows: The first partitioning module is used to: divide the digital array to be maintained into planar grids with half the physical size of the actual components in the digital array to be maintained as the step size, to obtain a first planar grid area, wherein each vertex of each first grid corresponds to a component mounting point, and the row number and column number of the component mounting point are used to represent the coordinates of the component mounting point in the first planar grid area. The second partitioning module is used to: divide the digital array to be maintained into planar grids with half the physical size of the channel in the digital array to be maintained as the step size, to obtain a second planar grid area, wherein each vertex of each second grid corresponds to a channel mounting point, and in the second planar grid area, the row number and column number of the channel mounting point are used to represent the coordinates of the channel mounting point; The monitoring and maintenance module is used to: edit the array layout description file, which contains basic layout information of the digital array and layout information of all components; configure the display layout of the monitoring interface based on the array layout description file; poll each component in the array layout description file; summarize the monitoring information fed back by the polled components; and display it on the monitoring interface. The processing module is used to: when a channel fails, re-edit the array layout description file, mark the channel status as faulty, block the channel, and fix the channel failure display on the monitoring interface; when all channels in a component fail, or the component itself fails, re-edit the array layout description file, mark the component status as faulty, block the component, stop polling the component's monitoring information, and fix the component failure display on the monitoring interface. The display module is used to: re-edit the array layout description file, update component information, and display component polling and monitoring information based on the new array layout description file after actual component replacement.

[0047] It should be noted that the beneficial effects of the array component monitoring and maintenance system provided in the above embodiments are the same as those of the array component monitoring and maintenance method described above, and will not be repeated here. Furthermore, the system provided in the above embodiments is only illustrated by the division of the above functional modules. In practical applications, the above functions can be assigned to different functional modules as needed, that is, the system can be divided into different functional modules according to the actual situation to complete all or part of the functions described above. In addition, the system and method embodiments provided in the above embodiments belong to the same concept, and their specific implementation process is detailed in the method embodiments, and will not be repeated here.

[0048] like Figure 4 As shown, an electronic device 300 according to an embodiment of the present invention includes a processor 320 coupled to a memory 310. The memory 310 stores at least one computer program 330, which is loaded and executed by the processor 320 to enable the electronic device 300 to implement any of the above-mentioned methods. Specifically: The electronic device 300 can vary considerably due to differences in configuration or performance. It may include one or more processors 320 (Central Processing Units, CPUs) and one or more memories 310. The memories 310 store at least one computer program 330, which is loaded and executed by the processors 320 to enable the electronic device 300 to implement the array component monitoring and maintenance method provided in the above embodiments. Of course, the electronic device 300 may also have wired or wireless network interfaces, a keyboard, and input / output interfaces for input and output. It may also include other components for implementing device functions, which will not be elaborated upon here.

[0049] An embodiment of the present invention provides a computer-readable storage medium storing at least one computer program, which is loaded and executed by a processor to enable a computer to implement any of the above-described methods.

[0050] Alternatively, the computer-readable storage medium may be a read-only memory (ROM), a random access memory (RAM), a compact disc read-only memory (CD-ROM), magnetic tape, a floppy disk, and an optical data storage device, etc.

[0051] In an exemplary embodiment, a computer program product or computer program is also provided, which includes computer instructions stored in a computer-readable storage medium. A processor of an electronic device reads the computer instructions from the computer-readable storage medium and executes the computer instructions, causing the electronic device to perform any of the methods described above.

[0052] It should be noted that the terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and represent a limitation on a specific order or sequence. Where appropriate, the order of use for similar objects can be interchanged so that the embodiments of this application described herein can be implemented in an order other than that shown or described.

[0053] Those skilled in the art will recognize that this invention can be implemented as a system, method, or computer program product. Therefore, this disclosure can be specifically implemented in the following forms: it can be entirely hardware, entirely software (including firmware, resident software, microcode, etc.), or a combination of hardware and software, generally referred to herein as a "circuit," "module," or "system." Furthermore, in some embodiments, this invention can also be implemented as a computer program product in one or more computer-readable media containing computer-readable program code.

[0054] Any combination of one or more computer-readable media may be used. A computer-readable medium can be a computer-readable signal medium or a computer-readable storage medium. A computer-readable storage medium can be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination thereof. More specific examples (a non-exhaustive list) of computer-readable storage media include: an electrical connection having one or more wires, a portable computer disk, a hard disk, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage device, magnetic storage device, or any suitable combination thereof. In this document, a computer-readable storage medium can be any tangible medium that contains or stores a program that can be used by or in connection with an instruction execution system, apparatus, or device.

[0055] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A method for monitoring and maintaining array components, characterized in that, include: Using half the physical size of the actual components in the digital array array to be maintained as the step size, the digital array array to be maintained is divided into planar grids to obtain a first planar grid region. Each vertex of each first grid corresponds to a component mounting point. In the first planar grid region, the row number and column number of the component mounting point are used to represent the coordinates of the component mounting point. Using half the physical size of the channel in the digital array to be maintained as the step size, the digital array to be maintained is divided into planar grids to obtain a second planar grid region. Each vertex of each second grid corresponds to a channel mounting point. In the second planar grid region, the row number and column number of the channel mounting point are used to represent the coordinates of the channel mounting point. Edit the array layout description file, which contains basic layout information of the digital array and layout information of all components; configure the display layout of the monitoring interface based on the array layout description file, poll each component in the array layout description file, summarize the monitoring information fed back by the polled components, and display it on the monitoring interface. When a channel fails, the array layout description file is re-edited, the channel status is marked as faulty, the channel is blocked, and the monitoring interface displays the channel fault. When all channels in a component fail, or the component itself fails, the array layout description file is re-edited, the component status is marked as faulty, the component is blocked, the monitoring information of the component is no longer polled, and the monitoring interface displays the component fault. After the actual component replacement, the array layout description file is re-edited, the component information is updated, and the component polling and monitoring information display is performed based on the new array layout description file.

2. The method for monitoring and maintaining array components according to claim 1, characterized in that, Half of the physical size of the component is half the length and width of the projected area of ​​the installed component on the digital array surface.

3. The method for monitoring and maintaining array components according to claim 1, characterized in that, Half of the physical size of the channel is half the length and width of the channel in the digital array projection area of ​​the component.

4. The method for monitoring and maintaining array components according to claim 1, characterized in that, The basic layout information of the digital array includes: the length and width of the digital array surface, the number of installed components, the length and width of the components in the projection area of ​​the digital array surface, and the length and width of the channels in the projection area of ​​the digital array surface.

5. The method for monitoring and maintaining array components according to claim 1, characterized in that, The layout information of all components includes: the coordinates of the component installation point, the number of channels in the component, the component ID, the component status flag, and the layout information of all channels in the component. The component status flag includes a normal flag and a fault flag.

6. The method for monitoring and maintaining array components according to claim 5, characterized in that, The layout information of the channel includes: the coordinates of the channel installation point, the channel status flag, and the fiber number corresponding to the channel. The channel status flag includes a normal flag and a fault flag.

7. A monitoring and maintenance system for array components, characterized in that, include: The first partitioning module is used to: divide the digital array to be maintained into planar grids with half the physical size of the actual components in the digital array to be maintained as the step size, to obtain a first planar grid area, wherein each vertex of each first grid corresponds to a component mounting point, and the row number and column number of the component mounting point are used to represent the coordinates of the component mounting point in the first planar grid area. The second partitioning module is used to: divide the digital array to be maintained into planar grids with half the physical size of the channel in the digital array to be maintained as the step size, to obtain a second planar grid area, wherein each vertex of each second grid corresponds to a channel mounting point, and in the second planar grid area, the row number and column number of the channel mounting point are used to represent the coordinates of the channel mounting point; The monitoring and maintenance module is used to: edit the array layout description file, which contains basic layout information of the digital array and layout information of all components; configure the display layout of the monitoring interface based on the array layout description file; poll each component in the array layout description file; summarize the monitoring information fed back by the polled components; and display it on the monitoring interface. The processing module is used to: when a channel fails, re-edit the array layout description file, mark the channel status as faulty, block the channel, and fix the channel failure display on the monitoring interface; when all channels in a component fail, or the component itself fails, re-edit the array layout description file, mark the component status as faulty, block the component, stop polling the component's monitoring information, and fix the component failure display on the monitoring interface. The display module is used to: re-edit the array layout description file, update component information, and display component polling and monitoring information based on the new array layout description file after actual component replacement.

8. The array component monitoring and maintenance system according to claim 7, characterized in that, Half of the physical size of the component is half the length and width of the projected area of ​​the installed component on the digital array surface.

9. An electronic device, characterized in that, The electronic device includes a processor coupled to a memory storing at least one computer program, which is loaded and executed by the processor to enable the electronic device to perform the method as described in any one of claims 1 to 6.

10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores at least one computer program, which is loaded and executed by a processor to enable the computer to perform the method as described in any one of claims 1 to 6.

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