A high-conductivity graphene power cable processing device

Abstract

The application provides a high-conductivity graphene power cable processing equipment, and relates to the technical field of cable processing.The equipment comprises two groups of supporting seats, a processing shuttle box, a cooling mechanism, two groups of electrostatic adsorption mechanisms, a wire-erection rolling mechanism and two groups of wire-laying channels.The two groups of supporting seats are symmetrically installed at the two ends of the bottom of the processing shuttle box and are equidistantly arranged along the horizontal direction.The cooling mechanism is arranged outside one end of the processing shuttle box.The two groups of electrostatic adsorption mechanisms are arranged on the upper and lower parts of the end of the processing shuttle box that is far away from the cooling mechanism.The wire-erection rolling mechanism is arranged in the middle of the processing shuttle box.The cooling mode and impurity cleaning mechanism are optimized, the processing quality of the graphene cable is effectively improved, the stability and efficiency of the equipment operation are enhanced, and the equipment is suitable for the large-scale production of high-conductivity graphene power cables.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of cable processing, in particular to a high-conductivity graphene power cable processing equipment. BACKGROUND

[0002] With the rapid development of new energy, smart grid and other fields, higher requirements are put forward for the electrical conductivity, mechanical strength and environmental resistance of cables. Graphene material is widely used in the reinforcement of high-end cable sheath or the modification of conductors due to its ultra-high thermal conductivity (5300 W / m·K), excellent electrical conductivity and mechanical properties. However, graphene cables face many technical bottlenecks in the processing link (especially cooling and surface treatment after extrusion), and traditional processes are difficult to adapt to their material properties. The specific problems are as follows:

[0003] Traditional cable cooling mostly uses water tank immersion or water mist spraying, which can quickly cool down, but has significant limitations for graphene cables. Graphene composite sheath has very high thermal conductivity (more than 5 times that of traditional PVC), but is relatively brittle. The radial temperature difference (often 3-5℃) caused by water film wrapping during water tank cooling easily causes internal stress concentration and causes sheath micro-cracks.

[0004] Graphene surface is easy to adsorb water molecules, and the residual water after water mist or water tank cooling will reduce its electrical conductivity (tests show that when the water content is >0.1%, the electrical conductivity decreases by more than 15%);

[0005] When the cooling medium (water) contacts the high-temperature sheath, bubbles may be generated due to local vaporization, which will form defects on the surface of the graphene layer, and the damage rate is high during processing. SUMMARY

[0006] In view of the above shortcomings of the prior art, the purpose of the embodiments of the present application is to provide a high-conductivity graphene power cable processing equipment, which can solve the technical problem of easy cracking of the graphene cable sheath caused by the cooling methods such as water cooling spraying and immersion in the prior art.

[0007] The embodiments of the present application provide a high-conductivity graphene power cable processing equipment, which comprises two groups of supporting seats, a processing shuttle box, a cooling mechanism, two groups of electrostatic adsorption mechanisms, a wire mounting and rolling mechanism, and two groups of wire routing channels.

[0008] The two groups of supporting seats are symmetrically installed in parallel at the two ends of the bottom of the processing shuttle box and are arranged equidistantly along the horizontal direction. The cooling mechanism is arranged outside one end of the processing shuttle box. The two groups of electrostatic adsorption mechanisms are arranged at the upper and lower positions of the end of the processing shuttle box which is away from the cooling mechanism. The wire mounting and rolling mechanism is arranged in the middle of the processing shuttle box.

[0009] The wire mounting and rolling mechanism comprises a plurality of groups of fixed clamping blocks, a plurality of groups of wire routing rollers and two groups of suspensions.

[0010] The two sets of suspensions are respectively fixedly mounted on both sides of the inner wall of the processing shuttle box, and several sets of fixing blocks are symmetrically arranged in pairs along the horizontal direction on both sides of the suspension. Several sets of cable-running rollers are sequentially locked between two opposite fixing blocks.

[0011] The cooling mechanism includes a semiconductor cooler, a mounting frame, an air inlet pipe, and a helium gas inlet device;

[0012] The fixing bracket is mounted on the outside of one side of the semiconductor cooler. The side of the fixing bracket away from the semiconductor cooler is fixedly installed on the outer wall of one side of the processing shuttle box. One end of the semiconductor cooler is connected to the inside of the air inlet pipe. One end of the air inlet pipe extends into the inside of the processing shuttle box. The end of the air inlet pipe away from the processing shuttle box is connected to the helium gas inlet device. The helium gas inlet device is fixedly installed on the upper surface of one side of one set of support seats.

[0013] The electrostatic adsorption mechanism includes a motor, an L-shaped frame, a C-shaped ring shell, an electrostatic adsorption plate, a pulley assembly, a connecting rod, and a connecting shaft.

[0014] The L-shaped frame is fixedly installed on the outer wall of one end of the processing shuttle box and near the top. The motor is fixedly installed on one side of the L-shaped frame. The connecting shaft is inserted inside the L-shaped frame and near the bottom of the motor. The connecting rod is located inside the processing shuttle box, and one end of the connecting shaft is inserted into the connecting rod. The motor output shaft is rotatably connected to the connecting shaft through a pulley assembly fitted at one end. The electrostatic adsorption plate is located inside the processing shuttle box and is fixedly connected to the outer wall of the connecting rod on one side. The C-shaped ring shell is fixedly installed on one end of the inner wall of the processing shuttle box and above the connecting rod.

[0015] Furthermore, a waste discharge box is installed inside the C-shaped ring shell, one end of which extends to the outside of the processing shuttle box, and a sealing plate is movably fitted on the outside of the end of the waste discharge box away from the processing shuttle box.

[0016] Furthermore, a first pneumatic rod is fixedly embedded on one side of the processing shuttle box and at the corresponding C-shaped ring shell. A scraper is fixedly installed at the telescopic end of the first pneumatic rod, and sliding rods are fixedly installed at both ends of the outer wall of the scraper. The ends of the two sliding rods away from the scraper extend to the outside of the processing shuttle box.

[0017] Furthermore, inserts are symmetrically installed at both ends of the inner walls of the two sets of suspensions. A second pneumatic rod is fixedly installed at the bottom of the inner side of each insert. A movable block is fixedly installed at the telescopic end of each second pneumatic rod. The movable block is slidably connected to the insert.

[0018] Further, the two groups of movable blocks are jointly installed with an insertion rod, an abutting line wheel is rotatably sleeved on the outside of the insertion rod, and the abutting line wheel is staggered with the position of the line guide roller.

[0019] Further, the inside bottom wall of the processing shuttle box is fixedly installed with a fixed rod at two ends, the upper ends of the two fixed rods are jointly installed with a spiral pipe, a plurality of nozzles are arranged in the spiral pipe, the plurality of nozzles are uniformly distributed along the spiral track of the spiral pipe, one end of the spiral pipe is connected with the end of the air inlet pipe, the spiral pipe is located outside the plurality of line guide rollers, and a viewing window is embedded in the inside of the side of the processing shuttle box away from the semiconductor refrigerator along the horizontal direction at equal distances.

[0020] Further, a rectangular wire port is formed in the top inside of the processing shuttle box, and a movable sealing plate is clamped in the rectangular wire port.

[0021] Further, a controller is fixedly installed on the upper outer wall of the side of the processing shuttle box close to the fixed frame, a negative pressure suction pipe is connected and installed on the top of the processing shuttle box, and an infrared temperature sensor is connected and installed on the top of the processing shuttle box close to the L-shaped frame.

[0022] The technical scheme provided by the embodiment of the present application has at least the following beneficial effects:

[0023] In the embodiment of the present application, the cooling mechanism uses helium as a cooling medium, cooperates with the semiconductor refrigerator to accurately control the temperature, and forms a uniform gas curtain around the cable through the inner spiral surface nozzles of the spiral pipe; the inert property of helium can avoid the decrease of the conductive property caused by the reaction of graphene with oxygen at high temperature; at the same time, the gas cooling has no contact pressure, and overcomes the problem of too large radial temperature difference caused by the water film barrier in the traditional water cooling and water mist cooling, and solves the problem of micro-cracks caused by temperature difference stress in the production process of graphene composite cable from the root. The two groups of electrostatic adsorption mechanisms (symmetrically arranged upward and downward) can adsorb the carbon powder on the outer surface of the graphene cable transmitted, and when the carbon powder is treated, the motors symmetrically arranged upward and downward can be staggered to drive the connecting rod to rotate through the driving belt pulley assembly in the use process, so as to promote the electrostatic adsorption plate to adsorb the cotton in the inside of the C-shaped ring shell, the first pneumatic rod in the inside of the processing shuttle box drives the scraper into the inside of the C-shaped ring shell, and the horizontally pushed scraper can remove the impurities on the adsorption surface of the electrostatic adsorption plate and introduce them into the impurity removal box, so that the overall action efficiency is high and the speed is fast. BRIEF DESCRIPTION OF DRAWINGS

[0024] The accompanying drawings are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application. In the drawings:

[0025] Figure 1 Figure 1 is a schematic diagram of the overall structure of a high-conductivity graphene power cable processing device according to an embodiment of the application.

[0026] Figure 2 Figure 2 is a schematic diagram of the overall structure of a high-conductivity graphene power cable processing device according to an embodiment of the application, from another perspective.

[0027] Figure 3 Figure 3 is a schematic diagram of the internal structure of a processing shuttle box of a high-conductivity graphene power cable processing device according to an embodiment of the application.

[0028] Figure 4 Figure 4 is a schematic diagram of the overall structure of a stringing and rolling mechanism of a high-conductivity graphene power cable processing device according to an embodiment of the application.

[0029] Figure 5 Figure 5 is a schematic diagram of the connection structure between a spiral tube and a nozzle of a high-conductivity graphene power cable processing device according to an embodiment of the application.

[0030] Figure 6 Figure 6 is a schematic diagram of the overall structure of an electrostatic adsorption mechanism of a high-conductivity graphene power cable processing device according to an embodiment of the application.

[0031] Figure 7 Figure 7 is a schematic diagram of the overall structure of a high-conductivity graphene power cable processing device according to an embodiment of the application. Figure 4 Figure 8 is an enlarged view of the structure of position A in Figure 7.

[0032] Explanation of reference signs: 1-supporting seat; 2-processing shuttle box; 3-observation window; 4-cooling mechanism; 401-semiconductor refrigerator; 402-fixing frame; 403-air inlet pipe; 404-helium gas inlet device; 5-wire mounting rolling mechanism; 501-fixing clamping block; 502-wire rolling roller; 503-suspension; 6-infrared temperature sensor; 7-electrostatic adsorption mechanism; 701-motor; 702-L-shaped frame; 703-C-shaped ring shell; 704-electrostatic adsorption plate; 705-belt pulley assembly; 706-connecting rod; 707-connecting shaft; 8-first pneumatic rod; 9-fixing rod; 10-controller; 11-second pneumatic rod; 12-inserting rod; 13-negative pressure suction pipe; 14-movable sealing plate; 15-sliding rod; 16-impurity removal box; 17-scraping plate; 18-line abutting wheel; 19-spiral pipe; 20-nozzle; 21-movable block; 22-inserting cylinder; 23-wire laying channel. DETAILED DESCRIPTION

[0033] In order to make the personnel in the art better understand the technical solutions in the embodiments of the present application, the technical solutions of the present application will be described clearly and completely below in conjunction with the drawings. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. It should be understood that these descriptions are only exemplary and are not used to limit the scope of the present application. Based on the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor should belong to the scope of protection of the present application.

[0034] In addition, in the following description, the description of well-known structures and technologies is omitted to avoid unnecessary confusion of the concepts disclosed in the present application.

[0035] The exemplary embodiments will be described in detail below with reference to the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application.

[0036] Reference is made to the drawings Figures 1 to 7 As shown, the embodiments of the present application provide a high-conductivity graphene power cable processing equipment, which comprises two groups of supporting seats 1, a processing shuttle box 2, a cooling mechanism 4, two groups of electrostatic adsorption mechanisms 7, a wire mounting rolling mechanism 5, and two groups of wire laying channels 23.

[0037] The two groups of supporting seats 1 are symmetrically installed in parallel at both ends of the bottom of the processing shuttle box 2, and are arranged equidistantly along the horizontal direction in sequence. The cooling mechanism 4 is arranged outside one end of the processing shuttle box 2. The two groups of electrostatic adsorption mechanisms 7 are arranged on the upper and lower parts of the end of the processing shuttle box 2 away from the cooling mechanism 4. The wire mounting rolling mechanism 5 is arranged in the middle of the processing shuttle box 2.

[0038] The wire-arranging and rolling mechanism 5 comprises a plurality of groups of fixed clamping blocks 501, a plurality of groups of wire-arranging rollers 502, and two groups of suspensions 503.

[0039] The two groups of suspensions 503 are fixed on the inner walls of the processing shuttle box 2, respectively. The plurality of groups of fixed clamping blocks 501 are symmetrically arranged in pairs along the horizontal direction outside the suspensions 503. The plurality of groups of wire-arranging rollers 502 are correspondingly clamped between two opposite fixed clamping blocks 501.

[0040] Referring to the drawings attached to the specification Figure 1 , Figure 2 and Figure 7 , in the embodiment of the present application, the support seat 1 provides stable support for the whole device. The processing shuttle box 2 serves as a closed space for cable processing and integrates various functional mechanisms. The wire-arranging and rolling mechanism 5 carries and transports the graphene cable. The electrostatic adsorption mechanism 7 adsorbs part of the impurities on the outer surface of the graphene cable. The wire-arranging channel 23 provides a path for the graphene cable to enter and exit the interior of the processing shuttle box 2.

[0041] Specifically, the cable enters the processing shuttle box 2 through the wire-arranging channel 23 and is supported and transported in the horizontal direction by the wire-arranging rollers 502 of the wire-arranging and rolling mechanism 5. During the transportation process, it successively undergoes cooling treatment by the cooling mechanism 4 and impurity cleaning by the electrostatic adsorption mechanism 7, and is finally output from the other end of the wire-arranging channel 23.

[0042] In one possible implementation, the cooling mechanism 4 comprises a semiconductor refrigerator 401, a fixed frame 402, an air inlet pipe 403, and a helium gas inlet device 404.

[0043] The fixed frame 402 is clamped on one side outside the semiconductor refrigerator 401. The fixed frame 402, away from one side of the semiconductor refrigerator 401, is fixedly installed on one side of the outer wall of the processing shuttle box 2. One end of the semiconductor refrigerator 401 is in communication with the inside of the air inlet pipe 403. One end of the air inlet pipe 403 extends into the interior of the processing shuttle box 2. The end of the air inlet pipe 403, away from the processing shuttle box 2, is connected with the helium gas inlet device 404. The helium gas inlet device 404 is fixedly installed on the upper end face of one of the support seats 1.

[0044] Referring to the drawings attached to the specification Figure 1 , Figure 2 and Figure 4 , in the embodiment of the present application, the fixed frame 402 is used to install the semiconductor refrigerator 401 on the outer wall of the processing shuttle box 2, so as to conveniently provide a low-temperature environment. The semiconductor refrigerator 401 is in communication with the air inlet pipe 403 through a port. The helium gas inlet device 404 delivers low-temperature gas into the interior of the processing shuttle box 2 through the lower end of the air inlet pipe 403.

[0045] Specifically, the helium gas inlet device 404 outputs helium gas, which is cooled to a set temperature by the semiconductor refrigerator 401, and is sent into the processing shuttle box 2 through the gas inlet pipe 403, directly acts on the surface of the cable to achieve uniform cooling, and avoids the temperature difference stress and the decrease of the conductivity caused by the traditional water cooling.

[0046] In a possible implementation, the electrostatic adsorption mechanism 7 includes a motor 701, an L-shaped frame 702, a C-shaped ring shell 703, an electrostatic adsorption plate 704, a belt pulley assembly 705, a connecting rod 706, and a connecting shaft 707.

[0047] The L-shaped frame 702 is fixedly installed on the outer wall of one end of the processing shuttle box 2 and close to the upper side, the motor 701 is fixedly installed on one side of the L-shaped frame 702, the connecting shaft 707 is penetratingly arranged in the L-shaped frame 702 and close to the lower side of the motor 701, the connecting rod 706 is located in the processing shuttle box 2, and one end of the connecting shaft 707 is penetratingly arranged in the connecting rod 706, the output shaft of the motor 701 is rotationally connected with the connecting shaft 707 through the belt pulley assembly 705 sleeved on one end, the electrostatic adsorption plate 704 is located in the processing shuttle box 2 and fixedly connected with the outer wall of one side of the connecting rod 706, and the C-shaped ring shell 703 is fixedly installed on the inner wall of one end of the processing shuttle box 2 and located above the connecting rod 706.

[0048] Referring to the drawings Figure 2 and Figure 5 In the embodiment of the present application, the symmetrical electrostatic adsorption plates 704 arranged on the upper and lower ends are electrified, so that the carbon powder impurities remaining on the surface of the graphene cable can be adsorbed above and below the surface, and the cleanliness during the cable processing process is ensured.

[0049] Specifically, when the impurities on the surface of the electrostatic adsorption plate 704 are cleaned, the motor 701 is started, the connecting shaft 707 is driven to rotate through the belt pulley assembly 705, the connecting rod 706 and the electrostatic adsorption plate 704 are driven to rotate to the range of the C-shaped ring shell 703, and the C-shaped ring shell 703 is internally provided with a slot adapted to the vertical overturning of the upper end of the connecting rod 706, so as to place the impurities in the C-shaped ring shell 703, and then the impurities are easily removed.

[0050] In a possible implementation, the C-shaped ring shell 703 is internally and communicatively provided with a impurity removal box 16, one end of the impurity removal box 16 extends to the outside of the processing shuttle box 2, and a sealing clamping plate is movably sleeved on the outside of one end of the impurity removal box 16 away from the processing shuttle box 2.

[0051] Referring to the drawings Figure 2 and Figure 6 In the embodiment of the present application, the impurities removed by the electrostatic adsorption mechanism 7 are collected, so as to avoid the secondary pollution caused by the accumulation of the impurities in the processing space.

[0052] Specifically, the impurities on the electrostatic adsorption plate 704 are cleaned and enter the impurity removal box 16 through the passage of the C-shaped ring shell 703. The sealing plate closes the end of the impurity removal box 16 to prevent the impurities from overflowing. The sealing plate is opened regularly to clean the impurities in the box.

[0053] In a possible implementation, a first pneumatic rod 8 is fixedly embedded on one side of the inside of the processing shuttle box 2 and corresponds to the C-shaped ring shell 703. The telescopic end of the first pneumatic rod 8 is fixedly installed with a scraper 17. The outer wall of the scraper 17 is fixedly installed with two slide rods 15 at both ends. The ends of the two slide rods 15 away from the scraper 17 extend to the outside of the processing shuttle box 2.

[0054] Referring to the accompanying drawings Figure 6 In the embodiment of the present application, the impurities adsorbed on the electrostatic adsorption plate 704 are scraped off and pushed into the impurity removal box 16, ensuring the continuous and effective work of the adsorption plate.

[0055] Specifically, when the electrostatic adsorption plate 704 adsorbs impurities, the first pneumatic rod 8 drives the scraper 17 to move horizontally along the slide rod 15 in a telescopic manner. The scraper 17 contacts the surface of the electrostatic adsorption plate 704, scrapes off the impurities, and pushes them into the C-shaped ring shell 703, and finally into the impurity removal box 16.

[0056] In a possible implementation, two groups of suspension frames 503 are symmetrically installed with plug-in barrels 22 at both ends of the inner wall. The second pneumatic rod 11 is fixedly installed at the bottom of the inner side of the plug-in barrel 22. The telescopic end of the second pneumatic rod 11 is fixedly installed with a movable block 21. The movable block 21 is in sliding connection with the plug-in barrel 22.

[0057] Referring to the accompanying drawings Figure 4 and Figure 7 In the embodiment of the present application, by adjusting the height of the movable block 21, the subsequent line abutting wheel 18 is lifted, and the conveying requirements of cables of different specifications are adapted.

[0058] Specifically, the movable block 21 is driven by the second pneumatic rod 11 to slide up and down along the inner wall of the plug-in barrel 22 in a telescopic manner, so as to adjust the height of the movable block 21 and provide a position adjustment basis for the line abutting wheel 18.

[0059] In a possible implementation, the two groups of movable blocks 21 are jointly installed with a plug-in rod 12. The line abutting wheel 18 is rotatably sleeved on the outside of the middle of the plug-in rod 12. The line abutting wheel 18 is staggered with the position of the wire rolling wheel 502.

[0060] Referring to the accompanying drawings Figure 3 and Figure 4 In the embodiment of the present application, the line abutting wheel 18 cooperates with the wire rolling wheel 502 to clamp the cable, preventing the cable from deviating or shaking during the conveying process, and ensuring the stability of the conveying.

[0061] Specifically, the plug rod 12 of the movable block 21 drives the external line wheel 18 to move, and the line wheel 18 and the line roller 502 clamp the outer surface of the graphene cable from the top and bottom directions. When the graphene cable is conveyed by the external traction winding mechanism, the line wheel 18 and the line roller 502 rotate in contact with the graphene cable, thereby reducing the friction damage.

[0062] In a possible implementation, the processing shuttle box 2 is internally provided with two fixed rods 9 fixedly installed at both ends of the bottom wall, the upper ends of the two fixed rods 9 are jointly provided with a spiral pipe 19, the spiral pipe 19 is internally provided with a plurality of nozzles 20, the plurality of nozzles 20 are uniformly distributed along the spiral track of the spiral pipe 19, one end of the spiral pipe 19 is in communication with the end of the air inlet pipe 403, the spiral pipe 19 is located outside the plurality of groups of line rollers 502, and the processing shuttle box 2 is internally provided with observation windows 3 embedded in the horizontal direction at equal distances away from the semiconductor refrigerator 401.

[0063] Referring to the drawings Figure 1 , Figure 3 and Figure 5 In the embodiment of the present application, the spiral pipe 19 and the nozzles 20 uniformly wrap the graphene cable with cooling helium, thereby improving the cooling efficiency, and the observation windows 3 facilitate real-time observation of the processing state of the graphene cable in the processing shuttle box 2.

[0064] Specifically, the low-temperature helium conveyed by the cooling mechanism 4 enters the spiral pipe 19 and is sprayed to the center through the nozzles 20 on the inner spiral surface, thereby forming an annular air curtain to uniformly wrap the graphene cable in the conveying process, thereby achieving uniform cooling. The operator can directly monitor the graphene cable conveying, cooling and impurity cleaning through the observation windows 3.

[0065] In a possible implementation, the processing shuttle box 2 is internally provided with a rectangular wire port at the top, the rectangular wire port is internally provided with a movable sealing plate 14, and two groups of wire channels 23 are respectively formed at both ends of the processing shuttle box 2.

[0066] Referring to the drawings Figure 1 and Figure 2 In the embodiment of the present application, the rectangular wire port and the movable sealing plate 14 facilitate the operation of the initial threading of the cable or the maintenance of the equipment. During threading or maintenance, the movable sealing plate 14 is opened, and the graphene cable is operated through the rectangular wire port. During normal processing, the movable sealing plate 14 is closed to ensure the sealing property of the processing space. The graphene cable enters and exits through the wire channels 23 at both ends to limit the conveying path.

[0067] In a possible implementation, the processing shuttle box 2 is fixedly installed with a controller 10 on the upper outer wall close to the fixed frame 402, the processing shuttle box 2 is fixedly installed with a negative pressure suction pipe 13 on the top, and the processing shuttle box 2 is fixedly installed with an infrared temperature sensor 6 on the top close to the L-shaped frame 702.

[0068] Referring to the drawings Figure 1 and Figure 2 The controller 10 controls the operation of each mechanism to realize automatic processing, the negative pressure suction pipe 13 can recycle the underutilized cooling helium, save energy, and the infrared temperature sensor 6 monitors the temperature in real time to provide a basis for cooling adjustment.

[0069] Specifically, the temperature inside the processing shuttle box 2 is detected by the infrared temperature sensor 6 and the data is transmitted to the controller 10, and the controller 10 adjusts the power of the semiconductor refrigerator 401 and the helium flow according to the temperature. At the same time, the action rhythm of the electrostatic adsorption mechanism 7 and other components is coordinated, the negative pressure suction pipe 13 recycles the helium in the box through the external suction device, and the recycled helium can be reused after purification.

[0070] The present application covers any substitution, modification, equivalent method and scheme made on the essence and scope of the present application. In order to make the public have a thorough understanding of the present application, specific details are described in the preferred embodiments of the present application, and the present application can also be fully understood without the description of these details to those skilled in the art. In addition, in order to avoid unnecessary confusion to the essence of the present application, well-known methods, processes, procedures, elements and circuits are not described in detail.

[0071] Finally, it should be pointed out that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application, and not to limit them. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement to part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and any changes or replacements easily thought of by those skilled in the art within the technical scope disclosed by the present application should be covered within the protection scope of the present application.

Claims

1. A high conductive graphene power cable processing apparatus, characterized by, The utility model relates to a kind of semiconductor wafer processing device, including: Two groups of support seat, processing shuttle box, cooling mechanism, two groups of electrostatic adsorption mechanism, line frame rolling mechanism, two groups of line channel; Two groups of the support seat are symmetrically installed in the bottom of processing shuttle box both ends, and are sequentially equidistantly arranged along horizontal direction, the cooling mechanism is arranged in the outside of one end of processing shuttle box, two groups of the electrostatic adsorption mechanism are respectively arranged in the inside of processing shuttle box and the upper and lower places of one end far from cooling mechanism, the line frame rolling mechanism is arranged in the inside of processing shuttle box middle; The line frame rolling mechanism includes several groups of fixed clamping block, several groups of line roller, two groups of suspension frame; Two groups of the suspension frame are respectively fixedly arranged in the inner wall of processing shuttle box both sides, and several groups of the fixed clamping block are symmetrically sequentially arranged in the outside of suspension frame both sides, and several groups of the line roller are sequentially clamped between two opposite fixed clamping blocks. The cooling mechanism includes semiconductor refrigerator, fixed frame, air inlet pipe, helium gas inlet device; The fixed frame is clamped in the outside of one side of semiconductor refrigerator, the fixed frame is fixedly installed in the outer wall of one side of processing shuttle box far from semiconductor refrigerator, one end of the semiconductor refrigerator is communicated with the inside of air inlet pipe, the air inlet pipe is extended to the inside of processing shuttle box, the air inlet pipe is connected with helium gas inlet device far from the inside of processing shuttle box, and the helium gas inlet device is fixedly installed on one side of the upper end surface of one group of support seat. The electrostatic adsorption mechanism includes motor, L-shaped frame, C-shaped ring shell, electrostatic adsorption plate, belt pulley assembly, connecting rod, connecting shaft; The L-shaped frame is fixedly installed on the outer wall of one end of processing shuttle box and is close to upper side, the motor is fixedly installed on one side of L-shaped frame, the connecting shaft is driven and penetrates in the inside of L-shaped frame and is close to lower side of motor, the connecting rod is located in the inside of processing shuttle box, and one end of the connecting shaft is penetrated into the inside of connecting rod, the motor output shaft is rotatably connected with the connecting shaft through the belt pulley assembly of one end sleeve, the electrostatic adsorption plate is located in the inside of processing shuttle box and is fixedly connected with the outer wall of connecting rod on one side, and the C-shaped ring shell is fixedly installed on the inner wall of processing shuttle box one end and is located above connecting rod.

2. The high conductive graphene power cable processing apparatus according to claim 1, wherein, The C-shaped ring shell is internally communicated with installation of the impurity removal box, the impurity removal box is extended to the outside of processing shuttle box one end, and the impurity removal box is movably sleeved with sealing clamping plate far from the outside of processing shuttle box one end.

3. The high conductive graphene power cable processing apparatus according to claim 1, wherein, The first pneumatic rod is fixedly embedded on one side of the inside of processing shuttle box and corresponds C-shaped ring shell, the scraping plate is fixedly installed on the telescopic end of the first pneumatic rod, the outer wall both ends of the scraping plate are fixedly installed with slide rod, and the slide rod is extended to the outside of processing shuttle box far from the scraping plate one end.

4. The high conductive graphene power cable processing apparatus according to claim 1, wherein, Two groups of the suspension frame inner wall both ends are respectively symmetrically installed with insertion cylinder, the second pneumatic rod is fixedly installed on the inside bottom of insertion cylinder, the movable block is fixedly installed on the telescopic end of the second pneumatic rod, and the movable block is slidably connected with insertion cylinder.

5. A high conductive graphene power cable processing apparatus according to claim 4, wherein, The insertion rod is movably sleeved with line wheel on the outside middle of the insertion rod, and the position of the line wheel is staggered with line roller.

6. The high conductive graphene power cable processing apparatus according to claim 1, wherein, The both ends of the inner bottom wall of the processing shuttle box are respectively fixedly provided with fixed rods, the upper ends of the two fixed rods are commonly provided with a spiral pipe, a plurality of nozzles are arranged in the spiral pipe, the plurality of nozzles are uniformly distributed along the spiral track of the spiral pipe, one end of the spiral pipe is communicated with the end of the air inlet pipe, the spiral pipe is located outside the several groups of wire running rollers, and a viewing window is equidistantly embedded in the inner side of the processing shuttle box away from the semiconductor refrigerator in the horizontal direction.

7. The high conductive graphene power cable processing apparatus according to claim 1, wherein, A rectangular wire port is formed in the top of the processing shuttle box, and a movable sealing plate is clamped in the rectangular wire port. Two groups of wire running channels are respectively formed at the both ends of the inner side of the processing shuttle box.

8. The high conductive graphene power cable processing apparatus according to claim 1, wherein, A controller is fixedly installed on the upper outer wall of the side of the processing shuttle box close to the fixed frame, a negative pressure suction pipe is communicated and installed on the top of the processing shuttle box, and an infrared temperature sensor is communicated and installed on the top of the processing shuttle box close to the L-shaped frame.

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