Tray placing equipment and tray placing method

By designing the lifting suction cup of the receiving mechanism and the coordinated movement of the three-axis moving pair, the problem of damage to non-contact semiconductor components during the tray placement process was solved, achieving safe placement of components and improving yield.

CN120878614APending Publication Date: 2025-10-31CHANGZHOU KERUIER TECH CO LTD
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Patent Information

Application Number
CN202511019963.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-07-23
Publication Date
2025-10-31

AI Technical Summary

Technical Problem

Existing tray placement methods can easily lead to damage to non-contact semiconductor components during the tray placement process, especially due to uneven surfaces causing them to fall or be impacted.

Method used

The lifting suction cup of the receiving mechanism grabs the bottom of the component and places it in the bearing cavity during the descent. The safe placement of the component is achieved by combining the coordinated movement of the three-axis sliding joint and the linear sliding joint.

Benefits of technology

The design of the receiving mechanism avoids damage to components during the tray placement process, improving yield and tray placement safety.

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Abstract

The invention belongs to the technical field of semiconductor element packaging, and particularly relates to disc placing equipment and a disc placing method, and the disc placing equipment comprises a carrying disc which is provided with a plurality of bearing cavities, and the bottoms of the bearing cavities are arranged in a penetrating manner; the conveying pair is suitable for conveying the loading disc; the moving mechanism is erected above the conveying pair, and the moving mechanism comprises a three-axis moving pair; the grabbing mechanism is arranged at the moving end of the three-axis moving pair, and the grabbing mechanism is suitable for grabbing the element and moves to the position above the carrying disc along with the moving mechanism; the bearing mechanism is arranged below the moving pair, the bearing mechanism comprises a bearing suction cup arranged in a lifting mode, and the bearing suction cup is suitable for ascending and stretching out of the bearing cavity to adsorb the bottom of the element and descending to enable the element to be placed in the bearing cavity; in short, after the grabbing mechanism grabs the element and moves the element to a certain height above the carrying disc, the bearing mechanism is lifted, the bottom of the element is adsorbed through the bearing mechanism, and then the element is descended, so that the element is safely placed in the bearing cavity, and the disc arrangement of the element is completed.
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Description

Technical Field

[0001] This invention belongs to the field of semiconductor component packaging technology, and specifically relates to a tray-stacking device and tray-stacking method. Background Technology

[0002] Non-contact semiconductor devices are a class of electronic devices that function by sensing changes in physical quantities (such as magnetic fields, light, and electric fields) rather than through direct electrical contact. They offer significant advantages in avoiding physical wear, improving hygiene and safety, and adapting to complex environments, and are widely used in automotive, industrial, and consumer electronics fields.

[0003] In the production process of non-contact semiconductor components, the components need to be placed on a tray for subsequent soldering and packaging. Existing tray placement methods usually involve gripping the components with suction cups or pneumatic grippers and then placing them into the carrier tray via a three-axis locating pair. However, when using suction cups, the components are prone to falling and being damaged because the surface of the components is usually uneven. When using pneumatic grippers, the carrier tray has a bearing cavity to limit the position of the components, which can cause the pneumatic movement to be blocked by the side walls of the bearing cavity. The components need to be lowered from a certain height, which can easily lead to impact damage to the components.

[0004] Therefore, how to avoid damage to components during tray placement is a technical problem that urgently needs to be solved in this field.

[0005] It should be noted that the information disclosed in this background section is only for understanding the background technology of the present application concept, and therefore, the above description is not considered to constitute prior art information. Summary of the Invention

[0006] This disclosure provides at least one tray-setting device and tray-setting method.

[0007] In a first aspect, embodiments of this disclosure provide a tray-stacking device, comprising: a carrier tray having a plurality of carrying cavities thereon, the bottom of the carrying cavities being through-through; a conveying pair adapted to convey the carrier tray; a moving mechanism mounted above the conveying pair, the moving mechanism including a three-axis moving pair; a gripping mechanism disposed at the moving end of the three-axis moving pair, the gripping mechanism being adapted to grip an element and move with the moving mechanism above the carrier tray; and a receiving mechanism disposed below the moving pair, the receiving mechanism including a receiving suction cup that is raised and lowered, the receiving suction cup being adapted to rise and extend out of the carrying cavity to adsorb the bottom of the element, and to descend to place the element in the carrying cavity.

[0008] In one optional embodiment, the bearing cavities are arranged in a matrix; the receiving mechanism further includes a linear sliding pair, the moving end of which is provided with a first lifting cylinder, and the receiving suction cup is provided at the lifting end of the first lifting cylinder.

[0009] In one alternative embodiment, the receiving suction cup includes a base and a suction nozzle; the suction nozzle is inserted into the top of the base and communicates with it through a gas flow channel that penetrates the base to form a gas source interface; and the suction nozzles are arranged longitudinally, and the number of suction nozzles is equal to the number of each row of bearing cavities.

[0010] In one optional embodiment, the suction nozzle is provided with a plurality of columns, and the number of columns of the bearing cavity is an integer multiple of the number of columns of the suction nozzle.

[0011] In one optional embodiment, the moving end of the linear sliding pair is provided with a second lifting cylinder, and the lifting end of the second lifting cylinder is provided with a limit baffle, which is adapted to rise to block the carrier plate.

[0012] In one optional embodiment, the conveying pair includes a pair of support plates, the inner sidewalls of the support plates are provided with a plurality of pulleys, a conveyor belt is wound around the pulleys, the conveyor belt is adapted to support and convey the pallet; and a drive motor is provided at the bottom of the support plates, a drive wheel is provided on the output shaft of the drive motor, and the conveyor belt is wound around the drive wheel.

[0013] In one optional embodiment, a pair of positioning holes are provided at the top of both ends of the carrier plate; positioning plates are respectively provided on the outer side wall of the support plate, and the positioning plates are connected to the support plate by a cylinder to enable the positioning plates to be raised and lowered; and positioning pins are provided at the bottom of the positioning plates, and the positioning pins are adapted to be lowered and inserted into the positioning holes to position the carrier plate.

[0014] In one optional embodiment, the top of the support plate is provided with limiting strips, the spacing of which is equal to the width of the carrier plate, to limit the carrier plate, and the sidewall of the limiting strips is provided with a through notch; and the sidewall of the support plate is provided with an infrared sensor, the detection end of which faces the through notch.

[0015] In one optional embodiment, the gripping mechanism includes a plurality of pneumatic grippers arranged in parallel, the pneumatic grippers being disposed at the moving end of a three-axis sliding pair for gripping elements.

[0016] Secondly, this disclosure also provides a plating method, including: In step S1, the pneumatic gripper grabs the component at the initial position, and at the same time the carrier tray enters the conveyor pair and is conveyed by the conveyor pair to the point where it is detected by the infrared sensor. The limit baffle rises to block the carrier tray, and the initial positioning of the carrier tray is completed. In step S2, the positioning plate is lowered by the cylinder to allow the positioning pin to be inserted into the positioning hole, thus completing the precise positioning of the carrier plate. At the same time, the limit baffle is lowered back to the initial position. Step S3: After the three-axis traverse joint drives the pneumatic gripper to move above the first row of the carrier, it descends to the designated position. Step S4: The base rises, the first row of nozzles adsorbs the component, and at the same time the pneumatic clamp releases the component and returns to the initial position to pick up the component. Step S5: After the three-axis moving pair drives the pneumatic gripper to move above the second row of the carrier, it descends to the designated position so that the nozzles of the second row can pick up the components until the nozzles are full of components. Step S6: The base descends to allow the component to fall into the carrier cavity, while the suction nozzle releases the component. Step S7: The linear translating pair drives the base to translate. Step S8: Repeat steps 3 to 7 until the carrier cavity is full of components; In step S9, the positioning plate is raised by the cylinder, and the carrier is delivered by the conveyor.

[0017] The beneficial effect of this invention is that the tray placement device and method use a gripping mechanism to grip the component, move it to a certain height above the carrier plate, raise the receiving mechanism, and then lower it to safely place the component in the carrier cavity, thus completing the tray placement of the component.

[0018] Other features and advantages of the invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention are realized and obtained in accordance with the structures particularly pointed out in the description, claims and drawings.

[0019] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, preferred embodiments are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0020] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0021] Figure 1 A perspective view of a tray-stacking device provided in an embodiment of this disclosure; Figure 2 A perspective view of a conveying pair and a receiving mechanism provided for an embodiment of this disclosure; Figure 3 A perspective view of a conveying pair and a receiving mechanism provided for an embodiment of this disclosure; Figure 4 for Figure 3 Enlarged view of point A in the middle; Figure 5 A perspective view of a receiving mechanism provided in an embodiment of this disclosure; Figure 6 This is a perspective view of a suction cup provided in an embodiment of the present disclosure.

[0022] In the picture: 1. Carrier tray; 11. Carrier cavity; 12. Positioning hole; 2. Conveyor pair; 21. Support plate; 21a. Pulley; 21b. Conveyor belt; 21c. Limiting strip; 21d. Through notch; 21e. Infrared sensor; 22. Drive motor; 22a. Drive wheel; 23. Positioning plate; 23a. Positioning pin; 3. Moving mechanism; 4. Gripping mechanism; 41. Pneumatic gripper; 5. Receiving mechanism; 51. Receiving suction cup; 51a. Base; 51b. Suction nozzle; 51c. Gas flow channel; 51d. Air source interface; 52. Linear moving pair; 53. First lifting cylinder; 54. Second lifting cylinder; 54a. Limit baffle; 6. Components. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0024] In this document, when it is mentioned that a first component is located on a second component, this can mean that the first component can be directly formed on the second component, or that a third component can be inserted between the first and second components. Furthermore, in the accompanying drawings, the thickness of the components may be exaggerated or reduced for the purpose of effectively describing the technical content.

[0025] In this document, when an element or layer is referred to as “located,” “joined to,” “connected to,” “attached to,” or “coupled to” another element or layer, it may be directly located, joined, connected, attached to, or coupled to the other element or layer, or there may be intermediate elements or layers present. Conversely, when an element is referred to as “directly on another element or layer,” “directly joined to,” “directly connected to,” “directly attached to,” or “directly coupled to” another element or layer, there may be no intermediate elements or layers present. Other terms used to describe relationships between elements should be interpreted in a similar manner (e.g., “between” versus “directly between,” “adjacent” versus “directly adjacent,” etc.). As used herein, the term “and / or” includes any and all combinations of one or more of the related listed items.

[0026] In this document, exemplary embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings. As used herein, expressions such as “at least one of…” modify the entire list of elements when following a list of elements, rather than individual elements in the list. For example, the expression “at least one of a, b, and c” should be understood to include only a, only b, only c, both a and b, both a and c, both b and c, or all of a, b, and c.

[0027] The terminology used herein is for the purpose of describing specific exemplary configurations only and is not intended to be limiting. As used herein, the singular articles “a,” “an,” and “the” may also be intended to include plural forms unless otherwise clearly stated herein. The terms “comprising,” “including,” and “having” are inclusive and thus specify the presence of features, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein should not be construed as requiring them to be performed in the specific order discussed or shown, unless specifically identified as such. Additional or alternative steps may be employed.

[0028] As used herein, the phrases “in one embodiment,” “according to one embodiment,” “in some embodiments,” etc., generally refer to the fact that a particular feature, structure, or characteristic following the phrase can be included in at least one embodiment of this disclosure. Therefore, a particular feature, structure, or characteristic can be included in more than one embodiment of this disclosure, such that these phrases do not necessarily refer to the same embodiment. As used herein, the terms “example,” “exemplary,” etc., are used to “serve as an example, instance, or illustration.” Any implementation, aspect, or design described herein as “example” or “exemplary” is not necessarily to be construed as preferred or superior to other implementations, aspects, or designs. Rather, the use of the terms “example,” “exemplary,” etc., is intended to present concepts in a specific manner.

[0029] Research has revealed that components in existing technologies are prone to damage during the tray placement process, leading to a decrease in yield. This is the problem and objective of the invention.

[0030] Based on the above research, this disclosure provides a tray placement device and method. By lifting and lowering the receiving mechanism to pick up the components on the gripping mechanism, the components are stably placed in the bearing cavity to ensure safe tray placement of the components.

[0031] The shortcomings of the above solutions are the result of the inventor's practical experience and careful research. Therefore, the discovery process of the above problems and the solutions proposed in this disclosure should be considered as the inventor's contribution to this disclosure.

[0032] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0033] The following detailed description of some embodiments of the present invention is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0034] See Figures 1 to 6 This invention illustrates a tray placement device, comprising: a carrier tray 1 having a plurality of bearing cavities 11, the bottom of which is through-hole; a conveying pair 2 adapted to convey the carrier tray 1; a moving mechanism 3 mounted above the conveying pair 2, the moving mechanism 3 including a three-axis moving pair; a gripping mechanism 4 disposed at the moving end of the three-axis moving pair, the gripping mechanism 4 adapted to grip an element 6 and move with the moving mechanism 3 above the carrier tray 1; and a receiving mechanism 5 disposed below the moving pair, the receiving mechanism 5 including a lifting and lowering receiving suction cup 51 adapted to rise and extend out of the bearing cavity 11 to adsorb the bottom of the element 6, and then lower to place the element 6 inside the bearing cavity 11. In short, the gripping mechanism 4 grips the element 6, moves it to a certain height above the carrier tray 1, the receiving mechanism 5 rises, the receiving mechanism 5 adsorbs the bottom of the element 6, and then lowers to safely place the element 6 inside the bearing cavity 11, thus completing the tray placement of the element 6.

[0035] In some embodiments, the bearing cavities 11 are arranged in a matrix; the receiving mechanism 5 further includes a linear sliding pair 52, the moving end of the linear sliding pair 52 is provided with a first lifting cylinder 53, and the receiving suction cup 51 is provided at the lifting end of the first lifting cylinder 53; in short, the first lifting cylinder 53 moves linearly following the linear sliding pair 52, and the receiving suction cup 51 rises / falls following the piston rod of the first lifting cylinder 53.

[0036] In some embodiments, the receiving suction cup 51 includes a base 51a and a suction nozzle 51b; the suction nozzle 51b is inserted into the top of the base 51a and communicates with it through a gas flow channel 51c, which penetrates the base 51a to form a gas source interface 51d; and the suction nozzles 51b are arranged longitudinally, and the number of suction nozzles 51b is equal to the number of each row of bearing cavities 11; in short, the suction nozzles 51b are arranged in rows, and after each row of suction nozzles 51b rises, it can cover each row of bearing cavities 11 to complete the suction of the component 6.

[0037] In some embodiments, the suction nozzle 51b is provided with a plurality of columns, and the number of columns of the carrier cavity 11 is an integer multiple of the number of columns of the suction nozzle 51b; in short, the arrangement of a plurality of columns of suction nozzle 51b makes it possible to complete the placement of the carrier plate 1 by only needing to translate an integer number of times.

[0038] In some embodiments, the moving end of the linear sliding pair 52 is provided with a second lifting cylinder 54, and the lifting end of the second lifting cylinder 54 is provided with a limit baffle 54a. The limit baffle 54a is adapted to rise to block the carrier plate 1. In short, when the carrier plate 1 approaches the receiving mechanism 5, the limit baffle 54a rises to block the carrier plate 1.

[0039] In some embodiments, the conveying pair 2 includes a pair of support plates 21. A plurality of pulleys 21a are provided on the inner sidewall of each support plate 21. A conveyor belt 21b is wound around each pulley 21a and is adapted to support and convey the pallet 1. A drive motor 22 is provided at the bottom of each support plate 21. A drive wheel 22a is provided on the output shaft of the drive motor 22, and the conveyor belt 21b is wound around the drive wheel 22a. In short, pulleys 21a are provided on the inner side of the support plate 21, a conveyor belt 21b is wound around each pulley 21a, and the conveyor belt 21b is wound around the drive wheel 22a. The drive motor 22 drives the drive wheel 22a to rotate, thereby driving the conveyor belt 21b to complete the conveying of the pallet 1.

[0040] In some embodiments, a pair of positioning holes 12 are provided at the top of both ends of the carrier plate 1; positioning plates 23 are respectively provided on the outer side wall of the support plate 21, and the positioning plates 23 are connected to the support plate 21 by a cylinder so that the positioning plates 23 are raised and lowered; and a positioning pin 23a is provided at the bottom of the positioning plate 23, the positioning pin 23a being adapted to descend and insert into the positioning hole 12 to position the carrier plate 1; in short, when the carrier plate is blocked by the limiting baffle 54a, the positioning plate 23 descends so that the positioning pin 23a is inserted into the positioning hole 12 to complete the precise positioning of the carrier plate 1, and then the limiting baffle 54a descends; furthermore, the head of the positioning pin 23a is set to be conical so that when the head of the positioning pin 23a is inserted into the positioning hole 12, the positioning hole 12 and the positioning pin 23a can achieve self-centering.

[0041] In some embodiments, the top of the support plate 21 is provided with limiting strips 21c, the spacing of the limiting strips 21c being equal to the width of the tray 1, to limit the tray 1, and the sidewall of the limiting strips 21c is provided with a through notch 21d; and the sidewall of the support plate 21 is provided with an infrared sensor 21e, the detection end of the infrared sensor 21e facing the through notch 21d; in short, the limiting strips 21c at the top of the support plate 21 are suitable for limiting the tray 1, and the drying sensor on the sidewall of the support plate 21 is suitable for detecting whether the tray 1 is accurately conveyed to the position of the receiving mechanism 5.

[0042] In some embodiments, the gripping mechanism 4 includes a plurality of pneumatic grippers 41 arranged in parallel. The pneumatic grippers 41 are disposed at the moving end of the three-axis translating joint to grip the element 6. In short, the pneumatic grippers complete lifting and translating operations through the three-axis translating joint.

[0043] See Figures 1 to 6 This illustrates a plating method, including: In step S1, the pneumatic gripper 41 grips the component 6 at the initial position, and at the same time, the carrier plate 1 enters the conveyor pair 2 and is conveyed by the conveyor pair 2 to the point where it is detected by the infrared sensor 21e. The limit baffle 54a rises to block the carrier plate 1, and the initial positioning of the carrier plate 1 is completed. In step S2, the positioning plate 23 is lowered by the cylinder so that the positioning pin 23a is inserted into the positioning hole 12, thus completing the precise positioning of the carrier plate 1. At the same time, the limiting baffle 54a is lowered back to the initial position. Step S3: After the three-axis traverse joint drives the pneumatic gripper 41 to move above the first row of the carrier plate 1, it descends to the designated position. In step S4, the base 51a rises, the first row of suction nozzles 51b adsorbs the element 6, and at the same time the pneumatic gripper 41 releases the element 6 and returns to the initial position to grip the element 6. Step S5: After the three-axis moving pair drives the pneumatic gripper 41 to move above the second row of the carrier plate 1, it descends to the designated position so that the suction nozzle 51b of the second row can adsorb the element 6 until the suction nozzle 51b is full of the element 6. In step S6, the base 51a descends to allow the component 6 to fall into the bearing cavity 11, while the suction nozzle 51b releases the component 6. Step S7: The linear sliding joint 52 drives the base 51a to translate. Step S8, repeat steps 3 to 7 until the carrier cavity 11 is filled with element 6; In step S9, the positioning plate 23 is raised by the cylinder, and the carrier plate 1 is sent out by the conveyor pair 2.

[0044] In the description of the embodiments of the present invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components 6. For those skilled in the art, the specific meaning of the above terms in the present invention can be understood according to the specific circumstances.

[0045] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are used only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element 6 referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, terms such as "first," "second," and other numerical terms used herein do not imply order or sequence unless expressly indicated herein. Therefore, without departing from the teachings of the exemplary embodiments, the first element, component, region, layer, or segment discussed above may be referred to as a second element, component, region, layer, or segment.

[0046] Spatially relative terms, such as “inside,” “outside,” “below,” “below,” “down,” “above,” “up,” etc., may be used herein to describe the relationship between one element or feature illustrated in the figures and another element or feature. In addition to the orientations depicted in the figures, spatially relative terms may be intended to cover different orientations of the device in use or operation. For example, if the device in the figure is flipped, an element described as “below” or “below” other elements or features would be oriented as “above” other elements or features. Thus, the example term “below” can cover both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein are interpreted accordingly.

[0047] In the above discussion, unless otherwise stated, when used to describe numerical values, the terms “about,” “approximately,” “basically,” etc., indicate a change of + / - 10% in that value.

[0048] Based on the above-described preferred embodiments of the present invention, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the inventive concept. The technical scope of this invention is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A tray-stacking device, characterized in that, include: A carrier disk (1) has several bearing cavities (11) formed thereon, with the bottom of each bearing cavity (11) penetrating through it; Conveyor pair (2), which is suitable for conveying carrier plate (1); The moving mechanism (3) is mounted above the conveying pair (2), and the moving mechanism (3) includes a three-axis moving pair; A gripping mechanism (4) is provided at the moving end of the three-axis sliding pair. The gripping mechanism (4) is adapted to grip the element (6) and moves with the moving mechanism (3) above the carrier (1). The receiving mechanism (5) is disposed below the movable pair. The receiving mechanism (5) includes a receiving suction cup (51) that is raised and extended from the bearing cavity (11) to adsorb the bottom of the element (6) and lower to place the element (6) in the bearing cavity (11).

2. The tray-stacking device as described in claim 1, characterized in that, The bearing cavities (11) are arranged in a matrix; The receiving mechanism (5) further includes a linear sliding pair (52), the moving end of which is provided with a first lifting cylinder (53), and the receiving suction cup (51) is provided at the lifting end of the first lifting cylinder (53).

3. The tray-stacking device as described in claim 2, characterized in that, The receiving suction cup (51) includes a base (51a) and a suction nozzle (51b). The suction nozzle (51b) is inserted into the top of the base (51a) and connected through a gas flow channel (51c), which penetrates the base (51a) to form a gas source interface (51d); and, The nozzles (51b) are arranged longitudinally, and the number of nozzles (51b) is equal to the number of each row of bearing cavities (11).

4. The tray-stacking device as described in claim 3, characterized in that, The suction nozzle (51b) is provided with several columns, and the number of columns of the bearing cavity (11) is an integer multiple of the number of columns of the suction nozzle (51b).

5. The tray-stacking device as described in claim 2, characterized in that, The moving end of the linear sliding pair (52) is provided with a second lifting cylinder (54), and the lifting end of the second lifting cylinder (54) is provided with a limit baffle (54a). The limit baffle (54a) is adapted to rise to block the carrier plate (1).

6. The tray-stacking device as described in claim 1, characterized in that, The conveying pair (2) includes a pair of support plates (21), the inner sidewalls of which are provided with a plurality of pulleys (21a), a conveyor belt (21b) is wound around the pulleys (21a), and the conveyor belt (21b) is adapted to support and convey the tray (1); and, The bottom of the support plate (21) is provided with a drive motor (22), and a drive wheel (22a) is provided on the output shaft of the drive motor (22). The conveyor belt (21b) is wound around the drive wheel (22a).

7. The tray-stacking device as described in claim 6, characterized in that, A pair of positioning holes (12) are provided at the top of both ends of the carrier disk (1). The outer side wall of the support plate (21) is provided with positioning plates (23), and the positioning plates (23) are connected to the support plate (21) by cylinders so that the positioning plates (23) can be raised and lowered; and, The bottom of the positioning plate (23) is provided with a positioning pin (23a), which is adapted to be lowered and inserted into the positioning hole (12) to position the carrier plate (1).

8. The tray-stacking device as described in claim 7, characterized in that, The top of the support plate (21) is provided with limiting strips (21c), the spacing of the limiting strips (21c) being equal to the width of the carrier plate (1) to limit the carrier plate (1), and the sidewalls of the limiting strips (21c) are provided with through notches (21d); and, An infrared sensor (21e) is provided on the side wall of the support plate (21), with the detection end of the infrared sensor (21e) facing the through-hole (21d).

9. The tray-stacking device as described in claim 1, characterized in that, The gripping mechanism (4) includes several pneumatic grippers (41) arranged in parallel. The pneumatic grippers (41) are located at the moving end of the three-axis moving pair to grip the element (6).

10. A plating method, characterized in that, include: In step S1, the pneumatic gripper (41) grips the component (6) at the initial position, and at the same time the carrier (1) enters the conveyor pair (2) and is conveyed by the conveyor pair (2) to be detected by the infrared sensor (21e). The limit baffle (54a) rises to block the carrier (1), and the initial positioning of the carrier (1) is completed. In step S2, the positioning plate (23) is lowered by the cylinder so that the positioning pin (23a) is inserted into the positioning hole (12) to complete the precise positioning of the carrier plate (1), while the limiting baffle (54a) is lowered back to the initial position. Step S3: After the three-axis moving pair drives the pneumatic gripper (41) to move above the first row of the carrier (1), it descends to the designated position; In step S4, the base (51a) rises, the first row of suction nozzles (51b) adsorbs the element (6), and at the same time the pneumatic gripper (41) releases the element (6) and returns to the initial position to grip the element (6). Step S5: After the three-axis moving pair drives the pneumatic gripper (41) to move above the second row of the carrier (1), it descends to the designated position so that the suction nozzle (51b) of the second row can adsorb the element (6) until the suction nozzle (51b) is full of the element (6). In step S6, the base (51a) descends to allow the component (6) to fall into the bearing cavity (11), while the suction nozzle (51b) releases the component (6). In step S7, the linear sliding joint (52) drives the base (51a) to translate. Step S8, repeat steps 3 to 7 until the carrier cavity (11) is filled with the component (6). In step S9, the positioning plate (23) is raised by the cylinder, and the carrier plate (1) is sent out by the conveyor pair (2).