Patch type network filter

Abstract

The invention relates to the technical field of magnets, inductors and transformers, in particular to a patch type network filter which comprises a bonding pad, a top cover and a coil assembly, the bonding pad is provided with a plurality of welding points, the coil assembly is electrically connected with the welding points through enameled wires, the top cover is provided with a device groove used for containing the coil assembly, and the enameled wires are electrically connected with the end portions of the welding points. The top cover is further provided with a glue containing groove used for containing the anti-oxidation layers, the glue containing groove is communicated with the device groove and right faces the welding points, the top cover is further provided with a connecting groove, the connecting groove, the device groove and the glue containing groove are located on the same side of the top cover, and the two ends of the connecting groove are communicated with the device groove and the glue containing groove respectively. The bonding pad is used for sealing the device groove, the glue containing groove and the connecting groove, and the end of the enameled wire penetrates through the connecting groove and is electrically connected with the welding point right opposite to the glue containing groove. By adopting the scheme, the technical problem that the service life of the network filter is shortened because the enameled wire welding point of the network filter is easy to oxidize in the prior art can be solved.

Description

Technical Field

[0001] This invention relates to the technical field of magnets, inductors, and transformers, specifically to a patch-type network filter. Background Technology

[0002] A network filter is an electronic component used for signal processing. Its main function is to filter signals by suppressing or enhancing specific frequency components, and it is widely used in communications, electromagnetic compatibility design, and the Internet of Things (IoT). Its structure mainly includes pads, a top cover, and an internal magnetic ring and coils wound around the magnetic ring. The coils are electrically connected to the pads. Unlike other electronic components, the coils in a network filter use enameled wire, a type of conductor with an insulating layer on its surface. Enameled wire effectively prevents short circuits between the tightly wound coil turns due to high-frequency electric fields. The insulation layer blocks current crosstalk between conductors, reducing energy loss caused by eddy currents during high-frequency operation and improving filtering efficiency. However, the inventors discovered in practical use that to ensure the soldering quality between the enameled wire and the pads, the insulation layer at the end of the enameled wire needs to be removed before soldering. After soldering, the solder joint is exposed. Over long-term use, oxidation occurs at the solder joint, leading to malfunction of the network filter and reducing its lifespan. Summary of the Invention

[0003] The present invention aims to provide a patch-type network filter to solve the technical problem that the enameled wire solder joints of network filters are prone to oxidation, which reduces the service life of the network filter.

[0004] This invention provides the following basic solution: A surface-mount network filter includes pads, a top cover, and a coil assembly. The pads have multiple solder points, and the coil assembly is electrically connected to the solder points via enameled wire. The top cover has a device slot for accommodating the coil assembly, and the pads are used to close the device slot. The ends of the enameled wire that are electrically connected to the solder points, as well as the solder points, are provided with an anti-oxidation layer. The top cover also has a glue-containing groove for accommodating the anti-oxidation layer. The glue-containing groove is connected to the device slot and faces the solder points. The pads are also used to close the glue-containing groove.

[0005] Furthermore, the top cover is also provided with a connecting groove. The connecting groove, the component groove, and the adhesive groove are located on the same side of the top cover, and the two ends of the connecting groove are connected to the component groove and the adhesive groove, respectively. The end of the enameled wire passes through the connecting groove and is electrically connected to the soldering point opposite the adhesive groove.

[0006] Furthermore, the solder points on the pads are located on both sides of the pads, and there are two adhesive reservoirs, with each reservoir directly opposite the solder points on both sides of the pad.

[0007] Furthermore, the depth of the connecting groove is less than the depth of the adhesive container groove.

[0008] Furthermore, the bottom of the connecting groove slopes from the side of the top cover away from the solder pad towards the other side along the adhesive groove towards the device groove.

[0009] Furthermore, the edges of the adjacent sidewalls of the adhesive container are rounded.

[0010] Furthermore, slots are provided at both ends of the solder pads, and blocks are provided at both ends of the top cover. The blocks and slots are used in conjunction.

[0011] Furthermore, the card block is equipped with a guide section.

[0012] Furthermore, the guide part is located inside the slot, and the sides of the guide part facing the bottom and wall of the slot are provided with inclined surfaces. The inclined surfaces are inclined from the bottom or wall of the slot towards the pad along the top cover towards the card block.

[0013] Furthermore, observation slots are provided on both sides of the pad, and the observation slots connect the top and bottom surfaces of the pad.

[0014] The beneficial effects of the basic scheme: Unlike other electronic components, network filters require specialized enameled wires—wires with an insulating layer—to effectively prevent short circuits between densely wound coil turns caused by high-frequency electric fields. The insulation layer blocks current crosstalk between conductors, reducing energy loss caused by eddy currents during high-frequency operation and improving filtering efficiency. In practical applications, the inventors discovered that the internal enameled wires of network filters are prone to oxidation over long-term use. Oxidation mainly occurs at the ends where the enameled wire connects to the solder joints and at the solder joints themselves. Researching the assembly process of network filters, the inventors found that the solder joints are exposed after welding. During use, these exposed solder joints are susceptible to oxidation, leading to malfunctions and reduced lifespan.

[0015] Therefore, the inventors developed this solution to address the problem of easy oxidation of the enameled wire solder joints in network filters, which reduces the lifespan of the network filters. During assembly, the top cover is inverted with the component slots facing upwards. Adhesive is applied to the adhesive grooves on the top cover. After the coil assemblies are soldered to the pads, the pads close the top cover, sealing the component slots, adhesive grooves, and connection slots. At this point, the adhesive fills the adhesive grooves, and after curing, it forms an anti-oxidation layer.

[0016] In this design, the adhesive reservoir provides space for the anti-oxidation layer at the solder joints. Its rounded corners facilitate the filling of the reservoir with adhesive, improving the coverage of the solder joints. Compared to a flat surface, the adhesive reservoir effectively increases the contact area between the adhesive and the top cover, thereby enhancing the connection stability between the solder pads and the top cover.

[0017] The connecting groove allows the enameled wire end to pass through and be welded to the solder joint opposite the adhesive groove. Adhesive covers the solder joint, thus preventing oxidation of the enameled wire solder joint and extending the lifespan of the network filter. Simultaneously, when there is excessive adhesive, the connecting groove and the enameled wire guide the adhesive into the device groove, preventing it from overflowing and affecting the appearance of the network filter, thereby improving the production yield of the network filter. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of an embodiment of a patch network filter according to the present invention; Figure 2 This is an exploded view of an embodiment of a patch-type network filter according to the present invention; Figure 3 This is a schematic diagram of the pad structure of an embodiment of a patch-type network filter according to the present invention; Figure 4 This is a schematic diagram of the top cover structure of an embodiment of a patch-type network filter according to the present invention. Detailed Implementation

[0019] The following detailed description illustrates the specific implementation method: The reference numerals in the accompanying drawings include: pad 1, top cover 2, component slot 3, solder point 4, observation slot 5, card slot 6, adhesive slot 7, connection slot 8, card block 9, guide part 10, and coil assembly 11.

[0020] Example A patch-type network filter, as shown in the attached image. Figure 1 As shown, it includes a solder pad 1, a top cover 2 and a coil assembly 11. The solder pad 1 has multiple solder points 4, which are located on both sides of the solder pad 1. Specifically, the top and bottom surfaces of the solder pad 1 have multiple solder points 4. The solder points 4 on the top surface of the solder pad 1 are located on both sides of the top surface, and the solder points 4 on the bottom surface of the solder pad 1 are located on both sides of the bottom surface.

[0021] As attached Figure 2 , 3 As shown, multiple observation slots 5 are provided on both sides of the pad 1. The observation slots 5 connect the top and bottom surfaces of the pad 1. The observation slots 5 are arc-shaped slots. The number of observation slots 5 is the same as the number of solder points 4 on the bottom surface of the pad 1, and their positions correspond one-to-one. The setting of the observation slots 5 makes it easy to observe the soldering status when the network filter and the circuit board are soldered, thereby determining whether the network filter and the circuit board are soldered stably.

[0022] The coil assembly 11 is electrically connected to the solder point 4 via enameled wire. Specifically, the coil assembly 11 includes a magnetic ring and a coil wound on the magnetic ring. The end of the coil is soldered to the solder point 4 on the top surface of the solder pad 1. The coil uses enameled wire. In this embodiment, there are two sets of coil assemblies 11. Each set of coil assemblies 11 includes a main magnetic ring and a secondary magnetic ring. The secondary magnetic ring is smaller than the main magnetic ring. The axes of the main magnetic ring and the secondary magnetic ring are perpendicular. The axis of the main magnetic ring is perpendicular to the top surface of the solder pad 1, and the axis of the secondary magnetic ring is perpendicular to the distribution direction of the observation slot 5. The enameled wire is not shown in the figures. Those skilled in the art can design the enameled wire connection to different solder points 4 according to the actual application of the coil assembly 11 in the network filter.

[0023] The ends of the enameled wire that are electrically connected to the solder joint 4, as well as the solder joint 4, are provided with an anti-oxidation layer. Specifically, the top cover 2 is inverted, with the device slot 3 facing upwards. Adhesive is applied to the adhesive reservoir 7 on the top cover 2, the solder pad 1 is fastened to the top cover 2, the adhesive covers the solder joint 4, and then the adhesive is cured. The cured adhesive is the anti-oxidation layer.

[0024] As attached Figure 4 As shown, the top cover 2 is provided with a device slot 3 for accommodating the coil assembly 11. When the top cover 2 and the pad 1 are assembled, the coil assembly 11 is located in the device slot 3. The device slot 3 provides space for the coil assembly 11, reducing the damage to the coil assembly 11 during transportation and use.

[0025] The top cover 2 is also provided with a glue-containing groove 7 for accommodating the anti-oxidation layer. The edges of the adjacent side walls of the glue-containing groove 7 are rounded. The glue-containing groove 7 is directly opposite the soldering point 4. Specifically, there are two glue-containing grooves 7, which are located on both sides of the component groove 3 and are directly opposite the soldering points 4 on both sides of the top surface of the solder pad 1. In this design, the rounded edges of the glue-containing groove 7 make it easier for the glue to fill the glue-containing groove 7 compared to right angle edges.

[0026] The adhesive groove 7 is connected to the component groove 3. The top cover 2 also has a connecting groove 8. The connecting groove 8, component groove 3, and adhesive groove 7 are located on the same side of the top cover 2, and the two ends of the connecting groove 8 are connected to the component groove 3 and the adhesive groove 7, respectively. The depth of the connecting groove 8 is less than the depth of the adhesive groove 7. The bottom of the connecting groove 8 slopes from the side of the top cover 2 away from the pad 1 towards the component groove 3. Specifically, the bottom surface of the top cover 2 has a connecting groove 8, a connecting groove 8, and a component groove 3. The two ends of the connecting groove 8 are connected to the opposite sidewalls of the component groove 3 and the adhesive groove 7, respectively. In this embodiment, after the top cover 2 and the pad 1 are fastened together, the distance from the bottom of the connecting groove 8 to the pad 1 is less than the distance from the adhesive groove 7 to the pad 1. The end of the enameled wire passes through the connecting groove 8 and is electrically connected to the solder point 4 opposite the adhesive groove 7.

[0027] The pad 1 is used to seal the component slot 3, the adhesive slot 7 and the connection slot 8, thereby separating the coil assembly 11 from the outside world and further reducing the damage to the coil assembly 11 during transportation and use.

[0028] In this design, the connecting groove 8 connects the device groove 3 and the adhesive reservoir 7. When the pad 1 closes the top cover 2, the adhesive in the adhesive reservoir 7 can overflow into the device groove 3 along the connecting groove 8, thus preventing adhesive overflow. At the same time, the enameled wire of the coil assembly 11 in the device groove 3 will be electrically connected to the soldering point 4 of the pad 1 along the connecting groove 8. The adhesive covers the soldering point 4 to form an anti-oxidation layer, thus preventing oxidation of the enameled wire soldering point 4.

[0029] The pad 1 has slots 6 at both ends, and the top cover 2 has blocks 9 at both ends. The blocks 9 and slots 6 work together. Specifically, the slots 6 connect the top and bottom surfaces of the pad 1, and the bottom and sides of the slots 6 are rounded. The rounded corners serve two purposes: first, to reduce collision damage to the pad 1 and top cover 2 during assembly; and second, to guide the assembly process, facilitating positioning and assembly. The blocks 9 have guide parts 10 located within the slots 6. The guide parts 10 have inclined surfaces on their sides facing the bottom and sides of the slots 6, sloping from the bottom or sides of the slots 6 towards the blocks 9 along the direction from the top cover 2 towards the pad 1.

[0030] In this design, the design of the locking block 9 and the locking slot 6 facilitates the locking block 9's positioning via the locking slot 6 during engagement, thereby enabling quick and accurate engagement of the top cover 2 and the solder pad 1. The guide part 10 guides the locking block 9 during engagement of the top cover 2 and the solder pad 1. The inclined surface of the guide part 10 makes it smoother, reducing the risk of collision damage during engagement and facilitating the guidance of the locking block 9, allowing it to easily slide into the locking slot 6.

[0031] The specific implementation process is as follows: During assembly, the top cover 2 is inverted, with the component slot 3 facing upwards. Glue is applied to the adhesive reservoir 7 on the top cover 2. The coil assembly 11 is placed on the solder pad 1. The enameled wire in the coil assembly 11 is welded to the solder point 4 on the solder pad 1 by resistance welding. After welding, the solder pad 1 closes the top cover 2, and the solder pad 1 seals the component slot 3 on the top cover 2. At this time, the bottom surface of the top cover 2 abuts against the top surface of the solder pad 1. Glue fills the adhesive reservoir 7 and covers the solder point 4. After the glue cures, it forms an anti-oxidation layer.

[0032] In this design, the adhesive reservoir 7 provides space for the anti-oxidation layer of the solder joint 4. Its rounded corners facilitate the filling of the reservoir 7 with adhesive, improving the coverage of the solder joint 4. Compared to a flat surface, the adhesive reservoir 7 effectively increases the contact area between the adhesive and the top cover 2, thereby improving the connection stability between the solder pad 1 and the top cover 2. The connecting groove 8 allows the enameled wire end to pass through and weld to the solder joint 4 opposite the adhesive reservoir 7. The adhesive covers the enameled wire solder joint 4, thus preventing oxidation of the solder joint and extending the lifespan of the network filter. Simultaneously, when there is excessive adhesive, it can overflow along the connecting groove 8 into the device groove 3, preventing overflow from affecting the appearance of the network filter and improving the production yield of the network filter.

[0033] The above descriptions are merely embodiments of the present invention. Commonly known structures and characteristics are not described in detail here. Those skilled in the art are aware of all common technical knowledge in the field prior to the application date or priority date, are aware of all existing technologies in that field, and have the ability to apply conventional experimental methods prior to that date. Those skilled in the art can, under the guidance of this application, improve and implement this solution in combination with their own capabilities. Some typical known structures or methods should not be obstacles for those skilled in the art to implement this application. It should be noted that those skilled in the art can make several modifications and improvements without departing from the structure of the present invention. These should also be considered within the scope of protection of the present invention, and will not affect the effectiveness of the implementation of the present invention or the practicality of the patent. The scope of protection claimed in this application should be determined by the content of its claims, and the specific embodiments described in the specification can be used to interpret the content of the claims.

Claims

1. A surface-mount network filter, comprising pads, a top cover, and a coil assembly, wherein the pads have multiple solder points, the coil assembly is electrically connected to the solder points via enameled wire, and the top cover has a device slot for accommodating the coil assembly, the pads being used to close the device slot, characterized in that: The ends of the enameled wire that are electrically connected to the solder joint, as well as the solder joint itself, are provided with an anti-oxidation layer. The top cover is also provided with a glue-containing tank for accommodating the anti-oxidation layer. The glue-containing tank is connected to the device tank and is directly opposite the solder joint. The solder pad is also used to seal the glue-containing tank.

2. A patch-type network filter according to claim 1, characterized in that: The top cover is also provided with a connecting groove. The connecting groove, the component groove and the adhesive groove are located on the same side of the top cover, and the two ends of the connecting groove are connected to the component groove and the adhesive groove respectively. The end of the enameled wire passes through the connecting groove and is electrically connected to the soldering point opposite the adhesive groove.

3. A patch-type network filter according to claim 2, characterized in that: The solder joints on the pads are located on both sides of the pads, and there are two adhesive reservoirs, each facing the solder joint on one side of the pad.

4. A patch-type network filter according to claim 3, characterized in that: The depth of the connecting groove is less than the depth of the adhesive container groove.

5. A patch-type network filter according to claim 4, characterized in that: The bottom of the connecting groove slopes from the side of the top cover away from the solder pad towards the other side, along the adhesive groove towards the device groove.

6. A patch-type network filter according to claim 5, characterized in that: The edges of the adjacent sidewalls of the adhesive container are rounded.

7. A patch-type network filter according to claim 6, characterized in that: The pads have slots at both ends, and the top cover has blocks at both ends. The blocks and slots work together.

8. A patch-type network filter according to claim 7, characterized in that: The card block is equipped with a guide section.

9. A patch-type network filter according to claim 8, characterized in that: The guide is located inside the slot. The guide has inclined surfaces on its sides facing the bottom and wall of the slot. The inclined surfaces slope from the bottom or wall of the slot toward the pad along the top cover toward the card block.

10. A patch-type network filter according to claim 9, characterized in that: The pads have observation slots on both sides, which connect the top and bottom surfaces of the pads.

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