Chip holder, chip holder device, and apparatus for manufacturing semiconductor device

Abstract

The chip holder (12) includes: a holding surface (24) that holds the semiconductor chip (100) in a non-contact manner; a suction path (33) for applying a negative pressure to the holding surface (24) and sucking the semiconductor chip (100); and an ultrasonic generator (14) that applies ultrasonic vibration to the holding surface (24), the outer dimension of the holding surface (24) being larger than the outer dimension of the semiconductor chip (100). A positioning groove (36) is formed in the holding surface (24), the positioning groove (36) having a shape that follows at least a part of the outer shape of the semiconductor chip (100).

Description

Technical Field

[0001] This specification discloses a technique for holding a semiconductor chip in a non-contact manner using ultrasound. Background Technology

[0002] In recent years, in order to achieve further miniaturization and high density of semiconductor devices, there has been a demand for a chip holder that holds semiconductor chips in a non-contact manner. To address this need, some chip holders that hold semiconductor chips in a non-contact manner have been proposed.

[0003] As a chip holder, a Bernoulli chuck is known. However, with a Bernoulli chuck, it is impossible to restrict the movement of the semiconductor chip held in a non-contact manner in the planar direction. Therefore, in chip holders utilizing a Bernoulli chuck, a guide member is usually provided on the chip holding surface to restrict the movement of the chip in the planar direction.

[0004] However, when a guide member is provided, the end of the semiconductor chip may come into contact with the guide member, potentially causing a notch in the semiconductor chip.

[0005] Existing technical documents

[0006] Patent documents

[0007] Patent Document 1: Japanese Patent Application Publication No. 2006-73654 Summary of the Invention

[0008] The problem that the invention aims to solve

[0009] Therefore, some technologies have been proposed to hold workpieces such as integrated circuit (IC) chips in a non-contact manner using ultrasound (e.g., Patent Document 1). Based on the ultrasonic compression effect generated by imparting ultrasound, a force is also generated in the planar direction to hold the workpiece, thus eliminating the need for a guide member. However, in the technology of Patent Document 1, there is room for further improvement regarding the positioning accuracy in the planar direction.

[0010] Therefore, this specification discloses a chip holder, a chip holding device, and a manufacturing apparatus for a semiconductor device that can properly position a semiconductor chip without contacting the semiconductor chip.

[0011] Technical means to solve the problem

[0012] The chip holder disclosed in this specification is characterized by comprising: a holding surface for holding a semiconductor chip in a non-contact manner; a suction path for applying negative pressure to the holding surface to suction the semiconductor chip; and a vibration generating part for applying ultrasonic vibration to the holding surface, wherein the outer dimensions of the holding surface are larger than the outer dimensions of the semiconductor chip.

[0013] In this case, a positioning groove can be formed on the retaining surface, the shape of which is at least a portion of the outline of the semiconductor chip.

[0014] Furthermore, the vibration generating part may have a soldering head that transmits ultrasonic vibrations, and the chip holder may also include a holding part, which is a plate-shaped holding part connected to the end of the soldering head, and its end face functions as the holding surface. The holding part has a central part that overlaps with the soldering head in the axial direction, and a flange part that extends radially outward from the central part and is thinner than the central part.

[0015] In addition, at least a portion of the positioning groove may extend through the flange in the thickness direction.

[0016] Alternatively, when ultrasonic vibration is applied to the retaining surface, the vibration amplitude of the outer portion (outer than the positioning groove) is greater than the vibration amplitude of the inner portion (inner than the positioning groove).

[0017] In this case, the semiconductor chip can accept vibration amplitude from an outer portion of the positioning groove to perform self-alignment in a manner that places it inside the positioning groove.

[0018] Another chip holder disclosed in this specification includes: a holding surface for holding a semiconductor chip in a non-contact manner; a suction path for applying negative pressure to the holding surface to suction the semiconductor chip; and a vibration generating part for applying ultrasonic vibration to the holding surface. The chip holder is characterized in that the suction path has a suction hole formed on the holding surface and communicating with a suction source, and an airflow forming groove formed on the holding surface and connected to the suction hole and extending along the surface direction.

[0019] In this case, the airflow forming groove may be formed only in the region that is inside the outer shape of the semiconductor chip.

[0020] Additionally, the airflow forming groove may have one or more radial portions extending from the suction hole along the surface direction. In this case, the airflow forming groove may also have one or more peripheral portions directly connected to the radial portions but not passing through the suction hole. Furthermore, the peripheral portions may be a closed shape surrounding the suction hole and connecting all or more of the radial portions.

[0021] In addition, the depth of the airflow forming groove can be greater than the amount by which the semiconductor chip floats from the holding surface, but less than 50 times the amount of the float.

[0022] The chip holding device disclosed in this specification holds a semiconductor chip in a non-contact manner. The chip holding device is characterized by comprising: a chip holder for holding the semiconductor chip in a non-contact manner; an ultrasonic wave generating unit for imparting ultrasonic vibration to the end face of the holder, i.e., the holding surface; a suction path for applying negative pressure to a suction hole formed on the holding surface to generate a suction force; and a controller for controlling the ultrasonic energy or the suction force when the semiconductor chip is separated from the holding surface, so as to balance the holding force generated by the ultrasonic vibration, the suction force, and the gravity acting on the semiconductor chip.

[0023] In this case, the controller can change the magnitude of at least one of the ultrasonic energy or the suction force applied to the holding surface when the position of the holding surface is moved and when the position of the holding surface is stationary.

[0024] In addition, the controller can increase at least one of the ultrasonic energy or the suction force when the holding surface is in motion, compared to when the holding surface is stationary.

[0025] Another chip holding device disclosed in this specification holds a semiconductor chip in a non-contact manner. The chip holding device is characterized by comprising: a chip holder for holding the semiconductor chip in a non-contact manner; an ultrasonic generator for applying ultrasonic vibration to the end face of the chip holder, i.e., the holding surface; a suction path for applying negative pressure to a suction hole formed on the holding surface to generate a suction force; a controller for controlling the driving of the ultrasonic generator and the suction source when the semiconductor chip is separated from the holding surface, so as to balance the holding force generated by the ultrasonic vibration, the suction force, and the gravity acting on the semiconductor chip; and at least one of a surface treatment device or an inspection device, wherein the surface treatment device processes the surface of the semiconductor chip held non-contactly by the holding surface, and the inspection device inspects the surface.

[0026] The semiconductor device manufacturing apparatus disclosed in this specification is characterized by comprising: a chip holder for holding a semiconductor chip in a non-contact manner; an ultrasonic generator for applying ultrasonic vibration to the end face of the chip holder, i.e., the holding surface; a suction path for applying negative pressure to a suction hole formed on the holding surface to generate a suction force; and a controller for controlling the driving of the ultrasonic generator and the suction source when the semiconductor chip is separated from the holding surface, so as to balance the holding force generated by the ultrasonic vibration, the suction force, and the gravity acting on the semiconductor chip, wherein the outer dimensions of the holding surface are larger than the outer dimensions of the semiconductor chip.

[0027] In this case, the chip holder can function as a pick-up collet. After receiving the semiconductor chip from the chip supply source, the pick-up collet maintains the semiconductor chip in a non-contact manner and rotates 180 degrees before transferring the semiconductor chip to the bonding tool.

[0028] In addition, the semiconductor device manufacturing apparatus can directly bond the semiconductor chip to the substrate.

[0029] The effects of the invention

[0030] The chip holder disclosed in this specification allows for proper positioning of the semiconductor chip relative to the holder without contact with the semiconductor chip. Attached Figure Description

[0031] [ Figure 1 [ ] is a diagram showing the structure of the chip holding device.

[0032] [ Figure 2 [] is the axial view of the retaining surface.

[0033] [ Figure 3 [] is a schematic diagram illustrating the function of the positioning groove.

[0034] [ Figure 4 [ ] is a schematic diagram illustrating the function of the airflow forming groove.

[0035] [ Figure 5A [Illustration 1] is a diagram showing an example of a groove formed on a retaining surface.

[0036] [ Figure 5B [Illustration 1] is another example of a groove formed on a retaining surface.

[0037] [ Figure 5C [Illustration 1] is another example of a groove formed on a retaining surface.

[0038] [ Figure 6A [Illustration 1] is another example of a groove formed on a retaining surface.

[0039] [ Figure 6B [Illustration 1] is another example of a groove formed on a retaining surface.

[0040] [ Figure 6C [Illustration 1] is another example of a groove formed on a retaining surface.

[0041] [ Figure 7 [ ] is a diagram showing the structure of another chip holding device.

[0042] [ Figure 8A [ ] is a diagram showing a processing apparatus that performs plasma processing.

[0043] [ Figure 8B [ ] is a diagram showing a cleaning device that performs the cleaning process.

[0044] [ Figure 9A [Illustration 1] is a diagram showing an inspection device for inspecting the edges of a semiconductor chip.

[0045] [ Figure 9B [Illustration 1] is a diagram showing an inspection apparatus for inspecting the appearance of a semiconductor chip.

[0046] [ Figure 10 [Illustration 1] is an example of a manufacturing apparatus having a chip holding device. Detailed Implementation

[0047] The structure of the chip holding device 10 will now be described with reference to the accompanying drawings. Figure 1 This is a diagram showing the structure of the chip holding device 10. The chip holding device 10 is a device for holding and transporting the semiconductor chip 100 in a non-contact manner, and is incorporated, for example, into a semiconductor device manufacturing apparatus or an inspection apparatus.

[0048] like Figure 1 As shown, the chip holding device 10 includes a chip holder 12, an ultrasonic generator 14, a vacuum source 20, and a controller 22. The chip holder 12 holds the semiconductor chip 100 in a non-contact manner. The chip holder 12 has a generally plate-shaped holding portion 23 and a solder head 26 extending axially from the holding portion 23. The end face of the holding portion 23 functions as a holding surface 24 for holding the semiconductor chip 100. An airflow forming groove 34 and a positioning groove 36 are formed on the holding surface 24, which will be described later. In addition, the chip holder 12 is connected to the vacuum source 20 (described later) and also has a suction path 33 for applying negative pressure to the holding surface 24 to suction the semiconductor chip 100. A suction hole 32 is formed at the center of the holding surface 24 as the end of the suction path 33.

[0049] Furthermore, the chip's position and orientation can be appropriately changed. Therefore, in Figure 1 In the chip holder 12, the holding surface 24 faces upward, but depending on how the chip holder 12 is used, it may be positioned with the holding surface 24 parallel to the vertical direction, or with the holding surface 24 facing downward. Moreover, even if the orientation is changed, the chip holder 12 can continue to hold the semiconductor chip 100 in a non-contact manner.

[0050] The solder head 26 extends axially from the back side of the holding surface 24 (i.e., the side opposite to the semiconductor chip 100). The solder head 26 is the portion that transmits ultrasonic vibrations generated by the ultrasonic generator 14 to the holding surface 24. A suction path 33 connecting the suction hole 32 to the vacuum source 20 is formed inside the solder head 26. In addition, the base of the solder head 26 is mechanically connected to the ultrasonic vibrator 16.

[0051] An ultrasonic generator 14 generates ultrasonic vibrations, for example, comprising an ultrasonic vibrator 16 and an AC power supply 18. The ultrasonic vibrator 16 is a vibration source that generates longitudinal vibrations by receiving a voltage signal, i.e., a drive signal. The ultrasonic vibrator 16, for example, is a lead zirconate titanate (PZT) that vibrates by receiving an AC voltage. It is a bolt-clamped Langevin type transducer (BLT, or BL transducer) that uses a metal block to clamp the PZT and applies tightening pressure using a screw (bolt). The AC power supply 18 applies an alternating voltage at a frequency equivalent to a predetermined resonant frequency to the ultrasonic vibrator 16.

[0052] By driving the ultrasonic generator 14, the holding surface 24 undergoes ultrasonic vibration along the axial direction. Moreover, by performing ultrasonic vibration on the holding surface 24, an ultrasonic compression effect is generated between the holding surface 24 and a plane (e.g., the end face of the semiconductor chip 100) that is close to the holding surface 24, thereby holding the semiconductor chip 100 by the holding surface 24 while maintaining its separation from the holding surface 24.

[0053] Vacuum source 20 generates negative pressure and may include, for example, an air pump. Vacuum source 20 is connected to suction path 33. By driving vacuum source 20, negative pressure acts on suction hole 32, generating suction force to adsorb semiconductor chip 100 onto holding surface 24.

[0054] The controller 22 controls the driving of the ultrasonic generator 14 and the vacuum source 20. The controller 22 is physically a computer having a processor 22a and a memory 22b. "Computer" also includes a microcontroller, which integrates a computer system into an integrated circuit. Furthermore, the term "processor 22a" refers to a processor in a broad sense, including general-purpose processors (e.g., central processing units (CPUs)) or dedicated processors (e.g., graphics processing units (GPUs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), programmable logic elements, etc.). Additionally, the memory 22b may include at least one of semiconductor memory (e.g., random access memory (RAM), read-only memory (ROM), solid-state drives, etc.) and magnetic disks (e.g., hard disk drives). Moreover, neither the processor 22a nor the memory 22b is necessarily a single unit; the controller 22 may have multiple processors 22a or multiple memories 22b.

[0055] The controller 22 controls the driving of the ultrasonic generator 14 and the vacuum source 20, enabling the holding surface 24 to hold the semiconductor chip 100 in a non-contact manner. That is, as described above, when an alternating voltage is applied to the ultrasonic vibrator 16, the holding surface 24 vibrates ultrasonically. When the semiconductor chip 100 is brought close to the holding surface 24 while the ultrasonic vibration is occurring, an ultrasonic compression effect is generated between the holding surface 24 and the semiconductor chip 100. The ultrasonic compression effect has the following effect: when one of two plates facing each other separated by a tiny gap is vibrated, a higher pressure is generated within the gap than outside due to the viscosity within the gap. When the ultrasonic compression effect occurs, an air film Sf is formed between the semiconductor chip 100 and the holding surface 24, hindering contact between them, and a holding force is generated that uses the holding surface 24 to hold the semiconductor chip 100.

[0056] Here, a holding force (hereinafter referred to as "ultrasonic holding force") generated by the ultrasonic compression effect is generated in two directions: perpendicular to the holding surface 24 and parallel to it (i.e., the surface direction). That is, when the ultrasonic compression effect is generated, a force acts on the semiconductor chip 100 in a direction that moves away from or lifts off the holding surface 24. In addition, when the ultrasonic compression effect is generated, the semiconductor chip 100 intends to remain within the vibrating surface. Therefore, even if the semiconductor chip 100 is temporarily displaced in the surface direction due to an external force, the semiconductor chip 100 moves in the surface direction with its entire body located within the vibrating surface, and intends to return to a state facing the holding surface 24.

[0057] Furthermore, the greater the ultrasonic energy (i.e., the greater the amplitude of ultrasonic vibration), the greater the thickness of the air film (hereinafter referred to as "ultrasonic extrusion film Sf") generated by the ultrasonic extrusion effect, i.e., the greater the amount of semiconductor chip 100 floating from the holding surface 24, Df. In addition, the greater the ultrasonic energy, the greater the ultrasonic holding force.

[0058] In this example, to assist this ultrasonic holding force, a suction force caused by negative pressure is also generated on the holding surface 24. The controller 22 controls the driving of the vacuum source 20 and the ultrasonic generator 14 so that the suction force, the ultrasonic holding force and the gravity acting on the semiconductor chip 100 are balanced when the semiconductor chip 100 is floating from the holding surface 24.

[0059] Furthermore, as described above, when the ultrasonic compression effect is generated, the semiconductor chip 100 is intended to be located within the vibrating surface. Therefore, if the holding surface 24 is made to have a shape approximately the same as that of the semiconductor chip 100, then through the ultrasonic compression effect, the semiconductor chip 100 automatically moves in the planar direction such that its entire body is located within the vibrating surface (i.e., in the region inside the outer shape of the holding surface 24). That is, self-alignment of the semiconductor chip 100 in the planar direction is possible.

[0060] However, the holding force in the surface direction caused by the ultrasonic compression effect is not very large. Therefore, depending on the magnitude of the gravity or inertial force acting on the semiconductor chip 100, there are cases where the surface positioning of the semiconductor chip 100 cannot be achieved with sufficient accuracy. Therefore, in this example, in order to further improve the positioning accuracy of the semiconductor chip 100 in the surface direction, the holding surface 24 is made larger than the semiconductor chip 100, and a plurality of grooves 34, 36 are formed in the holding surface 24. This will be explained in detail below.

[0061] Figure 2 This is the axial view of surface 24. Figure 2 In the diagram, the obliquely shaded areas represent recesses that do not penetrate the retaining part 23, while the cross-shaded areas represent holes that penetrate the retaining part 23. For example... Figure 2 As shown, a suction hole 32, an airflow forming groove 34, and a positioning groove 36 are formed on the holding surface 24. The positioning groove 36 has a shape that is substantially the same as the outer shape of the semiconductor chip 100. In this example, the semiconductor chip 100 is a square with one side approximately L1, so the inner periphery of the positioning groove 36 is also a square with one side approximately L1. Furthermore, as described above, the holding surface 24 is generally divided into a central portion 28 that overlaps with the solder head 26, and a flange portion 30 that extends radially outward from the central portion 28, in which the positioning groove 36 is located. At least a portion of the positioning groove 36 is a recess 36a that is sufficiently shallow compared to the wall thickness of the flange portion 30, and the remaining portion of the positioning groove 36 is a hole 36b that penetrates the flange portion 30 along the thickness direction. Figure 2 In the example, the straight portion of the rectangle in the positioning groove 36 penetrates the flange 30 along the thickness direction, and the corner of the rectangle becomes a recess that does not penetrate the flange 30.

[0062] Reference Figure 3 The function of this positioning groove 36 will be explained. Figure 3 This is a schematic diagram illustrating the function of the positioning groove 36. Furthermore, in Figure 3 The airflow forming groove 34 is omitted from the illustration. With the positioning groove 36 formed, the positioning accuracy of the semiconductor chip 100 in the planar direction is improved compared to the case where the positioning groove 36 is not formed. It is speculated that the principle behind this effect is that the amplitude of the ultrasonic vibration changes drastically around the positioning groove 36.

[0063] That is, when the ultrasonic generator 14 is driven, ultrasonic vibrations are generated on the holding surface 24. Without the positioning groove 36, it is assumed that the amplitude of the ultrasonic vibrations gradually increases as it approaches the outer periphery of the holding surface 24. Since the ultrasonic holding force changes correspondingly to the amplitude of the ultrasonic vibrations, even without the positioning groove 36, when the semiconductor chip 100 shifts from the center of the holding surface 24 in the planar direction, the ultrasonic holding force acting on the semiconductor chip 100 becomes unbalanced from left to right. To eliminate this imbalance, the semiconductor chip 100 moves in the planar direction, thus automatically correcting the positional shift of the semiconductor chip 100 in the planar direction, i.e., performing self-alignment. However, without the positioning groove 36, the imbalance of the ultrasonic holding force caused by the positional shift of the semiconductor chip 100 is small, therefore the self-alignment force is small.

[0064] On the other hand, with the positioning groove 36 formed, the strength of the retaining surface 24 is locally reduced at the location where the positioning groove 36 is formed. When ultrasonic vibration is applied to the retaining surface 24, the outer portion, which is further outward than the positioning groove 36, tends to swing around the positioning groove 36 as a fulcrum. As a result, compared to the inner portion, which is further inward than the positioning groove 36, the vibration amplitude of the outer portion increases more sharply, and the ultrasonic retaining force changes drastically with respect to the positioning groove 36.

[0065] Therefore, as Figure 3 As shown, when one end of the semiconductor chip 100 in the planar direction crosses the positioning groove 36 and is located outside in the planar direction, the balance of the ultrasonic holding force is significantly disrupted. To eliminate this imbalance, the semiconductor chip 100 moves inward toward the positioning groove 36 due to the relatively large force acting on it. Moreover, thus, the self-alignment accuracy of the semiconductor chip 100 can be improved when the positioning groove 36 is present, compared to the case without it.

[0066] Next, the airflow forming groove 34 will be described. For example... Figure 2 As shown, a suction hole 32 is formed at the center of the holding surface 24, and the suction hole 32 is connected to the vacuum source 20. An airflow forming groove 34 is a groove connected to the vacuum source 20. The shape of the airflow forming groove 34 is not particularly limited as long as it is connected to the suction hole 32. In this example, the airflow forming groove 34 includes: four radial portions 34a extending radially or in a cross shape from the suction hole 32; and a peripheral portion 34b directly connected to the radial portions 34a but not passing through the suction hole 32. Figure 2 As shown, the peripheral portion 34b is a closed shape that surrounds the suction hole 32 by connecting all or more of the radial portions 34a; more specifically, it is a roughly rectangular shape. Figure 2 As shown, this airflow forming groove 34 is formed only in the area that is inside the positioning groove 36, or in other words, inside the shape of the semiconductor chip 100.

[0067] Reference Figure 4 The function of this airflow forming groove 34 will be explained. Figure 4 This is a schematic diagram illustrating the function of the airflow forming groove 34. Furthermore, in Figure 4 The positioning groove 36 is omitted from the illustration. With the airflow forming groove 34 formed, the positioning accuracy of the semiconductor chip 100 in the planar direction is improved compared to the case where the airflow forming groove 34 is not formed. It is speculated that this effect is achieved by increasing and stabilizing the airflow velocity in the planar direction flowing between the semiconductor chip 100 and the holding surface 24 through the formation of the airflow forming groove 34.

[0068] That is, utilizing the ultrasonic compression effect, when a suction force is generated by the vacuum source 20 while maintaining the semiconductor chip 100 in a floating state, an airflow in the planar direction and towards the center is generated in the floating gap. Here, without the airflow forming groove 34, the airflow in the planar direction towards the center is slow due to the influence of fluid viscosity and is prone to instability. In addition, the suction force only acts locally near the suction hole 32. In this case, even if the semiconductor chip 100 experiences a positional shift in the planar direction, it is difficult to move in the planar direction, thus making it difficult to self-correct the positional shift.

[0069] On the other hand, such as Figure 4 As shown, with the airflow forming groove 34 formed, the thickness of the gap between the semiconductor chip 100 and the holding surface 24 increases near the airflow forming groove 34, reducing the influence of fluid viscosity on the overall airflow. As a result, the airflow velocity in the surface direction increases, and the airflow in the surface direction stabilizes. Compared to the case without the airflow forming groove 34, this is particularly beneficial near the outer periphery of the semiconductor chip 100 (…). Figure 4 The airflow near region A in the image is significantly stabilized. This stable airflow in the planar direction exerts a force on the semiconductor chip 100, aiming to bring the center of the semiconductor chip 100 closer to the suction hole 32 (and thus the center of the holding surface 24). Furthermore, the semiconductor chip 100 is automatically positioned relative to the holding surface 24. Additionally, by forming the airflow forming groove 34, the peak of the suction force generated near the suction hole 32 can be reduced, allowing the suction force to be dispersed in the planar direction. As a result, the semiconductor chip 100 becomes easier to move in the planar direction, thus facilitating self-correction of positional deviations in the planar direction.

[0070] Furthermore, the depth of this airflow forming groove 34 is not particularly limited. However, if the airflow forming groove 34 is too shallow, the airflow velocity in the surface direction within the floating gap will decrease due to the influence of fluid viscosity. Therefore, the depth of the airflow forming groove 34 can be set to be greater than or equal to the floating amount Df of the semiconductor chip 100 from the holding surface 24. Additionally, if the airflow forming groove 34 is too deep, it will affect the vibration mode or vibration amplitude of the holding surface 24. Therefore, the airflow forming groove 34 is set to a size that will not affect the vibration mode or vibration amplitude of the holding surface 24. For example, the airflow forming groove 34 can be set to be less than 100 times, less than 50 times, or less than 10 times the floating amount Df.

[0071] As is clear from the above description, this example can further improve the positional accuracy of the automatic positioning, i.e., self-alignment, of the semiconductor chip 100. Furthermore, the description up to this point is just one example; other structures can be appropriately modified as long as the external dimensions of the holding surface 24 are larger than the external dimensions of the semiconductor chip 100, or an airflow forming groove 34 connected to the suction hole 32 is formed on the holding surface 24.

[0072] Therefore, as long as the outer dimensions of the retaining surface 24 are larger than the outer dimensions of the semiconductor chip 100, no grooves may be formed on the retaining surface 24. Alternatively, as long as an airflow forming groove 34 is formed on the retaining surface 24, the outer dimensions of the retaining surface 24 may be the same as or smaller than the outer dimensions of the semiconductor chip 100.

[0073] Furthermore, the shape and combination of the positioning groove 36 and the airflow forming groove 34 can also be suitably changed. For example, as Figure 5A As shown, only the positioning groove 36 can be formed on the retaining surface 24 without forming the airflow forming groove 34. Alternatively, the position or extent of the hole (cross-shaded portion) through the flange portion 30 in the positioning groove 36 can be suitably changed. For example, as... Figure 5A As shown, the positioning groove 36 may also be without a hole. Furthermore, the shape of the positioning groove 36 does not necessarily have to be a closed curve without a starting or ending point, such as... Figure 5C As shown, it can also be one or more open curved shapes. In this case, the entire positioning groove 36 can be a hole (cross-shaded portion) that runs through the flange portion 30 along the thickness direction.

[0074] In addition, such as Figure 5B As shown, the airflow forming groove 34 may be formed on the holding surface 24 without forming the positioning groove 36. Furthermore, the shape of the airflow forming groove 34 can be appropriately modified as long as it is connected to the suction hole 32. For example, the number of radial portions 34a constituting the airflow forming groove 34 is not limited; it can be less than four or more than four. Therefore, the airflow forming groove 34 can be, for example, as shown... Figure 5B As shown, it has two radial sections 34a, and as a whole, it is shaped like the number "8". Furthermore, the peripheral portion 34b of the airflow forming groove 34 is not limited to a rectangle, but can also be... Figure 5C As shown, it is circular. Additionally, the radial section 34a can also be as shown... Figure 6A As shown, it extends outward beyond the periphery 34b. Furthermore, as... Figure 6B As shown, the airflow forming groove 34 may also be a shape having only radial portions 34a extending from the suction hole 32 along the surface direction without peripheral portions 34b. Furthermore, the peripheral portion 34b does not necessarily have to be a closed shape connecting all or part of the radial portions 34a; it may also be a line segment with an end. Therefore, for example, the airflow forming groove 34 may also be a shape like an "H". Furthermore, the airflow forming groove 34 may also be as... Figure 6C As shown, it has a straight radial portion 34a parallel to the positioning groove 36 and a peripheral portion 34b extending in a straight line from the end of the radial portion 34a to both sides, and is shaped like a "T".

[0075] Furthermore, as described above, the chip holder 12 in this example is capable of movement and rotation, and its posture and position can be changed. The controller 22 changes the ultrasonic energy and suction force applied to the holding surface 24 according to the changes in the movement and posture of the chip holder 12.

[0076] That is, corresponding to the movement of the holding surface 24, the orientation or magnitude of the inertial force acting on the semiconductor chip 100 changes. The controller 22 adjusts the ultrasonic energy and the suction force so that the semiconductor chip 100 can be held in a non-contact manner even if the orientation and magnitude of this inertial force change. Specifically, when the holding surface 24 moves, the controller 22 increases at least one of the ultrasonic energy or the suction force compared to the case where the holding surface 24 is stationary.

[0077] For example, consider keeping face 24 in its face orientation (e.g. Figure 1 The semiconductor chip 100 moves in the direction of arrow A1 (as shown in the image). In this case, an inertial force acts on the semiconductor chip 100 in the planar direction and opposite to the direction of movement. To counteract this inertial force and maintain the holding state of the semiconductor chip 100, the controller 22 adjusts the ultrasonic energy and the suction force to increase the holding force of the semiconductor chip 100 in the planar direction. Specifically, the controller 22 can increase the suction force while keeping the ultrasonic energy constant to increase the holding force in the planar direction. Alternatively, the controller 22 can also increase the ultrasonic energy while keeping the suction force constant to increase the holding force in the planar direction.

[0078] Additionally, consider the chip holding device 12 in its axial direction toward the semiconductor chip 100 (e.g. Figure 1 The semiconductor chip 100 moves in the direction of arrow A2. In this case, due to inertial force, the semiconductor chip 100 moves closer to the holding surface 24, and there is a possibility that the thickness of the ultrasonically extruded film Sf between the semiconductor chip 100 and the holding surface 24 will decrease. Therefore, in this case, the ultrasonic energy can be increased to prevent the thickness of the ultrasonically extruded film Sf from decreasing.

[0079] Additionally, consider the chip holding 12 in its axial direction toward the direction away from the semiconductor chip 100 (e.g. Figure 1 The semiconductor chip 100 moves in the direction of arrow A3 (as shown in the image). In this case, due to inertial force, the semiconductor chip 100 may move away from the holding surface 24, and there is a possibility that the holding force of the semiconductor chip 100 caused by the holding surface 24 may decrease. Therefore, in order to prevent the decrease in holding force, the suction force or the ultrasonic energy may be increased.

[0080] Furthermore, the effect of gravity on the semiconductor chip 100 changes corresponding to the orientation of the chip holder 12. For example, when the chip holder 12 is facing upwards, the gravity acting on the semiconductor chip 100 functions as a force that brings the semiconductor chip 100 closer to the holding surface 24. On the other hand, when the chip holder 12 is facing downwards, the gravity acting on the semiconductor chip 100 functions as a force that moves the semiconductor chip 100 away from the holding surface 24. Therefore, when the chip holder 12 is facing downwards, the controller 22 can increase at least one of the ultrasonic energy and the suction force compared to the case where the chip holder 12 is facing upwards, thereby increasing the holding force caused by the holding surface 24.

[0081] Furthermore, when the chip holder 12 is in a lateral position, the gravity acting on the semiconductor chip 100 functions as a force that moves the semiconductor chip 100 in the planar direction, i.e., a force that causes a positional offset of the semiconductor chip 100 in the planar direction. Therefore, when the chip holder 12 is in a lateral position, the controller 22 can increase the ultrasonic energy compared to when the chip holder 12 is upward or downward, thereby increasing the holding force in the planar direction caused by the holding surface 24.

[0082] Next, refer to Figure 7 Another chip holding device 10 will be described. Figure 7 This is a diagram showing the structure of another chip holding device 10. The chip holding device 10, in addition to having... Figure 1 In addition to the chip holding device 10, the device also includes a processing device 50 and an inspection device 52. The processing device 50 is used to perform predetermined processing, such as plasma processing or cleaning, on the surface of the semiconductor chip 100 held non-contactly in the chip holder 12. Figure 8A , Figure 8B An example of this processing device 50 is shown in the figure. Figure 8A It is a processing apparatus 50 for performing plasma treatment, and has a plasma irradiation head 50a. For example... Figure 8A As shown, the plasma irradiation head 50a can irradiate plasma onto the side of the semiconductor chip 100 opposite to the holding surface 24, thereby performing plasma treatment on the opposite side. Furthermore, Figure 8B This is a processing apparatus for cleaning the surface of a semiconductor chip 100, comprising a blower 50b for removing foreign matter and a suction pipe 50c for recovering the blown-away foreign matter. The processing apparatus 50 can remove foreign matter adhering to the surface of the semiconductor chip 100.

[0083] Moreover, as according to Figure 8A , Figure 8BAs such, in this example, this surface treatment (plasma treatment or cleaning treatment, etc.) can be performed while the semiconductor chip 100 is in a floating state. As a result, the degradation or contamination of the semiconductor chip 100 can be effectively prevented.

[0084] Inspection device 52 is a device for inspecting a semiconductor chip 100 held in a chip holder 12 in a non-contact manner. Figure 9A , Figure 9B An example of this inspection device 52 is shown in the figure. Figure 9A The inspection device 52, which inspects the edge of the semiconductor chip 100, includes a laser displacement meter 52a. The laser displacement meter 52a irradiates a laser beam onto an object and detects the distance to the object or the presence or absence of the object based on its reflected light. By scanning along the surface direction of the semiconductor chip 100 with the laser displacement meter 52a, the position of the edge of the semiconductor chip 100 can be detected.

[0085] in addition, Figure 9B The inspection apparatus 52 is used to inspect the appearance of the semiconductor chip 100 and includes an inspection camera 52b. The inspection camera 52b takes pictures of the side of the semiconductor chip 100 opposite to the holding surface 24. The controller 22 determines the quality of the semiconductor chip 100 based on the acquired images.

[0086] Moreover, as according to Figure 9A , Figure 9B As such, through this example, the semiconductor chip 100 can be inspected (edge ​​inspection or appearance inspection) while it is floating. As a result, degradation or contamination of the semiconductor chip 100 can be effectively prevented. Furthermore, when the semiconductor chip 100 is floated using the ultrasonic squeezing effect, it generates minute vibrations in the axial direction. Compared to the suction process performed using the vacuum source 20, the amplitude of these minute vibrations is lower when the suction is released. Therefore, to reduce the impact of these minute vibrations on inspection accuracy, the vacuum source 20 can be stopped during inspection to eliminate the suction force. Alternatively, to further reduce the impact of minute vibrations on inspection accuracy, the sampling timing of the inspection values ​​based on the inspection device 52 can be synchronized with the vibration cycle of the semiconductor chip 100.

[0087] Furthermore, the chip holding device 10 described so far can be incorporated into a semiconductor device manufacturing apparatus, for example. Figure 10 This is a diagram showing an example of a manufacturing apparatus 60 having a chip holding device 10. Figure 10 The manufacturing apparatus 60 is an apparatus for manufacturing semiconductor devices by bonding one or more semiconductor chips 100 to a substrate 110.

[0088] The manufacturing apparatus 60 includes a chip supply source 61, a pickup unit 62, and an adhesive unit 64. In the chip supply source 61, a semiconductor chip 100 attached to a cutting tape 66 is prepared. The pickup unit 62 includes an upward pusher 70 for pushing the semiconductor chip 100 attached to the cutting tape 66 upward from below; and a pickup clip 68 for picking up the pushed-up semiconductor chip 100. In this example, the chip holding device 10 is used as the pickup clip 68.

[0089] The semiconductor chip 100 is bonded to the substrate 110 at the bonding surface (i.e., the bonding surface). Figure 10 The thicker portion of the tape (in the image) is attached to the cutting tape 66 with its orientation upwards. The chip holder 12 of the pick-up clip 68 holds the mating surface in a non-contact manner using the holding surface 24. In other words, since the mating surface does not contact the holding surface 24, foreign matter adhesion is prevented, and damage caused by impact during contact is also effectively prevented.

[0090] If the pickup clamp 68 retrieves the semiconductor chip 100 from the cutting tape 66, it rotates 180 degrees around a predetermined rotation axis 72. This changes the holding surface 24 from a downward-facing state to an upward-facing state. During rotational movement, the controller 22 increases at least one of the ultrasonic energy or suction force compared to its stationary state, so that the semiconductor chip 100 can be properly held during the rotational movement.

[0091] The bonding portion 64 includes a bonding stage 76 for placing the substrate 110 and a bonding tool 74 for holding and transporting the semiconductor chip 100. The bonding tool 74 suctions and holds the semiconductor chip 100 at its end face and transports the semiconductor chip 100. Figure 10 As shown, the bonding tool 74 picks up the semiconductor chip 100 from the upward-facing pick-up chuck 68 and suctions and holds the side of the semiconductor chip 100 opposite to the bonding surface. Additionally, the bonding tool 74 presses the semiconductor chip 100 against the substrate 110 and bonds the semiconductor chip 100 to the substrate 110. The semiconductor device 120 is manufactured by bonding the required number of semiconductor chips 100 to a substrate 110.

[0092] Here, the bonding method is not particularly limited. In this example, the semiconductor chip 100 is directly bonded to the substrate 110. Direct bonding is a bonding method in which the semiconductor chip 100 is directly bonded to the substrate 110 without the use of an adhesive. For example, in direct bonding, the chip-side electrode formed on the bonding surface of the semiconductor chip 100 is bonded to the substrate-side electrode formed on the substrate 110. In this case, the electrodes can be fused using heat or bonded at room temperature.

[0093] However, in this type of direct bonding, it is susceptible to the influence of foreign objects or gaps on the bonding surface. Even the presence of minute foreign objects or gaps can easily lead to bonding defects. In this example, the pick-up clip 68 holds the semiconductor chip 100 in a non-contact manner, and the bonding surface of the semiconductor chip 100 does not come into contact with other components before being bonded to the substrate 110. Therefore, this example effectively prevents foreign objects from adhering to the bonding surface or creating gaps. Moreover, this effectively prevents bonding defects in direct bonding.

[0094] Furthermore, the structure described herein is one example; other structures can be suitably modified as long as the manufacturing apparatus 60 has a chip holding device 10 that holds the semiconductor chip 100 in a non-contact manner. For example, the manufacturing apparatus 60 may also use an adhesive such as a non-conductive film (NCF) to bond the semiconductor chip 100 to the substrate 110. In addition, not only the pick-up chuck 68, but also the bonding tool 74 may utilize the chip holding device 10.

[0095] Explanation of icon numbers

[0096] 10: Chip holding device; 12: Chip holder; 14: Ultrasonic generator; 16: Ultrasonic vibrator; 18: AC power supply; 20: Vacuum source; 22: Controller; 23: Holding part; 24: Holding surface; 26: Soldering head; 28: Central part; 30: Flange part; 32: Suction hole; 33: Suction path; 34: Airflow forming groove; 36: Positioning groove; 50: Processing device; 50a: Plasma irradiation head; 50b: Blower; 50c: Suction pipe; 52: Inspection device; 52a: Laser displacement meter; 52b: Inspection camera; 60: Manufacturing device; 61: Chip supply source; 62: Pick-up part; 64: Bonding part; 66: Cutting tape; 68: Pick-up clamp; 70: Upper pusher; 72: Rotating shaft; 74: Bonding tool; 76: Bonding stage; 100: Semiconductor chip; 110: Substrate; 120: Semiconductor device.

Claims

1. A chip holder, characterized in that, include: A holding surface holds the semiconductor chip in a non-contact manner; a suction path applies negative pressure to the holding surface to suction the semiconductor chip. And a vibration generating part, which imparts ultrasonic vibration to the holding surface, wherein the outer dimensions of the holding surface are larger than the outer dimensions of the semiconductor chip.

2. The chip holder according to claim 1, characterized in that, A positioning groove is formed on the retaining surface, the shape of which is at least a portion of the outline of the semiconductor chip.

3. The chip holder according to claim 2, characterized in that, The vibration generating part has a welding head that transmits ultrasonic vibrations. The chip holder further includes a holding portion, which is a plate-shaped holding portion connected to the end of the soldering head, and its end face functions as the holding surface. The retaining part has: The central portion overlaps axially with the welding head; and The flange extends radially outward from the central portion and is thinner than the central portion.

4. The chip holder according to claim 3, characterized in that, At least a portion of the positioning groove extends through the flange in the thickness direction.

5. The chip holder according to any one of claims 2 to 4, characterized in that, When ultrasonic vibration is applied to the retaining surface, the vibration amplitude of the outer portion, which is further outward than the positioning groove, is greater than the vibration amplitude of the inner portion, which is further inward than the positioning groove.

6. The chip holder according to any one of claims 2 to 5, characterized in that, The semiconductor chip receives vibration amplitude from an outer portion of the positioning groove to self-align in a manner that places it inside the positioning groove.

7. A chip holder, comprising: A holding surface holds the semiconductor chip in a non-contact manner; a suction path applies negative pressure to the holding surface to suction the semiconductor chip. And a vibration generating part, which imparts ultrasonic vibration to the holding surface. The chip holder is characterized in that... The suction path has a suction hole formed on the retaining surface and communicating with the suction source. An airflow forming groove is formed on the retaining surface, which is connected to the suction hole and extends along the surface direction.

8. The chip holder according to claim 7, characterized in that, The airflow forming groove is formed only in the region that is inside the shape of the semiconductor chip.

9. The chip holder according to claim 8, characterized in that, The airflow forming groove has one or more radial portions extending from the suction hole along the surface direction.

10. The chip holder according to claim 9, characterized in that, The airflow forming groove also has one or more peripheral portions that are directly connected to the radiating section but do not pass through the suction hole.

11. The chip holder according to claim 10, characterized in that, The peripheral portion is a closed shape that surrounds the suction hole and connects all of the more than one radial portion.

12. The chip holder according to claim 8, characterized in that, The depth of the airflow forming groove is greater than the amount by which the semiconductor chip floats from the holding surface, but less than 50 times the amount of float.

13. A chip holding device for holding a semiconductor chip in a non-contact manner. The chip holding device is characterized by comprising: A chip holder that holds the semiconductor chip in a non-contact manner; The ultrasonic generating unit imparts ultrasonic vibrations to the end face, i.e., the holding surface, of the holder; The suction path applies negative pressure to the suction holes formed on the retaining surface to generate suction force; as well as The controller controls the ultrasonic energy or the suction force when the semiconductor chip is separated from the holding surface, so as to balance the holding force generated by the ultrasonic vibration, the suction force and the gravity acting on the semiconductor chip.

14. The chip holding device according to claim 13, characterized in that, The controller changes the magnitude of at least one of the ultrasonic energy or the suction force applied to the holding surface when the holding surface is moved and when the holding surface is stationary.

15. The chip holding device according to claim 14, characterized in that, When the holding surface is moved, the controller increases at least one of the ultrasonic energy or the suction force compared to when the holding surface is stationary.

16. A chip holding device for holding a semiconductor chip in a non-contact manner. The chip holding device is characterized by comprising: A chip holder that holds the semiconductor chip in a non-contact manner; The ultrasonic generating unit imparts ultrasonic vibrations to the end face, i.e. the holding face, of the chip holder; The suction path applies negative pressure to the suction holes formed on the retaining surface to generate suction force; The controller controls the driving of the ultrasonic generating part and the suction source when the semiconductor chip is separated from the holding surface, so as to balance the holding force generated by the ultrasonic vibration, the suction force and the gravity acting on the semiconductor chip. as well as At least one of a surface treatment apparatus or an inspection apparatus, wherein the surface treatment apparatus processes the surface of the semiconductor chip held in a non-contact manner by the holding surface, and the inspection apparatus inspects the surface.

17. A semiconductor device manufacturing apparatus, characterized in that, include: Chip holders are used to hold semiconductor chips in a non-contact manner. The ultrasonic generating unit imparts ultrasonic vibrations to the end face, i.e. the holding face, of the chip holder; The suction path applies negative pressure to the suction holes formed on the retaining surface to generate suction force; as well as The controller controls the driving of the ultrasonic wave generator and the suction source when the semiconductor chip is separated from the holding surface, so as to balance the holding force generated by the ultrasonic wave vibration, the suction force, and the gravity acting on the semiconductor chip. The outer dimensions of the retaining surface are larger than the outer dimensions of the semiconductor chip.

18. The semiconductor device manufacturing apparatus according to claim 17, characterized in that, The chip holder functions as a pick-up collet. After receiving the semiconductor chip from the chip supply source, the pick-up collet maintains the semiconductor chip in a non-contact manner and rotates 180 degrees before transferring the semiconductor chip to the bonding tool.

19. The semiconductor device manufacturing apparatus according to claim 17 or 18, characterized in that, The semiconductor chip is directly bonded to the substrate.

Images