IDC server for geographic information processing

Abstract

The invention relates to an IDC (Internet Data Center) server for geographic information processing, which comprises an IDC case, a plurality of IDC server nodes, a power supply module, a data exchange module and a node monitoring system, and is characterized in that a node mounting cavity and a functional cavity which are independently distributed up and down are arranged in the IDC case; the interior of the node installation cavity is divided into a plurality of installation areas which are arranged side by side and penetrate through the two ends of the IDC case through partition plates, the IDC server nodes are inserted into the installation areas in a one-to-one correspondence mode from one end of the IDC case, and the power module and the data exchange module are arranged in the function cavity. The power supply module is respectively and electrically connected with the plurality of IDC server nodes, the data exchange modules and the node monitoring system, the plurality of data exchange modules are respectively and electrically connected with each IDC server node, and the node monitoring system is respectively and electrically connected with the power supply module and the plurality of IDC server nodes and is used for monitoring the operation condition of each IDC server node. The system has the advantages that the operation condition of each node can be monitored through the monitoring system, and disassembly, assembly and debugging are convenient.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of server devices, in particular to an IDC server for geographic information processing. BACKGROUND

[0002] IDC (Internet Data Center) server refers to a professional server device hosted in an IDC room, used for providing Internet services, data storage, computing resources and various network applications. It is the core component of IDC infrastructure. At present, geographic information systems have accumulated large data volume and multiple types of geographic information data. With the advent of the big data era, more accurate measurement methods for obtaining geographic information data should be explored. Although the existing geographic data has a large amount of content, the accuracy of geographic information data is low. A large amount of geographic data is generated after further processing of satellite pictures, and the accuracy and accuracy cannot meet the demand of the existing application scenarios for geographic information data. At present, the existing server lacks a display module, and the corresponding node hardware information and running state cannot be quickly found during use.

[0003] Therefore, it is necessary to develop an IDC server for geographic information processing to solve the above technical problems. SUMMARY

[0004] The technical problem to be solved by the present application is to provide an IDC server for geographic information processing, which effectively overcomes the defects of the prior art.

[0005] The technical solution of the present application to solve the above technical problems is as follows:

[0006] An IDC server for geographic information processing, comprising an IDC case, a plurality of IDC server nodes, a power module, a data exchange module and a node monitoring system, wherein the IDC case is provided with a node mounting cavity and a function cavity which are independently distributed up and down, the node mounting cavity is divided into a plurality of mounting areas which are arranged side by side and respectively penetrate the two ends of the IDC case by a partition, the plurality of IDC server nodes are respectively inserted into each mounting area from one end of the IDC case one by one, the power module and the data exchange module are arranged in the function cavity, the power module is electrically connected with the plurality of IDC server nodes, the data exchange module and the node monitoring system, the plurality of data exchange modules are respectively electrically connected with each IDC server node, and the node monitoring system is electrically connected with the power module and the plurality of IDC server nodes, for monitoring the running condition of each IDC server node.

[0007] On the basis of the above technical solution, the present application can be further improved as follows.

[0008] Further, the IDC case is a cuboid box, the box includes an upper portion and a bottom shell with both ends open, a cover plate and a top cover, the top cover is detachably mounted on the upper opening of the bottom shell, the cover plate is arranged between the two side walls of the bottom shell and close to the top cover, the node installation cavity is defined between the cover plate and the bottom shell, and the function cavity is defined between the cover plate and the top cover.

[0009] Further, the power module includes a plurality of power boxes, a power connection circuit board and a power adapter fixing plate, the power adapter fixing plate is detachably mounted between the other end of the cover plate and the top cover, a plurality of mounting holes corresponding to the power boxes are formed on the power adapter fixing plate, a plurality of power boxes are inserted into the mounting holes one by one, and the ends are detachably connected with the power adapter fixing plate, the power connection circuit board is mounted on the upper portion of the cover plate, a plurality of power boxes are electrically connected with the power connection circuit board respectively, and are electrically connected with a plurality of IDC server nodes, data exchange modules and node monitoring systems through the power connection circuit board.

[0010] Further, the power box is provided with four.

[0011] Further, the node monitoring system includes a screen and a single-chip microcomputer, one end of the top cover is bent downward to form an enclosure, a screen mounting opening is formed on the enclosure, the screen is mounted in the function cavity from the screen mounting opening and can be pulled out or pushed in from the screen mounting opening, the single-chip microcomputer is mounted on the upper portion of the cover plate, and the single-chip microcomputer is electrically connected with the screen and the data exchange module respectively.

[0012] Further, the two sides of one end of the bottom shell are respectively provided with node ear plates which are vertically turned outward and used for mounting connection with the cabinet, and a first handle is arranged at one end of the node ear plate.

[0013] Further, the IDC server node is provided with eight.

[0014] Further, the IDC server node includes a long strip-shaped box body, a mainboard, a graphics card module, a cooling fan assembly and a power adapter plate, one side of the box body is open, the mainboard, the graphics card module and the cooling fan assembly are respectively mounted on the other side wall inside the box body, the mainboard is close to one end of the box body, the cooling fan assembly is arranged between the mainboard and the graphics card module, the air outlet direction of the cooling fan assembly is towards one end of the box body, ventilation openings are respectively arranged on the two end side walls of the box body, and the power adapter plate is mounted on one side wall of the box body and electrically connected with the power module.

[0015] Further, the position corresponding to the chip on the mainboard is provided with a slot-shaped air baffle with two open ends, the slot of the air baffle is attached to the mainboard, one end of the air baffle is close to one end of the box body, the other end of the air baffle extends to the position of the heat dissipation fan assembly, a plurality of vertical heat dissipation fans arranged in a column are arranged in the heat dissipation fan assembly, at least two heat dissipation fans are arranged inside the other end of the air baffle, and at least one heat dissipation fan is arranged outside the other end of the air baffle.

[0016] Further, the other end of the air baffle is provided with a neck, and the outside of one end of the box body is provided with a second handle.

[0017] The application has the advantages that the structure is reasonable, the running conditions of each node can be monitored through the monitoring system, and the disassembly and debugging are facilitated. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 It is a structural schematic view of the IDC server for geographic information processing of the application;

[0019] Figure 2 It is an exploded view of the structure of the IDC server for geographic information processing of the application;

[0020] Figure 3 It is a structural schematic view of the IDC server for geographic information processing of the application after the top plate is disassembled;

[0021] Figure 4 It is a structural schematic view of the IDC server node in the IDC server for geographic information processing of the application;

[0022] Figure 5 It is a module connection diagram of each electrical element in the IDC server for geographic information processing of the application;

[0023] Figure 6 It is a network signal connection topology diagram in the IDC server for geographic information processing of the application.

[0024] In the drawings, the components represented by each reference numeral are listed as follows:

[0025] 1, IDC case; 2, IDC server node; 3, power supply module; 4, data exchange module; 11, bottom shell; 12, cover plate; 13, top cover; 21, box body; 22, mainboard; 23, display card module; 24, heat dissipation fan assembly; 25, power supply adapter plate; 26, air baffle; 31, power supply box; 32, power supply connection circuit board; 33, power supply adapter fixing plate; 51, screen; 52, single-chip microcomputer; 111, partition plate; 112, node ear side plate; 113, first handle; 131, sealing plate; 215, ventilation opening; 242, heat dissipation fan. Detailed Implementation

[0026] The principles and features of the present invention are described below with reference to the accompanying drawings. The examples given are only for explaining the present invention and are not intended to limit the scope of the present invention.

[0027] Example

[0028] like Figure 1 , 2 As shown in Figures 3, 5, and 6, the IDC server for geographic information processing in this embodiment includes an IDC chassis 1, multiple IDC server nodes 2, a power module 3, a data exchange module 4, and a node monitoring system. The IDC chassis 1 has independently distributed node mounting cavities and functional cavities. The node mounting cavities are divided into multiple parallel mounting areas that are connected to both ends of the IDC chassis 1 by partitions 111. The multiple IDC server nodes 2 are inserted into each of the mounting areas one by one from one end of the IDC chassis 1. The power module 3 and the data exchange module 4 are located in the functional cavities. The power module 3 is electrically connected to the multiple IDC server nodes 2, the data exchange module 4, and the node monitoring system. The multiple data exchange modules 4 are electrically connected to each of the IDC server nodes 2. The node monitoring system is electrically connected to the power module 3 and the multiple IDC server nodes 2 to monitor the operating status of each of the IDC server nodes 2.

[0029] The IDC server for geographic information processing in this embodiment has a reasonable internal structure design of IDC chassis 1, which makes multiple internal electrical components reasonably arranged in the corresponding cavities, which is convenient for disassembly, assembly, maintenance and repair. At the same time, the node monitoring system can effectively monitor the operating status of each node, which is convenient for disassembly and debugging.

[0030] In a preferred embodiment, the IDC chassis 1 is a rectangular box, which includes a bottom shell 11, a cover plate 12, and a top cover 13, all of which are open at the top and both ends. The top cover 13 is detachably mounted on the upper opening of the bottom shell 11. The cover plate 12 is disposed between the inner walls of the two sides of the bottom shell 11 and close to the top cover 13. The cover plate 12 and the bottom shell 11 define the node mounting cavity, and the cover plate 12 and the top cover 13 define the functional cavity.

[0031] In the above embodiment, the IDC case 1 adopts a traditional cuboid type, simple and elegant structure, wherein the bottom shell 11 is integrally cast, the top cover 13 has top cover flanges on both sides, which are buckled on both sides of the upper end of the bottom shell 11 and assembled by screws, and the cover plate 12 is provided with cover plate flanges on both sides, which are attached to the inner walls of both sides of the IDC case 1 and assembled with the bottom shell 11 by welding or screwing. The overall internal layout is very reasonable, which is beneficial to the compact installation of the IDC server node 2 and other electrical components, and the overall server size can be miniaturized to the extreme. A plurality of installation areas are distributed side by side between the two sides of the IDC case 1.

[0032] As a preferred embodiment, the power supply module 3 includes a plurality of power supply boxes 31, a power supply connection circuit board 32 and a power supply adapter fixing plate 33. The power supply adapter fixing plate 33 is detachably mounted between the other end of the cover plate 12 and the top cover 13. A plurality of mounting holes corresponding to the power supply boxes 31 are formed in the power supply adapter fixing plate 33. A plurality of power supply boxes 31 are inserted into the mounting holes one by one, and the ends are detachably connected to the power supply adapter fixing plate 33. The power supply connection circuit board 32 is mounted on the upper part of the cover plate 12. The plurality of power supply boxes 31 are electrically connected to the power supply connection circuit board 32 respectively, and are electrically connected to the plurality of IDC server nodes 2, data exchange modules 4 and node monitoring systems through the power supply connection circuit board 32 respectively (as shown in FIG. 6). Figure 5

[0033] In the above embodiment, the power supply adapter fixing plate 33 can seal the other end of the functional cavity, and also facilitate the installation of the power supply box 31. The power supply connection circuit board 32 mainly serves as an adapter for electrically connecting the power supply box 31 and other electrical components, which facilitates the circuit connection of internal electrical components. The power supply connection circuit board 32 is a product of existing technology, and the actual product can be adapted to the model. In addition, all electrical components in the server are connected to the plurality of power supply boxes 31 to achieve independent power supply.

[0034] Preferably, the power supply box 31 has four.

[0035] As a preferred embodiment, the node monitoring system includes a screen 51 and a single-chip microcomputer 52. One end of the top cover 13 is bent downward to form a sealing plate 131. A screen mounting opening is formed in the sealing plate 131. The screen 51 is mounted in the functional cavity from the screen mounting opening and can be pulled out or pushed in from the screen mounting opening. The single-chip microcomputer 52 is mounted on the upper part of the cover plate 12. The single-chip microcomputer 52 is electrically connected to the screen 51 and the data exchange module 4 respectively.

[0036] ​In this embodiment, the screen 51 is a touchable smart screen, which is wrapped with a shell to avoid damage caused by collision. The screen 51 is connected with the single-chip microcomputer 52, which contains a pre-written control program. Through the connection with the data exchange module 4, the running status of each IDC server node 2 can be monitored. The screen 51 is assembled in a pull-out mode, which can be pulled out from the screen mounting opening at the sealing plate 131 for use, or pushed into the functional cavity for hiding when not in use, thereby achieving good protection effect.

[0037] More specifically, as shown in Figure 6 , the screen 51 initiates a program command application to control the single-chip microcomputer 52, establishes a link with each IDC server node 2 through the connection data exchange module 4, calls node running data, and summarizes on the screen 51.

[0038] Preferably, the bottom shell 11 is provided with node ear plates 112 on both sides of one end, which are vertically turned outwards and used for mounting connection with the cabinet. The node ear plates 112 are provided with first handles 113 at one end. During installation, the entire server is pushed into the corresponding installation cavity of the cabinet, and after being pushed into place, the node ear plates 112 on both sides are respectively attached to both sides of the port of the installation cavity, and are connected and assembled by screws penetrating through the node ear plates 112 and both sides of the port. When disassembling, the screws are removed, and the entire server can be pulled out, which is very convenient to operate.

[0039] Preferably, the IDC server node 2 is provided with eight.

[0040] In this embodiment, the data exchange module 4 is composed of eight 10-gigabit electrical ports and four 10-gigabit optical ports. The eight 10-gigabit electrical ports are respectively connected with the eight IDC server nodes 2. The screen 51 of the node monitoring system is connected with one 10-gigabit optical port through an optical-electric conversion module. Two 10-gigabit optical ports are connected at the rear of the IDC cabinet 1 (i.e. the other end of the IDC cabinet 1) through an LC-LC optical fiber coupler.

[0041] As a preferred embodiment, as shown in Figure 4 , the IDC server node 2 includes a long strip-shaped box body 21, a mainboard 22, a graphics card module 23, a cooling fan assembly 24, and a power supply adapter plate 25. The box body 21 is provided with an open side. The mainboard 22, the graphics card module 23, and the cooling fan assembly 24 are respectively installed on the other side wall inside the box body 21. The mainboard 22 is close to one end of the box body 21. The cooling fan assembly 24 is arranged between the mainboard 22 and the graphics card module 23. The air outlet direction of the cooling fan assembly 24 is towards one end of the box body 21. Ventilation openings 215 are respectively arranged on the two end side walls of the box body 21. The power supply adapter plate 25 is installed on the side wall of the box body 21. The power supply adapter plate 25 is electrically connected with the power supply module 3.

[0042] In the above implementation scheme, the airflow generated by the cooling fan assembly 24 follows a "straight-through" path, meaning air enters from the other end of the housing 21, exits through a vent 215, and during this process, the airflow passes over the motherboard 22, carrying away the heat generated by the heat-generating electrical components on the motherboard 22. The airflow flows straight through the housing 21 from one end to the other. This straight-through airflow cooling method effectively reduces resistance and significantly improves heat dissipation performance. Furthermore, the internal space layout of the housing 21 is optimized, enhancing hardware expandability while ensuring heat dissipation performance.

[0043] In this embodiment, one end of the box 21 is connected to one end of the corresponding installation area through an existing snap-fit ​​structure (such as the CN214954853U computer chassis mounting snap-fit ​​structure, a in the figure refers to this), which can achieve quick locking. When disassembling, the snap-fit ​​connection can be released and the box 21 can be pulled out.

[0044] Preferably, the motherboard 22 has a slotted air guide shroud 26 with open ends at the corresponding chip positions. The slots of the air guide shroud 26 fit snugly against the motherboard 22. One end of the air guide shroud 26 is close to one end of the housing 21, and the other end extends to the cooling fan assembly 24. The cooling fan assembly 24 has multiple cooling fans 242 arranged vertically in a row inside, with at least two cooling fans 242 located inside the other end of the air guide shroud 26 and at least one cooling fan 242 located outside the other end of the air guide shroud 26. This design ensures that the air blown by at least two cooling fans 242 enters the air guide shroud 26, which covers the important electronic components (chips) on the motherboard 22. Therefore, the air guide shroud 26 effectively dissipates heat from the important electronic components on the motherboard 22, resulting in better heat dissipation performance and improved operation of the motherboard 22. Meanwhile, multiple cooling fans 242 cover the areas of the two side walls of the box 21 and blow directly onto them, so there are no blind spots in heat dissipation, making the entire IDC server node 2 run relatively stably.

[0045] In this embodiment, the other end of the aforementioned air guide shroud 26 is narrowed, and a second handle is provided on the outer side of one end of the aforementioned housing 21. The airflow blown out by the cooling fan 242 enters through the narrower air inlet at the other end of the air guide shroud 26, which enhances the air pressure and allows it to quickly enter the interior of the air guide shroud 26, promoting airflow and indirectly improving heat dissipation performance. Simultaneously, the design of the second handle (represented by b in the figure) facilitates the pulling out of the disassembled IDC server node 2 during maintenance and repair.

[0046] In the description of the present application, it is to be understood that the orientations or positional relationships indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like are based on the orientations or positional relationships shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and do not indicate or imply that the devices or elements indicated thereby must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0047] In addition, the terms "first", "second", "third", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated thereby. Therefore, the features defined with "first", "second", etc. can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise explicitly specified and limited.

[0048] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0049] In the present application, unless otherwise explicitly specified and limited, the first feature "on" or "under" the second feature can be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature "above", "over" and "on" the second feature can be that the first feature is directly above or obliquely above the second feature, or it can only mean that the first feature is higher in horizontal height than the second feature. The first feature "below", "under" and "under" the second feature can be that the first feature is directly below or obliquely below the second feature, or it can only mean that the first feature is lower in horizontal height than the second feature.

[0050] In the description of the specification, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are contained in at least one embodiment or example of the present application. In the specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any suitable manner in any one or more embodiments or examples. In addition, the person skilled in the art can combine and combine the different embodiments or examples described in the specification and the features of the different embodiments or examples without contradiction.

[0051] Although the embodiments of the present application have been shown and described above, it is understood that the above-described embodiments are exemplary and are not to be construed as limiting the present application, and those skilled in the art can make changes, modifications, replacements and variations to the above-described embodiments within the scope of the present application.

Claims

1. An IDC server for geographic information processing, characterized in that: The system includes an IDC chassis (1), multiple IDC server nodes (2), a power module (3), a data exchange module (4), and a node monitoring system. The IDC chassis (1) has independently distributed node mounting cavities and functional cavities. The node mounting cavities are divided into multiple parallel mounting areas that run through both ends of the IDC chassis (1) by partitions (111). The multiple IDC server nodes (2) are inserted into each mounting area from one end of the IDC chassis (1). The power module (3) and the data exchange module (4) are located in the functional cavities. The power module (3) is electrically connected to the multiple IDC server nodes (2), the data exchange module (4), and the node monitoring system. The multiple data exchange modules (4) are electrically connected to each IDC server node (2). The node monitoring system is electrically connected to the power module (3) and the multiple IDC server nodes (2) to monitor the operating status of each IDC server node (2).

2. An IDC server for geographic information processing according to claim 1, characterized in that: The IDC chassis (1) is a rectangular box. The box includes a bottom shell (11) with openings at the top and both ends, a cover plate (12) and a top cover (13). The top cover (13) is detachably installed at the upper opening of the bottom shell (11). The cover plate (12) is located between the inner walls of the two sides of the bottom shell (11) and close to the top cover (13). The cover plate (12) and the bottom shell (11) define the node mounting cavity, and the cover plate (12) and the top cover (13) define the functional cavity.

3. An IDC server for geographic information processing according to claim 2, characterized in that: The power module (3) includes multiple power boxes (31), a power connection circuit board (32), and a power adapter fixing plate (33). The power adapter fixing plate (33) is detachably mounted between the other end of the cover plate (12) and the top cover (13). The power adapter fixing plate (33) has multiple mounting holes corresponding to the power boxes (31). The multiple power boxes (31) are inserted into the mounting holes one by one, and their ends are detachably connected to the power adapter fixing plate (33). The power connection circuit board (32) is mounted on the upper part of the cover plate (12). The multiple power boxes (31) are electrically connected to the power connection circuit board (32) respectively, and are electrically connected to the multiple IDC server nodes (2), data exchange module (4), and node monitoring system respectively through the power connection circuit board (32).

4. An IDC server for geographic information processing according to claim 3, characterized in that: The power supply box (31) has four units.

5. An IDC server for geographic information processing according to claim 2, characterized in that: The node monitoring system includes a screen (51) and a microcontroller (52). One end of the top cover (13) is bent downward to form a sealing plate (131). The sealing plate (131) has a screen mounting opening. The screen (51) is installed into the functional cavity through the screen mounting opening and can be pulled out or pushed in through the screen mounting opening. The microcontroller (52) is mounted on the upper part of the cover plate (12). The microcontroller (52) is electrically connected to the screen (51) and the data exchange module (4) respectively.

6. An IDC server for geographic information processing according to claim 2, characterized in that: The bottom shell (11) has vertically outward-turned node ear side plates (112) on both sides of one end, which are used for installation and connection with the cabinet. The node ear side plate (112) has a first handle (113) at one end.

7. An IDC server for geographic information processing according to claim 1, characterized in that: The IDC server node (2) has eight nodes.

8. An IDC server for geographic information processing according to any one of claims 1 to 7, characterized in that: The IDC server node (2) includes a long box (21), a motherboard (22), a graphics card module (23), a cooling fan assembly (24), and a power adapter board (25). One side of the box (21) is open. The motherboard (22), the graphics card module (23), and the cooling fan assembly (24) are respectively installed on the other side wall inside the box (21). The motherboard (22) is close to one end of the box (21). The cooling fan assembly (24) is located between the motherboard (22) and the graphics card module (23). The air outlet of the cooling fan assembly (24) is directed towards one end of the box (21). Ventilation vents (215) are provided on the two side walls of the box (21). The power adapter board (25) is installed on one side wall of the box (21) and is electrically connected to the power module (3).

9. An IDC server for geographic information processing according to claim 8, characterized in that: The motherboard (22) has a slotted air guide shroud (26) with open ends at the corresponding chip position. The slot of the air guide shroud (26) fits the motherboard (22). One end of the air guide shroud (26) is close to one end of the housing (21). The other end of the air guide shroud (26) extends to the cooling fan assembly (24). The cooling fan assembly (24) has multiple cooling fans (242) arranged vertically in a row inside. At least two of the cooling fans (242) are located inside the other end of the air guide shroud (26), and at least one of the cooling fans (242) is located outside the other end of the air guide shroud (26).

10. An IDC server for geographic information processing according to claim 9, characterized in that: The other end of the air guide cover (26) is narrowed, and a second handle is provided on the outer side of one end of the box body (21).

Images