Flat wire type high-power E-type non-contact power supply electricity taking device
By using a multi-layered interlaced flat wire winding and a graphene heat dissipation layer design, the shortcomings of round wire coils in terms of high current carrying capacity, shape and size are solved, achieving efficient and stable wireless power supply, which is suitable for OHT cranes and stocker equipment in semiconductor manufacturing workshops.
Patent Information
- Application Number
- CN202511082682.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-04
- Publication Date
- 2025-11-04
AI Technical Summary
Existing round wire coils have shortcomings in terms of high current carrying capacity, manufacturing standardization, and size. Furthermore, they suffer from high eddy current losses during high-frequency operation, which affects the stability and reliability of the equipment.
The coil assembly is made of flat wires wound in a multi-layered manner. The adjacent two layers of flat wires are arranged alternately, the gap between layers is controlled within 0.1mm, the slot fill factor reaches more than 92%, the outer layer is wrapped with a graphene thermal conductive film, and an E-type magnetic core made of Mn-Zn ferrite material is used to suppress magnetic saturation. The outer layer of the coil assembly is wrapped with a heat dissipation layer.
It significantly improves the effective cross-sectional area and current carrying capacity of the conductor, reduces AC resistance and eddy current loss, enhances magnetic field coupling efficiency and heat dissipation performance, ensures stable operation of equipment under high-frequency conditions, and is suitable for long-term high-load power supply in complex environments.
Smart Images
Figure CN120895374A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of wireless power supply technology, specifically to a flat-wire high-power E-type non-contact power supply device. Background Technology
[0002] Non-contact power feeders are widely used in OHT cranes, stockers, and other equipment in semiconductor manufacturing workshops, avoiding dust and sparks caused by friction through wireless power supply. Currently, these devices primarily achieve power supply through the interaction of coils and the feeder's magnetic core. However, existing round wire coils exhibit certain limitations in practical applications. For example, round wire coils have insufficient performance when carrying high currents, are difficult to shape during manufacturing, and are relatively bulky. Furthermore, round wire coils are prone to deformation during the impregnation process, affecting subsequent performance. During continuous operation, the skin effect leads to uneven current density distribution on the conductor surface, resulting in increased resistance losses. Simultaneously, the low filler ratio between the round wires limits the increase in magnetic coupling area, thus affecting overall efficiency. These factors pose challenges to the stability and reliability of the equipment. Summary of the Invention
[0003] The purpose of this invention is to provide a flat wire type high-power E-type non-contact power supply device to solve the problems mentioned in the background art.
[0004] To achieve the above objectives, the present invention provides the following technical solution: a flat wire high-power E-type non-contact power collector, comprising an E-type magnetic core and a coil assembly wound on the E-type magnetic core. The coil assembly is made of flat wire wound in a multi-layer stacked manner, and the coil assembly has no skeleton structure. The wire in the coil assembly is a flat wire, and the flat wire is a flat copper busbar with a rectangular cross-section.
[0005] Preferably, the E-type magnetic core includes a winding plate, winding grooves, and pins, and the winding plate has winding grooves on its side for winding wires.
[0006] Preferably, the two ends of the winding plate are bonded to the inner side of the pin by a crimping process, with a crimping depth of 0.5 mm to 1.0 mm.
[0007] Preferably, the slot fill factor of the coil assembly is ≥92%.
[0008] Preferably, the coil assembly is wound in a multi-layered manner with adjacent layers of flat wires arranged alternately.
[0009] Preferably, both ends of the coil assembly are respectively attached to the inner side of the pin.
[0010] Preferably, the surface of the flat copper busbar is coated with an insulating coating, the material of the insulating coating is polyimide, and the surface is subjected to micro-arc oxidation treatment before coating the insulating coating, and the surface roughness Ra value after treatment is 0.2 micrometers to 0.4 micrometers.
[0011] Preferably, the outer layer of the coil assembly is wrapped with a heat dissipation layer, the heat dissipation layer material is a graphene thermal conductive film, and the thickness ranges from 0.1 mm to 0.2 mm.
[0012] Preferably, the heat dissipation layer is bonded to the coil assembly by a hot pressing process, with a hot pressing temperature of 150 degrees Celsius to 180 degrees Celsius and a pressure of 0.2 MPa to 0.3 MPa.
[0013] Preferably, the E-type magnetic core is made of ferrite material with a saturation magnetic induction intensity ≥500mT.
[0014] Compared with existing technologies, the beneficial effects of this invention are as follows: This flat-wire high-power E-type non-contact power collector is made of flat wire wound in a multi-layer stacked manner, with adjacent layers of flat wires arranged alternately and the interlayer gap controlled within 0.1mm, resulting in a slot fill factor of over 92%. This design not only increases the effective cross-sectional area of the conductor but also significantly reduces eddy current losses, thereby improving magnetic field coupling efficiency. Furthermore, compared to round wire, flat wires reduce AC resistance by over 20% and increase current carrying capacity by over 25% under the same cross-sectional area conditions, meeting the requirements for high-current operation. The E-type magnetic core uses Mn-Zn ferrite material with a saturation magnetic induction intensity of 550mT, effectively suppressing magnetic saturation and ensuring stable operation of the equipment under high-frequency working conditions. After the coil assembly is wrapped with a graphene thermal conductive film, the surface area is increased and the heat dissipation performance is significantly improved. The temperature rise is controlled within 40K during continuous operation, making it suitable for long-term high-load scenarios. Moreover, the structure is stable, with strong resistance to vibration and mechanical stress, making it suitable for field use. The magnetic field distribution is uniform, the edge effect is small, and electromagnetic interference (EMI) can be reduced. Attached Figure Description
[0015] Figure 1 This is a three-dimensional structural diagram of the present invention;
[0016] Figure 2 This is a top view of the structure of the present invention;
[0017] Figure 3 This is a schematic diagram of the three-dimensional structure of the E-type magnetic core of the present invention;
[0018] Figure 4 This is a side view of the structure of the present invention.
[0019] In the diagram: 1. Coil assembly; 2. E-type magnetic core; 21. Winding board; 22. Winding slot; 23. Pin. Detailed Implementation
[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0021] Please see Figure 1-4 The present invention provides a technical solution: a flat wire high-power E-type non-contact power supply device, characterized in that: it includes an E-type magnetic core 2 and a coil assembly 1 wound on the E-type magnetic core 2, the coil assembly 1 is made of flat wire wound in a multi-layer stacked manner, and the coil assembly has no skeleton structure, the wire in the coil assembly 1 is a flat wire, and the flat wire is a flat copper busbar with a rectangular cross-section.
[0022] The specific coil assembly has 30 turns, an inductance of 1.7mH, a copper busbar thickness of 0.8-1.2mm, and a width of 5-8mm.
[0023] The E-type magnetic core 2 includes a winding plate 21, a winding groove 22, and pins 23. The winding plate 21 has a winding groove 22 on its side for winding wires.
[0024] The two ends of the winding plate 21 are bonded to the inner side of the pin 23 by a crimping process, with a crimping depth of 0.5 mm to 1.0 mm.
[0025] The slot fill factor of the coil assembly is ≥92%;
[0026] The coil assembly 1 is wound in a multi-layered manner, with adjacent layers of flat wires arranged alternately, and the gap between layers ≤0.1mm.
[0027] The flat copper busbar is coated with an insulating coating made of polyimide. Before coating, it undergoes micro-arc oxidation treatment, and the surface roughness Ra value after treatment is 0.2 micrometers to 0.4 micrometers.
[0028] The coil assembly 1 is wrapped with a heat dissipation layer, which is made of graphene thermal conductive film with a thickness ranging from 0.1 mm to 0.2 mm.
[0029] The heat dissipation layer is bonded to the coil assembly 1 by a hot pressing process, with a hot pressing temperature of 150 degrees Celsius to 180 degrees Celsius and a pressure of 0.2 MPa to 0.3 MPa.
[0030] The E-type magnetic core 2 is made of ferrite material and its saturation magnetic induction intensity is ≥500mT.
[0031] Specifically, the E-type magnetic core 2 is the core component of the entire device. It is made of Mn-Zn ferrite material, which has a saturation magnetic induction intensity of 550mT, effectively suppressing magnetic saturation. The E-type magnetic core 2 includes a winding plate 21, a winding slot 22, and pins 23. Pins 23 are connected to the coil assembly 1 via a transition arc surface with a radius of curvature of 5-10mm. This reduces abrupt changes in magnetic flux density, making the magnetic field distribution more uniform and reducing electromagnetic interference caused by edge effects. The coil assembly 1 has no internal frame structure, and its ends are respectively attached to the inner side of the pins 23. The crimping depth of the coil assembly 1 is 0.5-1.0mm. The crimping process ensures a tight connection between the coil assembly 1 and the pins 23, avoiding increased contact resistance due to loosening.
[0032] Coil assembly 1 is made of flat wire wound in a multi-layered manner. The flat wire has a rectangular cross-section, a thickness ranging from 0.8 to 1.2 mm, and a width ranging from 5 to 8 mm. An insulating coating of polyimide, with a thickness ranging from 0.02 to 0.05 mm, is applied to the surface of the flat wire. Before coating, the insulating coating undergoes micro-arc oxidation treatment, resulting in a surface roughness Ra of 0.2 to 0.4 μm, which enhances the adhesion between the insulating coating and the wire substrate. Coil assembly 1 has 30 turns and an inductance of 1.7 mH. The turns are distributed with 15 turns at the top and 15 turns at the bottom, balancing the magnetic field strength and preventing localized overheating. The staggered angle between adjacent layers of flat wire 5 is 10° to 15°, and the interlayer gap is precisely controlled to below 0.08 mm, achieving a slot fill factor of over 92%. This winding method not only optimizes the space utilization of the conductor but also enhances the mechanical stability of the coil assembly 1, making it less prone to deformation under vibration or stress. The outer layer of the coil assembly 1 is wrapped with a heat dissipation layer made of graphene thermally conductive film with a thickness ranging from 0.1 to 0.2 mm. The heat dissipation layer is bonded to the coil assembly 1 via a hot-pressing process at a temperature of 150-180°C and a pressure of 0.2-0.3 MPa. This hot-pressing process ensures a gapless contact between the heat dissipation layer and the coil assembly 1, further improving heat conduction efficiency. In practical applications, the flat-wire high-power E-type non-contact power supply device of this invention is suitable for non-contact power supply needs in complex environments such as semiconductor manufacturing workshops. Its operating principle is as follows: When current passes through the coil assembly 1, the magnetic field generated by the flat wire is concentrated in the E-type magnetic core, forming a closed magnetic circuit. Because the cross-section of the flat wire is rectangular, compared to traditional round wire, under the same cross-sectional area conditions, the AC resistance is reduced by more than 20%, and the current carrying capacity is increased by more than 25%, meeting the requirements for high-current operation. The transition arc surface design makes the magnetic field distribution more uniform and reduces electromagnetic interference caused by edge effects. The multi-layer winding method of coil assembly 1 and the precise control of the interlayer gaps significantly improve the slot fill factor and reduce eddy current losses, thereby improving the magnetic field coupling efficiency. The heat dissipation layer increases the surface area and significantly improves heat dissipation performance, keeping the temperature rise below 40K during continuous operation. The two ends of coil assembly 1 are connected to the external circuit through a welding process, and the welding points are covered with a protective coating with a thickness of 0.1-0.2mm, made of epoxy resin. The protective coating serves to waterproof, dustproof, and corrosion-resistant, extending the service life of the device. In the actual installation process, the flat wire is first wound onto coil assembly 1 according to the predetermined number of turns and distribution, and then pressed against the inside of pin 23. Subsequently, the heat dissipation layer is attached to coil assembly 1 through a hot-pressing process to ensure tight contact between the two.This invention addresses the shortcomings of existing circular wire coils in terms of high current carrying capacity, manufacturing standardization, and volume by optimizing the winding method, material selection, and structural design of the coil assembly 1. At the same time, it significantly improves the uniformity of magnetic field distribution and heat dissipation performance.
[0033] In specific application scenarios: In semiconductor manufacturing workshops, OHT cranes and stocker equipment require wireless power supply via contactless power sources. First, the E-type magnetic core 2 is fixed to the power supply module of the equipment, ensuring that the transition arc surface between the two pins 23 faces the area of concentrated magnetic field. This design reduces abrupt changes in magnetic flux density and optimizes the magnetic field distribution through a transition arc surface with a curvature radius of 5-10mm, thereby reducing electromagnetic interference caused by edge effects. Subsequently, the coil assembly 1 is installed on the pins 23 according to a predetermined winding method and is pressed against the inner side of the pins 23. The pressing depth is controlled at 0.5-1.0mm to ensure a tight connection between the coil assembly 1 and the pins 23, avoiding increased contact resistance due to loosening. When current flows through the coil assembly 1, the magnetic field generated by the flat conductor is concentrated between the pins 23 of the E-type magnetic core 2, forming a closed magnetic circuit. Because the flat conductor has a rectangular cross-section, compared to traditional round wire, under the same cross-sectional area conditions, the AC resistance is reduced by more than 20%, and the current carrying capacity is increased by more than 25%, meeting the requirements for high-current operation. The coil assembly 1 is wound using a multi-layer stacking method. In the winding slots 22 wound on the winding plate 21, the staggered angle of adjacent layers of flat conductors 5 is 10°-15°, and the interlayer gap is precisely controlled to below 0.08mm, resulting in a slot fill factor of over 92%. This design not only optimizes the space utilization of the conductors but also significantly reduces eddy current losses, thereby improving magnetic field coupling efficiency. A heat dissipation layer wrapped around the outer layer of the coil assembly 1 is bonded to it via a hot-pressing process at a temperature of 150-180℃ and a pressure of 0.2-0.3MPa. This hot-pressing process ensures a gapless contact between the heat dissipation layer and the coil assembly 1, further improving heat conduction efficiency. The heat dissipation layer uses graphene thermally conductive film material with a thickness ranging from 0.1-0.2mm. Its high thermal conductivity significantly increases the surface area, and the temperature rise during continuous operation is controlled below 40K, making it suitable for long-term high-load scenarios. During actual installation, the two ends of coil assembly 4 are connected to the external circuit via welding. A protective coating, 0.1-0.2 mm thick and made of epoxy resin, is applied to the welding points. This protective coating provides waterproofing, dustproofing, and corrosion protection, extending the device's lifespan. After welding, the entire device is installed into the power supply module of an OHT crane or stocker, ensuring stable and reliable connection with other components. Through these steps, the flat-wire high-power E-type non-contact power supply of this invention can achieve efficient and stable wireless power supply in complex environments such as semiconductor manufacturing workshops. Its optimized structural design and material selection not only improve the uniformity of the magnetic field distribution and heat dissipation performance but also overcome the shortcomings of existing round-wire coils in terms of high current carrying capacity, manufacturing standardization, and size, ensuring the long-term stable operation of the equipment.
[0034] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.
Claims
1. A flat wire type high-power E-type non-contact power supply device, characterized in that: It includes an E-type magnetic core (2) and a coil assembly (1) wound on the E-type magnetic core (2). The coil assembly (1) is made of flat wires wound in a multi-layered manner, and there is no skeleton structure in the coil assembly. The wires in the coil assembly (1) are flat wires, and the flat wires are flat copper busbars with a rectangular cross-section.
2. The flat wire high-power E-type non-contact power supply device according to claim 1, characterized in that: The E-type magnetic core (2) includes a winding plate (21), a winding groove (22) and a lead (23). The winding plate (21) has a winding groove (22) on its side for winding wires.
3. The flat wire high-power E-type non-contact power supply device according to claim 1, characterized in that: The two ends of the winding plate (21) are bonded to the inner side of the pin (23) by a crimping process, with a crimping depth of 0.5 mm to 1.0 mm.
4. A flat wire type high-power E-type non-contact power supply device according to claim 1, characterized in that: The slot fill factor of the coil assembly is ≥92%.
5. A flat wire type high-power E-type non-contact power supply device according to claim 1, characterized in that: The coil assembly (1) is wound in a multi-layered manner by alternating two layers of flat wires.
6. A flat wire type high-power E-type non-contact power supply device according to claim 1, characterized in that: The two ends of the coil assembly (1) are respectively attached to the inner side of the pin (23).
7. A flat wire type high-power E-type non-contact power supply device according to claim 1, characterized in that: The flat copper busbar is coated with an insulating coating made of polyimide. Before coating, it undergoes micro-arc oxidation treatment, and the surface roughness Ra value after treatment is 0.2 micrometers to 0.4 micrometers.
8. A flat wire type high-power E-type non-contact power supply device according to claim 1, characterized in that: The coil assembly (1) is wrapped with a heat dissipation layer, which is made of graphene thermal conductive film with a thickness ranging from 0.1 mm to 0.2 mm.
9. A flat wire type high-power E-type non-contact power supply device according to claim 8, characterized in that: The heat dissipation layer is bonded to the coil assembly (1) by a hot pressing process, with a hot pressing temperature of 150 degrees Celsius to 180 degrees Celsius and a pressure of 0.2 MPa to 0.3 MPa.
10. A flat wire type high-power E-type non-contact power supply device according to claim 1, characterized in that: The E-type magnetic core (2) is made of ferrite material and its saturation magnetic induction intensity is ≥500mT.