A thermal management method for an eVTOL low-voltage distribution box module and related devices

Abstract

The application discloses a kind of eVTOL low-pressure power distribution box module heat management method and related device, its method includes: control temperature sensor to be attached on the high heat area of modular PCB architecture with preset frequency temperature acquisition processing, obtain the real-time temperature data corresponding to each high heat area;Each high heat area corresponding real-time temperature data is uploaded to microcontroller MCU in modular PCB architecture, and each high heat area corresponding real-time temperature data is preprocessed in microcontroller MCU, and each high heat area corresponding preprocessed temperature data is formed;Microcontroller MCU uploads each high heat area corresponding preprocessed temperature data to flight control system, and flight control system controls eVTOL low-pressure power distribution box module based on each high heat area corresponding preprocessed temperature data and carries out heat management.In the implementation process of the present application, dynamic heat dissipation management is realized, and heat dissipation capacity is improved.

Description

Technical Field

[0001] This invention relates to the technical field of electric aircraft, and more particularly to a thermal management method and related apparatus for an eVTOL low-voltage power distribution box module. Background Technology

[0002] In the low-voltage power distribution system of electric vertical takeoff and landing (eVTOL) aircraft, thermal management is a core technology to ensure equipment reliability. Traditional power distribution boxes adopt an integrated PCB design, and heat dissipation mainly relies on natural heat dissipation or simple air cooling systems, resulting in low heat dissipation efficiency. At the same time, the high heat-generating components in traditional designs are scattered, making it difficult to quickly locate and replace faulty parts, which increases maintenance difficulty and cost.

[0003] Traditional eVTOL low-voltage distribution box thermal management solutions mainly include: 1. Integrated PCB design: All circuits are integrated on a single PCB, high-heat-generating components are randomly distributed, and heat dissipation is achieved through natural convection or a single axial fan; 2. Ordinary thermal conductive medium: Low thermal conductivity silicone grease (approximately 2.0W / m・K) or no thermal pad is used, and heat is conducted to the plastic shell through the PCB substrate, resulting in low heat dissipation efficiency; 3. Non-modular maintenance: Maintenance requires complete disassembly of the PCB board, and failure of a single component may lead to replacement of the entire board, resulting in high maintenance costs (single maintenance time ≥ 2 hours). Summary of the Invention

[0004] The purpose of this invention is to overcome the shortcomings of the prior art. This invention provides a thermal management method and related device for an eVTOL low-voltage distribution box module. By setting a modular PCB architecture and setting corresponding heat dissipation equipment, optimizing the heat dissipation equipment, and providing corresponding thermal management methods, dynamic heat dissipation management is achieved and heat dissipation capacity is improved. Furthermore, the modular PCB architecture design makes subsequent maintenance more convenient and improves maintenance efficiency.

[0005] To address the aforementioned technical problems, this invention provides a thermal management method for an eVTOL low-voltage distribution box module, applied to the eVTOL low-voltage distribution box module. The eVTOL low-voltage distribution box module contains a modular PCB architecture consisting of a motherboard module and M power supply modules. A heat dissipation device is installed on the modular PCB architecture, where M is an integer greater than or equal to 1. The method includes:

[0006] The temperature sensor mounted on the high heat-generating area of ​​the modular PCB architecture is controlled to perform temperature acquisition and processing at a preset frequency to obtain real-time temperature data corresponding to each high heat-generating area. The high heat-generating area is a region composed of high heat-generating devices concentrated on each power module and motherboard module, and there are at least two high heat-generating areas.

[0007] The real-time temperature data corresponding to each high-heat area is uploaded to the microcontroller MCU in the modular PCB architecture, and the real-time temperature data corresponding to each high-heat area is preprocessed in the microcontroller MCU to form preprocessed temperature data corresponding to each high-heat area.

[0008] The microcontroller (MCU) uploads the pre-processed temperature data corresponding to each high-heat area to the flight control system. The flight control system then controls the eVTOL low-voltage power distribution box module to perform thermal management based on the pre-processed temperature data corresponding to each high-heat area.

[0009] Optionally, the heat dissipation device includes M+1 thermal pads, M+1 heat dissipation fin areas, and 2 (M+1) axial fans;

[0010] Each thermal pad is customized according to the shape and distribution of the heat-generating device in the corresponding high-heat area, and the material of the thermal pad is ceramic-filled silicon; the customized side of each thermal pad is in contact with the corresponding high-heat area, and the other side is in contact with a heat dissipation fin area, and two axial fans are configured for each heat dissipation fin area.

[0011] Optionally, the temperature sensor mounted on the high-heat-generating area of ​​the modular PCB architecture performs temperature acquisition processing at a preset frequency to obtain real-time temperature data corresponding to each high-heat-generating area, including:

[0012] A corresponding temperature sensor is mounted on each high-heat area in the modular PCB architecture, and the temperature sensor is connected to the microcontroller MCU for communication.

[0013] The microcontroller (MCU) generates a stable acquisition command according to a preset acquisition frequency, and performs temperature acquisition processing at a preset frequency based on the temperature acquisition command to obtain real-time temperature data corresponding to each high-heat area.

[0014] Optionally, the real-time temperature data corresponding to each high-heat-generating region is preprocessed in the microcontroller (MCU) to form preprocessed temperature data corresponding to each high-heat-generating region, including:

[0015] In the microcontroller (MCU), a moving average filtering algorithm is used to preprocess the instantaneous temperature fluctuation data in the real-time temperature data corresponding to each high-heat-generating region to eliminate the instantaneous temperature fluctuation data, thus forming preprocessed temperature data corresponding to each high-heat-generating region.

[0016] Optionally, in the microcontroller (MCU), a preprocessing method is used to eliminate instantaneous temperature fluctuations in the real-time temperature data corresponding to each high-heat-generating region based on a moving average filtering algorithm, forming preprocessed temperature data corresponding to each high-heat-generating region, including:

[0017] Set the maximum rate of change of two adjacent real-time temperature data samples, and determine the instantaneous temperature fluctuation data in the real-time temperature data based on the maximum rate of change of the samples.

[0018] The length of the filtering window is determined based on the current operating mode of the eVTOL low-voltage distribution box module, wherein the current operating mode is either flight mode, ground maintenance mode, or fault mode.

[0019] Based on the filter window length, the moving average filtering algorithm is used to preprocess the instantaneous temperature fluctuation data in the real-time temperature data corresponding to each high-heat region to eliminate the preprocessed temperature data corresponding to each high-heat region.

[0020] Optionally, the formula for the moving average filtering algorithm is as follows:

[0021] ;

[0022] in, This is the output value after the nth filter. This is the nth real-time temperature data; This represents the length of the filtering window.

[0023] Optionally, the flight control system controls the eVTOL low-voltage power distribution box module to perform thermal management based on the pre-processed temperature data corresponding to each high-heat area, including:

[0024] The flight control system uses the pre-processed temperature data corresponding to each high-heat area to match and process multiple preset temperature ranges, and obtains the corresponding control strategy based on the matching result of the pre-processed temperature data corresponding to each high-heat area, wherein each control strategy corresponds to a temperature range.

[0025] Based on the control strategy corresponding to the preprocessed temperature data of each high-heat area, the power supply priority of the eVTOL low-voltage power distribution box module is dynamically adjusted and the speed of the axial fan in the heat dissipation device is controlled for thermal management.

[0026] In the control strategy within a given temperature range, an incremental PID control algorithm is used to dynamically adjust the speed of the axial fan in the heat dissipation device.

[0027] In addition, this invention also provides a thermal management device for an eVTOL low-voltage distribution box module, applied to the eVTOL low-voltage distribution box module. The eVTOL low-voltage distribution box module has a modular PCB architecture consisting of a motherboard module and M power modules. A heat dissipation device is provided on the modular PCB architecture, where M is an integer greater than or equal to 1. The device includes:

[0028] Temperature acquisition module: used to control the temperature sensors mounted on the high heat generation area of ​​the modular PCB architecture to perform temperature acquisition processing at a preset frequency, and obtain real-time temperature data corresponding to each high heat generation area. The high heat generation area is a region composed of high heat generation devices concentrated on each power module and motherboard module, and there are at least two high heat generation areas.

[0029] Data processing module: used to upload the real-time temperature data corresponding to each high heat generation area to the microcontroller MCU in the modular PCB architecture, and to preprocess the real-time temperature data corresponding to each high heat generation area in the microcontroller MCU to form preprocessed temperature data corresponding to each high heat generation area;

[0030] Thermal management module: The microcontroller (MCU) uploads the pre-processed temperature data corresponding to each high-heat area to the flight control system. The flight control system controls the eVTOL low-voltage power distribution box module to perform thermal management based on the pre-processed temperature data corresponding to each high-heat area.

[0031] In addition, embodiments of the present invention also provide an electronic device, including a processor and a memory, wherein the processor runs a computer program or code stored in the memory to implement the thermal management method as described in any of the above.

[0032] In addition, embodiments of the present invention also provide a computer-readable storage medium for storing a computer program or code, which, when executed by a processor, implements the thermal management method as described above.

[0033] In this embodiment of the invention, by setting a modular PCB architecture and corresponding heat dissipation devices, optimizing the heat dissipation devices, and providing corresponding thermal management methods, dynamic heat dissipation management is achieved and heat dissipation capacity is improved; furthermore, the modular PCB architecture design makes subsequent maintenance more convenient and improves maintenance efficiency. Attached Figure Description

[0034] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0035] Figure 1 This is a flowchart illustrating the thermal management method of the eVTOL low-voltage distribution box module in an embodiment of the present invention.

[0036] Figure 2This is a flowchart illustrating the thermal management method of the eVTOL low-voltage distribution box module in another embodiment of the present invention.

[0037] Figure 3 This is a schematic diagram of the structural composition of the thermal management device of the eVTOL low-voltage distribution box module in an embodiment of the present invention;

[0038] Figure 4 This is a schematic diagram of the structural composition of the electronic device in an embodiment of the present invention;

[0039] Figure 5 This is a cross-sectional view of the modular PCB architecture in an embodiment of the present invention;

[0040] Figure 6 This is a diagram illustrating the arrangement of the axial fan in an embodiment of the present invention. Detailed Implementation

[0041] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0042] Example 1, please refer to Figure 1 , Figure 1 This is a flowchart illustrating the thermal management method of the eVTOL low-voltage distribution box module in an embodiment of the present invention.

[0043] like Figure 1 As shown, a thermal management method for an eVTOL low-voltage distribution box module is applied to the eVTOL low-voltage distribution box module. The eVTOL low-voltage distribution box module has a modular PCB architecture consisting of a motherboard module and M power supply modules. A heat dissipation device is installed on the modular PCB architecture. The method includes:

[0044] S101: Control the temperature sensor mounted on the high heat-generating area of ​​the modular PCB architecture to perform temperature acquisition and processing at a preset frequency to obtain real-time temperature data corresponding to each high heat-generating area. The high heat-generating area is a region composed of high heat-generating devices concentrated on each power module and motherboard module. There are at least two high heat-generating areas.

[0045] In the specific implementation of this invention, the heat dissipation device includes M+1 thermal pads, M+1 heat dissipation fin areas, and 2(M+1) axial fans; each thermal pad is customized according to the shape and distribution of the heat-generating device in the corresponding high-heat area, and the material of the thermal pad is ceramic-filled silicon; the customized side of each thermal pad is in contact with the corresponding high-heat area, and the other side is in contact with a heat dissipation fin area, and 2 axial fans are configured for each heat dissipation fin area.

[0046] Furthermore, the control of the temperature sensor mounted on the high-heat-generating area of ​​the modular PCB architecture to perform temperature acquisition processing at a preset frequency to obtain real-time temperature data corresponding to each high-heat-generating area includes: mounting a corresponding temperature sensor on each high-heat-generating area in the modular PCB architecture and establishing a communication connection between the temperature sensor and the microcontroller MCU; the microcontroller MCU generating a stable acquisition command according to the preset acquisition frequency, and performing temperature acquisition processing at the preset frequency based on the temperature acquisition command to obtain real-time temperature data corresponding to each high-heat-generating area.

[0047] For details, please refer to Figure 5 and Figure 6 In the eVTOL low-voltage power distribution box module, a modular PCB architecture (in this embodiment, the modular PCB architecture contains 4 power modules, i.e., M = 4) is mainly composed of a motherboard module and M power modules. Each power module is electrically connected to the motherboard module through 3 aviation-grade sockets (vibration-resistant electrical connectors) and reinforced with multiple screws to ensure the reliability and stability of the electrical connection. This embodiment mainly focuses on the thermal management of high-heat-generating components in the modular PCB architecture. Therefore, in the design of the modular PCB architecture, high-heat-generating components are centrally arranged in the power modules for unified management and heat dissipation. The high-heat-generating components are mainly chips, power inductors, and freewheeling Schottky diodes in the DC-DC unit.

[0048] Furthermore, heat dissipation equipment is installed on the modular PCB architecture. When there are four power modules on the modular PCB architecture, the heat dissipation equipment includes five thermal pads, five heat sink fin areas, and ten axial fans. The thermal pads are customized, using ceramic-filled silicon material with a thermal conductivity ≥4.0W / m・K, compressible thickness (compression ratio ≥30%), and their shape can be customized according to the actual shape and distribution of the heat-generating components. They tightly fill the air gap between the components and the module substrate, with a thermal resistance ≤0.3℃·in² / W. The metal top cover heat sink fins are made of 6063 aluminum alloy, integrating five independent heat sink fins, corresponding one-to-one with the positions of the power modules and motherboard modules. The thermal pads conduct heat from the heat-generating components to the fins, increasing the fin surface area by 300% compared to traditional designs, improving radiation and convection heat dissipation efficiency. Forced convection heat dissipation is achieved using axial fans. Each heat sink fin area is equipped with two axial fans (airflow 23.7 CFM). / each), that is, 2 units per group, for a total of 10 units; the heat of the heating element is transferred to the heat dissipation fins of the metal top cover through the thermal pad, and the airflow of the axial fan blows towards the narrow air channel formed by several slender fins in the fin area, forming forced convection, which improves the heat dissipation efficiency by 200% compared with the whole area heat dissipation, thus achieving high-efficiency heat dissipation.

[0049] In this embodiment, a modular PCB architecture is designed, namely: 1) Each power module is electrically connected to the motherboard module through 3 sockets and mechanically fixed with 4 screws, reducing the replacement time of a single power module to within 30 minutes and reducing maintenance costs by 75% compared to traditional whole board replacement; 2) The thermal pad is disassembled synchronously with the module, eliminating the need for re-application and avoiding performance degradation caused by repeated installation of thermal media in traditional solutions.

[0050] It can also optimize fault location. When the temperature of a module is continuously higher than 80°C for more than 10 seconds, the microcontroller (MCU) sends a fault code to the flight control system via RS-422. The flight control system highlights the location of the faulty module on the operation interface, and maintenance personnel can directly locate and replace it, which shortens the fault location time by 80% compared with the traditional solution.

[0051] In the modular PCB architecture, a corresponding temperature sensor (MCP9701A, MICROCHIP, with an accuracy of ±2℃ (max.)) is mounted on each high-heat area (such as the surface of a DC-DC chip or power inductor). A total of M+1 groups (1 motherboard + M modules) are used to monitor the component temperature in real time. The temperature sensor communicates with the microcontroller (MCU) located in the motherboard module of the modular PCB architecture. The MCU controls the temperature sensor to collect temperature data at a frequency of 20Hz and obtains the real-time temperature data corresponding to each high-heat area.

[0052] S102: Upload the real-time temperature data corresponding to each high-heat area to the microcontroller MCU in the modular PCB architecture, and preprocess the real-time temperature data corresponding to each high-heat area in the microcontroller MCU to form preprocessed temperature data corresponding to each high-heat area.

[0053] In the specific implementation of this invention, the real-time temperature data corresponding to each high-heat area is preprocessed in the microcontroller MCU to form preprocessed temperature data corresponding to each high-heat area. This includes: preprocessing the real-time temperature data corresponding to each high-heat area in the microcontroller MCU by eliminating instantaneous temperature fluctuation data based on a moving average filtering algorithm to form preprocessed temperature data corresponding to each high-heat area.

[0054] Furthermore, in the microcontroller (MCU), a preprocessing method is used to eliminate instantaneous temperature fluctuation data in the real-time temperature data corresponding to each high-heat-generating region based on a moving average filtering algorithm, forming preprocessed temperature data corresponding to each high-heat-generating region. This includes: setting the maximum sampling change rate of two adjacent real-time temperature data, and determining the instantaneous temperature fluctuation data in the real-time temperature data based on the maximum sampling change rate; determining the filter window length based on the current operating mode of the eVTOL low-voltage distribution box module, wherein the current operating mode is flight mode, ground maintenance mode, or fault mode; and using the moving average filtering algorithm to eliminate instantaneous temperature fluctuation data in the real-time temperature data corresponding to each high-heat-generating region based on the filter window length, forming preprocessed temperature data corresponding to each high-heat-generating region.

[0055] Furthermore, the formula for the moving average filtering algorithm is as follows:

[0056] ;

[0057] in, This is the output value after the nth filter. This is the nth real-time temperature data; This represents the length of the filtering window.

[0058] Specifically, during temperature data acquisition, there may be instantaneous fluctuations. Therefore, it is necessary to identify outliers in the real-time temperature data through a noise identification threshold. This requires setting a maximum rate of change between adjacent sampled values. In this embodiment, the maximum rate of change between adjacent sampled values ​​is set to... Outlier handling: If If the value is not found, it is determined to be an instantaneous fluctuation (such as vibration interference or electromagnetic noise). This value is not included in the current window calculation and is replaced by the average of the previous 4 valid values.

[0059] Example: Original sequence: [65, 68, 110 (spur), 67, 66]℃; Filtered output: (65+68+67+66) / 4≈66.5℃ (spur values ​​are suppressed).

[0060] When setting the filter window length, special optimizations are required for eVTOL scenarios, namely in flight mode, ground maintenance mode, or fault mode. In flight mode, the filter window automatically expands from N=5 to N=8 to enhance the suppression of vibration noise (such as sensor jitter caused by propeller aerodynamic noise). In ground maintenance mode, N=5 is restored to ensure rapid response when there is abnormal temperature (response time is reduced from 250ms to 100ms). In fault mode, N=10 (enhancing anti-interference).

[0061] After determining the filter window length, a moving average filtering algorithm is used to preprocess the instantaneous temperature fluctuation data in the real-time temperature data corresponding to each high-heat region, eliminating the need for filtering. This preprocessing results in preprocessed temperature data for each high-heat region. The formula for the moving average filtering algorithm is as follows:

[0062] ;

[0063] in, This is the output value after the nth filter. This is the nth real-time temperature data; This represents the length of the filtering window.

[0064] S103: The microcontroller (MCU) uploads the pre-processed temperature data corresponding to each high-heat area to the flight control system. The flight control system controls the eVTOL low-voltage power distribution box module to perform thermal management based on the pre-processed temperature data corresponding to each high-heat area.

[0065] In the specific implementation of this invention, the flight control system controls the eVTOL low-voltage power distribution box module for thermal management based on the pre-processed temperature data corresponding to each high-heat area. This includes: the flight control system matching the pre-processed temperature data corresponding to each high-heat area with multiple preset temperature ranges, and obtaining a corresponding control strategy based on the matching result of the pre-processed temperature data corresponding to each high-heat area, wherein each control strategy corresponds to a temperature range; dynamically adjusting the power supply priority of the eVTOL low-voltage power distribution box module and controlling the axial fan speed in the heat dissipation device for thermal management based on the control strategy corresponding to the pre-processed temperature data corresponding to each high-heat area; wherein in the control strategy within a given temperature range, an incremental PID control algorithm is used to dynamically adjust the axial fan speed in the heat dissipation device.

[0066] Specifically, the microcontroller (MCU) uploads the pre-processed temperature data corresponding to each high-heat area to the flight control system. At this time, the MCU uploads the temperature matrix to the flight control system (FCU) through the RS-422 interface (transmission rate 115200bps).

[0067] The flight control system matches the pre-processed temperature data corresponding to each high-heat area with multiple preset temperature ranges, and then matches the control strategy corresponding to the pre-processed temperature data for each high-heat area. Each control strategy corresponds to a temperature range. Specifically, the fan speed and power supply priority are dynamically adjusted according to the preset strategies, as shown in Table 1 below:

[0068] Table 1

[0069]

[0070] Then, based on the control strategy corresponding to the preprocessed temperature data of each high-heat area, the power supply priority of the eVTOL low-voltage distribution box module and the speed of the axial fan in the heat dissipation equipment are dynamically adjusted for thermal management. For a given temperature range, such as 50-80℃, an incremental PID control algorithm is used to adjust the fan speed, specifically as follows:

[0071] PID calculation formula:

[0072] u(n)=u(n-1) + Kp·[e(n)-e(n-1)] + Ki·e(n) + Kd·[e(n)-2e(n-1)+e(n-2)];

[0073] Parameter definitions: e(n) = Tset - Treal(n), the error between the temperature setpoint and the real-time value (unit: °C); Tset = 65 °C (50-65 °C range) or 75 °C (65-80 °C range), dynamically switching the setpoint according to the temperature range; u(n) is the current PWM duty cycle output (range 30%-70%); Kp = 0.8, Ki = 0.05, Kd = 0.2 (parameter set optimized by DO-160G vibration test).

[0074] Special design for eVTOL scenarios: ① Dual setpoint adaptive switching; 50-65℃ range: Tset=65℃, adopting a conservative adjustment strategy (Kp=0.8) to avoid frequent fan start-stop (temperature fluctuations are common during eVTOL take-off and landing); 65-80℃ range: Tset=75℃, automatically switching to aggressive parameters (Kp=1.2, Kd=0.3), improving response speed by 30% and coping with sudden changes in motor load during flight.

[0075] ② Vibration-resistant differential processing: The temperature error signal is first subjected to a second-order low-pass filter (cutoff frequency 10Hz): e′(n)=0.9e′(n−1)+0.1e(n); the differential term is only calculated for the filtered error to eliminate high-frequency noise caused by vibration (eVTOL propeller vibration frequency is 80Hz, 10Hz filtering can attenuate more than 90%). ③ Integral limiting and power supply coordination: Integral term limiting: when |e(n)|<2℃, the integral coefficient Ki automatically drops to 0.02 to prevent overshoot; Power supply priority mapping: when the PID output u(n)>60%, the flight control system synchronously triggers the "non-critical load power cut-off" command (such as the cabin entertainment system), reducing the power distribution box load power by 15%, forming a "heat dissipation-load reduction" coordinated control; the fan drive adopts PWM pulse width modulation (frequency 25kHz), and the fan speed is adjusted by changing the fan power supply voltage value, with a speed adjustment accuracy of ±5%.

[0076] Through a closed-loop control process, a complete control cycle of "acquisition-decision-execution-verification" is achieved. After each temperature adjustment, data is re-acquired through the temperature sensor array to verify the effect, and the PID parameters are dynamically adjusted according to the actual cooling rate to ensure that the expected heat dissipation effect is achieved under any flight conditions. The system's "dynamic adjustment and verification mechanism" is as follows:

[0077] (1) Real-time feedback: After each PWM adjustment (adjustment period 50ms), the new temperature data is read immediately; (2) Effect evaluation: By comparing the deviation between the set temperature curve and the actual temperature curve; (Calculation formula: ΔT=│Tactual-Ttarget│ / Ttarget×100%); (3) Secondary adjustment: When ΔT>5%, the PID algorithm is triggered to recalculate the output value.

[0078] In this embodiment of the invention, by setting a modular PCB architecture and corresponding heat dissipation devices, optimizing the heat dissipation devices, and providing corresponding thermal management methods, dynamic heat dissipation management is achieved and heat dissipation capacity is improved; furthermore, the modular PCB architecture design makes subsequent maintenance more convenient and improves maintenance efficiency.

[0079] Example 2, please refer to Figure 2 , Figure 2 This is a flowchart illustrating the thermal management method of the eVTOL low-voltage distribution box module in another embodiment of the present invention.

[0080] like Figure 2As shown, a thermal management method for an eVTOL low-voltage distribution box module is applied to the eVTOL low-voltage distribution box module. The eVTOL low-voltage distribution box module has a modular PCB architecture consisting of a motherboard module and M power supply modules. A heat dissipation device is installed on the modular PCB architecture, where M is an integer greater than or equal to 1. The method includes:

[0081] S201: Control the temperature sensor mounted on the high heat-generating area of ​​the modular PCB architecture to perform temperature acquisition and processing at a preset frequency to obtain real-time temperature data corresponding to each high heat-generating area. The high heat-generating area is a region composed of high heat-generating devices concentrated on each power module and motherboard module. There are at least two high heat-generating areas.

[0082] S202: Upload the real-time temperature data corresponding to each high-heat area to the microcontroller MCU in the modular PCB architecture, set the maximum sampling change rate of two adjacent real-time temperature data, and determine the instantaneous temperature fluctuation data in the real-time temperature data based on the maximum sampling change rate;

[0083] S203: Determine the filter window length based on the current operating mode of the eVTOL low-voltage distribution box module, wherein the current operating mode is flight mode, ground maintenance mode, or fault mode;

[0084] S204: Based on the filter window length, the moving average filtering algorithm is used to preprocess the instantaneous temperature fluctuation data in the real-time temperature data corresponding to each high-heat area to eliminate the preprocessed temperature data corresponding to each high-heat area.

[0085] S205: The microcontroller (MCU) uploads the pre-processed temperature data corresponding to each high-heat area to the flight control system. The flight control system uses the pre-processed temperature data corresponding to each high-heat area to match and process multiple preset temperature ranges, and obtains the corresponding control strategy based on the matching result of the pre-processed temperature data corresponding to each high-heat area. Each control strategy corresponds to a temperature range.

[0086] S206: Based on the control strategy corresponding to the preprocessed temperature data of each high-heat area, dynamically adjust the power supply priority of the eVTOL low-voltage distribution box module and control the speed of the axial fan in the heat dissipation device for thermal management; wherein, in the control strategy within a given temperature range, an incremental PID control algorithm is used to dynamically adjust the speed of the axial fan in the heat dissipation device.

[0087] For a detailed description of the implementation of Example 2, please refer to Example 1, which will not be repeated here.

[0088] Example 3, please refer to Figure 3 , Figure 3 This is a schematic diagram of the structural composition of the thermal management device of the eVTOL low-voltage distribution box module in an embodiment of the present invention.

[0089] like Figure 3 As shown, a thermal management device for an eVTOL low-voltage distribution box module is applied to the eVTOL low-voltage distribution box module. The eVTOL low-voltage distribution box module has a modular PCB architecture consisting of a motherboard module and M power supply modules. A heat dissipation device is installed on the modular PCB architecture, where M is an integer greater than or equal to 1. The device includes:

[0090] Temperature acquisition module 301: used to control the temperature sensor mounted on the high heat generation area of ​​the modular PCB architecture to perform temperature acquisition processing at a preset frequency, and obtain real-time temperature data corresponding to each high heat generation area. The high heat generation area is a region composed of high heat generation devices concentrated on each power module and motherboard module, and there are at least two high heat generation areas.

[0091] In the specific implementation of this invention, the heat dissipation device includes M+1 thermal pads, M+1 heat dissipation fin areas, and 2 (M+1) axial fans; each thermal pad is customized according to the shape and distribution of the heat-generating device in the corresponding high-heat-generating area, and the material of the thermal pad is ceramic-filled silicon; the customized side of each thermal pad is in contact with the corresponding high-heat-generating area, and the other side is in contact with a heat dissipation fin area, and 2 axial fans are configured for each heat dissipation fin area.

[0092] Furthermore, the control of the temperature sensor mounted on the high-heat-generating area of ​​the modular PCB architecture to perform temperature acquisition processing at a preset frequency to obtain real-time temperature data corresponding to each high-heat-generating area includes: mounting a corresponding temperature sensor on each high-heat-generating area in the modular PCB architecture and establishing a communication connection between the temperature sensor and the microcontroller MCU; the microcontroller MCU generating a stable acquisition command according to the preset acquisition frequency, and performing temperature acquisition processing at the preset frequency based on the temperature acquisition command to obtain real-time temperature data corresponding to each high-heat-generating area.

[0093] For details, please refer to Figure 5 and Figure 6In the eVTOL low-voltage power distribution box module, a modular PCB architecture (in this embodiment, the modular PCB architecture contains 4 power modules, i.e., M = 4) is mainly composed of a motherboard module and M power modules. Each power module is electrically connected to the motherboard module through 3 aviation-grade sockets (vibration-resistant electrical connectors) and reinforced with multiple screws to ensure the reliability and stability of the electrical connection. This embodiment mainly focuses on the thermal management of high-heat-generating components in the modular PCB architecture. Therefore, in the design of the modular PCB architecture, high-heat-generating components are centrally arranged in the power modules for unified management and heat dissipation. The high-heat-generating components are mainly chips, power inductors, and freewheeling Schottky diodes in the DC-DC unit.

[0094] Furthermore, heat dissipation equipment is installed on the modular PCB architecture. When there are four power modules on the modular PCB architecture, the heat dissipation equipment includes five thermal pads, five heat sink fin areas, and ten axial fans. The thermal pads are customized, using ceramic-filled silicon material with a thermal conductivity ≥4.0W / m・K, compressible thickness (compression ratio ≥30%), and their shape can be customized according to the actual shape and distribution of the heat-generating components. They tightly fill the air gap between the components and the module substrate, with a thermal resistance ≤0.3℃·in² / W. The metal top cover heat sink fins are made of 6063 aluminum alloy, integrating five independent heat sink fins, corresponding one-to-one with the positions of the power modules and motherboard modules. The thermal pads conduct heat from the heat-generating components to the fins, increasing the fin surface area by 300% compared to traditional designs, improving radiation and convection heat dissipation efficiency. Forced convection heat dissipation is achieved using axial fans. Each heat sink fin area is equipped with two axial fans (airflow 23.7 CFM). / each), 2 units per group, 10 units in total; the heat from the heating element is transferred to the heat dissipation fins of the metal top cover through the thermal pad, and the airflow from the axial fan blows towards the narrow air channel formed by several slender fins in the fin area, forming forced convection, which improves the heat dissipation efficiency by 200% compared to the whole area heat dissipation, thus achieving high-efficiency heat dissipation.

[0095] In this embodiment, a modular PCB architecture is designed, namely: 1) Each power module is electrically connected to the motherboard module through 3 sockets and mechanically fixed with 4 screws, reducing the replacement time of a single power module to within 30 minutes and reducing maintenance costs by 75% compared to traditional whole board replacement; 2) The thermal pad is disassembled synchronously with the power module, eliminating the need for re-application and avoiding performance degradation caused by repeated installation of thermal media in traditional solutions.

[0096] It can also optimize fault location. When the temperature of a module is continuously higher than 80°C for more than 10 seconds, the microcontroller (MCU) sends a fault code to the flight control system via RS-422. The flight control system highlights the location of the faulty module on the operation interface, and maintenance personnel can directly locate and replace it, which shortens the fault location time by 80% compared with the traditional solution.

[0097] In the modular PCB architecture, a corresponding temperature sensor (MCP9701A, MICROCHIP, with an accuracy of ±2℃ (max.)) is mounted on each high-heat area (such as the surface of a DC-DC chip or power inductor). A total of M+1 groups (1 motherboard + M modules) are used to monitor the component temperature in real time. The temperature sensor communicates with the microcontroller (MCU) located in the motherboard module of the modular PCB architecture. The MCU controls the temperature sensor to collect temperature data at a frequency of 20Hz and obtains the real-time temperature data corresponding to each high-heat area.

[0098] Data processing module 302: is used to upload the real-time temperature data corresponding to each high-heat area to the microcontroller MCU in the modular PCB architecture, and to preprocess the real-time temperature data corresponding to each high-heat area in the microcontroller MCU to form preprocessed temperature data corresponding to each high-heat area.

[0099] In the specific implementation of this invention, the real-time temperature data corresponding to each high-heat area is preprocessed in the microcontroller MCU to form preprocessed temperature data corresponding to each high-heat area. This includes: preprocessing the real-time temperature data corresponding to each high-heat area in the microcontroller MCU by eliminating instantaneous temperature fluctuation data based on a moving average filtering algorithm to form preprocessed temperature data corresponding to each high-heat area.

[0100] Furthermore, in the microcontroller (MCU), a preprocessing method is used to eliminate instantaneous temperature fluctuation data in the real-time temperature data corresponding to each high-heat-generating region based on a moving average filtering algorithm, forming preprocessed temperature data corresponding to each high-heat-generating region. This includes: setting the maximum sampling change rate of two adjacent real-time temperature data, and determining the instantaneous temperature fluctuation data in the real-time temperature data based on the maximum sampling change rate; determining the filter window length based on the current operating mode of the eVTOL low-voltage distribution box module, wherein the current operating mode is flight mode, ground maintenance mode, or fault mode; and using the moving average filtering algorithm to eliminate instantaneous temperature fluctuation data in the real-time temperature data corresponding to each high-heat-generating region based on the filter window length, forming preprocessed temperature data corresponding to each high-heat-generating region.

[0101] Furthermore, the formula for the moving average filtering algorithm is as follows:

[0102] ;

[0103] in, This is the output value after the nth filter. This is the nth real-time temperature data; This represents the length of the filtering window.

[0104] Specifically, during temperature data acquisition, there may be instantaneous fluctuations. Therefore, it is necessary to identify outliers in the real-time temperature data through a noise identification threshold. This requires setting a maximum rate of change between adjacent sampled values. In this embodiment, the maximum rate of change between adjacent sampled values ​​is set to... Outlier handling: If If the value is not found, it is determined to be an instantaneous fluctuation (such as vibration interference or electromagnetic noise). This value is not included in the current window calculation and is replaced by the average of the previous 4 valid values.

[0105] Example: Original sequence: [65, 68, 110 (spur), 67, 66]℃; Filtered output: (65+68+67+66) / 4≈66.5℃ (spur values ​​are suppressed).

[0106] When setting the filter window length, special optimizations are required for eVTOL scenarios, namely in flight mode, ground maintenance mode, or fault mode. In flight mode, the filter window automatically expands from N=5 to N=8 to enhance the suppression of vibration noise (such as sensor jitter caused by propeller aerodynamic noise). In ground maintenance mode, N=5 is restored to ensure rapid response when there is abnormal temperature (response time is reduced from 250ms to 100ms). In fault mode, N=10 (enhancing anti-interference).

[0107] After determining the filter window length, a moving average filtering algorithm is used to preprocess the instantaneous temperature fluctuation data in the real-time temperature data corresponding to each high-heat region, eliminating the need for filtering. This preprocessing process generates preprocessed temperature data for each high-heat region. The formula for the moving average filtering algorithm is as follows:

[0108] ;

[0109] in, This is the output value after the nth filter. This is the nth real-time temperature data; This represents the length of the filtering window.

[0110] Thermal management module 303: The microcontroller (MCU) uploads the pre-processed temperature data corresponding to each high-heat area to the flight control system. The flight control system dynamically adjusts the axial fan speed and power supply priority in the heat dissipation device based on the pre-processed temperature data corresponding to each high-heat area for thermal management.

[0111] In the specific implementation of this invention, the flight control system controls the eVTOL low-voltage power distribution box module for thermal management based on the pre-processed temperature data corresponding to each high-heat area. This includes: the flight control system matching the pre-processed temperature data corresponding to each high-heat area with multiple preset temperature ranges, and obtaining a corresponding control strategy based on the matching result of the pre-processed temperature data corresponding to each high-heat area, wherein each control strategy corresponds to a temperature range; dynamically adjusting the power supply priority of the eVTOL low-voltage power distribution box module and controlling the axial fan speed in the heat dissipation device for thermal management based on the control strategy corresponding to the pre-processed temperature data corresponding to each high-heat area; wherein in the control strategy within a given temperature range, an incremental PID control algorithm is used to dynamically adjust the axial fan speed in the heat dissipation device.

[0112] Specifically, the microcontroller (MCU) uploads the pre-processed temperature data corresponding to each high-heat area to the flight control system. At this time, the MCU uploads the temperature matrix to the flight control system (FCU) through the RS-422 interface (transmission rate 115200bps).

[0113] The flight control system matches the pre-processed temperature data corresponding to each high-heat area with multiple preset temperature ranges, and matches the control strategy corresponding to the pre-processed temperature data corresponding to each high-heat area. Each control strategy corresponds to a temperature range. Specifically, the fan speed and power supply priority are dynamically adjusted according to the preset strategy. The table can be found in Table 1 in step S103 of Embodiment 1, and will not be repeated here.

[0114] Then, based on the control strategy corresponding to the preprocessed temperature data of each high-heat area, the power supply priority of the eVTOL low-voltage distribution box module and the speed of the axial fan in the heat dissipation equipment are dynamically adjusted for thermal management. For a given temperature range, such as 50-80℃, an incremental PID control algorithm is used to adjust the fan speed, specifically as follows:

[0115] PID calculation formula:

[0116] u(n)=u(n-1) + Kp·[e(n)-e(n-1)] + Ki·e(n) + Kd·[e(n)-2e(n-1)+e(n-2)];

[0117] Parameter definitions: e(n) = Tset - Treal(n), the error between the temperature setpoint and the real-time value (unit: °C); Tset = 65 °C (50-65 °C range) or 75 °C (65-80 °C range), dynamically switching the setpoint according to the temperature range; u(n) is the current PWM duty cycle output (range 30%-70%); Kp = 0.8, Ki = 0.05, Kd = 0.2 (parameter set optimized by DO-160G vibration test).

[0118] Special design for eVTOL scenarios: ① Dual setpoint adaptive switching; 50-65℃ range: Tset=65℃, adopting a conservative adjustment strategy (Kp=0.8) to avoid frequent fan start-stop (temperature fluctuations are common during eVTOL take-off and landing); 65-80℃ range: Tset=75℃, automatically switching to aggressive parameters (Kp=1.2, Kd=0.3), improving response speed by 30% and coping with sudden changes in motor load during flight.

[0119] ② Vibration-resistant differential processing: The temperature error signal is first subjected to a second-order low-pass filter (cutoff frequency 10Hz): e′(n)=0.9e′(n−1)+0.1e(n); the differential term is only calculated for the filtered error to eliminate high-frequency noise caused by vibration (eVTOL propeller vibration frequency is 80Hz, 10Hz filtering can attenuate more than 90%). ③ Integral limiting and power supply coordination: Integral term limiting: when |e(n)|<2℃, the integral coefficient Ki automatically drops to 0.02 to prevent overshoot; Power supply priority mapping: when the PID output u(n)>60%, the flight control system synchronously triggers the "non-critical load power cut-off" command (such as the cabin entertainment system), reducing the power distribution box load power by 15%, forming a "heat dissipation-load reduction" coordinated control; the fan drive adopts PWM pulse width modulation (frequency 25kHz), and the fan speed is adjusted by changing the fan power supply voltage value, with a speed adjustment accuracy of ±5%.

[0120] Through a closed-loop control process, a complete control cycle of "acquisition-decision-execution-verification" is achieved. After each temperature adjustment, data is re-acquired through the temperature sensor array to verify the effect, and the PID parameters are dynamically adjusted according to the actual cooling rate to ensure that the expected heat dissipation effect is achieved under any flight conditions. The system's "dynamic adjustment and verification mechanism" is as follows:

[0121] (1) Real-time feedback: After each PWM adjustment (adjustment period 50ms), the new temperature data is read immediately; (2) Effect evaluation: By comparing the deviation between the set temperature curve and the actual temperature curve; (Calculation formula: ΔT=│Tactual-Ttarget│ / Ttarget×100%); (3) Secondary adjustment: When ΔT>5%, the PID algorithm is triggered to recalculate the output value.

[0122] In this embodiment of the invention, by setting a modular PCB architecture and corresponding heat dissipation devices, optimizing the heat dissipation devices, and providing corresponding thermal management methods, dynamic heat dissipation management is achieved and heat dissipation capacity is improved; furthermore, the modular PCB architecture design makes subsequent maintenance more convenient and improves maintenance efficiency.

[0123] This invention provides a computer-readable storage medium storing a computer program. When executed by a processor, the program implements the thermal management method of any of the above embodiments. The computer-readable storage medium includes, but is not limited to, any type of disk (including floppy disks, hard disks, optical disks, CD-ROMs, and magneto-optical disks), ROM (Read-Only Memory), RAM (Random Access Memory), EPROM (Erasable Programmable Read-Only Memory), EEPROM (Electrically Erasable Programmable Read-Only Memory), flash memory, magnetic cards, or optical cards. In other words, the storage device includes any medium that stores or transmits information in a readable form by a device (e.g., a computer, a mobile phone), and can be a read-only memory, a disk, or an optical disk, etc.

[0124] This invention also provides a computer application running on a computer, which is used to execute the thermal management method of any of the above embodiments.

[0125] also, Figure 4 This is a schematic diagram of the structural composition of the electronic device in an embodiment of the present invention.

[0126] This invention also provides an electronic device, such as... Figure 4 As shown. The electronic device includes components such as a processor 402, a memory 403, an input unit 404, and a display unit 405. Those skilled in the art will understand that... Figure 4The structural components of the illustrated electronic device do not constitute a limitation on all devices and may include more or fewer components than illustrated, or combine certain components. Memory 403 can be used to store application program 401 and various functional modules. Processor 402 runs application program 401 stored in memory 403, thereby performing various functional applications and data processing of the device. Memory can be internal memory or external memory, or both. Internal memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), flash memory, or random access memory. External memory may include hard disks, floppy disks, ZIP disks, USB flash drives, magnetic tapes, etc. The memory disclosed in this invention includes, but is not limited to, these types of memory. The memory disclosed in this invention is only an example and not a limitation.

[0127] Input unit 404 is used to receive signal input and user-input keywords. Input unit 404 may include a touch panel and other input devices. The touch panel can collect user touch operations on or near it (such as operations performed by the user using a finger, stylus, or any suitable object or accessory on or near the touch panel) and drive the corresponding connection device according to a pre-set program; other input devices may include, but are not limited to, one or more of physical keyboards, function keys (such as play control buttons, power buttons, etc.), trackballs, mice, joysticks, etc. Display unit 405 can be used to display user-input information or information provided to the user, as well as various menus of the terminal device. Display unit 405 may be in the form of a liquid crystal display, organic light-emitting diode, etc. Processor 402 is the control center of the terminal device, connecting various parts of the entire device through various interfaces and lines, performing various functions and processing data by running or executing software programs and / or modules stored in memory 403, and calling data stored in memory.

[0128] As one embodiment, the electronic device includes: one or more processors 402, a memory 403, and one or more application programs 401, wherein the one or more application programs 401 are stored in the memory 403 and configured to be executed by the one or more processors 402, and the one or more application programs 401 are configured to execute the thermal management method corresponding to any of the above embodiments.

[0129] In this embodiment of the invention, by setting a modular PCB architecture and corresponding heat dissipation devices, optimizing the heat dissipation devices, and providing corresponding thermal management methods, dynamic heat dissipation management is achieved and heat dissipation capacity is improved; furthermore, the modular PCB architecture design makes subsequent maintenance more convenient and improves maintenance efficiency.

[0130] Furthermore, the above provides a detailed description of the thermal management method and related devices for an eVTOL low-voltage distribution box module provided by the embodiments of the present invention. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. A method of thermal management of an eVTOL low voltage distribution box module, characterized by, The application is applied to an eVTOL low-voltage distribution box module, a modular PCB architecture composed of one mainboard module and M power modules is arranged in the eVTOL low-voltage distribution box module, and a heat dissipation device is arranged on the modular PCB architecture, wherein M is an integer greater than or equal to 1, and the method comprises the following steps: A temperature sensor attached to a high-heat area of the modular PCB architecture is controlled to collect and process temperature at a preset frequency to obtain real-time temperature data corresponding to each high-heat area, the high-heat area is an area composed of high-heat devices concentrated on each power module and the mainboard module, and the high-heat area is at least two; Real-time temperature data corresponding to each high-heat area is uploaded to a microcontroller MCU in the modular PCB architecture, and the real-time temperature data corresponding to each high-heat area is preprocessed in the microcontroller MCU to form preprocessed temperature data corresponding to each high-heat area; The microcontroller MCU uploads the preprocessed temperature data corresponding to each high-heat area to a flight control system, and the flight control system controls the eVTOL low-voltage distribution box module to perform thermal management based on the preprocessed temperature data corresponding to each high-heat area.

2. The thermal management method of claim 1, wherein, The heat dissipation device comprises M+1 heat-conducting pads, M+1 heat dissipation fin areas, and 2(M+1) axial flow fans; Each heat-conducting pad is customized according to the shape and distribution of heat-generating devices in the corresponding high-heat area, and the material of the heat-conducting pad is ceramic-filled silicon; one surface of each heat-conducting pad is in contact with the corresponding high-heat area, and the other surface is in contact with one heat dissipation fin area, and two axial flow fans are arranged for each heat dissipation fin area.

3. The thermal management method of claim 1, wherein, The control of the temperature sensor attached to the high-heat area of the modular PCB architecture to collect and process temperature at a preset frequency to obtain real-time temperature data corresponding to each high-heat area comprises the following steps: A corresponding temperature sensor is attached to each high-heat area in the modular PCB architecture, and the temperature sensor is communicatively connected to the microcontroller MCU; The microcontroller MCU generates a temperature collection instruction according to a preset collection frequency, and collects and processes temperature at a preset frequency based on the temperature collection instruction to obtain real-time temperature data corresponding to each high-heat area.

4. The thermal management method of claim 1, wherein, The preprocessing of the real-time temperature data corresponding to each high-heat area in the microcontroller MCU to form preprocessed temperature data corresponding to each high-heat area comprises the following steps: In the microcontroller MCU, the instantaneous temperature fluctuation data in the real-time temperature data corresponding to each high-heat area is eliminated by a sliding average filtering algorithm for preprocessing to form preprocessed temperature data corresponding to each high-heat area.

5. The thermal management method of claim 4, wherein, In the microcontroller MCU, the instantaneous temperature fluctuation data in the real-time temperature data corresponding to each high-heat area is eliminated by a sliding average filtering algorithm for preprocessing to form preprocessed temperature data corresponding to each high-heat area, which comprises the following steps: Set a maximum sampling rate of change of two adjacent real-time temperature data, and determine the instantaneous temperature fluctuation data in the real-time temperature data based on the maximum sampling rate of change; Determine a filter window length based on a current operating mode of the eVTOL low-voltage distribution box module, the current operating mode being a flight mode or a ground maintenance mode or a fault mode; Preprocess the instantaneous temperature fluctuation data in the real-time temperature data corresponding to each high-heat area using the moving average filtering algorithm based on the filter window length, to form preprocessed temperature data corresponding to each high-heat area.

6. The thermal management method of claim 5, wherein, The formula of the moving average filtering algorithm is as follows: ； wherein, is the value of the nth filtered output; is the nth real-time temperature data; is the filter window length.

7. The thermal management method of claim 1, wherein, The flight control system controls the eVTOL low-voltage distribution box module for thermal management based on the preprocessed temperature data corresponding to each high-heat area, including: The flight control system matches the preprocessed temperature data corresponding to each high-heat area with a plurality of preset temperature intervals, and obtains a corresponding control strategy according to the matching result of the preprocessed temperature data corresponding to each high-heat area, wherein each control strategy corresponds to a temperature interval; Dynamically adjust the power supply priority of the eVTOL low-voltage distribution box module and control the rotational speed of the axial flow fan in the heat dissipation device for thermal management based on the control strategy corresponding to the preprocessed temperature data corresponding to each high-heat area. In the control strategy within a given temperature interval, the rotational speed of the axial flow fan in the heat dissipation device is dynamically adjusted using an incremental PID control algorithm.

8. A thermal management device for an eVTOL low voltage distribution box module, characterized by, The device is applied to an eVTOL low-voltage distribution box module, the eVTOL low-voltage distribution box module is provided with a modular PCB architecture composed of one mainboard module and M power module groups, and a heat dissipation device is arranged on the modular PCB architecture, where M is an integer greater than or equal to 1, and the device comprises: A temperature acquisition module for controlling a temperature sensor attached to a high-heat area of the modular PCB architecture to perform temperature acquisition processing at a preset frequency, to obtain real-time temperature data corresponding to each high-heat area, the high-heat area being an area composed of high-heat devices concentrated on each power module group and mainboard module, and the high-heat area being at least two; A data processing module for uploading the real-time temperature data corresponding to each high-heat area to a microcontroller MCU in the modular PCB architecture, and preprocessing the real-time temperature data corresponding to each high-heat area in the microcontroller MCU to form preprocessed temperature data corresponding to each high-heat area; A thermal management module for the microcontroller MCU to upload the preprocessed temperature data corresponding to each high-heat area to a flight control system, and the flight control system to control the eVTOL low-voltage distribution box module for thermal management based on the preprocessed temperature data corresponding to each high-heat area.

9. An electronic device comprising a processor and a memory, characterized in that The processor runs a computer program or code stored in the memory to implement the thermal management method of any one of claims 1 to 7.

10. A computer readable storage medium for storing a computer program or code, characterized in that, When the computer program or code is executed by the processor, the thermal management method of any one of claims 1 to 7 is implemented.

Images