Signal transmission isolation device, signal isolation transmission circuit and electronic equipment

Abstract

The invention provides a signal transmission isolation device, a signal isolation transmission circuit and electronic equipment, and belongs to the technical field of communication. The signal transmission isolation device comprises a substrate, a first piezoelectric assembly and a second piezoelectric assembly, wherein the first piezoelectric assembly and the second piezoelectric assembly are arranged on the substrate. Wherein the first piezoelectric assembly comprises a first electrode, a first piezoelectric layer and a second electrode which are sequentially arranged in the direction away from the substrate, and orthographic projections of any two of the first electrode, the first piezoelectric layer and the second electrode on the substrate are at least partially overlapped; the second piezoelectric assembly comprises a third electrode, a second piezoelectric layer and a fourth electrode which are sequentially arranged in the direction away from the substrate, and orthographic projections of any two of the third electrode, the second piezoelectric layer and the fourth electrode on the substrate are at least partially overlapped.

Description

Technical Field

[0001] This disclosure belongs to the field of communication technology, and specifically relates to a signal transmission isolation device, a signal isolation transmission circuit, and an electronic device. Background Technology

[0002] Signal transmission isolation devices are widely used in many fields such as electronic systems and industrial control. They can protect equipment from damage, reduce interference between upstream and downstream circuits, decouple upstream and downstream circuits, and enhance system maintainability. Common isolators include optocouplers, magnetic coupling isolators, and capacitive isolators. Optocouplers achieve signal isolation through photoelectric conversion, magnetic coupling isolators achieve isolation through electromagnetic induction, and capacitive isolators achieve isolation through transient electric fields. All of these have problems such as large size, high cost, and difficulty in integration. Summary of the Invention

[0003] The present invention aims to at least solve one of the technical problems existing in the prior art, and provides a signal transmission isolation device, which includes a substrate and a first piezoelectric component and a second piezoelectric component disposed on the substrate.

[0004] The first piezoelectric component includes a first electrode, a first piezoelectric layer, and a second electrode arranged sequentially in a direction away from the substrate, and the orthogonal projections of any two of the three on the substrate at least partially overlap; the second piezoelectric component includes a third electrode, a second piezoelectric layer, and a fourth electrode arranged sequentially in a direction away from the substrate, and the orthogonal projections of any two of the three on the substrate at least partially overlap.

[0005] In some embodiments, the first piezoelectric component and the second piezoelectric component are disposed on the same side of the substrate and are disposed in the same layer;

[0006] The first piezoelectric component includes a main body and at least two branches connected to the main body, wherein the main body and the branches extend in different directions; each branch is disposed on the same side of the main body, and two adjacent branches are connected to the main body to form a groove; both the main body and the branches include a first electrode, a first piezoelectric layer and a second electrode arranged sequentially along a direction away from the substrate.

[0007] The second piezoelectric component includes at least one sub-part; the sub-part is disposed within the groove; the sub-part includes the third electrode, the second piezoelectric layer, and the fourth electrode arranged sequentially in a direction away from the substrate.

[0008] In some embodiments, the first piezoelectric component and the second piezoelectric component are disposed on the same side of the substrate and are disposed in the same layer;

[0009] The first piezoelectric component includes a first main body and a plurality of first branches connected to the first main body and disposed on the same side of the first main body; the first main body and the first branches extend in different directions, and both include a first electrode, a first piezoelectric layer and a second electrode arranged sequentially along the direction away from the substrate.

[0010] The second piezoelectric component includes a second main body and a plurality of second branches connected to the second main body and disposed on the side of the second main body close to the first main body; the second main body and the second branches extend in different directions, and both include the third electrode, the second piezoelectric layer and the fourth electrode arranged sequentially in a direction away from the substrate.

[0011] The first main body and the second main body extend in the same direction, and the distance between them is less than the sum of the lengths of the first branch and the second branch; in the extending direction of the first main body, each of the first branch and each of the second branch are alternately arranged.

[0012] In some embodiments, the first piezoelectric component and the second piezoelectric component are disposed on the same side of the substrate and are disposed in the same layer;

[0013] Both the first piezoelectric component and the second piezoelectric component have a planar spiral structure. The first piezoelectric component includes a plurality of first sub-parts connected in sequence, with adjacent first sub-parts extending in different directions. The second piezoelectric component includes a plurality of second sub-parts connected in sequence, with adjacent second sub-parts extending in different directions. The first sub-part includes a first electrode, a first piezoelectric layer, and a second electrode arranged sequentially in a direction away from the substrate. The second sub-part includes a third electrode, a second piezoelectric layer, and a fourth electrode arranged sequentially in a direction away from the substrate.

[0014] At least one second sub-part is disposed between two adjacent first sub-parts with the same extension direction, and at least one first sub-part is disposed between two adjacent second sub-parts with the same extension direction.

[0015] In some embodiments, the first piezoelectric component and the second piezoelectric component are disposed on the same side of the substrate, the second piezoelectric component is disposed on the side of the first piezoelectric component away from the substrate, and an interlayer insulating layer is disposed between them.

[0016] The orthographic projections of the first piezoelectric component and the second piezoelectric component on the substrate at least partially overlap.

[0017] In some embodiments, the first piezoelectric component and the second piezoelectric component are disposed on both sides of the substrate along its thickness direction.

[0018] In some embodiments, the orthographic projections of the first piezoelectric layer and the second piezoelectric layer on the substrate both include any one of a rectangle, a triangle, or a circle.

[0019] In some embodiments, both the first piezoelectric layer and the second piezoelectric layer are made of a material with a piezoelectric constant greater than or equal to 6 C / m2.

[0020] This disclosure also provides a signal isolation transmission circuit, including the signal transmission isolation device described in the above embodiments.

[0021] In some embodiments, the signal preprocessing module and the signal amplification module are also included;

[0022] The signal preprocessing module is connected to the first piezoelectric component and is configured to preprocess the input signal and transmit the preprocessed signal to the first piezoelectric component.

[0023] The signal amplification module is connected to the second piezoelectric component and is configured to amplify the signal output by the second piezoelectric component before outputting it.

[0024] This disclosure also provides an electronic device, including the signal isolation transmission circuit described in the above embodiments. Attached Figure Description

[0025] Figure 1 This is a cross-sectional view of a signal transmission isolation device provided in an embodiment of this disclosure.

[0026] Figure 2 This is a top view of a signal transmission isolation device provided in an embodiment of this disclosure.

[0027] Figure 3 This is a top view of yet another signal transmission isolation device provided in an embodiment of this disclosure.

[0028] Figure 4 This is a top view of yet another signal transmission isolation device provided in an embodiment of this disclosure.

[0029] Figure 5 This is a top view of yet another signal transmission isolation device provided in an embodiment of this disclosure.

[0030] Figure 6 This is a top view of yet another signal transmission isolation device provided in an embodiment of this disclosure.

[0031] Figure 7This is a cross-sectional view of yet another signal transmission isolation device provided in an embodiment of this disclosure.

[0032] Figure 8 This is a cross-sectional view of yet another signal transmission isolation device provided in an embodiment of this disclosure.

[0033] Figure 9 This is a schematic diagram of the circuit structure of a signal isolation transmission circuit provided in an embodiment of this disclosure.

[0034] Figure 10 This is a schematic diagram of the circuit structure of another signal isolation transmission circuit provided in an embodiment of the present disclosure. Detailed Implementation

[0035] To enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0036] Unless otherwise defined, the technical or scientific terms used in this application shall have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms “a,” “an,” “an,” “the,” and similar words used in this application do not indicate quantity limitation and may indicate singular or plural. The terms “comprising,” “including,” “having,” and any variations thereof used in this application are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or device that includes a series of steps or modules (units) is not limited to the listed steps or units, but may also include steps or units not listed, or may include other steps or units inherent to these processes, methods, products, or devices. The terms “connected,” “linked,” “coupled,” and similar words used in this application are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. “Multiple” used in this application refers to two or more. “And / or” describes the relationship between related objects, indicating that three relationships may exist; for example, “A and / or B” can represent: A alone, A and B simultaneously, and B alone. The character " / " generally indicates that the preceding and following objects are in an "or" relationship. The terms "first," "second," and "third" used in this application are merely to distinguish similar objects and do not represent a specific ordering of objects. "Above," "below," "left," and "right" are only used to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0037] It should be understood that when a layer or element is referred to as being on another layer or substrate, it may mean that the layer or element is directly on the other layer or substrate, or that there is an intermediate layer between the layer or element and the other layer or substrate. Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views as idealized exemplary drawings. In the drawings, the thickness of layers and regions is enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Therefore, exemplary embodiments should not be construed as being limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing. Thus, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the regions of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0038] To address the problems of large size, high cost, and difficulty in integration of current isolators, this disclosure provides a signal transmission isolation device that utilizes the piezoelectric effect and the inverse piezoelectric effect to achieve signal transmission. The piezoelectric effect refers to the change in the internal electric dipole moment of a piezoelectric material due to deformation when subjected to mechanical stress, resulting in the generation of equal amounts of positive and negative charges on the surface of the piezoelectric material, thereby achieving the conversion of mechanical energy into electrical energy. The inverse piezoelectric effect refers to the stretching or compression of the internal electric dipole moment of a piezoelectric material when an electric field is applied, causing mechanical deformation, such as elongation or bending, and achieving the conversion of electrical energy into mechanical energy.

[0039] Figure 1 This is a schematic diagram of a signal transmission isolation device provided in an embodiment of this disclosure. (Refer to...) Figure 1The signal transmission isolation device includes a substrate 1 and a first piezoelectric component 21 and a second piezoelectric component 22 disposed on the substrate 1. Specifically, the first piezoelectric component 21 includes a first electrode 211, a first piezoelectric layer 212, and a second electrode 213 arranged sequentially in a direction away from the substrate 1. The second piezoelectric component 22 includes a third electrode 221, a second piezoelectric layer 222, and a fourth electrode 223 arranged sequentially in a direction away from the substrate 1. For the first piezoelectric component 21, the orthographic projections of any two of the first electrode 211, the first piezoelectric layer 212, and the second electrode 213 on the substrate 1 at least partially overlap. At least partially overlap means that the orthographic projections of the two on the substrate 1 completely overlap, or that the orthographic projection of one completely covers the orthographic projection of the other. Preferably, in order to improve the electromechanical conversion capability (i.e., the conversion capability between mechanical energy and electrical energy), the orthographic projections of the first electrode 211 and the second electrode 213 on the substrate 1 are arranged to completely cover the orthographic projection of the first piezoelectric layer 212 on the substrate 1. In other words, the areas of both the first electrode 211 and the second electrode 213 are larger than the area of ​​the first piezoelectric layer 212. Similarly, for the second piezoelectric component 22, the orthographic projections of any two of the third electrode 221, the second piezoelectric layer 222, and the fourth electrode 223 onto the substrate 1 at least partially overlap. Preferably, the orthographic projections of the third electrode 221 and the fourth electrode 223 onto the substrate 1 completely cover the orthographic projection of the second piezoelectric layer 222 onto the substrate 1.

[0040] During signal transmission, the signal transmission isolation device can transmit the signal losslessly from the input sub-circuit to the output sub-circuit. During transmission, the signal undergoes a process from electrical signal to mechanical signal and back to electrical signal. The input sub-circuit may include, for example, a single signal source, or a sub-circuit composed of a signal source and other components. The output sub-circuit may include, for example, multiple components, such as a signal amplifier. Because the input and output sub-circuits can be isolated by the signal transmission isolation device, it reduces interference between upstream and downstream circuits, improving the circuit's anti-interference capability and reliability. Specifically, during transmission, one of the first piezoelectric component 21 and the second piezoelectric component 22 serves as the input of the signal transmission isolation device, and the other as its output. Taking the first piezoelectric component 21 as the input and the second piezoelectric component 22 as the output as an example, the first piezoelectric component 21 is connected in series with the input sub-circuit, and the second output sub-circuit is also connected in series. In other words, the first electrode 211 and the second electrode 213 of the first piezoelectric component 21 are respectively connected to the two ends of the input sub-circuit, and the third electrode 221 and the fourth electrode 223 of the second piezoelectric component 22 are respectively connected to the two ends of the output sub-circuit. After the input sub-circuit applies power to the first electrode 211 and the second electrode 213, according to the piezoelectric effect, the first piezoelectric layer 212 deforms and vibrates under the action of the electric field, which drives the second piezoelectric component 22 to vibrate. The second piezoelectric layer 222 of the second piezoelectric component 22 is deformed by mechanical stress. According to the inverse piezoelectric effect, a corresponding charge change is generated on the second piezoelectric layer 222, and the charge change is converted into an electrical signal, which is transmitted to the output sub-circuit to drive the output sub-circuit to work.

[0041] In some examples, the substrate 1 can be, for example, a glass substrate or a silicon substrate. A thinner substrate 1 is more easily vibrated by the piezoelectric component, but an excessively thin substrate 1 has low hardness and strength, making it prone to breakage. Preferably, the thickness of the substrate 1 can be set to 100±20 μm. The first electrode 211, second electrode 213, third electrode 221, and fourth electrode 223 can, for example, comprise high-temperature oxidation-resistant materials such as titanium / platinum (Ti / Pt), indium tin oxide (ITO), gold (Au), ruthenium oxide (RuO2), and lanthanum nickelate (LaNiO3). The first piezoelectric layer 212 and the second piezoelectric layer 222 can, for example, have a piezoelectric constant greater than or equal to 6 C / m. 2The materials used include, for example, lead zirconate titanate (PZT), lead magnesium niobate-lead titanate (PMNT), lead metaniobate-barium lithium (PBLN), and barium titanate (BT). Materials with a high piezoelectric constant can generate a large voltage when subjected to mechanical stress, and vice versa, thus possessing efficient electromechanical conversion capabilities. In addition, materials with a high piezoelectric constant also have high strength and high stiffness, enabling them to withstand large mechanical stresses and ensuring that the first piezoelectric layer 212 and the second piezoelectric layer 222 have good stability and reliability even in complex mechanical environments.

[0042] Before introducing the specific structure, it should be noted that, to prevent energy waste due to an excessive difference in area between the electrodes and the piezoelectric layer, the shapes of the electrodes and the piezoelectric layer are basically the same, with the electrode area slightly larger than the piezoelectric layer area. For example, as... Figure 2 As shown, when the first piezoelectric layer 212 is rectangular, the first electrode 211 and the second electrode 213 are also rectangular; when the first piezoelectric layer 212 is circular, the first electrode 211 and the second electrode 213 are also circular; when the first piezoelectric layer 212 is spiral, the first electrode 211 and the second electrode 213 are also spiral; and so on. Of course, if other circuit requirements necessitate larger electrodes, the electrodes and the piezoelectric layer can be set to different shapes, such as... Figure 3 As shown, the first electrode 211 and the third electrode 213 are both rectangular in shape, the first piezoelectric layer 212 and the second electrode 213 are both circular in shape, and the second piezoelectric layer 222 and the fourth electrode 223 are both triangular in shape.

[0043] In some examples, such as Figure 1-6 As shown, the first piezoelectric component 21 and the second piezoelectric component 22 are disposed on the same side of the substrate 1 and are disposed in the same layer. The first piezoelectric component 21 and the second piezoelectric component 22 transmit the mechanical signal of vibration through the substrate 1. At this time, the first electrode 211 and the third electrode 221 can be formed by a one-time patterning process, the first piezoelectric layer 212 and the second piezoelectric layer 222 can be formed by a one-time patterning process, and the second electrode 213 and the fourth electrode 223 can be formed by a one-time patterning process.

[0044] To better transmit and sense displacement, the first piezoelectric component 21 and the second piezoelectric component 22 can be wound together to form a structure in which one partially surrounds the other. In a specific example, such as... Figure 4As shown, the first piezoelectric component 21 includes a main body 31 and at least two branch portions 32 connected to the main body 31, the branch portions 32 extending in a different direction from the main body 31. The at least two branch portions 32 are disposed on the same side of the main body 31 and connected to the main body 31 to form a comb-like structure. The comb-like structure includes multiple grooves, each groove being formed by the connection of the main body 31 and two adjacent branch portions 32. The second piezoelectric component 22 includes at least one sub-part 33, one sub-part 33 being disposed correspondingly within one groove of the comb-like structure. Thus, each sub-part 33 is partially surrounded by the main body 31 and the two branch portions 32, thereby improving signal transmission efficiency and transmission quality.

[0045] In another specific example, such as Figure 5 As shown, the first piezoelectric component 21 includes a first main body 41 and a plurality of first branches 42 connected to the first main body 41. The first main body 41 and the first branches 42 extend in different directions. The second piezoelectric component 22 includes a second main body 43 and a plurality of second branches 44 connected to the second main body 43. The extension direction of the second main body 43 is the same as the extension direction of the second branches 44, and the extension direction of the second branches 44 is the same as the extension direction of the first branches 42. Further, the first main body 41 and the second main body 43 are disposed opposite to each other. Each first branch 42 is disposed on the side of the first main body 41 near the second main body 43 and is spaced apart along the extension direction of the first main body 41. Each second branch 44 is disposed on the side of the second main body 43 near the first main body 41 and is spaced apart along the extension direction of the first main body 41. Thus, the first piezoelectric component 21 and the second piezoelectric component 22 each form a comb-like structure. To improve aesthetics and uniformity of arrangement, first branch portions 42 and second branch portions 44 are alternately arranged along the extension direction of the first main body portion 41. Furthermore, the distance between the first main body portion 41 and the second main body portion 43 is less than the sum of the lengths of the first branch portions 42 and the second branch portions 44. In this case, the two comb-like structures are partially interlocked, with each first branch portion 42 partially surrounded by the second main body portion 43 and the two second branch portions 44, and each second branch portion 44 partially surrounded by the first main body portion 41 and the two first branch portions 42. This improves signal transmission efficiency and quality.

[0046] In yet another specific example, such as Figure 6 As shown, both the first piezoelectric component 21 and the second piezoelectric component 22 are planar spiral structures. The first piezoelectric component 21 includes a plurality of sequentially connected first sub-parts 51, with adjacent first sub-parts 51 extending in different directions. The second piezoelectric component 22 includes a plurality of sequentially connected second sub-parts 52, with adjacent second sub-parts 52 extending in different directions. (Refer to...) Figure 3Both the first sub-part 51 and the second sub-part 52 are linear structures. The extending directions of two adjacent first sub-parts 51 are perpendicular to each other, and the extending directions of two adjacent second sub-parts 52 are also perpendicular to each other. At least one second sub-part 52 is provided between every two adjacent first sub-parts 51 with the same extending direction, and the at least one second sub-part 52 includes one second sub-part 52 with the same extending direction as the aforementioned first sub-part 51. Similarly, at least one first sub-part 51 is provided between two adjacent second sub-parts 52 with the same extending direction, and the at least one first sub-part 51 includes one first sub-part 51 with the same extending direction as the aforementioned second sub-part 52. Thus, the first piezoelectric component 21 and the second piezoelectric component 22 are intertwined, which is beneficial for improving signal transmission efficiency and transmission quality. Of course, the planar helical structure is not limited to... Figure 6 As shown in the structure, the first piezoelectric component 21 and the second piezoelectric component 22 can also be a planar spiral structure with a circular outline. In this case, the first sub-part 51 and the second sub-part 52 are both arc-shaped structures, and the first piezoelectric component 21 and the second piezoelectric component have better compressive strength.

[0047] In other examples, the first piezoelectric component 21 and the second piezoelectric component 22 are disposed on the same side of the substrate 1, but on different layers. Specifically, refer to... Figure 7 A first piezoelectric component 21 is disposed on a substrate 1, and a second piezoelectric component 22 is disposed on the side of the first piezoelectric component 21 facing away from the substrate 1. An interlayer insulating layer 6 is disposed between the first piezoelectric component 21 and the second piezoelectric component 22 to insulate the second electrode 213 from the third electrode 221. The interlayer insulating layer 6 may include insulating materials such as polyvinyl chloride (PVC), cross-linked polyethylene (XLPE), or rubber. In this case, the first piezoelectric component 21 and the second piezoelectric component 22 can transmit vibrational mechanical signals through the interlayer insulating layer 6. To ensure structural stability, the orthographic projection of the first piezoelectric component 21 on the substrate 1 completely covers the orthographic projection of the second piezoelectric component 22 on the substrate 1. For example, the orthographic projections of the first piezoelectric component 21 and the second piezoelectric component 22 on the substrate 1 may include any one of a rectangle, a circle, or a triangle. The first piezoelectric component 21 and the second piezoelectric component 22 may have the same shape, or they may be designed with different shapes as needed; this disclosure does not impose any limitations in this regard.

[0048] In addition to placing the first piezoelectric component 21 and the second piezoelectric component 22 on the same side of the substrate 1, in some examples, the first piezoelectric component 21 and the second piezoelectric component 22 can also be placed on different sides of the substrate 1. In this case, the first piezoelectric component 21 and the second piezoelectric component 22 transmit signals by causing the substrate 1 to vibrate. Specifically, for example... Figure 8As shown, the substrate 1 has a first surface and a second surface disposed along its thickness direction. A first piezoelectric component 21 is disposed on the first surface side, and a second piezoelectric component 22 is disposed on the second surface side. The orthographic projections of the first piezoelectric component 21 and the second piezoelectric component 22 on the substrate 1 can completely overlap, partially overlap, or not overlap at all. Preferably, in order to improve signal transmission efficiency, the orthographic projections of the first piezoelectric component 21 and the second piezoelectric component 22 on the substrate 1 are configured to partially overlap or completely overlap.

[0049] This disclosure also provides a method for fabricating the signal transmission isolation device described in the above embodiments. Specifically, for the signal transmission isolation device in which the first piezoelectric component 21 and the second piezoelectric component 22 are disposed on the same side of the substrate 1 and in the same layer, the fabrication method includes steps S1 and S12.

[0050] S1. Provide a substrate 1.

[0051] The substrate 1 can be a glass substrate or a silicon substrate. In some examples, step S1 further includes cleaning the substrate 1. The cleaning method may specifically include cleaning the substrate 1 using a standard cleaning process. The cleaning method for the substrate 1 may include: alkaline cleaning, immersing the substrate 1 in a solution containing sodium hydroxide or ammonium hydroxide (commonly with a solution concentration of 5%–10%), which can remove organic matter and metal ions from the silicon wafer surface; acidic cleaning, immersing the substrate 1 in a solution containing hydrofluoric acid or hydrochloric acid (commonly with a solution concentration of 10%–30%), which can remove oxides and silica gel impurities from the substrate 1 surface; oxidative cleaning, immersing the substrate 1 in a solution containing potassium hydroxide or hydrogen peroxide (commonly with a solution concentration of 5%–10%), which can remove carbon and metal elements from the substrate 1 surface; and ultrapure water cleaning, immersing or spraying the substrate 1 in ultrapure water, which can remove small particles from the substrate 1 surface.

[0052] S12. A metal conductive layer is formed on the substrate 1, and a pattern including a first electrode 211 and a third electrode 221 is formed by a patterning process; a piezoelectric material layer is formed on the side of the first electrode 211 and the third electrode 221 away from the substrate 1, and a pattern including a first piezoelectric layer 212 and a second piezoelectric layer 222 is formed by a patterning process; a metal conductive layer is formed on the side of the first piezoelectric layer 212 and the second piezoelectric layer 222 away from the substrate 1, and a pattern including a second electrode 213 and a fourth electrode 223 is formed by a patterning process.

[0053] For a signal transmission isolation device in which the first piezoelectric component 21 and the second piezoelectric component 22 are disposed on the same side of the substrate 1 and are stacked together, the fabrication method includes the above-mentioned step S1 and the following step S22.

[0054] S22. A conductive metal layer is formed on the substrate 1, and a pattern including a first electrode 211 is formed by a patterning process; a piezoelectric material layer is formed on the side of the first electrode 211 away from the substrate 1, and a pattern including a first piezoelectric layer 212 is formed by a patterning process; a conductive metal layer is formed on the side of the first piezoelectric layer 212 away from the substrate 1, and a pattern including a second electrode 213 is formed by a patterning process; an insulating material layer is formed on the side of the second electrode 213 away from the substrate 1, serving as an interlayer insulating layer; a conductive metal layer is formed on the side of the interlayer insulating layer away from the substrate 1, and a pattern including a third electrode 221 is formed by a patterning process; a piezoelectric material layer is formed on the side of the third electrode 221 away from the substrate 1, and a pattern including a second piezoelectric layer 222 is formed by a patterning process; a conductive metal layer is formed on the side of the second piezoelectric layer 222 away from the substrate 1, and a pattern including a fourth electrode 223 is formed by a patterning process. The orthographic projections of the third electrode 221, the second piezoelectric layer 222, and the fourth electrode 223 onto the substrate 1 are all within the defined range of the orthographic projection of the first piezoelectric component 21 onto the substrate 1.

[0055] For the signal transmission isolation device with the first piezoelectric component 21 and the second piezoelectric component 22 disposed on both sides of the substrate 1, the fabrication method includes the above-mentioned step S1 and the following steps S32 and S33.

[0056] S32. A metal conductive layer is formed on the first surface of the substrate 1, and a pattern including the first electrode 211 is formed by a patterning process; a piezoelectric material layer is formed on the side of the first electrode 211 away from the substrate 1, and a pattern including the first piezoelectric layer 212 is formed by a patterning process; a metal conductive layer is formed on the side of the first piezoelectric layer 212 away from the substrate 1, and a pattern including the second electrode 213 is formed by a patterning process.

[0057] S33. The substrate 1 is inverted, and a piezoelectric material layer is formed on the second surface of the substrate 1. A pattern including the second piezoelectric layer 222 is formed by a patterning process. A metal conductive layer is formed on the side of the second piezoelectric layer 222 away from the substrate 1. A pattern including the fourth electrode 223 is formed by a patterning process.

[0058] In the aforementioned steps, the conductive metal layer may include, for example, high-temperature oxidation-resistant materials such as titanium / platinum (Ti / Pt), indium tin oxide (ITO), gold (Au), ruthenium oxide (RuO2), and lanthanum nickelate (LaNiO3), and can be deposited by magnetron sputtering. The piezoelectric material layer may include, for example, lead zirconate titanate (PZT), lead magnesium niobate-lead titanate (PMNT), lead metaniobate-barium lithium (PBLN), and barium titanate (BT), and can be deposited using sol-gel, magnetron sputtering, or aerosol methods. The interlayer insulating layer may include, for example, insulating materials such as polyvinyl chloride (PVC), cross-linked polyethylene (XLPE), or rubber, and can be formed by a deposition process.

[0059] As can be seen from the above fabrication process, the signal transmission isolation device of this application has a simple structure and low manufacturing cost. The piezoelectric component can be fabricated into a large-area thin film on the substrate, which helps to reduce the size of the signal transmission isolation device and has broad application prospects. Furthermore, this signal transmission isolation device also has good high-temperature oxidation resistance and can maintain stable performance in harsh working environments, further expanding its application range.

[0060] This disclosure also provides a signal isolation transmission circuit, which includes the signal isolation transmission device described in the above embodiments. Figure 9 This is a detailed architecture diagram of a signal isolation transmission circuit. Figure 10 This is a detailed architecture diagram of another type of signal isolation transmission circuit. For example... Figure 9-10 As shown, in addition to the signal isolation transmission device, the signal isolation transmission circuit also includes a signal input sub-circuit and a signal output sub-circuit. The signal input sub-circuit is connected to the first piezoelectric component 21 and is used to input analog or digital signals. The signal output sub-circuit is connected to the second piezoelectric component 22 and is used to output signals.

[0061] Specifically, the signal input sub-circuit includes a signal source, which can be an analog signal source or a digital signal source. In addition to the signal source, the signal input sub-circuit also includes a signal preprocessing module 7 connected to the signal source, configured to pre-amplify the signal input to the signal source to improve its anti-interference capability. For example, Figure 9 As shown, when the signal source is an analog signal source, the signal preprocessing module 7 includes an amplifier and a power supply to control the amplifier's operation. The amplifier can amplify the analog signal without distortion. When the signal source is a digital signal source, as shown... Figure 10 As shown, the signal preprocessing module 7 includes a DC source and a switch. The effective value of the DC source is greater than the effective value of the digital signal source. The digital signal source is used to control the switch. In this way, the signal input sub-circuit can output a digital signal with the same waveform and duty cycle as the signal output by the digital signal source, but with a larger amplitude, thereby amplifying the signal.

[0062] Subsequently, the signal, amplified by the signal preprocessing module 7, is transmitted to the first piezoelectric component 21, causing it to vibrate. This vibration, in turn, drives the second piezoelectric component 22 to vibrate. The second piezoelectric component 22 generates a corresponding charge according to the inverse piezoelectric effect and transmits it to the signal output sub-circuit. The signal output sub-circuit converts the charge generated by the second piezoelectric component 22 into a voltage signal; this function can be achieved through a charge amplification circuit or an integrator circuit. (Refer to...) Figure 9-10 In the signal isolation transmission circuit of this application, the signal output sub-circuit includes an amplifier, multiple capacitors Cd and Cf connected to the amplifier, and multiple resistors Ri, Rd, and Rf. Utilizing the concept of virtual short at the amplifier input, the signal output sub-circuit can directly integrate the charge signal on the second piezoelectric component 22 into the integrating capacitor in the circuit. At this time, the amplifier output is the sum of all the charge quantities, realizing the conversion of charge into a voltage signal.

[0063] In the signal transmission process of the signal isolation transmission circuit of this application, due to the combination of piezoelectric material layer and metal conductive layer, the piezoelectric effect and inverse piezoelectric effect of piezoelectric material are used to transmit signals, thus effectively achieving signal isolation, improving the anti-interference ability of signals, and thereby improving the accuracy and efficiency of signal transmission.

[0064] This disclosure also provides an electronic device that includes the signal isolation transmission circuit described in the above embodiments.

[0065] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of the present invention, and the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A signal transmission isolation device, comprising a substrate, and a first piezoelectric component and a second piezoelectric component disposed on the substrate; The first piezoelectric component includes a first electrode, a first piezoelectric layer, and a second electrode arranged sequentially in a direction away from the substrate, and the orthogonal projections of any two of the three on the substrate at least partially overlap; the second piezoelectric component includes a third electrode, a second piezoelectric layer, and a fourth electrode arranged sequentially in a direction away from the substrate, and the orthogonal projections of any two of the three on the substrate at least partially overlap.

2. The signal transmission isolation device according to claim 1, wherein, The first piezoelectric component and the second piezoelectric component are disposed on the same side of the substrate, and are disposed in the same layer; The first piezoelectric component includes a main body and at least two branches connected to the main body, wherein the main body and the branches extend in different directions; each branch is disposed on the same side of the main body, and two adjacent branches are connected to the main body to form a groove; both the main body and the branches include a first electrode, a first piezoelectric layer and a second electrode arranged sequentially along a direction away from the substrate. The second piezoelectric component includes at least one sub-part; the sub-part is disposed within the groove; the sub-part includes the third electrode, the second piezoelectric layer, and the fourth electrode arranged sequentially in a direction away from the substrate.

3. The signal transmission isolation device according to claim 1, wherein, The first piezoelectric component and the second piezoelectric component are disposed on the same side of the substrate, and are disposed in the same layer; The first piezoelectric component includes a first main body and a plurality of first branches connected to the first main body and disposed on the same side of the first main body; the first main body and the first branches extend in different directions, and both include a first electrode, a first piezoelectric layer and a second electrode arranged sequentially along the direction away from the substrate. The second piezoelectric component includes a second main body and a plurality of second branches connected to the second main body and disposed on the side of the second main body close to the first main body; The second main body and the second branch extend in different directions, and both include the third electrode, the second piezoelectric layer and the fourth electrode arranged sequentially in a direction away from the substrate. The first main body and the second main body extend in the same direction, and the distance between them is less than the sum of the lengths of the first branch and the second branch; in the extending direction of the first main body, each of the first branch and each of the second branch are alternately arranged.

4. The signal transmission isolation device according to claim 1, wherein, The first piezoelectric component and the second piezoelectric component are disposed on the same side of the substrate, and are disposed in the same layer; Both the first piezoelectric component and the second piezoelectric component have a planar spiral structure. The first piezoelectric component includes a plurality of first sub-parts connected in sequence, with adjacent first sub-parts extending in different directions. The second piezoelectric component includes a plurality of second sub-parts connected in sequence, with adjacent second sub-parts extending in different directions. The first sub-part includes a first electrode, a first piezoelectric layer, and a second electrode arranged sequentially in a direction away from the substrate. The second sub-part includes a third electrode, a second piezoelectric layer, and a fourth electrode arranged sequentially in a direction away from the substrate. At least one second sub-part is disposed between two adjacent first sub-parts with the same extension direction, and at least one first sub-part is disposed between two adjacent second sub-parts with the same extension direction.

5. The signal transmission isolation device according to claim 1, wherein, The first piezoelectric component and the second piezoelectric component are disposed on the same side of the substrate, the second piezoelectric component is disposed on the side of the first piezoelectric component away from the substrate, and an interlayer insulating layer is disposed between the two. The orthographic projections of the first piezoelectric component and the second piezoelectric component on the substrate at least partially overlap.

6. The signal transmission isolation device according to claim 1, wherein, The first piezoelectric component and the second piezoelectric component are disposed on both sides of the substrate along its thickness direction.

7. The signal transmission isolation device according to claim 1, wherein, The orthographic projections of the first piezoelectric layer and the second piezoelectric layer onto the substrate both include any one of a rectangle, a triangle, or a circle.

8. The signal transmission isolation device according to claim 1, wherein, Both the first and second piezoelectric layers have a piezoelectric constant greater than or equal to 6 C / m. 2 Materials.

9. A signal isolation transmission circuit, comprising a signal transmission isolation device as described in any one of claims 1-8.

10. The signal isolation transmission circuit according to claim 9, wherein, It also includes a signal preprocessing module and a signal amplification module; The signal preprocessing module is connected to the first piezoelectric component and is configured to preprocess the input signal and transmit the preprocessed signal to the first piezoelectric component. The signal amplification module is connected to the second piezoelectric component and is configured to amplify the signal output by the second piezoelectric component before outputting it.

11. An electronic device comprising the signal isolation transmission circuit as described in claim 9 or 10.

Images