Surface treatment system for processing semiconductor glass substrate

Abstract

The invention is applicable to the technical field of conveying and cleaning, and provides a surface treatment system for semiconductor glass substrate processing, which comprises two conveyors which are axially symmetrically arranged, a turn-over assembly is erected between the two conveyors, the turn-over assembly comprises an erecting piece, a first adsorption piece is rotatably matched on the erecting piece, and a second adsorption piece is rotatably matched on the erecting piece. The surface treatment system for processing the semiconductor glass substrate solves the problems that when an existing surface treatment system for processing the semiconductor glass substrate is used for cleaning the semiconductor glass substrate, the upper surface and the lower surface of the semiconductor glass substrate need to be cleaned independently; the upper surface and the lower surface of the semiconductor glass substrate cannot be cleaned in sequence in the conveying and processing process, and the cleaning efficiency of the semiconductor glass substrate is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of conveying and cleaning, more particularly, it relates to a surface treatment system for semiconductor glass substrate processing. BACKGROUND

[0002] The semiconductor glass substrate refers to the basic material for growing and manufacturing semiconductor devices, and is one of the most important components in the semiconductor industry. It carries the key functions of the entire electronic product and is the support platform for manufacturing semiconductor chips and other electronic components. It is easy to be contaminated during production transmission, so a treatment device is needed to clean the upper and lower surfaces of the substrate to remove dust and particles and other impurities on the upper and lower surfaces of the substrate.

[0003] At present, the surface treatment system for semiconductor glass substrate processing on the market has the following problems when processing and cleaning the upper and lower surfaces of the semiconductor glass substrate:

[0004] The existing surface treatment system for semiconductor glass substrate processing needs to clean the upper and lower surfaces of the semiconductor glass substrate separately when cleaning the semiconductor glass substrate, and cannot clean the upper and lower surfaces of the semiconductor glass substrate in turn during the transmission and processing process, which reduces the cleaning efficiency of the semiconductor glass substrate. SUMMARY

[0005] In view of the deficiencies of the prior art, the purpose of the present application is to provide a surface treatment system for semiconductor glass substrate processing which can combine the first vacuum part and the second vacuum part to adsorb and position the semiconductor glass substrate, and perform position changing and surface turning operation on the semiconductor glass substrate during transmission. During the whole process, the upper and lower surfaces of the semiconductor glass substrate can be cleaned only by transmission, without the need for separate cleaning operation on the upper and lower surfaces of the semiconductor glass substrate later, thereby improving the processing effect of the semiconductor glass substrate.

[0006] To achieve the above purpose, the present application provides the following technical scheme:

[0007] A surface treatment system for semiconductor glass substrate processing, comprising two conveyors arranged symmetrically about the axis, a surface turning assembly is arranged between the two conveyors, the surface turning assembly comprises a mounting member, a first suction accessory is rotatably connected to the mounting member, a second suction accessory is rotatably connected to the mounting member, and the first suction accessory and the second suction accessory are engaged with each other.

[0008] The mounting member comprises a I-shaped downward plate, two symmetrical rotating holes are formed in the side of the I-shaped downward plate near the bottom, and two symmetrical shifting rods are fixed to the side of the I-shaped downward plate above the two rotating holes.

[0009] The first suction accessory comprises a first rotating plate, a first sliding groove is arranged through the side of the first rotating plate and slidably connected with a first rotating lever, a first horizontal plate is rotatably connected with one side of the first rotating plate, a first gear is rotatably connected with one side of the first horizontal plate, a first U-shaped plate is fixed with the other side of the first horizontal plate, and a first vacuum device is rotatably connected with one outer side of the first U-shaped plate.

[0010] The second suction accessory comprises a second rotating plate, a second sliding groove is arranged through the side of the second rotating plate and slidably connected with a second rotating lever, a second horizontal plate is rotatably connected with the side of the second rotating plate, a second gear is rotatably connected with one side of the second horizontal plate, the second gear is engaged with the first gear, a second U-shaped plate is fixed with the other side of the second horizontal plate, and a second vacuum device is rotatably connected with one outer side of the second U-shaped plate.

[0011] The top plate is further provided with a top plate, and the top plate is fixed with a mounting frame arranged between the two conveyors.

[0012] The bottom of the top plate is fixed with a first hinge seat, the inside of the first hinge seat is hingedly connected with a mounting seat, the bottom of the mounting seat is fixed with a hydraulic telescopic cylinder, the telescopic end of the hydraulic telescopic cylinder is fixed with a sleeve, the outer bottom of the sleeve is fixed with a baffle, the side of the baffle is fixed with a pin shaft, the circumferential side of the pin shaft is rotatably connected with a rotating plate, and the side of the rotating plate is fixed with a rectangular frame.

[0013] The first gear is further provided with a first rotating shaft rotatably connected in a rotating hole, the end of the first rotating shaft is fixed with a rotating disc, and the end of the rotating disc is fixed with a rectangular block clamped with the rectangular frame.

[0014] The second gear is further provided with a second rotating shaft rotatably connected in another rotating hole, and the end of the second rotating shaft is fixed with a limiting nut.

[0015] The two rotating levers are further provided with limiting round plates respectively fixed with the first rotating plate and the second rotating plate, and the circumferential sides of the two rotating levers are respectively fixed with limiting round rings respectively fixed with the other sides of the first rotating plate and the second rotating plate.

[0016] The first U-shaped plate is further provided with a first fixing cylinder, and the first U-shaped plate is further provided with a first motor fixed in the first fixing cylinder.

[0017] The first vacuum piece comprises a first rotating cylinder rotatably fitted on a first fixed cylinder, a first side plate fixedly connected with an output shaft of a first motor is arranged at an end of the first rotating cylinder, a first adsorption plate is fixedly arranged on a side surface of the first side plate, a plurality of first air extraction pipes are in communication with the top of the first adsorption plate, a first conical adsorption disc is arranged at an end of each of the first air extraction pipes, a first vacuum pump is fixedly arranged on the top of the first adsorption plate, and the first vacuum pump is in communication with the first air extraction pipes through a flow communication hose.

[0018] The second U-shaped plate is fixedly arranged on an outer side surface of the second fixed cylinder, and a second motor is fixedly arranged on an outer side surface of the second U-shaped plate and located inside the second fixed cylinder.

[0019] The second vacuum piece comprises a second rotating cylinder rotatably fitted on a second fixed cylinder, a second side plate fixedly connected with an output shaft of a second motor is arranged at an end of the second rotating cylinder, a second adsorption plate is fixedly arranged on a side surface of the second side plate, a plurality of second air extraction pipes are in communication with the top of the second adsorption plate, a second conical adsorption disc is arranged at an end of each of the second air extraction pipes, a second vacuum pump is fixedly arranged on the top of the second adsorption plate, and the second vacuum pump is in communication with the second air extraction pipes through a hose.

[0020] The conveyor comprises a mounting base, two groups of symmetrical side plates are fixedly arranged on the top of the mounting base, each group of the side plates comprises two side plates which are symmetrically arranged front and back, a conveying roller is rotatably fitted between each group of the side plates, a driving motor is fixedly arranged at an end of the conveying roller, and a conveying belt is drivingly connected between the two conveying rollers.

[0021] Two vertical baffle plates are fixedly arranged on the top of each group of the side plates, a trapezoidal limiting plate is fixedly arranged above the conveying belt on one side of each of the two vertical baffle plates, a mounting groove is formed in each of the two trapezoidal limiting plates, and a plurality of righting rollers are rotatably fitted in the mounting groove.

[0022] Support frames are arranged on both sides of the mounting base and located inside a region of the conveying belt, an equipment mounting frame is fixedly arranged above the conveying belt on the outer top of the support frame, and a surface treatment equipment is fixedly arranged on the inner top of the equipment mounting frame.

[0023] The present application has the following advantages: 1. The present application can realize the cleaning of the upper and lower surfaces of the semiconductor glass substrate through the transposition and turning over of the turning over assembly arranged between the two conveyors, the adsorption and positioning of the semiconductor glass substrate by the first vacuum piece and the second vacuum piece, and the transmission process, so that the cleaning of the upper and lower surfaces of the semiconductor glass substrate is realized, and the cleaning of the upper and lower surfaces of the semiconductor glass substrate is not required in the later stage, thereby improving the processing effect of the semiconductor glass substrate.

[0024] 2、The present application is characterized in that the semiconductor glass substrate to be processed is guided from the inclined part to the horizontal part of the two trapezoidal limiting plates during the conveying process of the semiconductor glass substrate to be processed on the conveying belt, and the semiconductor glass substrate to be processed is guided by the rotation of the guiding roller arranged in the installation slot, so that the deviation of the position of the semiconductor glass substrate to be processed during the surface cleaning process is avoided, and the subsequent processing process is affected. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 It is a structural schematic diagram of the surface treatment system for the semiconductor glass substrate processing of the present application.

[0026] Figure 2 It is a structural schematic diagram of the conveying machine of the present application.

[0027] Figure 3 It is a structural schematic diagram of the turnover assembly of the present application.

[0028] Figure 4 It is a side view of the turnover assembly of the present application.

[0029] Figure 5 It is a structural schematic diagram of the erecting piece of the present application.

[0030] Figure 6 It is a front view of the erecting piece of the present application.

[0031] Figure 7 It is a structural schematic diagram of the first suction accessory of the present application.

[0032] Figure 8 It is a top view of the first suction accessory of the present application.

[0033] Figure 9 It is a sectional structural schematic diagram of the first suction accessory of the present application.

[0034] Figure 10 It is a structural schematic diagram of the second suction accessory of the present application.

[0035] Figure 11 It is a sectional structural schematic diagram of the second suction accessory of the present application.

[0036] Figure 12 It is a front view of the present application Figure 11 .

[0037] In the figure: 1, conveyor; 2, turn over assembly; 3, erecting piece; 4, first suction accessory; 5, second suction accessory; 6, first vacuum piece; 7, second vacuum piece; 101, mounting bottom plate; 102, side panel; 103, conveying roller; 104, driving motor; 105, conveying belt; 106, vertical baffle; 107, trapezoidal limiting plate; 108, mounting groove; 109, righting roller; 110, support frame; 111, equipment mounting frame; 112, surface treatment equipment; 301, I-shaped downward extending plate; 302, rotating hole; 303, poking lever; 304, top plate; 305, mounting frame; 306, first hinged seat; 307, mounting seat; 308, hydraulic telescopic cylinder; 309, sleeve; 310, baffle; 311, pin shaft; 312, rotating plate; 313, rectangular frame; 314, limiting round plate; 315, limiting round ring; 401, first rotating plate; 402, first sliding groove; 403, first cross plate; 404, first gear; 405, first U-shaped plate; 406, first rotating shaft; 407, rotating disc; 408, rectangular block; 409, first fixing cylinder; 410, first motor; 501, second rotating plate; 502, second sliding groove; 503, second cross plate; 504, second gear; 505, second U-shaped plate; 506, second rotating shaft; 507, limiting nut; 508, second fixing cylinder; 509, second motor; 601, first rotating cylinder; 602, first side plate; 603, first adsorption plate; 604, first suction pipe; 605, first conical adsorption disc; 606, first vacuum pump; 701, second rotating cylinder; 702, second side plate; 703, second adsorption plate; 704, second suction pipe; 705, second conical adsorption disc; 706, second vacuum pump. DETAILED DESCRIPTION

[0038] It should be noted that the embodiments and features in the embodiments in the present application can be combined with each other without conflict. The present application will be described in detail below with reference to the drawings and in combination with the embodiments.

[0039] It should be noted that, unless otherwise specified, all the technical and scientific terms used in the present application have the same meaning as that generally understood by the ordinary skilled person in the technical field to which the present application belongs.

[0040] In the present application, unless otherwise specified, the orientation such as "upper", "lower" is generally directed to the direction shown in the drawings, or is directed to the vertical, perpendicular or gravity direction; similarly, for the convenience of understanding and description, "left", "right" is generally directed to the left and right shown in the drawings; "inner", "outer" refers to the inner and outer relative to the contour of each component itself, but the above orientation words are not used to limit the present application.

[0041] Embodiment one, please refer to Figures 1-12 The present application provides the following technical solutions:

[0042] The utility model provides a kind of surface treatment system for semiconductor glass substrate processing, specifically, including two conveyors 1 arranged axially symmetric, two conveyors 1 between erecting are provided with turnover assembly 2, turnover assembly 2 includes erecting piece 3, first suction accessory 4 is rotatably matched on erecting piece 3, second suction accessory 5 is rotatably matched on erecting piece 3, and first suction accessory 4 and second suction accessory 5 are engaged between;Erecting piece 3 includes I-shaped lower extension plate 301, two rotation holes 302 symmetrically being provided in the side of I-shaped lower extension plate 301 near bottom are penetrated, and two shift rods 303 symmetrically are fixed on the side of I-shaped lower extension plate 301 above two rotation holes 302;First suction accessory 4 includes first rotating plate 401, first sliding slot 402 being slidably fitted on a shift rod 303 is penetrated in the side of first rotating plate 401, first horizontal plate 403 is rotatably matched on the side of first rotating plate 401, first gear 404 being rotatably matched on the side of I-shaped lower extension plate 301 is fixed on the side of first horizontal plate 403, first U-shaped plate 405 is fixed on the side opposite to another side of first horizontal plate 403, and first vacuum piece 6 is rotatably matched on the outer side of first U-shaped plate 405;Second suction accessory 5 includes second rotating plate 501, second sliding slot 502 being slidably fitted on another shift rod 303 is penetrated in the side of second rotating plate 501, second horizontal plate 503 is rotatably matched on the side of second rotating plate 501, second gear 504 being engaged with first gear 404 is fixed on the side of second horizontal plate 503, second U-shaped plate 505 is fixed on the side opposite to another side of second horizontal plate 503, and second vacuum piece 7 is rotatably matched on the outer side of second U-shaped plate 505;

[0043] Further, the top of I-shaped lower extension plate 301 is fixed with top plate 304, and the side of top plate 304 is fixed with mounting frame 305 erected between two conveyors 1;The bottom of top plate 304 is fixed with first hinged seat 306, and mounting seat 307 is hingedly matched in first hinged seat 306, hydraulic telescopic cylinder 308 is fixed in the bottom of mounting seat 307, sleeve 309 is fixed in the telescopic end of hydraulic telescopic cylinder 308, baffle 310 is fixed in the outer bottom of sleeve 309, pin shaft 311 is fixed in the side of baffle 310, rotating plate 312 is rotatably matched in the circumferential side of pin shaft 311, and rectangular frame 313 is fixed in the side of rotating plate 312;The end of first gear 404 is fixed with first rotating shaft 406 rotatably matched in one rotation hole 302, rotating disc 407 is fixed in the end of first rotating shaft 406, and rectangular block 408 is fixed with rotating disc 407 and is fixed with rectangular frame 313;The end of second gear 504 is fixed with second rotating shaft 506 rotatably matched in another rotation hole 302, and limiting nut 507 is fixed in the end of second rotating shaft 506.

[0044] The specific application of this embodiment is: when the upper surface of the semiconductor glass substrate is cleaned after being transported and centered, the semiconductor glass substrate is transported on the surface of the conveyor 1 to below the first vacuum piece 6. At this time, the first vacuum piece 6 is started to adsorb and position the semiconductor glass substrate. After adsorption and positioning, the hydraulic telescopic cylinder 308 is started to drive the telescopic end of the hydraulic telescopic cylinder 308 to elongate, so that the mounting seat 307 that is hingedly connected in the first hinged seat 306 is synchronously hingedly deflected, thereby driving the rotating plate 312 that is rotatably connected around the side surface of the pin shaft 311 to be synchronously hingedly deflected downward, so that the rectangular block 408 that is clamped and fixed in the rectangular frame 313 is synchronously deflected downward, thereby driving the rotating disc 407 to be deflected, so that the first rotating shaft 406 is clockwise circumferentially rotated in the rotating hole 302, thereby driving the first gear 404 that is fixed at the end of the first rotating shaft 406 to be synchronously clockwise circumferentially rotated. When the first gear 404 that is fixed at the end of the first rotating shaft 406 is synchronously clockwise circumferentially rotated, the second gear 504 that is engaged with the first gear 404 is counterclockwise circumferentially rotated (here, clockwise and counterclockwise rotation is specifically viewed from the front of the entire device, and the front direction can be specifically referred to as the direction of the arrow in the drawings) Figure 4 ). Thus, the first horizontal plate 403 and the second horizontal plate 503 that are respectively fixedly connected to the ends of the first gear 404 and the second gear 504 are simultaneously deflected to move closer to each other. When the first horizontal plate 403 and the second horizontal plate 503 are simultaneously deflected to move closer to each other, the first horizontal plate 403 and the second horizontal plate 503 are stably moved closer to each other by the rotating connection of the first rotating plate 401 and the second rotating plate 501 on the first horizontal plate 403 and the second horizontal plate 503 and the sliding connection of the first sliding groove 402 and the second sliding groove 502 with the two shifting rods 303. When the first horizontal plate 403 and the second horizontal plate 503 are deflected from the horizontal position to the position perpendicular to the top plate 304, the elongation of the hydraulic telescopic cylinder 308 is completed. Thus, the semiconductor glass substrate is adsorbed and positioned by the first vacuum piece 6 and the second vacuum piece 7, and the semiconductor glass substrate is transposed and turned over during transportation. The upper and lower surfaces of the semiconductor glass substrate are cleaned during transportation, without the need for separate cleaning of the upper and lower surfaces of the semiconductor glass substrate, thereby improving the processing effect of the semiconductor glass substrate.

[0045] Embodiment two, please refer to Figures 1-12, the embodiment two is improved on the basis of the embodiment one, specifically, two end portions of the two stirring rods 303 are respectively fixed with the limiting round plates 314 which are mutually attached to the first rotating plate 401 and the second rotating plate 501, and the circumferential surfaces of the two stirring rods 303 are respectively fixed with the limiting round rings 315 which are mutually attached to the other side surfaces of the first rotating plate 401 and the second rotating plate 501; one outer side surface of the first U-shaped plate 405 is fixed with the first fixed cylinder 409, and one outer side surface of the first U-shaped plate 405 is fixed with the first motor 410 inside the first fixed cylinder 409; the first vacuum part 6 comprises the first rotating cylinder 601 which is rotatably matched in the first fixed cylinder 409, the first rotating cylinder 601 is fixed with the first side plate 602 which is fixedly connected with the output shaft of the first motor 410 at the end portion, the first side plate 602 is fixed with the first adsorption plate 603 at the side surface, the first adsorption plate 603 is fixed with the first vacuum pump 606 at the top portion, the first vacuum pump 606 is communicated with the first suction pipe 604 through the flow communication hose; one outer side surface of the second U-shaped plate 505 is fixed with the second fixed cylinder 508, and one outer side surface of the second U-shaped plate 505 is fixed with the second motor 509 inside the second fixed cylinder 508; the second vacuum part 7 comprises the second rotating cylinder 701 which is rotatably matched in the second fixed cylinder 508, the second rotating cylinder 701 is fixed with the second side plate 702 which is fixedly connected with the output shaft of the second motor 509 at the end portion, the second side plate 702 is fixed with the second adsorption plate 703 at the side surface, the second adsorption plate 703 is fixed with the second vacuum pump 706 at the top portion, and the second vacuum pump 706 is communicated with the second suction pipe 704 through the hose.

[0046] The specific application of the embodiment two is that when the upper surface of the semiconductor glass substrate is righted and cleaned in the transmission process, the semiconductor glass substrate with the upper surface processed is transmitted to below the turnover assembly 2 arranged between the two conveyors 1, then the semiconductor glass substrate with the upper surface processed on the conveyor 1 is exchanged and turned over by the turnover assembly 2, so that the semiconductor glass substrate with the upper surface processed is exchanged to the surface of the other conveyor 1, and the upper and lower surfaces of the semiconductor glass substrate are cleaned in this way.

[0047] The upper surface of the semiconductor glass substrate is positioned directly below the first vacuum element 6 in the turnover assembly 2 after the centering and cleaning in the transmission process is completed. At this time, the first vacuum pump 606 fixed to the top of the first suction plate 603 is started to enable the first vacuum pump 606 to simultaneously perform the suction operation on the first suction pipes 604 through the hoses, so that the first conical suction disc 605 connected to the end of the first suction pipes 604 can adsorb the semiconductor glass substrate with the upper surface cleaned, and then the turnover assembly 2 can lift and turn the semiconductor glass substrate adsorbed to complete the adsorption and positioning process of the semiconductor glass substrate with the upper surface cleaned by the first vacuum element 6, so that the first vacuum element 6 and the semiconductor glass substrate adsorbed gradually approach the side of the top plate 304 (while the first vacuum element 6 and the semiconductor glass substrate adsorbed gradually approach the side of the top plate 304, the second vacuum element 7 synchronously approaches the opposite side of the top plate 304, and when the first vacuum element 6 and the second vacuum element 7 are located below the top plate 304 at the same time, the turnover assembly 2 is about to complete the preparation work for the position change of the semiconductor glass substrate with the upper surface cleaned). Until the first vacuum element 6 and the second vacuum element 7 are located below the top plate 304 at the same time, the first motor 410 and the second motor 509 are started at the same time to drive the first side plate 602 and the second side plate 702 fixed to the output shafts to synchronously rotate towards each other (the angle of the first side plate 602 and the second side plate 702 synchronously rotating towards each other is 90°, and after completing the 90° rotation towards each other, the lower surface of the semiconductor glass substrate adsorbed and positioned on the first vacuum element 6 faces the adsorption end of the second vacuum element 7, and at this time, the semiconductor glass substrate and the top plate 304 are perpendicular to each other), and during the process of the first side plate 602 and the second side plate 702 synchronously rotating towards each other by 90°, the first rotating cylinder 601 and the second rotating cylinder 701 are circumferentially limited by the rotation cooperation between the first fixed cylinder 409 and the second fixed cylinder 508 to improve the stability during the rotation of the first vacuum element 6 and the second vacuum element 7 towards each other;

[0048] After the first vacuum component 6 and the second vacuum component 7 approach each other and rotate towards each other, the second conical adsorption disks 705 on the second vacuum component 7 will be in contact with the lower surface of the semiconductor glass substrate. At this time, the first vacuum pump 606 and the second vacuum pump 706 are started simultaneously, so that the second vacuum pump 706 performs a pumping operation on the second suction pipes 704 through the hose. This causes the second conical adsorption disks 705 connected to the ends of the second suction pipes 704 to adsorb the lower surface of the semiconductor glass substrate after the upper surface has been cleaned. While the second vacuum component 7 is adsorbing, the adsorption and positioning process of the first vacuum component 6 on the upper surface of the semiconductor glass substrate after the upper surface has been cleaned ends. At this time, the... The first motor 410 and the second motor 509 are started in reverse, driving the first vacuum component 6 and the second vacuum component 7 to rotate 90° relative to each other simultaneously until the first vacuum component 6 and the second vacuum component 7 are parallel to the top plate 304. Then, the first motor 410 and the second motor 509 are turned off. Subsequently, through the flipping action of the flipping component 2, the semiconductor glass substrate with the upper surface cleaned is transferred to the conveyor belt 105 of another conveyor 1 (when the semiconductor glass substrate with the upper surface cleaned is transferred to the conveyor belt 105 of another conveyor 1, the lower surface of the semiconductor glass substrate is facing upward on the conveyor belt 105 of another conveyor 1), so as to facilitate the subsequent transfer, straightening and cleaning operation of the lower surface of the semiconductor glass substrate.

[0049] Example 3, please refer to Figures 1-12 This third embodiment improves upon the first embodiment as follows: Specifically, the conveyor 1 includes a mounting base plate 101. Two sets of symmetrical side panels 102 are fixed to the top of the mounting base plate 101. Each set of side panels 102 comprises two panels, which are symmetrically arranged front and rear. A conveyor roller 103 is rotatably coupled between each set of side panels 102. A drive motor 104 is fixed to the end of one conveyor roller 103, and a conveyor belt 105 is drivingly connected between the two conveyor rollers 103. Two symmetrical vertical... Two vertical baffles 106 are fixed with trapezoidal limiting plates 107 on opposite sides above the conveyor belt 105. Each trapezoidal limiting plate 107 has an installation groove 108 on opposite sides. Several straightening rollers 109 are rotatably fitted inside the installation groove 108. Support frames 110 are provided on both sides of the mounting base plate 101 in the area inside the conveyor belt 105. An equipment mounting frame 111 is fixed on the top of the support frame 110 above the conveyor belt 105. A surface treatment device 112 is fixed on the top of the equipment mounting frame 111.

[0050] The specific application of this embodiment is: during the process of cleaning and processing the semiconductor glass substrate, the semiconductor glass substrate to be processed is placed on the upper surface of the conveying belt 105 by the mechanical arm. At this time, the driving motor 104 is started to drive the output fixed conveying roller 103 to rotate, so that the conveying belt 105 connected to the two conveying rollers 103 is uniformly driven in the horizontal direction, thereby synchronously driving the semiconductor glass substrate to be processed placed on the conveying belt 105 to be driven in the horizontal direction. When the semiconductor glass substrate to be processed is conveyed on the conveying belt 105, the semiconductor glass substrate to be processed starts to be conveyed from the surface of the conveying belt 105 into the two trapezoidal limiting plates 107. When the semiconductor glass substrate to be processed starts to be conveyed from the surface of the conveying belt 105 into the two trapezoidal limiting plates 107, the semiconductor glass substrate to be processed gradually enters the horizontal plane (the distance between the horizontal planes of the two trapezoidal limiting plates 107 is equal to or slightly greater than the length of the semiconductor glass substrate to be processed) from the inclined surface of the two trapezoidal limiting plates 107 arranged oppositely, and is in contact with the peripheral surface of the supporting roller 109 rotatingly arranged inside the mounting groove 108 at the same time. After the semiconductor glass substrate to be processed enters the horizontal plane from the inclined surface of the two trapezoidal limiting plates 107, it is processed and cleaned by the supporting operation of the semiconductor glass substrate to be processed before processing and cleaning through the rotation of the supporting roller 109 rotatingly arranged inside the mounting groove 108. After the supporting operation is completed, the semiconductor glass substrate to be processed enters the horizontal plane of the two trapezoidal limiting plates 107 arranged oppositely, and is sequentially contacted between the opposite two side surfaces of the semiconductor glass substrate to be processed after supporting by the supporting rollers 109 rotatingly arranged on the horizontal plane of the opposite side surface of the two trapezoidal limiting plates 107, thereby assisting the semiconductor glass substrate to be processed after supporting operation to enter the surface treatment equipment 112 fixed on the top of the equipment mounting frame 111, so as to clean the upper surface of the semiconductor glass substrate to be processed after supporting, avoid the position deviation during the later surface cleaning process of the semiconductor glass substrate to be processed, and further affect the later processing process.

[0051] After the upper surface of the semiconductor glass substrate to be processed is cleaned, the processed semiconductor glass substrate is transported out of the surface processing device 112 (the surface processing device 112 can use a known substrate cleaning mechanism, such as the cleaning mechanism disclosed in the granted Chinese invention patent CN119008500B (invention title: “Semiconductor substrate cleaning device and method”), and thus the specific cleaning process is prior art, which will not be described in detail here), and then enters another conveyor 1 surface arranged symmetrically about the axis by a switching and turning operation. After entering the surface of another conveyor 1, the lower surface of the semiconductor glass substrate faces upward, and then the lower surface of the semiconductor glass substrate is cleaned by the conveying and surface cleaning process of another conveyor 1 (the righting and cleaning process of the lower surface of the semiconductor glass substrate is consistent with the cleaning process of the upper surface described above. For details, refer to the righting and cleaning operation process of the upper surface).

[0052] Obviously, the above-described embodiments are only a part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor should be within the scope of protection of the present application.

[0053] It should be noted that the terms used herein are only intended to describe specific embodiments, and are not intended to limit the exemplary embodiments according to the present application. As used herein, the singular form is intended to include the plural form unless the context clearly indicates otherwise, and it should be understood that when the terms “comprise” and / or “include” are used in the specification, there is a feature, step, work, device, component and / or combination thereof.

[0054] It should be noted that the terms “first”, “second” and the like used in the specification and claims of the present application and the above-described drawings are used to distinguish similar objects, and do not necessarily indicate a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein.

[0055] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. For those skilled in the art, the present application can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

[0056] The above merely describes the preferred embodiments of the present application, and the protection scope of the present application is not limited to the above-described embodiments. Any technical solution falling within the concept of the present application shall fall within the protection scope of the present application. It should be noted that, for ordinary skilled persons in the art, some improvements and refinements without departing from the principles of the present application shall also be considered as falling within the protection scope of the present application.

Claims

1. A surface treatment system for processing semiconductor glass substrates, comprising two conveyors (1) arranged symmetrically along an axis, characterized in that: A flipping assembly (2) is installed between the two conveyors (1). The flipping assembly (2) includes a support (3). A first suction member (4) is rotatably fitted on the support (3). A second suction member (5) is rotatably fitted on the support (3). The first suction member (4) and the second suction member (5) are engaged with each other. The mounting component (3) includes an I-shaped lower extension plate (301), and two symmetrical rotating holes (302) are opened through the side of the I-shaped lower extension plate (301) near the bottom. Two symmetrical levers (303) are fixed on the side of the I-shaped lower extension plate (301) above the two rotating holes (302). The first adsorption component (4) includes a first rotating plate (401). The first rotating plate (401) has a first sliding groove (402) that is slidably engaged with a lever (303) on its side. A first horizontal plate (403) is rotatably engaged with one side of the first rotating plate (401). A first gear (404) that is rotatably engaged with the side of the I-shaped lower extension plate (301) is fixed on one side of the first horizontal plate (403). A first U-shaped plate (405) is fixed on the opposite side of the first horizontal plate (403). A first vacuum component (6) is rotatably engaged with one outer side of the first U-shaped plate (405). The second adsorption component (5) includes a second rotating plate (501). The second rotating plate (501) has a second sliding groove (502) that is slidably engaged with another actuating rod (303) through its side. The second rotating plate (501) has a second horizontal plate (503) that is rotatably engaged with its side. The second horizontal plate (503) has a second gear (504) that meshes with the first gear (404) fixed on one side. The second horizontal plate (503) has a second U-shaped plate (505) that is fixed on the opposite side. The second vacuum component (7) is rotatably engaged with one outer side of the second U-shaped plate (505).

2. The surface treatment system for processing semiconductor glass substrates according to claim 1, characterized in that: The top of the I-shaped lower extension plate (301) is fixed with a top plate (304), and the side of the top plate (304) is fixed with a mounting frame (305) erected between the two conveyors (1); The top plate (304) is fixed with a first hinge seat (306) at the bottom. The first hinge seat (306) is hinged with a mounting seat (307) inside. The mounting seat (307) is fixed with a hydraulic telescopic cylinder (308) at the bottom. The telescopic end of the hydraulic telescopic cylinder (308) is fixed with a sleeve (309). The bottom of the sleeve (309) is fixed with a baffle (310). The side of the baffle (310) is fixed with a pin (311). The side of the pin (311) is rotatably fitted with a rotating plate (312). The side of the rotating plate (312) is fixed with a rectangular frame (313).

3. The surface treatment system for processing semiconductor glass substrates according to claim 2, characterized in that: The first gear (404) has a first rotating shaft (406) fixed at its end, which is rotatably fitted inside a rotating hole (302). The first rotating shaft (406) has a rotating disk (407) fixed at its end, and the rotating disk (407) has a rectangular block (408) fixed at its end, which is snapped and fixed to the rectangular frame (313).

4. The surface treatment system for processing semiconductor glass substrates according to claim 3, characterized in that: The end of the second gear (504) is fixed with a second rotating shaft (506) that is rotatably fitted inside another rotating hole (302), and the end of the second rotating shaft (506) is fixed with a limit nut (507).

5. The surface treatment system for processing semiconductor glass substrates according to claim 4, characterized in that: The ends of the two actuating levers (303) are respectively fixed with limiting circular plates (314) that fit against the first rotating plate (401) and the second rotating plate (501), and the peripheral sides of the two actuating levers (303) are respectively fixed with limiting rings (315) that fit against the opposite side of the first rotating plate (401) and the second rotating plate (501).

6. The surface treatment system for processing semiconductor glass substrates according to claim 5, characterized in that: A first fixing cylinder (409) is fixed to one outer side of the first U-shaped plate (405), and a first motor (410) is fixed inside the first fixing cylinder (409) on one outer side of the first U-shaped plate (405). The first vacuum component (6) includes a first rotating cylinder (601) rotatably fitted on a first fixed cylinder (409). The end of the first rotating cylinder (601) is fixed with a first side plate (602) fixedly connected to the output shaft of a first motor (410). The side of the first side plate (602) is fixed with a first adsorption plate (603). The top of the first adsorption plate (603) is connected to a plurality of first suction pipes (604). The ends of the plurality of first suction pipes (604) are all connected to a first conical adsorption disk (605). The top of the first adsorption plate (603) is fixed with a first vacuum pump (606). The first vacuum pump (606) is connected to the first suction pipes (604) through a flexible tube.

7. The surface treatment system for processing semiconductor glass substrates according to claim 6, characterized in that: A second fixing cylinder (508) is fixed to one outer side of the second U-shaped plate (505), and a second motor (509) is fixed inside the second fixing cylinder (508) on one outer side of the second U-shaped plate (505). The second vacuum component (7) includes a second rotating cylinder (701) rotatably fitted on a second fixed cylinder (508). The end of the second rotating cylinder (701) is fixed with a second side plate (702) fixedly connected to the output shaft of the second motor (509). The side of the second side plate (702) is fixed with a second adsorption plate (703). The top of the second adsorption plate (703) is connected to a plurality of second suction pipes (704). The ends of the plurality of second suction pipes (704) are all connected to a second conical adsorption disk (705). The top of the second adsorption plate (703) is fixed with a second vacuum pump (706). The second vacuum pump (706) is connected to the second suction pipes (704) through a hose.

8. The surface treatment system for processing semiconductor glass substrates according to claim 7, characterized in that: The conveyor (1) includes a mounting base plate (101), and two sets of symmetrical side panels (102) are fixed on the top of the mounting base plate (101). Each set of side panels (102) includes two side panels, and the two side panels (102) are symmetrically arranged front and back. A conveyor roller (103) is rotatably engaged between each set of side panels (102). A drive motor (104) is fixed at the end of one of the conveyor rollers (103), and a conveyor belt (105) is connected between the two conveyor rollers (103).

9. The surface treatment system for processing semiconductor glass substrates according to claim 8, characterized in that: Two symmetrical vertical baffles (106) are fixed to the top of the two sets of side panels (102). Trapezoidal limiting plates (107) are fixed on the opposite side of the two vertical baffles (106) above the conveyor belt (105). The opposite side of the two trapezoidal limiting plates (107) is provided with mounting grooves (108). Several straightening rollers (109) are rotatably fitted inside the mounting grooves (108). Support frames (110) are provided on both sides of the mounting base plate (101) in the internal area of ​​the conveyor belt (105). An equipment mounting frame (111) is fixed on the top of the support frame (110) above the conveyor belt (105). A surface treatment device (112) is fixed on the top of the equipment mounting frame (111).

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