Cooler through which fluid can flow for cooling at least two electrical and / or electronic components
By designing a cooler structure that includes cooling channels, distribution channels, and collection channels, the problems of large space and low cooling efficiency in existing cooler structures are solved, achieving efficient and compact cooling of electrical and electronic components, enhancing the rigidity of the cooler, and reducing pressure loss.
Patent Information
- Application Number
- CN202480018845.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-03-16
- Filing Date
- 2024-03-05
- Publication Date
- 2025-10-31
AI Technical Summary
Existing coolers used in hybrid or electric vehicles to cool electrical and electronic components suffer from large structural space requirements and low cooling efficiency.
A fluid-passing cooler was designed, which adopts a structure consisting of a first plate, a second plate and a third plate, and includes a cooling channel, a distribution channel and a collection channel. The cooling efficiency is optimized by parallel fluid flow, and the heat dissipation is enhanced by the turbulent structure. The design of the distribution and collection channels achieves uniform fluid distribution and low pressure loss.
It achieves efficient cooling of electrical and electronic components within a smaller structural space, improves the stiffness of the cooler, and reduces pressure loss through turbulent structure and fluid distribution optimization, thereby improving the cooling effect.
Smart Images

Figure CN120883364A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a fluid-flowable cooler for cooling at least two electrical and / or electronic components, and an electrical and / or electronic device having such a cooler and at least two electrical and / or electronic components. Background Technology
[0002] Power modules are used in hybrid or electric vehicles, for example, mounted in an inverter or converter structure. An inverter, for instance, is used to operate a motor, providing phase current to the motor. The power module can include, for example, a carrier substrate with conductive lines, on which power semiconductors are arranged, forming an electronic device unit together with the carrier substrate. During operation, heat is generated by the electronic device unit, which must be dissipated. For this purpose, the electronic device unit is thermally connected to a cooler. It is known that the cooler has cooling channels through which coolant can flow, dissipating heat from the cooler. Turbulent structures, such as turbulent inlets, can be provided in the cooling channels of the cooler, ensuring better heat dissipation from the cooler to the coolant flowing through it. The turbulent structure generates turbulent flow and increases the cooling surface area. Summary of the Invention
[0003] The fluid-permeable cooler according to the invention for cooling at least two electrical and / or electronic components has the advantage of small structural space requirements while maintaining relatively good thermal efficiency. This is achieved in particular by guiding the flow of fluid, used as a coolant, through the cooler. The fluid-permeable cooler for cooling at least two electrical and / or electronic components includes a first plate, a second plate, a third plate, at least two cooling channels, and a distribution channel. The second plate is arranged between the first and third plates. The at least two cooling channels are constructed between the first and second plates and are capable of parallel flow of fluid / received fluid. The distribution channel is constructed between the second and third plates. The distribution channel is fluidly connected to the inlet of the cooler for introducing fluid into the cooler and fluidly connected to the cooling channels for distributing the fluid that can be introduced through the inlet onto the cooling channels. Constructing the distribution channel between the second and third plates provides the advantage of uniform fluid distribution onto the cooling channels because the fluid flows into the cooling channels from below. This also has the advantage of enabling compact manufacture of the cooler. The parallel flow of the cooling channels optimizes the cooling of the electrical and / or electronic components and enables lower pressure loss. Furthermore, the introduction of a second plate between the first and third plates provides an additional structural plane, thereby structurally improving the overall rigidity of the cooler. The second plate advantageously serves as a partition wall between the distribution channels and the cooling channels. It should be noted that the arrangement of the second plate between the first and third plates advantageously includes arrangements between at least a portion of the first plate and at least a portion of the second plate, as well as arrangements between the entire first plate and the entire second plate. In other words, within the framework of the invention, it is advantageously sufficient for the arrangement of the second plate between the first and third plates that at least a portion of the second plate is arranged between at least a portion of the first plate and at least a portion of the second plate. Within the framework of the invention, the second and third plates can be particularly understood as a plate arrangement structure. In this way of thinking, the second plate preferably corresponds to the area of the plate arrangement structure that is arranged between the first plate and other areas of the plate arrangement structure.
[0004] The dependent claims indicate preferred improvements of the invention.
[0005] Preferably, the second plate has at least two openings through which the distribution channels are fluidically connected to the cooling channels. In other words, the second plate is preferably constructed with at least two openings, wherein the distribution channel is fluidly connected to one cooling channel through one opening and to another cooling channel through the other opening. That is, preferably each cooling channel is provided with at least one opening. The number of openings through which the distribution channels are fluidly connected to the cooling channels is preferably greater than or equal to the number of cooling channels. Particularly preferably, the number of openings corresponds to the number of cooling channels.
[0006] Within the framework of this invention, two regions or elements of a cooler that are fluidly connected to each other can also be referred to as being interconnected / fluidly connected / fluidly linked. Similarly, the connection between two regions or elements of a cooler can also be understood as fluid communication / fluid connection / fluid-like connection between these regions or elements.
[0007] Preferably, the flow direction of the fluid through the distribution channel is at an angle (not equal to zero) to the flow direction of the fluid through the cooling channel, and is particularly perpendicular.
[0008] According to an advantageous design of the invention, the cross-section of the distribution channel decreases in the direction from the first end to the second end of the distribution channel. In other words, the distribution channel tapers advantageously in the direction from the first end to the second end. Preferably, the cross-section of the distribution channel decreases in the flow direction of the fluid through the distribution channel. Here, the first end advantageously corresponds to the end on the inlet side of the distribution channel, i.e., the end of the distribution channel facing the inlet of the cooler. In particular, the width of the distribution channel decreases in the direction from the first end to the second end, preferably in the flow direction of the fluid through the distribution channel. This allows for a compact construction of the distribution channel because the cross-section of the distribution channel is adapted to the flow of fluid through it. That is, the cross-section of the distribution channel at its first end is larger than the cross-section of the distribution channel at its second end, where the volumetric flow rate of the fluid is greatest, and at the second end, where the volumetric flow rate of the fluid is minimum due to the distribution of fluid to the cooling channel along the flow direction of the fluid through the distribution channel.
[0009] According to an alternative advantageous design of the invention, the cross-section of the dispensing channel is constant in the direction from the first end of the dispensing channel to the second end of the dispensing channel, or in the longitudinal direction of the dispensing channel. In other words, the dispensing channel advantageously has a constant cross-section over its entire length. In particular, the dispensing channel has a constant width over its entire length. This design of the invention has the advantage of facilitating the construction of the dispensing channel.
[0010] Preferably, a cooling structure is arranged in at least one of the at least two cooling channels. The cooling structure is preferably connected to, and in particular, material-locked to, the first and / or second plates. Specifically, the cooling structure can be connected to the first and / or second plates by means of a brazing layer, particularly a hard brazing layer. Particularly preferably, a cooling structure is arranged in each cooling channel. Within the framework of the invention, the cooling structure is preferably understood as a structure with increased surface area, flow guidance, and enhanced heat conduction.
[0011] The corresponding cooling structure is preferably constructed as a turbulent flow generator (also known as a turbulent flow structure). That is, the corresponding cooling structure is constructed to generate turbulent flow in the fluid that can flow through the corresponding cooling channels. Therefore, the cooling structure ensures that heat is better transferred from the cooler to the fluid that can flow through the cooler. The corresponding cooling structure is particularly constructed as a turbulent flow insert.
[0012] The corresponding cooling structure can preferably include a cooling rib structure and / or a pin structure (cooling pin structure). It is also conceivable that the cooling structure alternatively or additionally has one or more cooling structural elements, which have a different shape than the cooling rib or pin. Particularly feasible is that the cooling structure has multiple cooling structural elements of different shapes. Thus, for example, it is feasible for the cooling structure to have one cooling rib and one pin, or multiple cooling ribs and multiple pins. Within the framework of this invention, cooling ribs and pins can particularly be referred to as cooling structural elements, respectively.
[0013] The cooling rib structure preferably includes one or more cooling ribs, which are preferably arranged sequentially in the direction of fluid flow in the corresponding cooling channels. The flow direction corresponds in particular to the main flow direction of the fluid used as a coolant, which flows through the through opening formed by one or more cooling ribs. Here, the main flow direction is especially the direction in which the fluid mainly flows, i.e., the direction in which the velocity component of the fluid is greater than the velocity component of the fluid in the direction perpendicular to the main flow direction.
[0014] Preferably, the cooling ribs are formed by a wavy profile that repeats periodically along the repeating direction. The pin structure can preferably include only one or more pins, which are preferably arranged along the flow direction of the fluid in the respective cooling channel and / or in a direction perpendicular to the flow direction of the fluid in the respective cooling channel.
[0015] The corresponding cooling structure can preferably be at least partially, and especially entirely, constructed and / or coated with a material having a thermal conductivity greater than 200 W / (m·K). Advantageously, the cooling structure can be at least partially, and especially entirely, constructed or coated with aluminum. In particular, these designs relate to the cooling structure elements of the cooling structure. Alternatively, embodiments using copper are feasible, for example.
[0016] Preferably, the fluid-permeable cooler further includes a collection channel that is fluidically connected to the cooling channel for collecting fluid that may be discharged from the cooling channel. Preferably, the collection channel is constructed between the second and third plates. This allows for a more uniform distribution of fluid that can be introduced through the inlet onto the cooling channel, as the design of the collection channel influences the flow of fluid through the distribution channel. Furthermore, this design of the collection channel offers the advantage of enabling a more compact structure for the cooler. The second plate advantageously serves as a partition wall between the collection channel and the cooling channel.
[0017] The collection channel is advantageously connected to the outlet fluid of the cooler. The fluid used as a coolant can be discharged through the outlet.
[0018] Preferably, the second plate has at least two additional openings through which the collection channel is fluidly connected to the cooling channel. In other words, it is preferable that the second plate has at least two additional openings, wherein the collection channel is fluidly connected to one of the cooling channels through one of the additional openings and to other cooling channels through the other additional openings. That is, it is preferable that each cooling channel is provided with at least one additional opening. The number of additional openings through which the collection channel is fluidly connected to the cooling channel is preferably greater than or equal to the number of cooling channels. Particularly preferably, the number of additional openings corresponds to the number of cooling channels.
[0019] Preferably, the flow direction of the fluid through the collection channel is at an angle (not equal to zero) to the flow direction of the fluid through the cooling channel, especially perpendicular to it.
[0020] According to an advantageous design of the invention, the cross-section of the collecting channel increases in the direction from the first end to the second end of the collecting channel. In other words, the collecting channel is advantageously widened in the direction from the first end to the second end. Preferably, the cross-section of the collecting channel increases in the flow direction of the fluid through the collecting channel. Here, the second end advantageously corresponds to the end on the outlet side of the collecting channel, i.e., the end of the collecting channel facing the outlet of the cooler. In particular, the width of the collecting channel increases in the direction from the first end to the second end, preferably in the flow direction of the fluid through the collecting channel. This allows for a compact construction of the collecting channel because the cross-section of the collecting channel is adapted to the flow of fluid through the collecting channel. Therefore, the cross-section of the collecting channel at its first end is preferably smaller than the cross-section of the collecting channel at its second end, where the volumetric flow rate of the fluid is minimized, and where the volumetric flow rate of the fluid from the cooling channel is collected.
[0021] According to an alternative advantageous design of the invention, the cross-section of the collection channel is constant in the direction from the first end of the collection channel to the second end of the collection channel, or in the longitudinal direction of the collection channel. In other words, the collection channel advantageously has a constant cross-section over its entire length. In particular, the collection channel has a constant width over its entire length. This design of the invention has the advantage of facilitating the construction of the collection channel.
[0022] According to an advantageous embodiment of the invention, the first plate and the third plate are connected to each other in such a way that an internal space is formed. That is, the internal space is formed between the first plate and the third plate. A second plate is arranged in the internal space. The second plate is preferably connected to the third plate, especially in a material-locking manner. In particular, the second plate and the third plate are connected by means of a brazing layer, especially a hard brazing layer.
[0023] Preferably, the third plate has a recess that is covered by the first plate. Here, the recess forms at least a portion of the interior space, and in particular, forms the (entire) interior space. Advantageously, the first plate is constructed flat. Here, the first plate can be called a cover plate and the third plate can be called a base plate.
[0024] The recesses are preferably constructed in a stepped manner, forming a first recess region and a second recess region along the thickness direction of the cooler. Preferably, a cooling channel is constructed in the first recess region, while a distribution channel is constructed in the second recess region. Furthermore, a collection channel is preferably constructed in the second recess region. At least one step is advantageously constructed at the transition between the first and second recess regions, and a second plate is partially disposed at / on this step.
[0025] The second plate is preferably constructed as a flat plate.
[0026] According to an alternative advantageous embodiment of the invention, the first plate is connected to the second plate, wherein the second plate has a recess. A cooling channel is formed in the recess of the second plate. The third plate has a recess in which a distribution channel is constructed.
[0027] Advantageously, the third plate is arranged on the second plate. Preferably, the third plate is connected only to the second plate.
[0028] Preferably, the third plate has an additional recess in which a collection channel is constructed.
[0029] The first and / or second and / or third plates can preferably be constructed as one or more sheet materials. When the plate has recesses, it can preferably be formed by deep drawing. The first and / or second and / or third plates are advantageously made of metal and / or coated.
[0030] The entire cooler, namely the first plate, the second plate, the third plate and the cooling structure, can preferably be made and / or coated from the same material, preferably aluminum or, for example, copper or stainless steel.
[0031] Within the framework of this invention, the fluid that can flow through the cooler can also be referred to as a cooling fluid. For example, water can be used as a coolant.
[0032] The inlet can preferably be configured as an inlet pipe fitting. The inlet pipe fitting can be, for example, a separate component, made of aluminum, and constructed, for example, in a columnar shape. The inlet pipe fitting can be advantageously fastened to the third plate, particularly by means of brazing, especially hard brazing. Similarly, the outlet can preferably be configured as an outlet pipe fitting. The outlet pipe fitting can be, for example, a separate component, made of aluminum, and constructed, for example, in a columnar shape. The outlet pipe fitting can be advantageously fastened to the third plate, particularly by means of brazing, especially hard brazing. The inlet pipe fitting and / or the outlet pipe fitting can preferably be joined in the same processing steps as other components of the cooler that are connected to each other by brazing, especially hard brazing.
[0033] The inlet and / or outlet can preferably be located directly below the first plate, especially directly below one of the cooling channels in the cooling channel.
[0034] Furthermore, the present invention relates to an electrical and / or electronic device having a fluid-permeable cooler as described above and at least two electrical and / or electronic components arranged at the fluid-permeable cooler.
[0035] Electrical and / or electronic equipment can be, in particular, power electronic devices, which include at least two power electronic device-structural units. Within the framework of this invention, the power electronic device-structural unit can also be referred to as a power module. The corresponding power electronic device-structural unit preferably includes a carrier plate and / or conductor lines and / or one or more power semiconductors.
[0036] Power electronic devices—structural units—are preferably bonded to fluid-permeable coolers, particularly on a first plate, by means of a bonding layer. This layer can be produced by a soldering or sintering process and is therefore referred to accordingly as a soldered layer or a sintered layer.
[0037] Each power electronic device-structure unit is preferably arranged in a receiving area, particularly a support surface, of the cooler corresponding to that power electronic device-structure unit. That is, the number of receiving areas preferably corresponds to the number of power electronic device-structure units. Attached Figure Description
[0038] Embodiments of the present invention will now be described in detail with reference to the accompanying drawings, wherein identical components or components with the same function are respectively given the same reference numerals. In the drawings: Figure 1 A simplified schematic side view of an electrical and / or electronic device according to the invention, having a fluid-permeable cooler according to a first embodiment of the invention, is shown. Figure 2 A simplified schematic cross-sectional view of an electrical and / or electronic device according to a first embodiment is shown. Figure 3 A simplified schematic top view of the area of the cooler according to the first embodiment is shown. Figure 4 A simplified schematic top view of the area of the cooler according to the first embodiment is shown. Figure 5 A simplified schematic top view of the area of the cooler according to the second embodiment is shown. Figure 6 A simplified schematic top view of the area of the cooler according to the third embodiment is shown. Figure 7 A simplified schematic top view of the area of the cooler according to the fourth embodiment is shown, and Figure 8 A simplified schematic cross-sectional view of an electrical and / or electronic device according to a fifth embodiment is shown. Detailed Implementation
[0039] The following is for reference. Figures 1 to 4 To describe an electrical and / or electronic device 1000 according to the present invention, the electrical and / or electronic device having a plurality of electrical and / or electronic components 200 and a fluid-permeable cooler 100 according to a first embodiment of the present invention for cooling the electrical and / or electronic components 200. The electrical and / or electronic device 1000 and, in particular, the cooler 100 extend along a longitudinal direction 501, a width direction 502, and a thickness direction 503.
[0040] In this embodiment, the electrical and / or electronic device 1000 includes three electrical and / or electronic components 200. However, the number of electrical and / or electronic components 200 can vary. The electrical and / or electronic components 200 are arranged sequentially along the longitudinal direction 501.
[0041] During operation, heat is generated by the electrical and / or electronic components 200, which must be dissipated to ensure efficient operation of the electrical and / or electronic components 200. For this purpose, the electrical and / or electronic components 200 are arranged at / on a fluid-permeable cooler 100, particularly at / on the first plate 101 of the cooler 100, such that the generated heat can be dissipated through the cooler 100. Specifically, each of the electrical and / or electronic components 200 is arranged in a receiving area 115 of the first plate 101, particularly on a support surface. Each receiving area 115 corresponds to a region on the outer surface of the first plate 101, which is configured to receive the component 200 before it is installed at the cooler 100 and actually receives the component 200 after installation. In the engaged state of the electrical and / or electronic components 200, the corresponding receiving area 115 contacts the corresponding component 200.
[0042] Specifically, a separate connection layer 201 is arranged between each receiving area in the cooler 100, particularly the receiving area 115, and each electrical and / or electronic component 200, for securing and thermally bonding the respective electrical and / or electronic component 200 to the cooler 100. Alternatively, all electrical and / or electronic components 200 may be mounted at the cooler 100 by means of a continuous connection layer. An intermediate layer can advantageously exist between each layer 201 and the cooler 100, which is firmly connected to the cooler 100 and allows for wetting of the connection layer 201. Specifically, the intermediate layer can be made of copper or nickel. The intermediate layer is an optional feature of the electrical and / or electronic equipment 1000 and can be considered, in particular, as a separate component or as part of the cooler 100.
[0043] The electrical and / or electronic equipment 1000 can be, in particular, a power electronic device-arrangement structure having electrical and / or electronic components 200 configured as power modules. This can be, for example, a power circuit for a hybrid or electric vehicle, such as an inverter structure or a converter structure. Each power module in the power module can, for example, have a carrier plate, conductor lines, and power semiconductors. The conductor lines can be, in particular, copper conductor lines, wherein the carrier plate can preferably be constructed of ceramic. The power semiconductors can be applied to the conductor lines by means of layers, in particular solder layers or sintered layers. The conductor lines, together with the carrier plate, form a power substrate. In this case, each connection layer 201 can be produced by a soldering or sintering process and can therefore be a soldering or sintering layer, by means of which the corresponding power module is bonded to and thus thermally connected to a fluid-permeable cooler 100. For this purpose, the first plate 101 can be advantageously surface-coated with a material suitable for a soldering or sintering process.
[0044] like Figure 2 As can be seen, the fluid-permeable cooler 100 includes a first plate 101, a second plate 102, and a third plate 103. Specifically, the first plate 101 is constructed flat, while the third plate 103 has a recess 131 covered by the first plate 101. Thus, an internal space 130 is formed between the first plate 101 and the third plate 103. Here, the internal space 130 corresponds to the recess 131. Therefore, a cooler 100 that is easy to manufacture is achieved in a compact structure. The first plate 101 and the third plate 103 are connected to each other in a material-locking manner. Specifically, the first plate 101 and the third plate 103 are connected by means of a brazing layer 117 (first brazing layer). The brazing layer 117 is, in particular, a hard brazing layer.
[0045] The second plate 102 is constructed flat and arranged between the first plate 101 and the third plate 103. Specifically, the entire second plate 102 is arranged between the areas of the first plate 101 and the third plate 103 and is located within the internal space 130. The second plate 102 is material-locked to the third plate 103, particularly by means of an additional brazing layer 118 (second brazing layer). Specifically, the additional brazing layer 118 is a hard brazing layer. The joining of the first plate 101, the second plate 102, the third plate 103, and the cooling structure 106 can be advantageously achieved in the same processing step by means of a hard brazing process.
[0046] The first plate 101, the second plate 102, and the third plate 103 are constructed as sheet metal and advantageously each have a constant thickness. The first plate 101 and the third plate 103 are particularly identical in thickness. However, it is also possible for the first plate 101 and the third plate 103 to have different thicknesses. The second plate 102 advantageously has a greater thickness than either the first plate 101 or the third plate 103, thereby increasing the rigidity of the cooler 100. To form the recess 131 in the third plate 103, the third plate 103 can be advantageously manufactured using a deep-drawing process.
[0047] Here, the first plate 101 can be called the cover plate and the third plate 103 can be called the bottom plate, while the second plate 102 can be called the middle plate.
[0048] Three separate cooling channels 104 are constructed within the internal space 130, each corresponding to an electrical and / or electronic component 200. In other words, the number of cooling channels 104 corresponds to the number of electrical and / or electronic components 200. The cooling channels 104 are constructed between the first plate 101 and the second plate 102 and are capable of flowing through a fluid used as a coolant, such as water. By means of the fluid, heat generated by the electrical and / or electronic components 200 is dissipated during operation of the electrical and / or electronic equipment 1000. The cooling channels 104 extend parallel to each other and are therefore capable of parallel flow of fluid. Specifically, the cooling channels 104 extend along the width direction 502 of the cooler 100. Therefore, the fluid-flowable cooler 100 is constructed as either a parallel-flowable or transverse-flowable cooler.
[0049] Preferably, a cooling structure 106 is arranged in each cooling channel 104. Here, each cooling structure 106 is located between the first plate 101 and the second plate 102. Each cooling structure 106 is material-locked to the first plate 101, especially by means of a brazing layer 117 (first brazing layer). In addition, each cooling structure 106 is material-locked to the second plate 102, especially by means of another brazing layer 119 (third brazing layer). In particular, the other brazing layer 119 is a hard brazing layer.
[0050] Cooling structure 106 is a structure with increased surface area, flow guidance, and enhanced heat conduction. Specifically, cooling structure 106 is configured as a turbulent flow generator (also called a turbulent structure). That is, cooling structure 106 is configured to generate turbulent flow in the fluid flowing through cooling channel 104. Therefore, cooling structure 106 ensures better heat transfer from cooler 100 to the fluid flowing through cooler 100. Cooling structure 106 is particularly configured as a turbulent inlet inserted into cooler 100.
[0051] Especially from Figure 3 and Figure 4 As can be seen, each cooling structure 106 extends completely through the corresponding cooling channel 104. Each cooling structure 106 extends, for example, with a receiving area 115 of the first plate 101 that is substantially the same area as the receiving area 115, on which the corresponding electrical and / or electronic components 200 are arranged. Each cooling structure 106 is arranged below the corresponding receiving area 115.
[0052] The cooling structure 106 is advantageously constructed as a cooling rib structure, each having a plurality of cooling ribs 160 arranged sequentially along the width direction 502 or along the flow direction 505 of the fluid passing through the cooling channel 104. The cooling ribs 160 are preferably formed by a wavy profile that repeats periodically along a repeating direction. This repeating direction preferably corresponds to the longitudinal direction 501 of the cooler 100. However, other designs for the cooling structure 106 are also possible. For example, the cooling structure 106 can be a pin structure.
[0053] The cooling structure 106 is at least partially, and especially entirely, made of and / or coated with a material having a thermal conductivity greater than 200 W / (m·K). Advantageously, the cooling structure 106 can be at least partially, and especially entirely, constructed of or coated with aluminum. In particular, the entire cooler 100, i.e., the first plate 101, the second plate 102, the third plate 103, and the cooling structure 106, can be constructed of the same material.
[0054] In order to introduce the fluid used as a coolant into the cooler 100, the cooler 100 has an inlet 108 ( Figure 4 To distribute fluid introduced through inlet 108 to cooling channel 104, cooler 100 also includes distribution channel 105, which is fluidly connected to inlet 108 on one side and cooling channel 104 on the other. Distribution channel 105 is constructed between second plate 102 and third plate 103. Specifically, distribution channel 105 is constructed in recess 131 of third plate 103 and extends along longitudinal direction 501 of cooler 100. Distribution channel 105 is arranged below second plate 102, first plate 101 and cooling channel 104.
[0055] For fluid communication / fluid connection between distribution channel 105 and cooling channel 104, the second plate 102 has an opening (first opening) 110 through which distribution channel 105 is fluidly connected to cooling channel 104. Figure 3 and Figure 4Thus, the second plate 102 has three openings 110. In other words, the number of openings 110 corresponds to the number of cooling channels 104, wherein each cooling channel 104 is provided with exactly one opening 110. That is, fluid flowing through the distribution channel 105 flows from the distribution channel 105 into each cooling channel 104 through the individual openings 110. This minimizes the pressure loss caused by the openings 110, allowing for better flow guidance of fluid from the distribution channel 105 into the cooling channels 104. However, it is also possible for each cooling channel 104 to be provided with two or more openings 110.
[0056] In addition, by Figures 2 to 4 It can be seen that the flow direction 507 of the fluid through the distribution channel 105 is perpendicular to the flow direction 505 of the fluid through the cooling channel 104.
[0057] Furthermore, the cooler 100 includes a collection channel 107 for collecting or re-receiving fluid that may drain from the cooling channel 104. For this purpose, the collection channel 107 is fluidly connected to the cooling channel 104. The collection channel 107 is constructed between the second plate 102 and the third plate 103. Specifically, the collection channel 107 is constructed in a recess 131 of the third plate 103 and extends along the longitudinal direction 501 of the cooler 100. The collection channel 107 is arranged below the second plate 102, the first plate 101, and the cooling channel 104.
[0058] To facilitate fluid communication / fluid connection between channel 107 and cooling channel 104, the second plate 102 has an additional opening (second opening) 111. Figure 3 and Figure 4 Thus, the second plate 102 has three additional openings 111. In other words, the number of additional openings 111 corresponds to the number of cooling channels 104, wherein each cooling channel 104 is provided with exactly one additional opening 111. That is, the fluid flowing through each cooling channel 104 flows into the collection channel 107 through a separate additional opening 111. This minimizes the pressure loss caused by the additional openings 111, allowing the fluid to flow more effectively from the cooling channels 104 into the collection channel 107. However, it is also possible for each cooling channel 104 to be provided with two or more additional openings 111.
[0059] Furthermore, the collection channel 107 is fluid-technically connected to the outlet 109 of the cooler 100. The fluid used as a coolant can be discharged through the outlet 109.
[0060] In addition, by Figures 2 to 4 It can be determined that the flow direction 508 of the fluid through the collection channel 107 is perpendicular to the flow direction 505 of the fluid through the cooling channel 104.
[0061] The third plate 103 has a first edge region 133, a second edge region 134, and a middle region 135 along its width direction 502, the middle region connecting the first edge region 133 and the second edge region 134. A dispensing channel 105 is formed in the first edge region 133, and a collecting channel 107 is formed in the second edge region 134. The middle region 135 is connected to the second plate 102 by means of a solder layer 118 such that the dispensing channel 105 and the collecting channel 107 are not directly fluidically connected to each other.
[0062] In addition, by Figure 2 It is understood that the recesses 131 are constructed in a stepped manner, forming a first recess region 136 and a second recess region 137 along the thickness direction 503 of the cooler 100. A cooling channel 104 is constructed in the first recess region 136, and a distribution channel 105 and a collection channel 107 are constructed in the second recess region 137. Specifically, a first recess 139 and a second recess 140 are constructed in the first recess region 136. The distribution channel 105 is constructed in the first recess 139, and the collection channel 107 is constructed in the second recess 140. A step 138 at the first edge region 133 and another step 138 at the second edge region 134 are constructed at the transition between the first recess region 136 and the second recess region 137, and the second plate 102 is partially disposed at / on this step.
[0063] Entrance 108 ( Figure 4 Arranged or constructed at the third plate 103, especially at the lower side 132 of the third plate 103. Figure 2 The inlet 108 can preferably be configured as an inlet pipe fitting. The inlet pipe fitting can be, for example, a separate component, made of aluminum, constructed, for example, in a columnar manner. In this case, the inlet pipe fitting can be material-locked, particularly by means of brazing, especially hard brazing, to the third plate 103. In this embodiment, as by... Figure 4 It can be seen that the inlet 108 is located directly below one of the cooling channels in the cooling channel 104 and therefore also directly below the first plate 101 and the corresponding receiving area 115.
[0064] Correspondingly, exports 109 ( Figure 4 Arranged or constructed at the third plate 103, especially at the lower side 132 of the third plate 103. Figure 2 The outlet 109 can also preferably be configured as an outlet pipe fitting. Accordingly, the outlet pipe fitting can be, for example, a separate component, made of aluminum, constructed, for example, in a columnar manner. In this case, the outlet pipe fitting can be material-locked, particularly by means of brazing, especially hard brazing, to the third plate 103. In this embodiment, as by Figure 4 It is understood that outlet 108 is located directly below one of the cooling channels in cooling channel 104, and therefore also directly below the first plate 101 and the corresponding receiving area 115. This arrangement of inlet 107 and outlet 108 allows for a particularly compact construction of the cooler 100. The inlet and / or outlet pipe fittings can preferably be joined in the same processing steps as other components of the cooler 100 that are connected to each other by brazing, especially hard brazing.
[0065] In addition, by Figure 4 As obtained, the cross-section of the distribution channel 105 decreases in the direction from the first end 151 to the second end 152 of the distribution channel 105. This specifically means that the width 601 of the distribution channel 105 decreases in the direction from the first end 151 to the second end 152. Here, the direction from the first end 151 to the second end 152 corresponds to the flow direction 507 of the fluid through the distribution channel 105. The flow direction 507 of the fluid through the distribution channel 105 also corresponds to the longitudinal direction 501 of the cooler 100. In other words, the distribution channel 105 tapers along the flow direction 507 of the fluid through the distribution channel 105. Here, the first end 151 corresponds to the end on the inlet side of the distribution channel 105, that is, the end of the distribution channel 105 facing the inlet 108 of the cooler 100. The inlet 107 is particularly arranged at the first end 151 of the distribution channel 105. The distribution channel 105 has its maximum cross-section or maximum width 601 at its first end 151, and its minimum cross-section or minimum width 601 at its second end 152. This has the advantage that the distribution channel 105 has its maximum cross-section or maximum width 601 at the location of the maximum fluid volumetric flow rate.
[0066] In addition, by Figure 4As observed, the cross-section of the collection channel 107 increases in the direction from the first end 171 to the second end 172 of the collection channel 107. This specifically means that the width 602 of the collection channel 107 increases in the direction from its first end 171 to its second end 172. Here, the direction from the first end 171 to the second end 172 of the collection channel 107 corresponds to the flow direction 508 of the fluid through the collection channel 107. The flow direction 508 of the fluid through the collection channel 107 also corresponds to the longitudinal direction 501 of the cooler 100. In other words, the collection channel 107 widens along the flow direction 508 of the fluid through the collection channel 107. Here, the second end 172 corresponds to the end on the outlet side of the collection channel 107, that is, the end of the collection channel 107 facing the outlet 109 of the cooler 100. The outlet 109 is particularly arranged at the second end 172 of the collection channel 107. The collection channel 107 has its minimum cross-section or minimum width 602 at its first end 171, and its maximum cross-section or maximum width 602 at its second end 152. This has the advantage that the collection channel 107 has its maximum cross-section or maximum width 602 at the location of the highest fluid volumetric flow rate.
[0067] To cool the electrical and / or electronic components 200, a fluid used as a coolant is introduced into the cooler 100 through inlet 108. Due to the fluid communication / fluid connection between inlet 108 and distribution channel 105, the fluid flows from inlet 108 into distribution channel 105. The fluid is then distributed from distribution channel 105 onto cooling channel 104. That is, the fluid flowing through distribution channel 105 flows into cooling channel 104 through opening 110 formed in second plate 102. The fluid flows through cooling structure 106 arranged therein in cooling channel 104. Thus, heat generated by the electrical and / or electronic components 200 and transferred to cooling structure 106 via first plate 101 is carried away by the fluid. The heated fluid then flows out of cooling channel 104 through another opening 111 formed in second plate 102 and into collection channel 107. The flow path of the fluid from distribution channel 105 through cooling channel 104 to collection channel 107 is as follows: Figures 2 to 4 The flow is indicated by streamline 510. Fluid flowing out of cooling channel 104 is collected in collection channel 107. Then, due to the fluid communication / fluid connection between collection channel 107 and outlet 109 of cooler 100, the fluid is transported away through outlet 109.
[0068] The electrical and / or electronic device 1000 according to the invention has several advantages. By providing the previously described distribution channel 105, fluid can flow from below into the cooling channel 104 and thus into the cooling structure 106 arranged therein. This allows for uniform distribution of fluid across the cooling channel 104. The previously described collection channel 107 also contributes to this, as it influences the flow of fluid through the distribution channel 105 due to its fluid communication / connection with the cooling channel 104. Parallel flow into the cooling structure 106 optimizes the cooling of the electrical and / or electronic components 200 and achieves lower pressure loss. Furthermore, the arrangement of the distribution channel 105 and the collection channel 107 below the second plate 102 enables a very compact structure for the cooler 100.
[0069] Figure 5 This relates to a fluid-permeable cooler 100 according to a second embodiment of the invention. The cooler 100 according to the second embodiment can be used in the electrical and / or electronic equipment 1000 described above according to the first embodiment for cooling electrical and / or electronic components 200. Figure 5 Only the area of cooler 100 is shown in the image.
[0070] The cooler 100 according to the second embodiment differs from the cooler according to the first embodiment in the design of the dispensing channel 105 and the collecting channel 107. Compared to the first embodiment, the dispensing channel 105 has a constant cross-section and, in particular, a constant width 601 in the direction from its first end 151 to its second end 152. Correspondingly, the collecting channel 107 has a constant cross-section and, in particular, a constant width 602 in the direction from its first end 171 to its second end 172. Advantageously, the dispensing channel 105 and the collecting channel 107 can have the same cross-section and, in particular, the same width. Therefore, the dispensing channel 105 and the collecting channel 107 can be easily constructed.
[0071] Another difference between the cooler 100 according to the second embodiment and the cooler 100 according to the first embodiment is that, here, neither the inlet 108 nor the outlet 109 is arranged directly below the second plate 102, the first plate 101, or the cooling channel 104. In other words, the inlet 108 and the outlet 109 are still arranged on the lower side 132 of the third plate 103, but outside the area where the second plate 102, the first plate 101, or the cooling channel 104 is constructed.
[0072] Figure 6 This relates to a fluid-permeable cooler 100 according to a third embodiment of the invention. The cooler 100 according to the third embodiment can be used in the electrical and / or electronic equipment 1000 described above according to the first embodiment for cooling electrical and / or electronic components 200. Figure 6 Only the area of cooler 100 is shown in the image.
[0073] The difference between the cooler 100 according to the third embodiment and the cooler according to the second embodiment lies in the arrangement of the inlet 108. For example... Figure 6 As shown, in the cooler 100 according to the third embodiment, the inlet 108 is arranged at the second end 152 of the distribution channel 105.
[0074] This arrangement of inlet 108 can be advantageous when the fluid used as a coolant must be introduced into and discharged from the cooler 100 from the same side of the cooler 100.
[0075] Figure 7 This relates to a fluid-permeable cooler 100 according to a fourth embodiment of the invention. The cooler 100 according to the fourth embodiment can be used in the electrical and / or electronic equipment 1000 described above according to the first embodiment for cooling electrical and / or electronic components 200. Figure 7 Only the area of cooler 100 is shown in the image.
[0076] The difference between the cooler 100 according to the fourth embodiment and the cooler according to the first embodiment lies in the design of the collection channel 107 and the arrangement of the inlet 108.
[0077] like Figure 7 As shown, in the cooler 100 according to the fourth embodiment, the inlet 108 is arranged at the second end 152 of the distribution channel 105. That is, the inlet 108 is arranged at the end of the distribution channel 105, where the distribution channel 105 has its minimum cross-section and, in particular, its minimum width 601. Furthermore, relative to the cooler 100 according to the first embodiment, the cross-section of the collection channel 107 here decreases in the flow direction 508 through which the fluid passes. In particular, the width 602 of the collection channel 107 decreases in the flow direction 508 through which the fluid passes. At the second end 172 where the outlet 109 is arranged, the collection channel 107 thus has its minimum cross-section and, in particular, its minimum width 602.
[0078] For example, in the case where electrical and / or electronic equipment 1000 is installed in another device, such as a vehicle, this design of the cooler 100 may be advantageous for space reasons.
[0079] Figure 8A cross-sectional view of an electrical and / or electronic device 1000 according to a fifth embodiment of the invention is shown, the electrical and / or electronic device having a fluid-permeable cooler 100. The electrical and / or electronic device 1000 here also has three electrical and / or electronic components 200, which are arranged and constructed as in the electrical and / or electronic components 200 of the electrical and / or electronic device 1000 according to the first embodiment.
[0080] The difference between the electrical and / or electronic equipment 1000 according to the fifth embodiment and the electrical and / or electronic equipment according to the first embodiment lies in the structure of the cooler 100.
[0081] Specifically, the second plate 102 has a recess 121 covered by the first plate 101, forming an internal space 120 between the first plate 101 and the second plate 102. Here, the internal space 120 corresponds to the recess 121. Thus, a cooler 100 that is easy to manufacture is achieved in a compact structure. Cooling channels 104 are formed in the recess 120 of the second plate 102. The first plate 101 and the second plate 102 are connected in a material-locking manner, especially by means of a brazing layer 116. The brazing layer 116 is particularly capable of being a hard brazing layer.
[0082] The third plate 103 has a first recess 139 and a second recess 140. The first recess 139 is located at a first edge region 133, and the second recess 140 is located at a second edge region 134. A dispensing channel 105 is constructed in the first recess 139, and a collection channel 107 is constructed in the second recess 140. Here, the third plate 103 is only connected to the second plate 102 or is arranged planarly on the second plate 102.
[0083] In this embodiment, the first plate 101 can be referred to as the cover plate and the second plate 102 can be referred to as the bottom plate.
[0084] according to Figures 5 to 7 The design scheme of the embodiments can also be combined with the fifth embodiment. The advantages described with respect to the electrical and / or electronic equipment 1000 also apply to the electrical and / or electronic equipment 1000 according to the fifth embodiment.
Claims
1. A fluid-permeable cooler (100) for cooling at least two electrical and / or electronic components (200), said fluid-permeable cooler comprising: • First board (101); • Second board (102); • The third plate (103), wherein the second plate (102) is arranged between the first plate (101) and the third plate (103); • At least two cooling channels (104) are constructed between the first plate (101) and the second plate (102) and are capable of parallel flow of fluid; and • A distribution channel (105) is constructed between the second plate (102) and the third plate (103), the distribution channel being fluid-technically connected to the inlet (108) of the cooler (100) for introducing fluid into the cooler (100), and the distribution channel being fluid-technically connected to the cooling channel (104) for distributing fluid that can be introduced through the inlet (108) onto the cooling channel (104).
2. The fluid-permeable cooler (100) according to claim 1, wherein, The second plate (102) has at least two openings (110) through which the distribution channel (105) is fluidly connected to the cooling channel (104).
3. The fluid-permeable cooler (100) according to any one of the preceding claims, wherein, The flow direction (507) of the fluid through the distribution channel (105) is at an angle, and in particular perpendicular, to the flow direction (505) of the fluid through the cooling channel (104).
4. The fluid-permeable cooler (100) according to any one of the preceding claims, wherein, The cross-section of the distribution channel (105) decreases or remains constant in the direction from the first end (151) to the second end (152), preferably in the flow direction (507) of the fluid passing through the distribution channel (105).
5. A fluid-permeable cooler (100) according to any one of the preceding claims, wherein, A cooling structure (106) is arranged in at least one of the at least two cooling channels (104), and in particular, a cooling structure (106) is arranged in each cooling channel (104).
6. The fluid-permeable cooler (100) according to any one of the preceding claims, the fluid-permeable cooler further comprising a collection channel (107) configured between the second plate (102) and the third plate (103) and fluid-technically connected to the cooling channel (104) for collecting fluid that can be discharged from the cooling channel (104).
7. The fluid-permeable cooler (100) according to claim 6, wherein, The second plate (102) has at least two additional openings (111) through which the collection channel (107) is fluidly connected to the cooling channel (104).
8. The fluid-permeable cooler (100) according to claim 6 or 7, wherein, The flow direction (508) of the fluid through the collection channel (107) is at an angle, and in particular perpendicular, to the flow direction (505) of the fluid through the cooling channel (104).
9. The fluid-permeable cooler (100) according to any one of claims 6 to 8, wherein, The cross-section of the collection channel (107) increases or remains constant in the direction from the first end (171) to the second end (172), preferably in the flow direction (508) of the fluid passing through the collection channel (107).
10. A fluid-permeable cooler (100) according to any one of the preceding claims, wherein, The first plate (101) and the third plate (103) are connected to each other such that an internal space (130) is formed between the first plate (101) and the third plate (103), in which the second plate (102) is arranged.
11. The fluid-permeable cooler according to claim 10, wherein, The third plate (103) has a recess (131) that is covered by the first plate (101), wherein the recess (131) forms at least a portion of the interior space (130), and in particular forms the interior space (130).
12. The fluid-permeable cooler (100) according to claim 10 or 11, wherein, The second plate (102) is constructed as a flat plate.
13. The fluid-permeable cooler (100) according to any one of claims 1 to 9, wherein, The first plate (101) is connected to the second plate (102), and the second plate (102) has a recess (121) in which the cooling channel (104) is formed, and the third plate (103) has a recess (139) in which the distribution channel (105) is constructed.
14. The fluid-permeable cooler (100) according to claim 13, wherein, The third plate (104) has an additional recess (140) in which the collection channel (107) is constructed.
15. An electrical and / or electronic device (1000) comprising a fluid-permeable cooler (100) according to any one of the preceding claims and at least two electrical and / or electronic components (200) disposed at the fluid-permeable cooler (100).