Semiconductor laser hair growth and hair care instrument

Abstract

The present application relates to hairdressing instrument technical field, specifically to a kind of semiconductor laser hair growth hairdressing instrument, comprising: data acquisition module, accumulation determination module, delay determination module, demand determination module and adjustment control module, each module cooperates with each other, by the monitoring data in the working process of hairdressing instrument, monitoring data at least include the temperature data of different monitoring points in hair growth cap, the conductivity data of different monitoring points in the head of the person treated, and laser power data;By analyzing monitoring data, determine the temperature control requirement at the current time, so as to adjust the control parameter in the heat dissipation controller of hairdressing instrument based on the temperature control requirement, so as to control the heat dissipation system of hairdressing instrument.The present application adjusts the control parameter in the heat dissipation controller of hairdressing instrument according to real-time temperature control requirement, effectively guarantees temperature control effect, while reducing temperature dissipation energy consumption.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of hair care instruments, in particular to a semiconductor laser hair growth and hair fixing hair care instrument. BACKGROUND

[0002] The semiconductor laser treatment instrument is a medical device based on low-energy laser technology (LLLT), which is usually composed of a hair growth cap, a light-emitting diode, a power control box, and a power line, and is powered by an external power supply. The working principle of the semiconductor laser hair growth and hair fixing hair care instrument is that low-energy red light can stimulate the resting hair follicles to enter the growth phase again, prolong the growth phase time, and increase the proliferation rate of active hair follicles in the growth phase without causing thermal damage. Its light biological regulation effect is related to the following mechanisms: (1) low-energy red light in the red light wavelength range can promote hair growth by affecting the function of hair stem cells; (2) by activating cytochrome c oxidase and increasing mitochondrial electron transport to increase ATP, it promotes the transition of hair follicles from the resting phase to the growth phase.

[0003] In the process of using the semiconductor laser treatment instrument, the speed of the heat dissipation fan in the heat dissipation system is usually adjusted by PID control to adjust the temperature in the hair growth cap. However, in the existing PID control, the control parameters are usually fixed and cannot respond to temperature fluctuations in the actual working process in a timely manner, resulting in poor control effect. At the same time, in the process of increasing the heat dissipation performance of the hair growth cap with high temperature, the heat dissipation system may need more energy to maintain a higher fan speed or cooling power, resulting in increased energy consumption. SUMMARY

[0004] In order to solve the above technical problems, the purpose of the present application is to provide a semiconductor laser hair growth and hair fixing hair care instrument, and the technical solution adopted is as follows:

[0005] In the first aspect, the present application provides a semiconductor laser hair growth and hair fixing hair care instrument, which comprises:

[0006] A data acquisition module is configured to acquire monitoring data in the working process of the hair care instrument, wherein the monitoring data at least includes temperature data of different monitoring points in the hair growth cap, conductivity data of different monitoring points on the head of the treatment subject, and laser power data;

[0007] An accumulative determination module is configured to determine the internal temperature accumulation at the current time based on the change fluctuations of the temperature data and the laser power data in different monitoring periods in the working process, and the change trend of the conductivity data in different monitoring periods.

[0008] a delay determination module configured to determine a thermal response delay index at the current time based on a synchronism of changes in the temperature data and the laser power data in different monitoring periods during the working process;

[0009] a demand determination module configured to determine a temperature regulation demand at the current time based on the internal temperature accumulation and the thermal response delay index;

[0010] an adjustment control module configured to adjust a control parameter in a heat dissipation controller of the hair care device based on the temperature regulation demand, and control the heat dissipation system of the hair care device based on the adjusted control parameter in the heat dissipation controller.

[0011] In some possible implementation manners of the first aspect, the accumulation determination module comprises:

[0012] a pressure index determination unit configured to determine a thermal management pressure index in each monitoring period during the working process based on fluctuation of changes in the temperature data and the laser power data in each monitoring period;

[0013] a conductivity index determination unit configured to determine a thermal sensitive conductivity index in each monitoring period during the working process based on the thermal management pressure index and a change trend of the conductivity data in each monitoring period;

[0014] an accumulation determination unit configured to determine an internal temperature accumulation at the current time based on fluctuation of changes in the thermal management pressure index in different monitoring periods during the working process, and a change relationship between the thermal management pressure index and the thermal sensitive conductivity index in different monitoring periods.

[0015] In some possible implementation manners of the first aspect, the laser power data is driving current data, and the pressure index determination unit is configured to:

[0016] determine, in the driving current data in each monitoring period during the working process, a power instantaneous intensity in each monitoring period based on a difference between current values of all arbitrary two monitoring times and a slope determined by current values of all adjacent monitoring times;

[0017] determine, in the temperature data of each monitoring point in each monitoring period during the working process, a temperature change rate of each monitoring point in each monitoring period based on a time interval between corresponding monitoring times of adjacent extreme points and a slope determined by temperature values of all adjacent monitoring times;

[0018] determine the thermal management pressure index in each monitoring period based on the power instantaneous intensity in each monitoring period and the temperature change rate of different monitoring points.

[0019] In some possible implementation manners of the first aspect, the power instantaneous intensity in each monitoring period is determined by: determining, in the driving current data in each monitoring period, a slope of current values of all adjacent monitoring time points; and determining an average value of the slopes.

[0020] In the driving current data in each monitoring period during the working process, a slope of current values of all adjacent monitoring time points is determined, and an average value of the slopes is obtained as a first slope average value.

[0021] In the driving current data in each monitoring period during the working process, an absolute value of a difference between current values of any two monitoring time points is determined.

[0022] The power instantaneous intensity in each monitoring period is determined based on the first slope average value and all the absolute values of the differences.

[0023] In some possible implementation manners of the first aspect, the temperature change rate of each monitoring point in each monitoring period is determined by: determining, in the temperature data of each monitoring point in each monitoring period during the working process, a slope of temperature values of all adjacent monitoring time points; and determining an average value of the slopes as a second slope average value.

[0024] In the temperature data of each monitoring point in each monitoring period during the working process, a slope of temperature values of all adjacent monitoring time points is determined, and an average value of the slopes is obtained as a second slope average value.

[0025] The temperature change rate of each monitoring point in each monitoring period is determined based on the second slope average value and a negative correlation mapping value of a time interval between two adjacent extreme points corresponding to monitoring time points in the temperature data of each monitoring point in each monitoring period during the working process.

[0026] In some possible implementation manners of the first aspect, the conductivity index determination unit is configured to:

[0027] The sub-thermal sensitive conductivity index of each monitoring point in each monitoring period is determined based on the thermal management pressure index and a difference between conductivities of adjacent monitoring time points in the conductivity data of each monitoring point in each monitoring period during the working process.

[0028] The thermal sensitive conductivity index in each monitoring period is determined based on a distribution level of the sub-thermal sensitive conductivity index of all the monitoring points in each monitoring period.

[0029] In some possible implementation manners of the first aspect, the accumulation determination unit is configured to:

[0030] The thermal management pressure indices in all the monitoring periods are normalized to obtain a first normalized value.

[0031] The thermal sensitive conductivity indices in all the monitoring periods are normalized to obtain a second normalized value.

[0032] determine the internal temperature accumulation at the current time based on a change correlation index between the first normalized value and the second normalized value in all monitoring time periods, and a slope determined by the first normalized value in all adjacent monitoring time periods.

[0033] In some possible implementation manners of the first aspect, the laser power data is drive current data, and the delay determination module includes:

[0034] a temperature normalization unit, configured to normalize a temperature value at each monitoring time in temperature data of different monitoring points to obtain a temperature normalized value;

[0035] a current normalization unit, configured to normalize a current value at each monitoring time in drive current data to obtain a current normalized value;

[0036] a negative slope determination unit, configured to determine a negative slope in slopes determined by the current normalized value at all adjacent monitoring times in the working process;

[0037] a target slope determination unit, configured to determine a target slope matched with the negative slope in slopes determined by the temperature normalized value at all adjacent monitoring times of each monitoring point in the working process;

[0038] a delay determination unit, configured to determine a thermal response delay index at the current time based on a difference between the negative slope and the target slope of different monitoring points in the growing cap in the working process.

[0039] In some possible implementation manners of the first aspect, the demand determination module includes:

[0040] an accumulation normalization unit, configured to normalize the internal temperature accumulation to obtain a third normalized value;

[0041] a delay index normalization unit, configured to normalize the thermal response delay index to obtain a fourth normalized value;

[0042] a demand determination unit, configured to determine an added value of the third normalized value and the fourth normalized value, and take the added value as a temperature regulation demand at the current time.

[0043] In some possible implementation manners of the first aspect, the control parameter in the heat dissipation controller includes a proportional gain coefficient in a PID control of a heat dissipation system, and the adjustment control module includes:

[0044] The parameter adjusting unit is configured to determine a product of the temperature regulation requirement and a proportional gain coefficient in PID control of the heat dissipation system as an adjusted proportional gain coefficient, so as to obtain an adjusted control parameter in the heat dissipation controller.

[0045] The control unit is configured to control a rotating speed of a heat dissipation fan in the heat dissipation system of the hair growing instrument based on the adjusted control parameter in the heat dissipation controller.

[0046] In a second aspect, the present application further provides a temperature control method for a semiconductor laser hair growth and hair fixing instrument, which comprises the following steps:

[0047] Collecting monitoring data in a working process of the hair growing instrument, wherein the monitoring data at least comprises temperature data of different monitoring points in a hair growth cap, conductivity data of different monitoring points on a head of a subject, and laser power data;

[0048] Determining an internal temperature accumulation at a current time based on variation fluctuation of the temperature data and the laser power data in different monitoring periods in the working process, and variation trend of the conductivity data in different monitoring periods;

[0049] Determining a thermal response delay index at the current time based on variation synchronism of the temperature data and the laser power data in different monitoring periods in the working process;

[0050] Determining a temperature regulation requirement at the current time based on the internal temperature accumulation and the thermal response delay index;

[0051] Adjusting a control parameter in a heat dissipation controller of the hair growing instrument based on the temperature regulation requirement, and controlling the heat dissipation system of the hair growing instrument based on the adjusted control parameter in the heat dissipation controller.

[0052] In a third aspect, the present application further provides a temperature control device for a semiconductor laser hair growth and hair fixing instrument, which comprises a memory and a processor. The memory is configured to store executable computer program codes, and the processor is configured to call and run the executable computer program codes from the memory, so that the system executes steps implemented by various modules in the first aspect or any possible implementation manner of the first aspect.

[0053] In a fourth aspect, the present application further provides a computer program product, which comprises computer program codes. When the computer program codes are run on a computer, the computer program codes make the computer execute steps implemented by various modules in the first aspect or any possible implementation manner of the first aspect.

[0054] In a fifth aspect, the present application further provides a computer readable storage medium storing computer program codes, which, when executed on a computer, cause the computer to perform the steps implemented by the various modules in the first aspect or any possible implementation manner of the first aspect.

[0055] The present application has the following beneficial effects: by collecting the monitoring data in the working process of the hair growing instrument by the data collection module, the monitoring data at least includes the temperature data of different monitoring points in the hair growth cap, the conductivity data of different monitoring points on the head of the subject, and the laser power data; then the change fluctuation of the temperature data and the laser power data in different monitoring periods in the working process, and the change trend of the conductivity data in different monitoring periods are analyzed by the accumulative determination module to determine the internal temperature accumulation at the current time; at the same time, the change synchronism of the temperature data and the laser power data in different monitoring periods in the working process is analyzed by the delay determination module to determine the thermal response delay index at the current time; thus, based on the internal temperature accumulation and the thermal response delay index, the temperature regulation requirement at the current time is determined by the requirement determination module; finally, the adjustment control module adjusts the control parameters in the heat dissipation controller of the hair growing instrument based on the temperature regulation requirement, and controls the heat dissipation system of the hair growing instrument based on the adjusted control parameters in the heat dissipation controller. The present application collects the monitoring data in the working process of the hair growing instrument, and analyzes the monitoring data, determines the thermal response delay index and the thermal response delay index at the current time, thereby adaptively determines the real-time temperature regulation requirement, adjusts the control parameters in the heat dissipation controller of the hair growing instrument based on the temperature regulation requirement, and finally realizes the adaptive temperature control of the hair growing instrument, effectively ensures the temperature regulation requirement in the working process of the hair growing instrument, and reduces the temperature dissipation energy consumption. BRIEF DESCRIPTION OF DRAWINGS

[0056] In order to more clearly illustrate the technical solutions and advantages of the embodiments of the present application or the prior art, the drawings needed in the following embodiment or prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and those skilled in the art can also obtain other drawings according to these drawings without creative labor.

[0057] Figure 1 A structure schematic diagram of a semiconductor laser hair growth and fixing hair growing instrument according to an embodiment of the present application;

[0058] Figure 2 A step flowchart of a temperature control method for a semiconductor laser hair growth and fixing hair growing instrument according to an embodiment of the present application. DETAILED DESCRIPTION

[0059] In order to clearly illustrate the technical solutions of the present application, the following will give a detailed description of the present application with reference to the drawings.

[0060] Embodiments of the present application will be described in more detail with reference to the drawings. Although some embodiments of the present application are shown in the drawings, it should be understood that the present application can be implemented in various forms and should not be interpreted as being limited to the embodiments set forth herein, but rather these embodiments are provided for more thorough and complete understanding of the present application. It should be understood that the drawings and embodiments of the present application are only for illustrative purposes and are not intended to limit the scope of protection of the present application.

[0061] It should be understood that each step described in the method embodiments of the present application can be performed in different order and / or in parallel. In addition, the method embodiments can include additional steps and / or omit the steps shown. The scope of the present application is not limited in this respect.

[0062] The term "comprising" and variations thereof as used in the present application are open-ended, that is, "including but not limited to". The term "based on" is "at least partially based on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments". Related definitions will be given in the description below.

[0063] It should be noted that the concepts of "first", "second", etc. mentioned in the present application are only used to distinguish different devices, modules or units, and are not intended to limit the order or interdependence of the functions performed by these devices, modules or units.

[0064] In the embodiments of the present application, although the operations or steps are described in a specific order in the drawings, it should not be understood as requiring the operations or steps to be performed in the specific order or serial order shown, or requiring all of the operations or steps to be performed to obtain the desired results. In the embodiments of the present application, these operations or steps can be performed in series; they can also be performed in parallel; and a part of them can be performed.

[0065] At the same time, it can be understood that the data involved in the technical solutions of the present application (including but not limited to the data itself, the acquisition or use of the data) should comply with the requirements of the relevant laws, regulations and provisions. Unless otherwise defined, all technical and scientific terms used in the present application have the same meaning as understood by those skilled in the art to which the present application belongs, and all parameters or indicators in the formulas involved in the present application are the values of normalized and dimensionless.

[0066] The embodiment of the present application provides a semiconductor laser hair growth hair fixing and nourishing instrument, which is essentially a software system, the software system is composed of various modules for realizing corresponding functions, and a corresponding structural diagram is as shown in the figure. Figure 1 The core of the system is to realize a temperature control method for the semiconductor laser hair growth hair fixing and nourishing instrument, and various modules in the system correspond to various steps in the method, and a corresponding flow chart is as shown in the figure. Figure 2 The various modules of the system are described in detail below in combination with the specific steps in the method.

[0067] The data acquisition module 100 is used for acquiring monitoring data in the working process of the hair nourishing instrument, and the monitoring data at least includes temperature data of different monitoring points in the hair growth cap, conductivity data of different monitoring points on the head of the treated person, and laser power data.

[0068] Specifically, in the hair fixing and nourishing process of the treated person, the data acquisition module 100 is used to acquire monitoring data in the working process of the hair nourishing instrument, so as to realize accurate temperature control of the hair nourishing instrument according to the monitoring data. The type of the monitoring data can be reasonably set according to the control requirement, and in the embodiment, the monitoring data specifically includes temperature data of different monitoring points in the hair growth cap, conductivity data of different monitoring points on the head of the treated person, and laser power data of the hair nourishing instrument.

[0069] In a specific example, different monitoring points are uniformly arranged in the hair growth cap, high-precision temperature sensors are arranged at the different monitoring points, the temperature sensors are used to monitor the temperature change of the scalp of the treated person in real time, so that the temperature data of the different monitoring points in the hair cap are obtained.

[0070] The laser current sensor is arranged to monitor the driving current of the laser of the hair nourishing instrument in real time, and since the driving current can effectively reflect the change of the laser power, the driving current data collected is recorded as the laser power data.

[0071] Meanwhile, different monitoring points are uniformly arranged on the head of the treated person, the positions of the monitoring points are the same as the positions of the monitoring points where the temperature sensors are arranged in the hair cap, and conductivity sensors are arranged at the different monitoring points, the conductivity sensors are used to monitor the skin conductivity of the treated person in real time, so that the conductivity data of the different monitoring points on the head of the treated person are obtained.

[0072] The data acquisition module 100 synchronously collects data from various sensors at a fixed frequency, and the fixed frequency can be 1 time / second, and the collected monitoring data is stored in a local storage or a cloud server, so as to be analyzed and processed subsequently.

[0073] The accumulation determination module 200 is configured to determine the internal temperature accumulation at the current time based on the fluctuation of the temperature data and the laser power data in different monitoring periods during the operation process and the change trend of the conductivity data in different monitoring periods.

[0074] Specifically, effective management of power fluctuations can ensure the stability of laser output and avoid inconsistent treatment effects caused by uneven power. Stable laser power can provide uniform energy distribution, ensuring that each hair follicle receives sufficient and consistent stimulation, thereby improving hair growth effects. However, power fluctuations can cause a transient increase or decrease in heat, affecting the working load of the heat dissipation system. If the power suddenly increases, the heat dissipation system may not be able to adapt in time, causing the device temperature to rise accordingly. If the temperature rise rate is much higher than the power increase rate, it indicates that the heat dissipation system is insufficient to handle the heat, and the internal temperature rises rapidly due to the inability to remove excess heat in time, i.e., the device's heat dissipation pressure increases, and the device may face a thermal risk. At the same time, during the use of the semiconductor laser hair growth and hair loss treatment instrument, the scalp as the treatment area will absorb and emit heat to different degrees due to its structure and physiological state. When the conductivity of the scalp area rises and the heat dissipation pressure of the device increases as the treatment time increases, it indicates that the scalp area is highly sensitive to temperature. Further, when the degree of sensitivity of the scalp area to temperature continues to rise while the heat management pressure does not increase significantly during the treatment process, it indicates that the heat dissipation performance of the device is insufficient, and the internal temperature accumulation of the semiconductor laser hair growth and hair loss treatment instrument is strong. Therefore, timely temperature regulation response is needed to avoid overheating.

[0075] Therefore, by analyzing the fluctuation of the temperature data and the laser power data in different monitoring periods during the operation process of the hair growth instrument and the change trend of the conductivity data in different monitoring periods, the internal temperature accumulation at the current time can be determined. Further, the accumulation determination module 200 includes a pressure index determination unit 201, a conductivity index determination unit 202, and an accumulation determination unit 203, specifically:

[0076] The pressure index determination unit 201 is configured to determine the heat management pressure index in each monitoring period based on the fluctuation of the temperature data and the laser power data in each monitoring period during the operation process.

[0077] The change fluctuation of the temperature data and the laser power data in each monitoring period of the working process is analyzed. When the power fluctuation is large, the heat generated by the device in a short time will also change. Generally, when the power increases, the temperature should increase slowly accordingly. If the temperature increase rate is much higher than the power increase rate, it indicates that the heat dissipation system is insufficient in handling heat, and the corresponding heat management pressure index is large.

[0078] Further, the pressure index determination unit 201 is configured to:

[0079] First, in the driving current data in each monitoring period of the working process, the power instantaneous intensity in each monitoring period is determined based on the difference between the current values of any two monitoring times and the slope determined by the current values of all adjacent monitoring times.

[0080] Wherein, the power instantaneous intensity in each monitoring period is determined, including: in the driving current data in each monitoring period of the working process, determining the average value of the slope determined by the current values of all adjacent monitoring times, to obtain a first slope average; in the driving current data in each monitoring period of the working process, determining the absolute value of the difference between the current values of any two monitoring times; based on the first slope average and all the absolute value of the difference, the power instantaneous intensity in each monitoring period is determined.

[0081] In a specific example, the working process is segmented, and each set time length such as 5 minutes is taken as a monitoring period, so that a plurality of monitoring periods in the working process can be determined. In the segmentation process, the segmentation can be performed in the order of time from back to front, that is, the current time and the 5 minutes before it are taken as the first monitoring period, and the 5 minutes before the first monitoring period are taken as the second monitoring period, and so on. If the last monitoring period is less than 5 minutes, the last monitoring period is combined into the previous monitoring period.

[0082] For the driving current data in each monitoring period of the working process, any two adjacent data points form a slope, which is the ratio of the difference between the current values corresponding to the two data points to the time interval between the monitoring times corresponding to the two data points. The average value of all slopes is determined to obtain a first slope average, denoted as K . Further, based on the first slope average K and the absolute value of the difference between any two current values, the power instantaneous intensity of the hair care instrument in the monitoring period is calculated:

[0083] ,

[0084] In the formula, represents the power instantaneous intensity in the rth monitoring period; represents the absolute value of the first slope mean value corresponding to the driving current data in the rth monitoring period K . , respectively represent the current values at monitoring time o and monitoring time c in the driving current data in the rth monitoring period; i represents the group number of the current group composed of the current values at any two monitoring times in the driving current data in the rth monitoring period; n represents the number of current groups composed of the current values at any two monitoring times in the driving current data in the rth monitoring period.

[0085] In the above formula, when the driving current frequently fluctuates sharply in a short time with large rising and falling amplitudes in the current monitoring period, the value of the power instantaneous intensity is large, which indicates that the degree of laser power instantaneous fluctuation is high, and the laser may be in an unstable working state. Since the higher the laser power is, the more heat is generated, the sharp fluctuation of the current will cause the instantaneous instability of the laser power, and the power fluctuation will cause the instantaneous increase or decrease of heat, affecting the working load of the heat dissipation system. If the power suddenly increases, the heat dissipation system may not be able to adapt in time, resulting in an increase in the temperature of the equipment.

[0086] Secondly, in the temperature data of each monitoring point in each monitoring period during the working process, the temperature change rate of each monitoring point in each monitoring period is determined based on the time interval between the monitoring times corresponding to the adjacent extreme points and the slope determined by the temperature values of all adjacent monitoring times.

[0087] wherein the temperature change rate of each monitoring point in each monitoring period is determined, including: in the temperature data of each monitoring point in each monitoring period during the working process, determining the average value of the slope determined by the temperature values of all adjacent monitoring times to obtain a second slope mean value; based on the second slope mean value and the negative correlation mapping value of the time interval between the monitoring times corresponding to all two adjacent extreme points in the temperature data of each monitoring point in each monitoring period during the working process, determining the temperature change rate of each monitoring point in each monitoring period.

[0088] Temperature is an important factor affecting the efficacy of laser treatment. Suitable temperature can promote the metabolic activity of hair follicle cells and enhance the promoting effect of laser on hair regeneration. By analyzing the temperature change trend, overheating phenomenon can be found in time, and measures such as adjusting the heat dissipation design or reducing the output power can be taken to effectively prevent thermal damage.

[0089] In a specific example, for each temperature data of each monitoring point in each monitoring period during the working process, the time point corresponding to each temperature value is denoted as t, a slope is formed between any two adjacent data points, the slope is the ratio of the difference between the current value and the previous value corresponding to the two data points and the time interval between the monitoring time points corresponding to the two data points, the average value of all slopes is determined to obtain a second slope average value denoted as k , and then the temperature change rate of each monitoring point in each monitoring period is calculated as

[0090] ,

[0091] In the formula, denotes the temperature change rate of the u-th monitoring point in the r-th monitoring period; denotes the absolute value of the second slope average value corresponding to the temperature data of the u-th monitoring point in the r-th monitoring period k . , denote the monitoring time corresponding to the v-th extreme point and the v+1-th extreme point in the temperature data of the u-th monitoring point in the r-th monitoring period, respectively; m denotes the total number of extreme points in the temperature data of the u-th monitoring point in the r-th monitoring period.

[0092] In the above formula, if the temperature change rate in the cap is high in the monitoring period, the value of the temperature change rate is large, and the high temperature change rate may be related to the change of the laser output power. If the laser output power fluctuates significantly during the working process, it may cause the temperature in the cap to rise or fall rapidly, and the large temperature change rate may imply that the internal heat accumulation is fast.

[0093] Finally, based on the power instantaneous intensity in each monitoring period and the temperature change rate of different monitoring points, the thermal management pressure index in each monitoring period is determined.

[0094] The insufficient heat capacity of the internal material of the cap may cause the temperature to change rapidly in a short time, especially in the case of large power fluctuation, the heat cannot be effectively absorbed and relieved, further increasing the thermal load of the equipment, thereby causing large thermal management pressure.

[0095] In a specific example, based on the power instantaneous intensity in each monitoring period and the temperature change rate of different monitoring points, the thermal management pressure index in each monitoring period is determined as

[0096] ,

[0097] In the formula, a thermal management pressure index in the rth monitoring period; a power instantaneous intensity in the rth monitoring period; a temperature change rate of the u-th monitoring point in the rth monitoring period; N represents the total number of monitoring points in the hair growth cap.

[0098] In the above formula, when the power instantaneous intensity and the temperature change rate of each monitoring point are large, it indicates that the heat dissipation pressure in the current monitoring period is greater, and the thermal management pressure index of the hair growth hair growth device is larger.

[0099] The pressure index determination unit 201 can accurately determine the thermal management pressure index in each monitoring period by analyzing the change fluctuations of the temperature data and the laser power data in each monitoring period during operation. The thermal management pressure index reflects the effectiveness of the heat dissipation capability of the hair growth cap during operation, and also provides real-time feedback, which helps to identify possible thermal load problems of the device.

[0100] The conductivity index determination unit 202 is configured to determine a thermal sensitive conductivity index in each monitoring period based on the thermal management pressure index and the change trend of the conductivity data in each monitoring period during operation.

[0101] During the use of the semiconductor laser hair growth hair growth device, the scalp will absorb and dissipate the heat emitted by the hair growth device to different degrees. If the conductivity of the scalp treatment area increases with the increase of treatment time, and the heat dissipation pressure of the device is high, i.e. the thermal management pressure index is large, it indicates that the sensitivity of the scalp area to temperature change is high, and the thermal sensitive conductivity index of the scalp treatment area is large.

[0102] Further, the conductivity index determination unit 202 is configured to:

[0103] First, based on the thermal management pressure index and the difference between the conductivities of adjacent monitoring moments in the conductivity data of each monitoring point in each monitoring period during operation, a sub-thermal sensitive conductivity index of each monitoring point in each monitoring period is determined.

[0104] In a specific example, the conductivity data of each monitoring point in each monitoring period during operation is obtained, and then based on the thermal management pressure index and the difference between the conductivities of adjacent monitoring moments in the conductivity data, a sub-thermal sensitive conductivity index of each monitoring point in each monitoring period is determined.

[0105] ,

[0106] In the formula, This represents the thermal conductivity index of the u-th monitoring point within the r-th monitoring period. This represents the thermal management pressure index during the r-th monitoring period; , Let V represent the conductivity at the v-th monitoring time and the conductivity at the v+1-th monitoring time in the conductivity data of the u-th monitoring point within the r-th monitoring period, respectively. M This represents the total number of monitoring moments within the r-th monitoring period.

[0107] In the above formula, a higher value of the thermal conductivity index indicates that the conductivity of the scalp area at the corresponding monitoring point is more sensitive to temperature changes. This may mean that the temperature of the scalp area rises rapidly during operation. If the temperature continues to rise during operation, it may mean that the heat accumulation in the scalp area exceeds the heat dissipation capacity of the device, resulting in an excessively high scalp temperature and thus affecting the heat dissipation effect.

[0108] Secondly, based on the distribution level of the sub-thermal conductivity index of all monitoring points in each monitoring period, the thermal conductivity index in each monitoring period is determined.

[0109] In a specific example, in order to assess the sensitivity of the conductivity of the entire scalp area of ​​the patient to temperature changes, the average value of the sub-thermal conductivity index of all monitoring points in each monitoring period is determined and used as the thermal conductivity index in each monitoring period.

[0110] The aforementioned conductivity index determination unit 202 accurately determines the thermally sensitive conductivity index for each monitoring period based on the thermal management stress index and combined with the difference in conductivity between adjacent monitoring times in the conductivity data of each monitoring point during each monitoring period in the working process. This index is used to reflect the sensitivity of the patient's scalp to temperature changes.

[0111] The accumulation determination unit 203 is used to determine the internal temperature accumulation at the current moment based on the changes and fluctuations of the thermal management pressure index during different monitoring periods in the operation process and the relationship between the thermal management pressure index and the thermally sensitive conductivity index during different monitoring periods.

[0112] The change of the thermal management pressure index and the thermal sensitive conductivity index in different monitoring periods is analyzed. In normal condition, with the extension of the treatment time, if the thermal sensitive conductivity index starts to rise, it indicates that the response of the scalp conductivity to the temperature change is enhanced, which means that the scalp temperature is increasing. At this time, the thermal management pressure index may also show an upward trend, because the increase of the scalp temperature usually increases the heat dissipation pressure, and the device needs more energy to maintain normal work. If the thermal sensitive conductivity index continues to rise while the thermal management pressure index does not show a significant upward trend, it indicates that the heat dissipation performance of the device is insufficient, and the internal temperature of the device accumulates to a high degree.

[0113] Further, the accumulative determination unit 203 is configured to:

[0114] Firstly, the thermal management pressure index in all monitoring periods is normalized to obtain a first normalized value.

[0115] In a specific example, the thermal management pressure index in all monitoring periods is linearly normalized, such as using the maximum and minimum value normalization algorithm to normalize the thermal management pressure index in all monitoring periods, and the obtained normalized value is recorded as the first normalized value.

[0116] Secondly, the thermal sensitive conductivity index in all monitoring periods is normalized to obtain a second normalized value.

[0117] In a specific example, the thermal sensitive conductivity index in all monitoring periods is also linearly normalized, such as using the maximum and minimum value normalization algorithm to normalize the thermal sensitive conductivity index in all monitoring periods, and the obtained normalized value is recorded as the second normalized value.

[0118] Finally, based on the change correlation index between the first normalized value and the second normalized value in all monitoring periods, and the slope determined by the first normalized value in all adjacent monitoring periods, the internal temperature accumulation at the current time is determined.

[0119] In a specific example, the mean square error between the first normalized value and the second normalized value in all monitoring periods is determined, and the mean square error is determined as the change correlation index, which reflects the change relationship between the thermal management pressure index and the thermal sensitive conductivity index in different monitoring periods. At the same time, the first normalized value in any two adjacent monitoring periods forms a slope, which is the difference between the next first normalized value and the previous first normalized value, and the ratio of the time length between the center monitoring time of the two monitoring periods. The average of all slopes is determined as the third slope average and recorded as . Thus, based on the change correlation index and the third slope average determining the internal temperature accumulation at the current time point:

[0120] ,

[0121] wherein, represents the change correlation index between the first normalized value and the second normalized value in all monitoring time periods, p represents the sequence composed of the second normalized value in all monitoring time periods, q represents the sequence composed of the first normalized value in all monitoring time periods, MSE represents the mean square error function of taking p and q ; represents the average value of the slope determined by the first normalized value in all adjacent monitoring time periods, i.e. the third slope average.

[0122] In the above formula, the greater the value of the change correlation index and the smaller the value of the third slope average (the value of is greater than 0), the poorer the correlation between the thermal management pressure index and the heat-sensitive conductivity index, indicating that the heat-sensitive conductivity index continues to rise while the thermal management pressure index does not rise significantly, the heat dissipation performance of the device is insufficient, and the internal temperature accumulation of the semiconductor laser hair growth and hair growth instrument is strong. At this time, the temperature of the device needs to be adjusted in time to enhance the heat dissipation capacity to prevent overheating.

[0123] The accumulation determination module 200 determines the thermal management pressure index in each monitoring time period in the working process by analyzing the change fluctuation of the temperature data and the laser power data in each monitoring time period, and then analyzes the change trend of the conductivity data in each monitoring time period according to the thermal management pressure index, determines the heat-sensitive conductivity index in each monitoring time period, and finally analyzes the change fluctuation of the thermal management pressure index in different monitoring time periods and the change relationship between the thermal management pressure index and the heat-sensitive conductivity index in different monitoring time periods, thereby accurately identifying the internal temperature accumulation at the current time point.

[0124] The delay determination module 300 is used to determine the thermal response delay index at the current time point based on the descending change synchronism of the temperature data and the laser power data in different monitoring time periods in the working process.

[0125] Specifically, in the optimization of the heat dissipation performance of the semiconductor laser hair growth hair growth hair growth instrument in the dynamic scalp treatment process by analyzing the internal temperature accumulation at the current time based on the fluctuation of the thermal management pressure index in different monitoring periods and the change relationship between the thermal management pressure index and the thermal sensitive conductivity index in different monitoring periods, in order to ensure that the equipment can quickly respond to the temperature change of the scalp, the descending change synchronization of the temperature data and the laser power data in different monitoring periods also needs to be analyzed to achieve the best temperature control effect.

[0126] Under normal circumstances, the temperature in the hair growth cap should be synchronized with the change of laser power. If the temperature continues to rise after the power is adjusted down, it means that the heat dissipation system has failed to adjust in time to adapt to the change of power, the time delay of scalp temperature relative to the change of laser output power is high, and the heat dissipation efficiency is low. At this time, the heat dissipation system in the hair growth cap needs to be adjusted to quickly affect the change of scalp temperature, and ensure the temperature adjustment effect.

[0127] Therefore, by analyzing the change synchronization of the temperature data and the laser power data in different monitoring periods during the working process, the thermal response delay index at the current time can be determined. Further, the delay determination module 300 includes a temperature normalization unit 301, a current normalization unit 302, a current negative slope determination unit 303, a temperature target slope determination unit 304, and a delay determination unit 305. Specifically:

[0128] The temperature normalization unit 301 is configured to normalize the temperature value of each monitoring time in the temperature data of different monitoring points to obtain a temperature normalized value.

[0129] In order to facilitate comparison, the driving current data and the temperature data of different monitoring points are mapped into the same coordinate system. In a specific example, for any monitoring point in the hair growth cap, the maximum and minimum value normalization algorithm is used to linearly normalize the temperature value of all monitoring times in the temperature data during the working process of the hair growth instrument, and the obtained normalized value is recorded as the temperature normalized value.

[0130] The current normalization unit 302 is configured to normalize the current value of each monitoring time in the driving current data to obtain a current normalized value.

[0131] In a specific example, correspondingly, for the driving current data during the working process of the hair growth instrument, the maximum and minimum value normalization algorithm is used to linearly normalize the current value of each monitoring time in the driving current data, and the obtained normalized value is recorded as the current normalized value.

[0132] The current negative slope determination unit 303 is configured to determine a negative slope among slopes determined by the current normalized values of all adjacent monitoring time points in the working process.

[0133] In a specific example, for the current normalized value data corresponding to the driving current data in the working process of the hair growth device, a slope is formed between any two adjacent data points, which is the ratio of the difference between the latter current normalized value and the former current normalized value corresponding to the two data points to the time interval between the monitoring time points corresponding to the two data points. The slope is denoted as When the slope is positive, it indicates that the power of the device is rising, and when the slope is negative, it indicates that the power of the hair growth device is being adjusted downward. All negative slopes are screened and marked as negative slopes.

[0134] The temperature target slope determination unit 304 is configured to determine a target slope matched with the negative slope among slopes determined by the temperature normalized values of all adjacent monitoring time points in the working process of each monitoring point.

[0135] In a specific example, for the temperature normalized value data corresponding to the temperature data of each monitoring point in the working process of the hair growth device, a slope is formed between any two adjacent data points, which is the ratio of the difference between the latter temperature normalized value and the former temperature normalized value corresponding to the two data points to the time interval between the monitoring time points corresponding to the two data points. The slope is denoted as For each negative slope in the driving current data , the slope of the two monitoring time points corresponding to the negative slope is taken as the target slope matched with the negative slope .

[0136] The delay determination unit 305 is configured to determine a thermal response delay index at the current time based on the difference between the negative slope and the target slope of different monitoring points in the hair growth cap in the working process.

[0137] In a specific example, based on the difference between the negative slope and the target slope of different monitoring points in the hair growth cap in the working process of the hair growth device, the time delay characteristics of the change of the scalp temperature relative to the laser output power in the laser working process are quantified, and a thermal response delay index at the current time is determined:

[0138] ,

[0139] In the formula, represents the thermal response delay index at the current time; ​This represents the average difference between the slopes of all negative values ​​at the u-th monitoring point inside the hair growth cap and its target slope during the operation of the hair growth device. , , Let represent the slope of the b-th negative value at the u-th monitoring point inside the hair growth cap during the operation of the hair growth device, and its target slope, respectively. B This represents the total number of negative slope values ​​at the u-th monitoring point inside the hair growth cap during the operation of the hair growth device. N This indicates the total number of monitoring points inside the hair growth cap.

[0140] In the above formula, the average difference The larger the value, the stronger the temperature hysteresis effect in the monitoring area of ​​the corresponding monitoring point. The thermal response delay index at the current moment is obtained by calculating the average of the average differences among all monitoring points in the hair growth cap. Thermal response delay index The larger the value, the greater the lag in the scalp's response to the heat generated by laser irradiation during the hair growth, hair strengthening, and hair care process.

[0141] The aforementioned delay determination module 300 determines the negative slope of the slope by determining the normalized current value of all adjacent monitoring times during the operation of the hair care device, and based on the difference between the negative slope of different monitoring points and its target slope, it can accurately determine the thermal response delay index at the current moment.

[0142] The demand determination module 400 is used to determine the temperature control demand at the current moment based on the internal temperature accumulation and thermal response delay index.

[0143] Specifically, based on the internal temperature accumulation and thermal response delay index at the current moment, the temperature control requirements at the current moment are determined in real time, so as to make more precise adjustments to the heat dissipation system of the hair care device.

[0144] Therefore, based on the internal temperature accumulation and thermal response delay index, the temperature control requirement at the current moment can be determined. Furthermore, the requirement determination module 400 includes an accumulation normalization unit 401, a delay index normalization unit 402, and a requirement determination unit 403, specifically:

[0145] The cumulative normalization unit 401 is used to normalize the internal temperature accumulation to obtain a third normalized value.

[0146] In a specific example, the maximum-minimum normalization algorithm is used to calculate the cumulative internal temperature at the current moment. R After normalization, a third normalized value is obtained and denoted as . .

[0147] The delay index normalization unit 402 is configured to normalize the thermal response delay index to obtain a fourth normalized value.

[0148] In a specific example, the thermal response delay index at the current time is normalized by using a max-min value normalization algorithm to obtain a fourth normalized value, denoted as .

[0149] The demand determination unit 403 is configured to determine the sum of the third normalized value and the fourth normalized value as the temperature regulation demand at the current time.

[0150] By integrating the normalized values corresponding to the internal temperature accumulation and the thermal response delay index, the temperature regulation demand at the current time is determined in real time, and there is ; in the formula, represents the temperature regulation demand at the current time, , and the value range of is (0, 2). The greater the value of the temperature regulation demand , the higher the adjustment demand of the device on the heat dissipation performance.

[0151] The demand determination module 400 determines the temperature regulation demand in real time by normalizing the internal temperature accumulation and the thermal response delay index and adding the normalized values.

[0152] The adjustment control module 500 is configured to adjust the control parameter in the heat dissipation controller of the hair care instrument based on the temperature regulation demand, and control the heat dissipation system of the hair care instrument based on the adjusted control parameter in the heat dissipation controller.

[0153] Specifically, the heat dissipation system of the hair care instrument usually adopts forced air cooling for heat dissipation, and the core heat dissipation component of the heat dissipation system includes a heat dissipation fan. The heat dissipation controller of the heat dissipation system adjusts the rotation speed of the heat dissipation fan in the heat dissipation system by using PID control to realize temperature adjustment in the hair growth cap. The proportional gain coefficient P in the PID control of the heat dissipation controller is an important control parameter, which determines the temperature response speed of the heat dissipation system. In order to enable the heat dissipation system in the hair growth cap to respond to the temperature change in the scalp treatment area and the power fluctuation in time, the proportional gain coefficient P in the PID control of the heat dissipation controller can be adjusted in real time by using the real-time determined temperature regulation demand.

[0154] ​Therefore, based on the temperature regulation requirement, the control parameter in the heat dissipation controller of the hair growing instrument can be adjusted, and the heat dissipation system of the hair growing instrument is controlled based on the adjusted control parameter in the heat dissipation controller. Further, the control parameter in the heat dissipation controller includes a proportional gain coefficient in the heat dissipation system PID control, the adjustment control module 500 includes a parameter adjustment unit 501 and a control unit 502, and specifically:

[0155] The parameter adjustment unit 501 is configured to determine the product of the temperature regulation requirement and the proportional gain coefficient in the heat dissipation system PID control as the adjusted proportional gain coefficient, so as to obtain the adjusted control parameter in the heat dissipation controller.

[0156] In a specific example, the temperature regulation requirement at the current time is calculated as follows: The product of the temperature regulation requirement and the proportional gain coefficient in the heat dissipation system PID control (the original value of the proportional gain coefficient in the existing PID control) is calculated, and the product is taken as the adjusted proportional gain coefficient , that is, the adaptive proportional gain coefficient . Thus, the adjusted control parameter in the heat dissipation controller can be obtained.

[0157] The control unit 502 is configured to control the rotation speed of the heat dissipation fan in the heat dissipation system of the hair growing instrument based on the adjusted control parameter in the heat dissipation controller.

[0158] In a specific example, the heat dissipation system of the hair growing instrument is controlled based on the control parameter in the heat dissipation system PID control of the hair growing instrument including the adjusted proportional gain coefficient , so as to adjust the rotation speed of the heat dissipation fan, so as to ensure that the heat dissipation performance timely responds to the power fluctuation and temperature overheating in the hair growing treatment process, ensures the treatment effect, and reduces the energy consumption in the use process of the equipment. Since the rotation speed of the heat dissipation fan in the heat dissipation system of the hair growing instrument is controlled and adjusted based on the control parameter in the heat dissipation system PID control of the hair growing instrument, the specific implementation process of the control and adjustment belongs to the prior art, and will not be described here.

[0159] Based on the same inventive concept, the embodiment of the present application also provides a temperature control method for a semiconductor laser hair growing instrument, as shown in Figure 2 , the method comprises:

[0160] Collecting monitoring data in the working process of the hair growing instrument, the monitoring data at least including temperature data of different monitoring points in the hair growing cap, electrical conductivity data of different monitoring points on the head of the treatment person, and laser power data;

[0161] determine the internal temperature accumulation at the current moment based on the change fluctuation of the temperature data and the laser power data in different monitoring periods during the working process, and the change trend of the conductivity data in different monitoring periods;

[0162] determine the thermal response delay index at the current moment based on the change synchronism of the temperature data and the laser power data in different monitoring periods during the working process;

[0163] determine the temperature regulation requirement at the current moment based on the internal temperature accumulation and the thermal response delay index;

[0164] adjust the control parameters in the heat dissipation controller of the hair care instrument based on the temperature regulation requirement, and control the heat dissipation system of the hair care instrument based on the adjusted control parameters in the heat dissipation controller.

[0165] Based on the same inventive concept, the embodiment of the present application also provides a temperature control device for a semiconductor laser hair growth and hair fixing hair care instrument, which comprises a memory, a processor and computer program code stored in the memory and running on the processor, wherein when the processor executes the computer program code, the system can execute the steps realized by each module of any one of the semiconductor laser hair growth and hair fixing hair care instruments introduced above.

[0166] The embodiment of the present application can divide the functional modules of the system according to the above-mentioned method examples, for example, each functional module can be corresponding, or two or more functions can be integrated in one processing module, and the integrated module can be realized in the form of hardware. It should be noted that the division of modules in the embodiment is illustrative, and is only a logical function division, and another division mode can be used in actual implementation.

[0167] Based on the same inventive concept, the embodiment of the present application also provides a computer program product, which comprises computer program code, when the computer program code runs on a computer, the computer executes the steps realized by each module of any one of the semiconductor laser hair growth and hair fixing hair care instruments introduced above.

[0168] Based on the same inventive concept, the embodiment of the present application also provides a computer readable storage medium, which stores computer program code, when the computer program code runs on a computer, the computer executes the steps realized by each module of any one of the semiconductor laser hair growth and hair fixing hair care instruments introduced above.

[0169] It should be noted that the above-described embodiments are only used to illustrate the technical solutions of the present application, rather than limit them; although the foregoing embodiments of the present application have been described in detail, those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can be modified, or some technical features can be replaced by equivalent ones; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and should be included in the protection scope of the present application.

Claims

1. A semiconductor laser hair growth and strengthening device, characterized in that, The hair care device includes: The data acquisition module is used to collect monitoring data during the operation of the hair growth device. The monitoring data includes at least temperature data at different monitoring points inside the hair growth cap, electrical conductivity data at different monitoring points on the patient's head, and laser power data. The accumulation determination module is used to determine the internal temperature accumulation at the current moment based on the changes and fluctuations of the temperature data and the laser power data during different monitoring periods in the operation process, as well as the changing trend of the conductivity data during different monitoring periods. The delay determination module is used to determine the thermal response delay index at the current moment based on the synchronicity of the changes in the temperature data and laser power data during different monitoring periods in the operation process. The demand determination module is used to determine the temperature control demand at the current moment based on the internal temperature accumulation and thermal response delay index. The adjustment control module is used to adjust the control parameters in the heat dissipation controller of the hair care device based on the temperature regulation requirements, and to control the heat dissipation system of the hair care device based on the adjusted control parameters in the heat dissipation controller.

2. The semiconductor laser hair growth and strengthening device according to claim 1, characterized in that, The cumulative determination module includes: The pressure index determination unit is used to determine the thermal management pressure index for each monitoring period based on the changes and fluctuations of the temperature data and laser power data during each monitoring period in the operation process; The conductivity index determination unit is used to determine the heat-sensitive conductivity index for each monitoring period based on the thermal management pressure index and the changing trend of conductivity data during each monitoring period in the operation process; The accumulation determination unit is used to determine the internal temperature accumulation at the current moment based on the changes and fluctuations of the thermal management pressure index during different monitoring periods in the operation process, as well as the relationship between the thermal management pressure index and the thermally sensitive conductivity index during different monitoring periods.

3. The semiconductor laser hair growth and strengthening device according to claim 2, characterized in that, The laser power data is driving current data, and the pressure index determination unit is configured as follows: In the driving current data during each monitoring period during operation, the instantaneous power intensity during each monitoring period is determined based on the slope determined by the difference between the current values ​​at any two monitoring times and the current values ​​at all adjacent monitoring times. In the temperature data of each monitoring point during each monitoring period during the working process, the rate of temperature change of each monitoring point during each monitoring period is determined based on the time interval between the monitoring times corresponding to adjacent extreme points and the slope determined by the temperature values ​​of all adjacent monitoring times. Based on the instantaneous power intensity and the rate of temperature change at different monitoring points during each monitoring period, the thermal management pressure index for each monitoring period is determined.

4. The semiconductor laser hair growth and strengthening device according to claim 3, characterized in that, Determine the instantaneous power intensity within each monitoring period, including: In the driving current data during each monitoring period of the operation, the average slope determined by the current values ​​at all adjacent monitoring times is obtained to obtain the first average slope value; In the driving current data during each monitoring period of the operation, determine the absolute value of the difference between the current values ​​at any two monitoring times; Based on the first slope mean and the absolute values ​​of all the differences, the instantaneous power intensity within each monitoring period is determined.

5. A semiconductor laser hair growth and strengthening device according to claim 3, characterized in that, Determine the rate of temperature change at each monitoring point within each monitoring period, including: In the temperature data of each monitoring point during each monitoring period during the working process, the average slope of the temperature values ​​at all adjacent monitoring times is determined to obtain the second average slope value; Based on the second slope mean and the negative correlation mapping value of the time interval between all two adjacent extreme points corresponding to the monitoring time in the temperature data of each monitoring point in each monitoring period during the operation, the temperature change rate of each monitoring point in each monitoring period is determined.

6. A semiconductor laser hair growth and strengthening device according to claim 2, characterized in that, The conductivity index determination unit is configured as follows: Based on the thermal management pressure index and the difference in conductivity between adjacent monitoring times in the conductivity data of each monitoring point during each monitoring period in the operation process, the sub-thermal sensitive conductivity index of each monitoring point in each monitoring period is determined. The thermal conductivity index for each monitoring period is determined based on the distribution level of the sub-thermal conductivity index of all monitoring points within each monitoring period.

7. A semiconductor laser hair growth and strengthening device according to claim 2, characterized in that, The cumulative determination unit is configured as follows: The thermal management pressure index for all monitoring periods was normalized to obtain the first normalized value; The thermally sensitive conductivity index was normalized for all monitoring periods to obtain a second normalized value. Based on the correlation index between the first normalized value and the second normalized value over all monitoring periods, and the slope determined by the first normalized value over all adjacent monitoring periods, the internal temperature accumulation at the current moment is determined.

8. A semiconductor laser hair growth and strengthening device according to claim 1, characterized in that, The laser power data is drive current data, and the delay determination module includes: The temperature normalization unit is used to normalize the temperature values ​​at each monitoring time in the temperature data of different monitoring points to obtain the normalized temperature value. The current normalization unit is used to normalize the current value at each monitoring moment in the drive current data to obtain the current normalization value. The negative slope determination unit is used to determine the negative slope among the slopes determined by the normalized current values ​​at all adjacent monitoring times during the operation. A temperature target slope determination unit is used to determine the target slope that matches the negative slope among the slopes determined by the normalized temperature values ​​of all adjacent monitoring times at each monitoring point during the operation process. The delay determination unit is used to determine the thermal response delay index at the current moment based on the difference between the negative slope and the target slope of different monitoring points inside the hair growth cap during the working process.

9. A semiconductor laser hair growth and strengthening device according to claim 1, characterized in that, The requirement determination module includes: An accumulation normalization unit is used to normalize the internal temperature accumulation to obtain a third normalized value; The delay index normalization unit is used to normalize the thermal response delay index to obtain a fourth normalized value. The demand determination unit is used to determine the sum of the third normalized value and the fourth normalized value, and to use the sum as the temperature control demand at the current moment.

10. A semiconductor laser hair growth and strengthening device according to claim 1, characterized in that, The control parameters in the heat dissipation controller include the proportional gain coefficient in the PID control of the heat dissipation system, and the adjustment control module includes: The parameter adjustment unit is used to determine the product of the temperature control requirement and the proportional gain coefficient in the PID control of the heat dissipation system as the adjusted proportional gain coefficient, thereby obtaining the adjusted control parameters in the heat dissipation controller. The control unit is used to control the speed of the cooling fan in the cooling system of the hair care device based on the control parameters adjusted in the heat dissipation controller.

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