Semiconductor plating apparatus

Abstract

The application belongs to the technical field of electroplating, and particularly relates to a semiconductor electroplating device, which comprises a fixing base, a lifting column sliding up and down arranged on the fixing base, a rotating frame rotatably connected to the lifting column, the rotating frame having four ends cross-distributed, a sliding column sliding up and down arranged at each end of the rotating frame, and a clamping piece arranged on each sliding column, the clamping piece comprising a translation rod and an electric roller. The lifting frame lifts the workpiece on the conveying belt, the three electric rollers on the front side move, the edge of the workpiece is embedded into the annular groove, the rotating frame is rotated by controlling the speed reducer, the next workpiece is clamped by the clamping piece, the rotating frame is rotated again, the sliding column is lowered by controlling the linear motor, the clamping piece and the two workpieces are respectively lowered into two electroplating cylinders for electroplating, the electric roller rotates to make the workpiece rotate, the uniformity of the plating layer is improved, the feeding, electroplating and unloading are simultaneously performed, the process continuity is high, the waiting time is reduced, and the work efficiency is effectively improved.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of electroplating, and particularly relates to a semiconductor electroplating device. BACKGROUND

[0002] In the manufacturing process of semiconductors, a wafer needs to be electroplated, specifically, metal ions in an electroplating solution are reduced into metal atoms and deposited on the surface of a workpiece by an electrochemical method, so as to form a metal film on the surface of the workpiece.

[0003] The existing semiconductor electroplating equipment mostly adopts a single-station operation mode, and loading, electroplating and unloading need to be completed in steps. During the electroplating process, the loading and unloading stations are stalled, resulting in idle waiting time between processes and poor process continuity. In addition, the existing equipment relies on static electroplating, and the workpiece is fixed in the electroplating solution, which affects the thickness of the plating layer due to uneven distribution of the electric field. SUMMARY

[0004] In order to solve the problems of poor process continuity and insufficient plating layer uniformity, the application provides a semiconductor electroplating device.

[0005] The technical implementation scheme of the application is as follows: a semiconductor electroplating device comprises a fixing seat, a lifting column sliding up and down is arranged on the fixing seat, a rotating frame is rotatably connected to the lifting column, the rotating frame has four ends that are distributed in a cross shape, a sliding column sliding up and down is arranged at each end of the rotating frame, a clamping piece is arranged on each sliding column, the clamping piece comprises a translation rod and a self-rotating electric roller, at least three translation rods sliding horizontally are arranged at the bottom end of each sliding column in a radial direction, an electric roller is mounted at the end of each translation rod away from the sliding column, each electric roller has a ring-shaped groove matched with the edge of a workpiece, a fixed frame is fixedly arranged below the left sliding column and the rear sliding column, an electroplating cylinder is mounted on the fixed frame, a feeding mechanism is arranged below the front sliding column, and an unloading mechanism is arranged below the right sliding column.

[0006] More preferably, the semiconductor electroplating device further comprises a driving mechanism for driving the translation rod to slide, the driving mechanism comprises an electric push rod, a lifting ring, a connecting block and a hinged rod, a lifting ring sliding up and down is arranged in the middle of each sliding column, an electric push rod is connected to the side surface of each sliding column, the telescopic rod of the electric push rod is connected to the lifting ring, a connecting block is connected to each translation rod, and a hinged rod is rotatably connected between the connecting block and the lifting ring.

[0007] More preferably, the semiconductor electroplating device further comprises a liquid outlet pipe, a liquid discharge pipe and a valve rod, a liquid outlet pipe is communicated with the bottom of each electroplating cylinder, the two liquid outlet pipes are jointly communicated with a liquid discharge pipe, a valve rod is slidingly connected in each liquid outlet pipe, and the valve rod blocks the communication between the liquid outlet pipe and the liquid discharge pipe.

[0008] More preferably, the semiconductor electroplating device further comprises a protrusion, the valve rod bottom end extends from the outlet pipe bottom end, the valve rod bottom end is rotationally connected with the protrusion, the fixed frame is connected with a fixed block, the fixed block is rotationally connected with a rotating rod, the lifting column bottom end is connected with a push rod, and the push rod is connected with a connecting ring.

[0009] More preferably, the rotating rod one end is provided with a long hole, the other end of the rotating rod is a contact end, and the two protrusions are located in the two long holes; the connecting ring bottom part is in contact with the contact end top part of the rotating rod, and the push rod bottom end has a ring part for pushing the contact end.

[0010] More preferably, the feeding mechanism comprises a mounting frame, the fixed seat is connected with the mounting frame, the mounting frame upper part is provided with a pair of rotating shafts one, two conveying belts one are wound around the two rotating shafts one, the fixed seat is connected with a linear actuator, the linear actuator is connected with a lifting frame for lifting workpieces, and the lifting frame has two pairs of inner side bending ends with inclined surfaces.

[0011] More preferably, the discharging mechanism comprises a connecting box, the fixed seat is connected with the connecting box, the connecting box is provided with three rotating shafts three, two conveying belts two are wound around the left rotating shaft three and the middle rotating shaft three, two conveying belts three are wound around the middle rotating shaft three and the right rotating shaft three, the connecting box upper part is provided with two water inlet pipes, and a row of spray heads are rotationally installed on the water inlet pipes.

[0012] More preferably, the semiconductor electroplating device further comprises a dryer, and the dryer is installed on the connecting box upper part.

[0013] Compared with the prior art, the present application has the following advantages: 1. The lifting frame lifts the workpieces on the conveying belt one, the three front electric rollers move, the workpiece edges are embedded in the annular grooves, the rotating frame is rotated by controlling the speed reducer motor, the next workpiece is clamped by the clamping piece, the rotating frame is rotated again, the sliding column is lowered by controlling the linear motor, and the clamping piece and the two workpieces are lowered into the two electroplating cylinders for electroplating. The workpieces are rotated by the self-rotating electric rollers, the plating uniformity is improved, the feeding, electroplating and discharging are carried out at the same time, the process continuity is strong, the waiting time is reduced, and the work efficiency is effectively improved.

[0014] 2. The lifting frame is limited by the bending end to the workpiece, and the bending end has an inclined surface, so that the lifting frame can adapt to the slight position offset difference of the workpiece.

[0015] 3. The lifting column, rotating frame, sliding column and clamping piece are raised by controlling the hydraulic cylinder, the ring part pushes the contact end, the rotating rotating rod moves the protrusion downward through the long hole, the valve rod no longer blocks the communication between the outlet pipe and the drain pipe, the lifting column is lowered by controlling the hydraulic cylinder, the connecting ring pushes the contact end, the valve rod blocks the communication between the outlet pipe and the drain pipe again, the valve rod position is automatically and synchronously controlled, and the cleaning efficiency is improved.

[0016] 4. The workpiece is conveyed to the second conveying belt by the second conveying belt, and the two rows of nozzles clean the workpiece, the second conveying belt and the third conveying belt are staggered in the front-rear direction, so that the surface of the workpiece is fully exposed and cleaned. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of the present application.

[0018] Figure 2 It is a top view of the present application.

[0019] Figure 3 It is a schematic diagram of the structure of the feeding mechanism and the unloading mechanism hidden in the present application.

[0020] Figure 4 It is a schematic diagram of the structure of the sliding column, linear motor, translation rod, driving mechanism and electric roller of the present application.

[0021] Figure 5 It is a side view of the present application based on Figure 4 .

[0022] Figure 6 It is a schematic diagram of the connection relationship of the outlet pipe, drain pipe, valve rod, protruding block, fixed block, rotating rod and connecting ring of the present application.

[0023] Figure 7 It is a schematic diagram of the structure of the feeding mechanism of the present application.

[0024] Figure 8 It is a schematic diagram of the relative position of the bent end and the electric roller of the present application.

[0025] Figure 9 It is a schematic diagram of the partial cross-sectional structure of the unloading mechanism and the dryer of the present application.

[0026] Figure 10 It is a schematic diagram of the structure of the rotating shaft three, second conveying belt, third conveying belt, water inlet pipe and nozzle of the present application.

[0027] The marks of each component in the drawings are as follows: 1, fixed seat, 2, lifting column, 20, pushing rod, 21, hydraulic cylinder, 3, rotating frame, 4, sliding column, 41, linear motor, 5, translation rod, 51, electric pushing rod, 52, lifting ring, 53, connecting block, 54, hinged rod, 6, electric roller, 60, workpiece, 7, fixed frame, 8, electroplating cylinder, 81, outlet pipe, 82, drain pipe, 83, valve rod, 84, protruding block, 85, fixed block, 86, rotating rod, 87, long hole, 88, connecting ring, 91, mounting frame, 92, rotating shaft one, 93, conveying belt one, 94, lifting frame, 95, bent end, 101, connecting box, 102, rotating shaft three, 103, second conveying belt, 104, third conveying belt, 105, water inlet pipe, 106, nozzle, 11, dryer. DETAILED DESCRIPTION

[0028] The utility model provides a semiconductor electroplating device, refer to Figures 1-5 , including fixed seat 1, lifting column 2, hydraulic cylinder 21, rotating frame 3, sliding column 4, linear motor 41, clamping piece, fixed frame 7, electroplating cylinder 8, feeding mechanism and unloading mechanism, fixed seat 1 is equipped with the lifting column 2 that slides up and down, fixed seat 1 is bolted with hydraulic cylinder 21, the movable rod of hydraulic cylinder 21 is connected with lifting column 2, the top end of lifting column 2 is rotatably connected with rotating frame 3 driven by speed reducer motor, and speed reducer motor is installed in lifting column 2, rotating frame 3 has four ends that are cross distribution, and the distance of four ends and the center of speed reducer motor output shaft is equal, rotating frame 3 is equipped with the sliding column 4 that slides up and down at end, and rotating frame 3 is connected with the linear motor 41 for driving sliding column 4 to lift at end, clamping piece is equipped on sliding column 4, and clamping piece includes translation bar 5 and self-rotating electric roller 6, sliding column 4 bottom end is equipped with three horizontal sliding translation bar 5 along the radial, and the end of translation bar 5 away from sliding column 4 is installed with electric roller 6, electric roller 6 can self-rotate, and the drive mode of electric roller 6 is prior art, and electric roller 6 has annular groove that is adapted to the edge of workpiece 60, in the embodiment, the surface of electric roller 6 has rubber layer to avoid the edge of workpiece 60 abrasion, and fixed frame 7 is equipped below left side sliding column 4 and rear side sliding column 4, and fixed frame 7 is installed with electroplating cylinder 8, and feeding mechanism is equipped below front side sliding column 4, and unloading mechanism is equipped below right side sliding column 4.

[0029] Refer to Figure 1 , Figure 3 , Figure 4 And Figure 5 , the semiconductor electroplating device further includes a drive mechanism for driving the sliding of the translation bar 5, the drive mechanism including an electric push rod 51, a lifting ring 52, a connecting block 53, and a hinged rod 54, the sliding column 4 is provided with a lifting ring 52 that slides up and down in the middle, the electric push rod 51 is bolted to the side surface of the sliding column 4, the telescopic rod of the electric push rod 51 is connected with the lifting ring 52, the connecting block 53 is fixedly connected to the top of the translation bar 5, and the hinged rod 54 is rotatably connected between the connecting block 53 and the lifting ring 52 at the same sliding column 4.

[0030] Refer to Figure 3 And Figure 6The semiconductor electroplating device further comprises liquid outlet pipes 81, a liquid discharge pipe 82 and valve rods 83, the bottom of the electroplating cylinder 8 is communicated with the liquid outlet pipes 81, the liquid discharge pipe 82 is a three-way pipe, the liquid discharge pipe 82 is communicated with the liquid outlet pipes 81 on the side, the valve rods 83 are slidably connected in the liquid outlet pipes 81, and the valve rods 83 block the communication between the liquid outlet pipes 81 and the liquid discharge pipe 82; when the valve rods 83 are lowered, the communication between the liquid outlet pipes 81 and the liquid discharge pipe 82 is not blocked by the valve rods 83; the semiconductor electroplating device further comprises protrusions 84, fixed blocks 85, rotating rods 86 and connecting rings 88, the bottom end of the valve rod 83 extends out of the bottom end of the liquid outlet pipe 81, the bottom end of the valve rod 83 is rotatably connected with a pair of protrusions 84 on the side, the fixed frame 7 is fixedly connected with the fixed blocks 85, the fixed blocks 85 are rotatably connected with a pair of rotating rods 86, the bottom end of the lifting column 2 is fixedly connected with four push rods 20, the bottom end of the push rod 20 is provided with a ring-shaped part, the middle part of the two push rods 20 close to the electroplating cylinder 8 is connected with the connecting rings 88, one end of the rotating rod 86 is provided with a long hole 87, and the other end of the rotating rod 86 is a contact end; when the push rod 20 rises, the ring-shaped part pushes the contact end of the rotating rod 86, so that the rotating rod 86 rotates; the two protrusions 84 are located in the two long holes 87, and the bottom of the connecting ring 88 is in contact with the top of the contact end of the rotating rod 86.

[0031] With reference to Figure 1 , Figure 2 , Figure 7 and Figure 8 , the feeding mechanism comprises a mounting frame 91, rotating shafts 92, conveying belts 93 and lifting frames 94, the front side of the fixed seat 1 is connected with the mounting frame 91, the mounting frame 91 is installed with a pair of rotating shafts 92 driven by a driving motor, two conveying belts 93 are respectively wound between the two ends of the two rotating shafts 92, the conveying belts 93 are used for conveying the workpieces 60 to be electroplated, the rear part of the fixed seat 1 is installed with a linear driver, the driving motor and the linear driver are not shown in the figure, and the linear driver is connected with the lifting frames 94, the front part and the rear part of the lifting frame 94 are provided with a pair of bent ends 95 with inclined inner sides, and the lifting frame 94 is used for lifting the workpieces 60 on the conveying belts 93.

[0032] With reference to Figure 1 , Figure 2 , Figure 9 and Figure 10The unloading mechanism comprises a connecting box 101, three rotating shafts 102, two conveying belts 103, two conveying belts 104, two water inlet pipes 105 and a plurality of spray heads 106. The connecting box 101 is fixedly connected to the right side of the fixed seat 1. Three rotating shafts 102 driven by driving motors are installed on the connecting box 101. The driving motors are not shown in the figure. Two conveying belts 103 are wound around the left rotating shaft 102 and the middle rotating shaft 102. Two conveying belts 104 are wound around the middle rotating shaft 102 and the right rotating shaft 102. Two water inlet pipes 105 are installed on the upper part of the connecting box 101. The two water inlet pipes 105 are located above and below the two conveying belts 104 respectively. A plurality of spray heads 106 are rotatably installed on the water inlet pipes 105. The structure and direction adjustment mode of the spray heads 106 are prior art. The semiconductor electroplating device further comprises a dryer 11. The dryer 11 is installed on the right side of the upper part of the connecting box 101. The dryer 11 is prior art.

[0033] In the first step, the rotating shaft 92 rotates, and the two conveying belts 93 convey the workpiece 60 to be electroplated backward. When the workpiece 60 moves to the position directly above the lifting frame 94 (the bent end 95 of the lifting frame 94 is lower than the bottom surface of the workpiece 60), the workpiece 60 is located directly below the front clamping member at the same time. The linear actuator drives the lifting frame 94 to rise. The lifting frame 94 lifts the workpiece 60 on the conveying belt 93 until the edge of the workpiece 60 is flush with the annular groove of the motorized roller 6. The workpiece 60 is limited by the four bent ends 95. The bent end 95 has an inclined surface, so that the lifting frame 94 can adapt to the slight positional deviation of the workpiece 60.

[0034] In the second step, the electric push rod 51 drives the lifting ring 52 to rise, and the three translation rods 5 slide towards each other under the transmission of the hinged rod 54, driving the three motorized rollers 6 to move until the edge of the workpiece 60 is embedded in the annular groove of the motorized roller 6. The linear actuator drives the lifting frame 94 to descend and reset.

[0035] In the third step, the reduction motor drives the rotating frame 3 to rotate clockwise by 90 degrees, driving the sliding column 4, the clamping member and the clamped workpiece 60 to rotate together. Similarly, the lifting frame 94 lifts the next workpiece 60 on the conveying belt 93, so that the front clamping member clamps the next workpiece 60. The lifting frame 94 descends and resets, and the rotating frame 3 rotates clockwise by 90 degrees again.

[0036] In the fourth step, the left linear motor 41 and the rear linear motor 41 drive the left sliding column 4 and the rear sliding column 4 to descend respectively, driving the corresponding clamping member and workpiece 60 to descend into the electroplating cylinder 8 for electroplating. During the electroplating process, the motorized roller 6 rotates in the same direction, and the workpiece 60 rotates under the action of friction. The rubber layer avoids the edge of the workpiece 60 from being worn, so that the workpiece 60 is fully exposed to the electroplating solution, improving the uniformity of the plating layer.

[0037] Fifth step, when the two workpieces 60 electroplating is completed, control the left linear motor 41 and the rear linear motor 41 drive the left slide column 4 and the rear slide column 4 to rise reset respectively, the corresponding clamping piece and workpiece 60 leave the electroplating cylinder 8, the rotating frame 3 rotates 90 degrees again, the workpiece 60 electroplating is completed to the conveyor belt two 103 directly above, control the right side of the electric push rod 51 drive the right side of the lifting ring 52 to descend, under the transmission of the articulated rod 54 makes three translation rods 5 to the direction of mutual far away, three electric roller 6 and the workpiece 60 separate, the workpiece 60 falls on the conveyor belt two 103.

[0038] Sixth step, control two rows of spray head 106 spray water mist, clean the workpiece 60 on the conveyor belt two 103, the rotating shaft three 102 rotates, drives the conveyor belt two 103 and the conveyor belt three 104 to rotate, the conveyor belt two 103 will workpiece 60 to the right to the conveyor belt three 104, adjust the spray head 106 water mist spray angle, control two rows of spray head 106 spray water mist continue to clean the workpiece 60, the conveyor belt two 103 and the conveyor belt three 104 stagger in front and back direction, so that the workpiece 60 surface fully exposed, clean, clean the waste liquid generated in the inner bottom of the connecting box 101 to collect, control the dryer 11 dry workpiece 60 after cleaning, the conveyor belt three 104 again to the right output after drying the workpiece 60.

[0039] Thus, the workpiece 60 feeding, electroplating and unloading can be carried out simultaneously, the process continuity is strong, reduces the waiting time, effectively improves the work efficiency.

[0040] When the workpiece 60 electroplating is completed, control the hydraulic cylinder 21 drive the lifting column 2 to rise, drives the rotating frame 3, the slide column 4 and the clamping piece to rise as a whole, avoid the clamping piece influence the subsequent electroplating cylinder 8 cleaning work, when the ring shaped part of the push rod 20 bottom end top and the contact end bottom of the rotating rod 86 contact, the ring shaped part push the contact end up, to make the rotating rod 86 rotate, the rotating rotating rod 86 through the long hole 87 makes the protruding block 84 to move down, drive the valve rod 83 to move down, the valve rod 83 no longer block the communication of the liquid outlet pipe 81 and the drain pipe 82, the liquid in the electroplating cylinder 8 can be discharged through the liquid outlet pipe 81 and the drain pipe 82, in order to clean the inside of the electroplating cylinder 8, improve the cleaning efficiency; when the electroplating cylinder 8 cleaning is completed, control the hydraulic cylinder 21 makes the lifting column 2, the rotating frame 3, the slide column 4 and the clamping piece to drop as a whole, the push rod 20 drives the connecting ring 88 to drop together, the connecting ring 88 push the contact end of the rotating rod 86 to drop, the rotating rod 86 reverses, the reversing rotating rod 86 through the long hole 87 makes the protruding block 84 to move up, drive the valve rod 83 to move up, the valve rod 83 blocks the communication of the liquid outlet pipe 81 and the drain pipe 82 again, can be added electroplating liquid again.

Claims

1. A semiconductor plating apparatus comprising a fixing seat (1), characterized in that, The fixed seat (1) is provided with an up-down sliding lifting column (2), the lifting column (2) is rotatably connected with a rotating frame (3), the rotating frame (3) has four ends in cross distribution, the rotating frame (3) is provided with an up-down sliding sliding column (4) at the end, the sliding column (4) is provided with a clamping piece, the clamping piece comprises a translation rod (5) and an electric roller (6), the sliding column (4) is radially provided with at least three horizontal sliding translation rods (5) at the bottom, the electric roller (6) is mounted at the end away from the sliding column (4) of the translation rod (5), the electric roller (6) has a ring groove matched with the edge of the workpiece (60), the fixed frame (7) is fixed below the left sliding column (4) and the rear sliding column (4), the electric plating cylinder (8) is mounted on the fixed frame (7), the feeding mechanism is arranged below the front sliding column (4), and the discharging mechanism is arranged below the right sliding column (4).

2. The semiconductor plating apparatus according to claim 1, wherein The semiconductor electroplating device further comprises a driving mechanism for driving the sliding of the translation rod (5), the driving mechanism comprises an electric push rod (51), a lifting ring (52), a connecting block (53) and a hinged rod (54), the middle part of the sliding column (4) is provided with a lifting ring (52) sliding up and down, the side surface of the sliding column (4) is connected with an electric push rod (51), the telescopic rod of the electric push rod (51) is connected with the lifting ring (52), the connecting block (53) is connected with the translation rod (5), and the hinged rod (54) is rotatably connected between the connecting block (53) and the lifting ring (52).

3. The semiconductor plating apparatus according to claim 2, wherein The semiconductor electroplating device further comprises a liquid outlet pipe (81), a liquid discharge pipe (82) and a valve rod (83), the bottom of the electroplating cylinder (8) is communicated with the liquid outlet pipe (81), the two liquid outlet pipes (81) are commonly communicated with the liquid discharge pipe (82), the valve rod (83) is slidably connected in the liquid outlet pipe (81), and the valve rod (83) blocks the communication between the liquid outlet pipe (81) and the liquid discharge pipe (82).

4. The semiconductor plating apparatus according to claim 3, wherein The semiconductor electroplating device further comprises a protrusion (84), the bottom end of the valve rod (83) extends from the bottom end of the liquid outlet pipe (81), the bottom end of the valve rod (83) is rotatably connected with the protrusion (84), the fixed block (85) is connected with the fixed frame (7), the rotating rod (86) is rotatably connected with the fixed block (85), the pushing rod (20) is connected with the lifting column (2), and the connecting ring (88) is connected with the middle part of the pushing rod (20).

5. The semiconductor plating apparatus according to claim 4, wherein the semiconductor plating apparatus is characterized by comprising: a semiconductor wafer cleaning device for cleaning the semiconductor wafer. One end of the rotating rod (86) is provided with a long hole (87), the other end of the rotating rod (86) is a contact end, and the two protrusions (84) are located in the two long holes (87); the bottom of the connecting ring (88) is in contact with the top of the contact end of the rotating rod (86), and the bottom end of the pushing rod (20) has a ring-shaped part for pushing the contact end.

6. The semiconductor plating apparatus according to claim 5, wherein The feeding mechanism comprises a mounting frame (91), the mounting frame (91) is connected to the fixed base (1), a pair of rotating shafts I (92) are mounted on the upper portion of the mounting frame (91), two conveying belts I (93) are wound around the two rotating shafts I (92), a linear driver is connected to the fixed base (1), a lifting frame (94) for lifting the workpiece (60) is connected to the linear driver, and the lifting frame (94) has two pairs of bent ends (95) with inclined inner sides.

7. The semiconductor plating apparatus according to claim 6, wherein The discharging mechanism comprises a connecting box (101), the connecting box (101) is connected to the fixed base (1), three rotating shafts III (102) are mounted on the connecting box (101), two conveying belts II (103) are wound around the left rotating shaft III (102) and the middle rotating shaft III (102), two conveying belts III (104) are wound around the middle rotating shaft III (102) and the right rotating shaft III (102), two water inlet pipes (105) are mounted on the upper portion of the connecting box (101), and a row of spray heads (106) are rotatably mounted on the water inlet pipes (105).

8. The semiconductor plating apparatus according to claim 7, wherein The semiconductor electroplating device further comprises a dryer (11), and the dryer (11) is mounted on the upper portion of the connecting box (101).

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