Inertial sensor module, shock absorbing structure, method, apparatus, device, and medium

Abstract

The present application relates to the technical field of sensor damping, and more particularly to an inertial sensor module, a damping structure, a method, a device, equipment and a medium, the damping method of the present application first acquires a plurality of first acceleration data queues; then frequency domain feature analysis is performed on each first acceleration data queue, a first voltage indication for adjusting the input voltage of the damping block is output according to the frequency domain amplitude output obtained by frequency domain feature analysis; then a plurality of second acceleration data queues are acquired, a first phase angle is determined according to each second acceleration data queue; finally, a first waveform opposite in phase to the first phase angle is superimposed on the first voltage indication as a second voltage indication for output, the present application obtains acceleration data values according to an inertial sensor, and performs frequency domain analysis on the data twice. The present application method adopts passive and active damping, and greatly reduces the influence of vibration on the inertial sensor.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of sensor shock absorption, and in particular to an inertial sensor module, a shock absorption structure, a method, an apparatus, a device and a medium. BACKGROUND

[0002] MEMS inertial measurement unit, also known as micro-electro-mechanical system, is widely used in many fields such as aerospace, automotive electronics and consumer electronics. With the advantages of small size, low cost and low power consumption, the working principle of MEMS inertial measurement unit is based on the mechanical properties of micro-mechanical structure.

[0003] In actual working environment, MEMS inertial measurement unit will be disturbed by various vibrations. The vibration will cause additional displacement and deformation of the microstructure of MEMS inertial measurement unit, resulting in noise and drift of the output signal, which will increase the error of the output signal of MEMS inertial measurement unit and reduce the measurement accuracy and reliability.

[0004] At the same time, with the continuous improvement of the range and speed of the carrier, the use of MEMS inertial measurement unit in high overload and strong impact application environment becomes more frequent. High overload application environment can produce several thousand to tens of thousands of g impact instantaneously, which is easy to cause deformation of the external structure of MEMS inertial measurement unit, bending of the internal circuit board, falling of components, falling of internal chips, fracture of bonding wires and damage of the overall circuit. Thus, the overall performance of MEMS inertial measurement unit is reduced or completely fails.

[0005] Therefore, in order to improve the performance of MEMS inertial measurement unit, effective damping measures need to be taken. Based on this, a shock absorption structure needs to be developed and designed. SUMMARY

[0006] The embodiments of the present application provide an inertial sensor module, a shock absorption structure, a method, an apparatus, a device and a medium, which are used to solve the problem that the MEMS inertial measurement unit is easy to fail after vibration in the prior art.

[0007] In a first aspect, the embodiments of the present application provide a shock absorption structure, comprising:

[0008] a shell, a gland and a first frame;

[0009] the upper surface of the shell is open;

[0010] the side surface of the first frame is provided with a plurality of first shock absorption blocks, and the upper surface of the first frame is provided with a plurality of second shock absorption blocks;

[0011] the shell is provided with an inwardly inclined inner wall, and the first frame abuts against the inner wall of the shell through the plurality of first shock absorption blocks;

[0012] The first damping block and the second damping block are each provided with an electrostatic comb drive;

[0013] When the gland compresses the opening on the upper surface of the shell, the lower surface of the gland abuts against the plurality of second damping blocks to fix the first frame inside the shell;

[0014] When the input voltage of the first damping block is changed or the input voltage of the second damping block is changed, the vibration frequency of the first damping block or the vibration frequency of the second damping block is changed accordingly.

[0015] In a possible implementation manner, the first damping block and the second damping block respectively include:

[0016] an electrostatic comb drive and an elastic element;

[0017] The fixed end of the electrostatic comb drive is fixedly connected with the first frame, and the elastic element is fixedly connected with the moving end of the electrostatic comb drive;

[0018] When the gland compresses the opening on the upper surface of the shell, the elastic element abuts against the inner wall of the shell or the lower surface of the gland.

[0019] In a second aspect, an embodiment of the present application provides an inertial sensor module, which includes an inertial sensor, a control unit, and a damping structure as described in the first aspect or any possible implementation manner of the first aspect.

[0020] The inertial sensor is fixedly connected with the first frame, and the inertial sensor is signal-connected with the control unit.

[0021] When the control unit receives a plurality of acceleration data queues, the control unit generates an indication for adjusting the input voltage of the first damping block and / or the input voltage of the second damping block according to the plurality of acceleration data queues.

[0022] In a third aspect, an embodiment of the present application provides a damping method applied to the inertial sensor module of the second aspect, and the damping method includes:

[0023] obtaining a plurality of first acceleration data queues, wherein each first acceleration data queue corresponds to one dimension direction;

[0024] performing frequency domain feature analysis on each first acceleration data queue, and outputting a first voltage indication for adjusting the input voltage of the damping block according to the frequency domain amplitude obtained by the frequency domain feature analysis;

[0025] obtaining a plurality of second acceleration data queues, and determining a first phase angle according to each second acceleration data queue, wherein each second acceleration data queue corresponds to one dimension direction;

[0026] A first waveform opposite in phase to the first phase angle is superimposed on the first voltage indication as a second voltage indication and output.

[0027] In a possible implementation, the frequency domain feature analysis on each first acceleration data queue is performed, and a first voltage indication for adjusting an input voltage of the shock attenuation block is output according to a frequency domain amplitude obtained by the frequency domain feature analysis, including:

[0028] For each first acceleration data queue, the following steps are performed respectively:

[0029] The fundamental frequency is obtained;

[0030] A plurality of frequency amplitudes are generated according to the first acceleration data queue and a plurality of multiples of the fundamental frequency, wherein each frequency amplitude corresponds to a multiple of the fundamental frequency;

[0031] A target amplitude is selected from the plurality of frequency amplitudes as the target amplitude;

[0032] A target multiple is selected as the target multiple, wherein the target multiple corresponds to the target amplitude;

[0033] The first voltage indication is output according to a response characteristic of the shock attenuation block and the target multiple, wherein the first voltage indication is positively correlated with the target multiple.

[0034] In a possible implementation, the plurality of frequency amplitudes are generated according to the first acceleration data queue and the plurality of multiples of the fundamental frequency, including:

[0035] The plurality of frequency amplitudes are generated according to a first formula, the first acceleration data queue and the plurality of multiples of the fundamental frequency, wherein the first formula is:

[0036]

[0037] wherein, is the i th frequency amplitude, is the i th data of the first acceleration data queue, is a total number of data in the first acceleration data queue, is a natural constant, is a circular constant, is the fundamental frequency. In a possible implementation, the first phase angle is determined according to each second acceleration data queue, including:

[0038] In a possible implementation, the first phase angle is determined according to each second acceleration data queue, including:

[0039] ​The first phase angle corresponding to each second acceleration data queue is determined according to a second formula, wherein the second formula is:

[0040]

[0041] In the formula, is a sine amplitude corresponding to a target frequency multiplication, is a cosine amplitude corresponding to the target frequency multiplication, is the i th data of the second acceleration data queue, is a sine function, is a total number of data in the second acceleration data queue, is a circular constant, is a target frequency multiplication, is a cosine function, is the first phase angle, is given according to the sign of the input is given according to the sign of the input is an inverse tangent function of four coordinate interval angles.

[0042] In a fourth aspect, an embodiment of the present application provides a damping device for implementing the method of the third aspect or any possible implementation manner of the third aspect, comprising:

[0043] An acceleration acquisition module is configured to acquire a plurality of first acceleration data queues, wherein each first acceleration data queue corresponds to a dimension direction;

[0044] A first damping module is configured to perform frequency domain feature analysis on each first acceleration data queue, and output a first voltage indication of adjusting an input voltage of a damping block according to a frequency domain amplitude obtained by the frequency domain feature analysis;

[0045] A phase determination module is configured to acquire a plurality of second acceleration data queues, and determine a first phase angle according to each second acceleration data queue, wherein each second acceleration data queue corresponds to a dimension direction;

[0046] and

[0047] A second damping module is configured to superimpose a first waveform opposite in phase to the first phase angle on the first voltage indication as a second voltage indication.

[0048] In a fifth aspect, an embodiment of the present application provides an electronic device, comprising a memory and a processor, wherein the memory stores a computer program capable of running on the processor, and the processor implements the steps of the method of the third aspect or any possible implementation manner of the third aspect when executing the computer program.

[0049] ​In a sixth aspect, an embodiment of the present application provides a computer readable storage medium, which stores a computer program. The computer program is executed by a processor to implement the steps of the method in the third aspect or any possible implementation manner of the third aspect.

[0050] Compared with the prior art, the embodiment of the present application has the following beneficial effects:

[0051] The embodiment of the present application discloses a damping method, which first acquires a plurality of first acceleration data queues, wherein each first acceleration data queue corresponds to a dimension direction; then performs frequency domain feature analysis on each first acceleration data queue, and outputs a first voltage instruction for adjusting an input voltage of a damping block according to a frequency domain amplitude obtained by the frequency domain feature analysis; then acquires a plurality of second acceleration data queues, and determines a first phase angle according to each second acceleration data queue, wherein each second acceleration data queue corresponds to a dimension direction; and finally superimposes a first waveform opposite in phase to the first phase angle on the first voltage instruction as a second voltage instruction for output. According to the acceleration data value obtained by the inertial sensor, the data is analyzed twice in the frequency domain, the vibration frequency is obtained according to the first transformation result, the stiffness of the damping block is adjusted according to the vibration frequency, the purpose of damping is achieved, the phase angle of the vibration is obtained according to the second transformation result, and a waveform opposite in phase to the phase angle is generated on the damping block, and the purpose of damping is achieved. The method of the present application adopts passive and active damping, and greatly reduces the influence of vibration on the inertial sensor. BRIEF DESCRIPTION OF DRAWINGS

[0052] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0053] Figure 1 is a schematic diagram of an inertial sensor module provided by the embodiment of the present application;

[0054] Figure 2 is a schematic diagram of a damping block provided by the embodiment of the present application;

[0055] Figure 3 is a flowchart of a damping method provided by the embodiment of the present application;

[0056] Figure 4 is a functional block diagram of a damping device provided by the embodiment of the present application;

[0057] Figure 5is a functional block diagram of an electronic device provided by an embodiment of the present application.

[0058] In the drawings:

[0059] The shell 101;

[0060] The gland 102;

[0061] The first frame 103;

[0062] The inertial sensor 104;

[0063] The electrostatic comb drive 1031;

[0064] The elastic element 1032. DETAILED DESCRIPTION

[0065] In the following description, for purposes of explanation and not limitation, specific details are set forth, such as particular sequences of steps, techniques, etc., in order to provide a thorough understanding of the present embodiments. However, it will be apparent to those skilled in the art that the present application can be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known methods, devices, and apparatus are omitted so as not to obscure the description of the present application with unnecessary detail.

[0066] In order to make the objects, technical solutions and advantages of the present application clearer, the following will be described in conjunction with the accompanying drawings and specific embodiments.

[0067] The following will be described in detail for the embodiments of the present application, and the present example is implemented on the premise of the technical solutions of the present application, and detailed implementation manners and specific operation processes are given, but the protection scope of the present application is not limited to the following embodiments.

[0068] The first aspect of the present application provides a damping structure, comprising:

[0069] The shell, the gland and the first frame;

[0070] The upper surface of the shell is provided with an opening;

[0071] The side surface of the first frame is provided with a plurality of first damping blocks, and the upper surface of the first frame is provided with a plurality of second damping blocks;

[0072] The shell is provided with an inwardly inclined inner wall, and the first frame abuts against the inner wall of the shell through the plurality of first damping blocks;

[0073] The first damping block and the second damping block are both provided with an electrostatic comb drive;

[0074] When the gland is pressed against the opening on the upper surface of the shell, the lower surface of the gland abuts against the plurality of second damping blocks to fix the first frame inside the shell.

[0075] When the input voltage of the first damping block is changed or the input voltage of the second damping block is changed, the vibration frequency of the first damping block or the vibration frequency of the second damping block is changed.

[0076] Exemplarily, as shown in the figure, the present application provides a damping structure which can be used to install an inertial sensor 104. It includes a shell 101, a gland 102 and a first frame 103, wherein the first frame 103 is used to fix the object to be protected by damping, for example, Figures 1-2 The inertial sensor 104 is fixed on the first frame 103. Figure 1

[0077] On the periphery and side surface of the first frame 103, damping blocks are respectively arranged.

[0078] The damping blocks are actually installed in different dimensions, so as to realize damping in different dimensions.

[0079] Specifically, the shell 101 is provided with an inwardly inclined inner wall, and the damping blocks on the periphery of the first frame 103: a plurality of first damping blocks abut against the inner wall, that is, the first damping blocks can generate a lateral support force.

[0080] And another part of the damping block: the second damping block is arranged on the upper surface of the first frame 103, when the gland 102 is buckled on the upper surface opening of the shell 101, the second damping block abuts against the gland 102, so as to generate a vertical support force. That is, the second damping block is used to generate vertical support force and damping capacity, and the lateral damping block is mainly used to generate horizontal damping force, and the horizontal damping block is configured to correspond to different dimensional directions, for example, two are configured longitudinally, and the other two are configured transversely.

[0081] Since the damping blocks generate damping capacity in different directions respectively, the damping blocks can be respectively configured to adapt to vibration in different directions.

[0082] In the implementation of the damping block, the damping block of the present application is provided with an electrostatic comb drive 1031, which generates different electrostatic forces inside when different voltages are added from outside, so that the vibration frequency of the damping block is changed.

[0083] That is, by controlling the electrostatic comb drive 1031 on the damping block, the purpose of controlling the vibration frequency of the damping block can be achieved, so as to change the vibration frequency according to the external vibration, and to isolate the vibration as much as possible.

[0084] In some embodiments, the first damping block and the second damping block respectively include:

[0085] ​The electrostatic comb drive 1031 and the elastic element 1032;

[0086] The fixed end of the electrostatic comb drive 1031 is fixedly connected with the first frame 103, and the elastic element is fixedly connected with the moving end of the electrostatic comb drive 1031.

[0087] When the gland 102 is pressed against the opening on the upper surface of the shell 101, the elastic element 1032 abuts against the inner wall of the shell 101 or the lower surface of the gland 102.

[0088] Exemplarily, in some embodiments, the shock-absorbing block comprises two parts, namely the elastic element and the electrostatic comb drive, which are fixed together, wherein the elastic element part is used to abut against the shell or the gland, and the electrostatic comb drive is used to connect the first frame.

[0089] The elastic element can be implemented in various forms, such as sponge, rubber or inflatable air bag. In this way, the first buffering can be performed by the elastic element, the second buffering can be performed by the electrostatic comb drive, and the purpose of enhanced buffering can be achieved through the control effect of the electrostatic comb drive.

[0090] The second aspect of the present application provides an inertial sensor module comprising an inertial sensor, a control unit and a shock-absorbing structure as described in the first aspect.

[0091] The inertial sensor is fixedly connected with the first frame, and the inertial sensor is signal-connected with the control unit.

[0092] When the control unit receives a plurality of acceleration data queues, the control unit generates an indication for adjusting the input voltage of the first shock-absorbing block and / or the input voltage of the second shock-absorbing block according to the plurality of acceleration data queues.

[0093] Exemplarily, the second aspect of the present application provides an inertial sensor module comprising an inertial sensor and a control unit, the inertial sensor being fixed to the first frame, and the control unit receiving signals from the inertial sensor and adjusting the shock-absorbing module according to the received acceleration signals.

[0094] In fact, when controlling the shock-absorbing module, the control unit performs frequency domain analysis on the acceleration signals to analyze the frequency domain value of external vibration, adjusts the stiffness of the electrostatic comb drive as much as possible to isolate external vibration, and generates a voltage signal with the same frequency and opposite phase as the frequency domain value on the electrostatic comb drive to offset the external vibration.

[0095] In order to achieve the above-mentioned purpose, the third aspect of the present application is discussed in detail.

[0096] Figure 3 A flowchart of a vibration reduction method provided in the third aspect of an embodiment of the present invention.

[0097] like Figure 3 As shown, a flowchart illustrating the implementation of the vibration reduction method provided by an embodiment of the present invention is presented, and is described in detail below:

[0098] In step 301, a first acceleration data queue is obtained, wherein each first acceleration data queue corresponds to a dimension direction.

[0099] In step 302, frequency domain feature analysis is performed on each first acceleration data queue, and a first voltage indicator is output to adjust the input voltage of the damping block based on the frequency domain amplitude obtained from the frequency domain feature analysis.

[0100] In some implementations, the step of performing frequency domain feature analysis on each first acceleration data queue and outputting a first voltage indicator to adjust the input voltage of the damper block based on the frequency domain amplitude obtained from the frequency domain feature analysis includes:

[0101] For each first acceleration data queue, perform the following steps:

[0102] Obtain the fundamental frequency;

[0103] Based on the first acceleration data queue and multiple harmonics of the fundamental frequency, multiple frequency amplitudes are generated, wherein each frequency amplitude corresponds to a harmonic of the fundamental frequency.

[0104] Select the frequency amplitude with the largest value from the plurality of frequency amplitude values ​​as the target amplitude;

[0105] The harmonic corresponding to the target amplitude is taken as the target harmonic.

[0106] Based on the response characteristics of the damping block and the target harmonic frequency, a first voltage indication is output, wherein the first voltage indication is positively correlated with the target harmonic frequency.

[0107] In some implementations, generating multiple frequency amplitudes based on the first acceleration data queue and multiple harmonics of the fundamental frequency includes:

[0108] Multiple frequency amplitudes are generated based on the first formula, the first acceleration data queue, and multiple harmonics of the fundamental frequency, wherein the first formula is:

[0109]

[0110] in, For the first Each frequency amplitude, For the first acceleration data queue One data point, This represents the total number of data points in the first acceleration data queue. It is a natural constant. Pi This is the fundamental frequency.

[0111] For example, the present invention acquires acceleration signals from an inertial sensor. The acceleration measurement direction of the inertial sensor is consistent with the installation direction of the damping block. The acceleration data of each dimension measured by the inertial sensor forms a data queue. By processing the queue of each dimension, the frequency domain amplitude of that dimension can be obtained. Usually, only one frequency domain amplitude is the most prominent, that is, the main frequency domain amplitude. For the frequency corresponding to the frequency domain amplitude, the input voltage of the corresponding electrostatic comb driver is adjusted to achieve the purpose of eliminating vibration. On this basis, frequency domain analysis is performed again to obtain the phase of the vibration of the inertial sensor. By superimposing a waveform with the opposite phase on the input voltage of the electrostatic comb driver, the vibration cancellation effect is achieved.

[0112] To achieve the above objectives, this invention generates multiple harmonics based on the fundamental frequency, processes each queue based on these harmonics, and generates multiple frequency amplitudes. In one scenario, multiple frequency amplitudes are generated using a first formula:

[0113]

[0114] in, For the first Each frequency amplitude, For the first acceleration data queue One data point, This represents the total number of data points in the first acceleration data queue. It is a natural constant. Pi This is the fundamental frequency.

[0115] The maximum amplitude among multiple frequency amplitudes is selected as the target amplitude, and the harmonic corresponding to the target amplitude is taken as the target harmonic. At this time, the input voltage of the damping block in the corresponding dimension is adjusted according to the target harmonic. For example, the above process processes the acceleration data queue in the vertical direction to obtain the target harmonic corresponding to the vertical direction. Then, the input voltage of the electrostatic comb driver of the second damping block is adjusted according to the target harmonic so that the vibration characteristics of the damping block itself are lower than the target harmonic. Usually, a coefficient is taken, for example, 0.2. The product of this coefficient and the harmonic is taken as the vibration characteristics of the damping block itself.

[0116] In step 303, multiple second acceleration data queues are acquired, and a first phase angle is determined based on each second acceleration data queue, wherein each second acceleration data queue corresponds to a dimensional direction.

[0117] In some implementations, determining the first phase angle based on each second acceleration data queue includes:

[0118] The first phase angle corresponding to each second acceleration data queue is determined according to the second formula, whereby the second formula is:

[0119]

[0120] In the formula, The amplitude of the sine wave corresponding to the target harmonic. The cosine amplitude corresponding to the target harmonic. For the second acceleration data queue One data point, It is a sine function. This represents the total number of data points in the second acceleration data queue. Pi For target frequency multiplication, It is a cosine function. The first phase angle, For based on the input symbols The symbol denoted by gives the arctangent function of the angle in the four coordinate intervals.

[0121] For example, it can be understood that after the vibration characteristics of the damping block itself change, the vibration phase of the inertial sensor will also change. As mentioned above, the present invention superimposes a waveform on the input voltage of the electrostatic comb driver, and the phase of this waveform is opposite to the phase of the inertial sensor, thereby achieving the purpose of vibration reduction.

[0122] At this point, multiple acceleration data queues will be obtained again through the inertial sensor. These acceleration data queues, according to the second formula, yield the phase angle of the inertial sensor's vibration:

[0123]

[0124] In the formula, The amplitude of the sine wave corresponding to the target harmonic. The cosine amplitude corresponding to the target harmonic. For the second acceleration data queue One data point, It is a sine function. This represents the total number of data points in the second acceleration data queue. Pi For target frequency multiplication, It is a cosine function. The first phase angle, For based on the input symbols The symbol denoted by gives the arctangent function of the angle in the four coordinate intervals.

[0125] It should be noted that the arctangent function in the above equation provides an angle value covering four coordinate intervals based on the signs of the two input variables; in other words, it provides... The angle between them.

[0126] In step 304, a first waveform with the opposite phase to the first phase angle is superimposed on the first voltage indicator and output as a second voltage indicator.

[0127] For example, since the target frequency is obtained from the aforementioned steps, the phase angle is superimposed with π to obtain the superimposed voltage waveform. The superimposed voltage waveform is then superimposed with the previous voltage value to achieve the purpose of active vibration reduction by the damping block.

[0128] The vibration reduction method of this invention first acquires multiple first acceleration data queues, each corresponding to a dimensional direction. Then, it performs frequency domain feature analysis on each first acceleration data queue, and outputs a first voltage indicator to adjust the input voltage of the damping block based on the frequency domain amplitude obtained from the analysis. Next, it acquires multiple second acceleration data queues, and determines a first phase angle based on each second acceleration data queue, each corresponding to a dimensional direction. Finally, it superimposes a first waveform with a phase opposite to the first phase angle onto the first voltage indicator, outputting it as a second voltage indicator. This invention obtains acceleration data values ​​from an inertial sensor, performs two frequency domain analyses on the data, obtains the vibration frequency based on the first transformation result, adjusts the stiffness of the damping block according to the vibration frequency to achieve vibration reduction, and then obtains the phase angle of the vibration based on the second transformation result, generating a waveform with a phase angle opposite to the vibration angle on the damping block to achieve vibration reduction. This invention employs passive and active vibration reduction, significantly reducing the impact of vibration on the inertial sensor.

[0129] It should be understood that the sequence number of each step in the above embodiments does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.

[0130] The following are embodiments of the apparatus of the present invention. For details not described in detail, please refer to the corresponding method embodiments described above.

[0131] Figure 4 This is a functional block diagram of the shock absorption device provided in the embodiments of the present invention, with reference to... Figure 4The shock absorption device comprises: an acceleration acquisition module 401, a first shock absorption module 402, a phase determination module 403, and a second shock absorption module 404, wherein:

[0132] The acceleration acquisition module 401 is configured to acquire a plurality of first acceleration data queues, each of which corresponds to a dimension direction.

[0133] The first shock absorption module 402 is configured to perform frequency domain feature analysis on each first acceleration data queue, and output a first voltage instruction for adjusting the input voltage of the shock absorption block according to the frequency domain amplitude obtained by the frequency domain feature analysis.

[0134] The phase determination module 403 is configured to acquire a plurality of second acceleration data queues, and determine a first phase angle according to each second acceleration data queue, each of which corresponds to a dimension direction.

[0135] The second shock absorption module 404 is configured to superimpose a first waveform opposite in phase to the first phase angle on the first voltage instruction as a second voltage instruction.

[0136] The second shock absorption module 404 is configured to superimpose a first waveform opposite in phase to the first phase angle on the first voltage instruction as a second voltage instruction.

[0137] Figure 5 is a functional block diagram of an electronic device provided by an embodiment of the present application. As shown in Figure 5 The electronic device 5 of the embodiment comprises a processor 500 and a memory 501, and the memory 501 stores a computer program 502 which can be run on the processor 500. The processor 500 implements the steps in the above-mentioned various shock absorption methods and embodiments when executing the computer program 502, such as the steps 301 to 304 shown in Figure 3

[0138] For example, the computer program 502 can be divided into one or more modules / units, which are stored in the memory 501 and executed by the processor 500 to complete the present application.

[0139] The electronic device 5 can be a desktop computer, a notebook computer, a palm computer, a cloud server, and other computing devices. The electronic device 5 can include, but is not limited to, a processor 500, a memory 501. Those skilled in the art can understand that Figure 5 The electronic device 5 is only an example and does not constitute a limitation on the electronic device 5, and can include more or fewer components than shown, or combine certain components, or different components, for example, the electronic device 5 can also include an input / output device, a network access device, a bus, etc.

[0140] ​The processor 500 can be a central processing unit (CPU), and can also be other general-purpose processors, a digital signal processor (DSP), an application specific integrated circuit (ASIC), a field-programmable gate array (FPGA) or other programmable logic device, discrete gate or transistor logic, discrete hardware components, etc. The general-purpose processor can be a microprocessor or the processor can also be any conventional processor.

[0141] The memory 501 can be an internal storage unit of the electronic device 5, such as a hard disk or a memory of the electronic device 5. The memory 501 can also be an external storage device of the electronic device 5, such as a plug-in hard disk, a smart media card (SMC), a secure digital (SD) card, a flash card, etc. provided on the electronic device 5. Further, the memory 501 can include both the internal storage unit and the external storage device of the electronic device 5. The memory 501 is used to store the computer program 502 and other programs and data required by the electronic device 5. The memory 501 can also be used to temporarily store data that has been output or will be output.

[0142] Those skilled in the art can clearly understand that, for the convenience and brevity of description, only the division of the above functional units and modules is exemplified, and in actual application, the above functions can be completed by different functional units and modules according to needs, that is, the internal structure of the apparatus is divided into different functional units or modules to complete all or part of the above described functions. Each functional unit and module in the embodiments can be integrated in one processing unit, or each unit can exist physically, or two or more units can be integrated in one unit, and the integrated unit can be realized in the form of hardware or in the form of software. In addition, the specific names of each functional unit and module are only for easy distinction, and do not limit the protection scope of the present application. The specific working process of the units and modules in the system can refer to the corresponding process in the foregoing method embodiments, which will not be described here.

[0143] In the above embodiments, the description of each embodiment has its own emphasis, and the parts not described or recorded in detail in a certain embodiment can refer to the related description of other embodiments.

[0144] Those skilled in the art can understand that the units and algorithm steps of each example described in combination with the embodiments disclosed herein can be realized by electronic hardware or a combination of computer software and electronic hardware. Whether the functions are realized in hardware or software depends on the specific application and design constraints of the technical solution. A person skilled in the art can use different methods to realize the described functions for each specific application, but such implementation should not be considered beyond the scope of the present application.

[0145] In the embodiments provided by the present application, it should be understood that the disclosed apparatus / equipment and method can be implemented in other manners. For example, the described apparatus / equipment embodiments are merely schematic. For example, the division of the modules or units is merely a logical function division. There can be another division manner for the actual implementation. For example, a plurality of units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the displayed or discussed mutual couplings or direct couplings or communication connections between different units, or the among different units, can be indirect couplings or communication connections through some interfaces, devices or units, and can be in electrical, mechanical or other forms.

[0146] The units described as separated components can or can not be physically separated, and the components displayed as units can or can not be physical units, i.e., can be located in one place, or can be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purposes of the embodiments.

[0147] In addition, each functional unit in the various embodiments of the present application can be integrated in one processing unit, or each unit can exist physically as a separate unit, or two or more units can be integrated in one unit. The integrated unit can be realized in the form of hardware, or in the form of a software functional unit.

[0148] The integrated module / unit, if realized in the form of a software function unit and sold or used as an independent product, can be stored in a computer-readable storage medium. Based on such understanding, all or part of the processes in the above-mentioned embodiment methods can also be completed by a computer program instructing related hardware, and the computer program can be stored in a computer-readable storage medium. When the computer program is executed by a processor, the steps of the above-mentioned various method and device embodiments can be implemented. The computer program includes computer program code, which can be in the form of source code, object code, executable files or some intermediate forms, etc. The computer-readable medium can include any entity or device capable of carrying the computer program code, recording medium, U disk, mobile hard disk, magnetic disk, optical disk, computer memory, read-only memory (ROM), random access memory (RAM), electric carrier signal, telecommunication signal and software distribution medium, etc.

[0149] The above-mentioned embodiments are only used to illustrate the technical solutions of the present application, rather than limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can be modified, or some technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should be included in the protection scope of the present application.

Claims

1. A shock absorbing structure, characterized by, include: Housing, gland, and first frame; The upper surface of the housing has an opening; The first frame has multiple first damping blocks on its side and multiple second damping blocks on its upper surface. The housing has an inwardly inclined inner wall, and the first frame abuts against the inner wall of the housing through the plurality of first shock-absorbing blocks; Both the first and second damping blocks are equipped with electrostatic comb-shaped actuators. When the pressure cap presses against the opening on the upper surface of the housing, the lower surface of the pressure cap abuts against the plurality of second shock-absorbing blocks to fix the first frame inside the housing; When the input voltage of the first damping block or the input voltage of the second damping block is changed, the vibration frequency of the first damping block or the vibration frequency of the second damping block changes accordingly.

2. The shock absorbing structure of claim 1, wherein The first damping block and the second damping block each include: Electrostatic comb-shaped actuator and elastic element; The fixed end of the electrostatic comb-shaped driver is fixedly connected to the first frame, and the elastic element is fixedly connected to the moving end of the electrostatic comb-shaped driver. When the gland presses against the opening on the upper surface of the housing, the elastic element abuts against the inner wall of the housing or against the lower surface of the gland.

3. An inertial sensor module, characterized by Includes an inertial sensor, a control unit, and a shock-absorbing structure as described in any one of claims 1-2; The inertial sensor is fixedly connected to the first frame, and the inertial sensor is signal-connected to the control unit; When the control unit receives multiple acceleration data queues, the control unit generates an instruction to adjust the input voltage of the first damping block and / or the input voltage of the second damping block based on the multiple acceleration data queues.

4. A method of damping, characterized by Applied to the inertial sensor module as described in claim 3, the vibration reduction method includes: Acquire multiple first acceleration data queues, where each first acceleration data queue corresponds to a dimension. Frequency domain feature analysis is performed on each first acceleration data queue, and the first voltage indicator for adjusting the input voltage of the damping block is output based on the frequency domain amplitude obtained from the frequency domain feature analysis. Multiple second acceleration data queues are acquired, and a first phase angle is determined based on each second acceleration data queue, wherein each second acceleration data queue corresponds to a dimensional direction; A first waveform with the opposite phase to the first phase angle is superimposed on the first voltage indicator and output as a second voltage indicator.

5. The shock mitigation method of claim 4, wherein, The step of performing frequency domain feature analysis on each first acceleration data queue and outputting a first voltage indicator to adjust the input voltage of the damping block based on the frequency domain amplitude obtained from the frequency domain feature analysis includes: For each first acceleration data queue, perform the following steps: Obtain the fundamental frequency; Based on the first acceleration data queue and multiple harmonics of the fundamental frequency, multiple frequency amplitudes are generated, wherein each frequency amplitude corresponds to a harmonic of the fundamental frequency. Select the frequency amplitude with the largest value from the plurality of frequency amplitude values ​​as the target amplitude; The harmonic corresponding to the target amplitude is taken as the target harmonic. Based on the response characteristics of the damping block and the target harmonic frequency, a first voltage indication is output, wherein the first voltage indication is positively correlated with the target harmonic frequency.

6. The shock mitigation method of claim 5, wherein, The generating a plurality of frequency amplitudes according to the first acceleration data queue and a plurality of multiple frequencies of the fundamental frequency comprises: The generating a plurality of frequency amplitudes according to the first acceleration data queue, the first formula and a plurality of multiple frequencies of the fundamental frequency, wherein the first formula is: wherein, is the first frequency amplitude, is the first frequency amplitude, is the first frequency amplitude, is the first frequency amplitude, is the first frequency amplitude, is the first frequency amplitude, is the first frequency amplitude, is the first frequency amplitude.

7. The shock mitigation method of any of claims 4-6, wherein, The determining a first phase angle according to each second acceleration data queue comprises: The determining a first phase angle according to each second acceleration data queue according to a second formula, wherein the second formula is: In the formula, The amplitude of the sine wave corresponding to the target harmonic. The cosine amplitude corresponding to the target harmonic. For the second acceleration data queue One data point, It is a sine function. This represents the total number of data points in the second acceleration data queue. Pi For target frequency multiplication, It is a cosine function. The first phase angle, For based on the input symbols The symbol denoted by gives the arctangent function of the angle in the four coordinate intervals.

8. A shock absorbing device, characterized by The shock-absorbing device for implementing the shock-absorbing method of any one of claims 4-7 comprises: An acceleration acquisition module, configured to acquire a plurality of first acceleration data queues, wherein each first acceleration data queue corresponds to a dimension direction; A first shock-absorbing module, configured to perform frequency domain feature analysis on each first acceleration data queue, and output a first voltage instruction for adjusting an input voltage of a shock-absorbing block according to a frequency domain amplitude obtained by the frequency domain feature analysis; A phase determination module, configured to acquire a plurality of second acceleration data queues, and determine a first phase angle according to each second acceleration data queue, wherein each second acceleration data queue corresponds to a dimension direction; And A second shock-absorbing module, configured to superimpose a first waveform opposite in phase to the first phase angle on the first voltage instruction as a second voltage instruction for output.

9. An electronic device comprising a memory and a processor, said memory having stored therein a computer program operable on said processor, characterized in that, The processor executes the computer program to implement the steps of the method of any one of claims 4-7.

10. A computer-readable storage medium storing a computer program, the computer-readable storage medium comprising: The computer program is executed by the processor to implement the steps of the method of any one of claims 4-7.

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