Data storage chip packaging structure

Abstract

The invention relates to the technical field of data storage chip packaging, and discloses a data storage chip packaging structure which comprises a protection assembly and a heat dissipation assembly, the protection assembly is composed of a shell, a base, a chip body, a top cover, bolts and damping silica gel, the inner bottom wall of the shell is fixedly connected with the base, and the top cover is arranged at the top end of the base. According to the data storage chip packaging structure, through the arrangement of the heat conduction ring, the heat conduction sheet, the bottom shell and the square groove, when the data storage chip packaging structure is used, after the heat conduction ring absorbs heat generated by the chip body, the heat conduction ring surrounds the periphery of the chip body so that the heat can be absorbed to the maximum extent, and the heat conduction sheet is attached to the heat conduction ring so that the heat can be absorbed and dissipated into the square groove formed in the bottom shell; the square grooves form convection channels, so that air can circulate in the square grooves conveniently, the heat-conducting fins are driven to absorb heat, the temperature of the chip can be effectively reduced by about 10-20 DEG C by the heat-conducting fins, and the service life of the chip body is prolonged.

Description

Technical Field

[0001] This invention relates to the field of data storage chip packaging technology, specifically to a data storage chip packaging structure. Background Technology

[0002] Data storage chip packaging refers to the process of encapsulating data storage chips using specific materials and processes to achieve goals such as chip protection, performance optimization, improved reliability, and adaptability to different application scenarios. Packaging is not only a means of physical protection, but also involves optimization in multiple aspects such as electrical, thermal management, and signal integrity.

[0003] However, traditional data storage chip packaging structures have the following drawbacks:

[0004] (1) Existing chip packaging structures generally cannot effectively protect the chip after packaging. When the device or motherboard is subjected to external impact, some of the impact energy may directly damage the chip, causing the chip to be unable to function properly.

[0005] (2) Existing chip packages have poor heat dissipation efficiency. The chip will emit a lot of heat on its surface after long-term use. Existing package structures generally do not have heat dissipation structures inside. If heat dissipation is not carried out, chip usage may be interrupted. Summary of the Invention

[0006] (a) Technical problems to be solved

[0007] In view of the shortcomings of the prior art, the technical problem of the present invention is to provide a data storage chip packaging structure that is highly practical, simple to operate, and relatively simple in structure, thereby solving the problem of poor chip protection and buffering effect mentioned in the background art.

[0008] (II) Technical Solution

[0009] To achieve the above objectives, the present invention provides the following technical solution: a data storage chip packaging structure, comprising a protective component and a heat dissipation component, wherein the protective component is composed of a housing, a base, a chip body, a top cover, bolts, and damping silicone; the base is fixedly connected to the inner bottom wall of the housing; the top cover is provided at the top of the base; bolts are installed at the top of the top cover; damping silicone is provided on the inner top wall of the top cover and the inner bottom wall of the base; and the chip body is disposed between the damping silicone.

[0010] The heat dissipation assembly consists of a heat-conducting ring, a heat-conducting plate, a bottom shell, and a square groove. The inner bottom wall of the base is provided with a heat-conducting ring on the surface of the base. The bottom end of the heat-conducting ring is fixedly connected to a heat-conducting plate. The bottom end of the housing is equipped with a bottom shell, and a square groove is provided on the side of the bottom shell.

[0011] Preferably, the top of the base is provided with a connecting groove below the top cover, and the bolt passes through the top cover and connects to the connecting groove. The connecting groove is used to connect the bolt and the top cover to connect them to the base.

[0012] Preferably, there are five heat-conducting sheets arranged at equal intervals. This arrangement increases the heat dissipation area and improves heat dissipation efficiency.

[0013] Preferably, a fixing frame is installed on the inner top wall of the housing, and a moisture-absorbing layer is provided on the inner wall of the fixing frame. The fixing frame is connected to the moisture-absorbing layer, and the moisture-absorbing layer uses silica gel desiccant, which is mainly composed of silicon dioxide. It can absorb several times its own weight in water, thereby maintaining a low humidity environment inside the chip body.

[0014] Preferably, the inner sidewall of the housing is provided with a fixing groove, and the inner wall of the fixing groove is provided with a sealing layer. The sealing layer prevents moisture from entering the housing. In some memory chips used in humid environments, the sealing layer can effectively block the intrusion of external moisture, thus improving the moisture resistance of the device by several times.

[0015] Preferably, the chip body has a mounting groove on its side, and the inner wall of the mounting groove is provided with pins. The pins are used for electrical connection, signal transmission and power management.

[0016] Preferably, the inner bottom wall of the housing is provided with a heat dissipation groove below the base, the heat dissipation groove penetrates the heat-conducting fin, and the heat dissipation groove is used to accelerate the dissipation of heat.

[0017] Preferably, an elongated groove is provided on one side of the housing, and a connection port is provided on the inner wall of the elongated groove. The connection port is used to connect with other devices on the motherboard surface for data transmission and other operations.

[0018] Preferably, a connecting groove is provided on the side of the bottom shell, and solder balls are installed on the inner wall of the connecting groove. The solder balls facilitate the soldering connection of the device to the motherboard surface.

[0019] Preferably, there are four solder balls, which are symmetrically distributed. The symmetrical distribution of the solder balls can stably fix the device on the motherboard surface.

[0020] (III) Beneficial Effects

[0021] Compared with the prior art, the present invention provides a data storage chip packaging structure having the following characteristics:

[0022] Beneficial effects:

[0023] 1. This data storage chip packaging structure, through the arrangement of a shell, base, chip body, top cover, bolts, and damping silicone, allows for precise placement during use. The shell connects to the base, and the chip body is placed on the inner bottom wall of the base to ensure accurate positioning. The top cover is placed on top of the base, and the bolts are used to secure it tightly to the base. Damping silicone is used to fix the top cover and base together. This damping silicone not only provides stable clamping force to ensure the chip body is fixed within the package, but also plays a crucial buffering role when subjected to external impacts. When the packaging structure is subjected to external impacts, the molecular chains inside the damping silicone slip, twist, and deform. These microscopic molecular movements effectively absorb and dissipate a large amount of impact energy, thereby significantly reducing the impact force transmitted to the chip body. This energy absorption mechanism is similar to a "molecular-level shock absorber," converting impact energy into internal molecular friction and heat energy, thereby reducing the direct impact force on the chip body and effectively protecting the chip from mechanical damage. The packaging structure not only provides physical protection but also maintains the stability and reliability of the chip in dynamic environments, ensuring its high performance in various application scenarios.

[0024] 2. This data storage chip packaging structure, through the arrangement of a thermal coil, thermal pad, bottom shell, and square slot, allows the thermal coil to absorb the heat generated by the chip body during use. The thermal coil surrounds the chip body to maximize heat absorption. The thermal pad is in close contact with the thermal coil, which can absorb heat and dissipate it into the square slot inside the bottom shell. The square slot forms a convection channel, which facilitates air circulation within the square slot and carries the heat absorbed by the thermal pad. The thermal pad can effectively reduce the chip temperature by about 10-20 degrees Celsius, thereby extending the service life of the chip body. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the overall appearance of a data storage chip packaging structure proposed in this invention;

[0026] Figure 2 This is a schematic diagram of the internal cross-sectional structure of a data storage chip packaging structure proposed in this invention;

[0027] Figure 3 This is a top cross-sectional view of the housing of a data storage chip packaging structure proposed in this invention;

[0028] Figure 4 This invention proposes a data storage chip packaging structure. Figure 2 Enlarged structural diagram of section A;

[0029] Figure 5 This is a schematic diagram of the shell disassembly structure of a data storage chip packaging structure proposed in this invention.

[0030] In the diagram: 1. Protective component; 101. Housing; 102. Base; 103. Chip body; 104. Top cover; 105. Bolt; 106. Damping silicone; 2. Heat dissipation component; 201. Thermal coil; 202. Thermal sheet; 203. Bottom shell; 204. Square groove; 3. Fixing frame; 4. Moisture-absorbing layer; 5. Sealing layer; 6. Pins; 7. Heat dissipation groove; 8. Connection port; 9. Solder ball. Detailed Implementation

[0031] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0032] Please see Figure 1-5 The present invention provides a technical solution: a data storage chip packaging structure, including a protective component 1 and a heat dissipation component 2. The protective component 1 is composed of a housing 101, a base 102, a chip body 103, a top cover 104, bolts 105 and damping silicone 106. The base 102 is fixedly connected to the inner bottom wall of the housing 101. The top cover 104 is provided at the top of the base 102. Bolts 105 are installed at the top of the top cover 104. The damping silicone 106 is provided on the inner top wall of the top cover 104 and the inner bottom wall of the base 102. The chip body 103 is provided between the damping silicone 106.

[0033] The heat dissipation assembly 2 consists of a thermal coil 201, a thermal pad 202, a bottom shell 203, and a square groove 204. The thermal coil 201 is located on the inner bottom wall of the base 102, and the thermal pad 202 is fixedly connected to the bottom end of the thermal coil 201. The bottom shell 203 is installed at the bottom end of the housing 101, and a square groove 204 is formed on the side of the bottom shell 203. The housing 101 is connected to the base 102. The chip body 103 is placed on the inner bottom wall of the base 102, ensuring its accurate position. The top cover 104 is placed on top of the base 102, and the top cover 104 is tightly connected to the base 102 by rotating the bolt 105. Damping silicone 106 is used to fix the top cover 104 and the base 102 together. This damping silicone 106 not only provides a stable clamping force to ensure the chip body 103 is fixed within the package, but also plays a crucial buffering role when subjected to external impacts. When the package structure is subjected to external impacts, the molecular chains inside the damping silicone 106 will slip, twist, and deform. These microscopic molecular movements can effectively absorb and dissipate a large amount of impact energy, thereby significantly reducing the impact force transmitted to the chip body 103. This energy absorption mechanism is similar to a "molecular-level shock absorber," which can convert impact energy into internal molecular friction and heat energy, thereby reducing the direct impact force on the chip body 103 and effectively protecting the chip from mechanical damage. The packaging structure not only provides physical protection but also maintains the stability and reliability of the chip in dynamic environments, ensuring its high performance in various application scenarios. After the thermal coil 201 absorbs the heat generated by the chip body 103, the thermal coil 201 can maximize heat absorption around the chip body 103. The thermal pad 202 is attached to the thermal coil 201, which can absorb the heat and dissipate it into the square groove 204 opened inside the bottom shell 203. The square groove 204 forms a convection channel, which can facilitate the air to circulate in the square groove 204 and carry the heat absorbed by the thermal pad 202. The thermal pad 202 can effectively reduce the chip temperature by about 10-20 degrees Celsius, thereby extending the service life of the chip body 103.

[0034] The top of the base 102 is provided with a connecting groove below the top cover 104. The bolt 105 passes through the top cover 104 and connects to the connecting groove. The connecting groove is used to connect the bolt 105 and the top cover 104 to connect it to the base 102.

[0035] There are five heat-conducting plates 202, which are arranged at equal intervals. The equal interval arrangement of the heat-conducting plates 202 can increase the heat dissipation area and improve the heat dissipation efficiency.

[0036] A fixing frame 3 is installed on the inner top wall of the housing 101. A moisture-absorbing layer 4 is provided on the inner wall of the fixing frame 3. The fixing frame 3 is connected to the moisture-absorbing layer 4. The moisture-absorbing layer 4 uses silica gel desiccant, which is mainly composed of silicon dioxide. It can absorb several times its own weight in water, thereby maintaining a low humidity environment inside the chip body 103.

[0037] The inner wall of the housing 101 is provided with a fixing groove, and the inner wall of the fixing groove is provided with a sealing layer 5. The sealing layer 5 prevents moisture from entering the interior of the housing 101. In some memory chips used in humid environments, the sealing layer 5 can effectively block the intrusion of external moisture, thus improving the moisture resistance of the device by several times.

[0038] The chip body 103 has a mounting slot on its side, and the inner wall of the mounting slot is provided with pins 6. The installation of pins 6 is used for electrical connection, signal transmission and power management.

[0039] A heat dissipation groove 7 is provided on the inner bottom wall of the housing 101 below the base 102. The heat dissipation groove 7 passes through the heat conduction plate 202 and is used to accelerate the dissipation of heat.

[0040] A long slot is provided on one side of the housing 101, and a connection port 8 is provided on the inner wall of the long slot. The connection port 8 is used to connect with other devices on the motherboard surface for data transmission and other operations.

[0041] The bottom shell 203 has a connecting groove on its side, and solder balls 9 are installed on the inner wall of the connecting groove. Solder balls 9 facilitate the soldering connection of the device to the motherboard surface.

[0042] There are four solder balls 9, which are symmetrically distributed. The symmetrical distribution of the solder balls 9 can stably fix the device on the motherboard surface.

[0043] The working steps of the device in this invention are as follows:

[0044] S1: The housing 101 is connected to the base 102. The chip body 103 is placed on the inner bottom wall of the base 102 to ensure its accurate positioning. The top cover 104 is placed on top of the base 102, and the top cover 104 is tightly connected to the base 102 by rotating the screw 105. Damping silicone 106 is used to fix the top cover 104 and the base 102. This damping silicone 106 not only provides a stable clamping force to ensure the chip body 103 is fixed within the package, but also plays a crucial buffering role when subjected to external impact. When the package structure is subjected to external impact, the molecular chains inside the damping silicone 106 will slip, twist, and deform. These microscopic molecular movements can effectively absorb and dissipate a large amount of impact energy, thereby significantly reducing the impact force transmitted to the chip body 103. This energy absorption mechanism is similar to a "molecular-level shock absorber", which can convert impact energy into internal molecular friction and heat energy, thereby reducing the direct impact force on the chip body 103 and effectively protecting the chip body 103 from mechanical damage. The packaging structure can not only provide physical protection, but also maintain the stability and reliability of the chip body 103 in dynamic environments, ensuring its high performance in various application scenarios.

[0045] S2: After the heat-conducting ring 201 absorbs the heat generated by the chip body 103, the heat-conducting ring 201 can maximize the absorption of heat around the chip body 103. The heat-conducting sheet 202 is attached to the heat-conducting ring 201, which can absorb the heat and dissipate it into the square groove 204 opened inside the bottom shell 203. The square groove 204 forms a convection channel, which can facilitate the air to circulate in the square groove 204, and drive the heat absorbed by the heat-conducting sheet 202. The heat-conducting sheet 202 can effectively reduce the chip temperature by about 10-20 degrees Celsius, thereby extending the service life of the chip body 103.

[0046] S3: The fixed frame 3 is connected to the moisture-absorbing layer 4. The moisture-absorbing layer 4 uses silica gel desiccant, which is mainly composed of silicon dioxide. It can absorb several times its own weight in water, thereby maintaining a low humidity environment inside the chip body 103. The sealing layer 5 prevents moisture from entering the housing 101. In some memory chips used in humid environments, the sealing layer 5 can effectively block the intrusion of external moisture, improving the moisture resistance of the device by several times. The pins 6 are used for electrical connection, signal transmission and power management. The heat dissipation groove 7 is used to accelerate heat dissipation. The connection port 8 is used to connect with other devices on the motherboard surface for data transmission. The solder balls 9 facilitate soldering the device to the motherboard surface.

[0047] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one" does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0048] In the description of this specification, the terms "connection", "installation", "fixing", "setting", etc. are interpreted broadly. For example, "connection" can be a fixed connection or an indirect connection through an intermediate component without affecting the relationship between components and the technical effect. It can also be an integral connection or a partial connection. In such cases, those skilled in the art can understand the specific meaning of the above terms in this invention or invention according to the specific circumstances.

[0049] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A data storage chip packaging structure, comprising a protective component (1) and a heat dissipation component (2), characterized in that: The protective component (1) is composed of a housing (101), a base (102), a chip body (103), a top cover (104), bolts (105), and damping silicone (106). The base (102) is fixedly connected to the inner bottom wall of the housing (101). The top cover (104) is provided at the top of the base (102). Bolts (105) are installed at the top of the top cover (104). Damping silicone (106) is provided on the inner top wall of the top cover (104) and the inner bottom wall of the base (102). The chip body (103) is located between the damping silicone (106). The heat dissipation assembly (2) consists of a heat-conducting ring (201), a heat-conducting plate (202), a bottom shell (203), and a square groove (204). The inner bottom wall of the base (102) is provided with a heat-conducting ring (201) on the surface of the base (102). The bottom end of the heat-conducting ring (201) is fixedly connected to the heat-conducting plate (202). The bottom end of the housing (101) is equipped with a bottom shell (203). A square groove (204) is provided on the side of the bottom shell (203).

2. The data storage chip packaging structure according to claim 1, characterized in that: The top of the base (102) is provided with a connecting groove below the top cover (104), and the bolt (105) passes through the top cover (104) and connects to the connecting groove.

3. The data storage chip packaging structure according to claim 1, characterized in that: There are five heat-conducting plates (202), which are arranged at equal intervals.

4. The data storage chip packaging structure according to claim 1, characterized in that: A fixing frame (3) is installed on the inner top wall of the housing (101), and a moisture-absorbing layer (4) is provided on the inner wall of the fixing frame (3).

5. The data storage chip packaging structure according to claim 1, characterized in that: The inner wall of the housing (101) is provided with a fixing groove, and the inner wall of the fixing groove is provided with a sealing layer (5).

6. The data storage chip packaging structure according to claim 1, characterized in that: The chip body (103) has a mounting groove on its side, and the inner wall of the mounting groove is provided with pins (6).

7. The data storage chip packaging structure according to claim 1, characterized in that: The inner bottom wall of the housing (101) is provided with a heat dissipation groove (7) located below the base (102), and the heat dissipation groove (7) penetrates the heat-conducting plate (202).

8. The data storage chip packaging structure according to claim 1, characterized in that: An elongated groove is provided on one side of the housing (101), and a connection port (8) is provided on the inner wall of the elongated groove.

9. A data storage chip packaging structure according to claim 1, characterized in that: The bottom shell (203) has a connecting groove on its side, and a welding ball (9) is installed on the inner wall of the connecting groove.

10. A data storage chip packaging structure according to claim 1, characterized in that: There are four solder balls (9), and the solder balls (9) are symmetrically distributed.

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