Immersed cooling system, control method thereof and electronic equipment

Abstract

The invention discloses an immersed cooling system and a control method thereof, and electronic equipment, and is applied to the technical field of electronic equipment cooling, the immersed cooling system comprises: a case, the interior of which is provided with a cavity, the cavity is internally provided with a phase change area and an immersion area, and the immersion area is filled with a cooling liquid; the thermoelectric cooling upper cover is arranged at the top of the case to seal the cavity; the cold end heat exchanger extends to the phase change area of the cavity; the thermoelectric cooling assembly is arranged on the thermoelectric cooling upper cover in a penetrating mode, and the cold end of the thermoelectric cooling assembly is attached to the cold end heat exchanger; and the hot end heat exchanger is arranged at the top of the thermoelectric cooling upper cover, and the hot end heat exchanger is attached to the hot end of the thermoelectric cooling assembly. According to the immersed cooling system, the thermoelectric cooling assembly is arranged on the thermoelectric cooling upper cover, the cold end heat exchanger and the hot end heat exchanger are both installed on the thermoelectric cooling upper cover, the structure is compact, sealing is reliable, field deployment and later operation and maintenance are convenient, and the equipment installation and management cost in an edge computing scene is saved.

Description

Technical Field

[0001] This invention relates to the field of electronic device cooling technology, and in particular to an immersion cooling system and its control method, as well as electronic devices. Background Technology

[0002] With the rapid development of information technology and artificial intelligence, edge computing, as a technology that performs computing and storage near the data source, has been widely used in many fields. Since liquid cooling technology has a higher heat exchange efficiency than air cooling, it has become a potential cooling solution for outdoor edge servers.

[0003] In related technologies, to meet the increasing complexity and energy consumption of outdoor edge servers, two-phase immersion cooling technology has been proposed. This technology not only utilizes the sensible heat of the coolant—the process by which the coolant absorbs heat from the engine through physical heat absorption (rather than phase change)—but also utilizes the latent heat of the coolant—the heat absorbed or released during phase changes (such as boiling or condensation)—for more efficient heat dissipation. However, applying existing two-phase immersion cooling systems to edge servers still faces many technical challenges, such as poor reliability, large size, high cost, and difficulties in coolant recirculation, which severely limit its application in edge servers.

[0004] Therefore, how to improve the reliability and efficiency of immersion cooling systems is a technical problem that needs to be solved by those skilled in the art. Summary of the Invention

[0005] The purpose of this invention is to provide an immersion cooling system and its control method and electronic equipment, which can improve cooling efficiency and reduce size.

[0006] To achieve the above objectives, the present invention provides the following technical solution.

[0007] An immersion cooling system includes: a chassis with an internal cavity for housing a heating element, the cavity containing a phase change zone and an immersion zone, the immersion zone being filled with coolant; a thermoelectric cooling cover disposed on top of the chassis to enclose the cavity; a cold-end heat exchanger disposed at the bottom of the thermoelectric cooling cover, extending into the phase change zone of the cavity; a thermoelectric refrigeration assembly penetrating the thermoelectric cooling cover, the cold end of the thermoelectric refrigeration assembly being in contact with the cold-end heat exchanger to transfer heat from the cold-end heat exchanger to the cold end of the thermoelectric refrigeration assembly; and a hot-end heat exchanger disposed on top of the thermoelectric cooling cover, the hot end of the hot end of the thermoelectric refrigeration assembly being in contact with the hot end of the thermoelectric refrigeration assembly to transfer heat from the hot end of the thermoelectric refrigeration assembly to the hot-end heat exchanger.

[0008] A method for controlling an immersion cooling system includes the following steps: When the motherboard inside the chassis is running and in the power-on and startup phase, the thermoelectric cooling component and the fan assembly are turned on synchronously, and the thermoelectric cooling component operates under medium load; the temperature of the heating element is acquired, and the fan assembly speed is adjusted in real time according to the temperature of the heating element; furthermore, based on the temperature change of the heating element, the effectiveness of the condensation effect of the cold-end heat exchanger is determined, and when the condensation effect of the cold-end heat exchanger is ineffective, the motherboard is controlled to stop running; the coolant level in the immersion zone is acquired, and when the coolant level in the immersion zone is lower than the target level, an alarm signal is issued, and the motherboard is controlled to stop running; when the motherboard inside the chassis is running and in a stable operating phase, the temperature of the heating element is acquired, and the power of the thermoelectric cooling component and the fan assembly speed are adjusted according to the temperature of the heating element; the surface temperature of the cold-end heat exchanger is acquired, and when the surface temperature of the cold-end heat exchanger is greater than or equal to the target surface temperature, the power of the thermoelectric cooling component is increased; the coolant level in the immersion zone is acquired, and when the coolant level in the immersion zone is lower than the target level, an alarm signal is issued, and the motherboard is controlled to stop running.

[0009] The present invention also provides an electronic device comprising any of the above-mentioned immersion cooling systems.

[0010] The immersion cooling system provided by this invention has the following advantages: First, by setting a cavity inside the chassis, the heating element is placed inside the cavity, and then the heating element is immersed in coolant. When the heating element emits heat, the coolant absorbs the heat from the heating element, thus cooling it. Simultaneously, the coolant undergoes a phase change after absorbing heat, changing from a liquid to a gaseous state. Through the setting of a cold-end heat exchanger, which extends into the phase change zone of the cavity, the coolant, after changing to a gaseous state, condenses under the action of the cold-end heat exchanger, changing from a gaseous state back to a liquid state and flowing back to the immersion zone, thereby achieving a circulating phase change of the coolant and providing good cooling for the heating element. Furthermore, to ensure the condensation effect of the cold-end heat exchanger, heat dissipation is required. In this application, a thermoelectric refrigeration assembly is used to dissipate heat from the cold-end heat exchanger. The thermoelectric refrigeration assembly uses electrical energy provided by an external power source, and the thermoelectric components in the thermoelectric refrigeration assembly... Electrons within the cooling chip undergo energy conversion under a temperature gradient: the cold end absorbs heat, the hot end releases heat, and then the hot end conducts the heat out into the environment. The thermoelectric cooling component boasts high control precision, enabling accurate adjustment based on the actual temperature of the heating element. By ensuring a good condensation effect of the cold-end heat exchanger, the heat dissipation effect of the heating element is guaranteed, ensuring its smooth operation. Furthermore, to improve the heat dissipation efficiency of the hot end of the thermoelectric cooling component, this application adds a hot-end heat exchanger. The hot-end heat exchanger is placed on top of the thermoelectric cooling cover, creating a space between it and the cover for the thermoelectric cooling component. This facilitates the connection between the thermoelectric cooling component and the cold-end heat exchanger, allowing heat transfer from the cold-end heat exchanger to the thermoelectric cooling component. Simultaneously, it facilitates the connection between the thermoelectric cooling component and the hot-end heat exchanger, allowing heat transfer from the thermoelectric cooling component to the hot-end heat exchanger, which is then dissipated into the environment.

[0011] The immersion cooling system provided by this invention utilizes a thermoelectric cooling cover to extend the cold-end heat exchanger toward the interior of the chassis. The thermoelectric cooling components and the hot-end heat exchanger are located on top of the thermoelectric cooling cover, resulting in a compact and reliable system structure. Furthermore, the thermoelectric cooling components and the hot-end heat exchanger are located on the outside of the chassis, facilitating on-site deployment and subsequent maintenance, and saving on equipment installation and management costs in edge computing scenarios.

[0012] In one embodiment, the device further includes: a fan assembly mounted on a hot-end heat exchanger, the fan assembly being used to provide cooling airflow to the hot-end heat exchanger; a temperature detection component for acquiring the temperature of the heating element and / or the cold-end heat exchanger; and a controller connected to the temperature detection component, the thermoelectric cooling assembly, and the fan assembly, the controller being used to control the power of the thermoelectric cooling assembly and / or the rotational speed of the fan assembly based on the temperature of the heating element and / or the cold-end heat exchanger. The above configuration, through the fan assembly, utilizes the airflow generated by the fan assembly to dissipate heat from the heat exchanger at the hot end, achieving natural convection cooling. Furthermore, a temperature detection component acquires the temperature of the heating element. This temperature can be monitored either in real-time or at set intervals, allowing for adjustments to the fan assembly speed or the power of the thermoelectric cooling assembly. During system startup and initial operation, the heating element temperature rises slowly, so only the fan assembly speed needs adjustment. Once the system reaches stable operation, the power of the thermoelectric cooling assembly and / or the fan assembly speed can be adjusted based on the heating element temperature. The fan assembly speed has a relatively small impact on the heating element temperature, while the thermoelectric cooling assembly power has a relatively large impact. Therefore, large temperature fluctuations can be addressed by adjusting the thermoelectric cooling assembly power, while small temperature fluctuations can be addressed by adjusting the fan assembly speed. This combination of the thermoelectric cooling assembly and the fan assembly improves the control precision of the cooling system, maximizes energy savings, and reduces costs.

[0013] The immersion cooling system control method provided by this invention is divided into a power-on and startup phase and a stable operation phase, based on the operating status of the motherboard inside the chassis. During the power-on and startup phase, the thermoelectric cooling component is activated and operates at a medium load to establish initial condensation capacity. The fan assembly starts simultaneously, forming a preliminary forced convection path. Then, by monitoring the temperature of the heating elements, the fan speed is adjusted in real time according to the temperature of the heating elements. Since the power consumption of the heating elements on the motherboard is not yet increased during the power-on and startup phase, the heat dissipation pressure on the heating elements is relatively low, and the thermoelectric cooling chip is already set to a medium load, its cooling capacity can meet the heat dissipation requirements of the heating elements. Furthermore, by monitoring the temperature changes of the heating elements, the effectiveness of the condensation effect of the cold-end heat exchanger is determined, and if the condensation effect of the cold-end heat exchanger is ineffective, the motherboard is controlled to stop operating. Simultaneously, the cooling capacity within the immersion zone is monitored... The liquid level effectively prevents malfunctions in the heat dissipation system. The goal at this stage is to achieve rapid heat transfer and condensation reflux loop establishment for the high-power heat-generating components on the motherboard during initial operation, laying the foundation for temperature control during subsequent high-load operation. Furthermore, during stable operation, the temperature of the heat-generating components is detected, and the power of the thermoelectric cooling components and the speed of the fan components are adjusted to achieve real-time monitoring and adjustment of the thermoelectric cooling components, fan components, and temperature detection components. This immersion cooling system control method has adaptive adjustment capabilities, a reliable anomaly detection mechanism, and a comprehensive safety protection strategy, enabling stable operation of edge servers in harsh environments such as high temperature, high humidity, and high dust without human intervention. Compared with two-phase cooling solutions in related technologies, this system significantly improves thermal management efficiency, equipment reliability, and operating economy, and is suitable for various edge computing deployment scenarios.

[0014] The electronic device provided by the present invention is equipped with the above-mentioned immersion cooling system. Since the immersion cooling system has the above-mentioned technical effects, the electronic device equipped with the immersion cooling system should also have the corresponding technical effects. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of the present invention or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of a specific embodiment of the immersion cooling system provided by the present invention.

[0017] Figure 2 for Figure 1The side view of the immersion cooling system shown.

[0018] Figure 3 for Figure 1 A partial structural schematic diagram of the immersion cooling system is shown.

[0019] Figure 4 for Figure 1 The diagram shows the structure of the thermoelectric cooling cover in the immersion cooling system.

[0020] Figure 5 for Figure 1 The diagram shows the cooling principle of the immersion cooling system.

[0021] Figure 6 for Figure 1 The diagram shows the control principle of the immersion cooling system.

[0022] Figure 7 This is a flowchart illustrating a specific implementation of the immersion cooling system control method provided by the present invention.

[0023] Figure 8 This is a flowchart illustrating another specific embodiment of the immersion cooling system control method provided by the present invention.

[0024] Figure reference numerals: 100-Heating element; 200-MCU component; 300-Main board; 1-Chassis; 11-Chassis heat sink fins; 12-Injection port; 13-Exhaust port; 2-Thermoelectric cooling top cover; 21-Fasteners; 22-Top cover heat insulation component; 3-Cold end heat exchanger; 31-Cold end substrate; 32-Cold end heat sink fins; 321-Condensation channel; 4-Thermoelectric cooling assembly; 41-Thermoelectric cooling element; 42-Thermoelectric heat insulation component; 5-Hot end heat exchanger; 51-Lower hot end heat exchanger 52-Upper hot-end heat exchanger; 53-Heat pipe of hot-end heat exchanger; 54-Fin of hot-end heat exchanger; 55-First plate; 56-Second plate; 7-Fan assembly; 71-Lower fan assembly; 72-Upper fan assembly; 81-Temperature detection component; 82-Controller; 83-Liquid level detection component; 9-Waterproof cap; 91-Baffle; 10-1-Hot-end heat dissipation zone; 10-2-Thermoelectric cooling zone; 10-3-Phase change zone; 10-4-Immersion zone; 10-5-Natural convection zone. Detailed Implementation

[0025] The core of this invention is to provide an immersion cooling system and its control method and electronic equipment, which can significantly improve the condensation and reflux rate of two-phase coolant and is reliable in use.

[0026] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present invention.

[0027] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the invention. The terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, where the range of similarity is within an acceptable deviation range, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity, i.e., the limitations of the measurement system. For example, "parallel" includes absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where the acceptable deviation range for approximate equality can be, for example, the difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0028] To enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0029] In this implementation, please refer to Figures 1 to 3The immersion cooling system includes: a chassis 1, with an internal cavity for housing the heating element 100, a phase change zone 10-3 and an immersion zone 10-4 within the cavity, the immersion zone 10-4 being filled with coolant; the upper part of the chassis 1 is an open structure, i.e., the top of the cavity is open; a thermoelectric cooling cover 2, located on the top of the chassis 1 to seal the cavity; the thermoelectric cooling cover 2 is detachably connected to the chassis 1 for easy disassembly and maintenance; and a cold-end heat exchanger 3, located at the bottom of the thermoelectric cooling cover 2, extending to the phase change zone of the cavity. Zone 10-3; The cold end heat exchanger 3 and the surface of the coolant in the immersion zone 10-4 are separated by a certain distance to facilitate the phase change of the coolant; Thermoelectric cooling component 4 is installed through the thermoelectric cooling cover 2, and the cold end of the thermoelectric cooling component 4 is in contact with the cold end heat exchanger 3 so that the heat of the cold end heat exchanger 3 can be transferred to the cold end of the thermoelectric cooling component 4; The hot end heat exchanger 5 is installed on the top of the thermoelectric cooling cover 2, and the hot end heat exchanger 5 is in contact with the hot end of the thermoelectric cooling component 4 so that the heat of the hot end of the thermoelectric cooling component 4 can be transferred to the hot end heat exchanger 5.

[0030] Specifically, the heat from the heating element 100 is first transferred to the coolant, which undergoes a phase change from liquid to gas. Then, through the condensation effect of the cold-end heat exchanger 3, it changes back from gas to liquid. The cold-end heat exchanger 3 absorbs heat and transfers it to the cold end of the thermoelectric refrigeration assembly 4. The cold end of the thermoelectric refrigeration assembly transfers heat to the hot end of the thermoelectric refrigeration assembly. The hot end of the thermoelectric refrigeration assembly transfers some of the heat to the hot-end heat exchanger 5, which dissipates the heat into the environment. The hot end of the thermoelectric refrigeration assembly dissipates the remaining heat directly into the environment.

[0031] This immersion cooling system involves creating a cavity within the chassis 1, placing the heating element 100 inside the cavity, and then immersing the heating element 100 in coolant. When the heating element 100 generates heat, the coolant absorbs this heat, cooling the heating element 100. Simultaneously, the coolant undergoes a phase change upon absorbing heat, transforming from a liquid to a gaseous state. Through the installation of a cold-end heat exchanger 3, which extends into the phase change zone 10-3 of the cavity, the coolant transforms into... After reaching a gaseous state, the coolant condenses under the action of the cold-end heat exchanger 3, changing from a gaseous state to a liquid state and flowing back to the immersion zone 10-4, thereby achieving a circulating phase change of the coolant and providing good cooling for the heating element 100. Furthermore, to ensure the condensation effect of the cold-end heat exchanger 3, heat dissipation is required. In this application, a thermoelectric refrigeration assembly 4 is used to dissipate heat from the cold-end heat exchanger 3. The thermoelectric refrigeration assembly 4 is powered by electricity supplied by an external power source, and the thermoelectric cooling element 41 in the thermoelectric refrigeration assembly 4... Electrons within the thermoelectric cooling assembly undergo energy conversion under a temperature gradient, with the cold end absorbing heat and the hot end releasing heat. The hot end then conducts the heat out into the environment for dissipation. The thermoelectric cooling assembly 4 has high control precision and can be precisely adjusted according to the actual temperature of the heating element 100. By ensuring the good condensation effect of the cold end heat exchanger 3, the heat dissipation effect of the heating element 100 is ensured, guaranteeing the smooth operation of the heating element 100. Furthermore, to improve the heat dissipation efficiency of the hot end of the thermoelectric cooling assembly 4, this application also adds a hot end heat exchanger 5. The hot end heat exchanger 5 is placed on top of the thermoelectric cooling cover 2, forming a space between the hot end heat exchanger 5 and the thermoelectric cooling cover 2 for the thermoelectric cooling assembly 4 to be placed. On the one hand, this facilitates the contact between the thermoelectric cooling assembly 4 and the cold end heat exchanger 3, facilitating the transfer of heat from the cold end heat exchanger 3 to the thermoelectric cooling assembly 4. On the other hand, it facilitates the contact between the thermoelectric cooling assembly 4 and the hot end heat exchanger 5, facilitating the transfer of heat from the thermoelectric cooling assembly 4 to the hot end heat exchanger 5, which is then dissipated into the environment.

[0032] The immersion cooling system provided by this invention sets the thermoelectric cooling component 4 on the thermoelectric cooling cover 2, and installs both the cold end heat exchanger 3 and the hot end heat exchanger 5 on the thermoelectric cooling cover 2. The cold end heat exchanger 3 is located inside the chassis 1, and the hot end heat exchanger 5 is located outside the chassis 1, which makes the entire system structure compact and reliably sealed. In addition, since all components are installed on the thermoelectric cooling cover 2, it is convenient for on-site deployment and subsequent operation and maintenance, saving equipment installation and management costs in edge computing scenarios.

[0033] In some embodiments, the thermoelectric cooling assembly 4 includes a plurality of thermoelectric cooling elements 41 and a plurality of thermoelectric insulating components 42. The thermoelectric cooling elements 41 are arranged in an array, for example, a 2x4 array. The thermoelectric insulating components 42 are located between adjacent thermoelectric cooling elements 41. Specifically, the thermoelectric cooling element 41, also known as a semiconductor cooling element, is a cooling technology based on the thermoelectric effect (Peltier effect). Its core principle is to achieve the directional transfer of heat by driving thermoelectric materials with electrical energy, thereby producing a cooling effect. The position of the thermoelectric cooling element 41 should correspond to the position of the cold-end heat exchanger 3 to ensure that the heat from the cold-end heat exchanger 3 can be transferred to the thermoelectric cooling element 41.

[0034] In some implementations, such as Figure 4 As shown, the thermoelectric cooling cover 2 is provided with several through slots, and a thermoelectric cooling chip 41 is arranged in each through slot. The bottom of the thermoelectric cooling chip 41 forms the cold end of the thermoelectric cooling chip 41 and is connected to the cold end heat exchanger 3. A first thermoelectric heat-conducting layer is provided between the two. The top of the thermoelectric cooling chip 41 forms the hot end of the thermoelectric cooling chip 41 and is connected to the hot end heat exchanger 5. A second thermoelectric heat-conducting layer is provided between the two. The top of the thermoelectric cooling chip 41 should protrude from the surface of the through slot. Thermoelectric heat insulation components 42 are provided between different thermoelectric cooling chips 41 to ensure that the heat of the thermoelectric cooling chip 41 is transferred to the hot end heat exchanger 5 more efficiently.

[0035] In some embodiments, the thermoelectric cooling assembly 4 further includes a first thermoelectric thermally conductive layer and a second thermoelectric thermally conductive layer. The first thermoelectric thermally conductive layer is located between the thermoelectric cooling chip 41 and the cold-end heat exchanger 3, and the second thermoelectric thermally conductive layer is located between the thermoelectric cooling chip 41 and the hot-end heat exchanger 5. Specifically, the first and second thermoelectric thermally conductive layers can be thermally conductive silicone grease. By setting the first and second thermoelectric thermally conductive layers, the heat transfer efficiency between the thermoelectric cooling chip 41 and the cold-end heat exchanger 3, as well as between the thermoelectric cooling chip 41 and the hot-end heat exchanger 5, can be improved.

[0036] In some embodiments, the cold-end heat exchanger 3 includes a cold-end base 31 and a plurality of cold-end heat dissipation fins 32. The cold-end heat dissipation fins 32 are disposed on the cold-end base 31 and are located within the phase change zone 10-3. The cold-end base 31 is disposed at the bottom of the thermoelectric cooling cover 2. The cold-end base 31 and the thermoelectric cooling cover 2 can be detachably connected by bolts. The cold-end base 31 is attached to the thermoelectric refrigeration assembly 4. The cold-end heat dissipation fins 32 are in direct contact with the gaseous cooling medium for condensation.

[0037] In some embodiments, a heat insulation component 22 is provided between the cold end base 31 and the thermoelectric cooling cover 2. The heat insulation component 22 can be a heat-insulating rubber gasket to prevent heat exchange between the cold end base 31 and the thermoelectric cooling cover 2. Specifically, the heat from the cold end heat exchanger 3 is mainly transferred to the thermoelectric cooling assembly 4 through the cold end base 31, while minimizing the transfer to the thermoelectric cooling cover 2. Since the thermoelectric cooling cover 2 is connected to the chassis 1, the heat from the thermoelectric cooling cover 2 will also be transferred to the coolant through the chassis 1. Therefore, it is necessary to reduce the amount of heat transferred from the cold end heat exchanger 3 to the thermoelectric cooling cover 2. Furthermore, the thermoelectric heat insulation component 42 and the heat insulation component 22 can be made of heat-insulating foam, which can be polyurethane foam, rubber foam, or polyethylene foam.

[0038] In some embodiments, the cold-end heat dissipation fins 32 are provided with a plurality of condensation channels 321. The condensation channels 321 can be grooves, allowing the condensed coolant to flow from the phase change zone 10-3 to the immersion zone 10-4. Both the cold-end heat dissipation fins 32 and the condensation channels 321 extend toward the immersion zone 10-4. Specifically, both the cold-end heat dissipation fins 32 and the condensation channels 321 extend vertically, and the condensation channels 321 extend from the side of the cold-end heat dissipation fins 32 closest to the cold-end base 31 to the other side. The side of the condensation channels 321 away from the cold-end base 31 is an open structure to facilitate liquid flow. With the above arrangement, by designing condensation channels 321 on both sides of each cold-end heat dissipation fin 32, the coolant vapor can be quickly condensed upon encountering the cold-end heat dissipation fins 32, and converge at the condensation channels 321, then flow back to the immersion zone 10-4 under the action of gravity.

[0039] In some embodiments, the chassis 1 is made of aluminum alloy, which has a high thermal conductivity. The chassis 1 is a one-piece molded package. Specifically, the chassis 1 cools the coolant, further reducing its temperature, improving cooling efficiency, and saving energy. Specifically, the chassis 1 adopts a one-piece molded, non-disassembly sealed design in the vertical direction. The cross-section of the chassis 1 can be rectangular. The front, back, left, and right sides of the chassis 1 are formed by extruding aluminum alloy, and an aluminum alloy base plate is welded to the bottom surface to complete the seal. The chassis 1 is a one-piece molded component, requiring no disassembly or assembly, ensuring virtually no leakage points after the coolant is poured into the chassis 1. To facilitate the installation of the motherboard 300 inside the chassis 1, guide rails are provided on the left and right inner walls of the chassis 1 to fix the motherboard 300. Simultaneously, to cooperate and seal with the thermoelectric cooling cover 2, a sealing groove is designed on the upper surface of the chassis 1, and a sealing ring is placed therein, achieving a sealed connection between the thermoelectric cooling cover 2 and the chassis 1.

[0040] In some implementations, the motherboard 300 is the core of the edge electronic device, which can be a server or other device. It typically integrates powerful processors, such as multi-core CPUs (Central Processing Units), GPUs (Graphics Processing Units), and FPGAs (Field-Programmable Gate Arrays), to provide the necessary computing power for edge computing. In the heat dissipation design of the edge electronic device, the processor, memory, and power module on the motherboard 300 are usually the main sources of heat generation. The motherboard 300 is secured by a mounting bracket and a thermoelectric cooling cover 2, and is vertically immersed in the coolant within the chassis 1. The upper part of the motherboard 300 primarily houses the I / O components of the electronic devices, such as VGA (Video Graphics Array), USB (Universal Serial Bus), and power interfaces. The lower middle part primarily houses the main processing and computing components of the electronic devices, ensuring that the immersion coolant can directly contact these high-power heat-generating components 100. These heat-generating components 100 can be MCU (Microcontroller Unit) components, PCH (Platform Controller Hub) components, GPU components, or VR (Virtual Reality) components. Simultaneously, the motherboard 300 also features multiple temperature detection components 81 to collect real-time temperature information from each heat-generating component 100 and transmit the temperature signals to the controller 82. Furthermore, the motherboard 300 also includes a liquid level detection component 83 to monitor the coolant level within the chassis 1 in real-time, preventing insufficient or rapid coolant loss.

[0041] In some embodiments, chassis 1 is provided with heat dissipation fins 11 on its peripheral and bottom surfaces. These heat dissipation fins 11 can be straight-toothed fins, providing good heat dissipation. The coolant transfers heat to the heat dissipation fins 11 through the chassis 1. Specifically, to enhance the natural convection heat dissipation capability of chassis 1, straight-toothed heat dissipation fins are designed on all five surfaces. The heat dissipation fins 11 on the sides of chassis 1 extend in the same direction as the direction of gravity, while the heat dissipation fins 11 on the bottom of chassis 1 extend in the same direction as the length of chassis 1. Furthermore, to enhance the radiative heat exchange capability between chassis 1 and the environment, a radiative cooling coating is sprayed onto the outer wall of chassis 1. This coating helps chassis 1 to radiate heat with the external environment, further increasing the passive heat dissipation capability of chassis 1.

[0042] In some embodiments, to facilitate vacuuming and liquid injection inside the chassis 1, a liquid injection port 12 and a vacuum port 13 are provided on the side wall of the chassis 1. The liquid injection port 12 corresponds to the position of the immersion zone 10-4, and the vacuum port 13 corresponds to the position of the phase change zone 10-3. When it is necessary to fill the chassis 1 with coolant, coolant is introduced through the liquid injection port 12, and then the gas inside the chassis 1 is discharged through the vacuum port 13. The vacuum port 13 can also discharge excess gas during use.

[0043] In some embodiments, a plurality of fasteners 21 are also included. The fasteners 21 are used to install the hot-end heat exchanger 5 onto the thermoelectric cooling cover 2. One end of the fastener 21 is connected to the hot-end heat exchanger 5, and the other end is connected to the thermoelectric cooling cover 2. The connection position between at least one of the hot-end heat exchanger 5 and the thermoelectric cooling cover 2 and the fastener 21 is adjustable to adjust the distance between the hot-end heat exchanger 5 and the thermoelectric cooling cover 2. Specifically, the fastener 21 can be a bolt, and the thermoelectric cooling cover 2 and the hot-end heat exchanger 5 can be provided with threaded holes or other connection structures. By rotating the fastener 21, the distance between the thermoelectric cooling cover 2 and the hot-end heat exchanger 5 can be adjusted for easy operation. The above-mentioned setup, with fasteners 21 supporting the hot-end heat exchanger 5, allows the hot-end heat exchanger 5 to be suspended above the thermoelectric cooling cover 2, thus creating a gap between the hot-end heat exchanger 5 and the thermoelectric cooling cover 2. By placing both the thermoelectric refrigeration assembly 4 and the hot-end heat exchanger 5 on the thermoelectric cooling cover 2, it is for the convenience of installation and to prevent excessive pressure from the hot-end heat exchanger 5 on the thermoelectric refrigeration assembly 4. The fasteners 21 can be adjusted to change the gap between the hot-end heat exchanger 5 and the thermoelectric cooling cover 2, thereby ensuring that the pressure on the thermoelectric refrigeration assembly 4 does not exceed its maximum pressure resistance value, thus ensuring the effectiveness of the thermoelectric refrigeration assembly 4.

[0044] In some implementation methods, please refer to Figure 1 and Figure 6 It also includes: a fan assembly 7, which is mounted on the hot-end heat exchanger 5 and is used to provide cooling airflow to the hot-end heat exchanger 5; the fan assembly 7 can be an axial fan assembly 7; a temperature detection component 81, which is used to obtain the temperature of the heating element 100 and / or the cold-end heat exchanger 3; and a controller 82, which is connected to the temperature detection component 81, the thermoelectric cooling assembly 4 and the fan assembly 7, and is used to control the power of the thermoelectric cooling assembly 4 and / or the speed of the fan assembly 7 according to the temperature of the heating element 100 and / or the cold-end heat exchanger 3.

[0045] The above configuration, through the fan assembly 7, enables the heat exchanger 5 to be cooled by the airflow generated by the fan assembly 7, achieving natural convection cooling. Furthermore, the temperature of the heating element 100 is obtained through the temperature detection component 81. Based on the actual temperature of the heating element 100—for example, real-time or at set intervals—the fan assembly 7 speed or the power of the thermoelectric cooling assembly 4 can be adjusted. During system startup and start-up, because the temperature of the heating element 100 rises slowly, only the fan assembly 7 needs to be adjusted. The speed of the fan assembly 7 can be adjusted according to the temperature of the heating element 100. Once the system enters a stable operating phase, the power of the thermoelectric cooling assembly 4 and / or the speed of the fan assembly 7 can be adjusted based on the temperature of the heating element 100. The speed of the fan assembly 7 has a relatively small impact on the temperature of the heating element 100, while the power of the thermoelectric cooling assembly 4 has a relatively large impact on the temperature of the heating element 100. Therefore, for large temperature fluctuations, the power of the thermoelectric cooling assembly 4 can be adjusted, while for small temperature fluctuations, the speed of the fan assembly 7 can be adjusted. By combining the thermoelectric cooling assembly 4 and the fan assembly 7, the control accuracy of the heat dissipation system can be improved, energy savings can be maximized, and costs can be reduced.

[0046] In some embodiments, a liquid level detection component 83 is also included to obtain the liquid level of the coolant in the chassis 1. The liquid level detection component 83 is connected to the controller 82. The controller 82 is also used to control the start and stop of the motherboard 300 according to the liquid level of the coolant, so as to avoid damage to the heating element 100 due to the liquid level of the coolant.

[0047] In one specific embodiment, the controller 82 is used to acquire signal values ​​from the temperature detection component 81 and the liquid level detection component 83 in real time, and adjust the working state of the thermoelectric cooling component 4 and the fan component 7 in real time according to the temperature state of the heating element 100, and determine whether to stop and replenish liquid in real time according to the liquid level state, so as to achieve dynamic control and safety and energy saving. The controller 82 can be the MCU component 200 on the motherboard 300, which can acquire signal values ​​from the temperature detection component 81 and the liquid level detection component 83 in real time, and realize the control of the working state of the thermoelectric cooling component 4 and the fan component 7 through logic analysis.

[0048] In some embodiments, the hot-end heat exchanger 5 includes a lower hot-end heat exchanger 51, an upper hot-end heat exchanger 52, and a hot-end heat exchanger heat pipe 53. Both the lower hot-end heat exchanger 51 and the upper hot-end heat exchanger 52 include a plurality of hot-end heat exchanger fins 54. Through the cooperation of the hot-end heat exchanger fins 54 and the fan assembly 7, the heat dissipation efficiency of the lower hot-end heat exchanger 51 and the upper hot-end heat exchanger 52 is achieved. The bottom of the lower hot-end heat exchanger 51 is in contact with the thermoelectric cooling assembly 4, allowing the heat from the thermoelectric cooling assembly 4 to be directly transferred to the lower hot-end heat exchanger 51. One end of the hot-end heat pipe 53 is connected to the bottom of the lower hot-end heat exchanger 51 or the thermoelectric cooling assembly. The surface of component 4 is connected, and the other end is connected to the upper hot-end heat exchanger 52. The lower hot-end heat exchanger 51 or the thermoelectric cooling component 4 is connected to the upper hot-end heat exchanger 52 through the heat pipe 53 of the hot-end heat exchanger, so as to transfer the heat of the lower hot-end heat exchanger 51 or the heat of the thermoelectric cooling component 4 to the upper hot-end heat exchanger 52, thereby further improving the heat dissipation efficiency. Specifically, the heat pipe 53 of the hot-end heat exchanger is filled with a heat exchange medium, which can be a two-phase heat exchange medium. Any medium that can transfer the heat of the lower hot-end heat exchanger 51 or the heat of the thermoelectric cooling component 4 to the upper hot-end heat exchanger 52 is acceptable.

[0049] Furthermore, the lower hot-end heat exchanger 51 is locked with screws and the thermoelectric cooling cover 2. The lower surface of the lower hot-end heat exchanger 51 is in contact with the hot end of the thermoelectric cooling component 4 through thermal grease. The upper hot-end heat exchanger 52 and the lower hot-end heat exchanger 51 are connected by the heat pipe 53 of the hot-end heat exchanger and fixed to the inside of the waterproof cap 9 with screws. In order to enhance the heat dissipation capacity of the hot-end heat exchanger 5, fan assemblies 7 are installed at the air inlets of both the upper hot-end heat exchanger 52 and the lower hot-end heat exchanger 51 to form forced convection. The fan assemblies 7 are powered by connecting to the motherboard 300 through cables and are controlled by the controller 82 on the motherboard 300 to adjust their working status.

[0050] In some embodiments, the fan assembly 7 includes an upper fan assembly 72 and a lower fan assembly 71. The upper fan assembly 72 is disposed on the upper hot end heat exchanger 52, and the lower fan assembly 71 is disposed on the lower hot end heat exchanger 51. Both the upper fan assembly 72 and the lower fan assembly 71 are connected to the controller 82 to facilitate the adjustment of the speed of the upper fan assembly 72 and the lower fan assembly 71.

[0051] In some implementations, the controller 82 can control the speed of the upper fan assembly 72 and the lower fan assembly 71 separately. By controlling the upper fan assembly 72 and the lower fan assembly 71 separately by the controller 82, more precise regulation can be made as needed. In actual use, the upper fan assembly 72 and the lower fan assembly 71 can be turned on as needed. Only the upper fan assembly 72 or only the lower fan assembly 71 can be turned on. When the heat dissipation demand is low, only one of the upper fan assembly 72 and the lower fan assembly 71 can be turned on. This setting can reduce energy consumption and minimize costs. On the other hand, since the fan assembly 7 is noisy, controlling only one of the upper fan assembly 72 and the lower fan assembly 71 to turn on can effectively reduce noise.

[0052] In some embodiments, both the lower hot-end heat exchanger 51 and the upper hot-end heat exchanger 52 include a first plate 55 and a second plate 56. The first plate 55 is located on the side of the second plate 56 facing away from the chassis 1. The hot-end heat exchanger fins 54 are located between the first plate 55 and the second plate 56. The fan assembly 7 is installed between the first plate 55 and the second plate 56, and the airflow direction of the fan assembly 7 is parallel to the extension direction of the hot-end heat exchanger fins 54. Further, one end of the hot-end heat pipe 53 is connected to the second plate 56 of the lower hot-end heat exchanger 51, and the other end is connected to the second plate 56 of the upper hot-end heat exchanger 52. Specifically, the fan assembly 7 includes multiple fan components, which can be arranged at intervals to provide uniform heat dissipation airflow for the entire lower hot-end heat exchanger 51 or upper hot-end heat exchanger 52. The cooperation between the hot-end heat exchanger fins 54 and the heat dissipation components can accelerate heat dissipation.

[0053] In some embodiments, a waterproof cap 9 is also included. The waterproof cap 9 is disposed on the upper part of the chassis 1 and covers the outside of the hot end heat exchanger 5, the thermoelectric refrigeration assembly 4 and the thermoelectric cooling cover 2. The waterproof cap 9 is provided with heat dissipation holes for heat dissipation airflow to ensure smooth flow of heat dissipation airflow.

[0054] In some embodiments, the interior of the waterproof cap 9 is further provided with a partition 91. The extension direction of the partition 91 is parallel to the extension direction of the thermoelectric cooling cover 2, and the upper hot-end heat exchanger 52 is placed on the partition 91, with the heat pipe 53 of the hot-end heat exchanger passing through the partition 91. The partition 91 effectively supports the upper hot-end heat exchanger 52, reducing the pressure on the heat pipe 53 of the hot-end heat exchanger. The structure of the waterproof cap 9 is mainly used to provide waterproofing and structural support for the chassis 1. The waterproof cap 9 is fixed to the upper left and right sides of the chassis 1 with screws. The length and width of the waterproof cap 9 both exceed the chassis 1, that is, the vertical projection of the waterproof cap 9 should be able to cover the vertical projection of the chassis 1 to form a complete coverage of the chassis 1. The upper hot-end heat exchanger 52 and the fan assembly 7 of the hot-end heat exchanger 5 are fixed on the waterproof inner side.

[0055] Specifically, in one embodiment, the immersion cooling system combines four cooling technologies: liquid cooling, thermoelectric cooling, natural convection, and radiation cooling. It implements two-phase immersion cooling within a sealed chassis 1, while simultaneously incorporating thermoelectric cooling elements 41 and radiation cooling technology to improve cooling efficiency. The system is then regulated as a whole by a control system, achieving efficient heat dissipation even in harsh environments. The system includes a chassis 1, a thermoelectric cooling cover 2, coolant, and a control system. The control system includes a controller 82, a liquid level detection component 83, and a temperature detection component 81. The chassis 1 primarily provides space for the internal coolant and motherboard 300, and provides a waterproof and dustproof physical environment for the motherboard 300. The thermoelectric cooling cover 2 and its connected components primarily provide condensation conditions for the coolant undergoing phase change within the chassis 1, allowing it to condense and flow back to the immersion zone 10⁻⁴. Simultaneously, the thermoelectric cooling cover 2 also provides a certain heat dissipation environment and waterproof and dustproof protection to ensure the normal operation of the condensation end inside the chassis 1 and the I / O (Input / Output) interfaces of external electronic devices. The thermoelectric cooling cover 2 and its connected components adopt a sandwich structure design, which, from bottom to top, consists of: cold-end heat exchanger 3 → thermoelectric cooling cover 2 → thermally conductive silicone grease → thermal insulation foam + thermoelectric cooling assembly 4 → thermally conductive silicone grease → hot-end heat exchanger 5 → waterproof cap 9. The thermoelectric cooling cover 2 is mainly made of sheet metal. Its lower surface and the upper surface of the chassis 1 are fixed with screws and a sealing ring is tightened to form a seal for the entire chassis 1. The thermoelectric cooling cover 2 also has multiple through holes to provide installation space for the cold-end heat exchanger 3 and the I / O components on the motherboard 300. Furthermore, the thermoelectric cooling cover 2 has positioning holes for the motherboard 300 to facilitate fixing to the motherboard 300 inside the chassis 1 with screws. The cold-end heat exchanger 3 is used to cool the coolant vapor undergoing phase change inside the chassis 1, causing it to condense and flow back to the liquid immersion zone 10-4. The cold-end heat exchanger 3 is designed as an aluminum extruded straight-tooth radiator. A small portion of its cold-end base 31 is fixed to the lower surface of the thermoelectric cooling cover 2 by screws. The contact portion between the cold-end base 31 and the thermoelectric cooling cover 2 is thermally insulated by a heat-insulating component 22, such as a heat-insulating rubber gasket, to prevent heat exchange between them. Most of the structure of the cold-end base 31 is separate from the thermoelectric cooling cover 2, and the cold energy transfer is formed through the contact between the first thermoelectric thermal conductive layer and the cold end of the upper thermoelectric cooling component 4. The cooling capacity is transferred through the cold end base 31 to the cold end heat dissipation fins 32. The cold end heat dissipation fins 32 are inverted inside the chassis 1 to condense the coolant vapor. The thermoelectric cooling component 4 is used to provide cooling capacity to the cold end heat exchanger 3. Its lower surface is in contact with the cold end heat exchanger 3 base through thermal grease, and its upper surface is in contact with the hot end heat exchanger 5 base through thermal grease. It is connected to the motherboard 300 for power supply through a cable and is controlled by the controller 82 on the motherboard 300 to adjust its working state.Since the thermoelectric cooling chip 41 is relatively small in thickness, in order to prevent the hot end of the thermoelectric cooling chip 41 from interfering with the cold end, heat insulation foam is filled around the thermoelectric cooling chip 41. The heat insulation foam has a single-sided adhesive backing and is attached to the surface of the cold end base 31 of the cold end heat exchanger 3. The hot end heat exchanger 5 is used to dissipate heat from the hot end of the thermoelectric cooling chip 41.

[0056] Furthermore, the coolant directly contacts the main heat-generating components 100 of the electronic equipment, relying on its sensible and latent heat to dissipate a large amount of heat. Since the motherboard 300 contains a large number of electronic components, the coolant needs to have excellent electrical insulation properties to prevent short circuits or other electrical faults. In this application, a fluorocarbon coolant with good insulation and phase change characteristics is selected. The coolant is injected into the chassis 1 through the injection port 12. The volume of the immersion zone 10-4 accounts for about 3 / 4 of the total volume of the chassis 1, which can ensure that the main heat-generating areas of the motherboard 300 are covered. The remaining 1 / 4 of the chassis 1 is the phase change zone 10-3. After absorbing a large amount of heat from the motherboard 300, the immersion coolant undergoes a phase change. The coolant vapor concentrates in the phase change zone 10-3 and condenses and flows back to the immersion zone 10-4 after contacting the cold end heat exchanger 3. In addition to carrying away a large amount of heat from electronic devices through the phase change latent heat, the submerged coolant, which does not undergo phase change, stores a large amount of sensible heat. It is in direct contact with the chassis 1 and transfers this heat to the chassis heat dissipation fins 11 outside the chassis 1, and dissipates it to the outdoor environment through natural convection.

[0057] Please refer to Figure 5 The immersion cooling system forms a hot-end heat dissipation zone 10-1 through the arrangement of the hot-end heat exchanger 5 and the fan assembly 7, a thermoelectric cooling zone 10-2 through the arrangement of the thermoelectric cooling assembly 4, a phase change zone 10-3 through the arrangement of the cold-end heat exchanger 3, an immersion zone 10-4 through the arrangement of the coolant, and a natural convection zone 10-5 outside the chassis 1 through the arrangement of the chassis heat dissipation fins 11. The formation of the above zones can complement each other and improve the heat dissipation efficiency of the heat-generating element 100.

[0058] In addition to the aforementioned immersion cooling system, this invention also provides a control method for the immersion cooling system, which can be implemented using the aforementioned immersion cooling system. Please refer to [link / reference needed]. Figure 7 and Figure 8 The control method for this immersion cooling system includes the following steps.

[0059] When the motherboard 300 inside chassis 1 is running and in the power-on and startup phase, the following steps are included.

[0060] Step S11: The thermoelectric cooling component 4 and the fan component 7 are turned on simultaneously. The thermoelectric cooling component 4 operates under medium load to establish initial condensation capacity, and the fan component 7 is started simultaneously to form a preliminary forced convection path.

[0061] Step S12: Obtain the temperature of the heating element 100 and adjust the speed of the fan assembly 7 in real time according to the temperature of the heating element 100.

[0062] Step S13: Based on the temperature change of the heating element 100, determine whether the condensation effect of the cold end heat exchanger 3 is effective, and when the condensation effect of the cold end heat exchanger 3 is ineffective, control the main board 300 to stop running; obtain the liquid level of the coolant in the immersion zone 10-4, and when the liquid level of the coolant in the immersion zone 10-4 is lower than the target liquid level, issue an alarm signal and control the main board 300 to stop running.

[0063] Once the motherboard 300 inside chassis 1 is running and in a stable operating phase, the following steps are included.

[0064] Step S21: Obtain the temperature of the heating element 100, and adjust the power of the thermoelectric cooling assembly 4 and the speed of the fan assembly 7 according to the temperature of the heating element 100.

[0065] Step S22: Obtain the surface temperature of the cold end heat exchanger 3, and increase the power of the thermoelectric cooling component 4 when the surface temperature of the cold end heat exchanger 3 is greater than or equal to the target surface temperature.

[0066] Step S23: Obtain the coolant level in the immersion zone 10-4, and after the coolant level in the immersion zone 10-4 is lower than the target level, issue an alarm signal and control the mainboard 300 to stop running; that is, execute a power-off strategy on the mainboard 300.

[0067] The immersion cooling system control method is divided into a power-on and startup phase and a stable operation phase, based on the operating status of the motherboard 300 inside the chassis 1. During the power-on and startup phase, the thermoelectric cooling component 4 is activated and operates at a medium load to establish initial condensation capacity. The fan assembly 7 starts simultaneously, forming an initial forced convection path. Then, the temperature of the heating element 100 is monitored, and the speed of the fan assembly 7 is adjusted in real time according to the temperature of the heating element 100. Since the power consumption of the heating element 100 on the motherboard 300 is not increased temporarily during the power-on and startup phase, the heat dissipation pressure of the heating element 100 is relatively small. Furthermore, the thermoelectric cooling chip 41 has been set to a medium load, and its cooling capacity can meet the heat dissipation requirements of the heating element 100. By monitoring the temperature change of the heating element 100, it is determined whether the condensation effect of the cold end heat exchanger 3 is effective. When the condensation effect of the cold end heat exchanger 3 is ineffective, the main board 300 is controlled to stop running. At the same time, by monitoring the coolant level in the immersion zone 10-4, the abnormality of the heat dissipation system can be effectively prevented. The goal of this stage is to achieve the rapid heat transfer and condensation reflux closed loop of the high-power heating element 100 of the main board 300 in the initial operating state, laying the foundation for temperature control for subsequent high-load operation.

[0068] Furthermore, during the stable operation phase, the temperature of the heating element 100 is detected, and the power of the thermoelectric cooling component 4 and the speed of the fan component 7 are adjusted to achieve real-time monitoring and adjustment of the thermoelectric cooling component 4, the fan component 7, and the temperature detection component 81. This immersion cooling system control method has adaptive adjustment capabilities, a reliable anomaly detection mechanism, and a comprehensive safety protection strategy, enabling stable operation of the edge server in harsh environments such as high temperature, high humidity, and high dust without human intervention. Compared with the two-phase cooling scheme in related technologies, this system significantly improves thermal management efficiency, equipment reliability, and operating economy, and is suitable for various edge computing deployment scenarios.

[0069] In some implementations, the method further includes the following steps: after the motherboard 300 inside the chassis 1 is running and in a stable operating phase, the temperature of the cold end heat exchanger 3 is obtained, and when the temperature of the cold end heat exchanger 3 is greater than or equal to the preset temperature, it indicates that the cooling capacity of the thermoelectric cooling chip 41 is insufficient and the power of the thermoelectric cooling assembly 4 needs to be increased; the temperature of the heating element 100 is obtained, and when the temperature of the heating element 100 is greater than or equal to the target temperature, the power of the thermoelectric cooling assembly 4 is increased, and the speed of the fan assembly 7 is adjusted to the maximum speed.

[0070] In some implementations, when the temperature of the cold end heat exchanger 3 is greater than or equal to the preset temperature and remains at the target time, or when the rate of drop in the coolant level in the immersion zone 10-4 is greater than or equal to the target rate, an alarm signal is issued and the main board 300 is controlled to stop operating; that is, a power-off strategy is implemented on the main board 300.

[0071] In some embodiments, the immersion cooling system further includes a temperature detection component 81, which is used to obtain the temperature of the heating element 100 and / or the cold-end heat exchanger 3; it also includes the following steps: when the motherboard 300 in the chassis 1 is powered on but not running, the immersion cooling system is in the pre-start detection stage, which determines whether the temperature detection component 81 is abnormal, whether the coolant level in the immersion zone 10-4 is sufficient, and whether the thermoelectric cooling component 4 and the fan assembly 7 are in place. If the temperature detection component 81 is abnormal, the coolant level in the immersion zone 10-4 is insufficient, and / or the thermoelectric cooling component 4 and the fan assembly 7 are not in place, the immersion cooling system is controlled to enter a protection state. If the temperature detection component 81 is normal, the coolant level in the immersion zone 10-4 is sufficient, and the thermoelectric cooling component 4 and the fan assembly 7 are both in place, the immersion cooling system is controlled to enter the start-up preparation stage in order to control the motherboard 300 to run; the pre-start detection stage, the start-up stage, and the stable operation stage are performed sequentially.

[0072] Specifically, in one embodiment, the immersion cooling system control method includes the following three stages.

[0073] Pre-boot detection phase: After the motherboard 300 is powered on, before booting, the MCU component 200 first enters the pre-initialization working state. At this time, the MCU component 200 takes over the system initialization logic and performs status acquisition and analysis, including the following aspects: Temperature detection component 81: acquires the initial temperature signal of the core area of ​​the motherboard 300; Liquid level detection component 83: determines whether the coolant is sufficient; Status of thermoelectric cooling component 4 and fan component 7: detects whether they are in place; After analyzing all initial signals, if the MCU component 200 detects insufficient liquid level, abnormal temperature detection component 81, or absence of thermoelectric cooling component 4 and fan component 7, the control logic enters the protection state, preventing the motherboard 300 from further booting operations, and simultaneously issues an alarm prompt through a buzzer or status indicator light, prompting the user to replenish liquid or perform maintenance; If the liquid level is sufficient, the temperature detection component 81 is in normal condition, and both thermoelectric cooling component 4 and fan component 7 are in place, the system enters the startup preparation phase.

[0074] Power-on and Startup Phase: Once the system confirms entry into the startup preparation phase, the MCU element 200 issues a power-on command, officially powering on the motherboard 300 and starting it up. As the motherboard 300 loads the BIOS and operating system, all system modules simultaneously enter the working state. During this phase, the MCU element 200 initiates the following control strategies: activating the thermoelectric cooling component 4, setting it to medium load operation (approximately 50% PWM duty cycle) to establish initial condensation capacity; simultaneously activating the fan component 7 to form a preliminary forced convection path; adjusting the speed of the fan component 7 in real time according to linear control logic based on feedback data from the temperature detection component 81; detecting temperature fluctuations of the heating element 100 within the immersion zone 10-4 to determine if system condensation is effective. For example, by detecting the temperature detection component 81 embedded upstream of the motherboard 300, it can be determined whether the temperature value of the heating element 100 is continuously rising. If it is continuously rising, it indicates that the high-temperature steam has not effectively condensed; if there is a dynamic of rising and then falling, it indicates that condensation is effective; continuing to monitor the coolant level and environmental conditions to prevent system abnormalities; the environmental conditions can be monitored through the temperature detection components 81 upstream and downstream of the motherboard 300. The goal of this stage is to achieve rapid heat transfer and condensation reflux closed loop establishment of the high-power heating element 100 on the motherboard 300 in the initial operating state, laying the foundation for temperature control in subsequent high-load operation.

[0075] Normal operation phase: After the electronic device enters a stable operation phase, such as after the operating system completes startup and begins data processing tasks, the MCU element 200 switches to dynamic thermal management mode. At this time, the system heat load changes with the calculated pressure of the heating element 100, and the MCU element 200 needs to adaptively adjust the entire thermal management module. The control strategies include: temperature feedback closed-loop control: real-time reading of temperature data from each temperature detection component 81, and adjustment of the working state of the thermoelectric cooling component 4 through a PID control algorithm to achieve precise temperature control; dynamic adjustment of fan component 7 speed: adjusting the speed of fan component 7 through a PID control algorithm to improve heat dissipation efficiency or reduce power consumption. Specifically, a PID calculation can be performed based on the temperature information of each module and compared, and the largest calculated value is taken as the output value; phase change condensation path management: by detecting the surface temperature of the cold end heat exchanger 3, it is determined whether there is a risk of insufficient condensation, and the power of the thermoelectric cooling chip 41 is increased to maintain condensation capacity; abnormal protection mechanism: if the temperature of the heating element 100 exceeds the limit... Upon reaching the target temperature, MCU component 200 immediately increases the power of thermoelectric cooling component 4 and adjusts the speed of fan component 7 to its maximum speed. If the coolant level suddenly drops or the condensation delay exceeds the specified period, the MCU will trigger an alarm or power-off strategy. The condensation delay exceeding the specified period means that if the temperature cannot be reduced to below the preset temperature within a specified time (generally 2-3 minutes) after the temperature of the cold end heat exchanger 3 is detected to exceed the preset temperature, it indicates that the delay time exceeds the specified period. During the entire operation, MCU component 200 is also responsible for recording key operating parameters, including temperature data from various sensors, PWM duty cycle of the cooling chip, current and speed of fan component 7, fault alarm history, etc., and can upload them to the remote operation and maintenance platform through the communication interface on the motherboard 300 to realize remote monitoring and debugging of the heat dissipation system in edge electronic devices.

[0076] In addition to the above-mentioned immersion cooling system and its control method, the present invention also provides an electronic device including the above-mentioned immersion cooling system. For the structure of other parts of the electronic device, please refer to the relevant technology, which will not be repeated here.

[0077] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0078] The immersion cooling system, its control method, and electronic equipment provided by this invention have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this invention. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of this invention. It should be noted that those skilled in the art can make various improvements and modifications to this invention without departing from its principles, and these improvements and modifications also fall within the protection scope of this invention.

Claims

1. An immersion cooling system, characterized in that, include: The chassis (1) has an internal cavity for placing a heating element (100), and the cavity has a phase change zone (10-3) and an immersion zone (10-4), and the immersion zone (10-4) is filled with coolant; A thermoelectric cooling cover (2) is provided on the top of the chassis (1) to seal the cavity; A cold-end heat exchanger (3) is disposed at the bottom of the thermoelectric cooling cover (2) and extends to the phase change zone (10-3) of the cavity. Thermoelectric cooling component (4) is disposed through the thermoelectric cooling cover (2). The cold end of the thermoelectric cooling component (4) is in contact with the cold end heat exchanger (3) so that the heat of the cold end heat exchanger (3) is transferred to the cold end of the thermoelectric cooling component (4). A hot-end heat exchanger (5) is disposed on the top of the thermoelectric cooling cover (2). The hot-end heat exchanger (5) is in contact with the hot end of the thermoelectric refrigeration assembly (4) so ​​that the heat of the hot end of the thermoelectric refrigeration assembly (4) is transferred to the hot-end heat exchanger (5).

2. The immersion cooling system according to claim 1, characterized in that, The thermoelectric cooling assembly (4) includes a plurality of thermoelectric cooling plates (41) and a plurality of thermoelectric insulation components (42), wherein each of the thermoelectric cooling plates (41) is arranged in an array, and the thermoelectric insulation components (42) are located between adjacent thermoelectric cooling plates (41).

3. The immersion cooling system according to claim 2, characterized in that, The thermoelectric cooling assembly (4) further includes a first thermoelectric thermal conductive layer and a second thermoelectric thermal conductive layer. The first thermoelectric thermal conductive layer is located between the thermoelectric cooling chip (41) and the cold end heat exchanger (3), and the second thermoelectric thermal conductive layer is located between the thermoelectric cooling chip (41) and the hot end heat exchanger (5).

4. The immersion cooling system according to claim 1, characterized in that, The cold end heat exchanger (3) includes a cold end base (31) and a plurality of cold end heat dissipation fins (32). The cold end heat dissipation fins (32) are disposed on the cold end base (31) and are located within the phase change zone (10-3). The cold end base (31) is detachably disposed at the bottom of the thermoelectric cooling cover (2) and is attached to the thermoelectric refrigeration assembly (4).

5. The immersion cooling system according to claim 4, characterized in that, A heat insulation component (22) is provided between the cold end base (31) and the thermoelectric cooling cover (2).

6. The immersion cooling system according to claim 4, characterized in that, The cold end heat dissipation fins (32) are provided with a plurality of condensation channels (321) for the condensed coolant to flow from the phase change zone (10-3) to the immersion zone (10-4). The cold end heat dissipation fins (32) and the condensation channels (321) both extend toward the immersion zone (10-4).

7. The immersion cooling system according to any one of claims 1 to 6, characterized in that, The chassis (1) is provided with chassis heat dissipation fins (11) on its periphery and bottom surface. The coolant transfers heat to the chassis heat dissipation fins (11) through the chassis (1); and / or, the outer surface of the chassis (1) is provided with a radiation cooling coating.

8. The immersion cooling system according to any one of claims 1 to 6, characterized in that, It also includes several fasteners (21) for mounting the hot-end heat exchanger (5) onto the thermoelectric cooling cover (2); one end of the fastener (21) is connected to the hot-end heat exchanger (5) and the other end is connected to the thermoelectric cooling cover (2); the connection position of at least one of the hot-end heat exchanger (5) and the thermoelectric cooling cover (2) with the fastener (21) is adjustable to adjust the distance between the hot-end heat exchanger (5) and the thermoelectric cooling cover (2).

9. The immersion cooling system according to any one of claims 1 to 6, characterized in that, Also includes: A fan assembly (7) is mounted on the hot-end heat exchanger (5) and is used to provide heat dissipation airflow to the hot-end heat exchanger (5). Temperature detection component (81) is used to obtain the temperature of the heating element (100) and / or the cold end heat exchanger (3); The controller (82) is connected to the temperature detection component (81), the thermoelectric cooling assembly (4) and the fan assembly (7). The controller (82) is used to control the power of the thermoelectric cooling assembly (4) and / or the speed of the fan assembly (7) according to the temperature of the heating element (100) and / or the cold end heat exchanger (3).

10. The immersion cooling system according to claim 9, characterized in that, It also includes a liquid level detection component (83) for obtaining the liquid level of the coolant in the chassis (1). The liquid level detection component (83) is connected to the controller (82). The controller (82) is also used to control the start and stop of the motherboard (300) in the chassis (1) according to the liquid level of the coolant.

11. The immersion cooling system according to claim 10, characterized in that, The hot-end heat exchanger (5) includes a lower hot-end heat exchanger (51), an upper hot-end heat exchanger (52), and a hot-end heat exchanger heat pipe (53). Both the lower hot-end heat exchanger (51) and the upper hot-end heat exchanger (52) include a number of hot-end heat exchanger fins (54). The bottom of the lower hot-end heat exchanger (51) is attached to the thermoelectric refrigeration assembly (4). One end of the hot-end heat exchanger heat pipe (53) is connected to the bottom of the lower hot-end heat exchanger (51) or the surface of the thermoelectric refrigeration assembly (4), and the other end is connected to the upper hot-end heat exchanger (52). The hot-end heat exchanger heat pipe (53) is filled with a heat exchange medium.

12. The immersion cooling system according to claim 11, characterized in that, The fan assembly (7) includes a lower fan assembly (71) and an upper fan assembly (72). The upper fan assembly (72) is disposed on the upper hot end heat exchanger (52), and the lower fan assembly (71) is disposed on the lower hot end heat exchanger (51). Both the upper fan assembly (72) and the lower fan assembly (71) are connected to the controller (82).

13. The immersion cooling system according to claim 11, characterized in that, Both the lower hot-end heat exchanger (51) and the upper hot-end heat exchanger (52) include a first plate (55) and a second plate (56). The first plate (55) is located on the side of the second plate (56) away from the chassis (1). The hot-end heat exchanger fins (54) are located between the first plate (55) and the second plate (56). The fan assembly (7) is installed between the first plate (55) and the second plate (56), and the airflow direction of the fan assembly (7) is parallel to the extension direction of the hot-end heat exchanger fins (54).

14. The immersion cooling system according to claim 11, characterized in that, It also includes a waterproof cap (9), which is located on the upper part of the chassis (1) and covers the outside of the hot end heat exchanger (5), the thermoelectric refrigeration assembly (4) and the thermoelectric cooling cover (2); the waterproof cap (9) is provided with heat dissipation holes for heat dissipation airflow.

15. The immersion cooling system according to claim 14, characterized in that, The interior of the waterproof cap (9) is also provided with a partition (91), the extension direction of the partition (91) is parallel to the extension direction of the thermoelectric cooling cover (2), and the upper hot end heat exchanger (52) is placed on the partition (91), and the heat pipe (53) of the hot end heat exchanger passes through the partition (91).

16. A control method for an immersion cooling system, employing the immersion cooling system as described in any one of claims 9 to 15, characterized in that, Includes the following steps: When the motherboard (300) inside the chassis (1) is running and in the power-on and startup phase, the thermoelectric cooling component (4) and the fan component (7) are turned on synchronously, and the thermoelectric cooling component (4) operates under medium load; the temperature of the heating element (100) is obtained, and the speed of the fan component (7) is adjusted in real time according to the temperature of the heating element (100); and, according to the temperature change of the heating element (100), it is determined whether the condensation effect of the cold end heat exchanger (3) is effective, and when the condensation effect of the cold end heat exchanger (3) is ineffective, the motherboard (300) is controlled to stop running; the liquid level of the coolant in the immersion zone (10-4) is obtained, and when the liquid level of the coolant in the immersion zone (10-4) is lower than the target liquid level, an alarm signal is issued, and the motherboard (300) is controlled to stop running; When the motherboard (300) in the chassis (1) is running and in a stable operating phase, the temperature of the heating element (100) is obtained, and the power of the thermoelectric cooling component (4) and the speed of the fan component (7) are adjusted according to the temperature of the heating element (100); the surface temperature of the cold end heat exchanger (3) is obtained, and when the surface temperature of the cold end heat exchanger (3) is greater than or equal to the target surface temperature, the power of the thermoelectric cooling component (4) is increased; the liquid level of the coolant in the immersion zone (10-4) is obtained, and when the liquid level of the coolant in the immersion zone (10-4) is lower than the target liquid level, an alarm signal is issued to control the motherboard (300) to stop running.

17. The immersion cooling system control method according to claim 16, characterized in that, It also includes the following steps: When the motherboard (300) in the chassis (1) is running and in a stable operating phase, the temperature of the cold end heat exchanger (3) is obtained, and when the temperature of the cold end heat exchanger (3) is greater than or equal to the preset temperature, the power of the thermoelectric cooling component (4) is increased; the temperature of the heating element (100) is obtained, and when the temperature of the heating element (100) is greater than or equal to the target temperature, the power of the thermoelectric cooling component (4) is increased, and the speed of the fan component (7) is adjusted to the maximum speed.

18. The immersion cooling system control method according to claim 17, characterized in that, When the temperature of the cold end heat exchanger (3) is greater than or equal to the preset temperature and remains at the target time, or when the liquid level of the coolant in the immersion zone (10-4) drops at a rate greater than or equal to the target rate, an alarm signal is issued and the main board (300) is controlled to stop operating.

19. The immersion cooling system control method according to any one of claims 16 to 18, wherein the immersion cooling system further comprises a temperature detection component (81), the temperature detection component (81) being used to acquire the temperature of the heating element (100) and / or the cold end heat exchanger (3); characterized in that, It also includes the following steps: When the motherboard (300) inside the chassis (1) is powered on but not running, the immersion cooling system is in the pre-start detection stage, determining whether the temperature detection component (81) is abnormal, whether the coolant level in the immersion zone (10-4) is sufficient, and whether the thermoelectric cooling assembly (4) and the fan assembly (7) are in place. If the temperature detection component (81) is abnormal, the coolant level in the immersion zone (10-4) is insufficient, and / or the thermoelectric cooling assembly (4) and the fan assembly (7) are in place, the system will detect any abnormalities. When the fan assembly (7) is not in place, the immersion cooling system is controlled to enter the protection state. If the temperature detection component (81) is normal, the coolant level in the immersion zone (10-4) is sufficient, and the thermoelectric cooling component (4) and the fan assembly (7) are both in place, the immersion cooling system is controlled to enter the start-up preparation stage in order to control the motherboard (300) to run. The pre-start detection stage, the start-up and startup stage, and the stable operation stage are performed in sequence.

20. An electronic device comprising an immersion cooling system, characterized in that, The immersion cooling system is the immersion cooling system according to any one of claims 1 to 15.

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