Substrate processing module and substrate processing apparatus

Abstract

A substrate processing module and a substrate processing apparatus are provided with: a first groove and a second groove which are arranged in a first direction and in which a substrate can be arranged; a first transport mechanism that moves the substrate in a first direction; and a second transport mechanism that moves the substrate in a second direction intersecting the first direction, the first groove and the second groove are disposed in the first region, and the first transport mechanism transports the substrate in the first direction in a second region disposed above the first region. The second conveyance mechanism conveys the substrate in the second direction in a third region different from the second region.

Description

Technical Field

[0001] This disclosure relates to a substrate processing module for processing a substrate and a substrate processing apparatus having the substrate processing module. Background Technology

[0002] As a substrate processing apparatus, there exists a cleaning apparatus that, after treating various substrates such as semiconductor wafers (hereinafter referred to as "substrate") with a prescribed chemical solution, cleans them with a cleaning solution such as pure water to remove foreign matter adhering to the surface of the substrate. Among the cleaning apparatuses, there are wet cleaning apparatuses that perform cleaning by immersing the substrate in a chemical solution and a cleaning solution.

[0003] Patent Document 1 discloses a substrate processing apparatus comprising multiple pairs of chemical tanks and cleaning tanks arranged along the longitudinal direction of the apparatus, and having a main conveying mechanism and a secondary conveying mechanism. The main conveying mechanism moves multiple substrates from one end of the apparatus to the other end along the longitudinal direction. The secondary conveying mechanism moves multiple substrates within the range of a pair of chemical tanks and cleaning tanks in both the longitudinal and vertical directions.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2018-56158 Summary of the Invention

[0007] The problem that the invention aims to solve

[0008] In the substrate processing apparatus of Patent Document 1, the main conveying mechanism and the auxiliary conveying mechanism may interfere with each other when they move separately, and the movement sequence will be restricted, which may reduce the throughput.

[0009] Therefore, the purpose of this disclosure is to provide a substrate processing module and a substrate processing apparatus that can improve throughput.

[0010] Solution for solving the problem

[0011] To achieve the aforementioned objective, a substrate processing module of one embodiment of the present disclosure includes: a first groove and a second groove arranged in a first direction for configuring a substrate; a first conveying mechanism for moving the substrate in the first direction; and a second conveying mechanism for moving the substrate in a second direction intersecting the first direction, wherein the first groove and the second groove are disposed in a first region, the first conveying mechanism conveys the substrate in the first direction in a second region disposed above the first region, and the second conveying mechanism conveys the substrate in the second direction in a third region different from the second region.

[0012] One embodiment of the substrate processing apparatus disclosed herein includes: the substrate processing module; and other modules connected to the substrate processing module in the second direction.

[0013] Invention Effects

[0014] According to this disclosure, throughput can be increased. Attached Figure Description

[0015] Figure 1 This is a perspective view illustrating the substrate processing apparatus of Embodiment 1.

[0016] Figure 2 Yes Figure 1 A perspective view illustrating the components of the substrate processing apparatus shown.

[0017] Figure 3 Yes Figure 1 A perspective view illustrating the chemical module in the substrate processing apparatus shown.

[0018] Figure 4 Yes Figure 1 A perspective view illustrating the second conveying mechanism in the substrate processing apparatus shown.

[0019] Figure 5 Yes Figure 3 A three-dimensional diagram illustrating the main parts of the chemical module shown.

[0020] Figure 6 Yes Figure 1 A perspective view illustrating the removal module in the substrate processing apparatus shown.

[0021] Figure 7 Yes Figure 1 A perspective view illustrating the loading module in the substrate processing apparatus shown.

[0022] Figure 8 Yes Figure 3 The diagram illustrates the operation of the upper and lower conveying sections of the second conveying mechanism in the chemical module shown.

[0023] Figure 9 Yes Figure 3 The diagram illustrates the operation of the first conveying section of the first conveying mechanism in the chemical module shown.

[0024] Figure 10 This is a diagram illustrating a support member that holds the substrate.

[0025] Figure 11 Yes Figure 1 A perspective view illustrating the drying module in the substrate processing apparatus shown.

[0026] Figure 12 This is a schematic diagram showing the second conveyor mechanism from the front.

[0027] Figure 13 This is a schematic top view representing the processing space of the modified example.

[0028] Figure 14A This is a schematic diagram illustrating an example of the operation of a substrate processing apparatus.

[0029] Figure 14B This is a schematic diagram illustrating an example of the operation of a substrate processing apparatus.

[0030] Figure 15A This is a schematic diagram illustrating an example of the operation of a substrate processing apparatus.

[0031] Figure 15B This is a schematic diagram illustrating an example of the operation of a substrate processing apparatus.

[0032] Figure 16A This is a schematic diagram illustrating an example of the operation of a substrate processing apparatus.

[0033] Figure 16B This is a schematic diagram illustrating an example of the operation of a substrate processing apparatus.

[0034] Figure 17A This is a schematic diagram illustrating an example of the operation of a substrate processing apparatus.

[0035] Figure 17B This is a schematic diagram illustrating an example of the operation of a substrate processing apparatus.

[0036] Figure 18A This is a schematic diagram illustrating an example of the operation of a substrate processing apparatus.

[0037] Figure 18B This is a schematic diagram illustrating an example of the operation of a substrate processing apparatus.

[0038] Figure 19A This is a schematic diagram illustrating an example of the operation of a substrate processing apparatus.

[0039] Figure 19B This is a schematic diagram illustrating an example of the operation of a substrate processing apparatus.

[0040] Figure 20A This is a schematic diagram illustrating an example of the operation of a substrate processing apparatus.

[0041] Figure 20BThis is a schematic diagram illustrating an example of the operation of a substrate processing apparatus.

[0042] Figure 21A This is a schematic diagram illustrating an example of the operation of a substrate processing apparatus.

[0043] Figure 21B This is a schematic diagram illustrating an example of the operation of a substrate processing apparatus.

[0044] Figure 22A This is a schematic diagram illustrating an example of the operation of a substrate processing apparatus.

[0045] Figure 22B This is a schematic diagram illustrating an example of the operation of a substrate processing apparatus.

[0046] Figure 23A This is a schematic diagram illustrating an example of the operation of a substrate processing apparatus.

[0047] Figure 23B This is a schematic diagram illustrating an example of the operation of a substrate processing apparatus.

[0048] Figure 24A This is a schematic diagram illustrating an example of the operation of a substrate processing apparatus.

[0049] Figure 24B This is a schematic diagram illustrating an example of the operation of a substrate processing apparatus.

[0050] Figure 25A This is a schematic diagram illustrating an example of the operation of a substrate processing apparatus.

[0051] Figure 25B This is a schematic diagram illustrating an example of the operation of a substrate processing apparatus.

[0052] Figure 26A This is a schematic diagram illustrating an example of the operation of a substrate processing apparatus.

[0053] Figure 26B This is a schematic diagram illustrating an example of the operation of a substrate processing apparatus.

[0054] Figure 27 This is a schematic top view illustrating an example of processing substrates in batches.

[0055] Figure 28 This is a schematic top view illustrating an example of processing substrates in multiple batches.

[0056] Figure 29This is a schematic diagram showing the state in which multiple chemical modules in the substrate processing apparatus of Embodiment 1 are respectively configured with substrates.

[0057] Figure 30 This is a schematic diagram showing the state in which multiple chemical modules in the substrate processing apparatus of Embodiment 2 are respectively configured with substrates.

[0058] Figure 31 This is a schematic top view showing the movement range of the first and second conveying mechanisms in the substrate processing apparatus of Embodiment 1.

[0059] Figure 32 This is a schematic top view showing the movement range of the first and second conveying mechanisms in the substrate processing apparatus of Embodiment 3.

[0060] Figure 33 This is a schematic perspective view showing the first conveying mechanism in the substrate processing apparatus of Embodiment 4.

[0061] Figure 34 This is a schematic front view showing the handover state of the substrates achieved by the two first transport units in the substrate processing apparatus of Embodiment 4.

[0062] Figure 35A This is a schematic top view showing the transfer operation of the substrates performed by the two first transport units in the substrate processing apparatus of Embodiment 4.

[0063] Figure 35B This is a schematic top view showing the transfer operation of the substrates performed by the two first transport units in the substrate processing apparatus of Embodiment 4.

[0064] Figure 35C This is a schematic top view showing the transfer operation of the substrates performed by the two first transport units in the substrate processing apparatus of Embodiment 4.

[0065] Figure 35D This is a schematic top view showing the transfer operation of the substrates performed by the two first transport units in the substrate processing apparatus of Embodiment 4.

[0066] Figure 36 This is a schematic front view showing the peripheral structure of the second conveying mechanism in the substrate processing apparatus of Embodiment 5.

[0067] Figure 37 This is a schematic side view showing the peripheral structure of the second conveying mechanism in the substrate processing apparatus of Embodiment 5.

[0068] Figure 38 This is a schematic perspective view of the chuck section in embodiment 5.

[0069] Figure 39This is a schematic top view of the chuck section in Embodiment 5.

[0070] Figure 40 This is a schematic top view of the first conveying mechanism in Embodiment 5.

[0071] Figure 41 This is a schematic top view of the first conveying mechanism in Embodiment 5.

[0072] Figure 42 This is a schematic front view of the first conveying mechanism in Embodiment 5.

[0073] Figure 43A This is a schematic front view showing the method of transferring substrates between the two first transport sections in Embodiment 5.

[0074] Figure 43B This is a schematic front view showing the method of transferring substrates between the two first transport sections in Embodiment 5.

[0075] Figure 43C This is a schematic front view showing the method of transferring substrates between the two first transport sections in Embodiment 5.

[0076] Figure 44A This is a schematic front view showing the method of transferring the substrate from the second transport section to the first transport section in Embodiment 5.

[0077] Figure 44B This is a schematic front view showing the method of transferring the substrate from the second transport section to the first transport section in Embodiment 5.

[0078] Figure 44C This is a schematic front view showing the method of transferring the substrate from the second transport section to the first transport section in Embodiment 5.

[0079] Figure 45A This is a schematic front view showing the method of transferring the substrate from the first transport section to the second transport section in Embodiment 5.

[0080] Figure 45B This is a schematic front view showing the method of transferring the substrate from the first transport section to the second transport section in Embodiment 5.

[0081] Figure 45C This is a schematic front view showing the method of transferring the substrate from the first transport section to the second transport section in Embodiment 5.

[0082] Figure 45D This is a schematic front view showing the method of transferring the substrate from the first transport section to the second transport section in Embodiment 5.

[0083] Figure 46AThis is a schematic side view showing the state in which the chuck section of Embodiment 5 slides in the +Y direction.

[0084] Figure 46B This is a schematic side view showing the state in which the chuck section of Embodiment 5 slides in the -Y direction.

[0085] Figure 47 This is a schematic side view of the peripheral structure of the second conveying mechanism in a substrate processing apparatus according to a modified example of Embodiment 5.

[0086] Figure 48 This is a schematic top view showing a modified example of the first and second slots. Detailed Implementation

[0087] According to a first aspect of this disclosure, a substrate processing module is provided, comprising: a first groove and a second groove arranged in a first direction for configuring a substrate; a first conveying mechanism for moving the substrate in the first direction; and a second conveying mechanism for moving the substrate in a second direction intersecting the first direction, wherein the first groove and the second groove are disposed in a first region, the first conveying mechanism conveys the substrate in the first direction in a second region disposed above the first region, and the second conveying mechanism conveys the substrate in the second direction in a third region different from the second region.

[0088] According to a second aspect of this disclosure, a substrate processing module as described in the first aspect is provided, wherein the first region, the second region, and the third region are arranged in a vertical direction from bottom to top in this order.

[0089] According to a third aspect of this disclosure, a substrate processing module as described in the second aspect is provided, wherein the first conveying mechanism includes a first up-and-down actuator for moving the substrate up and down between the first region and the second region, and the second conveying mechanism includes a second up-and-down actuator for moving the substrate up and down between the second region and the third region.

[0090] According to a fourth aspect of this disclosure, a substrate processing module as described in the third aspect is provided, wherein the first up and down actuators are configured at a position offset relative to the first slot and the second slot in the second direction and at a height position lower than the second region.

[0091] According to the fifth aspect of this disclosure, a substrate processing module according to any one of the first to fourth aspects is provided, further comprising: a control unit, the control unit controlling the first conveying mechanism and the second conveying mechanism to perform the transfer of the substrate in the second region.

[0092] According to the sixth aspect of this disclosure, a substrate processing module as described in the fifth aspect is provided, wherein the substrate processing module further comprises a control unit, the control unit controlling the second conveying mechanism in a manner that selectively executes a first function and a second function, the first function being the function of conveying the substrate in the second direction in the second region, and the second function being the function of conveying the substrate in the second direction in the third region.

[0093] According to the seventh aspect of this disclosure, a substrate processing module is provided in any one of the second to fourth aspects, wherein the range of movement of the substrate in the first direction realized by the first conveying mechanism overlaps with the range of movement of the substrate in the second direction realized by the second conveying mechanism when viewed from above.

[0094] According to the eighth aspect of this disclosure, a substrate processing module according to any one of the first to seventh aspects is provided, wherein two first conveying units are provided, one of the first conveying units has a first chuck that is movable and disposed in the first groove while holding the substrate, and the other first conveying unit has a second chuck that is movable and disposed in the second groove while holding the substrate, at least one of the first chuck and the second chuck can move between an upper position in the first groove and an upper position in the second groove, and the first chuck and the second chuck are configured to be able to exchange substrates with each other.

[0095] According to the ninth aspect of this disclosure, a substrate processing module according to any one of the first to eighth aspects is provided, wherein the first groove is disposed on the front side of the first direction, the second groove is disposed on the rear side of the first direction, and the second conveying mechanism moves the substrate above the first groove.

[0096] According to the tenth aspect of this disclosure, a substrate processing module is provided according to any one of the first to ninth aspects, wherein the first tank and the second tank are each any one of a chemical tank for treating the substrate with a chemical solution, a cleaning tank for cleaning the substrate, and a single-tank processing tank that has both the function of treating the substrate with a chemical solution and the function of cleaning the substrate.

[0097] According to the eleventh aspect of this disclosure, a substrate processing module as described in the tenth aspect is provided, wherein the first tank is a cleaning tank disposed on the front side of the first direction, and the second tank is a liquid tank disposed on the rear side of the first direction.

[0098] According to the twelfth aspect of this disclosure, a substrate processing module is provided according to any one of the first to eleventh aspects, wherein the substrate processing module can be connected to other modules in the second direction, and the other modules are any one of a loading module, a loading module, a drying module, and a substrate processing module.

[0099] According to the thirteenth aspect of this disclosure, a substrate processing module is provided as described in any one of the first to twelfth aspects, wherein the first conveying mechanism or the second conveying mechanism includes a position adjustment mechanism for adjusting the position of holding the substrate.

[0100] According to the fourteenth aspect of this disclosure, a substrate processing module as described in the thirteenth aspect is provided, wherein the position adjustment mechanism has the function of adjusting the transport position of the substrate in the first direction.

[0101] According to the fifteenth aspect of this disclosure, a substrate processing apparatus is provided, comprising: a substrate processing module as described in any one of the first to fourteenth aspects; and other modules connected to the substrate processing module in the second direction.

[0102] Hereinafter, embodiments of the substrate processing apparatus 1 of the present invention will be described with reference to the accompanying drawings.

[0103] It should be noted that, in this specification, "module" refers to a standardized and detachable (replaceable) component, meaning a component that is considered a unified unit during use. Furthermore, "first direction" refers to the direction in which a pair of solution tanks and cleaning tanks are arranged, i.e., the short-dimensional direction of the substrate processing apparatus 1 (e.g., front-back direction, longitudinal direction). Furthermore, "second direction" refers to the direction intersecting the first direction and the vertical direction, and the direction in which multiple modules are connected, i.e., the long-dimensional direction of the substrate processing apparatus 1 (e.g., left-right direction, transverse direction). The first direction can also be referred to as the TD (Transverse Direction) direction, and the second direction can also be referred to as the MD (Machine Direction) direction. In the figures, the "first direction" is shown as the Y-axis direction, the "second direction" as the X-axis direction, and the "vertical direction" as the Z-axis direction. The first direction, the second direction, and the vertical direction intersect each other (e.g., orthogonal).

[0104] (Implementation Method 1)

[0105] Reference Figures 1-10 The substrate processing apparatus 1 of Embodiment 1 will be described. Figure 1 This is a perspective view illustrating the substrate processing apparatus 1 of Embodiment 1. Figure 2 Yes Figure 1 A perspective view illustrating the constituent elements of the substrate processing apparatus 1 shown. Figure 3 Yes Figure 1 A perspective view illustrating the chemical module 7 in the substrate processing apparatus 1 shown. Figure 4 Yes Figure 1 A perspective view illustrating the second transport mechanism 72 in the substrate processing apparatus 1 shown. Figure 5 Yes Figure 3 A three-dimensional diagram illustrating the main parts of chemical module 7. Figure 6 Yes Figure 1 A perspective view illustrating the transfer module 8 in the substrate processing apparatus 1 shown. Figure 7 Yes Figure 1 A perspective view illustrating the loading module 5 in the substrate processing apparatus 1 shown. Figure 8 Yes Figure 3 The diagram illustrates the operation of the upper and lower conveying section 13 of the second conveying mechanism 72 in the chemical module 7 shown. Figure 9 Yes Figure 3 The diagram illustrates the operation of the first conveying section 11 of the first conveying mechanism 70 in the chemical module 7 shown. Figure 10 This is a diagram illustrating the support member 2 that holds the substrate 4. Figure 11 Yes Figure 1 A perspective view illustrating the drying module 6 in the substrate processing apparatus 1 shown. Figure 12 It is a positive observation Figure 4 A schematic diagram of the second conveying mechanism 72 shown.

[0106] The substrate processing apparatus 1 includes, for example, at least one module for performing various processes on multiple substrates 4 held by the carrier 2. Specifically, the substrates 4 are, for example, semiconductor substrates, glass substrates for liquid crystal displays, glass substrates for photomasks, substrates for optical discs, MEMS (Micro-Electro-Mechanical System) sensor substrates, solar cell panels, etc. The module has a standardized housing 20, configured to be detachable (replaceable) in a second direction (X-axis direction, which is the longitudinal direction of the substrate processing apparatus 1, hereinafter referred to as "second direction"). A fan filter unit (not shown) may also be provided at the top of the module. The fan filter unit includes a fan and a filter for drawing in air from the cleanroom and delivering it to the module. The fan filter unit creates a downward airflow of clean air within the processing space of the module. Alternatively, other configurations that draw in clean air from the cleanroom may be used instead of the fan filter unit.

[0107] like Figure 1 and Figure 2As shown, the substrate processing apparatus 1 includes, for example, an infeed module 5, a drying module 6, a chemical module 7 (substrate processing module), an outfeed module 8, and a second conveying mechanism 72. The infeed module 5, chemical module 7, drying module 6, and outfeed module 8 are arranged adjacent to each other along a second direction. The infeed module 5, chemical module 7, drying module 6, and outfeed module 8 are configured to be detachably connected in the second direction. This allows for flexible adaptation to changes in the processing procedure, improving scalability. It should be noted that a transparent window that is visually perceptible to the operator can also be provided on the front surface of the substrate processing apparatus 1.

[0108] The second conveying mechanism 72 extends in the second direction and conveys the pair in the second direction. Figure 10 The carrier 2 holds the multiple substrates 4 shown. The second conveying mechanism 72 is disposed on the upper part of the front side of the infeed module 5, chemical module 7, drying module 6 and outfeed module 8 in the first direction (Y-axis direction, which is the short dimension direction of the substrate processing apparatus 1, hereinafter referred to as "first direction").

[0109] like Figure 3 , Figures 5-9 , Figure 11 As shown, the substrate processing apparatus 1 also includes a first conveying mechanism 70. The first conveying mechanism 70 has the function of conveying and holding multiple substrates 4 in the vertical direction and the first direction, so that the substrates 4 are respectively immersed in the chemical solution tank 32 and the cleaning tank 34. The first conveying mechanism 70 includes a first conveying section 11, a first actuator 12, a vertical conveying section 13, a vertical actuator 14, an arm 16, and a support platform 18, which will be described later.

[0110] The first conveying mechanism 70 and the second conveying mechanism 72 can exchange the carrier 2. The specific method will be described later.

[0111] The substrate processing apparatus 1 has Figure 1 The control unit 101 is shown in a schematic diagram. The control unit 101, for example, performs operation control and data processing on various elements of the substrate processing apparatus 1. The control unit 101 includes, for example, a CPU (Central Processing Unit), RAM (Random Access Memory), and ROM (Read Only Memory). The CPU executes control according to a program stored in the ROM (e.g., control of the transport operation of the carrier 2 via the first transport mechanism 70 and the second transport mechanism 72, etc.).

[0112] In the loading module 5, the substrate 4 before processing is loaded into the apparatus as a unit using the carrier 2. In the drying module 6, for example, the substrate 4 is vapor-dried using IPA (isopropanol) as a unit using the carrier 2. In the chemical module 7, the substrate 4 is cleaned as a unit using the carrier 2. In the unloading module 8, the cleaned substrate 4 is unloaded from the apparatus as a unit using the carrier 2.

[0113] The loading module 5, also known as the loading section, is disposed on the upstream side of the substrate processing apparatus 1 in the second direction. For example... Figure 7 As shown, the loading module 5 has an openable and closable loading section 26 on the upstream side of its housing 20 in the second direction. The carrier 2 is loaded into the interior of the loading module 5 via the loading section 26. The carrier 2 loaded into the interior of the loading module 5 is placed on the mounting platform 22. Inside the loading module 5, the carrier 2 is conveyed in the first direction via the first conveying section 11 through the arm 16, and conveyed in the up-down direction via the up-down conveying section 13 through the arm 16. A second conveying receiving section 40 of the second conveying mechanism 72 is mounted on the upper part of the housing 20 of the loading module 5. The carrier 2 is conveyed in the second direction via the second conveying section 48 (not shown) and conveyed downstream via the opening 37a located opposite the loading section 26. The first actuator 12 of the first conveying section 11 is disposed on the lower side of the mounting surface of the mounting platform 22. The upper and lower actuators 14 of the upper and lower conveying section 13 are also positioned to the side and lower part of the mounting surface of the mounting platform 22. That is, the carrier 2 placed on the mounting platform 22 is isolated from the influence of the first actuator 12 and the upper and lower actuators 14 by the downward flow from the fan filter unit and the arm length of the arm 16. As a result, contamination of the carrier 2 in the transport module 5 caused by particles generated by the first actuator 12 and the upper and lower actuators 14 can be suppressed.

[0114] The unloading module 8, also known as the unloading section, is disposed on the downstream side of the substrate processing apparatus 1 in the second direction. For example... Figure 6As shown, the carrier 2, which is moved into the interior of the transfer module 8, is placed on the mounting platform 22. Inside the transfer module 8, the carrier 2 is conveyed in a first direction via the first conveying section 11 through the arm 16, and in an upward and downward direction via the vertical conveying section 13 through the arm 16. The first actuator 12 of the first conveying section 11 is positioned to the side and lower than the mounting surface of the mounting platform 22. The vertical actuator 14 of the vertical conveying section 13 is also positioned to the side and lower than the mounting surface of the mounting platform 22. That is, the carrier 2 placed on the mounting platform 22 is isolated from the influence of the first actuator 12 and the vertical actuator 14 by the downward flow from the fan filter unit and the arm length of the arm 16. As a result, contamination of the carrier 2 inside the transfer module 8 caused by particles generated by the first actuator 12 and the vertical actuator 14 can be suppressed. The transfer module 8 has a transfer section 27 configured to be openable and closable on the downstream side of its housing 20 in a second direction. The carrier 2 is moved out to the outside of the transfer module 8, i.e., the outside of the substrate processing apparatus 1, via the transfer section 27. A second transport receiving section 40 of the second transport mechanism 72 is mounted on the upper part of the housing 20 of the transfer module 8. The carrier 2 is transported in the second direction via the second transport section 48 (not shown) and moved into the interior of the transfer module 8 via the opening 37a provided at a position opposite to the transfer section 27.

[0115] It should be noted that in the above scheme, the carrier 2 is transported from the loading module 5 to the unloading module 8 along the second direction in one direction, but other schemes can also be adopted. For example, the substrate processing apparatus 1 may only have either the loading module 5 or the unloading module 8. The loading module 5 may have the functions of both a loader and an unloader, or the unloading module 8 may have the functions of both a loader and an unloader. In this case, the carrier 2 is transported along the second direction in both one direction and the other direction (i.e., reciprocating transport along the second direction).

[0116] The substrate processing apparatus 1 has at least one drying module 6. For example... Figure 1 As shown, for example, the drying module 6 is disposed between the chemical module 7 and the transfer module 8.

[0117] like Figure 11 As shown, the drying module 6, like other modules 5, 7, and 8, serves as a first conveying mechanism 70, having a first conveying section 11 for conveying the carrier 2 in a first direction and a vertical conveying section 13 for conveying the carrier 2 in a vertical direction. The first conveying section 11 has a first actuator 12, and the vertical conveying section 13 has a vertical actuator 14. A second conveying receiving section 40 of the second conveying mechanism 72 is mounted on the upper part of the housing 20 of the drying module 6. The carrier 2 is conveyed in the second direction via the second conveying section 48 (not shown), and via the upstream opening 37a of two openings 37a located in opposing positions. Figure 11 (on the right side) is moved into the interior of the drying module 6, through the downstream opening 37a ( Figure 11 (From the left side) Move it to the outside of the drying module 6.

[0118] The drying module 6 has a drying chamber 31. The drying chamber 31 is, for example, located on the front side of the drying module 6 in a first direction. A drying process is performed in the drying chamber 31 to dry the substrate 4 after it has undergone various chemical treatments such as cleaning, etching, and resist stripping by the chemical module 7. In the drying module 6, the carrier 2 holding the substrate 4 is conveyed to the drying chamber 31 in a vertical direction via the arm 16 and the vertical conveyor 13. The first actuator 12 and the vertical actuator 14 are disposed separately from the drying chamber 31 on the lower side. Therefore, the drying chamber 31 is isolated from the influence of the first actuator 12 and the vertical actuator 14.

[0119] In this drying process, commonly known drying methods can be used. Specifically, for example, a drying method using the Marangoni effect, known as IMD (IPA Mist Dryer), can be used. In this drying method, the carrier 2 holding the substrate 4 is immersed in a pure water tank provided in the drying chamber 31, and IPA mist or vaporized IPA is continuously supplied to the water surface, utilizing the difference in surface tension generated on the surface of the substrate 4 passing through the water surface when the substrate 4 is raised or lowered, or when the water surface overflows or falls.

[0120] In addition, as another drying method, a centrifugal drying method, known as a spin dryer, can also be used. In this drying method, a carrier 2 that holds the substrate 4 is placed on a rotating rotor provided in a drying chamber 31. After the carrier 2 and the substrate 4 are fixed by a protective fixing device called a retainer, the centrifugal force generated by rotating the rotating rotor is used.

[0121] In addition, as another drying method, drying by steam cleaning, for example, can be performed using a steam dryer. In this drying method, a drying chamber 31 is filled with saturated vapor produced by heating a solvent with low latent heat of vaporization (e.g., IPA). A carrier 2, which holds a substrate 4 at a lower temperature than the vapor, is placed in the drying chamber 31. The surfaces of the carrier 2 and the substrate 4 are cleaned by condensing and liquefying IPA on the surface of the substrate 4. When the carrier 2 and the substrate 4 are heated to the same temperature as the IPA vapor, the condensation and liquefaction of IPA on the surfaces of the carrier 2 and the substrate 4 is stopped, and the carrier 2 and the substrate 4 are dried.

[0122] As another drying method, N2 drying via N2 can also be used. In any drying method, the drying chamber 31 is isolated from the influence of the up-and-down actuator 14 and the first actuator 12 of the carrier 2 that holds the substrate 4 during transport. This suppresses contamination within the drying module 6 caused by particles generated by the up-and-down actuator 14 and the first actuator 12. It should be noted that the first actuator 12 and the up-and-down actuator 14 can also be disposed separately from the drying chamber 31 at the lower rear side of the drying chamber 31 in the first direction. Furthermore, if only up-and-down transport is required, the drying module 6 may not include the first transport section 11.

[0123] Chemistry module 7 has at least one module. For example... Figure 1 and Figure 2 As shown, chemical module 7 includes, for example, a first chemical module 7a, a second chemical module 7b, a third chemical module 7c, and a fourth chemical module 7d. In chemical module 7, various chemical treatments are performed, including APM (ammonium hydroxide-hydrogen peroxide mixture) cleaning, SPM (sulfuric acid-hydrogen peroxide mixture) cleaning, HPM (hydrochloric acid-hydrogen peroxide mixture) cleaning, and DHF (diluted hydrofluoric acid) cleaning, as well as etching and resist stripping. These chemical treatments can be arbitrarily combined depending on the type of chemical treatment applied to the substrate 4. Each chemical module 7a, 7b, 7c, and 7d is configured to be detachably connected in a second direction. This allows for flexible adaptation to changes in the processing procedures, improving scalability.

[0124] like Figure 3 , Figure 5 as well as Figure 9As shown, the chemical module 7 has a chemical solution tank 32 (second tank) for chemical cleaning and a cleaning tank 34 (first tank) for pure water cleaning (rinsing). The chemical solution tank 32 is disposed on the rear side in the first direction, and the cleaning tank 34 is disposed on the front side in the first direction. That is, the chemical solution tank 32 and the cleaning tank 34 are arranged in the first direction. As a result, the width of the chemical module 7 in the second direction is narrowed, thus enabling miniaturization of the substrate processing apparatus 1. It should be noted that a configuration in which the chemical solution tank 32 is disposed on the front side in the first direction and the cleaning tank 34 is disposed on the rear side in the first direction can also be adopted. In addition, a common exhaust pipe 29 for discharging chemical vapor generated from the chemical solution tank 32 can be disposed on the rear side in the first direction, thus making maintenance of the substrate processing apparatus 1 easier. The chemical solution tank 32 stores the various chemical solutions described above. The cleaning tank 34 stores pure water. The medicine tank 32, for example, has an inner tank for immersing the carrier 2 in the medicine and an outer tank for collecting medicine overflowing from the upper end of the inner tank. At a time unrelated to the conveying action of the carrier 2, the opening of the medicine tank 32 is closed by a cover.

[0125] Two side walls 37, 37 are provided on the side of the liquid medicine tank 32 in the second direction. That is, the side of the liquid medicine tank 32 in the second direction is separated by the side walls 37. This can suppress contamination caused by the atmosphere of the liquid medicine stored in the liquid medicine tank 32 of the adjacent chemical module 7. At the same time, a rear wall 38 is provided at the rear of the liquid medicine tank 32 in the first direction. The liquid medicine tank 32 is surrounded by the two side walls 37, 37 and the rear wall 38 in a U-shape when viewed from above and below.

[0126] For example, two side exhaust pipes 36, 36, each with a side exhaust port 36a, can be respectively provided on the upper side of the medicine tank 32. The two side exhaust ports 36a, 36a are located at approximately the same height as the opening of the medicine tank 32, although slightly lower. A rear exhaust pipe 39 is provided on the rear wall 38. Figure 9 (See diagram) Rear exhaust port 39a. Two side exhaust pipes 36, 36 and the rear exhaust pipe 39 branch off from and connect to the common exhaust pipe 29. The rear exhaust port 39a is located above the opening of the liquid tank 32. Thus, the side exhaust ports 36a and the rear exhaust port 39a, which discharge liquid vapor evaporated from the liquid tank 32, are arranged around the liquid tank 32. This can suppress the diffusion of liquid vapor generated from the liquid tank 32 into the processing space within the chemical module 7, and can suppress contamination of the substrate 4 transported in the processing space within the chemical module 7.

[0127] Each chemical module 7's first conveying mechanism 70 has a first conveying section 11 for conveying the carrier 2 in a first direction and an up-and-down conveying section 13 for conveying the carrier 2 in a vertical direction. The up-and-down conveying section 13 has an up-and-down actuator 14. The carrier 2 is supported by a support platform 18 located at one end of an inverted U-shaped arm 16. It should be noted that the carrier 2 has a flange 3 on its upper part, which, as described above, can be freely held relative to the flange 3 by the chuck 44 of the second conveying section 48. Furthermore, the flange 3 of the carrier 2 can also be supported by the support platform 18. In addition, the arm 16 can also have a D-shaped shape.

[0128] The other end of arm 16 is fitted with a vertical actuator 14. The vertical actuator 14 is an electrically powered linear actuator, for example, having a screw shaft that moves arm 16, a motor that rotates the screw shaft, a power supply, and a control unit that controls the motor. When the support member 2 is positioned directly above the medicine tank 32 or the cleaning tank 34, and arm 16 is moved downward by the vertical actuator 14, the support member 2, which holds multiple substrates 4, is immersed in the medicine solution in the medicine tank 32 or the cleaning solution in the cleaning tank 34. When arm 16 is moved upward by the vertical actuator 14 while the support member 2 is immersed in the medicine solution or the cleaning solution, the support member 2, which holds multiple substrates 4, is pulled up from the medicine solution or the cleaning solution. Therefore, when the support member 2 is located directly above the liquid tank 32 or the cleaning tank 34, the arm 16 is moved in the vertical direction by the vertical actuator 14, and the support member 2, which holds multiple substrates 4, is pulled up or immersed in the liquid in the liquid tank 32 or the cleaning liquid in the cleaning tank 34.

[0129] The first conveying unit 11 has a first actuator 12. An up-and-down actuator 14 is mounted on the first actuator 12. The first actuator 12 is an electrically powered linear actuator, for example, having a screw shaft that moves the up-and-down actuator 14, a motor that rotates the screw shaft, a power supply, and a control unit that controls the motor. When the arm 16 is moved to the upper position and then moved rearward in the first direction by the first actuator 12, the carrier 2 holding the multiple substrates 4 is conveyed directly above the medicine tank 32. When the arm 16 is positioned in the pulled-up position and then moved forward in the first direction by the first actuator 12, the carrier 2 holding the multiple substrates 4 is conveyed directly above the cleaning tank 34. Therefore, when the arm 16 is positioned in the pulled-up position and then moved in the first direction by the first actuator 12, the carrier 2 holding the multiple substrates 4 is conveyed between directly above the medicine tank 32 and directly above the cleaning tank 34.

[0130] The first actuator 12 and the upper and lower actuators 14 are disposed on the outer side and lower side of the opening of the medicine tank 32, separated by the side exhaust pipe 36. That is, the medicine tank 32 and the cleaning tank 34 are isolated from the influence of the first actuator 12 and the upper and lower actuators 14 by the downward flow from the fan filter unit and the exhaust from the side exhaust pipe 36. As a result, the separation distance between the first actuator 12 and the upper and lower actuators 14 and the opening of the medicine tank 32 can be greatly ensured, and thus, the contamination within the chemical module 7 caused by particles generated by the first actuator 12 and the upper and lower actuators 14 can be suppressed. It should be noted that a configuration can also be adopted in which the two side exhaust pipes 36 are removed, and exhaust is carried out only through the rear exhaust pipe 39.

[0131] Next, refer to Figure 1 , Figure 2 , Figure 4 , Figure 8 as well as Figure 9 The second conveying mechanism 72 will be described.

[0132] like Figure 1 As shown, the second conveying mechanism 72 is disposed on the upper part of the housing 20 in the infeed module 5, chemical module 7, drying module 6, and outfeed module 8. Figure 4 As shown, the second conveying mechanism 72, for example, has a configuration in which multiple second conveying accommodating portions 40 and a second actuator 41 are connected in a second direction. The second conveying accommodating portions 40 are respectively configured as part of the housing 20 of the loading module 5, the chemical module 7, the drying module 6, and the unloading module 8. That is, the second conveying accommodating portions 40 are integrally formed with the housing 20. Furthermore, the second conveying accommodating portions 40 can also be configured as separate box-shaped components. Figure 2 and Figure 4 To facilitate understanding of the configuration of the second conveying receiving portion 40, the diagram shows a configuration where the second conveying receiving portion 40 is separated from the housing 20. However, the second conveying receiving portion 40 can be an integral part of the housing 20 or it can be configured as a separate component. The second conveying receiving portion 40 and the second actuator 41 are configured to be detachably connected in a second direction.

[0133] like Figure 4As shown, the second conveying mechanism 72 has a plurality of second conveying accommodating portions 40 and at least one second conveying portion 48. The number of second conveying portions 48 disposed in the second conveying mechanism 72 is appropriately increased or decreased according to the number of connected second conveying accommodating portions 40. The second conveying portion 48 has a second actuator 41. The second actuator 41 is housed in the second conveying accommodating portion 40. The first actuator 12 and the upper and lower actuators 14 are housed in the chemical module 7, and the second actuator 41 is housed in the second conveying accommodating portion 40. Thus, the first actuator 12 and the upper and lower actuators 14 are housed separately from the second actuator 41, thereby suppressing contamination within the chemical module 7.

[0134] The second actuator 41 is, for example, an electrically powered linear actuator. The second actuator 41 is, for example, a rack and pinion, and includes: a flat guide portion with a rack having teeth; a circular gear, referred to as the pinion; a motor for rotating the circular gear; a power supply; and a control portion for controlling the motor. The flat guide portion has multiple guide plates, which can be configured to be detachably connected in a second direction.

[0135] like Figure 8 , Figure 9 , Figure 12 As shown, in addition to the second actuator 41, the second conveying unit 48 also includes a chuck actuator 42, a connecting arm 43, a chuck part 44, a holding block 45, upper and lower rails 74, and a connecting block 76.

[0136] The chuck actuator 42 is a component used to integrally drive the connecting arm 43 and the chuck section 44, and includes a drive source such as a motor, a power supply, and a control unit. The chuck actuator 42 is not limited to an electric type; it can also be an actuator driven by hydraulic or pneumatic pressure. The two connecting arms 43 are connected to the chuck actuator 42, and the chuck actuator 42 can drive the two connecting arms 43 to slide in both directions of approaching and separation in the horizontal direction (see arrow X2).

[0137] Connecting arm 43 is the arm that connects the chuck actuator 42 and the chuck section 44. For example... Figure 9 As shown, the connecting arm 43 has a U-shaped shape and extends forward, downward, and rearward from the connection portion of the chuck actuator 42. The connecting arm 43, together with the chuck actuator 42, is housed in the second transport receiving portion 40, and extends forward through an opening 80 provided in the second transport receiving portion 40, downward through an opening 79 provided in the top surface portion 77 of the housing 20, and into the processing space of the housing 20. Inside the housing 20, the chuck portion 44 is disposed on the connecting arm 43.

[0138] The chuck portion 44 is a rod-shaped member extending downward from the connecting arm 43, having a claw-like shape with its tip curved inward. For example... Figure 4As shown, chuck portions 44 are respectively mounted on the connecting arms 43. Figure 4 The example shown illustrates a case where two chuck portions 44 are fitted onto a connecting arm 43. However, as long as at least one chuck portion 44 exists on a connecting arm 43 (i.e., a pair of chuck portions 44), the number of chuck portions 44 can be arbitrary. The chuck portions 44, together with the connecting arm 43, are driven to slide horizontally via chuck actuators 42 (see arrow X2). Figure 9 As shown, the chuck portion 44 is configured to be located directly above the cleaning tank 34.

[0139] A pair of chuck portions 44, 44, separated in the X-axis direction, clamp the flange portion 3 of the carrier member 2 from both sides by sliding towards each other. The clamping of the flange portion 3 of the carrier member 2 is released by sliding the two chuck portions 44, 44 towards each other. Therefore, the pair of chuck portions 44, 44 can disengage relative to the flange portion 3 of the carrier member 2.

[0140] The retaining block 45 is a block that holds the chuck actuator 42. The retaining block 45 holds the chuck actuator 42, thereby holding the pair of connecting arms 43 and the chuck portion 44 connected to the chuck actuator 42 in a slidable manner as a single unit. The retaining block 45 is mounted on the upper and lower rails 74.

[0141] The upper and lower rails 74 are rail-shaped components extending vertically, and are fitted with retaining blocks 45 (refer to arrow Z1) in a manner that allows them to move vertically. The retaining blocks 45 move vertically along the upper and lower rails 74, thereby enabling the connecting arm 43 and the chuck portion 44 to move vertically as a unit. The upper and lower rails 74 are connected to the rails of the second actuator 41 via connecting blocks 76.

[0142] The connecting block 76 and the upper and lower tracks 74 are driven by the second actuator 41 to move horizontally along the X-axis, which is the second direction (see arrow X1). Figure 12 In the diagram, dashed and solid lines are used to show that the connecting block 76 and the upper and lower tracks 74 move horizontally, causing the second conveying unit 48 to be in different positions.

[0143] exist Figure 12 In the diagram, solid and dashed lines illustrate how the holding block 45, connected to the upper and lower rails 74, moves vertically to position the second conveying section 48 at different heights. Furthermore, the upper and lower rails 74 are equipped with a vertical actuator 78 for driving the holding block 45 in the vertical direction. The vertical actuator 78 may, for example, be built into the upper and lower rails 74, although... Figure 12 The diagram is a rough sketch, but any composition can be used.

[0144] According to the above configuration, driven by the second actuator 41 and the up-down actuator 78, the holding block 45, the connecting arm 43, and the chuck portion 44 of the second transport section 48 can move integrally in the horizontal direction (arrow X1) and the vertical direction (arrow Z1). In this configuration, the connecting arm 43 and the chuck portion 44 can slide in the horizontal direction (arrow X2) driven by the chuck actuator 42, and can freely hold the carrier 2 that holds the substrate 4. The chuck portion 44 is not limited to linear sliding drive; as long as it is rotary drive or otherwise can freely hold the carrier 2 and the substrate 4, it can move in any direction. The second transport section 48 of this embodiment does not have the function of moving along the Y-axis direction, which is the first direction.

[0145] like Figure 8 , Figure 9 As shown, the internal space of the chemical module 7 is divided into multiple regions LV1 to LV3. The chemical module 7 of this embodiment has three regions LV1, LV2, and LV3, which are arranged in this order from bottom to top in the vertical direction. When regions are divided in the vertical direction, they can also be referred to as "hierarchies." Regions are not limited to being divided in the vertical direction; they can also be divided in directions different from the vertical direction (e.g., horizontal or inclined). Regions are not limited to not overlapping each other completely; they can also partially overlap.

[0146] In this embodiment, the first region LV1 is the lowest of the three regions LV1, LV2, and LV3, corresponding to the height of the cleaning tank 34 and the medicine tank 32. The second region LV2 is located between the first region LV1 and the third region LV3, and is used for the first conveying mechanism 70 to convey the carrier 2 and the substrate 4 in the first direction. The third region LV3 is the highest of the three regions LV1, LV2, and LV3, and is used for the second conveying unit 48 to move together with the substrate 4 in the second direction.

[0147] like Figure 8 As shown, the first conveying mechanism 70 has the function of moving the substrate 4 vertically between the first region LV1 and the second region LV2, and the second conveying mechanism 72 has the function of moving the substrate 4 vertically between the second region LV2 and the third region LV3. Both the first conveying mechanism 70 and the second conveying mechanism 72 can convey the substrate 4 to the second region LV2, thereby enabling the transfer of the substrate 4 in the second region LV2. In this embodiment, the first conveying mechanism 70 does not have the function of rising to the third region LV3, and the second conveying mechanism 72 does not have the function of descending to the first region LV1.

[0148] The first conveying mechanism 70 and the substrate 4 held by the first conveying mechanism 70 move in a first direction within a second region LV2. That is, the range of movement of the substrate 4 in the first direction achieved by the first conveying mechanism 70 is encompassed within the second region LV2. Conversely, the second conveying mechanism 72 and the substrate 4 held by the second conveying mechanism 72 can move in a second direction within a third region LV3, which is higher than the second region LV2. That is, the range of movement of the substrate 4 in the second direction achieved by the second conveying mechanism 72 is encompassed within the third region LV3, which is different from the second region LV2. With this configuration, the first conveying mechanism 70 and the second conveying mechanism 72 can move without interfering with each other; therefore, there are no limitations associated with independent movement, and throughput can be increased.

[0149] It should be noted that the second conveying mechanism 72 is not limited to moving in the second direction in the third region LV3. It can also move in the second direction in the second region LV2 without interfering with the first conveying mechanism 70. The control unit 101 has a first function of conveying the substrate 4 in the second direction in the second region LV2 and a second function of conveying the substrate 4 in the second direction in the third region LV3. By selectively executing the first and second functions, the throughput can be further improved.

[0150] like Figure 9 As shown, the opening 37a provided in the side wall 37 is located from the second region LV2 to the third region LV3. That is, the opening 37a is provided corresponding to the movement range of the second conveying mechanism 72 and the substrate 4 held by the second conveying mechanism 72. By providing the side wall 37 in areas other than the opening 37a, the generation of contamination between adjacent chemical modules 7 can be suppressed.

[0151] In particular, the second actuator 41, the chuck actuator 42, and the upper and lower actuator 78, which serve as the drive mechanisms for driving the chuck section 44, are all housed in the second transport receiving section 40 above the top surface 77 of the housing 20. In this way, each drive mechanism is configured in isolation from the processing space of the housing 20, thereby suppressing contamination and keeping the interior of the housing 20 in a clean state.

[0152] The specific embodiments and numerical values ​​of the present invention have been described, but the present invention is not limited to the above embodiments, and various modifications and implementations can be made within the scope of the present invention.

[0153] For example, in the above-described embodiment 1, the first actuator 12 and the upper and lower actuators 14 are disposed on the lower side (lower part in the second direction), but they can also be disposed on the first direction side as needed.

[0154] The number and combination of modules in the substrate processing apparatus 1 can be designed appropriately as needed; for example, the chemical module 7 and the drying module 6 can be configured alternately.

[0155] The implementation method 1 is summarized as follows.

[0156] The substrate processing apparatus 1 of one aspect of the present invention is characterized in that,

[0157] The substrate processing apparatus 1 includes a chemical module 7, which comprises: a chemical solution tank 32 for processing the substrate 4 held by the carrier 2 with a chemical solution; and a cleaning tank 34 for cleaning the substrate 4 held by the carrier 2.

[0158] The chemical module 7 includes:

[0159] The first conveying unit 11 conveys the carrier 2 in a first direction in which the medicine tank 32 and the cleaning tank 34 are arranged.

[0160] The vertical conveying unit 13 conveys the carrier 2 in a vertical direction intersecting the first direction; and

[0161] The second conveying unit 48 conveys the carrier 2 in a second direction that intersects the first direction and the vertical direction.

[0162] The first conveying unit 11, the second conveying unit 48, and the upper and lower conveying unit 13 are driven by the first actuator 12, the second actuator 41, and the upper and lower actuator 14, respectively.

[0163] The first actuator 12, the second actuator 41, and the upper and lower actuators 14 are isolated from the medicine tank 32 and the cleaning tank 34.

[0164] According to the above configuration, by conveying in the first direction by the first conveying unit 11 and in the second direction by the second conveying unit 48, other adjacent liquid tanks 32 and cleaning tanks 34 are isolated from the influence of liquid adhering to the conveyed carrier 2, thus suppressing contamination caused by the liquid. Furthermore, the actuators 12, 41, and 14 of the conveying units 11, 48, and 13 that drive the conveying of the carrier 2 are isolated from the influence of the liquid tanks 32 and cleaning tanks 34, thus suppressing contamination caused by particles of the carrier 2 within the chemical module 7. Moreover, the liquid tanks 32 and cleaning tanks 34 are arranged in the first direction, thereby narrowing the width of the chemical module 7 in the second direction, thus enabling miniaturization of the substrate processing apparatus 1. Furthermore, since the apparatus for each processing step is modularized, changes can be flexibly addressed by connecting other modules 5, 6, and 8 to the chemical module 7.

[0165] Furthermore, in one embodiment of the substrate processing apparatus 1,

[0166] The chemical module 7 is configured to be detachably connected in the second direction.

[0167] According to the above implementation method, it can flexibly respond to changes in the processing process and improve scalability.

[0168] Furthermore, in one embodiment of the substrate processing apparatus 1,

[0169] The first actuator 12 and the upper and lower actuators 14 are disposed below each opening of the medicine tank 32 and the cleaning tank 34.

[0170] According to the above embodiment, contamination within the chemical module 7 caused by particles generated by the first actuator 12 and the upper and lower actuators 14 can be suppressed.

[0171] Furthermore, in one embodiment of the substrate processing apparatus 1,

[0172] It also includes: an infeed module 5 for infeeding the carrier 2 that holds the substrate 4; a drying module 6 for drying the substrate 4 held by the carrier 2; or an outfeed module 8 for outfeeding the carrier 2 that holds the substrate 4.

[0173] The loading module 5, the drying module 6, and the unloading module 8 are configured to be detachably connected in the second direction.

[0174] According to the above implementation method, it can flexibly respond to changes in the processing process and improve scalability.

[0175] Furthermore, in one embodiment of the substrate processing apparatus 1,

[0176] The second direction side of the medicine tank 32 is separated by a side wall 37.

[0177] According to the above embodiment, pollution caused by the atmosphere of the medicine stored in the medicine tank 32 of the adjacent chemical module 7 can be suppressed.

[0178] Furthermore, in one embodiment of the substrate processing apparatus 1,

[0179] The medicine tank 32 is located on the rear side in the first direction, and the cleaning tank 34 is located on the front side in the first direction.

[0180] According to the above embodiment, the exhaust pipe 39 for discharging the liquid vapor generated from the liquid tank 32 can be arranged on the rear side in the first direction, thus making the maintenance of the substrate processing apparatus 1 easier.

[0181] It should be noted that in the above embodiment 1, the case in which multiple substrates 4 are held by the carrier 2 has been described, but it is not limited to this case, and there may be no carrier. For example, multiple substrates 4 may be held directly by the chuck part 44 and the support table 18.

[0182] Next, use Figure 8 , Figure 9 The relationship between the driving space configured with actuators 12, 14, 41, 42, and 78 and the processing space for processing substrate 4 will be explained.

[0183] like Figure 8 , Figure 9 As shown, the housing 20 forms a processing space A for processing substrates 4. The processing space A is the space surrounding the liquid tank 32 and the cleaning tank 34, through which multiple substrates 4 are transported in the front-back direction (first direction) and the lateral direction (second direction). The processing space A is surrounded by a pair of side walls 37 and a rear wall 38.

[0184] like Figure 8 , Figure 9 As shown, the housing 20 forms a first drive space B1. The first drive space B1 is a space for arranging the first actuator 12 and the upper and lower actuators 14. The first drive space B1 is formed on the side and below in a second direction relative to the openings of the medicine tank 32 and the cleaning tank 34.

[0185] like Figure 8 , Figure 9 As shown, the housing 20 forms a second drive space B2. The second drive space B2 is a space for arranging drive mechanisms such as the second actuator 41, the chuck actuator 42, and the up / down actuator 78 for driving the chuck section 44. The second drive space B2 is formed above the processing space A.

[0186] Actuators 12, 14, 41, and 78 can be isolated from processing space A by arranging actuators 12, 14, 41, and 78 in drive spaces B1 and B2. This can prevent foreign matter generated by actuators 12, 14, 41, and 78 from entering processing space A and can suppress contamination within chemical module 7.

[0187] like Figure 3 As shown, the first drive space B1 and the processing space A are separated by a side exhaust duct 36. However, this is not a limited case; for example, the first drive space B1 can also be separated from the processing space A by providing a wall that divides the first drive space B1 and the processing space A. Figure 13 This example will be used to illustrate the point.

[0188] Figure 13 This is a schematic top view representing the processing space A of the modified example. For example... Figure 13As shown, a bottom wall 90 is provided to surround the liquid tank 32 and the cleaning tank 34. The bottom wall 90 is the wall that forms the bottom of the processing space A. An opening 92 is formed in a portion of the bottom wall 90, and a movable wall 94 is provided below the opening 92. The movable wall 94 is configured to cover the opening 92 and moves integrally with the arm 16 supporting the support platform 18 in the front-rear direction (arrows L1, L2). The movable wall 94 has a shape that is longer in the front-rear direction and always has a length that covers the entire opening 92 within the range of movement of the arm 16. The arm 16 extends downward through the movable wall 94 and is connected to the upper and lower actuators 14. The arm 16 is disposed in close contact with the through hole of the movable wall 94 through which the arm 16 passes. Figure 13 In the example shown, the side exhaust pipe 36 is not provided.

[0189] according to Figure 13 The configuration shown allows for physical isolation between the processing space A and the first drive space B1 by providing a movable wall 94 for the insertion arm 16, while moving the arm 16 in the front-to-back direction. This, in turn, more reliably suppresses contamination within the chemical module 7.

[0190] In addition, Figure 13 In the example shown, the support platform 18 has an upper section 18A and a lower section 18B in the outer frame portion that forms the space for accommodating the carrier 2. The upper section 18A is a portion that protrudes upwards from the lower section 18B and functions to support the flange portion 3 of the carrier 2 from below. The lower section 18B is a portion located below the upper section 18A, forming a gap at the top of the chuck portion 44 (claw shape) for arranging the second conveying unit 48. By providing the lower section 18B, while the upper section 18A supports the flange portion 3 of the carrier 2, the chuck portion 44 of the second conveying unit 48 can also support the flange portion 3 of the carrier 2 at a different position than the upper section 18A. Thus, the chuck portion 44 and the support platform 18 can hold the carrier 2 without interfering with each other, and the carrier 2 can be easily transferred between the chuck portion 44 and the support platform 18.

[0191] Next, use Figures 14A to 26B An example of the operation of the substrate processing apparatus 1 will be described.

[0192] Figures 14A to 26B This is a schematic diagram illustrating an example of the operation of the substrate processing apparatus 1. Figure 14A , Figure 15A ... Figure 26A These are the top views of processing space A. Figure 14B , Figure 15B ... Figure 26B These are side views showing the periphery of the support platform 18 and the base plate 4. Figure 14A and Figure 14B Corresponding to the same state, Figure 15A and Figure 15B The other attached figures correspond to the same state.

[0193] like Figure 14A , Figure 14B As shown, firstly, within the processing space A, the support platform 18 of the first conveying mechanism 70 stands ready above the cleaning tank 34. (As...) Figure 14B As shown, the support platform 18 is positioned at the raised position H1 within the second region LV2 described above. In the standby state, as... Figure 14A As shown, the second conveying section 48 of the second conveying mechanism 72 moves the carrier 2, which holds the plurality of substrates 4, laterally (in the second direction) (arrow M1). The chuck section 44 of the second conveying section 48, the carrier 2 held by the chuck section 44, and the substrates 4 move laterally, for example, within the aforementioned third region LV3, thus avoiding interference with the support platform 18 disposed in the second region LV2. Figure 14A In the event of interference between the support platform 18 shown, the support platform 18 in other modules, and the substrate 4, the second conveying mechanism 72 can move the carrier 2 and the substrate 4 laterally in the second region LV2.

[0194] like Figure 15A , Figure 15B As shown, the second transport section 48 moves the carrier 2, which holds the substrate 4, above the support platform 18. Then, the aforementioned holding block 45 descends along the upper and lower tracks 74, thereby causing the second transport section 48 to descend integrally toward the second region LV2 (arrow M2), so that the support platform 18 holds the carrier 2.

[0195] like Figure 16A , Figure 16B As shown, the upper section 18A of the support platform 18 abuts against the flange portion 3 of the bearing member 2, providing support from below. (Similar to using...) Figure 13 As explained, the chuck portion 44 supports the flange portion 3 of the carrier member 2 at a position different from the upper section 18A of the support table 18, thus avoiding interference with the support table 18. Then, the chuck portion 44 is moved in the opening direction (arrow M3-1) to release the grip on the substrate 4. Thus, as... Figure 17A , Figure 17B As shown, the bearing member 2 is transferred from the chuck section 44 to the support platform 18.

[0196] like Figure 17BAs shown, the chuck portion 44, released from the grip of the support member 2, rises and retracts (arrow M3-2). The chuck portion 44, retracting towards the third region LV3, can move freely laterally (in the second direction) without interfering with the support member 2, base plate 4, support platform 18, arm 16, etc., located in the second region LV2. The support platform 18 holds the support member 2 in the raised position H1 as shown... Figure 17A As shown, it moves toward the rear of the liquid tank 32 in the first direction (arrow M4). With the chuck section 44 open to the outside, the support platform 18 and the carrier 2 can move in the first direction without interfering with the chuck section 44. Therefore, it is also possible to move in the first direction without waiting for the chuck section 44 to rise.

[0197] like Figure 18A As shown, the carrier 2 and the support platform 18 move to a position above the liquid tank 32 and then stop. In this state, as... Figure 18B As shown, the carrier 2 and support platform 18 are lowered (arrow M5), immersing the substrate 4 in the medicine stored in the medicine tank 32. The chuck portion 44, which retracts towards the third region LV3, can... Figure 18A As shown, it can move freely in the second direction (arrow M6), thus allowing it to move to other modules or retreat directly above the cleaning tank 34 to hold the carrier 2, which is the next object to be processed. Figure 18A In the example shown, the second conveying unit 48 is retracted from directly above the cleaning tank 34 in the second direction. However, since it will not interfere with the components arranged in the first region LV1 and the second region LV2, it can also remain above the cleaning tank 34 without retracting. Furthermore, the chuck unit 44 is not limited to retracting to the third region LV3. It can also move in the second direction while remaining in the second region LV2 without rising to the third region LV3, provided that it does not interfere with the support platform 18 and the base plate 4 in other modules.

[0198] like Figure 19A , Figure 19B As shown, the support stage 18 is lowered to a lowered position H2, which is the height position for immersing multiple substrates 4 in the chemical solution. The surface of the substrates 4 can be etched or processed by immersing the substrates 4 in the chemical solution.

[0199] As for the liquid used in the solution tank 32, any liquid can be used as long as it can treat the surface of the substrate 4. For example, in the case of organic liquids, amine solutions such as NMP, monoethanolamine, and acetone can be used; in the case of inorganic liquids, SC1 (APM), SC2 (HPM), SPM, HF (hydrofluoric acid), BHF (buffered hydrofluoric acid), etc., can be used. In addition, a single liquid or a combination of two or more liquids can be used.

[0200] When the chemical treatment of substrate 4 is completed, the carrier 2 and the support platform 18 are raised (arrow M7) to lift substrate 4. Figure 20B As shown, the support platform 18 rises to the rising position H1 included in the second region LV2. In this state, as... Figure 20A As shown, the carrier 2 and the support platform 18 are moved forward in the first direction toward the cleaning tank 34 (arrow M8).

[0201] like Figure 21A As shown, the carrier 2 and the support platform 18 move to a position directly above the cleaning tank 34 and then stop. Afterwards, as... Figure 21B As shown, the carrier 2 and the support platform 18 are lowered (arrow M9) to place the substrate 4 inside the cleaning tank 34.

[0202] like Figure 22B As shown, with the support platform 18 lowered to the lowered position H2, the substrate 4 is immersed in cleaning water, such as pure water, stored in the cleaning tank 34. This allows for rinsing of the surface of the substrate 4, where the chemical solution is attached. Immersion in cleaning water is not the only option; cleaning water can also be sprayed onto the substrate 4. As a rinsing process, any liquid / method can be used as long as it replaces the chemical solution attached to the surface of the substrate 4 in a state that will not cause problems in the next process. For example, protic solvents, water, IPA, alcohols such as ethanol, NMP, and amine solutions such as monoethanolamine can also be used. Furthermore, a single liquid or a combination of two or more liquids can be used.

[0203] like Figure 22A As shown, when the second conveyor 48 is retracted, during the rinsing process of the substrate 4, the second conveyor 48 can also be moved in the second direction and returned to above the cleaning tank 34 (arrow M10). When the second conveyor 48 is positioned in the third region LV3, regardless of whether the second conveyor 48 is directly above the cleaning tank 34, as... Figure 22B As shown, the carrier 2 and the support platform 18 that hold the substrate 4 after rinsing can both rise toward the second region LV2 (arrow M11).

[0204] like Figure 23B As shown, the support platform 18 raises the carrier 2 to an elevated position H1, which serves as a position for handing over to the chuck section 44, and is positioned in the second region LV2. After the chuck section 44 is moved in the opening direction (arrow M12), the second transport section 48, positioned in the third region LV3, descends integrally toward the second region LV2 (arrow M13).

[0205] like Figure 24A , Figure 24BAs shown, with the chuck section 44 lowered and positioned in the second region LV2, the chuck section 44 is moved in the closing direction (arrow M14) to hold multiple substrates 4. The chuck section 44 is inserted into the gap between the lower section 18B of the support platform 18 and the flange 3 of the carrier member 2, supporting the flange 3 from below.

[0206] After that, as Figure 25A , Figure 25B As shown, with the carrier 2 held in place by the chuck section 44, the second conveying section 48 is raised (arrow M15). This releases the support table 18 from holding the carrier 2, and the carrier 2 is transferred from the support table 18 to the chuck section 44.

[0207] like Figure 26A , Figure 26B As shown, the second conveying section 48 and the carrier 2 and substrate 4 held by the second conveying section 48 rise to the third region LV3 and move freely in the second direction (arrow M16) without interfering with the support platform 18 and arm 16 arranged in the second region LV2.

[0208] according to Figures 14A to 26B The operation shown allows the use of a chemical solution tank 32 and a cleaning tank 34 arranged in a front-to-back direction (first direction) within the processing space A of the chemical module 7. The substrate 4 is transported in the front-to-back direction (first transport step), and chemical treatment and rinsing treatment of the substrate 4 are performed. After both treatments are completed, the substrate 4 is transported laterally (second direction) toward the next chemical module 7 (second transport step). By performing the first and second transport steps, a substrate 4 that has undergone etching and other treatments can be manufactured.

[0209] When processing substrate 4 in batches, it is only necessary to process one batch of substrate 4 per module. Figures 14A to 26B The actions shown are sufficient. For example... Figure 27 As shown in the schematic top view, after the substrate 4 is processed by the chemical module 7A (1), the substrate 4 is then transported to the next chemical module 7B for further processing (2), and then to the next chemical module 7C for further processing (3). It should be noted that the order of actions (1) to (3) is not particularly limited and can be random. That is, it is not necessary to transport the substrate 4 in the order of chemical modules 7A, 7B, and 7C and perform processing through each module.

[0210] When substrate 4 is processed in multiple batches, such as Figure 28As shown in the schematic top view, substrate 4A can be processed by chemical module 7A (4), substrate 4B can be processed by another chemical module 7B (5), and substrate 4C can be further processed by another chemical module 7C (6). First transport mechanisms 70 are provided in modules 7A, 7B, and 7C respectively, so the transport / processing of substrates can be performed in parallel by each module 7A, 7B, and 7C. It should be noted that the order of actions (4) to (6) is not particularly limited and can be random. For example, substrate 4C can be transported to chemical module 7C, then substrate 4A can be transported to chemical module 7A, then substrate 4B can be transported to chemical module 7B, and substrates 4A, 4B, and 4C can be processed by each module 7A, 7B, and 7C respectively.

[0211] exist Figure 28 In the example shown, substrates 4A and 4C are positioned inside or directly above the cleaning tank 34, and substrate 4B is positioned inside or directly above the medicine tank 32. The first conveying mechanism 70 for conveying substrates 4A, 4B, and 4C is positioned in either the first region LV1 or the second region LV2. If the second conveying mechanism 72 moves laterally within a third region LV3, which is higher than the second region LV2, it can move freely in the second direction regardless of the position / state of substrates 4 and the first conveying mechanism 70 in modules 7A, 7B, and 7C. Figure 28 As shown, regardless of the state of chemical modules 7A and 7B, the second transport mechanism 72 can move through chemical modules 7A and 7B in the second direction and access chemical module 7C (7). The second transport mechanism 72, which moves to chemical module 7C, can accept the processed substrate 4C and transport it to the next chemical module 7 (8). After handing over the substrate 4C to the next chemical module 7, it can move to the module (e.g., chemical module 7A) in chemical modules 7A and 7B that has processed the substrates 4A and 4B (9), accept the processed substrate 4A, and transport it to the next chemical module 7. The substrate 4A (and the carrier 2) held by the second transport mechanism 72 is also arranged in the third region LV3. Therefore, even if the second transport mechanism 72 is in the state of holding the substrate 4A, it can move freely in the second direction regardless of the position / state of the other substrates 4 in other modules and the first transport mechanism 70.

[0212] Based on the above actions, multiple batches of substrates 4A, 4B, and 4C can be processed in parallel through each module, and the second conveying mechanism 72 can move laterally between modules during this processing. This enables actions that are impossible in conventional substrate processing apparatuses that arrange multiple slots in a row laterally, significantly improving processing efficiency.

[0213] As described above, the second conveying mechanism 72 is not limited to moving in the second direction within the third region LV3 (second function). It can also move in the second direction within the second region LV2 (first function) without interfering with the first conveying mechanism 70, etc. The control unit 101 selectively executes the first and second functions according to various conditions, thereby further improving throughput.

[0214] (Function / Effect)

[0215] As described above, the chemical module 7 (substrate processing module) of Embodiment 1 includes: a cleaning tank 34 (first tank) and a chemical solution tank 32 (second tank) arranged in a first direction, which can be used to arrange a substrate 4; a first conveying mechanism 70 for moving the substrate 4 in the first direction (Y-axis direction); and a second conveying mechanism 72 for moving the substrate 4 in a second direction (X-axis direction) intersecting the first direction. The cleaning tank 34 and the chemical solution tank 32 are disposed in a first region LV1. The first conveying mechanism 70 conveys the substrate 4 in the first direction in a second region LV2 disposed above the first region LV1. The second conveying mechanism 72 conveys the substrate 4 in the second direction in a third region LV3 different from the second region LV2.

[0216] With this configuration, when the second conveying mechanism 72 conveys the substrate 4 in the second direction, it can convey the substrate 4 without interfering with the first conveying mechanism 70, etc., thereby increasing the throughput.

[0217] Furthermore, in the chemical module 7 of Embodiment 1, the first region LV1, the second region LV2, and the third region LV3 are arranged in this order from bottom to top in the vertical direction. With this configuration, regions LV1, LV2, and LV3 can be divided in the vertical direction, and space in the vertical direction can be effectively utilized.

[0218] Furthermore, in the chemical module 7 of Embodiment 1, the first transport mechanism 70 includes a vertical actuator 14 (first vertical actuator) for moving the substrate 4 vertically between the first region LV1 and the second region LV2, and the second transport mechanism 72 includes a vertical actuator 78 (second vertical actuator) for moving the substrate 4 vertically between the second region LV2 and the third region LV3. With this configuration, both the first transport mechanism 70 and the second transport mechanism 72 access the second region LV2, enabling the transfer of the substrate 4 within the second region LV2.

[0219] Furthermore, the chemical module 7 in Embodiment 1 also includes a control unit 101, which controls the first transport mechanism 70 and the second transport mechanism 72 to perform the transfer of the substrate 4 within the second region LV2. With this configuration, by performing the transfer of the substrate 4 in the second region LV2, the first transport mechanism 70 does not need to raise the substrate 4 to the third region LV3, thus shortening the vertical length of the vertical actuator 14 of the first transport mechanism 70 and suppressing contamination.

[0220] Furthermore, in the chemical module 7 of Embodiment 1, the control unit 101 controls the second transport mechanism 72 to selectively perform a first function and a second function. The first function is to transport the substrate 4 in the second direction (Y direction) in the second region LV2, and the second function is to transport the substrate 4 in the second direction in the third region LV3. With this configuration, the throughput can be increased by selectively performing the first and second functions according to the situation.

[0221] Furthermore, in the chemical module 7 of Embodiment 1, the cleaning tank 34 is disposed at the front side in the first direction, the liquid tank 32 is disposed at the rear side in the first direction, and the second conveying mechanism 72 moves the substrate 4 above the cleaning tank 34. With this configuration, contamination between the liquid tanks 32 of different modules can be reduced. Furthermore, when the operator inspects the interior of the chemical module 7 from the front, the substrate 4 conveyed by the second conveying mechanism 72 is easily visually identified.

[0222] Furthermore, in the chemical module 7 of Embodiment 1, the other modules connected to the chemical module 7 in the second direction are any one of the following: the loading module 5, the unloading module 8, the drying module 6, and the chemical module 7. Based on this configuration, modules capable of connecting various functions can be used as other modules.

[0223] Furthermore, the substrate processing apparatus 1 of Embodiment 1 includes a chemical module 7 and other modules (infeed module 5, drying module 6, chemical module 7 or outfeed module 8) connected to the chemical module 7 in a second direction. With this configuration, the substrate processing apparatus 1 has a small footprint and can achieve high processing efficiency.

[0224] (Implementation Method 2)

[0225] Reference Figure 29 , Figure 30 The differences between the substrate processing apparatus 1 of Embodiment 1 and the substrate processing apparatus 200 of Embodiment 2 will be described here. Components identical or the same as those in Embodiment 1 will be referred to by the same names and reference numerals. Furthermore, descriptions that are repeated in Embodiment 1 will be omitted.

[0226] Figure 29This is a schematic diagram showing the state in which multiple chemical modules 7 in the substrate processing apparatus 1 of Embodiment 1 are respectively arranged with substrates 4. Figure 30 This is a schematic diagram showing the state in which multiple chemical modules 7 in the substrate processing apparatus 200 of Embodiment 2 are respectively arranged with substrates 4.

[0227] In Embodiment 1, both the first conveying mechanism 70 and the second conveying mechanism 72 have vertical movement functions and transfer the substrate 4 in the second region LV2, which is the middle layer. In contrast, in Embodiment 2, only the first conveying mechanism 270 has vertical movement functions, while the second conveying mechanism 272 does not have vertical movement functions and transfers the substrate 4 in the third region LV3, which is the uppermost layer.

[0228] exist Figure 29 , Figure 30 The example illustrates a "no-carrier" case where the conveying mechanisms 70, 72, 270, and 272 directly hold the substrate 4.

[0229] exist Figure 29 In the example shown, in the chemical module 7 on the left, the substrate 4, supported by the support platform 18, is positioned in the first region LV1 and processed in the cleaning tank 34 (not shown). In the chemical module 7 on the right, the up-down actuator 14 of the first transport mechanism 70 raises the substrate 4 to the second region LV2. The first transport mechanism 70 can transport the substrate 4 in the first direction (Y-axis direction) in the second region LV2 and move the substrate 4 between directly above the cleaning tank 34 and directly above the chemical solution tank 32. The second transport mechanism 72 (shown in solid lines) positioned in the third region LV3 descends to the second region LV2 (shown in dashed lines), thereby also allowing the transfer of the substrate 4 in the second region LV2.

[0230] The second conveying mechanism 72 in Embodiment 1 has the function of moving in the third region LV3 in the second direction (X-axis direction) (arrow X1) and the function of moving up and down between the third region LV3 and the second region LV2 (arrow Z1). The movement range of the substrate 4 achieved by the second conveying mechanism 72 includes the second region LV2 and the third region LV3, but not the first region LV1. The first conveying mechanism 70 has the function of moving up and down between the first region LV1 and the second region LV2 (arrow Z2) and the function of moving in the second region LV2 in the first direction (Y-axis direction). The movement range of the substrate 4 achieved by the first conveying mechanism 70 includes the first region LV1 and the second region LV2, but not the third region LV3. The length D1 of the up and down actuator 14 of the first conveying mechanism 70 in the up and down direction is restricted so that the support table 18, the arm 16, and the substrate 4 supported by the support table 18 cannot rise to the third region LV3. Therefore, the up and down actuator 14 is accommodated in the first region LV1.

[0231] The second conveying mechanism 72 in Embodiment 1 is not limited to moving in the third region LV3, but also has the function of moving in the second region LV2 in the second direction, which can improve throughput.

[0232] exist Figure 30 In the example shown, in the leftmost chemical module 7, the substrate 4 is positioned in the first region LV1 and processed in the cleaning tank 34. In the central chemical module 7, the up-and-down actuator 214 of the first transport mechanism 270 raises the substrate 4 to the second region LV2. The first transport mechanism 270 can transport the substrate 4 in a first direction in the second region LV2 and move the substrate 4 between directly above the cleaning tank 34 and directly above the solution tank 32. In Embodiment 2, the second transport mechanism 272 does not have the function of descending to the second region LV2; therefore, the transfer of the substrate 4 does not occur in the second region LV2. In the rightmost chemical module 7, the up-and-down actuator 214 of the first transport mechanism 270 further raises the substrate 4 to the third region LV3. The transfer of the substrate 4 occurs between the second transport mechanism 272 and the first transport mechanism 270 positioned in the third region LV3.

[0233] The second conveying mechanism 272 in Embodiment 2 has the function of moving in a second direction within the third region LV3 (arrow X1), but does not have the function of moving up and down. Figure 29 (Arrow Z1). The movement range of the substrate 4 achieved by the second transport mechanism 272 is limited to the third region LV3. In addition to the function of moving vertically between the first region LV1 and the second region LV2 (arrow Z2), the first transport mechanism 270 also has the function of moving vertically between the second region LV2 and the third region LV3 (arrow Z3). The movement range of the substrate 4 achieved by the first transport mechanism 270 includes the first region LV1, the second region LV2, and the third region LV3. The vertical actuator 214 of the first transport mechanism 270 sets the vertical length D2 to a value greater than... Figure 29 The length D1 shown is long and extends to the second region LV2 so that the substrate 4 can be moved up and down from the first region LV1 to the third region LV3.

[0234] exist Figure 29 In the illustrated embodiment 1, within the second region LV2, (1) the substrate 4 is transported in the first direction and (2) the substrate 4 is transferred; conversely, in Figure 30 In the embodiment 2 shown, the substrate 4 is transported in the first direction within the second region LV2 (1), and the substrate 4 is handed over within the third region LV3 (2).

[0235] In Embodiment 2, the second conveying mechanism 272 conveys the substrate 4 in a second direction in a third region LV3 that is offset upward relative to a second region LV2 that includes the movement range of the substrate 4 implemented by the first conveying mechanism 70. Therefore, the first conveying mechanism 70 and the second conveying mechanism 72 can convey the substrate 4 without interfering with each other. It should be noted that the second conveying mechanism 272 is not limited to being in a position offset upward relative to the region that includes the movement range of the substrate 4 implemented by the first conveying mechanism 70; it can also convey the substrate 4 in the second direction in regions offset in other directions.

[0236] In embodiment 2, the second conveying mechanism 272 moves only in the second direction within the third region LV3; therefore, it is also possible to... Figure 9 The opening 37a shown is only provided in the third region LV3, so that the sidewall 37 exists in the second region LV2. As a result, pollution can be further suppressed.

[0237] according to Figure 30 The substrate processing apparatus 200 of Embodiment 2 shown includes: a cleaning tank 34 (first tank) and a chemical solution tank 32 (second tank) arranged in a first direction (Y-axis direction) for placing a substrate 4; a first conveying mechanism 70 for moving the substrate 4 in the first direction; and a second conveying mechanism 272 for moving the substrate 4 in a second direction (X-axis direction) intersecting the first direction. The cleaning tank 34 and the chemical solution tank 32 are disposed in a first region LV1. The first conveying mechanism 70 conveys the substrate 4 in the first direction in a second region LV2 disposed above the first region LV1, and the second conveying mechanism 272 conveys the substrate 4 in the second direction in a third region LV3 different from the second region LV2. With this configuration, the first conveying mechanism 70 and the second conveying mechanism 72 can convey the substrate 4 without interfering with each other, thereby increasing throughput.

[0238] In the substrate processing apparatus 200 of Embodiment 2, the up-down actuator 214 (first up-down actuator) moves the substrate 4 up and down between the first region LV1 and the third region LV3, which is higher than the second region LV2. With this configuration, the up-down actuator for moving the second transport mechanism 272 up and down can be omitted, and the structure of the second transport mechanism 272 can be simplified.

[0239] In the substrate processing apparatus 200 of Embodiment 2, the control unit 101 controls the first transport mechanism 270 and the second transport mechanism 272 to perform the transfer of substrate 4 within the third region LV3. With this configuration, even if the second transport mechanism 272 does not have a vertical movement function, the first transport mechanism 270 can still rise to the third region LV3 to perform the transfer of substrate 4.

[0240] In the substrate processing apparatus 200 of Embodiment 2, the second conveying mechanism 272 does not have the function of moving the substrate 4 up and down. With this configuration, the structure of the second conveying mechanism 272 can be simplified.

[0241] On the other hand, according to Figure 29 The substrate processing apparatus 1 of Embodiment 1 shown can shorten the length D1 of the upper and lower actuators 14 of the first conveying mechanism 70, thus suppressing contamination caused by the upper and lower actuators 14. The shorter upper and lower actuators 14 also reduce the likelihood of breakage caused by deflection when supporting the carrier 2 and the plurality of substrates 4 in the first conveying mechanism 70, providing an advantage in terms of strength. Furthermore, since the first conveying mechanism 70 does not have the function of rising to the third region LV3, there is no constraint on the movement of the second conveying mechanism 72 in the second direction within the third region LV3, simplifying movement control.

[0242] (Implementation Method 3)

[0243] Reference Figure 31 , Figure 32 The differences between the substrate processing apparatus 1 of Embodiment 1 and the substrate processing apparatus 300 of Embodiment 3 will be described here. Components identical or the same as those in Embodiment 1 will be referred to by the same names and reference numerals. Furthermore, descriptions that are repeated in Embodiment 1 will be omitted.

[0244] Figure 31 This is a schematic top view showing the movement range of the first conveying mechanism 70 and the second conveying mechanism 72 in the substrate processing apparatus 1 of Embodiment 1. Figure 32 This is a schematic top view showing the movement range of the first conveying mechanism 370 and the second conveying mechanism 372 in the substrate processing apparatus 300 of Embodiment 3.

[0245] In Embodiment 1, the movement ranges of the substrate 4 achieved by the first conveying mechanism 70 and the second conveying mechanism 72 at least partially overlap when viewed from above. In contrast, in Embodiment 3, the movement ranges of the substrate 4 achieved by the first conveying mechanism 370 and the second conveying mechanism 372 do not overlap (misalign) when viewed from above.

[0246] exist Figure 31 In the example shown, the movement range A1 of the substrate 4 in the first direction (Y-axis direction) implemented by the first conveying mechanism 70 and the movement range A2 of the substrate 4 in the second direction (X-axis direction) implemented by the second conveying mechanism 72 overlap when viewed from above. In this configuration, as described above, the throughput can be improved by making the areas where the substrate 4 is moved by the first conveying mechanism 70 and the second conveying mechanism 72 different in the vertical direction without causing interference.

[0247] exist Figure 32 In the example shown, the movement range A3 of the substrate 4 in the first direction (Y-axis direction) implemented by the first conveying mechanism 370 and the movement range A4 of the substrate 4 in the second direction (X-axis direction) implemented by the second conveying mechanism 372 are offset in the first direction and do not overlap when viewed from above. That is, the areas in which the first conveying mechanism 370 and the second conveying mechanism 372 move the substrate 4 are different in the horizontal direction. With this configuration, similar to Embodiment 1, the substrate 4 can be conveyed independently while the conveying mechanisms 370 and 372 do not interfere with each other, thereby increasing throughput. The first conveying mechanism 370 conveys the substrate 4 in the first direction in the second region LV2, while the second conveying mechanism 372 can also convey the substrate 4 in a different region at the same height as the second region LV2 or in a region at a different height when conveying the substrate 4 in the second direction.

[0248] The displacement is not limited to the region including the area of ​​the substrate 4 moving range A3 realized by the first conveying mechanism 370 and the region including the area of ​​the substrate 4 moving range A4 realized by the second conveying mechanism 372 in the first direction or the horizontal direction, but may also be the case of displacement in other directions (e.g., the inclined direction).

[0249] As mentioned above, Figure 32 The substrate processing apparatus 300 of Embodiment 3 shown includes: a cleaning tank 34 (first tank) and a chemical solution tank 32 (second tank) arranged in a first direction (Y-axis direction) for placing a substrate 4; a first conveying mechanism 370 for moving the substrate 4 in the first direction; and a second conveying mechanism 372 for moving the substrate 4 in a second direction (X-axis direction) intersecting the first direction. The cleaning tank 34 and the chemical solution tank 32 are disposed in a first region LV1. The first conveying mechanism 370 conveys the substrate 4 in the first direction in a second region LV2 (including a movement range A3) disposed above the first region LV1. The second conveying mechanism 372 conveys the substrate 4 in the second direction in a region different from the second region LV2 (including a movement range A4).

[0250] With this configuration, the first conveying mechanism 370 and the second conveying mechanism 372 can convey the substrate 4 without interfering with each other, thereby increasing the throughput.

[0251] On the other hand, according to Figure 31The substrate processing apparatus 1 of Embodiment 1 shown is configured such that the movement range A1 of the first conveying mechanism 70 and the movement range A2 of the second conveying mechanism 72 at least partially overlap, thus reducing the space occupied by the substrate processing apparatus 1 including the chemical module 7. The second conveying mechanism 72 conveys the substrate 4 in the second direction in a third region LV3, which is higher than the second region LV2, thereby increasing the height of the housing 20 and positioning the opening 37a at the top, while also suppressing cross-contamination between modules.

[0252] (Implementation Method 4)

[0253] Reference Figure 33 , Figure 34 , Figures 35A to 35D The differences between the substrate processing apparatus 1 of Embodiment 1 and the substrate processing apparatus 400 of Embodiment 4 will be described here. Components identical or the same as those in Embodiment 1 will be referred to by the same names and reference numerals. Furthermore, descriptions that are repeated in Embodiment 1 will be omitted.

[0254] Figure 33 This is a schematic perspective view showing the first conveying mechanism 470 in the substrate processing apparatus 400 according to Embodiment 4. Figure 34 This is a schematic front view showing the handover state of the substrate 4 achieved by the two first transport sections 472 and 474. Figures 35A to 35D These are schematic top views showing the handover operation of the substrate 4 via the two first transport sections 472 and 474.

[0255] In Embodiment 1, the first conveying mechanism 70 has one first conveying section 11, whereas in Embodiment 4, the first conveying mechanism 470 has two first conveying sections 472 and 474.

[0256] like Figure 33 As shown, the first conveying mechanism 470 has a first conveying section 472 and a first conveying section 474.

[0257] Both the first transport units 472 and 474 can hold and move the substrate 4. As a part for holding the substrate 4, the first transport unit 472 has a chuck 476 and the first transport unit 474 has a chuck 478.

[0258] Chucks 476 and 478 each have multiple arms 476A and 478A that can support the base plate 4 from below, and are configured in a comb-like shape. Figure 33 , Figure 34 In the example shown, there are four arms 476A and four arms 478A.

[0259] like Figure 33As shown, a first conveying unit 472 includes a horizontal actuator 480, an up-down actuator 482, and a connecting arm 484.

[0260] The horizontal actuator 480 is an actuator that enables the chuck 476 to move in the Y-axis direction, which is the horizontal direction (arrow Y4). The vertical actuator 482 is an actuator that enables the chuck 476 to move in the Z-axis direction, which is the vertical direction (arrow Z4). The connecting arm 484 is an arm that connects the chuck 476 to the vertical actuator 482.

[0261] Another first conveying unit 474 has an up-and-down actuator 486 and a connecting arm 488. The first conveying unit 474 does not have a horizontal actuator.

[0262] The up-down actuator 486 is an actuator (arrow Z5) that enables the chuck 478 to move in the Z-axis direction, which is the up-down direction. The connecting arm 488 is the arm that connects the chuck 478 to the up-down actuator 486.

[0263] The first conveying unit 472, which has both vertical and horizontal conveying functions, has the function of immersing the plurality of substrates 4 held by the chuck 476 in the liquid tank 32 and the function of moving the plurality of substrates 4 between the position above the liquid tank 32 and the position above the cleaning tank 34.

[0264] The first conveying unit 474, which has the function of conveying up and down, has the function of immersing the multiple substrates 4 held by the chuck 478 in the cleaning tank 34.

[0265] like Figure 34 As shown, the four arms 476A of chuck 476 and the four arms 478A of chuck 478 are arranged in a staggered position in the X-axis direction. Therefore, when chucks 476 and 478 move up and down respectively, and when chuck 476 moves horizontally, arms 476A and 478A do not interfere with each other. Chucks 476 and 478 can operate independently when they are not holding the substrate 4, and can transfer the substrate 4 when either of them is holding the substrate 4.

[0266] When transferring substrate 4, simply lower the chuck holding substrate 4 or raise the chuck not holding substrate 4 while the chuck holding substrate 4 is positioned above and the chuck not holding substrate 4 is positioned below.

[0267] use Figures 35A to 35D The operation of the first conveying mechanism 470 having the above-described configuration will be explained.

[0268] exist Figure 35AIn the shown configuration, chucks 476 and 478 are both positioned overlapping with the cleaning tank 34 when viewed from above. With chuck 476 located in the second region LV2 and chuck 478 located below the second region LV2 (e.g., in the first region LV1), the upper chuck 476 receives multiple substrates 4 from the second transport mechanism 72 (not shown), thus becoming... Figure 35A The state shown. The first transport section 472 receiving the substrate 4 moves the chuck 476 and the substrate 4 horizontally in the Y-axis direction toward the position above the liquid tank 32 (arrow N1).

[0269] exist Figure 35B In the shown state, the chuck 476 of the first conveying unit 472 is positioned above the medicine tank 32. The first conveying unit 472 immerses the substrate 4 in the medicine tank 32 by lowering the chuck 476 and the substrate 4. When the processing in the medicine tank 32 is completed, the first conveying unit 472 raises the chuck 476 and the substrate 4 and moves them horizontally in the Y-axis direction toward a position above the cleaning tank 34 (arrow N2).

[0270] exist Figure 35C In the shown configuration, the chuck 476 of the first transport unit 472 is positioned above the cleaning tank 34. The chuck 476 is located in the second region LV2, while the chuck 478 of the first transport unit 474 is retracted to a position lower than the second region LV2, thus avoiding interference with the substrate 4. The first transport unit 472 lowers the chuck 476, or the first transport unit 474 raises the chuck 478, thereby transferring multiple substrates 4 from chuck 476 to chuck 478. After transferring the substrates 4, the chuck 476 moves in the Y-axis direction towards a position above the liquid tank 32 (arrow N3) and retracts from its position above the cleaning tank 34.

[0271] exist Figure 35D In the shown state, the chuck 478 of the first transport unit 474 holds multiple substrates 4, and the first transport unit 474 lowers the chuck 478 and the substrates 4, thereby immersing the substrates 4 in the cleaning water of the cleaning tank 34. When the processing in the cleaning tank 34 is completed, the first transport unit 474 raises the chuck 478 and the substrates 4. Then, the first transport unit 474 transfers the multiple substrates 4 to a second transport unit 48 (not shown), and the substrates 4 transferred to the second transport unit 48 are transported along the X-axis direction.

[0272] Thus, by combining the two first conveying units 472 and 474, the first conveying unit 472 can be used for processing in the liquid tank 32, and the first conveying units 472 and 474 can be used for transfer of substrate 4 to each other, and the first conveying unit 474 can be used for processing in the cleaning tank 34.

[0273] As described above, in the substrate processing apparatus 400 of Embodiment 4, two first transport units 472 and 474 are provided. One first transport unit 474 has a chuck 478 (first chuck) that can be raised and lowered and is disposed in the cleaning tank 34 (first tank) while holding the substrate 4. The other first transport unit 472 has a chuck 476 (second chuck) that can be raised and lowered and is disposed in the medicine tank 32 (second tank) while holding the substrate 4. The chuck 476 can move between the upper position of the cleaning tank 34 and the upper position of the medicine tank 32. The chuck 478 and the chuck 476 are configured to be able to exchange substrate 4 with each other.

[0274] With this configuration, the two first conveying units 472 and 474 are used in combination, thereby increasing the operating rate of each of the cleaning tank 34 and the liquid tank 32, and increasing the throughput of the substrate processing apparatus 400.

[0275] It should be noted that the description focuses on the case where the first conveying unit 472 has a horizontal conveying function, while the first conveying unit 474 does not. However, this is not a limitation; it is sufficient that at least one of the two first conveying units 472 and 474 has a horizontal conveying function. That is, it is sufficient that at least one of the chucks 476 and 478 can move between the position above the cleaning tank 34 and the position above the medicine tank 32.

[0276] The arms 476A and 478A of the chucks 476 and 478 are not limited to a comb shape; they can be any other shape as long as they can hold and connect multiple substrates 4.

[0277] (Implementation Method 5)

[0278] Reference Figures 36-4 6. The differences between the substrate processing apparatus 1 of Embodiment 1 and the substrate processing apparatus 500 of Embodiment 5 will be described. Here, the same names and reference numerals are used for components that are the same as those in Embodiment 1. In addition, descriptions that are repeated in Embodiment 1 are omitted.

[0279] Figure 36 , Figure 37 These are a schematic front view and a schematic side view showing the peripheral structure of the second transport section 502 (second transport mechanism) in the substrate processing apparatus 500 of Embodiment 5.

[0280] In Embodiment 1, the second transport section 48 holds the carrier 2 that holds the plurality of substrates 4. In contrast, Embodiment 5 differs in that the second transport section 502 directly holds the plurality of substrates 4, a so-called "carrier-free" method. Embodiment 5 also differs from Embodiment 1 in that it includes a position adjustment mechanism 510 for adjusting the holding position of the second transport section 502 on the substrates 4.

[0281] like Figure 36 As shown, in addition to the second actuator 41, chuck actuator 42, connecting arm 43 and holding block 45, the second transport unit 502 also includes a chuck unit 504, a connecting block 506 and a position adjustment mechanism 510.

[0282] The chuck section 504 is a pair of components used to directly hold multiple substrates 4, and is assembled to the connecting block 506. The connecting block 506 is a block used to connect the chuck section 504 to the connecting arm 43. The position adjustment mechanism 510 is a mechanism used to adjust the holding position of the chuck section 504 on the substrates 4.

[0283] Figure 38 , Figure 39 These are a schematic perspective view and a schematic top view of the chuck section 504 without a load-bearing component.

[0284] like Figure 38 , Figure 39 As shown, the chuck section 504 has a pair of chuck arms 507 and a holding section 508.

[0285] The chuck arm 507 is a pair of arms that extend in a manner that connects the connecting block 506 and the holding part 508. The holding part 508 is a part used to directly hold the substrate 4 and is provided with a plurality of holding grooves 510.

[0286] like Figure 39 As shown, a plurality of holding grooves 510 are provided in the holding section 508, and a substrate 4 can be held by a pair of left and right holding grooves 510 aligned in the Y direction. Figure 39 The example illustrates a state in which three substrates 4 are held by multiple holding grooves 510.

[0287] The second conveying unit 502, having the above-described configuration, directly connects to the substrate 4 with the first conveying mechanism. That is, the first conveying mechanism is also a type without a load-bearing component; the first conveying mechanism without a load-bearing component will be described below.

[0288] Figure 40 , Figure 41 These are schematic top views of the first conveying mechanism 511 in Embodiment 5.

[0289] like Figure 40As shown, the first conveying mechanism 511 includes a first conveying section 512 and a first conveying section 513.

[0290] Both the first conveying units 512 and 513 are components that can directly hold the substrate 4 and have the function of moving up and down. The first conveying unit 512 also has the function of moving in the Y direction between the medicine tank 32 and the cleaning tank 34. The first conveying unit 513 is different from the first conveying unit 512 and does not have the function of moving in the Y direction. It is disposed above the cleaning tank 34.

[0291] The first conveying unit 512 has a movable arm 514 and four arms 516, 517, 518, and 519.

[0292] The movable arm 514 is an arm driven by actuators in both the Y and Z directions. Arms 516, 517, 518, and 519 are arms that directly hold the substrate 4, and are held by the movable arm 514. Arms 516, 517, 518, and 519 extend in the Y direction and are provided with holding grooves 526, 527, 528, and 529. A substrate 4 can be held from below by a set of holding grooves 526, 527, 528, and 529 aligned in the Y direction. Figure 40 The example illustrates the state in which three substrates 4 are held by three sets of holding grooves 526, 527, 528, and 529.

[0293] The first conveying unit 513 has a movable arm 534 and four arms 536, 537, 538, and 539.

[0294] The movable arm 534 is an arm driven in the Z direction by an actuator. Arms 536, 537, 538, and 539 are arms that directly hold the substrate 4, and are held by the movable arm 534. Arms 536, 537, 538, and 539 extend in the Y direction and are provided with holding grooves 546, 547, 548, and 549. A substrate 4 can be held from below by a set of holding grooves 546, 547, 548, and 549 that are aligned in the Y direction.

[0295] like Figure 40 As shown, the eight arms 516, 517, 518, 519, 536, 537, 538, and 539 in the two first conveying units 512 and 513 are adjusted in a manner in which their positions in the X direction do not overlap. Based on this configuration, as... Figure 41 As shown, even when the two first conveying sections 512 and 513 are located above the washing tank 34, the eight arms 516, 517, 518, 519, 536, 537, 538, and 539 can move up and down independently without overlapping each other. Figure 42As shown, the first conveying unit 512 and the second conveying unit 513 can move independently along the Z direction to transfer the substrate 4.

[0296] Next, use Figures 43A-43C The schematic front view illustrates the method of transferring the substrate 4 between the two first transport sections 512 and 513.

[0297] exist Figure 43A In this configuration, the first transport section 512 holds the substrate 4. In this state, the first transport section 513, located below the first transport section 512, rises towards the first transport section 512. As described above, the four arms of the first transport section 512 and the four arms of the first transport section 513 are staggered in the X direction, thus preventing mutual interference. Figure 43B As shown, the first conveying section 513 contacts the substrate 4 held by the first conveying section 512 from below.

[0298] When the first conveying section 513 rises further, as Figure 43C As shown, the first transport section 512 releases its holding of the substrate 4, and the first transport section 513 holds the substrate 4 alone. In this way, the substrate 4 can be transferred from the first transport section 512 to the first transport section 513.

[0299] Conversely, in the case of transferring substrate 4 from first transport section 513 to first transport section 512, as long as the operation is performed with Figures 43A-43C The operation can be performed in the reverse order. That is, the first transport section 512, located below the first transport section 513, rises relative to the first transport section 513 that holds the substrate 4. As a result, the first transport section 513 releases the substrate 4 from its holding position, and the second transport section 512 holds the substrate 4 alone. In this way, the substrate 4 can be transferred from the first transport section 513 to the first transport section 512.

[0300] Next, use Figures 44A to 44C as well as Figures 45A to 45D The schematic front view describes the method of transferring the substrate 4 between the first transport section 512, 513 (first transport mechanism 511) and the second transport section 502 (second transport mechanism).

[0301] Figures 44A to 44C This describes a method for transferring substrate 4 from the second transport section 502 to the first transport section 512.

[0302] exist Figure 44A In the process, with the chuck portion 504 of the second transport portion 502 holding the substrate 4, the second transport portion 502 descends toward the first transport portion 512 located below.

[0303] like Figure 44BAs shown, the lower end of the substrate 4 held by the chuck portion 504 contacts the holding grooves of the four arms of the first transport portion 512. In this state, the second transport portion 502 descends slightly further, thereby releasing the chuck portion 504 from holding the substrate 4, and the first transport portion 512 holds the substrate 4 alone.

[0304] like Figure 44C As shown, thereafter, a pair of chuck sections 504 are driven in a manner that separates them from each other in the X direction.

[0305] In this way, substrate 4 can be transferred from the second transport section 502 to the first transport section 512. The same method can also be used to transfer substrate 4 from the second transport section 502 to the first transport section 513.

[0306] Figures 45A to 45D This describes a method for transferring substrate 4 from the first transport section 512 to the second transport section 502.

[0307] like Figure 45A As shown, while the first transport section 512 holds the substrate 4, the second transport section 502, located above the first transport section 512, descends toward the first transport section 512. The pair of arms 504 of the first transport section 512 are in an open state and do not interfere with the substrate 4.

[0308] like Figure 45B As shown, when the chuck section 504 descends to a height position that can hold the substrate 4, the pair of chuck sections 504 are driven in the closing direction.

[0309] like Figure 45C As shown, a pair of chuck portions 504 clamp the substrate 4 from both sides, causing the substrate 4 to engage with the substrate. Figure 38 , Figure 39 The holding groove 508 is shown. In this state, the second conveying section 502 rises, thereby releasing the first conveying section 512 from holding the substrate 4. Figure 45D As shown, the second transport section 502 holds the substrate 4 independently, allowing the substrate 4 to be transferred from the first transport section 512 to the second transport section 502. The same method can also be used to transfer the substrate 4 from the first transport section 513 to the second transport section 502.

[0310] exist Figures 44A to 44C as well as Figures 45A to 45D In the operation shown, to reliably transfer the substrate 4, the holding grooves of the first transport sections 512 and 513 need to be aligned in the Y direction with the holding groove of the second transport section 502. On the other hand, in the case of... Figure 1As shown, when multiple chemical modules 7 are connected in the X direction, the position of the first transport section 512, 513 of each module in the Y direction may be offset. If the offset is large, the position of the holding groove of the first transport section 512, 513 in the Y direction may not be aligned with the holding groove of the second transport section 502, and the handover of the substrate 4 may fail.

[0311] In the case of conveying the carrier 2 that holds multiple substrates 4 as in Embodiment 1, there is no need to align the holding grooves with each other, so such a problem is not easily generated. However, in the case of the carrierless type that directly holds the substrates 4 as shown in Embodiment 5, such a problem is significantly generated.

[0312] Therefore, in the substrate processing apparatus 500 of Embodiment 5, a position adjustment mechanism 510 is provided that can adjust the holding position of the second transport section 502 on the substrate 4 in the Y direction.

[0313] As a component used to adjust the holding position of the chuck section 504 on the base plate 4 in the Y direction. Figure 36 , Figure 37 The position adjustment mechanism 510 shown includes a slider 552, a slider plate 554, and a sliding drive unit 556.

[0314] The slider 552 is a component used to slide the sliding plate 554 in the Y direction, and is fixed to the upper surface of the retaining block 45 in a state of extension in the Y direction. Figure 36 In the example shown, a pair of sliders 552 are arranged at intervals in the X direction.

[0315] The sliding plate 554 is a component that slides along the sliding member 552 in the Y direction and is driven by the sliding drive unit 556. A chuck actuator 42 is fixed on the upper surface of the sliding plate 554.

[0316] The sliding drive unit 556 is a component used to slide the sliding plate 554. For example, it is composed of a mechanism (motor, belt, etc.) that converts the rotational force generated by the motor into a linear driving force in the Y direction. As the sliding drive unit 556, any configuration can be used as long as the sliding plate 554 can be slidably driven in both the +Y and -Y directions.

[0317] According to the above configuration, the constituent elements including the chuck section 504 and the position adjustment mechanism 510 can move up and down as a whole (arrow Z1), and the chuck section 504 can be opened and closed (arrow X2), while the position of the chuck section 504 in the Y direction can be adjusted by the drive of the sliding plate 554 (arrow Y1).

[0318] Figure 46A , Figure 46B These are schematic side views showing the state in which the chuck section 504 slides in the Y direction.

[0319] exist Figure 46A In the middle, it indicates the state where the sliding plate 554 moves in the +Y direction, causing the chuck section 504 to move in the +Y direction. Figure 46B The text indicates that the sliding plate 554 is moved in the -Y direction, causing the chuck section 504 to move in the -Y direction. This allows adjustment of the holding position of the chuck section 504 on the substrate 4 in the Y direction.

[0320] When using the position adjustment mechanism 510, in the case of... Figure 1 When multiple chemical modules 7 are connected as shown, the position of the first conveying section 512, 513 in the Y direction of each module is calculated, and the position adjustment amount of the position adjustment mechanism 510 on the second conveying section 502 is predetermined to align with the calculated position. For example, a first adjustment amount can be determined for a certain chemical module 7, and a second adjustment amount different from the first adjustment amount can be determined for other chemical modules 7.

[0321] When the control unit 101 transfers the substrate 4 between the second transport unit 502 and the first transport units 512 and 513 in the chemical module 7, it adjusts the position of the second transport unit 502 in the Y direction based on the position adjustment amount corresponding to the chemical module 7 to transfer the substrate 4.

[0322] Therefore, the substrate 4 can be transferred while the holding grooves of the second conveying unit 502 and the first conveying units 512 and 513 are aligned in the Y direction. This allows for high-precision transfer of the substrate 4, reducing production stoppages and waste due to damaged substrates caused by transfer failures. Furthermore, when connecting the chemical modules 7, there is no need to improve dimensional accuracy related to Y-direction position adjustment, allowing for earlier connection of the chemical modules 7. This shortens the assembly / setting time of the substrate processing apparatus 1. Moreover, even if there are individual differences in the shape and size of each chemical module 7, these differences can be absorbed.

[0323] As described above, in the substrate processing apparatus 500 of Embodiment 5, the second transport unit 502 (second transport mechanism) includes a position adjustment mechanism 510 for adjusting the position of the substrate 4 being held. With this configuration, the transfer of the substrate 4 between the first transport units 512, 513 and the second transport unit 502 can be performed with high precision, thereby improving throughput.

[0324] It should be noted that in Embodiment 5, the second conveying unit 502 is described as having a position adjustment mechanism 510, but this is not a limitation. For example, the first conveying units 512 and 513 (first conveying mechanism 511) may also have a position adjustment mechanism. That is, it is sufficient if either the first conveying mechanism 511 or the second conveying mechanism has a position adjustment mechanism.

[0325] Figure 40 The first conveying unit 512 shown already has a Y-direction movement function. Therefore, by pre-determining the Y-direction position adjustment amount of the first conveying unit 512 for each module, the first conveying unit 512 can have a position adjustment function. On the other hand, the first conveying unit 513 does not have a Y-direction movement function. Therefore, by adding a separate Y-direction movement mechanism and pre-determining the Y-direction position adjustment amount of the first conveying unit 513 for each module, the first conveying unit 513 can have a position adjustment function. For example, when adding a Y-direction movement mechanism to the first conveying unit 513, such as... Figure 40 As shown, the moving mechanism is positioned not at a position offset in the Y direction relative to the cleaning tank 34, but at a position offset in the X direction, thereby ensuring the moving distance / moving space in the Y direction.

[0326] Furthermore, in the substrate processing apparatus 500 of Embodiment 5, the position adjustment mechanism 510 has the function of adjusting the transport position of the substrate 4 in the Y direction (first direction). With this configuration, even when multiple chemical modules 7 are connected in the X direction without causing a positional offset in the Y direction, the transfer of the substrate 4 between the first transport section 512, 513 and the second transport section 502 can be performed with high precision.

[0327] It should be noted that in Embodiment 5, the position adjustment mechanism 510 was described in the Y direction, but it is not limited to this case. Position adjustment can also be performed in a direction different from the Y direction. It should also be noted that in the case of position adjustment in multiple directions, multiple sliding plates can be provided as needed. Furthermore, it is not limited to linear position adjustment; it can also have the function of rotation and adjustment in the horizontal plane.

[0328] Figure 47 This is a schematic side view showing the peripheral structure of the second conveying section 502 in a modified example of Embodiment 5. In Embodiment 5, the second actuator 41 is positioned above the holding block 45, but... Figure 47 In the modified example shown, a second actuator 564 is provided on the back side of the upper and lower tracks 74.

[0329] Figure 47The second conveying unit 502 shown includes a connecting plate 560, a pair of tracks 562, and a second actuator 564.

[0330] A connecting plate 560 is connected to the back side of the upper and lower rails 74 and supports the upper and lower rails 74. A pair of rails 562 are rails extending in the X-axis direction and are spaced apart in the Z-axis direction to support the connecting plate 560 in a manner that allows it to travel in the X-axis direction. A second actuator 564 drives the connecting plate 560 in the X-axis direction along the rails 562.

[0331] according to Figure 47 The configuration shown allows the X-axis moving mechanism (connecting plate 560, track 562, and second actuator 564) to be positioned at the same height in the Z-axis direction as the Z-axis moving mechanism (upper and lower tracks 74, chuck actuator 42, position adjustment mechanism 510, etc.). Therefore, compared to the substrate processing apparatus 500 of Embodiment 5, the height of the substrate processing apparatus 500 can be reduced, further miniaturizing the substrate processing apparatus 500.

[0332] It should be noted that this is not limited to Figure 47 With the configuration shown, the same effect can be achieved as long as the moving mechanism that moves the chuck 504 in the Z-axis direction and the moving mechanism that moves the chuck 504 in the X-axis direction are in the same position.

[0333] It should be noted that in embodiments 1 to 5, the case where the cleaning tank 34 and the medicine tank 32 are provided as two tanks (first tank and second tank) has been described, but the situation is not limited to this. For example, as Figure 48 As shown in the schematic top view, different combinations of tanks can also be used in each of the chemical modules 7A, 7B, and 7C. Figure 48 In the example shown, the first tank 34A of chemical module 7A is a cleaning tank, and the second tank 32A is a chemical solution tank. However, the first tank 34B and the second tank 32B of chemical module 7B are both chemical solution tanks, while the first tank 34C and the second tank 32C of chemical module 7C are both single-tank treatment tanks. A single-tank treatment tank refers to a tank that combines the functions of chemical solution treatment and cleaning treatment, having the function of supplying / draining chemical solution and supplying / draining cleaning liquid.

[0334] The chemical solutions used in the first tank 34B and the second tank 32B of chemical module 7B can be the same or different types, and the chemical solutions used in the first tank 34C and the second tank 32C of chemical module 7C can also be the same or different types.

[0335] like Figure 48As shown in the layout, the combination of the first and second tanks is not limited to cleaning tank 34 and chemical solution tank 32; various combinations can be used. Any combination is acceptable as long as the first and second tanks are any of the following: chemical solution tank, cleaning tank, or single-tank treatment tank.

[0336] As described above, in the chemical module 7 of the embodiment, the first tank and the second tank are each one of the following: a chemical solution tank for treating the substrate 4 with a chemical solution, a cleaning tank for cleaning the substrate 4, or a single-tank processing tank that combines the functions of chemical solution treatment and cleaning of the substrate 4. With this configuration, the first tank and the second tank can be combined in various ways.

[0337] The respective effects can be achieved by appropriately combining the described embodiments and any of the various modifications.

[0338] Explanation of reference numerals in the attached figures

[0339] 1: Substrate processing apparatus;

[0340] 2: Load-bearing components;

[0341] 4: Substrate;

[0342] 7: Chemistry module;

[0343] 32: Medicine solution tank;

[0344] 34: Cleaning tank;

[0345] 70: First conveying mechanism;

[0346] 72: Second conveying mechanism;

[0347] LV1: First area;

[0348] LV2: Second area;

[0349] LV3: Third area.

Claims

1. A substrate processing module, comprising: The first and second slots are arranged in a first direction and can be used to assemble a substrate. A first conveying mechanism moves the substrate in the first direction; and The second conveying mechanism moves the substrate in a second direction that intersects the first direction. The first slot and the second slot are configured in the first region. The first conveying mechanism conveys the substrate in the first direction in a second region positioned above the first region. The second conveying mechanism conveys the substrate in the second direction in a third region, which is different from the second region.

2. The substrate processing module according to claim 1, wherein, The first region, the second region, and the third region are arranged in this order from bottom to top in the vertical direction.

3. The substrate processing module according to claim 2, wherein, The first conveying mechanism includes a first up-and-down actuator that moves the substrate up and down between the first region and the second region. The second conveying mechanism includes a second up-and-down actuator that moves the substrate up and down between the second region and the third region.

4. The substrate processing module according to claim 3, wherein, The first up-down actuator is configured at a position offset in the second direction relative to the first slot and the second slot, and at a height position lower than the second region.

5. The substrate processing module according to claim 1, further comprising: A control unit controls the first conveying mechanism and the second conveying mechanism to perform the transfer of the substrate in the second region.

6. The substrate processing module according to claim 5, wherein, The control unit controls the second conveying mechanism in a manner that selectively executes a first function and a second function, the first function being the function of conveying the substrate in the second direction in the second region, and the second function being the function of conveying the substrate in the second direction in the third region.

7. The substrate processing module according to claim 2, wherein, The range of movement of the substrate in the first direction achieved by the first conveying mechanism and the range of movement of the substrate in the second direction achieved by the second conveying mechanism at least partially overlap when viewed from above.

8. The substrate processing module according to claim 1, wherein, The first conveying mechanism has two first conveying sections. The first conveying unit includes a first chuck that is movable and disposed within the first slot while holding the substrate. Another of the first conveying units includes a second chuck that can be lifted and is disposed in the second slot while holding the substrate. At least one of the first chuck and the second chuck is movable between a position above the first slot and a position above the second slot. The first chuck and the second chuck are configured to be able to connect substrates to each other.

9. The substrate processing module according to claim 1, wherein, The first groove is disposed on the front side in the first direction, the second groove is disposed on the rear side in the first direction, and the second conveying mechanism moves the substrate above the first groove.

10. The substrate processing module according to claim 1, wherein, The first tank and the second tank are each one of the following: a chemical tank for treating the substrate with a chemical solution, a cleaning tank for cleaning the substrate, and a single-tank treatment tank that combines the functions of chemical treatment and cleaning of the substrate.

11. The substrate processing module according to claim 10, wherein, The first tank is a cleaning tank located on the front side of the first direction, and the second tank is a medicine tank located on the rear side of the first direction.

12. The substrate processing module according to claim 1, wherein, The substrate processing module can be connected to other modules in the second direction. The other modules are any one of the following: loading module, unloading module, drying module, and substrate processing module.

13. The substrate processing module according to claim 1, wherein, The first conveying mechanism or the second conveying mechanism includes a position adjustment mechanism for adjusting the position of holding the substrate.

14. The substrate processing module according to claim 13, wherein, The position adjustment mechanism has the function of adjusting the transport position of the substrate in the first direction.

15. A substrate processing apparatus comprising: The substrate processing module as described in any one of claims 1 to 14; and Other modules are connected to the substrate processing module in the second direction.

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