Wafer processing apparatus

Abstract

The application relates to the field of semiconductor production and discloses a wafer processing device which comprises a mounting base, a rotating groove is arranged in the middle of the mounting base, a connecting base is fixedly arranged on the upper surface of the mounting base, and a driving mechanism is arranged in the middle of the right side surface of the mounting base. The distance between the limiting base and the piston is reduced, the elastic member extension length is reduced, and the wafer adsorption pressure on the bottom surface of the hole plate is reduced to be far smaller than the adsorption force required when the wafer is moved left and right, turned up and down, accelerated or decelerated and the like driven by the mechanical arm, so that the adsorption force between the wafer and the hole plate is obviously reduced under the premise that the wafer cannot fall off, and the problem that the wafer surface is easily scratched when an external device moves and positions the wafer due to the fact that the wafer is prevented from falling off in the movement process by using too large adsorption force in the prior art wafer processing device is solved.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, and more particularly to a wafer processing apparatus. Background Technology

[0002] A wafer is a silicon wafer used in the fabrication of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. Wafers need to be transferred between different workstations or equipment on the production line. During these transfers, wafers need to be clamped and transported to ensure that they are moved stably and accurately from one workstation to another. Clamping and transporting devices are required to clamp and transport wafers.

[0003] In existing wafer processing equipment, there is a common risk of wafers detaching from the bottom surface of the perforated plate during operations such as wafer handling, flipping, acceleration, or deceleration. To address this, current technologies typically increase the adhesion force of the perforated plate to the wafer to ensure stable attachment during movement. However, when the wafer is moved and positioned by external devices, this method can easily cause scratches on the wafer surface due to excessive adhesion force, affecting wafer integrity and subsequent processing quality. Furthermore, to mitigate the scratching problem, some equipment uses perforated plates with smoother surfaces to reduce contact friction. However, this introduces new problems: during complex movements of the wafer processing equipment, the wafer can easily slide on the bottom surface of the perforated plate due to its own inertia, causing a positional shift in the adsorption state, which in turn affects the wafer's positioning accuracy and reduces the operational stability and reliability of the equipment. Summary of the Invention

[0004] This application proposes a wafer processing apparatus that has the advantages of high wafer positioning accuracy and low wafer wear, thereby solving the problems of inertial displacement and surface wear during wafer transfer.

[0005] To achieve the above objectives, this application adopts the following technical solution: a wafer processing apparatus, including a mounting base, a rotating groove formed in the middle of the mounting base, a connecting base fixedly mounted on the upper surface of the mounting base, and further comprising:

[0006] A drive mechanism is disposed in the middle of the right side of the mounting base;

[0007] A rotating base, which is movably fitted onto the bottom of the inner cavity of the rotating groove;

[0008] Multiple adjustment mechanisms are circumferentially and equidistantly arranged in the middle of the rotary seat;

[0009] The adjusting mechanism includes a sliding sleeve that is slidably connected to a rotating base. A clamping rod is slidably connected to the middle of the sliding sleeve. A threaded rod is threaded to the top of the clamping rod. A bevel gear is fixedly installed at one end of the threaded rod near the hydraulic rod. A contact block is fixedly installed at the bottom of the sliding sleeve near the rotating base.

[0010] A limiting seat is disposed in the middle between multiple adjusting mechanisms;

[0011] A hydraulic rod is fixedly installed in the middle of the lower surface of the connecting seat, and the telescopic end of the hydraulic rod is fixedly installed in the middle of the upper surface of the limiting seat.

[0012] Pressure control mechanism, wherein the pressure control mechanism is provided with a hydraulic rod telescopic end;

[0013] The movable mechanism is disposed between the bottom surface of the limiting seat and the middle part of the rotating seat.

[0014] Preferably, the driving mechanism includes a driving component, which is fixedly installed on the right side of the mounting base. A gear is fixedly installed at the output end of the driving component, and counterweights are fixedly installed on the front and rear sides and the middle of the left side of the mounting base.

[0015] Preferably, a toothed ring is fixedly sleeved on the outer curved surface of the rotary seat, the toothed ring is slidably sleeved with the mounting base, a plurality of guide grooves are equidistantly opened on the circumference of the outer curved surface of the rotary seat, the sliding sleeve is slidably sleeved in the middle of the guide groove, a plug hole is opened in the middle of the rotary seat, and a perforated plate is fixedly installed at the bottom of the inner cavity of the plug hole.

[0016] Preferably, a plurality of limiting rods are fixedly installed at equal intervals on the curved circumference of the limiting seat, and the plurality of limiting rods are slidably sleeved on the middle of the adjacent clamping rods. A support sleeve is fixedly installed on the upper surface of the limiting rod, and the threaded rod is movably sleeved on the middle of the support sleeve.

[0017] Preferably, the pressure control mechanism includes an inner sleeve, which is fixedly fitted onto the middle of the telescopic end of the hydraulic rod. The inner sleeve has multiple mounting grooves equidistantly spaced on its curved circumference. An elastic block is fixedly installed on the side of the mounting groove closest to the hydraulic rod, and a conical block is fixedly installed on the side of the elastic block away from the hydraulic rod. The conical block is slidably fitted into the mounting groove. An outer sleeve is movably fitted onto the outer surface of the inner sleeve. The inner cavity of the outer sleeve has multiple conical grooves equidistantly spaced on its circumference. A bevel gear ring is fixedly fitted onto the bottom of the outer curved surface of the outer sleeve, and multiple bevel gears mesh with the bevel gear ring.

[0018] Preferably, the movable mechanism includes an elastic element, which is fixedly installed in the middle of the bottom surface of the limiting seat, and a piston is fixedly installed at the bottom end of the elastic element, which is slidably sleeved in the middle of the plug hole.

[0019] Preferably, the contact surfaces between the rotary seat and the rotating groove are smooth surfaces, and the weight of the counterweight is equal to the sum of the weight of the driving component and the weight of the gear.

[0020] Preferably, the perforated plate has multiple through holes equidistantly spaced around its surface, the side of the contact block near the rotating base is a convex arc surface, and the arc surface of the contact block near the rotating base is provided with a smooth wear-resistant coating.

[0021] Preferably, the contact surface between the limiting rod and the clamping rod is a smooth surface, and the cone block on the side away from the elastic block has a convex cone shape.

[0022] Preferably, the conical groove is conical in shape, and the contact surfaces between the piston and the plug hole are provided with a smooth, wear-resistant coating.

[0023] The beneficial effects of this invention are as follows:

[0024] 1. This invention activates the hydraulic rod in the forward direction, causing its extension end to move upward. This extension end, through a limit seat and elastic element, drives the piston upward, reducing the air pressure between the wafer on the bottom surface of the perforated plate and the plug and piston. At this point, atmospheric pressure pushes the wafer tightly against the surface of the perforated plate, stretching the elastic element until the pressure of the wafer adhering to the bottom surface of the perforated plate is sufficient to overcome the maximum impact force generated when an external robotic arm moves the wafer left, right, up, down, accelerating, and decelerating via the wafer processing device. This continues until the robotic arm moves the wafer via the wafer processing device to directly above another wafer stage. Then, the hydraulic rod is activated in the reverse direction, causing its extension end to move downward. The hydraulic rod's extension end moves the piston upwards via a limit seat and an elastic element, reducing the distance between the limit seat and the piston. This, in turn, reduces the extension length of the elastic element, thereby lowering the pressure on the bottom surface of the perforated plate to a level far less than the suction force required for the robotic arm to move the wafer left and right, flip up and down, accelerate or decelerate. This significantly reduces the suction force between the wafer and the perforated plate without causing the wafer to fall off, thus solving the problem of existing wafer processing devices using excessive suction force to prevent wafers from falling off during movement, which easily scratches the wafer surface when external devices push and position the wafer.

[0025] 2. This invention uses a forward-starting drive unit. The output end of the drive unit drives the gear to rotate forward, the gear drives the gear ring to rotate forward, the gear ring drives the rotating seat to rotate forward, and the rotating seat drives the adjusting mechanism to rotate forward. At this time, since the hydraulic rod is fixedly connected to the rotating groove and remains stationary, and the pressure control mechanism is fixedly connected to the hydraulic rod and remains stationary, when the bevel gear on the side of the adjusting mechanism close to the bevel gear ring rotates forward along the bevel gear ring it meshes with, the bevel gear ring pushes the bevel gear to rotate forward. The bevel gear drives the threaded rod to rotate forward, the threaded rod pulls the clamping rod to move closer to the wafer, and the clamping rod drives the sliding sleeve and the contact block to move closer to the wafer. This achieves the goal of reducing the adhesion force between the wafer and the perforated plate, and then multiple contact blocks reposition the wafer. The new wafer is pushed to the center position of the wafer processing unit until the outer sleeve is compressed by the conical groove and conical block to shrink into the inner cavity of the mounting groove. When the outer sleeve and the inner sleeve slide relative to each other, the rotating base rotates at the same time, and the rotating base drives the wafer to rotate, so that the wafer is rotated to the direction that needs to be placed. This realizes the repositioning and reorientation of the wafer, thereby solving the problem that existing wafer processing units use perforated plates with smooth contact surfaces with the wafer in order to avoid scratching the wafer surface. This causes the wafer to slip due to the inertia of the wafer itself when the existing wafer processing unit drives the wafer to flip left, right, up and down, accelerate and decelerate, resulting in a decrease in wafer positioning accuracy. Attached Figure Description

[0026] The accompanying drawings, which form part of this specification, illustrate embodiments disclosed in this application and, together with the specification, serve to explain the principles of this application in a clear and understandable manner.

[0027] This disclosure will become clearer with reference to the accompanying drawings and the following detailed description, wherein:

[0028] Figure 1 This is a schematic diagram of the overall appearance and structure of the present invention;

[0029] Figure 2 This is a schematic diagram of the overall inverted structure of the present invention;

[0030] Figure 3 This is a schematic diagram of the overall cross-sectional structure of the present invention;

[0031] Figure 4 This is a schematic diagram of the rotating base structure of the present invention;

[0032] Figure 5 This is a schematic diagram of the adjustment mechanism structure of the present invention;

[0033] Figure 6 This is a schematic diagram of the active mechanism structure of the present invention;

[0034] Figure 7 This is a schematic diagram of the pressure control mechanism of the present invention;

[0035] Figure 8This is a schematic diagram of the conical groove structure of the present invention.

[0036] The components are as follows: 1. Mounting base; 101. Rotating groove; 102. Connecting base; 2. Drive mechanism; 201. Drive component; 202. Gear; 203. Counterweight; 3. Rotary base; 301. Gear ring; 302. Guide groove; 303. Plug hole; 304. Orifice plate; 4. Adjustment mechanism; 401. Sliding sleeve; 402. Clamping rod; 403. Threaded rod; 404. Bevel gear; 405. Contact block; 5. Limiting seat; 501. Limiting rod; 502. Support sleeve; 6. Hydraulic rod; 7. Pressure control mechanism; 701. Inner sleeve; 702. Elastic block; 703. Conical block; 704. Outer sleeve; 705. Conical groove; 706. Bevel gear ring; 8. Movable mechanism; 801. Elastic component; 802. Piston. Detailed Implementation

[0037] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0038] Please see Figures 1 to 8 As shown, a wafer processing apparatus includes a mounting base 1, a rotating groove 101 formed in the middle of the mounting base 1, a connecting seat 102 fixedly mounted on the upper surface of the mounting base 1, and further includes:

[0039] Drive mechanism 2 is located in the middle of the right side of the mounting base 1;

[0040] Rotary seat 3 is movably sleeved at the bottom of the inner cavity of the rotating groove 101;

[0041] The contact surfaces between the rotary seat 3 and the rotating groove 101 are all smooth surfaces, thereby reducing the frictional resistance between the rotary seat 3 and the rotating groove 101, and thus reducing the load on the output end of the drive component 201 when it drives the rotary seat 3 to rotate through the gear 202 and the gear ring 301.

[0042] Multiple adjustment mechanisms 4 are circumferentially and equidistantly arranged in the middle of the rotary seat 3;

[0043] The adjusting mechanism 4 includes a sliding sleeve 401, which is slidably connected to the rotating seat 3. A clamping rod 402 is slidably connected to the middle of the sliding sleeve 401. A threaded rod 403 is threadedly connected to the top of the clamping rod 402. A bevel gear 404 is fixedly installed at one end of the threaded rod 403 near the hydraulic rod 6. A contact block 405 is fixedly installed at the bottom of the sliding sleeve 401 near the rotating seat 3.

[0044] The side of the contact block 405 near the rotating base 3 is a convex arc surface. The arc surface of the contact block 405 near the rotating base 3 is provided with a smooth wear-resistant coating, thereby reducing the contact area and frictional resistance between the contact block 405 and the wafer. This prevents the rotating contact block 405 from causing wafer edge wear and rotating the adsorbed wafer, thus avoiding wafer edge damage and deterioration of positioning accuracy.

[0045] Limit seat 5, the limit seat 5 is located in the middle between multiple adjusting mechanisms 4,

[0046] Hydraulic rod 6 is fixedly installed in the middle of the lower surface of the connecting seat 102, and the telescopic end of hydraulic rod 6 is fixedly installed in the middle of the upper surface of the limiting seat 5.

[0047] Pressure control mechanism 7, with the extension end of the hydraulic rod 6 provided in pressure control mechanism 7;

[0048] The movable mechanism 8 is located between the bottom surface of the limit seat 5 and the middle part of the rotating seat 3.

[0049] Please see Figure 1 and Figure 2 As shown, the drive mechanism 2 includes a drive component 201, which is fixedly installed on the right side of the mounting base 1. A gear 202 is fixedly installed at the output end of the drive component 201. Counterweights 203 are fixedly installed on the front and rear sides and the middle of the left side of the mounting base 1.

[0050] The weight of the counterweight 203 is equal to the sum of the weight of the drive component 201 and the weight of the gear 202. This ensures that the weight of the wafer processing device is kept the same in all four directions, including the left and right sides and the front and back sides. This avoids the problem that external robotic arms used to move the wafer processing device horizontally and vertically may experience uneven force in certain directions, resulting in greater wear on one side than on the other. This can cause the wafer processing device to tilt to one side, leading to lower wafer positioning accuracy.

[0051] Please see Figures 1 to 5 As shown, a toothed ring 301 is fixedly sleeved on the outer curved surface of the rotary seat 3. The toothed ring 301 is slidably sleeved with the mounting base 1. Multiple guide grooves 302 are equidistantly opened on the circumference of the outer curved surface of the rotary seat 3. A sliding sleeve 401 is slidably sleeved in the middle of the guide groove 302. A plug hole 303 is opened in the middle of the rotary seat 3. A perforated plate 304 is fixedly installed at the bottom of the inner cavity of the plug hole 303.

[0052] The perforated plate 304 has multiple through holes equidistantly spaced around its surface. This allows a negative pressure to be formed between the wafer attached to the bottom surface of the perforated plate 304 and the bottom surface of the piston 802 inside the plug hole 303 when the piston 802 moves upward, thereby causing the wafer to be adsorbed onto the lower surface of the perforated plate 304.

[0053] Please see Figure 1 , Figure 4 and Figure 6 As shown, multiple limiting rods 501 are fixedly installed at equal intervals on the curved circumference of the limiting seat 5. The multiple limiting rods 501 are slidably sleeved in the middle of the adjacent clamping rod 402. A support sleeve 502 is fixedly installed on the upper surface of the limiting rod 501, and the threaded rod 403 is movably sleeved in the middle of the support sleeve 502.

[0054] The contact surface between the limiting rod 501 and the clamping rod 402 is a smooth surface, which reduces the frictional resistance between the clamping rod 402 and the limiting rod 501, reduces the load required for the clamping rod 402 to move, and makes the clamping rod 402 move more flexibly.

[0055] Please see Figures 5 to 8 As shown, the pressure control mechanism 7 includes an inner sleeve 701, which is fixedly sleeved in the middle of the telescopic end of the hydraulic rod 6. The inner sleeve 701 has multiple mounting grooves equidistantly opened on the curved circumference. An elastic block 702 is fixedly installed on the side of the mounting groove close to the hydraulic rod 6, and a cone block 703 is fixedly installed on the side of the elastic block 702 away from the hydraulic rod 6. The cone block 703 is slidably sleeved with the mounting groove. An outer sleeve 704 is movably sleeved on the outer side of the inner sleeve 701. Multiple conical grooves 705 are equidistantly opened on the inner circumference of the outer sleeve 704. A bevel gear ring 706 is fixedly sleeved on the bottom of the outer curved surface of the outer sleeve 704. Multiple bevel gears 404 mesh with the bevel gear ring 706.

[0056] The cone block 703 has a convex cone shape on the side away from the elastic block 702, and the cone groove 705 is cone-shaped. This allows the outer sleeve 704 to drive the inner sleeve 701 to rotate when the rotational resistance between the cone groove 705 and the inner sleeve 701 is small. When the rotational resistance between the cone groove 705 and the inner sleeve 701 is large, the outer sleeve 704 pushes the cone block 703 through the cone groove 705 to compress the elastic block 702 and shrink it, causing the cone block 703 to shrink into the inner cavity of the mounting groove. At this time, the outer sleeve 704 and the inner sleeve 701 maintain relative sliding.

[0057] Please see Figure 5 and Figure 6 As shown, the active mechanism 8 includes an elastic element 801, which is fixedly installed in the middle of the bottom surface of the limiting seat 5. A piston 802 is fixedly installed at the bottom end of the elastic element 801, and the piston 802 is slidably sleeved in the middle of the plug hole 303.

[0058] The contact surfaces between piston 802 and plug hole 303 are coated with a smooth, wear-resistant coating, which improves the sealing performance between piston 802 and plug hole 303, and extends the service life of piston 802 and plug hole 303. This prevents the wafer adsorbed on the bottom surface of the orifice plate 304 from falling off due to insufficient sealing performance between piston 802 and plug hole 303 in the later stages.

[0059] Working principle:

[0060] In use, the external robotic arm is connected to the middle of the upper surface of the wafer processing device connector 102. When it is necessary to transfer the wafer placed on the stage, the drive unit 201 is first activated in reverse. The drive unit 201 drives the gear 202 to reverse, the gear 202 drives the gear ring 301 to reverse, the gear ring 301 drives the rotating seat 3 to reverse, and the rotating seat 3 drives the adjusting mechanism 4 to reverse. At this time, since the hydraulic rod 6 is fixedly connected to the connector 102 and remains stationary, and the pressure control mechanism 7 is fixedly connected to the hydraulic rod 6 and remains stationary, the bevel gear 404 of the adjusting mechanism 4, which is close to the bevel gear ring 706, moves along the bevel gear ring 706 that meshes with it. When rotating in the reverse direction, the bevel ring 706 pushes the bevel gear 404 to rotate in the reverse direction, the bevel gear 404 drives the threaded rod 403 to rotate in the reverse direction, the threaded rod 403 pushes the clamping rod 402 to move away from the hydraulic rod 6, the clamping rod 402 drives the sliding sleeve 401 and the contact block 405 to move away from the hydraulic rod 6, so that the diameter of the multiple contact blocks 405 is larger than the diameter of the stage and the wafer. Then, the wafer processing device is moved above the wafer by the robotic arm, so that the upper surface of the wafer contacts the bottom surface of the perforated plate 304 and the lower surface of the mounting base 1, and at the same time, the wafer and the stage are located in the middle position of the multiple contact blocks 405.

[0061] Next, the hydraulic rod 6 is activated in the forward direction. The telescopic end of the hydraulic rod 6 moves upward, which drives the limit seat 5 and the pressure control mechanism 7 to move upward. The limit seat 5 drives the clamping rod 402, the threaded rod 403 and the bevel gear 404 to move upward through the limit rod 501 and the support sleeve 502. The clamping rod 402 drives the contact block 405 to move upward. At the same time, the limit seat 5 drives the elastic element 801 to move upward. The elastic element 801 drives the piston 802 to move upward, which reduces the air pressure between the wafer on the bottom surface of the perforated plate 304 and the inner cavity of the plug hole 303 and the piston 802. At this time, the atmospheric pressure pushes the surface of the wafer perforated plate 304 to fit tightly until the elastic element 801 is stretched to the point that the pressure of the wafer adsorbed on the bottom surface of the perforated plate 304 is sufficient to overcome the maximum impact force generated when the external robotic arm drives the wafer to flip left and right, up and down, accelerate and decelerate through the wafer processing device, and does not fall off the perforated plate. After that, the robotic arm drives the wafer through the wafer processing device to move it to the top of another wafer stage.

[0062] Next, the hydraulic rod 6 is activated in reverse. The telescopic end of the hydraulic rod 6 moves downward, causing the limit seat 5 and the pressure control mechanism 7 to move downward. The limit seat 5, through the limit rod 501, causes the clamping rod 402 to move downward. The clamping rod 402 causes the threaded rod 403 to move downward, which in turn causes the bevel gear 404 to move downward. The clamping rod 402 causes the contact block 405 to move downward. Simultaneously, as the limit seat 5 moves downward, the distance between the limit seat 5 and the piston 802 decreases, and the telescopic length of the elastic element 801 decreases. At this point, the pressure on the bottom surface of the perforated plate 304 is reduced to a level far less than the maximum impact force generated when the robotic arm drives the wafer to flip left, right, up, down, accelerate, and decelerate through the wafer processing device. This is sufficient for the wafer to adhere to the bottom surface of the perforated plate 304. Then, the forward... When the drive unit 201 is activated, the output end of the drive unit 201 drives the gear 202 to rotate forward. The gear 202 drives the gear ring 301 to rotate forward. The gear ring 301 drives the rotating seat 3 to rotate forward. The rotating seat 3 drives the adjusting mechanism 4 to rotate forward. At this time, since the hydraulic rod 6 is fixedly connected to the rotating groove 101 and remains stationary, and the pressure control mechanism 7 is fixedly connected to the hydraulic rod 6 and remains stationary, when the bevel gear 404 on the side of the adjusting mechanism 4 close to the bevel gear ring 706 rotates forward along the bevel gear ring 706 that meshes with it, the bevel gear ring 706 pushes the bevel gear 404 to rotate forward. The bevel gear 404 drives the threaded rod 403 to rotate forward. The threaded rod 403 pulls the clamping rod 402 to move closer to the wafer. The clamping rod 402 drives the sliding sleeve 401 and the contact block 405 to move closer to the wafer.

[0063] This reduces the adhesion force between the wafer and the perforated plate 304, allowing multiple contact blocks 405 to push the wafer back to the center of the wafer processing device. The outer sleeve 704, through the conical groove 705 and conical block 703, compresses the elastic block 702 and retracts into the mounting groove cavity. When the outer sleeve 704 and inner sleeve 701 slide relative to each other, the rotating base 3 rotates simultaneously, causing the wafer to rotate to its desired orientation. This achieves wafer repositioning and reorientation, solving the problem of existing wafer processing devices using smooth contact surfaces to avoid scratching the wafer surface. The perforated plate 304 addresses the problem that existing wafer processing devices, when performing actions such as flipping, rotating, accelerating, and decelerating the wafer, cause the wafer attached to the bottom surface of the perforated plate 304 to slip due to the wafer's own inertia, resulting in reduced wafer positioning accuracy. Simultaneously, it overcomes the problem of existing wafer processing devices using high suction to adhere the wafer to the bottom surface of the perforated plate 304 to prevent it from detaching during these actions. This results in excessive suction between the wafer and the perforated plate 304, causing scratches on the wafer surface when the wafer is pushed and repositioned.

[0064] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A wafer processing apparatus, comprising a mounting base (1), wherein a rotating groove (101) is formed in the middle of the mounting base (1), and a connecting seat (102) is fixedly mounted on the upper surface of the mounting base (1), characterized in that, Also includes: A drive mechanism (2) is provided in the middle of the right side of the mounting base (1); Rotary seat (3), which is movably sleeved on the bottom of the inner cavity of the rotating groove (101); Multiple adjustment mechanisms (4) are circumferentially and equidistantly arranged in the middle of the rotary seat (3); The adjusting mechanism (4) includes a sliding sleeve (401), which is slidably connected to the rotating seat (3). A clamping rod (402) is slidably connected to the middle of the sliding sleeve (401). A threaded rod (403) is threadedly connected to the top of the clamping rod (402). A bevel gear (404) is fixedly installed at one end of the threaded rod (403) near the hydraulic rod (6). A contact block (405) is fixedly installed at the bottom of the sliding sleeve (401) near the rotating seat (3). A limiting seat (5) is disposed in the middle between multiple adjusting mechanisms (4); Hydraulic rod (6), the hydraulic rod (6) is fixedly installed in the middle of the lower surface of the connecting seat (102), and the telescopic end of the hydraulic rod (6) is fixedly installed in the middle of the upper surface of the limiting seat (5); Pressure control mechanism (7), wherein the pressure control mechanism (7) is provided with a hydraulic rod (6) telescopic end; The active mechanism (8) is located between the bottom surface of the limiting seat (5) and the middle part of the rotating seat (3).

2. The wafer processing apparatus according to claim 1, characterized in that, The driving mechanism (2) includes a driving component (201), which is fixedly installed on the right side of the mounting base (1). A gear (202) is fixedly installed at the output end of the driving component (201). A counterweight (203) is fixedly installed on the front and rear sides and the middle of the left side of the mounting base (1).

3. The wafer processing apparatus according to claim 2, characterized in that, A toothed ring (301) is fixedly sleeved on the outer curved surface of the rotating base (3). The toothed ring (301) is slidably sleeved with the mounting base (1). Multiple guide grooves (302) are equidistantly opened on the outer curved surface of the rotating base (3). The sliding sleeve (401) is slidably sleeved in the middle of the guide groove (302). A plug hole (303) is opened in the middle of the rotating base (3). A perforated plate (304) is fixedly installed at the bottom of the inner cavity of the plug hole (303).

4. The wafer processing apparatus according to claim 3, characterized in that, The limiting seat (5) has multiple limiting rods (501) fixedly installed at equal intervals on its curved circumference. The multiple limiting rods (501) are slidably sleeved in the middle of the adjacent clamping rod (402). The upper surface of the limiting rod (501) is fixedly installed with a support sleeve (502), and the threaded rod (403) is movably sleeved in the middle of the support sleeve (502).

5. A wafer processing apparatus according to claim 4, characterized in that, The pressure control mechanism (7) includes an inner sleeve (701), which is fixedly sleeved on the middle of the telescopic end of the hydraulic rod (6). The inner sleeve (701) has multiple mounting grooves equidistantly opened on the curved circumference. An elastic block (702) is fixedly installed on the side of the mounting groove close to the hydraulic rod (6). A cone block (703) is fixedly installed on the side of the elastic block (702) away from the hydraulic rod (6). The cone block (703) is slidably sleeved with the mounting groove. An outer sleeve (704) is movably sleeved on the outer side of the inner sleeve (701). The inner circumference of the outer sleeve (704) has multiple conical grooves (705) equidistantly opened. A bevel gear ring (706) is fixedly sleeved on the bottom of the outer curved surface of the outer sleeve (704). Multiple bevel gears (404) mesh with the bevel gear ring (706).

6. A wafer processing apparatus according to claim 5, characterized in that, The active mechanism (8) includes an elastic element (801), which is fixedly installed in the middle of the bottom surface of the limiting seat (5). A piston (802) is fixedly installed at the bottom end of the elastic element (801), and the piston (802) is slidably sleeved in the middle of the plug hole (303).

7. A wafer processing apparatus according to claim 6, characterized in that, The contact surfaces between the rotating base (3) and the rotating groove (101) are both smooth surfaces, and the weight of the counterweight (203) is equal to the sum of the weight of the driving component (201) and the weight of the gear (202).

8. A wafer processing apparatus according to claim 7, characterized in that, The perforated plate (304) has multiple through holes equidistantly spaced around its surface. The side of the contact block (405) near the rotating base (3) is a convex arc surface, and the arc surface of the contact block (405) near the rotating base (3) is provided with a smooth wear-resistant coating.

9. A wafer processing apparatus according to claim 8, characterized in that, The contact surface between the limiting rod (501) and the clamping rod (402) is a smooth surface, and the cone block (703) on the side away from the elastic block (702) has a convex cone shape.

10. A wafer processing apparatus according to claim 9, characterized in that, The conical groove (705) is cone-shaped, and the contact surfaces between the piston (802) and the plug hole (303) are provided with a smooth, wear-resistant coating.

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