Electronic device and method of manufacturing same

Abstract

An electronic device and a method of manufacturing the electronic device. In one example, an electronic device includes a substrate including a top side, a bottom side, a dielectric structure, and a conductive structure; a first electronic component over the top side of the substrate and coupled with the conductive structure, where the first electronic component includes a first side facing the substrate and a second side facing away from the substrate; an encapsulant over the top side of the substrate and covering a lateral side of the first electronic component; a cover over the top side of the substrate and over the first electronic component; and an adhesive between the second side of the first electronic component and an inner side of the cover. Other examples and related methods are also disclosed herein.

Description

Technical Field

[0001] This disclosure generally relates to electronic devices, and more specifically to electronic devices and methods for manufacturing electronic devices. Background Technology

[0002] Previous electronic packaging and the methods used to form electronic packages were inappropriate, for example, causing excessively high costs, reduced reliability, relatively low performance, or excessively large package sizes. By comparing conventional and traditional methods with this disclosure and referring to the drawings, those skilled in the art will understand the other limitations and disadvantages of these methods. Summary of the Invention

[0003] This disclosure provides an electronic device comprising: a substrate including a top side, a bottom side, a dielectric structure, and a conductive structure; a first electronic component over the top side of the substrate and coupled to the conductive structure, wherein the first electronic component includes a first side facing the substrate and a second side facing away from the substrate; an encapsulation over the top side of the substrate and covering a lateral side of the first electronic component; a cover over the top side of the substrate and over the first electronic component; and an adhesive between the second side of the first electronic component and an inner side of the cover. The electronic device includes a connector between a contact pad on the conductive structure and the first side of the first electronic component, wherein the first electronic component is coupled to the conductive structure via the connector. In the electronic device, the encapsulation is between the top side of the substrate and the first side of the first electronic component and covers a lateral side of the connector. In the electronic device, the cover includes a protrusion on an inner side of the cover, and the adhesive is disposed between the second side of the first electronic component and the protrusion. The electronic device includes a second electronic component above the top side of the substrate and coupled to the conductive structure, wherein the adhesive is disposed between the top side of the second electronic component and the inner side of the cover. In the electronic device, the cover includes a protrusion on the inner side of the cover and a sidewall at the peripheral side of the cover, and the adhesive is between the top side of the second electronic component and the inner side of the cover, and between the protrusion and the sidewall. In the electronic device: the adhesive includes a first adhesive pattern and a second adhesive pattern; the first adhesive pattern is between the second side of the first electronic component and the inner side of the cover; the second adhesive pattern is between the top side of the second electronic component and the inner side of the cover; and the first adhesive pattern and the second adhesive pattern are discontinuous. In the electronic device, the first adhesive pattern includes a first adhesive material, and the second adhesive pattern includes a second adhesive material different from the first adhesive material. In the electronic device, the cover includes a sidewall at the peripheral side of the cover, and the outer lateral side of the sidewall is not covered by the encapsulation. In the electronic device, the cover includes a sidewall at its peripheral side, and the outer lateral side of the sidewall is covered by a portion of the encapsulation. The electronic device includes a pillar above the top side of the substrate, wherein the adhesive is between the top side of the pillar and the inner side of the cover. In the electronic device, the outer lateral side of the pillar is not covered by the encapsulation. In the electronic device, the outer lateral side of the pillar is covered by a portion of the encapsulation. In the electronic device, the portion of the encapsulation is between the inner side of the cover and the top side of the substrate.

[0004] This disclosure provides a method for manufacturing an electronic device, comprising: providing a cover including a first side and a second side; providing an adhesive on the first side of the cover; providing a first electronic component on the adhesive on the first side of the cover; providing an encapsulation on the first side of the cover covering a lateral side of the first electronic component; and providing a substrate above the encapsulation, above the first electronic component, and above the cover, wherein the substrate includes a dielectric structure and a conductive structure, and wherein the first electronic component is coupled to the conductive structure. In the method, the cover includes a top plate and a sidewall extending from the top plate, and the sidewall is coupled to the substrate. The method includes providing a connector between the conductive structure and the first electronic component, wherein the encapsulation is between the substrate and the first electronic component and covers the lateral side of the connector.

[0005] This disclosure provides a method for manufacturing an electronic device, comprising: applying an adhesive; applying a first electronic component on the adhesive; applying a post on the adhesive; applying an encapsulation between the post and the first electronic component, wherein the encapsulation covers a lateral side of the first electronic component and an inner lateral side of the post; applying a substrate above the encapsulation, above the first electronic component, and above the post, wherein the substrate includes a dielectric structure and a conductive structure, and wherein the first electronic component is coupled to the conductive structure; and applying a cap above the encapsulation, above the first electronic component, and above the post, wherein the adhesive is between the first electronic component and the cap. In this method, the adhesive includes a first adhesive pattern and a second adhesive pattern, the first adhesive pattern being between the first electronic component and the cap, and the second adhesive pattern being between the post and the cap. The method also includes applying a connector between the conductive structure and the first electronic component, wherein the encapsulation is between the substrate and the first electronic component and covers the lateral side of the connector. Attached Figure Description

[0006] Figure 1 A cross-sectional view of an example electronic device is shown.

[0007] Figures 2A to 2H A cross-sectional view showing an example method for manufacturing an example electronic device.

[0008] Figure 3 A cross-sectional view of an example electronic device is shown.

[0009] Figures 4A to 4H A cross-sectional view showing an example method for manufacturing an example electronic device.

[0010] Figures 5A to 5HA cross-sectional view showing an example method for manufacturing an example electronic device.

[0011] The following discussion presents various examples of providing electronic devices and methods of manufacturing electronic devices. Such examples are non-limiting, and the scope of the appended claims should not be limited to the specific examples disclosed. In the following discussion, the terms "example" and "for example" are non-limiting.

[0012] The drawings illustrate the general construction method and may omit descriptions and details of well-known features and techniques to avoid unnecessarily obscuring the present disclosure. Furthermore, elements in the drawings are not necessarily drawn to scale. For example, the dimensions of some elements in different figures may be exaggerated relative to other elements to aid in understanding the examples discussed in this disclosure. The same reference numerals in different figures denote the same elements.

[0013] The term "or" refers to any one or more items in a list connected by "or". As an example, "x or y" means any element in the three-element set {(x),(y),(x,y)}. As another example, "x, y or z" means any element in the seven-element set {(x),(y),(z),(x,y),(x,z),(y,z),(x,y,z)}.

[0014] The terms “comprises” and “includes” are “open-ended” terms that specify the presence of the stated feature but do not exclude the presence or addition of one or more other features.

[0015] The terms “first,” “second,” etc., may be used herein to describe various elements, and these elements should not be limited by these terms. These terms are used only to distinguish one element from another. Thus, for example, a first element discussed in this disclosure may be referred to as a second element without departing from the teachings of this disclosure.

[0016] Unless otherwise specified, the term "coupled" may be used to describe two elements in direct contact with each other, or to describe two elements indirectly coupled through one or more other elements. For example, if element A is coupled to element B, then element A may be in direct contact with element B or indirectly coupled to element B through intervening element C. Similarly, the terms "above" or "on" may be used to describe two elements in direct contact with each other, or to describe two elements indirectly coupled through one or more other elements. As used herein, the term "coupled" may refer to mechanical coupling or electrical coupling. Detailed Implementation

[0017] In one example, an electronic device includes: a substrate including a top side, a bottom side, a dielectric structure, and a conductive structure; a first electronic component over the top side of the substrate and coupled to the conductive structure, wherein the first electronic component includes a first side facing the substrate and a second side facing away from the substrate; an encapsulation over the top side of the substrate and covering a lateral side of the first electronic component; a cover over the top side of the substrate and over the first electronic component; and an adhesive between the second side of the first electronic component and the inner side of the cover.

[0018] In another example, a method for manufacturing an electronic device includes: providing a cover including a first side and a second side; providing an adhesive on the first side of the cover; providing a first electronic component on the adhesive on the first side of the cover; providing an encapsulation covering a lateral side of the first electronic component on the first side of the cover; and providing a substrate above the encapsulation, above the first electronic component, and above the cover, wherein the substrate includes a dielectric structure and a conductive structure, and wherein the first electronic component is coupled to the conductive structure.

[0019] Other examples are included in this disclosure. Such examples can be found in the drawings, claims, or description of this disclosure.

[0020] Figure 1 A cross-sectional view of example electronic device 100 is shown. Figure 1 In the example shown, electronic device 100 may include a substrate 110, electronic components 120, 120', adhesive material 130, a cover 140, an encapsulation 150, and external interconnects 160. In some examples, electronic device 100 may include electronic component 170.

[0021] The substrate 110 may have a top side and a bottom side, and may include a dielectric structure 111 and a conductive structure 112. The conductive structure 112 may include a substrate-inward terminal 112a and a substrate-outward terminal 112b.

[0022] Electronic component 120 may be located above the top side of substrate 110 and may include a first side 121 and a second side 122 opposite to the first side 121. Electronic component 120 may include contact pads 123 on the first side 121. The first side 121 of electronic component 120 may face substrate 110, and the second side 122 of electronic component 120 may face away from substrate 110. Electronic component 120 may include connectors 124 coupled to or in contact with contact pads 123. Contact pads 123 and connectors 124 may be coupled to conductive structure 112. Electronic components 120' and 170 may include connectors 124' and 174, respectively. Encapsulation 150 may cover the top side of substrate 110 and the lateral side of electronic component 120. Cover 140 may be located above the top side of substrate 110 and above electronic component 120. Adhesive material 130 may be located between the second side 122 of electronic component 120 and the inside of cover 140. In some examples, the cover 140 may directly contact the conductive structure 112 or the dielectric structure 111. In some examples, the cover 140 may be coupled to the conductive structure 112 or the dielectric structure 111. In some examples, the bottom side of the cover 140 (e.g., the bottom side of the cover sidewall) may be coplanar with the bottom side of the encapsulation 150, and the top side of the conductive structure 112 may be coplanar with the bottom side of the cover 140. In some examples, the bottom side of the cover 140 may be coplanar with the top side of the dielectric structure 111.

[0023] Figures 2A to 2H Demonstrates the use of examples in manufacturing electronic devices (e.g., Figure 1 A cross-sectional view of an example method of electronic device 100. Figure 2A A cross-sectional view of an electronic device 100 in its early manufacturing stages is shown. Figure 2A In the example shown, the cover 140 may be disposed on the surface of the carrier 10. The cover 140 may be attached to the upper side of the carrier 10. The carrier 10 may include a temporary bonding layer 11 disposed on the upper side. The cover 140 may be attached to the temporary bonding layer 11 of the carrier 10.

[0024] The cover 140 may include a top plate 141 and sidewalls 142. In some examples, the top plate 141 may be a square or rectangular plate. In some examples, the cover 140 may include four sidewalls 142 that curve and / or extend from the edges of the top plate 141. The cover 140 may be oriented such that the outer (or second) side of the top plate 141 can be attached to the carrier 10 via a temporary bonding layer 11. For example, a plurality of covers 140 may be attached to the carrier 10 and spaced apart from each other above the carrier 10.

[0025] The cover 140 may have a cavity formed by the top plate 141 and the sidewalls 142. In some examples, the cover 140 may include a protrusion 143 projecting from the inner (or first) side of the top plate 141. In some examples, the protrusion 143 may be located substantially at the center of the inner side of the top plate 141 of the cover 140. The thickness of the top plate 141 in the area where the protrusion 143 is located may be greater than the thickness of other areas of the top plate 141.

[0026] The cover 140 may include metal. For example, the cover 140 may include aluminum or copper and have high thermal conductivity and radiation. In some examples, the cover 140 may be referred to as or include a heat sink, heat dissipation plate, or cap. In some examples, grooves, protrusions, or fins may be provided on the outer side of the top plate 141 of the cover 140 to improve heat dissipation efficiency.

[0027] In some examples, the total height of the cover 140 can range from approximately 1 millimeter (mm) to approximately 5 millimeters. In some examples, the height of the protrusion 143, measured from the inside of the top plate 141, can range from approximately 0.05 millimeters to approximately 1 millimeter, and the area of ​​the protrusion 143 can range from approximately 0.4 mm by 0.4 mm to approximately 69 mm by 69 mm.

[0028] The carrier 10 may be a generally planar plate. In some examples, the carrier 10 may include or be referred to as a substrate, plate, wafer, panel, or strip. In some examples, the thickness of the carrier 10 may range from approximately 100 micrometers (μm) to approximately 2000 μm, and the width of the carrier 10 may range from approximately 100 mm to approximately 600 mm. The carrier 10 can enable the integration of multiple electronic devices in electronic device manufacturing processes.

[0029] The carrier 10 may include a temporary bonding layer 11 disposed on its surface. The temporary bonding layer 11 may be disposed on the surface of the carrier 10 by coating methods such as spin coating, blade coating, casting, brushing, spraying, slot extrusion coating, curtain coating, slant coating, or blade coating; or printing methods such as screen printing, pad printing, gravure printing, flexographic printing, offset printing, or inkjet printing; or intermediate techniques between coating and printing; or may be disposed by direct attachment of a bonding film or bonding tape. In some examples, the temporary bonding layer 11 may include, or be referred to as, a temporary bonding film, temporary bonding tape, or temporary adhesive coating. For example, the temporary bonding layer 11 may be a thermal release tape or film, or an optical release tape or film, wherein the adhesive strength is weakened or removed by heat or light. The temporary bonding layer 11 may allow the carrier 10 to be separated from the cover 140 after the electronic device is completed, as described later.

[0030] Figure 2B A cross-sectional view of an electronic device 100 in its late-stage manufacturing process is shown. Figure 2B In the example shown, adhesive material 130 may be disposed within the cavity of cover 140 (e.g., on the inside of top plate 141). In some examples, adhesive material 130 may be disposed to completely or almost completely cover the inside of top plate 141 of cover 140. Adhesive material 130 may include, or be referred to as, a thermal adhesive material, a thermal interface material (TIM), or a polymeric TIM. Adhesive material 130 may include a thermally conductive material, and is temporarily referenced. Figure 1 The adhesive material can contact the second side 122 of the electronic component 110 and the inner side of the top plate of the cover 140. Some examples of the adhesive material 130 may comprise a polymeric thermal interface material, such as silicone, epoxy, or polyurethane; or a high-heat polymeric thermal interface material, such as graphite, boron nitride, silver, aluminum, or alumina. In some examples, the adhesive material 130 may comprise a metallic thermal interface material, such as gallium, gallium alloys (e.g., alloys containing indium, tin, or zinc), silver alloys, tin-silver, indium, or indium alloys.

[0031] In some examples, the adhesive material 130 may be configured to have patterns or portions spaced apart from each other on the inner side of the top plate 141 of the cover 140. In some examples, this patterned adhesive material 130 may include adhesive pattern 130a and / or adhesive pattern 130b. In some examples, adhesive pattern 130a may be made of a different adhesive material than adhesive pattern 130b. In some examples, adhesive pattern 130a may be discontinuous or spaced apart from adhesive pattern 130b. In some examples, the different adhesive patterns may include different materials with different properties, such as different thermal conductivity or insulation properties, or different heat dissipation properties. For example, adhesive pattern 130a may contact the protrusion 143 and may include a metallic TIM, while adhesive pattern 130b may contact other areas of the cover 140 (e.g., top plate 141) and may include a polymeric TIM. It should be noted that these are merely examples of the different materials that adhesive patterns 130a and 130b may include, and the scope of the disclosed subject matter is not limited in these respects.

[0032] Adhesive material 130 can be applied to the inside of the top plate 141 of the cover 140 by, for example, application or printing. In some examples, the thickness of adhesive material 130 can range from approximately 10 μm to approximately 300 μm. Applying adhesive to the cover 140 and then positioning electronic components 120 and 120' on the adhesive 130 tends to prevent or reduce the occurrence of adhesive material 130 flowing too far along the sidewalls of electronic components 120 and 120' or deforming.

[0033] Figure 2C A cross-sectional view of an electronic device 100 in its late-stage manufacturing process is shown. Figure 2CIn the illustrated example, electronic components 120 or 120' may be disposed on the upper side of adhesive material 130. In some examples, the pick-and-place device may pick up electronic components 120 or 120' respectively and place them on the upper side of adhesive material 130. In some examples, the pick-and-place device may pick up electronic components 120 or 120' and place them within the cavity of cover 140. Electronic component 120' may be disposed within the cavity on the surface of adhesive material 130 applied to the inner side of top plate 141 of cover 140, spaced apart from electronic component 120. The cavity may be defined at the peripheral side of cover 140 by sidewalls of cover 140. Adhesive material 130 on top plate 141 may be disposed on, coupled to, and / or in contact with the second side 122 of electronic components 120 and 120'.

[0034] In some examples, electronic component 120 may be attached to protrusion 143 of cover 140 via adhesive material 130. Adhesive material 130 may be positioned between electronic component 120 and top plate 141 of cover 140. Adhesive material 130 may be located at protrusion 143 between a second side 122 of electronic component 120 and cover 140. Adhesive material 130 may also be located between electronic component 120 and cover 140. In some examples, adhesive material 130 may be located between protrusion 143 and sidewall 142. Adhesive material 130 may transfer heat generated from electronic component 120 to cover 140.

[0035] Electronic component 120 may include a first side 121 and a second side 122. The second side 122 of the electronic component may be opposite to the first side 121 of the electronic component 120. In some examples, the first side 121 of the electronic component may include, or be referred to as, the active side, and the second side 122 of the electronic component may include, or be referred to as, the inactive side. Electronic component 120 may include a sidewall or lateral wall connecting the first side 121 and the second side 122 of the electronic component 120. In some examples, electronic component 120 may include, or be referred to as, a die, a chip, a package, or a passive or active component.

[0036] Electronic component 120 may include contact pads 123 disposed on a first side 121 of electronic component 120. Contact pads 123 may be input / output terminals of electronic component 120. The contact pads 123 of electronic component 120 may be spaced apart from each other in a row or column direction. In some examples, the contact pads 123 of electronic component 120 may be bonding pads of electronic component 120 or redistribution layer (RDL) pads exposed via the dielectric material of electronic component 120. In some examples, the dielectric material of electronic component 120 may be silicon nitride (SiN) or silicon dioxide (SiO2).

[0037] Electronic component 120 may include connector 124. Connector 124 may couple to and / or contact the contact pads 123 of electronic component 120. In some examples, connector 124 may include or be referred to as bumps, tin-lead (SnPb) bumps, lead-free bumps, copper-phosphorus (CuP), pillar bumps, posts, or pillars. In some examples, connector 124 may be disposed to the contact pads 123 of electronic component 120 via electroplating, electroless plating, or sputtering or deposition (e.g., physical vapor deposition (PVD), chemical vapor deposition (CVD), metal-organic chemical vapor deposition (MOCVD), atomic layer deposition (ALD), low-pressure chemical vapor deposition (LPCVD), or plasma-enhanced chemical vapor deposition (PECVD)). In some examples, the thickness of connector 124 may range from approximately 1 μm to approximately 100 μm. In some examples, the total thickness of the electronic component 120 may be in the range of approximately 0.05 mm to approximately 0.8 mm, and the area or "occupied area" of the electronic component 120 may be in the range of approximately 0.1 mm by 0.1 mm to approximately 100 mm by 100 mm.

[0038] In some examples, electronic component 120 may include a metallization layer in contact with a second side 122 of electronic component 120. In some examples, the metallization layer may include, or be referred to as, a back-side metallization (BSM) plating, a conductive film, or a conductive separator.

[0039] Electronic component 120' may include elements, features, materials, or manufacturing methods similar to or the same as those of electronic component 120. Electronic component 120' may include connector 124'. In some examples, the thickness of electronic component 120' may be greater than the thickness of electronic component 120. In some examples, when the thickness of electronic component 120' is similar to the thickness of electronic component 120, the top plate 141 of cover 140 may not have protrusion 143, such that the top plate 141 may be substantially planar and have a uniform thickness.

[0040] In a top plan view, electronic component 120' may be located outside of electronic component 120. For example, electronic component 120' may be located between electronic component 120 and the sidewall 142 of cover 140. Electronic component 120' may include a die, chip, package, or passive or active component. In some examples, electronic component 120' may include or be referred to as a passive component, antenna, or power device.

[0041] Figure 2D A cross-sectional view of an electronic device 100 in its late-stage manufacturing process is shown. Figure 2DIn the example shown, an encapsulation 150 can be provided to fill the cavity of the cover 140 and cover the electronic components 120 and 120'. The encapsulation 150 may contact or cover the inner side of the sidewall 142 of the cover 140, the upper side of the adhesive material 130, and / or the lateral sides of the electronic components 120 and 120'. The encapsulation 150 may be positioned between the lateral sides of the electronic components 120 and 120' and the sidewall 142 of the cover 140. The encapsulation 150 can transfer heat generated from the electronic components 120 and 120' to the cover 140.

[0042] In some examples, the encapsulation 150 may be provided to fill the space between adjacent covers 140 above the carrier 10. The encapsulation 150 may contact or cover the outer lateral side of the sidewall 142 of the cover 140. In some examples, the encapsulation 150 may contact the inner side of the top plate 141 of the cover 140. For example, the encapsulation 150 may be located between adhesive material patterns 130a and 130b.

[0043] In some examples, encapsulation 150 may include, or be referred to as, a body or molding compound. For example, encapsulation 150 may include an epoxy molding compound, a resin, a filler-reinforced polymer, a Class B press film, or an adhesive. For example, encapsulation 150 may be formed by compression molding, transfer molding, liquid body molding, vacuum lamination, paste printing, or film-assisted molding.

[0044] In some examples, the encapsulation 150 may be disposed above the sidewall 142 of the cover 140 and above the upper sides of the connectors 124 and 124' of the electronic components 120 and 120'. The upper portion of the encapsulation 150 may be removed to expose the upper sides of the connectors 124 and 124' of the electronic components 120 and 120' and the upper side of the sidewall 142 of the cover 140.

[0045] In some examples, the upper portion of the encapsulation 150 can be removed by grinding. For example, when removing the upper portion of the encapsulation 150, the upper portions of the connectors 124 and 124' of the electronic components 120 and 120', as well as the upper portion of the sidewall 142 of the cover 140, can be removed. In some examples, the upper side of the encapsulation 150 may be coplanar with the upper sides of the connectors 124 and 124' of the electronic components 120 and 120' and with the upper side of the sidewall 142 of the cover 140. In some examples, the thickness of the encapsulation 150 filling the cavity of the cover 140 may be in the range of approximately 50 μm to approximately 1000 μm. The encapsulation 150 can transfer heat generated by the electronic components 120, 120' to the cover 140. In some examples, according to Figure 2D As shown in the orientation, the top side of the sidewall 142 may be coplanar with the top side of the encapsulation 150.

[0046] Figure 2EA cross-sectional view of an electronic device 100 in its late-stage manufacturing process is shown. Figure 2E In the example shown, substrate 110 may be disposed above electronic components 120 and 120', cover 140, and encapsulation 150. Substrate 110 may include dielectric structure 111 and conductive structure 112.

[0047] According to various examples, dielectric structure 111 may include one or more dielectric layers made of dielectric materials (e.g., polymers, polyimide (PI), benzocyclobutene (BCB), polybenzoxazole (PBO), bismaleimide triazine (BT), resins, Ajinomoto deposited film (ABF), Si3N4, SiO2, SiON, etc.) and interleaved between the layers of conductive structure 112. The thickness of dielectric structure 111 may range from approximately 2 μm to approximately 50 μm. The thickness of dielectric structure 111 may relate to individual dielectric layers of dielectric structure 111. Conductive structure 112 may include one or more conductive layers defining signal distribution elements (e.g., traces, vias, pads, conductive paths, UBM, etc.). Conductive structure 112 may include aluminum, copper, gold, silver, nickel, and / or palladium. The thickness of conductive structure 112 may range from approximately 1 μm to approximately 10 μm. The thickness of conductive structure 112 may relate to individual layers of conductive structure 112. The conductive structure 112 can distribute electrical signals in the vertical and lateral directions via the substrate 110. The conductive structure 112 can electrically couple electronic component 120 to electronic component 120'. In some examples, the conductive structure 112 can also be coupled to the sidewall 142 of the cover 140. An encapsulation 150 can be located between the substrate 110 and the first side 121 of the electronic component 120. The encapsulation 150 can cover the lateral side of the connector 124.

[0048] The conductive structure 112 may include an internal substrate terminal 112a, an external substrate terminal 112b, and one or more conductive layers coupling a corresponding one of the internal substrate terminals 112a to a corresponding one of the external substrate terminals 112b. In some examples, the internal substrate terminals 112a may be disposed on the inner side of the substrate 110 (e.g., on the side close to or adjacent to the encapsulation 150 and electronic components 120, 120'). The internal substrate terminals 112a may be coupled to connectors 124, 124' and sidewall 142. The external substrate terminals 112b may be disposed on the outer side of the substrate 110 (e.g., on the side opposite to or away from the encapsulation 150 and electronic components 120, 120'). According to various examples, the substrate 110 may be a redistribution layer (RDL) substrate and may be formed on the encapsulation 150, connectors 124, 124', and sidewall 142. Forming the substrate 110 over the encapsulation 150, electronic components 120, 120', and sidewall 142 can reduce the package height because interconnects (e.g., bumps, pillars, adhesives, etc.) between the internal substrate terminals 112a and connectors 124, 124 and / or between the internal substrate terminals 112a and sidewall 142 can be omitted. Using an RDL substrate also allows for narrower spacing of the internal substrate terminals 112a compared to a preformed substrate. Although shown as an RDL substrate, it is carefully considered and understood that in some examples, the substrate 110 may be a preformed or laminated substrate formed separately and then disposed over the encapsulation 150, connectors 124, 124', and sidewall 142.

[0049] The dielectric structure 111 may include apertures exposing the upper sides of connectors 124 and 124' and the upper side of sidewall 142 of cover 140. For example, after a mask pattern is formed on the upper side of the dielectric structure 111, a portion of the dielectric structure 111 may be removed by etching to form apertures and expose the upper sides of connectors 124 and 124' and the sidewall 142 of cover 140. A conductive structure 112 may be coupled to and in contact with connectors 124 and 124' and the sidewall 142 exposed via the dielectric structure 111. For example, an internal substrate terminal 112a may contact connectors 124 and 124' of electronic components 120 and 120' and the sidewall 142 of cover 140. In some examples, the total thickness of substrate 110 may range from approximately 10 μm to approximately 200 μm.

[0050] In some examples, a portion of the coupling or contact cover 140 of the conductive structure 112 may be electrically connected to ground (e.g., a ground plane in the substrate 110), or to an external interconnect 160 that will be coupled to ground (e.g., an external ground interconnect). Figure 2F The conductive structure of ))

[0051] In the current example, substrate 110 is shown as a redistribution layer (“RDL”) substrate. The RDL substrate may include one or more conductive redistribution layers and one or more dielectric layers, and (a) may be formed layer-by-layer over an electronic device to which the RDL substrate is to be electrically coupled. The RDL substrate may be formed using an additive stacking process and may include one or more dielectric layers and one or more conductive layers stacked alternately, defining corresponding conductive redistribution patterns or traces configured to collectively (a) fan the traces out of the occupied area of ​​the electronic device, or (b) fan the traces into the occupied area of ​​the electronic device. The conductive patterns may be formed using plating processes such as electroplating or electroless plating. The conductive patterns may include conductive materials such as copper or other platingable metals. The locations of the conductive patterns may be created using photolithography processes such as photolithography and photoresist materials used to form a photomask. The dielectric layer of the RDL substrate can be patterned using a photo-patterning process and may include a photomask through which light is exposed to photo-pattern the desired features (e.g., vias in the dielectric layer). The dielectric layer may be made of a photodeterminable organic dielectric material such as PI, BCB, or PBO. These dielectric materials may be spin-coated or otherwise coated in liquid form rather than attached as a preform. To allow the desired photodeterminable features to form properly, these photodeterminable dielectric materials may omit structural reinforcing agents or may be filler-free, free of strands, fabrics, or other particles that may interfere with light from the photo-patterning process. In some examples, these filler-free properties of filler-free dielectric materials may allow for a reduced thickness of the resulting dielectric layer. Although the photodeterminable dielectric materials described above may be organic materials, in some examples, the dielectric material of the RDL substrate may include one or more inorganic dielectric layers. Some examples of one or more inorganic dielectric layers may include silicon nitride (Si3N4), silicon oxide (SiO2), or silicon oxynitride (SiON). The one or more inorganic dielectric layers may be formed not by using photoconfined organic dielectric materials, but by growing inorganic dielectric layers using oxidation or nitriding processes. These inorganic dielectric layers may be filler-free and free of strands, fabrics, or other dissimilar inorganic particles. In some examples, the RDL substrate may omit a permanent core structure or carrier, such as dielectric materials comprising bismaleimide triazine (BT) or FR4, and these types of RDL substrates may be referred to as coreless substrates. Substrates in this disclosure (e.g., substrate 110) may include RDL substrates.

[0052] In some examples, substrate 110 may be a preformed substrate. The preformed substrate may be fabricated prior to attachment to an electronic device and may include a dielectric layer between respective conductive layers. The conductive layer may include copper and may be formed using an electroplating process. The dielectric layer may be a relatively thick, non-photodefineable layer and may serve as a preformed film rather than a liquid attachment, and may contain a resin with fillers such as strands, fabrics, or other inorganic particles for rigid or structural support. Because the dielectric layer is non-photodefineable, features such as vias or openings can be formed using a drilling machine or laser. In some examples, the dielectric layer may include a prepreg material or an ajinomoto deposited film (ABF). The preformed substrate may include a permanent core structure or carrier, such as a dielectric material comprising bismaleimide triazine (BT) or FR4, and the dielectric and conductive layers may be formed on the permanent core structure. In other examples, the preformed substrate may be a coreless substrate with a permanent core structure omitted, and the dielectric and conductive layers may be formed on a sacrificial carrier and removed after the dielectric and conductive layers are formed and before attachment to an electronic device. The preformed substrate may be referred to as a printed circuit board (PCB) or a laminated substrate. This preformed substrate may be formed via a semi-additive process or a modified semi-additive process. The substrate in this disclosure (e.g., substrate 110) may include a preformed substrate.

[0053] Figure 2F A cross-sectional view of an electronic device 100 in its late-stage manufacturing process is shown. Figure 2F In the example shown, external interconnect 160 may be disposed above the substrate external terminal 112b of substrate 110. External interconnect 160 may be coupled to or in contact with the substrate external terminal 112b of substrate 110. In some examples, external interconnect 160 may include tin (Sn), silver (Ag), lead (Pb), copper (Cu), tin-lead (Sn-Pb), Sn37-Pb, Sn95-Pb, Sn-Pb-Ag, Sn-Cu, Sn-Ag, Sn-Au, Sn-Bi, or Sn-Ag-Cu. For example, external interconnect 160 may be formed via a reflow process after forming a solder-containing conductive material on the substrate external terminal 112b using a drop ball method. External interconnect 160 may include, or be referred to as, a conductive ball (e.g., a solder ball), a conductive pillar (e.g., a copper pillar), or a conductive pillar each having a solder cap formed above the copper pillar. In some examples, the size of the external interconnect 160 can range from approximately 10 μm to approximately 600 μm. The external interconnect 160 can be electrically coupled to electronic components 120 and 120' via conductive structures 112 of the substrate 110.

[0054] In some examples, electronic component 170 may be disposed on an external terminal 112b of substrate 110. Electronic component 170 may be electrically coupled to electronic component 120 and / or electronic component 120' via conductive structure 112 of substrate 110. Electronic component 170 may contain elements, features, materials, or manufacturing methods similar to or the same as those of electronic component 120. Electronic component 170 may include a die, chip, package, or passive or active component. In some examples, electronic component 170 may include or be referred to as a passive component, antenna patch, or power device.

[0055] Figure 2G A cross-sectional view of an electronic device 100 in its late-stage manufacturing process is shown. Figure 2G In the example shown, the carrier 10 can be removed from the cap 140 and the encapsulation 150. In some examples, the temporary bonding layer 11 can be removed or reduced by applying heat, light, a chemical solution, or physical force. Figure 2F The adhesive strength is adjusted to allow the carrier 10 to separate from the underside of the cover 140 and the encapsulant 150. In response to the removal of the carrier 10, the outer side of the top plate 141 of the cover 140 can be exposed.

[0056] According to various examples, a monomerization process can be performed in which the encapsulation 150 and substrate 110, separated between spaced-apart caps 140, are separated into individual electronic devices 100 by sawing. In some examples, a diamond blade or a laser beam can be used during the monomerization process. In some examples, after monomerization, the outer lateral sides of the sidewalls 142 of the cap 140 are exposed and not covered by the encapsulation 150, and the lateral sides of the sidewalls 142 are coplanar with the lateral sides of the substrate 110. The electronic device 100 may include the substrate 110, electronic components 120 and 120', adhesive material 130, cap 140, encapsulation 150, and external interconnects 160. Electronic components 120 and 120' may be surrounded by the encapsulation 150, and the encapsulation 150 may be surrounded by the cap 140. Figure 2G As shown, as a result of the monomerization process, the encapsulation 150 can be removed from the outer lateral side of the cover 140, and the lateral side of the substrate 110 can be flush with or coplanar with the outer lateral side of the cover 140. For example, the outer lateral side of the sidewall 142 may not be covered by the encapsulation 150. In some examples, the conductive structure 112 may be exposed at the lateral side of the substrate 110, and in other examples, the conductive structure 112 may be covered by the dielectric structure 111 of the substrate 110 at the lateral side of the substrate 110.

[0057] Electronic device 100 can be flipped around substrate 110 such that external interconnect 160 is located on the underside of substrate 110, and electronic components 120 and 120', adhesive material 130, cover 140, and encapsulant 150 are located on the upper side of substrate 110. In some examples, electronic device 100 may have electronic component 170 located on the underside of substrate 100.

[0058] Figure 2H A cross-sectional view of the electronic device 100' is shown. Figure 2H In the example shown, the following can be used: Figure 2G Different monomerization processes are used to provide individual electronic devices 100'. Figure 2H The monomerization process can leave an outer portion of the encapsulation 150 on the outer lateral side of the sidewall 142 of the cover 140. Additionally, a portion of the substrate 110 may extend beyond the outer lateral side of the cover 140 and may be flush with or coplanar with the outer portion of the encapsulation 150. Therefore, the outer lateral side of the sidewall 142 of the cover 140 may be covered by the encapsulation 150. In some examples, the conductive structure 112 may be exposed from the lateral side of the substrate 110, and in other examples, the conductive structure 112 may be covered by the dielectric structure 111 of the substrate 110 at the lateral side of the substrate 110.

[0059] Figure 3 A cross-sectional view of example electronic device 200 is shown. Figure 3 In the illustrated example, electronic device 200 may include a substrate 110, electronic components 120 and 120', an encapsulation 150, external interconnects 160, adhesive material 230, a cover 240, and a post 280. In some examples, electronic device 200 may further include electronic component 170. In some examples, post 280 may directly contact conductive structure 112 or dielectric structure 111. In some examples, post 280 may be coupled to conductive structure 112 or dielectric structure 111. In some examples, the bottom side of post 280 may be coplanar with the bottom side of encapsulation 150, and the top side of conductive structure 112 may be coplanar with the bottom side of post 280. In some examples, the bottom side of post 280 may be coplanar with the top side of dielectric structure 111. In some examples, adhesive material 230 may be between the top side of post 280 and the inside of cover 240. Encapsulation 150 may cover the inner transverse side of column 280, while the outer transverse side of column 280 may not be covered by encapsulation 150.

[0060] Electronic device 200 may be similar to electronic device 100. For example, electronic device 200 may be similar to electronic device 100 in terms of substrate 110, electronic components 120, 120', 170, encapsulation 150, and external interconnects 160. Figure 1Compared to the configuration of cover 140 shown, the cover 240 of the electronic device 200 can be in a position where... Figure 3 The configuration shown.

[0061] Figures 4A to 4H Demonstrates the use of examples in manufacturing electronic devices (e.g.) Figure 3 A cross-sectional view of an example method of electronic device 200. Figure 4A A cross-sectional view of an electronic device 200 in its early manufacturing stages is shown. Figure 4A In the example shown, adhesive material 230 may be disposed on the surface of carrier 10. Adhesive material 230 may be in contact with the upper side of carrier 10. Adhesive material 230 may contain elements, features, materials, or manufacturing methods similar to or the same as those of adhesive material 130 of electronic device 100. In some examples, carrier 10 for manufacturing electronic device 200 may include a temporary bonding layer 11.

[0062] In some examples, the adhesive material 230 may cover the entire surface of the carrier 10. In other examples, the adhesive material 230 may be disposed above the carrier 10 at the location where each electronic device 200 is to be disposed. In some examples, the adhesive material 230 may be disposed at the location where electronic components 120, 120', and / or pillars 280 are to be disposed. Because the adhesive material 230 is disposed on the carrier 10, it is possible to prevent or reduce the occurrence of the adhesive material 230 flowing down the lateral sides of electronic components 120 and 120' or deforming due to its placement on the upper side of electronic components 120 and 120'. In some examples, the adhesive material 230 may include adhesive patterns, such as adhesive pattern 230a, adhesive pattern 230b, and adhesive pattern 230c. In some examples, adhesive pattern 230a, adhesive pattern 230b, or adhesive pattern 230c may be made of different adhesive materials. In some examples, different adhesive patterns may include different materials with different properties, such as different thermal conductivity or insulation properties, or different heat dissipation properties. For example, adhesive pattern 230a may include metallic TIM, adhesive pattern 230b may include polymeric TIM, and adhesive pattern 230c may include carbon-filled TIM. It should be noted that these are merely examples of different materials that adhesive patterns 230a, 230b, and 230c may include, and the scope of the disclosed subject matter is not limited in these respects.

[0063] Figure 4B A cross-sectional view of an electronic device 200 in the late stages of manufacturing is shown. Figure 4BIn the example shown, electronic components 120 and 120' and post 280 may be disposed on adhesive material 230. Electronic components 120 and 120' and post 280 may be coupled to carrier 10 via adhesive material 230. Electronic components 120 and 120' may contain elements, features, materials, or manufacturing methods similar to or the same as those of electronic components 120 and 120' of electronic device 100.

[0064] The pick-and-place device can pick up the posts 280 and place them on the upper side of the adhesive material 230. In some examples, the posts 280 can be arranged in a square or rectangular ring shape above the carrier 10 in a top view and can surround the electronic components 120 and 120'. In some examples, the posts 280 can be located in the four corner areas surrounding the electronic components 120 and 120'. The inner lateral sides of the posts 280 can face the electronic components 120 and 120', and the outer lateral sides of the posts 280 can face adjacent posts 280. The adhesive material 230 can couple a first side (or lower side) of the posts 280 to the carrier 10. The posts 280 can provide cavities, and the electronic components 120 and 120' can be located within the cavities. The posts 280 can be arranged on the carrier 10 so as to be spaced apart from each other in rows or columns. The posts 280 can be made of metal. For example, the posts 280 can be made of copper, gold, silver, palladium, or nickel. In some examples, the width of each post 280 can be in the range of approximately 0.2 mm to approximately 2 mm, and the height of each post 280 can be in the range of approximately 0.2 mm to approximately 4 mm.

[0065] Figure 4C A cross-sectional view of an electronic device 200 in the late stages of manufacturing is shown. Figure 4C In the example shown, encapsulation 150 may cover post 280 and electronic components 120 and 120'. Encapsulation 150 contacts the lateral side of post 280, the upper side of adhesive material 230, and the lateral side of electronic components 120 and 120'. Encapsulation 150 may contact the inner lateral side of post 280 and may fill the cavity substantially defined by post 280. Encapsulation 150 may transfer heat generated from electronic components 120 and 120' to post 280. In some examples, encapsulation 150 may contact the upper side of carrier 10. Encapsulation 150 may expose the upper side of connectors 124 and 124' of electronic components 120 and 120' and the upper side of post 280. The upper side of encapsulation 150 may be coplanar with the upper side of connectors 124 and 124' and the upper side of post 280. The components, features, materials, or manufacturing methods of the encapsulation 150 may be the same as or similar to the components, features, materials, or manufacturing methods of the encapsulation 150 of the electronic device 100. In some examples, according to Figure 4C As shown in the orientation, the top side of column 280 may be coplanar with the top side of encapsulation 150.

[0066] Figure 4D A cross-sectional view of an electronic device 200 in the late stages of manufacturing is shown. Figure 4D In the example shown, a substrate 110 may be provided to cover electronic components 120 and 120', pillar 280, and encapsulation 150. The substrate 110 may include a dielectric structure 111 and a conductive structure 112. The elements, features, materials, or manufacturing methods of the substrate 110 may be the same as or similar to the elements, features, materials, or manufacturing methods of the substrate 110 of the electronic device 100.

[0067] Figure 4E A cross-sectional view of an electronic device 200 in the late stages of manufacturing is shown. Figure 4E In the example shown, external interconnect 160 may be disposed at substrate external terminal 112b of substrate 110. In some examples, electronic component 170 may be disposed on substrate external terminal 112b of substrate 110. The elements, features, materials, or manufacturing methods of external interconnect 160 and electronic component 170 may be the same as or similar to the elements, features, materials, or manufacturing methods of external interconnect 160 and electronic component 170 of electronic device 100, respectively.

[0068] Figure 4F A cross-sectional view of an electronic device 200 in the late stages of manufacturing is shown. Figure 4F In the example shown, the carrier 10 can be removed from the adhesive material 230 and the encapsulation 150. In some examples, the carrier 10 can be removed by grinding. In some examples, the carrier 10 can be removed by reducing the adhesive strength of the temporary bonding layer, as described above with reference to the carrier 10 and temporary bonding layer 11 of the electronic device 100. The carrier 10 can be removed to expose the upper side of the adhesive material 230 and the upper side of the encapsulation 150. After removing the carrier 10, a monomerization process can be performed, in which the encapsulation 150 and the substrate 110 between the spaced-apart pillars 280 are separated into individual electronic devices 200 by sawing. In some examples, a diamond blade or a laser beam can be used during the monomerization process. In some examples, the outer lateral sides of the pillars 280 can be exposed via the monomerization process such that the outer lateral sides of the pillars are not covered by the encapsulation 150. In some examples, a portion of the outer lateral side of the encapsulation 150 may be located between adjacent pillars, and the outer lateral side of the encapsulation 150 may be flush with or coplanar with the outer lateral side of the pillar 280. The outer lateral side of the pillar 280 may be flush with or coplanar with the lateral side of the substrate 110.

[0069] Individually separated electronic devices 200 can be flipped around substrate 110 such that external interconnects 160 are located on the underside of substrate 110, and electronic components 120 and 120', adhesive material 230, encapsulant 150, and pillars 280 are located on the upper side of substrate 110. In some examples, electronic device 200 may have electronic component 170 located on the underside of substrate 100. Adhesive material 230 may contact the upper sides of electronic components 120 and 120', the upper side of encapsulant 150, and the upper side of pillars 280.

[0070] Figure 4G 200 electronic devices in the late stages of manufacturing are on display. Figure 4G In the example shown, cover 240 may be attached to cover the upper side of adhesive material 230. In some examples, cover 240 may include a rectangular plate. Cover 240 may be coupled to electronic components 120 and 120', encapsulation 150, and post 280 via adhesive material 230. Elements, features, materials, or manufacturing methods of cover 240 may be similar to elements, features, materials, or manufacturing methods of the top plate 141 of cover 140 of electronic device 100. In some examples, the inner side of cover 240 may be planar (e.g., cover 240 may have no protrusions). Adhesive material 230 may transfer heat generated from electronic components 120 and 120' to cover 240. Encapsulation 150 may transfer heat generated from electronic components 120 and 120' to post 280. Electronic device 200 may include a substrate 110, electronic components 120, 120', and 170, adhesive material 230, a cover 240, an encapsulant 150, an outer encapsulant 160, and a post 280. Electronic components 120 and 120' may be surrounded by the encapsulant 150.

[0071] Figure 4H Display electronic device 200'. Figure 4H In the example shown, the following can be used: Figure 4F Different monomerization processes are used to provide individual electronic devices 200'. Figure 4HThe monomerization process can leave an outer portion of the encapsulation 150 on the outer lateral side of the pillar 280. Additionally, a portion of the substrate 110 can extend beyond the outer lateral side of the pillar 280 and can be flush with or coplanar with the outer portion of the encapsulation 150. Similarly, a portion of the cap 240 can extend beyond the outer lateral side of the pillar 280 and can be flush with or coplanar with the outer portion of the encapsulation 150. Therefore, the outer lateral side of the pillar 280 can be covered by the encapsulation 150, and the outer portion of the encapsulation 150 can be located at the outer periphery of the substrate 110 between the inner side of the cap 240 and the top side of the substrate 110. In some examples, the encapsulation 150 can contact the lateral sides of the inner cap 240 and the adhesive patterns 230a, 230b, 230c. Although electronic device 200' is shown as having adhesive patterns 230a, 230b, 230c, it should be understood, upon careful consideration, that in some examples, electronic device 200' may comprise a continuous adhesive 230, similar to... Figure 4G The electronic device 200. Similarly, it should be understood, upon careful consideration, that in some examples, the electronic device 200 may include adhesive patterns 230a, 230b, 230c, similar to Figure 4H The electronic device 200' is described. In some examples, the conductive structure 112 may be exposed on the lateral side of the substrate 110, and in other examples, the conductive structure 112 may be covered by the dielectric structure 111 of the substrate 110 on the lateral side of the substrate 110. In some examples, the post 280 may directly contact the conductive structure 112 or the dielectric structure 111. In some examples, the post 280 may be coupled to the conductive structure 112 or the dielectric structure 111. In some examples, the bottom side of the post 280 may be coplanar with the bottom side of the encapsulation 150, and the top side of the conductive structure 112 may be coplanar with the bottom side of the post 280. In some examples, the bottom side of the post 280 may be coplanar with the top side of the dielectric structure 111.

[0072] Figures 5A to 5H A cross-sectional view showing an example method for manufacturing an example electronic device 200. Figure 5A A cross-sectional view of an electronic device 200 in its early manufacturing stages is shown. Figure 5A In the example shown, electronic components 120 and 120' and post 280 may be disposed on the upper side of carrier 10. Carrier 10 may include a temporary bonding layer 11 disposed on the upper side. Electronic components 120 and 120' and post 280 may be coupled to carrier 10 via temporary bonding layer 11. The elements, features, materials, or manufacturing methods of electronic components 120 and 120' may be similar to or the same as the elements, features, materials, or manufacturing methods of electronic components 120 and 120' of electronic device 100. The method of disposing of post 280 may be similar to... Figure 4B The method for setting column 280 is shown.

[0073] Figures 5B to 5D A cross-sectional view of an example electronic device 200 in the late manufacturing stage is shown. Figure 5B , Figure 5C and Figure 5D The examples shown can be similar to, respectively. Figure 4C , Figure 4D and Figure 4E The process for manufacturing the electronic device 200 is shown.

[0074] Figure 5E A cross-sectional view of an electronic device 200 in the late stages of manufacturing is shown. Figure 5E In the example shown, the carrier 10 can be removed from electronic components 120 and 120', encapsulation 150, and pillar 280. The method for removing the carrier 10 can be similar to the method for removing the carrier 10 of electronic device 100. The carrier 10 can be removed to expose the tops of electronic devices 120 and 120', the top of encapsulation 150, and the top of pillar 280. After removing the carrier 10, a monomerization process can be performed, wherein the area of ​​encapsulation 150 and the substrate 110 located between adjacent pillars 280 of the individual electronic devices 200 is separated into individual electronic devices 200 by sawing. The monomerization process can be similar to... Figure 4F The monomerization process in the process.

[0075] The modular electronic device 200 can be flipped so that, based on substrate 110, external interconnects 160 are located on the underside of substrate 110, and electronic components 120 and 120', encapsulation 150 and pillars 280 are located on the upper side of substrate 110. In some examples, electronic device 200 may have electronic components 170 located on the underside of substrate 100.

[0076] Figure 5F A cross-sectional view of an electronic device 200 in the late stages of manufacturing is shown. Figure 5F In the example shown, adhesive material 230 may be disposed above and / or covering electronic components 120 and 120', encapsulation 150, and pillar 280. Adhesive material 230 may contact the upper side of electronic devices 120 and 120', the upper side of encapsulation 150, and the upper side of pillar 280. Elements, features, materials, or manufacturing methods of adhesive 230 may be similar to or the same as elements, features, materials, or manufacturing methods of adhesive material 130 of electronic device 100.

[0077] Figure 5G A cross-sectional view of an electronic device 200 in the late stages of manufacturing is shown. Figure 5G In the example shown, the cap 240 is located above and coupled to the adhesive 230. Figure 5G The example shown can be similar to Figure 4G The manufacturing process is shown. In some examples, Figure 5G Electronic devices 200 and Figure 4G The electronic devices 200 are generally similar or identical. In some examples, devices similar to those used for... Figure 4H Different monomerization processes are used to obtain electronic devices 200' such as Figure 5G The illustrated electronic device 200 has an outer portion of the encapsulation 150 covering the outer lateral side of the pillar 280. In these examples, a portion of the substrate 110 may extend beyond the outer lateral side of the pillar 280 and may be flush with or coplanar with the outer portion of the encapsulation 150. Similarly, portions of the cap 240 and adhesive 230 may extend beyond the outer lateral side of the pillar 280 and may be flush with or coplanar with the outer portion of the encapsulation 150. Thus, the outer lateral side of the pillar 280 may be covered by the encapsulation 150. In some examples, the conductive structure 112 may be exposed at the lateral side of the substrate 110, and in other examples, the conductive structure 112 may be covered by the dielectric structure 111 at the lateral side of the substrate 110.

[0078] Figure 5H A cross-sectional view of an electronic device 200 in the late manufacturing stage is shown. Figure 5H The example shown can be broadly similar to Figure 5GThe electronic device 200 differs in that the adhesive material 230 can be configured as an adhesive pattern 230a disposed between the inner (or bottom) side of the cover 240 and the top side 122 of the electronic component 120, an adhesive pattern 230b disposed between the inner (or bottom) side of the cover 240 and the top side 122' of the electronic component 120', and an adhesive pattern 230c disposed between the inner (or bottom) side of the cover 240 and the top side of the post 280. In these examples, because the adhesive patterns 230a, 230b, and 230c are discontinuous across the inner side of the cover 240, gaps may exist between the lateral sides of adjacent adhesive patterns 230a, 230b, and 230c and between the inner (or bottom) side of the cover 240 and the top side of the encapsulation 150. These gaps may include air gaps or may be filled with an overflow of another material, such as adhesive patterns 230a, 230b, or 230c. In some examples, different adhesive patterns may include different materials with different properties, such as different thermal conductivity or insulation properties, or different heat dissipation properties. For example, adhesive pattern 230a may include metallic TIM, adhesive pattern 230b may include polymeric TIM, and adhesive pattern 230c may include carbon-filled TIM. It should be noted that these are merely examples of the different materials that adhesive patterns 230a, 230b, and 230c may include, and the scope of the disclosed subject matter is not limited in these respects. In some examples, post 280 may directly contact conductive structure 112 or dielectric structure 111. In some examples, post 280 may be coupled to conductive structure 112 or dielectric structure 111. In some examples, the bottom side of post 280 may be coplanar with the bottom side of encapsulation 150, and the top side of conductive structure 112 may be coplanar with the bottom side of post 280. In some examples, the bottom side of post 280 may be coplanar with the top side of dielectric structure 111.

[0079] This disclosure includes references to certain examples. However, those skilled in the art will understand that various changes can be made and equivalents can be substituted without departing from the scope of this disclosure. Furthermore, modifications can be made to the disclosed examples without departing from the scope of this disclosure. Therefore, it is intended that this disclosure be limited to the disclosed examples, but rather to include all examples falling within the scope of the appended claims.

Claims

1. An electronic device comprising: The substrate includes a top side, a bottom side, a dielectric structure, and a conductive structure; A first electronic component is located above the top side of the substrate and coupled to the conductive structure, wherein the first electronic component includes a first side facing the substrate and a second side facing away from the substrate; An encapsulation material that is above the top side of the substrate and covers the lateral side of the first electronic component; A cover, which is above the top side of the substrate and above the first electronic component; as well as An adhesive is applied between the second side of the first electronic component and the inside of the cover.

2. The electronic device of claim 1, comprising a connector between the conductive structure and a contact pad on the first side of the first electronic component, wherein the first electronic component is coupled to the conductive structure via the connector.

3. The electronic device of claim 2, wherein the encapsulation is between the top side of the substrate and the first side of the first electronic component and covers the lateral side of the connector.

4. The electronic device of claim 1, wherein the cover includes a protrusion on the inner side of the cover, and the adhesive is disposed between the second side of the first electronic component and the protrusion.

5. The electronic device of claim 1, comprising a second electronic component above the top side of the substrate and coupled to the conductive structure, wherein the adhesive is disposed between the top side of the second electronic component and the inner side of the cover.

6. The electronic device of claim 5, wherein the cover includes a protrusion on the inner side of the cover and a sidewall on the outer side of the cover, and the adhesive is between the top side of the second electronic component and the inner side of the cover, and between the protrusion and the sidewall.

7. The electronic device according to claim 5, wherein: The adhesive includes a first adhesive pattern and a second adhesive pattern; The first adhesive pattern is between the second side of the first electronic component and the inner side of the cover; The second adhesive pattern is located between the top side of the second electronic component and the inner side of the cover; and The first adhesive pattern is discontinuous with the second adhesive pattern.

8. The electronic device of claim 7, wherein the first adhesive pattern comprises a first adhesive material, and the second adhesive pattern comprises a second adhesive material different from the first adhesive material.

9. The electronic device of claim 1, wherein the cover includes a sidewall at the periphery of the cover, and the outer lateral side of the sidewall is not covered by the encapsulant.

10. The electronic device of claim 1, wherein the cover includes a sidewall at the periphery of the cover, and the outer lateral side of the sidewall is covered by a portion of the encapsulation.

11. The electronic device of claim 1, comprising a pillar above the top side of the substrate, wherein the adhesive is between the top side of the pillar and the inner side of the cover.

12. The electronic device of claim 11, wherein the outer lateral side of the column is not covered by the encapsulation.

13. The electronic device of claim 11, wherein the outer lateral side of the post is covered by a portion of the encapsulation.

14. The electronic device of claim 13, wherein the portion of the encapsulation is between the inner side of the cover and the top side of the substrate.

15. A method for manufacturing an electronic device, comprising: The cover includes a first side and a second side; An adhesive is applied to the first side of the cover; A first electronic component is disposed on the adhesive on the first side of the cover; An encapsulation covering the lateral side of the first electronic component is provided on the first side of the cover; as well as A substrate is disposed above the encapsulation, above the first electronic component, and above the cover, wherein the substrate includes a dielectric structure and a conductive structure, and wherein the first electronic component is coupled to the conductive structure.

16. The method of claim 15, wherein the cover comprises a top plate and a sidewall extending from the top plate, and the sidewall is coupled to the substrate.

17. The method of claim 15, further comprising distributing a connector between the conductive structure and the first electronic component, wherein the encapsulation is between the substrate and the first electronic component and covers the lateral side of the connector.

18. A method for manufacturing an electronic device, comprising: Set the adhesive; The first electronic component is disposed on the adhesive; Posts are provided on the adhesive; An encapsulation is provided between the column and the first electronic component, wherein the encapsulation covers the lateral side of the first electronic component and the inner lateral side of the column; A substrate is disposed above the encapsulation, above the first electronic component, and above the pillar, wherein the substrate includes a dielectric structure and a conductive structure, and wherein the first electronic component is coupled to the conductive structure; as well as A cover is disposed above the encapsulation, above the first electronic component, and above the post, wherein the adhesive is between the first electronic component and the cover.

19. The method of claim 18, wherein the adhesive comprises a first adhesive pattern and a second adhesive pattern, the first adhesive pattern being between the first electronic component and the cover, and the second adhesive pattern being between the post and the cover.

20. The method of claim 18, further comprising distributing a connector between the conductive structure and the first electronic component, wherein the encapsulation is between the substrate and the first electronic component and covers the lateral side of the connector.

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