Cooling fin and electronic equipment

Abstract

The invention provides a cooling fin and electronic equipment, and relates to the technical field of cooling devices. The cooling fin comprises a shell and turbulent flow pieces, the multiple turbulent flow pieces are fixed to the inner wall of the shell, each turbulent flow piece is made of memory metal, and the included angle between each turbulent flow piece and the inner wall of the shell is increased under the action of thermal shock. According to the cooling fin and the electronic equipment provided by the invention, the flow disturbing piece made of the memory metal can increase the included angle between the flow disturbing piece and the inner wall of the shell under thermal shock, so that the flow disturbing piece can generate stronger disturbance on people flowing in the shell, the cooling efficiency is improved, and therefore, the flow disturbing piece can automatically adjust and adjust the heat exchange capability according to working conditions, and a heat source is stabilized at a specific temperature.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat dissipation devices, in particular to a heat dissipation fin and an electronic device. BACKGROUND

[0002] Electronic devices are prone to generate a lot of heat during operation, and need to be installed with heat dissipation fins for heat dissipation. With the enrichment of electronic device functions, the heat generated by electronic devices such as processors increases. In order to improve the heat dissipation effect, the current common way is to set fins to increase the heat dissipation area or to use heat dissipation materials with better heat conduction performance. However, the heat dissipation effect of these two ways is fixed and cannot be adjusted according to the change of heat generation. SUMMARY

[0003] The present application provides a heat dissipation fin and an electronic device to solve the defect that the heat dissipation capacity of the heat dissipation member in the prior art is fixed and cannot be adjusted according to the change of heat generation.

[0004] The present application provides a heat dissipation fin, which comprises a shell and a spoiler, a plurality of spoilers are fixed to the inner wall of the shell, each spoiler is made of memory metal, and the included angle between each spoiler and the inner wall of the shell increases under the action of thermal shock.

[0005] According to the heat dissipation fin provided by the embodiment of the present application, the spoiler comprises a first structure body and a second structure body connected together, the same side end of the first structure body and the second structure body is fixedly connected with the inner wall of the shell, and the material of the first structure body and the second structure body is different, wherein the first structure body expands under heat, and the second structure body shrinks under heat.

[0006] According to the heat dissipation fin provided by the embodiment of the present application, along the flow direction of heat in the shell, the second structure body is located on the windward side.

[0007] According to the heat dissipation fin provided by the embodiment of the present application, the spoiler is in the shape of a cone.

[0008] According to the heat dissipation fin provided by the embodiment of the present application, the spoiler is in the shape of a cone, and the bottom surface of the spoiler is fixedly connected with the inner wall of the shell.

[0009] According to the heat dissipation fin provided by the embodiment of the present application, one side of the shell is provided with a heat dissipation fin.

[0010] According to the heat dissipation fin provided by the embodiment of the present application, a plurality of spoilers are arranged in multiple rows and multiple columns on the inner wall of the shell.

[0011] In the second aspect, the present application further provides an electronic device, which comprises a heat source and the heat dissipation fin as described in any one of the first aspect, and the side of the shell on which the spoiler is installed faces the heat source.

[0012] According to the electronic device provided by the embodiment of the present application, the heat-conducting pad is arranged between the heat sink and the heat source.

[0013] According to the electronic device provided by the embodiment of the present application, the heat-conducting pad is a copper sheet.

[0014] The heat sink and the electronic device provided by the present application, the spoiler made of memory metal can increase the included angle with the inner wall of the shell under thermal shock, thereby generating stronger disturbance to the flow in the shell, improving the heat dissipation efficiency. Therefore, the spoiler can adjust according to the working condition, adjust the heat exchange capacity, and stabilize the heat source at a specific temperature. BRIEF DESCRIPTION OF DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the present application or prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0016] Figure 1 is a schematic view of the cooperation of the heat sink and the heat source provided by the present application; Figure 2 is a schematic view of the state change of the spoiler under thermal shock provided by the present application.

[0017] Figure 3 is a schematic view of the installation of the spoiler in the shell provided by the present application.

[0018] Figure 4 is a perspective view of the spoiler provided by the present application.

[0019] Figure 5 is a schematic view of the state of the spoiler under rated working condition provided by the present application.

[0020] Figure 6 is a schematic view of the state of the spoiler under extreme working condition provided by the present application.

[0021] Figure 7 is a comparison diagram of heat exchange coefficients of the spoiler under different inclination angles provided by the present application.

[0022] Reference signs: 10, shell; 11, heat dissipation channel; 20, spoiler; 21, first structure; 22, second structure; 30, heat source. DETAILED DESCRIPTION

[0023] In order to make the objects, technical solutions and advantages of the present application clearer, the following will clearly and completely describe the technical solutions in the present application with reference to the drawings in the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based upon the embodiments in the present application, all other embodiments obtained by those ordinarily skilled in the art without creative effort belong to the scope of the present application.

[0024] The terms "first", "second" in the description and claims of the present application can explicitly or implicitly include one or more features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise specified. In addition, "and / or" in the description and claims means at least one of the connected objects, and the character " / ", generally means that the front and rear associated objects are in an "or" relationship.

[0025] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0026] In the description of the present application, it should be noted that, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0027] The following will be described with reference to the drawings Figures 1-7 The fin of the present application is described.

[0028] The fin of the present application is described. Figure 1 The fin of the present application is described. Figure 2 As shown in the drawings, the fin includes a shell 10 and a spoiler 20, and a plurality of spoilers 20 are fixed on the inner wall of the shell 10. The spoiler 20 is made of memory metal. The included angle between each spoiler 20 and the inner wall of the shell 10 increases under the action of thermal shock.

[0029] The housing 10 is flat and has a hollow heat dissipation channel 11 inside, with the baffle 20 located inside the heat dissipation channel 11. Shape memory metal shrinks or expands at different temperatures and can recover its original shape after deformation. In the heat sink provided by this embodiment, the baffle 20 gradually stands upright under thermal shock, increasing the angle between the baffle 20 and the inner wall of the housing 10, thereby disturbing the heat flowing within the heat dissipation channel 11 and improving the heat dissipation effect.

[0030] One end of the spoiler 20 is embedded in the housing 10. Alternatively, the spoiler 20 is in the shape of a nail and is inserted and fixed to the inner wall of the housing 10. In addition, the spoiler 20 can also be fixed to the inner wall of the housing 10 by other fixing methods.

[0031] In use, one side of the housing 10 is in contact with the heat source 30, and heat enters the housing 10 from the heat source 30 and flows into the housing 10. For example... Figure 1 and Figure 5 As shown, under rated operating conditions, the baffle 20 is basically in contact with the inner wall of the housing 10, reducing the resistance of the baffle 20 to heat flow and ensuring good heat dissipation. Under extreme operating conditions where localized heat increases, the baffle 20 in the corresponding area will deform under the impact of the heat flow, such as... Figure 2 and Figure 6 As shown, the shape memory metal deforms, causing the turbulence-disrupting component 20 to stand up, thereby enabling the turbulence-disrupting component 20 to adapt to changes in operating conditions, increase the turbulence intensity, and improve heat dissipation capacity.

[0032] like Figure 7 As shown, when the angle between the baffle 20 and the inner wall of the housing 10, i.e. the tilt angle of the baffle 20, is different, the tilt angle increases, the heat exchange system is improved, which helps to improve the heat dissipation effect, reduce the operating risk of electronic equipment under extreme conditions such as increased heat, and improve the service life of electronic equipment.

[0033] The heat sink provided in this embodiment of the invention has a flow-deflecting element 20 made of shape memory metal that can increase the angle between itself and the inner wall of the housing 10 under thermal shock, thereby generating stronger disturbance to the flow of people inside the housing 10 and improving heat dissipation efficiency. Thus, the flow-deflecting element 20 can adjust itself according to the working conditions to adjust the heat exchange capacity and stabilize the heat source 30 at a specific temperature.

[0034] In one embodiment, such as Figure 3 , Figure 4 and Figure 5 As shown, the spoiler 20 includes a first structure 21 and a second structure 22 connected together, with the same-side ends of both the first structure 21 and the second structure 22 connected to the inner wall of the housing 10. The first structure 21 and the second structure 22 are made of different materials. The first structure 21 expands when heated, while the second structure 22 contracts when heated.

[0035] As shown in Figure 2 and Figure 5 , under the action of thermal shock, the first structure 21 expands, and the second structure shrinks, so that the whole spoiler 20 gradually stands up. It can be understood that the spoiler 20 can also have three or more structures. For example, the spoiler 20 includes three structures, two of which are located on the opposite sides of the third structure. As long as the multiple structures cooperate to increase the included angle with the inner wall of the shell 10 under thermal shock.

[0036] In still other embodiments, the side of the spoiler 20 is provided with an elastic reset member. The spoiler 20 is made of a heat-expandable memory metal. When subjected to thermal shock, the spoiler 20 expands and stands up, and the elastic reset member stores energy; after the heat decreases, the elastic reset member resets and pushes the spoiler 20 back to the state of being attached to the shell 10.

[0037] As shown in Figure 2 , Figure 5 and Figure 6 , along the direction of heat flow inside the shell 10, the second structure 22 is located on the windward side. Heat causes the second structure 22 to shrink, driving the whole spoiler 20 to stand up.

[0038] In an optional embodiment, as shown in Figure 4 , the spoiler 20 is in the shape of a cone. For example, the spoiler 20 is in the shape of a circular cone, and the bottom surface of the spoiler 20 is fixedly connected to the inner wall of the shell 10. For another example, the spoiler 20 is in the shape of a square cone. Of course, the spoiler 20 can also be in the shape of a truncated cone. In still another optional embodiment, the outer wall of the spoiler 20 is a slope, and along the extension direction of the slope, the cross-sectional area of the spoiler 20 in the direction perpendicular to the central axis gradually decreases, so as to provide a bending space for the spoiler 20.

[0039] In a specific embodiment, the first structure and the second structure are both in the shape of a semi-circular cone, and the two are butt-jointed to form a circular cone structure.

[0040] In an embodiment, as shown in Figure 1 and Figure 2 , the spoiler 20 has multiple, and the multiple spoilers 20 are arranged in multiple rows and multiple columns on the inner wall of the shell 10.

[0041] For example, the multiple spoilers 20 are arranged in a square array inside the shell 10. Alternatively, the adjacent two rows of spoilers 20 are staggered. It should be noted that the spoilers 20 have gaps between each other when they are substantially attached to the shell 10, so as to ensure that heat can quickly enter the heat dissipation space above the spoilers 20.

[0042] When different regions of the shell 10 are subjected to thermal shock, only the spoilers 20 in the corresponding regions are deformed. As shown in Figure 2As shown, the plurality of cone-shaped turbulence members 20 are installed in the shell 10, and the heat source 30 is an electronic device. The left turbulence member 20 deforms under thermal shock, and the included angle between the turbulence member 20 and the inner wall of the shell 10 increases, so that the turbulence member 20 gradually stands up from the state of being basically attached to the shell 10, thereby improving the turbulence capacity, keeping the temperature of the electronic device balanced, and avoiding local high temperature from damaging the electronic device.

[0043] Optionally, the shell 10 is provided with a heat dissipation fin on one side. The heat dissipation fin is located on the side of the shell 10 away from the electronic device.

[0044] The embodiment of the present application also provides an electronic device, which comprises a heat source 30 and the heat dissipation fin as above, and the side of the shell 10 on which the turbulence member 20 is installed faces the heat source 30.

[0045] In use, the heat generated by the heat source 30 is transferred to the heat dissipation fin, and compared with the conventional heat dissipation structure, the turbulence capacity can be improved by the turbulence member 20 made of memory metal in the shell 10, and the heat dissipation speed is accelerated.

[0046] In the case that the shell 10 of the electronic device radiator is not provided with a heat dissipation fin, a heat-conducting gasket can be additionally arranged between the heat source 30 and the electronic device radiator. Optionally, the heat-conducting gasket leads the heat of the heat source 30 out to the side of the heat source 30, and the heat is dissipated by the heat dissipation fin connected to the heat-conducting gasket. Alternatively, the heat-conducting gasket is clamped between the heat dissipation fin and the heat source 30.

[0047] Specifically, the heat-conducting gasket is made of a metal material with good heat-conducting performance, such as copper or silicon.

[0048] The electronic device is a work computer, a smart phone, a tablet computer, or the like.

[0049] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A heat sink, characterized in that, The device includes a housing and aerodynamic components. A plurality of aerodynamic components are fixed to the inner wall of the housing. Each aerodynamic component is made of shape memory metal. The angle between each aerodynamic component and the inner wall of the housing increases under the action of thermal shock.

2. The heat sink according to claim 1, characterized in that, The aerodynamic component includes a first structure and a second structure connected together. The same side ends of the first structure and the second structure are fixedly connected to the inner wall of the shell. The first structure and the second structure are made of different materials. The first structure expands when heated, while the second structure contracts when heated.

3. The heat sink according to claim 2, characterized in that, Along the direction of heat flow within the casing, the second structure is located on the windward side.

4. The heat sink according to any one of claims 1 to 3, characterized in that, The aerodynamic component is cone-shaped.

5. The heat sink according to claim 4, characterized in that, The aerodynamic component is conical in shape, and its bottom surface is fixedly connected to the inner wall of the housing.

6. The heat sink according to claim 1, characterized in that, The housing has heat dissipation fins on one side.

7. The heat sink according to claim 1, characterized in that, Multiple of the aforementioned aerodynamic components are arranged in multiple rows and columns on the inner wall of the housing.

8. An electronic device, characterized in that, Includes a heat source and a heat sink as described in any one of claims 1 to 7, wherein the side of the housing on which the baffle is mounted faces the heat source.

9. The electronic device according to claim 8, characterized in that, A thermally conductive pad is provided between the heat sink and the heat source.

10. The electronic device according to claim 9, characterized in that, The thermal pad is a copper sheet.

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