Inductor and manufacturing method thereof

Abstract

The invention provides an inductor and a manufacturing method of the inductor. The inductor comprises a magnetic core, the magnetic core comprises a magnetic core body, a plurality of pins are arranged on the side face of the magnetic core body, a gap is formed between every two adjacent pins, the two ends of each pin exceed the magnetic core body, and the height difference between every two adjacent pins is smaller than or equal to 0.1 mm. The height difference of the pins in the inductor is smaller than or equal to 0.1 mm, so that poor welding is avoided, and the quality of the inductor is guaranteed. And the positions of the pins can be freely adjusted under the condition that the pins are kept independent and are not in contact with each other, so that the structure is suitable for different PCB circuits and is convenient to assemble.

Description

Technical Field

[0001] This disclosure belongs to the field of inductor technology, specifically relating to an inductor and a method for manufacturing an inductor. Background Technology

[0002] With the development of applications such as artificial intelligence (AI), deep learning, and high-performance computing (HPC), the increased computing power of core chips has led to a continuous increase in peak power consumption and transient current. This places demands on inductors in the power conversion units of chips, requiring high current capacity, high efficiency, and fast transient response. Traditional discrete inductors are mounted on the surface of printed circuit boards (PCBs), which has problems such as increased parasitic parameters, occupied PCB area, poor heat dissipation, difficulty in integrating functions, and complex assembly. Summary of the Invention

[0003] The purpose of this disclosure is to provide an inductor and a method for manufacturing the inductor, thereby solving the problems in the prior art.

[0004] Therefore, in a first aspect, this disclosure provides an inductor comprising:

[0005] magnetic core;

[0006] The magnetic core has multiple pins disposed on its side. A gap is provided between two adjacent pins. Both ends of the pins extend beyond the magnetic core. The height difference between adjacent pins is less than or equal to 0.1 mm.

[0007] Optionally, the pin is one of a signal pin, a power pin, or a ground pin.

[0008] Optionally, the power supply pin or the ground pin has a U-shaped structure, partially covering the side of the magnetic core.

[0009] Optionally, both the power supply pin and the ground pin are U-shaped structures, covering opposite sides of the magnetic core, with a gap between them.

[0010] Optionally, the signal pin is disposed on the surface of the power supply pin, and an isolation layer is disposed between the signal pin and the power supply pin.

[0011] Optionally, the signal pin, the power pin, and the ground pin constitute a pin module, and the pin module is located on the side of the magnetic core.

[0012] Optionally, an insulating layer is provided between the power supply pin and the ground pin.

[0013] Optionally, the surfaces of the magnetic core and the pins are coated with a protective varnish.

[0014] A method for manufacturing an inductor is also provided, including the following steps:

[0015] Multiple pins are inserted into an assembly fixture, wherein the assembly fixture includes multiple grooves for placing the pins, and the bottom of the assembly fixture is flat so that the height difference of the pins is less than or equal to 0.1 mm;

[0016] Apply adhesive to the pins;

[0017] The magnetic core is placed in the assembly fixture, and the pins are attached to the side of the magnetic core by the adhesive.

[0018] A method for manufacturing an inductor is also provided, comprising the following steps: forming a pin module by means of metal injection of signal pins, power pins and ground pins, and attaching the pin module to the side of the magnetic core with an adhesive.

[0019] Beneficial effects:

[0020] (1) This disclosure provides an inductor and a method for manufacturing the inductor. By ensuring that the height difference between the pins in the inductor is less than or equal to 0.1 mm, poor soldering is avoided and the quality of the inductor is guaranteed. The positions of the pins can be freely adjusted while maintaining independence and non-contact with each other, adapting to different PCB circuits and facilitating assembly.

[0021] (2) In this disclosure, the surface area is increased and the heat dissipation capacity is improved by using the U-shaped structure of the power supply pin and the ground pin.

[0022] (3) By using metal injection, signal pins, power pins and ground pins are made into pin modules, which improves the stability and manufacturing consistency of the pin modules and facilitates installation.

[0023] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this disclosure, nor is it intended to limit the scope of this disclosure. Other features of this disclosure will become readily apparent from the following description. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this disclosure or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the structure of an embodiment 1 of an inductor disclosed herein;

[0026] Figure 2 This is a schematic diagram of the structure of an embodiment 2 of an inductor disclosed herein;

[0027] Figure 3 This is a schematic diagram of the structure of an embodiment 3 of the inductor disclosed herein;

[0028] Figure 4 This is a schematic diagram of the pin module of an embodiment 4 of an inductor in this disclosure;

[0029] Figure 5 This is a schematic diagram of the structure of an embodiment 4 of an inductor in this disclosure;

[0030] Figure 6 This is a schematic diagram of the assembly fixture for a method of manufacturing an inductor according to the present disclosure.

[0031] In the diagram, 1-magnetic core, 2-signal pin, 3-power supply pin, 4-ground pin, 5-assembly fixture, 51-groove. Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0033] The terms "first," "second," "third," "fourth," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be used interchangeably where appropriate. For example, without departing from the scope of this document, first information can also be referred to as second information, and similarly, second information can also be referred to as first information.

[0034] Depending on the context, the word "if" as used here can be interpreted as "when," "when," or "in response to determination."

[0035] Furthermore, as used herein, the singular forms “a,” “one,” and “the” are intended to also include the plural forms, unless the context indicates otherwise.

[0036] It should be further understood that the terms “comprising” or “including” indicate the presence of features, steps, operations, elements, components, items, kinds, and / or groups, but do not exclude the presence, occurrence, or addition of one or more other features, steps, operations, elements, components, items, kinds, and / or groups.

[0037] The terms “or” and “and / or” as used herein are interpreted as inclusive, or mean any one or any combination thereof. Therefore, “A, B, or C” or “A, B, and / or C” means “any one of the following: A; B; C; A and B; A and C; B and C; A, B, and C”. Exceptions to this definition occur only when combinations of elements, functions, steps, or operations are inherently mutually exclusive in some way.

[0038] Example 1:

[0039] This disclosure provides, for example Figure 1 An inductor shown includes:

[0040] Core 1 and pins.

[0041] The magnetic core 1 is made of ferrite or metal magnetic powder material and can be shaped according to requirements, such as cuboid, cylinder, polygonal prism and other irregular shapes. A conductive coil is set inside the magnetic core 1. The conductive coil is made of a highly conductive metal such as copper wire and passes through the magnetic core 1.

[0042] There are multiple pins, which are set on the side of the magnetic core 1. There is a gap between two adjacent pins. Both ends of the pins extend beyond the magnetic core 1, and the height difference between adjacent pins is less than or equal to 0.1mm.

[0043] The pins are selected from one of the following: signal pin 2, power input pin 3, or ground pin 4. The number of each type of pin can be set according to actual needs. Signal pin 2 can be selected from 0 to 20, power input pin from 0 to 10, and ground pin 4 from 0 to 10. When adjacent pins are not in contact, the spacing between them has no substantial impact on the inductor. Therefore, the pin positions can be freely set according to requirements, improving the flexibility of the inductor.

[0044] Multiple pins mounted on the same side of magnetic core 1 can be installed individually or integrated into a single unit via insulating plastic and then installed synchronously.

[0045] The connection between the pin and the magnetic core 1 can be either embedded in the pin slot or attached with adhesive.

[0046] Among them, the pin slot embedding method requires reserving a pin slot on the magnetic core 1 for embedding the pin, and embedding the pin into the pin slot.

[0047] It can be directly glued and fixed by adhesive. The adhesive can be a high temperature resistant adhesive with a low coefficient of thermal expansion, such as epoxy or silicone adhesive. Specifically, epoxy resin glue can be used.

[0048] The surfaces of magnetic core 1 and the pins are coated with protective varnish. The protective varnish is made of epoxy or polyurethane and applied as a whole, which provides moisture protection, dust protection, rust protection and insulation.

[0049] Example 2:

[0050] like Figure 2 As shown, the difference between Embodiment 2 and Embodiment 1 is that the power supply pin 3 or ground pin 4 has a U-shaped structure and is partially covered by the side of the magnetic core 1.

[0051] By increasing the surface area of ​​the pins, the impedance is reduced, while the heat dissipation capacity is improved.

[0052] Example 3:

[0053] like Figure 3 As shown, the difference between Embodiment 3 and Embodiment 2 is that both the power supply pin 3 and the ground pin 4 are U-shaped structures, which are relatively covered on both sides of the magnetic core 1. There is a gap between the power supply pin 3 and the ground pin 4. The signal pin 2 is disposed on the surface of the power supply pin 3. An isolation layer is disposed between the signal pin 2 and the power supply pin 3.

[0054] A gap is provided between the power supply pin 3 and the ground pin 4 to prevent short circuits. The isolation layer can be insulating varnish, tape, or Mylar sheet, which fixes the signal pin 2 to the surface of the power supply pin 3 and insulates it to prevent short circuits.

[0055] Example 4:

[0056] like Figure 4-5 As shown, the difference between Embodiment 4 and Embodiment 3 is that an insulating layer is provided between the power supply pin 3 and the ground pin 4, and the signal pin 2, power supply pin 3 and ground pin 4 constitute a pin module, which is located on the side of the magnetic core 1.

[0057] The signal pin 2, power pin 3, and ground pin 4 are assembled into a pin module by metal injection, which facilitates control of the pin height difference and allows for quick pin installation.

[0058] Comparative Example 1:

[0059] The pins and magnetic core 1 are wrapped by a buried magnetic process. After the magnetic core 1 is packaged, holes are drilled around the pins and copper is deposited by CVD to cover the inside of the through holes with a copper layer.

[0060] Performance testing,

[0061] Performance tests were performed on Examples 1-4 and Comparative Example 1, measuring inductance, power supply impedance, grounding impedance, and overall inductance. The dimensions of Examples 1-4 and the Comparative Example were all 9.9 × 8.9 × 3.0 mm. Inductance values ​​were measured using a WK3260B precision magnetic component analyzer at 1 MHz and 1 V. Power supply impedance and grounding impedance were measured using an RM3542 microohmmeter. Inductance was measured using a WK3260B with a WK3265B DC bias unit under 45 ADC conditions.

[0062] The test results are shown in the table below.

[0063] Inductance value power supply impedance Grounding impedance 45A inductance Example 1 85nH 0.09mΩ 0.04mΩ 55nH Example 2 83.3nH 0.09mΩ 0.96mΩ 53.5nH Example 3 81nH 0.96mΩ 0.96mΩ 52nH Example 4 81nH 0.96mΩ 0.96mΩ 52nH Comparative Example 1 72nH 0.3mΩ 0.25mΩ 40nH

[0064] According to the test results, the inductance values ​​and inductance quantities of Examples 1-4 are all greater than those of Comparative Example 1, while the power supply impedance and grounding impedance are both less than those of Comparative Example 1, thus achieving better inductance performance compared to the structure of Comparative Example 1.

[0065] The inductors of Examples 1-4 have the following beneficial effects compared to Comparative Example 1:

[0066] 1. Improved electrical performance: Significantly reduces parasitic inductance and resistance, effectively suppressing voltage spikes and losses.

[0067] 2. Improved heat dissipation performance: The pin design creates multiple heat conduction paths, improving the module's cooling efficiency.

[0068] 3. Space utilization optimization: Vertically integrated pins save PCB footprint.

[0069] 4. Simplified manufacturing process: Avoids multiple soldering and mounting steps, improving mass production yield and reliability.

[0070] 5. Strong module functionality integration: It is easy to integrate sensing, protection and control functions to realize intelligent power modules.

[0071] On the other hand, a method for manufacturing an inductor is also provided, including the following steps:

[0072] S101. Insert multiple pins into assembly fixture 5.

[0073] Among them, such as Figure 6 As shown, the assembly fixture 5 includes multiple grooves 51 for placing pins. The bottom of the assembly fixture 5 is a flat surface so that the height difference of the pins is less than or equal to 0.1 mm.

[0074] S102. Apply adhesive to the pins;

[0075] Among them, the adhesive can be selected as a high-temperature resistant adhesive with a low coefficient of thermal expansion, such as epoxy or silicone adhesives, specifically epoxy resin adhesive.

[0076] S103. Place the magnetic core into the assembly fixture 5, and attach the pins to the side of the magnetic core with adhesive.

[0077] Since the pins have already been arranged, you only need to put the magnetic core in and glue it to fix the pins, and ensure that the height difference of the pins is less than or equal to 0.1mm.

[0078] Another method for manufacturing an inductor is also provided, including the following steps:

[0079] S201: Signal pins, power pins, and ground pins are assembled into a pin module by metal ejection.

[0080] The signal pins, power pins, and ground pins are isolated by epoxy resin within the pin module. Epoxy resin has adhesive properties, which helps to bond the pins and inductors together. Simultaneously, epoxy resin itself is an insulating medium, which solves the insulation impedance problem, ensuring that the impedance between the pin and the conductor is greater than 200 megohms at 60V.

[0081] S202. Attach the pin module to the side of the magnetic core using adhesive.

[0082] The pin module is constructed by ejecting metal to form signal pins, power pins, and ground pins, which facilitates control over the height difference of the pins and allows for quick pin installation.

[0083] Finally, it should be noted that other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This disclosure is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein, and is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and alterations may be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. An inductor, characterized in that, include: magnetic core; The magnetic core has multiple pins disposed on its side. A gap is provided between two adjacent pins. Both ends of the pins extend beyond the magnetic core. The height difference between adjacent pins is less than or equal to 0.1 mm.

2. An inductor according to claim 1, characterized in that, The pin is one of a signal pin, a power pin, or a ground pin.

3. An inductor according to claim 2, characterized in that, The power supply pin or the ground pin has a U-shaped structure and partially covers the side of the magnetic core.

4. An inductor according to claim 3, characterized in that, Both the power supply pin and the ground pin are U-shaped structures, covering the two sides of the magnetic core respectively, and a gap is provided between the power supply pin and the ground pin.

5. An inductor according to claim 4, characterized in that, The signal pin is disposed on the surface of the power pin, and an isolation layer is provided between the signal pin and the power pin.

6. An inductor according to claim 5, characterized in that, The signal pin, the power pin, and the ground pin constitute a pin module, which is located on the side of the magnetic core.

7. An inductor according to claim 5, characterized in that, An insulating layer is provided between the power supply pin and the ground pin.

8. An inductor according to any one of claims 1-7, characterized in that, The surfaces of the magnetic core and the pins are coated with protective paint.

9. A method for manufacturing an inductor, characterized in that, Includes the following steps: Multiple pins are inserted into an assembly fixture, wherein the assembly fixture includes multiple grooves for placing the pins, and the bottom of the assembly fixture is flat so that the height difference of the pins is less than or equal to 0.1 mm; Apply adhesive to the pins; The magnetic core is placed in the assembly fixture, and the pins are attached to the side of the magnetic core by the adhesive.

10. A method for manufacturing an inductor, characterized in that, The process includes the following steps: forming a pin module by ejecting signal pins, power pins, and ground pins using metal injection, and attaching the pin module to the side of the magnetic core using an adhesive.

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