Laser film opening machine and using method thereof

Abstract

The invention relates to the technical field of laser film opening, and discloses a laser film opening machine and a using method thereof. A basket lifting module, an empty basket transferring module, a telescopic belt line module, a silicon wafer centering module, a silicon wafer caching module, an NG blanking module, an AOI module, a hidden crack detection module, an L-shaped swing arm module, a processing platform deck module, a visual positioning module and a reflector path module are mounted on the machine shell, and the basket lifting module is used for lifting a basket and is matched with a telescopic belt to unstack silicon wafers; the multi-station rotating disc type structural design is adopted, the stations of feeding, positioning, machining, discharging and the like operate synchronously, the efficiency bottleneck of serial traditional linear conveying procedures is avoided, meanwhile, the system is provided with the L-shaped swing arm module, feeding and discharging are synchronous, the working efficiency is improved, and the working efficiency is improved. The coordination and continuity of the production process are optimized, the transmission efficiency of silicon wafers is improved, and the batch processing capacity of photovoltaic cells is also improved.

Description

Technical Field

[0001] This invention relates to the field of laser film-opening technology, specifically to a laser film-opening machine and its usage method. Background Technology

[0002] In the manufacturing process of photovoltaic cells, the preparation of interdigitated PN junctions, optimization of surface passivation layers, and efficient metallization are the core steps to improve cell performance. Among these, laser delamination technology can precisely remove the back passivation film of solar cells, forming windows for ohmic contact paste. This not only reduces the cost of PN junction preparation but also allows for flexible control of the position and precision of the contact area. It is a key process step for improving efficiency and reducing costs in the large-scale production of photovoltaic cells. Therefore, laser delamination machines have become an indispensable core piece of equipment in the photovoltaic cell manufacturing process. The laser wafer forming machine is mainly composed of multiple functional modules working together to achieve automated silicon wafer processing. Among them, the basket lifting module is responsible for lifting and fixing the silicon wafer basket, and works with the telescopic belt to complete the unpacking and loading of silicon wafers; the transmission module is responsible for transferring silicon wafers between various workstations, ensuring stable transport; the positioning module combines initial and fine positioning to ensure the accuracy of the silicon wafer processing position; the processing module uses laser shaping and focusing to achieve high-precision etching of the passivation film; the loading and unloading module is responsible for the transfer of silicon wafers between the buffer area and the processing stage; and the inspection module is used to screen qualified silicon wafers to ensure product quality. Existing laser wafer-opening machines still have significant shortcomings in practical applications. On the one hand, the equipment uses a linear conveying method, requiring sequential processes such as feeding, positioning, and processing, which prevents synchronous operation of each station and results in low overall processing efficiency. On the other hand, traditional feeding methods often rely on XYZ robotic arms or 6-axis robots, which can easily generate stress due to mechanical contact during silicon wafer gripping, leading to a high breakage rate and limited feeding speed. In addition, some equipment adopts a single station and single laser head design to pursue high production capacity, resulting in bulky equipment that occupies a large area of ​​production space and is not conducive to a compact production line layout. Summary of the Invention

[0003] The purpose of this invention is to provide a laser wafer opening machine and its usage method, solving the following technical problems: Existing equipment uses linear conveying, with feeding, positioning, and processing performed sequentially, making it impossible for each station to operate synchronously, resulting in low overall processing efficiency. Silicon wafer gripping is prone to stress due to mechanical contact, leading to a high breakage rate and limited feeding speed. Furthermore, the equipment is large in size, occupying a large production area, which is not conducive to a compact production line layout.

[0004] The objective of this invention can be achieved through the following technical solution: A laser film-opening machine, comprising a housing, on which are installed a flower basket lifting module, an empty flower basket transfer module, a telescopic belt conveyor module, a silicon wafer centering module, a silicon wafer buffer module, an NG unloading module, an AOI module, a microcrack detection module, an L-shaped swing arm module, a processing platform module, a vision positioning module, and an external optical path module; The flower basket lifting module is used for lifting flower baskets and works with telescopic belts to unpack silicon wafers. The empty flower basket transfer module is used to transfer empty flower baskets from the loading position to the unloading position for receiving materials; The telescopic belt conveyor module is used to remove / place silicon wafers from / in a basket; The silicon wafer alignment module is used for the initial positioning of the product. The silicon wafer buffer module is used to buffer products when there is a waiting period during loading or unloading. The NG unloading module is used for unloading NG products; The AOI module is used to detect whether a product has passed processing. The microcrack detection module is used to detect whether a product has microcracks. The L-shaped swing arm module is used for product loading and unloading; The processing platform module consists of a loading station, a positioning station, a processing station, and an unloading station; The visual positioning module can perform visual positioning of the product; The external optical path module is used for product processing through the shaping, modulation, and focusing of lasers.

[0005] As a preferred embodiment of the present invention: the flower basket lifting module includes a lead screw module, one side of which is fixedly connected to the housing, a downward limiting block is installed on one side of the lead screw module, a downward pressing cylinder is fixedly connected to the top of the downward limiting block, a silicon wafer straightening plate is installed at the bottom of one side of the lead screw module, a flower basket blocking block is fixedly connected to the bottom of one side of the silicon wafer straightening plate, a flower basket conveying line is fixedly connected to one side of the flower basket blocking block, a clamping cylinder is fixedly connected to one side of the flower basket blocking block, and a silicon wafer detection sensor is fixedly connected to one side of the downward limiting block. The empty flower basket transfer module includes two mounting plates, both of which are fixedly connected to the bottom of the housing. Multiple evenly distributed transmission wheels are rotatably connected to one side of the mounting plate. A transmission belt is installed on the outer wall of the transmission wheels. A guide plate is fixedly connected to one side of the mounting plate. A motor is fixedly connected to one side of the mounting plate. The drive end of the motor is installed on the transmission wheel. A pressure plate is fixedly connected to one side of the top of the mounting plate. The telescopic belt conveyor module includes a mounting frame, which is fixedly connected to the top of the housing. A telescopic plate is fixedly connected to the top of the mounting frame, and telescopic belts are provided on both sides of the telescopic plate. A capacitive sensor is fixedly connected to one side of the telescopic plate, and a proximity sensor is fixedly connected to one side of the mounting frame. A telescopic cylinder is fixedly connected inside the mounting frame, and the telescopic end of the telescopic cylinder is fixedly connected to the bottom of the telescopic plate. A second motor is fixedly connected to one side of the mounting frame, and the drive end of the second motor is mounted on the telescopic belt.

[0006] As a preferred embodiment of the present invention: the silicon wafer alignment module includes a base plate, which is fixedly connected to the top of the housing. A geared motor is fixedly connected to one side of the base plate. A drive wheel is rotatably connected inside one side of the base plate, and a driven wheel is rotatably connected inside the other side of the base plate. A synchronous belt is installed on the outer wall of the drive wheel and the driven wheel. The drive end of the geared motor is fixedly connected to one side of the drive wheel. Two position adjustment plates are fixedly connected to the outer wall of the synchronous belt. A guide rail is fixedly connected to the top of the base plate. The bottom of the position adjustment plate is slidably connected to the outer wall of the guide rail. A sensor is fixedly connected to one side of the top of the base plate. An angle adjustment plate is fixedly connected to the top of the position adjustment plate. A plurality of evenly distributed guide wheels are fixedly connected to the top of the angle adjustment plate.

[0007] As a preferred embodiment of the present invention: the silicon wafer cache module includes a second lead screw module, one side of which is fixedly connected to the top of the housing, a width adjustment rod is installed on one side of the second lead screw module, and a toothed bar is installed at the bottom of the width adjustment rod; The NG unloading module includes a fixing block, the bottom of which is fixedly connected to the top of the housing, a rodless cylinder is fixedly connected to the bottom of the fixing block, a Bernoulli suction cup is installed inside the fixing block, and an NG material tray is installed on the top of the Bernoulli suction cup.

[0008] As a preferred embodiment of the present invention: the AOI module includes a fixing block, the bottom of the fixing block is fixedly connected to the top of the housing, a height adjustment plate is fixedly connected to one side of the top of the fixing block, a camera adjustment plate is fixedly connected inside the height adjustment plate, a camera lens is fixedly connected to the bottom of the camera adjustment plate, and a light source is fixedly connected to one side of the fixing block. The microcrack detection module includes a profile frame, the bottom of which is fixedly connected to the top of the housing, a line scan camera lens is fixedly connected to one side of the profile frame, and a laser light source is fixedly connected to one side of the profile frame.

[0009] As a preferred embodiment of the present invention: the L-shaped swing arm module includes a support block, the bottom of which is fixedly connected to the top of the housing, and an L-shaped swing arm is rotatably connected to the top of the support block. Two suction cup fixing plates are slidably connected inside the L-shaped swing arm. Two feeding Bernoulli suction cups are installed on one side of one suction cup fixing plate, and two unloading Bernoulli suction cups are installed on one side of the other suction cup fixing plate. A limit block is fixedly connected to the top of the support block, a pressure gauge is fixedly connected to the top of the housing, and a second geared motor is fixedly connected to one side of the support block. The drive end of the second geared motor is fixedly connected inside the L-shaped swing arm.

[0010] As a preferred embodiment of the present invention: the processing platform module includes a high-speed motor, the bottom of which is fixedly connected to the top of the housing, a rotary table is fixedly connected to the top of the high-speed motor, a pneumatic slip ring is installed on the top of the rotary table, a plurality of evenly distributed adsorption platforms are installed on the top of the rotary table, a surface light source is fixedly connected to one side of the bottom of the rotary table, a plurality of evenly distributed compression springs are fixedly connected to the top of the adsorption platforms, and the bottom of the adsorption platforms is threadedly connected to...

[0011] As a preferred embodiment of the present invention: the visual positioning module includes a support frame, which is fixedly connected to the top of the housing. A camera positioning module is fixedly connected to one side of the support frame. The camera positioning module includes a second height adjustment plate, which is fixedly connected to one side of the support frame. A camera is fixedly connected to the top of one side of the second height adjustment plate, and a lens is fixedly connected to the bottom of the camera. A second light source is fixedly connected to one side of the support plate. A position adjustment plate X is fixedly connected to one side of the second height adjustment plate, and a position adjustment plate Y is fixedly connected to one side of the position adjustment plate X.

[0012] As a preferred embodiment of the present invention: the external optical path module includes a lead screw module three, the lead screw module three is fixedly connected to the top of the housing, a galvanometer is installed on one side of the lead screw module three, a reflector is fixedly connected to one side of the galvanometer, a leveling screw is provided inside the galvanometer, and a field lens is fixedly connected to the bottom of the galvanometer.

[0013] A method of using a laser film-opening machine includes: Step 1: The basket is connected to the designated position via the conveyor line. After being positioned by the basket blocking block, it is clamped horizontally by the clamping cylinder and pressed vertically by the pressing cylinder to prevent shaking. The silicon wafer straightening plate arranges the silicon wafers. Then, the lead screw module drives the basket to rise to the initial picking position. The silicon wafer detection sensor confirms that the wafer picking is ready. Step 2: The telescopic plate of the telescopic belt conveyor module extends into the basket. The telescopic belt rotates to take out the silicon wafer and transfer it to the silicon wafer centering module. The synchronous belt drives the guide wheels on both sides to move in the center. Combined with the angle adjustment plate and the position adjustment plate, the silicon wafer is initially positioned. The sensor ensures the positioning accuracy. If the processing platform does not need the material, the silicon wafer is transported to the silicon wafer buffer module. The buffer is lifted by the toothed bar and then transported to the next station when needed. Step 3: The Bernoulli chuck of the L-arm module picks up the silicon wafer from the buffer belt. The arm rotates 90° clockwise to the loading station of the processing stage module and releases the silicon wafer. The stage uses a pneumatic slip ring to hold and fix the silicon wafer. The rotary table rotates 180° counterclockwise to move the silicon wafer to the positioning station. After being accurately positioned by the vision positioning module, it rotates 180° again to the processing station. The external optical path module drives the galvanometer to move, and the laser focuses to complete the back passivation film etching. Step 4: The processed silicon wafers are transferred to the unloading station via a rotary table. The unloading Bernoulli suction cup of the L-arm module is picked up and transferred to the unloading conveyor belt. The wafers are then inspected by the microcrack detection module and the AOI module. Qualified silicon wafers are fed into the unloading basket by the telescopic conveyor belt module. The basket lifting module gradually descends to receive the wafers as they are placed in. NG products are picked up by the Bernoulli suction cup of the NG unloading module and placed in the NG material tray. Step 5: When all the silicon wafers in the basket are removed, the lead screw module 1 drives the empty basket to descend to the empty basket transfer module. The transfer wheel moves the empty basket to the unloading position via the transfer belt, waiting to receive the processed silicon wafers. During the transfer, the pressure plate prevents the basket from tilting, and the guide plate ensures that the transfer direction is accurate. The power is provided by motor 1.

[0014] The beneficial effects of this invention are: (1) By adopting a multi-station turntable structure design, this invention enables synchronous operation of various stations such as loading, positioning, processing, and unloading, effectively avoiding the efficiency bottleneck caused by sequential processes in traditional linear conveying. At the same time, the system is also specially equipped with an L-shaped swing arm module. The introduction of this module enables the loading and unloading actions to be carried out synchronously, further optimizing the coordination and continuity of the entire production process. This not only significantly improves the transmission efficiency of silicon wafers between various stations, but also greatly increases the batch processing capacity of photovoltaic cells.

[0015] (2) By employing a telescopic belt conveyor module, this invention enables non-contact transfer of silicon wafers. This transfer method not only prevents relative slippage of the silicon wafers during transfer but also ensures that the belt surface is non-slip, dust-free, and scratch-free, thereby ensuring the integrity of the silicon wafers. Furthermore, the Bernoulli suction cup adsorption technology combined with the L-arm module reduces stress damage to the silicon wafers caused by traditional robotic arm gripping. This technology utilizes Bernoulli's principle, controlling the airflow inside the suction cup to generate negative pressure, thereby achieving adsorption of the silicon wafers. Compared to traditional robotic arm gripping methods, this adsorption method causes less stress damage to the silicon wafers, effectively reducing the wafer breakage rate during transfer and transport, thus improving the transfer efficiency of the silicon wafers, reducing the breakage rate, and ultimately improving the product yield.

[0016] (3) By cleverly utilizing the integrated design concept of dual workstations and dual laser heads on both the front and rear sides, this invention not only successfully reduces the overall size and floor space of the equipment while ensuring high production capacity output, but also brings significant space-saving effects to production enterprises. It not only greatly improves the practicality and economy of the equipment, but also better meets the urgent need of photovoltaic production lines for compact layout, making the production process more efficient and smooth, and further optimizing the production environment. Attached Figure Description

[0017] The invention will now be further described with reference to the accompanying drawings.

[0018] Figure 1 This is a perspective view of the present invention; Figure 2 This is a schematic diagram of the flower basket lifting module in this invention; Figure 3 This is a schematic diagram of the hollow flower basket transfer module of the present invention; Figure 4 This is a schematic diagram of the telescopic belt conveyor module in this invention; Figure 5 This is a schematic diagram of the silicon wafer alignment module in this invention; Figure 6 This is a schematic diagram of the silicon wafer cache module in this invention; Figure 7 This is a schematic diagram of the NG unloading module in this invention; Figure 8 This is a schematic diagram of the AOI module in this invention; Figure 9 This is a schematic diagram of the microcrack detection module in this invention; Figure 10 This is a schematic diagram of the L-shaped swing arm module in this invention; Figure 11 This is a schematic diagram of the processing platform module in this invention; Figure 12This is a schematic diagram of the adsorption platform in this invention; Figure 13 This is a schematic diagram of the visual positioning module in this invention; Figure 14 This is a schematic diagram of the camera positioning module in this invention; Figure 15 This is a schematic diagram of the external optical path module in this invention.

[0019] Attached diagrams describe: 1. Flower basket lifting module; 2. Empty flower basket transfer module; 3. Telescopic conveyor belt module; 4. Silicon wafer centering module; 5. Silicon wafer buffer module; 6. NG unloading module; 7. AOI module; 8. Microcrack detection module; 9. L-shaped swing arm module; 10. Processing platform module; 11. Vision positioning module; 12. External optical path module; 101. Lead screw module one; 102. Pressing cylinder; 103. Pressing limit block; 104. Clamping cylinder; 105. Flower basket conveyor line; 106. Flower basket blocking block; 107. Silicon wafer straightening plate; 108. Silicon wafer detection sensor; 201. Conveyor belt; 202. Conveyor wheel; 203. Guide plate; 204. Motor one; 205. Pressure plate; 301. Telescopic plate; 302. Telescopic belt; 303. Capacitive sensor; 304. Proximity sensor; 305. Telescopic cylinder; 306. Motor II; 401. Gear motor I; 402. Drive wheel; 403. Synchronous belt; 404. Sensor; 405. Guide rail; 406. Driven wheel; 407. Guide wheel; 408. Angle adjustment plate; 409. Position adjustment plate; 501. Lead screw module II; 502. Width adjustment rod; 503. Gear bar; 601. Rodless cylinder; 602. NG material tray; 603. Bernoulli suction cup; 701. Height adjustment Plate 1; 702, Camera Adjustment Plate; 703, Camera Lens; 704, Light Source 1; 801, Profile Frame; 802, Line Scan Camera Lens; 803, Laser Light Source; 901, L-shaped Swing Arm; 902, Suction Cup Fixing Plate; 903, Limit Block; 904, Pressure Gauge; 905, Gear Motor 2; 906, Unloading Bernoulli Suction Cup; 907, Loading Bernoulli Suction Cup; 1001, Pneumatic Slip Ring; 1002, Rotary Table; 1003, Adsorption Platform; 1 004, Surface light source; 1005, High-speed motor; 1006, Compression spring; 1007, Leveling screw; 1101, Camera positioning module; 1102, Camera; 1103, Lens; 1104, Light source two; 1105, Position adjustment plate X; 1106, Position adjustment plate Y; 1107, Height adjustment plate two; 1201, Lead screw module three; 1202, Galvanometer; 1203, Reflector; 1204, Leveling screw; 1205, Field lens. Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0021] Please see Figure 1 - Figure 15 As shown, the present invention is a laser film-opening machine and its usage method, including a machine housing, on which are installed a flower basket lifting module 1, an empty flower basket transfer module 2, a telescopic belt conveyor module 3, a silicon wafer centering module 4, a silicon wafer buffer module 5, an NG unloading module 6, an AOI module 7, a microcrack detection module 8, an L-shaped swing arm module 9, a processing platform module 10, a vision positioning module 11, and an external optical path module 12; The basket lifting module 1 is used for lifting the basket and working with the telescopic belt to destacking silicon wafers. The empty basket transfer module 2 is used to transfer the empty baskets from the loading position to the unloading position for receiving. The telescopic belt conveyor module 3 is used to remove / place silicon wafers from the basket. The silicon wafer alignment module 4 is used for initial positioning of the product. The silicon wafer buffer module 5 is used to buffer products when there is a waiting period during loading or unloading. The NG unloading module 6 is used to unload NG products. The AOI module 7 is used to detect whether the product is qualified. The microcrack detection module 8 is used to detect whether the product has microcracks. The L-shaped swing arm module 9 is used for product loading and unloading. The processing platform module 10 includes a loading station, a positioning station, a processing station, and an unloading station. The vision positioning module 11 can perform visual positioning of the product. The external optical path module 12 is used for product processing through laser shaping, modulation, and focusing.

[0022] Please see Figure 2 - Figure 4 The flower basket lifting module 1 includes a lead screw module 101. One side of the lead screw module 101 is fixedly connected to the housing. A downward pressure limit block 103 is installed on one side of the lead screw module 101. A downward pressure cylinder 102 is fixedly connected to the top of the downward pressure limit block 103. A silicon wafer straightening plate 107 is installed at the bottom of one side of the lead screw module 101. A flower basket blocking block 106 is fixedly connected to the bottom of one side of the silicon wafer straightening plate 107. A flower basket conveying line 105 is fixedly connected to one side of the flower basket blocking block 106. A clamping cylinder 104 is fixedly connected to one side of the flower basket blocking block 106. A silicon wafer detection sensor 108 is fixedly connected to one side of the downward pressure limit block 103. The lead screw module 101 is used for lifting the basket and working with the telescopic belt to unpack the silicon wafers. Each time the telescopic belt picks up a silicon wafer, the lead screw module drives the basket to descend a fixed distance until all the silicon wafers in the basket are picked up. The pressing cylinder 102 is used to fix the basket to prevent it from shaking during lifting. The pressing limit block 103 is used to press the basket and guide it to ensure the consistency of the basket's position. The clamping cylinder 104 can clamp the basket after it is transported to the correct position to prevent it from shaking during lifting. The basket conveyor line 105 is used for transporting the basket. The basket blocking block 106 is used to stop and block the basket to ensure the consistency of the basket's stopping position. The silicon wafer straightening plate 107 can straighten the silicon wafers. The silicon wafer detection sensor 108 is used to detect whether the silicon wafers have completely entered the basket. The empty flower basket transfer module 2 includes two mounting plates, both of which are fixedly connected to the bottom of the housing. Multiple evenly distributed transmission wheels 202 are rotatably connected to one side of the mounting plate. A transmission belt 201 is installed on the outer wall of the transmission wheels 202. A guide plate 203 is fixedly connected to one side of the mounting plate. A motor 204 is fixedly connected to one side of the mounting plate. The drive end of the motor 204 is installed on the transmission wheels 202. A pressure plate 205 is fixedly connected to one side of the top of the mounting plate. The conveyor belt 201 uses a synchronous belt to ensure smooth transport of the flower basket. The conveyor wheel 202 is used for belt steering and power transmission. The guide plate 203 guides the flower basket and controls its transport direction. By adjusting the guide plate, it can accommodate flower baskets of different sizes. The motor 204 provides the power source. The pressure plate 205 is used to hold the flower basket in place to prevent it from swaying or tilting during the connection process. The empty flower basket moves from the silicon wafer discharge position on the left to the silicon wafer inlet position on the right. The telescopic belt conveyor module 3 includes a mounting frame, which is fixedly connected to the top of the housing. A telescopic plate 301 is fixedly connected to the top of the mounting frame. Telescopic belts 302 are provided on both sides of the telescopic plate 301. A capacitive sensor 303 is fixedly connected to one side of the telescopic plate 301. A proximity sensor 304 is fixedly connected to one side of the mounting frame. A telescopic cylinder 305 is fixedly connected inside the mounting frame. The telescopic end of the telescopic cylinder 305 is fixedly connected to the bottom of the telescopic plate 301. A second motor 306 is fixedly connected to one side of the mounting frame. The drive end of the second motor 306 is mounted on the telescopic belt 302. The telescopic plate 301 supports the telescopic belt, while the telescopic belt 302 is used for transporting silicon wafers. This belt has a non-slip, dust-free, and scratch-free surface. Its high coefficient of friction ensures that the silicon wafers do not slip relative to the belt during transport, preventing scratches. A capacitive sensor 303 and a proximity sensor 304 detect whether the silicon wafers are in position. A telescopic cylinder 305 drives the telescopic plate to extend and retract, and a second motor 306 provides power output. When upstream material arrives at the telescopic plate 301, the second motor 306 drives the telescopic belt 302 to rotate, transporting the product to the designated position via the conveyor belt. This continues until all silicon wafers are removed from the basket, at which point the telescopic cylinder 305 drives the telescopic plate 301 to retract.

[0023] Please see Figure 5 The silicon wafer alignment module 4 includes a base plate, which is fixedly connected to the top of the housing. A geared motor 401 is fixedly connected to one side of the base plate. A drive wheel 402 is rotatably connected inside one side of the base plate, and a driven wheel 406 is rotatably connected inside the other side of the base plate. A synchronous belt 403 is installed on the outer wall of the drive wheel 402 and the driven wheel 406. The drive end of the geared motor 401 is fixedly connected to one side of the drive wheel 402. Two position adjustment plates 409 are fixedly connected to the outer wall of the synchronous belt 403. A guide rail 405 is fixedly connected to the top of the base plate. The bottom of the position adjustment plate 409 is slidably connected to the outer wall of the guide rail 405. A sensor 404 is fixedly connected to one side of the top of the base plate. An angle adjustment plate 408 is fixedly connected to the top of the position adjustment plate 409. Multiple evenly distributed guide wheels 407 are fixedly connected to the top of the angle adjustment plate 408. The geared motor 401 precisely controls the movement position, the drive pulley 402 provides power output, the synchronous belt 403 precisely controls the centering and positioning position, the sensor 404 senses the positive and negative limit positions and the origin, the guide rail 405 provides guidance, the driven pulley 406 transmits power, the guide pulley 407 is used for centering and edge positioning, the angle adjustment plate 408 adjusts the silicon wafer angle, and the position adjustment plate 409 adjusts the silicon wafer position. When the product moves onto the telescopic belt, the geared motor 401 drives the drive pulley 402, driven pulley 406, and synchronous belt 403. After the synchronous belt 403 moves a certain distance, the four guide pulleys 407 move to the center, centering the product and achieving initial positioning.

[0024] Please see Figure 6 and Figure 7 The silicon wafer cache module 5 includes a second lead screw module 501. One side of the second lead screw module 501 is fixedly connected to the top of the housing. A width adjustment rod 502 is installed on one side of the second lead screw module 501. A toothed rod 503 is installed at the bottom of the width adjustment rod 502. Screw module 2 501 controls the lifting and lowering of the buffer mechanism. Width adjustment rod 502 adjusts the position of the toothed bar, accommodating silicon wafers of different sizes. The toothed bar 503, made of non-metallic material, supports the silicon wafer to prevent damage. Initially positioned at the bottom of the module, when a product arrives at the buffer position, if the downstream equipment is not receiving material, screw module 2 501 drives the toothed bar 503 to rise a certain height, lifting the product. This process is repeated sequentially. When the upstream equipment is short of material, screw module 2 501 drives the toothed bar 503 to descend a certain height, allowing the product to fall onto the buffer belt for loading into the buffer position. The NG unloading module 6 includes a fixing block, the bottom of the fixing frame is fixedly connected to the top of the machine housing, the bottom of the fixing frame is fixedly connected to a rodless cylinder 601, the inside of the fixing frame is equipped with a Bernoulli suction cup 603, and the top of the Bernoulli suction cup 603 is equipped with an NG material tray 602. The rodless cylinder 601 is used for extending and retracting the suction cup, the NG tray 602 is used to store NG silicon wafers, and the Bernoulli suction cup 603 is used to pick up the product. The rodless cylinder 601 is initially in the retracted state. When an NG silicon wafer appears, the rodless cylinder 601 extends, causing the Bernoulli suction cup 603 to pick up the product. Then, the rodless cylinder 601 retracts, at which point the Bernoulli suction cup 603 places the product onto the NG tray 602.

[0025] Please see Figure 8 and Figure 9 The AOI module 7 includes a fixing block, the bottom of which is fixedly connected to the top of the housing. A height adjustment plate 701 is fixedly connected to one side of the top of the fixing block. A camera adjustment plate 702 is fixedly connected inside the height adjustment plate 701. A camera lens 703 is fixedly connected to the bottom of the camera adjustment plate 702. A light source 704 is fixedly connected to one side of the fixing block. Height adjustment plate 701 is used to adjust the overall height of the four cameras, camera adjustment plate 702 can adjust the height of individual cameras, camera lens 703 adopts a high-pixel area array camera and zoom lens, and light source 704 is used for product lighting. Images of the silicon wafer are captured by the four wide-field-of-view cameras for data parameter analysis. The microcrack detection module 8 includes a profile frame 801, the bottom of which is fixedly connected to the top of the housing, a line scan camera lens 802 is fixedly connected to one side of the profile frame 801, and a laser light source 803 is fixedly connected to one side of the profile frame 801. The profile frame 801 supports the camera and light source for easy adjustment. The line scan camera lens 802 uses a line scan camera to dynamically scan and collect data from the product. The laser light source 803 is used to illuminate the product. As the product moves on the conveyor line, the camera is triggered to collect signals, enabling image acquisition and data analysis.

[0026] Please see Figure 10The L-shaped swing arm module 9 includes a support block, the bottom of which is fixedly connected to the top of the housing. An L-shaped swing arm 901 is rotatably connected to the top of the support block. Two suction cup fixing plates 902 are slidably connected inside the L-shaped swing arm 901. Two feeding Bernoulli suction cups 907 are installed on one side of one suction cup fixing plate 902, and two discharging Bernoulli suction cups 906 are installed on one side of the other suction cup fixing plate 902. A limit block 903 is fixedly connected to the top of the support block. A pressure gauge 904 is fixedly connected to the top of the housing. A second geared motor 905 is fixedly connected to one side of the support block. The drive end of the second geared motor 905 is fixedly connected inside the L-shaped swing arm 901. L-shaped swing arm 901 is used to connect the suction cup, enabling simultaneous loading and unloading when rotating 90°. Suction cup fixing plate 902 is used to install and fix the suction cup. Limit block 903 is used to limit the rotation angle of the swing arm to prevent the conduit from getting tangled. Pressure gauge 904 can display the working pressure of the suction cup. When the pressure exceeds the set range, an alarm is triggered. Gear motor 905 is used to drive the swing arm to rotate 90° back and forth. Unloading Bernoulli suction cup 906 realizes product unloading, and loading Bernoulli suction cup 907 realizes product loading. Unloading Bernoulli suction cup 906 and loading Bernoulli suction cup 907 simultaneously pick up products from the loading belt and unloading station. Gear motor 905 drives L-shaped swing arm 901 to rotate 90 degrees clockwise to shut off the compressed air. Unloading Bernoulli suction cup 906 and loading Bernoulli suction cup 907 simultaneously release the products. Gear motor 905 drives L-shaped swing arm 901 to rotate 90 degrees counterclockwise to return to the initial position, and the cycle continues.

[0027] Please see Figure 11 and Figure 12 The processing platform module 10 includes a high-speed motor 1005. The bottom of the high-speed motor 1005 is fixedly connected to the top of the housing. A rotary table 1002 is fixedly connected to the top of the high-speed motor 1005. A pneumatic slip ring 1001 is installed on the top of the rotary table 1002. Multiple evenly distributed adsorption platforms 1003 are installed on the top of the rotary table 1002. A surface light source 1004 is fixedly connected to the bottom of one side of the rotary table 1002. Multiple evenly distributed compression springs 1006 are fixedly connected to the top of the adsorption platform 1003. A threaded connection 1007 is made to the bottom of the adsorption platform 1003. The pneumatic slip ring 1001 ensures normal operation of the air circuit and prevents air tube entanglement during product rotation. The rotary table 1002 is used for loading, unloading, CCD positioning, laser processing, and idle positions. The adsorption platform 1003 is used to adsorb products. The surface light source 1004 provides bottom lighting when the product needs to be gripped and positioned. The high-speed motor 1005 ensures precise high-speed movement of the product. The clamping spring 1006 is used to clamp the adsorption platform assembly, and 1007 is used for leveling the adsorption platform assembly. The material swing arm connects the adsorbed product to the loading station of the rotary table 1002. Negative pressure is applied through the pneumatic slip ring 1001, and the adsorption platform 1003 adsorbs the product. Then, the high-speed motor 1005 drives the turntable to rotate 180 degrees counterclockwise. The unloading station unloads the product while the loading station continues loading. The CCD camera at the positioning station positions the product, and the processing station processes the product (loading, positioning, and processing are performed simultaneously).

[0028] Please see Figure 13 and Figure 14 The visual positioning module 11 includes a support frame, which is fixedly connected to the top of the housing. A camera positioning module 1101 is fixedly connected to one side of the support frame. The camera positioning module 1101 includes a height adjustment plate 1107, which is fixedly connected to one side of the support frame. A camera 1102 is fixedly connected to the top of one side of the height adjustment plate 1107. A lens 1103 is fixedly connected to the bottom of the camera 1102. A light source 1104 is fixedly connected to one side of the support plate. A position adjustment plate X1105 is fixedly connected to one side of the height adjustment plate 1107. A position adjustment plate Y1106 is fixedly connected to one side of the position adjustment plate X1105. The camera positioning module 1101 uses four sets of CCDs on one side and two sets of CCD cameras on one product for positioning, respectively capturing the two right-angled sides or marks of the same product. Camera 1102 is used for visual positioning, lens 1103 is used for visual positioning, light source 1104 is used for positioning lighting, position adjustment plate X 1105 is used to adjust the camera position in the X direction to be compatible with products of different sizes, position adjustment plate Y 1106 is used to adjust the camera position in the Y direction to be compatible with products of different sizes, and height adjustment plate 1107 is used to adjust the camera position in the Z direction for adjusting the camera focus.

[0029] Please see Figure 15 The external optical path module 12 includes a lead screw module 3 1201, which is fixedly connected to the top of the housing. A galvanometer 1202 is installed on one side of the lead screw module 3 1201, and a reflector 1203 is fixedly connected to one side of the galvanometer 1202. A leveling screw 1204 is provided inside the galvanometer 1202, and a field lens 1205 is fixedly connected to the bottom of the galvanometer 1202. The lead screw module 1201 is used to precisely control the movement position of the galvanometer. The galvanometer 1202 can control the laser processing position and pattern. The reflector 1203 is used to adjust the laser incident direction. The leveling screw 1204 is used to level the galvanometer. The field lens 1205 is used to focus the laser.

[0030] A method of using a laser film-opening machine includes: Step 1: The basket is connected to the designated position via the conveyor line 105. After being positioned by the basket blocking block 106, it is clamped laterally by the clamping cylinder 104 and pressed longitudinally by the pressing cylinder 102 to prevent shaking. The silicon wafer straightening plate 107 sorts the silicon wafers. Then, the lead screw module 101 drives the basket to rise to the initial picking position. The silicon wafer detection sensor 108 confirms that the wafer picking is ready. Step 2: The telescopic plate 301 of the telescopic belt conveyor module 3 extends into the basket, and the telescopic belt 302 rotates to take out the silicon wafer and transfer it to the silicon wafer centering module 4. The synchronous belt 403 drives the guide wheels on both sides to move in the center. Combined with the angle adjustment plate 408 and the position adjustment plate 409, the silicon wafer is initially positioned. The sensor 404 ensures the positioning accuracy. If the processing platform does not need the material, the silicon wafer is transported to the silicon wafer buffer module 5, and the buffer is lifted by the toothed bar 503. When needed, it is transported to the next station. Step 3: The loading Bernoulli chuck of L-arm module 9 picks up the silicon wafer from the buffer belt. The arm rotates 90° clockwise to the loading station of processing stage module 10 and releases the silicon wafer. The stage uses pneumatic slip ring 1001 to adsorb and fix the silicon wafer. The rotary table rotates 180° counterclockwise to transfer the silicon wafer to the positioning station. After being precisely positioned by vision positioning module 11, it rotates 180° again to the processing station. External optical path module 12 drives galvanometer 1202 to move, and laser focusing completes the back passivation film etching. Step 4: The processed silicon wafers are transferred to the unloading station via the rotary table 1002. They are picked up by the unloading Bernoulli suction cup of the L swing arm module 9 and transferred to the unloading belt. They are then inspected by the microcrack detection module 8 and the AOI module 7 in sequence. Qualified silicon wafers are fed into the unloading basket by the telescopic belt module 3. The basket lifting module 1 gradually descends to receive the wafers as they are placed in. NG products are picked up by the Bernoulli suction cup 603 of the NG unloading module 6 and placed in the NG material tray 602. Step 5: When all the silicon wafers in the basket are removed, the lead screw module 101 drives the empty basket to descend to the empty basket transfer module 2. The transfer wheel 202 transfers the empty basket to the unloading position via the transfer belt 201, waiting to receive the processed silicon wafers. During the transfer, the pressure plate 205 prevents the basket from tilting, and the guide plate 203 ensures that the transfer direction is accurate. The power is provided by the motor 204.

[0031] The working principle of this invention is as follows: The basket loaded with silicon wafers is connected from the previous station to the designated position by the basket conveyor line 105 of the basket lifting module 1. The basket blocking block 106 blocks and precisely positions the basket to ensure that the basket stops at the same position. After the basket is in place, the clamping cylinder 104 clamps the basket laterally, while the pressing cylinder 102 drives the pressing limit block 103 to press the basket longitudinally to prevent the basket from shaking during the lifting process. The silicon wafer straightening plate 107 straightens the silicon wafers in the basket to avoid unevenness. The lead screw module 101 drives the basket to rise to the initial picking position. The silicon wafer detection sensor 108 detects whether the silicon wafer has completely entered the basket to ensure that the wafer picking is ready. The telescopic cylinder 305 of the telescopic belt module 3 drives the telescopic plate 301 to extend and enter the basket; the second motor 306 drives the telescopic belt 302 to rotate, taking the silicon wafer out of the basket and transferring it to the designated position. The capacitive sensor 303 and the proximity sensor 304 detect whether the silicon wafer is in place. After the silicon wafer is transferred to the silicon wafer centering module 4, the first geared motor 401 drives the driving wheel 402, the driven wheel 406 and the synchronous belt 403 to move, driving the guide wheels 407 on both sides to move along the guide rail 405 to center. The initial positioning of the silicon wafer angle and position is achieved by the angle adjustment plate 408 and the position adjustment plate 409. The sensor 404 senses the limit position to ensure positioning accuracy. If the loading station of the processing platform module 10 has not yet issued a material request instruction, the silicon wafer is transported to the silicon wafer buffer module 5. The lead screw module 2 501 drives the gear bar 503 to rise. After the width adjustment rod 502 adapts to the size of the silicon wafer, the gear bar 503 lifts the silicon wafer to buffer it. When the processing station needs the silicon wafer, the lead screw module 2 501 drives the gear bar 503 to fall down, and the silicon wafer falls onto the buffer belt and is transported to the next station. The loading Bernoulli suction cup 907 of the L-shaped swing arm module 9 picks up the silicon wafer from the loading waiting position of the buffer belt, while the unloading Bernoulli suction cup 906 is in the unloading state. The geared motor 905 drives the L-shaped swing arm 901 to rotate 90° clockwise. The limit block 903 limits the rotation angle to prevent the conduit from getting tangled. The pressure gauge 904 monitors the suction cup pressure to ensure stable adsorption. The L-shaped swing arm 901 rotates to the loading position of the processing platform module 10. The loading Bernoulli suction cup 907 releases the silicon wafer. The pneumatic slip ring 1001 applies negative pressure to make the adsorption platform 1003 adsorb and fix the silicon wafer. The leveling screw 1007 ensures that the platform is horizontal, and the clamping spring 1006 assists in fixing. The high-speed motor 1005 of the processing stage module 10 drives the rotary table 1002 to rotate 180° counterclockwise, transferring the silicon wafers from the loading station to the positioning station. Simultaneously, the loading station continues to receive new silicon wafers, thus achieving synchronous operation across multiple stations. The camera 1102 of the vision positioning module 11 takes pictures of the silicon wafers at the positioning station through the lens 1103, and the second light source 1104 provides illumination. The positioning is achieved through the position adjustment plate X 1105, the position adjustment Y 1106, and the height adjustment plate 110. 7. Adapt to the silicon wafer size, grasp the right-angle edge or mark point of the silicon wafer to achieve precise positioning, the rotary table 1002 rotates 180° again, and the positioned silicon wafer is transferred to the processing station. The lead screw module 1201 of the external optical path module 12 drives the galvanometer 1202 to move to the processing position. The laser is reflected by the reflector 1203, modulated by the galvanometer 1202, and focused on the surface of the silicon wafer by the field lens 1205 to complete the back passivation film etching. The leveling screw 1204 ensures that the galvanometer is horizontal. After processing, the rotary table 1002 rotates to move the processed silicon wafer to the unloading station. The unloading Bernoulli chuck 906 of the L-shaped swing arm module 9 picks up the silicon wafer, and the L-shaped swing arm 901 rotates 90° counterclockwise to return to the initial position, releasing the silicon wafer onto the unloading belt. The silicon wafer is then conveyed to the microcrack detection module 8 via the unloading belt. The line scan camera lens 802 supported by the profile frame 801 performs a dynamic scan of the moving silicon wafer under the illumination of the laser light source 803 to detect the presence of microcracks. The silicon wafer continues to be conveyed to the AOI module 7. The height adjustment plate 701 and the camera adjustment plate 702 adjust the position of the camera lens 703. Under the illumination of the light source 704, images are acquired by a high-pixel area array camera to analyze whether the processing is qualified. Qualified silicon wafers are conveyed to the unloading telescopic belt of the telescopic belt conveyor module 3. The telescopic plate 301 extends to send the silicon wafer into the unloading basket. The lead screw module 101 of the basket lifting module 1 gradually descends as the silicon wafer is placed in, ensuring that the basket accurately receives the material. If the product is detected as NG, the rodless cylinder 601 of the NG unloading module 6 drives the Bernoulli suction cup 603 to extend and pick up the NG silicon wafer. After retracting, it is placed in the NG material tray 602. After all the silicon wafers are removed from the basket, the lead screw module 101 of the basket lifting module 1 drives the empty basket to descend to the empty basket transfer module 2. Driven by the motor 204, the transmission wheel 202 moves the empty basket along the guide plate 203 to the unloading position via the transmission belt 201. The pressure plate 205 prevents the basket from tilting during the transfer process, waiting to receive the processed silicon wafers.

[0032] The foregoing has provided a detailed description of one embodiment of the present invention, but this description is merely a preferred embodiment and should not be construed as limiting the scope of the invention. All equivalent variations and modifications made within the scope of the claims of this invention should still fall within the patent coverage of this invention.

Claims

1. A laser film-opening machine, comprising a housing, characterized in that, The machine housing is equipped with a basket lifting module (1), an empty basket transfer module (2), a telescopic belt conveyor module (3), a silicon wafer centering module (4), a silicon wafer buffer module (5), an NG unloading module (6), an AOI module (7), a microcrack detection module (8), an L-shaped swing arm module (9), a processing platform module (10), a vision positioning module (11), and an external optical path module (12). The flower basket lifting module (1) is used for lifting the flower basket and is used in conjunction with the telescopic belt for unpacking silicon wafers. The empty flower basket transfer module (2) is used to transfer the empty flower baskets at the loading position to the unloading position for receiving materials; The telescopic belt conveyor module (3) is used to remove / place silicon wafers from / in the basket; The silicon wafer alignment module (4) is used for the initial positioning of the product; The silicon wafer cache module (5) is used for caching products; The NG unloading module (6) is used for unloading NG products; The AOI module (7) is used to detect whether the product is qualified after processing; The microcrack detection module (8) is used to detect whether the product has microcracks; L-arm module (9) is used for product loading and unloading; The processing platform module (10) consists of a loading station, a positioning station, a processing station, and a unloading station; The visual positioning module (11) is capable of visually positioning the product; The external optical path module (12) is used for product processing through laser shaping, modulation and focusing.

2. The laser film-opening machine according to claim 1, characterized in that, The flower basket lifting module (1) includes a lead screw module (101), one side of which is fixedly connected to the housing. A pressure limiting block (103) is installed on one side of the lead screw module (101). A pressure cylinder (102) is fixedly connected to the top of the pressure limiting block (103). A silicon wafer straightening plate (107) is installed at the bottom of one side of the lead screw module (101). A flower basket blocking block (106) is fixedly connected to the bottom of one side of the silicon wafer straightening plate (107). A flower basket conveying line (105) is fixedly connected to one side of the flower basket blocking block (106). A clamping cylinder (104) is fixedly connected to one side of the flower basket blocking block (106). A silicon wafer detection sensor (108) is fixedly connected to one side of the pressure limiting block (103). The empty flower basket transfer module (2) includes two mounting plates, both of which are fixedly connected to the bottom of the housing. Multiple evenly distributed transmission wheels (202) are rotatably connected to one side of the mounting plate. A transmission belt (201) is installed on the outer wall of the transmission wheel (202). A guide plate (203) is fixedly connected to one side of the mounting plate. A motor (204) is fixedly connected to one side of the mounting plate. The drive end of the motor (204) is installed on the transmission wheel (202). A pressure plate (205) is fixedly connected to one side of the top of the mounting plate. The telescopic belt module (3) includes a mounting frame, which is fixedly connected to the top of the housing. A telescopic plate (301) is fixedly connected to the top of the mounting frame. Telescopic belts (302) are provided on both sides of the telescopic plate (301). A capacitive sensor (303) is fixedly connected to one side of the telescopic plate (301). A proximity sensor (304) is fixedly connected to one side of the mounting frame. A telescopic cylinder (305) is fixedly connected inside the mounting frame. The telescopic end of the telescopic cylinder (305) is fixedly connected to the bottom of the telescopic plate (301). A second motor (306) is fixedly connected to one side of the mounting frame. The drive end of the second motor (306) is mounted on the telescopic belt (302).

3. A laser film-opening machine according to claim 2, characterized in that, The silicon wafer alignment module (4) includes a base plate, which is fixedly connected to the top of the housing. A geared motor (401) is fixedly connected to one side of the base plate. A drive wheel (402) is rotatably connected inside one side of the base plate, and a driven wheel (406) is rotatably connected inside the other side of the base plate. A synchronous belt (403) is installed on the outer wall of the drive wheel (402) and the driven wheel (406). The drive end of the geared motor (401) is fixedly connected to one side of the drive wheel (402). Two position adjustment plates (409) are fixedly connected to the outer wall of the synchronous belt (403). A guide rail (405) is fixedly connected to the top of the base plate. The bottom of the position adjustment plate (409) is slidably connected to the outer wall of the guide rail (405). A sensor (404) is fixedly connected to one side of the top of the base plate. An angle adjustment plate (408) is fixedly connected to the top of the position adjustment plate (409). A plurality of evenly distributed guide wheels (407) are fixedly connected to the top of the angle adjustment plate (408).

4. A laser film-opening machine according to claim 3, characterized in that, The silicon wafer cache module (5) includes a second lead screw module (501), one side of which is fixedly connected to the top of the housing. A width adjustment rod (502) is installed on one side of the second lead screw module (501), and a toothed rod (503) is installed at the bottom of the width adjustment rod (502). The NG unloading module (6) includes a fixing block, the bottom of the fixing frame is fixedly connected to the top of the housing, the bottom of the fixing frame is fixedly connected to a rodless cylinder (601), a Bernoulli suction cup (603) is installed inside the fixing frame, and an NG material tray (602) is installed on the top of the Bernoulli suction cup (603).

5. A laser film-opening machine according to claim 4, characterized in that, The AOI module (7) includes a fixing block, the bottom of which is fixedly connected to the top of the housing, a height adjustment plate (701) is fixedly connected to one side of the top of the fixing block, a camera adjustment plate (702) is fixedly connected inside the height adjustment plate (701), a camera lens (703) is fixedly connected to the bottom of the camera adjustment plate (702), and a light source (704) is fixedly connected to one side of the fixing block. The microcrack detection module (8) includes a profile frame (801), the bottom of which is fixedly connected to the top of the housing, a line scan camera lens (802) is fixedly connected to one side of the profile frame (801), and a laser light source (803) is fixedly connected to one side of the profile frame (801).

6. A laser film-opening machine according to claim 5, characterized in that, The L-shaped swing arm module (9) includes a support block. The bottom of the support block is fixedly connected to the top of the housing. An L-shaped swing arm (901) is rotatably connected to the top of the support block. Two suction cup fixing plates (902) are slidably connected inside the L-shaped swing arm (901). Two feeding Bernoulli suction cups (907) are installed on one side of one of the suction cup fixing plates (902), and two discharging Bernoulli suction cups (906) are installed on one side of the other suction cup fixing plate (902). A limit block (903) is fixedly connected to the top of the support block. A pressure gauge (904) is fixedly connected to the top of the housing. A second geared motor (905) is fixedly connected to one side of the support block. The drive end of the second geared motor (905) is fixedly connected inside the L-shaped swing arm (901).

7. A laser film-opening machine according to claim 6, characterized in that, The processing platform module (10) includes a high-speed motor (1005), the bottom of which is fixedly connected to the top of the housing. A rotary table (1002) is fixedly connected to the top of the high-speed motor (1005). A pneumatic slip ring (1001) is installed on the top of the rotary table (1002). Multiple evenly distributed adsorption platforms (1003) are installed on the top of the rotary table (1002). A surface light source (1004) is fixedly connected to the bottom of one side of the rotary table (1002). Multiple evenly distributed compression springs (1006) are fixedly connected to the top of the adsorption platform (1003). A (1007) is threadedly connected to the bottom of the adsorption platform (1003).

8. A laser film-opening machine according to claim 7, characterized in that, The visual positioning module (11) includes a support frame, which is fixedly connected to the top of the housing. A camera positioning module (1101) is fixedly connected to one side of the support frame. The camera positioning module (1101) includes a height adjustment plate (1107), which is fixedly connected to one side of the support frame. A camera (1102) is fixedly connected to the top of one side of the height adjustment plate (1107), and a lens (1103) is fixedly connected to the bottom of the camera (1102). A light source (1104) is fixedly connected to one side of the support plate. A position adjustment plate X (1105) is fixedly connected to one side of the height adjustment plate (1107), and a position adjustment plate Y (1106) is fixedly connected to one side of the position adjustment plate X (1105).

9. A laser film-opening machine according to claim 8, characterized in that, The external optical path module (12) includes a lead screw module three (1201), which is fixedly connected to the top of the housing. A galvanometer (1202) is installed on one side of the lead screw module three (1201), and a reflector (1203) is fixedly connected to one side of the galvanometer (1202). A leveling screw (1204) is provided inside the galvanometer (1202), and a field lens (1205) is fixedly connected to the bottom of the galvanometer (1202).

10. A method of using a laser film-opening machine, employing the laser film-opening machine as described in claim 9, characterized in that, include: Step 1: The basket is connected to the designated position via the conveyor line (105). After being positioned by the basket blocking block (106), it is clamped laterally by the clamping cylinder (104) and pressed longitudinally by the pressing cylinder (102) to prevent shaking. The silicon wafer straightening plate (107) arranges the silicon wafers. Then, the lead screw module (101) drives the basket to rise to the initial picking position. The silicon wafer detection sensor (108) confirms that the wafer picking is ready. Step 2: The telescopic plate (301) of the telescopic belt conveyor module (3) extends into the basket, and the telescopic belt (302) rotates to take out the silicon wafer and transfer it to the silicon wafer centering module (4). The synchronous belt (403) drives the guide wheels on both sides to move in the center. Combined with the angle adjustment plate (408) and the position adjustment plate (409), the initial positioning of the silicon wafer is achieved. The sensor (404) ensures the positioning accuracy. If the processing platform does not need the material for the time being, the silicon wafer is transported to the silicon wafer buffer module (5), and the buffer is lifted by the toothed bar (503). When needed, it is transported to the next station. Step 3: The loading Bernoulli chuck of the L-arm module (9) picks up the silicon wafer from the buffer belt. The arm rotates 90° clockwise to the loading station of the processing stage module (10) and releases the silicon wafer. The stage uses a pneumatic slip ring (1001) to adsorb and fix the silicon wafer. The rotary table rotates 180° counterclockwise to transfer the silicon wafer to the positioning station. After being precisely positioned by the vision positioning module (11), it rotates 180° again to the processing station. The external optical path module (12) drives the galvanometer (1202) to move, and the laser focuses to complete the back passivation film etching. Step 4: The processed silicon wafers are transferred to the unloading station via the rotary table (1002). The unloading Bernoulli chuck of the L swing arm module (9) is picked up and transferred to the unloading belt. The wafers are then inspected by the microcrack detection module (8) and the AOI module (7). Qualified silicon wafers are fed into the unloading basket by the telescopic belt module (3). The basket lifting module (1) gradually lowers to receive the wafers as they are placed in. NG products are picked up by the Bernoulli chuck (603) of the NG unloading module (6) and placed in the NG tray (602). Step 5: When all the silicon wafers in the basket are removed, the lead screw module 1 (101) drives the empty basket to descend to the empty basket transfer module (2). The transfer wheel (202) transfers the empty basket to the unloading position through the transfer belt (201), and then receives the processed silicon wafers. During the transfer, the pressure plate (205) prevents the basket from tilting, and the guide plate (203) ensures that the transfer direction is accurate. The power is provided by motor 1 (204).

Images