Electronic component

Abstract

An electronic component includes a component body, an external electrode, and a protective member. The component body has a rectangular lower surface. The external electrode includes a base layer. The substrate layer is connected with the lower surface. The protective member is in contact with the lower surface and the base layer, surrounds the base layer along the outer edge of the base layer, and has an inner edge having a rectangular shape and an outer edge having a rectangular shape. A chamfer is applied to a first outer edge corner farthest from an intersection point of two diagonal lines below among four outer edge corners of the outer edge, and / or a chamfer is applied to a first exposed portion corner farthest from an intersection point of two diagonal lines below among four exposed portion corners of an exposed portion of the base layer exposed from the protective member.

Description

TECHNICAL FIELD

[0001] The present application relates to an electronic component. BACKGROUND

[0002] As a conventional electronic component-related invention, for example, a ceramic electronic component described in Patent Document 1 is known. In the ceramic electronic component, a cover layer is provided to cover at least a part of a peripheral portion of an external terminal electrode provided to a ceramic layer. Thereby, the peripheral portion of the external terminal electrode is protected. As a result, peeling of the external terminal electrode from the ceramic layer can be suppressed.

[0003] Patent Document 1: Japanese Patent No. 5708798

[0004] In addition, in the field of the ceramic electronic component described in Patent Document 1, even if the cover layer is provided, there is a possibility that a crack is generated in the ceramic layer from an end portion of the external terminal electrode. SUMMARY

[0005] Therefore, an object of the present application is to provide an electronic component in which a crack is suppressed from being generated in a main body starting from an end portion of an external electrode.

[0006] An electronic component of one embodiment of the present application includes a component main body, an external electrode, and a protection member, the component main body has a lower surface of a rectangular shape, the external electrode includes a base layer, the base layer is in contact with the lower surface, the protection member is in contact with the lower surface and the base layer, surrounds the base layer along an outer edge of the base layer, has an inner edge of a rectangular shape and an outer edge of a rectangular shape, a first outer edge corner, which is farthest from an intersection of two diagonal lines of the lower surface, among four outer edge corners of the outer edge is chamfered, and / or a first exposed portion corner, which is farthest from the intersection of the two diagonal lines of the lower surface, among four exposed portion corners of an exposed portion where the base layer is exposed from the protection member is chamfered.

[0007] According to the electronic component of the present application, a crack is suppressed from being generated in a main body starting from an end portion of an external electrode. BRIEF DESCRIPTION OF DRAWINGS

[0008] Figure 1 is a perspective view of the electronic component 10. Figure 2 is a plan view of the electronic component 10. Figure 3 is a plan view and a cross-sectional view of the electronic component 10. Figure 4 is a plan view and a cross-sectional view of the electronic component 10. Figure 5 is a bottom view of the electronic component 10. Figure 6 is a bottom view of the electronic component 10a. Figure 7 is a bottom view of the electronic component 10b. Figure 8 is a bottom view of the electronic component 10c. Figure 9 is a bottom view of the electronic component 10d. Figure 10 is a bottom view of the electronic component 10e. Figure 11 is a bottom view of the electronic component 10f. Figure 12 is a bottom view of the electronic component 10g. Figure 13 is a sectional view of the electronic component 10h. DETAILED DESCRIPTION

[0009] (Embodiment) [Structure of Electronic Component 10] Hereinafter, the structure of the electronic component 10 of the embodiment of the present application will be described with reference to the drawings. Figure 1 is an appearance perspective view of the electronic component 10. Figure 2 and Figure 5 is a bottom view of the electronic component 10. Figure 3 and Figure 4 is a bottom view and a sectional view of the electronic component 10.

[0010] In the present specification, directions are defined as follows. A direction in which a plurality of insulator layers are stacked is defined as an up-down direction. A direction orthogonal to the up-down direction is defined as a left-right direction and a front-rear direction. The left-right direction and the front-rear direction are orthogonal. Further, the up-down direction, the front-rear direction, and the left-right direction in the present embodiment can not coincide with the up-down direction, the front-rear direction, and the left-right direction at the time of use of the electronic component 10.

[0011] First, the structure of the electronic component 10 will be described with reference to Figure 1 and Figure 2 . The electronic component 10 is used in a wireless communication terminal such as a smartphone, for example. As shown in Figure 1 , the electronic component 10 is provided with a component main body 12, external electrodes 14a to 14d, and protective components 16a to 16d.

[0012] The component main body 12 has a structure in which a plurality of insulator layers are stacked in the up-down direction. The component main body 12 has a rectangular parallelepiped shape. As shown in Figure 1As shown, the component body 12 has an upper face SU, a lower face SD, a left face SL, a right face SR, a front face SF, and a back face SB. The upper face SU, the lower face SD, the left face SL, the right face SR, the front face SF, and the back face SB have rectangular shapes. The upper face SU faces upward. The lower face SD faces downward. The left face SL, the right face SR, the front face SF, and the back face SB are side faces between the lower face SD and the upper face SU. In addition, each edge line of the component body 12 is chamfered. The material of the component body 12 as described above is ceramic.

[0013] The external electrodes 14a to 14d are provided to the lower face SD. The external electrode 14a is located near the left back corner of the lower face SD. The external electrode 14b is located near the right back corner of the lower face SD. The external electrode 14c is located near the left front corner of the lower face SD. The external electrode 14d is located near the right front corner of the lower face SD. The external electrodes 14a to 14d have rectangular shapes when viewed in the upward direction.

[0014] Hereinafter, the structure of the external electrode 14a will be described with reference to FIG. 2. Figures 3-5 The external electrode 14a includes a base layer 142a and a plating layer 143a. The base layer 142a is in contact with the lower face SD. The base layer 142a has an outer edge Ea having a rectangular shape when viewed in the upward direction. The outer edge Ea of the base layer 142a includes an opposite portion Ela opposite to the outer edge of the lower face SD and a non-opposite portion E2a not opposite to the outer edge of the lower face SD when viewed in the upward direction. The opposite portion Ela is opposite to the outer edge of the lower face SD means that there is no other electrode between the opposite portion Ela and the outer edge of the lower face SD. In the present embodiment, the opposite portion Ela is the left edge and the back edge of the base layer 142a. The non-opposite portion E2a is the right edge and the front edge of the base layer 142a. The plating layer 143a will be described later.

[0015] The protective member 16a is in contact with the lower face SD and the base layer 142a, and surrounds the base layer 142a along the outer edge of the base layer 142a. In the present embodiment, the entire outer edge El of the base layer 142a overlaps the protective member 16a when viewed in the upward direction.

[0016] In addition, the protective member 16a has a rectangular annular shape. The protective member 16a has an inner edge IE and an outer edge OE, and the inner edge IE and the outer edge OE have rectangular shapes. The first outer edge corner Cl, which is the most distant from the intersection P of the two diagonal lines of the lower face in the four outer edge corners of the outer edge OE, is chamfered. The first outer edge corner Cl is the left back corner of the outer edge OE. In the present embodiment, the first outer edge corner Cl is R-chamfered. However, the three outer edge corners other than the first outer edge corner Cl in the four outer edge corners are not chamfered.

[0017] In addition, as shown in FIG. 2, the protective member 16a has a rectangular annular shape. The protective member 16a has an inner edge IE and an outer edge OE, and the inner edge IE and the outer edge OE have rectangular shapes. The first outer edge corner Cl, which is the most distant from the intersection P of the two diagonal lines of the lower face in the four outer edge corners of the outer edge OE, is chamfered. The first outer edge corner Cl is the left back corner of the outer edge OE. In the present embodiment, the first outer edge corner Cl is R-chamfered. However, the three outer edge corners other than the first outer edge corner Cl in the four outer edge corners are not chamfered. Figure 5As shown in FIG. 1, the first exposed corner Cll of the four exposed corners of the exposed portion Pa, from which the base layer 142a of the protective member 16a is exposed, is chamfered. The first exposed corner Cll is the left rear corner of the exposed portion Pa. In the present embodiment, the first exposed corner Cll is chamfered with an R chamfer. However, the three exposed corners of the four exposed corners other than the first exposed corner Cll are not chamfered. The material of the protective members 16a to 16d is ceramic as described above. The material of the protective members 16a to 16d is the same as the material of the member main body 12.

[0018] As shown in FIG. 1, the first exposed corner Cll of the four exposed corners of the exposed portion Pa, from which the base layer 142a of the protective member 16a is exposed, is chamfered. The first exposed corner Cll is the left rear corner of the exposed portion Pa. In the present embodiment, the first exposed corner Cll is chamfered with an R chamfer. However, the three exposed corners of the four exposed corners other than the first exposed corner Cll are not chamfered. The material of the protective members 16a to 16d is ceramic as described above. The material of the protective members 16a to 16d is the same as the material of the member main body 12. Figure 3 Figure 4 As shown in FIG. 1, the first exposed corner Cll of the four exposed corners of the exposed portion Pa, from which the base layer 142a of the protective member 16a is exposed, is chamfered. The first exposed corner Cll is the left rear corner of the exposed portion Pa. In the present embodiment, the first exposed corner Cll is chamfered with an R chamfer. However, the three exposed corners of the four exposed corners other than the first exposed corner Cll are not chamfered. The material of the protective members 16a to 16d is ceramic as described above. The material of the protective members 16a to 16d is the same as the material of the member main body 12.

[0019] Further, the structures of the external electrodes 14b to 14d and the protective members 16b to 16d are the same as those of the external electrode 14a and the protective member 16a and thus the description thereof is omitted.

[0020] The electronic component 10 as described above is mounted on a circuit substrate with solder. The external electrodes 14a to 14d are attached with solder. Further, the external electrodes 14a to 14d are fixed to the external electrodes of the circuit substrate with the solder.

[0021] [Effects] According to the electronic component 10, it is possible to suppress the occurrence of a crack in the member main body 12 starting from the end portion of the external electrode 14a. More specifically, when the electronic component 10 is mounted on a circuit substrate, the external electrodes 14a to 14d are fixed to the mounting electrodes of the circuit substrate with solder. At this time, the external electrodes 14a to 14d are subjected to a force toward the intersection P of the two diagonal lines of the lower surface SD. In this case, stress is likely to concentrate in the first outer edge corner Cl of the four outer edge corners of the outer edge OE, which is farthest from the intersection P of the two diagonal lines of the lower surface SD. Therefore, in the electronic component 10, the first outer edge corner Cl is chamfered. Thus, stress is suppressed from concentrating in the first outer edge corner Cl, and the occurrence of a crack in the member main body 12 starting from the end portion of the external electrode 14a is suppressed.

[0022] ​In addition, stress is likely to concentrate in the first corner C11 that is farthest from the intersection P of the two diagonal lines below the distance SD in the four corners of the exposed portion Pa. Therefore, in the electronic component 10, the first corner C11 that is farthest from the intersection P of the two diagonal lines below the distance SD in the four corners of the exposed portion Pa of the substrate layer 142a exposed from the protective component 16a is chamfered. Thus, the stress concentration in the first corner C11 is suppressed, and the occurrence of a crack in the component main body 12 starting from the end portion of the external electrode 14a is suppressed.

[0023] (Variants) Hereinafter, variants of the electronic component 10a to 10g will be described with reference to the drawings. Figures 6-12 The following drawings are the electronic components 10a to 10g, respectively.

[0024] As shown in the electronic component 10a, C-chamfering is performed at the first outer corner C1 and the first exposed corner C11. Figure 6

[0025] As shown in the electronic component 10b, R-chamfering is performed at the first outer corner C1. No chamfering is performed at the first exposed corner C11. Figure 7

[0026] As shown in the electronic component 10c, C-chamfering is performed at the first outer corner C1. No chamfering is performed at the first exposed corner C11. Figure 8

[0027] As shown in the electronic component 10d, no chamfering is performed at the first outer corner C1. R-chamfering is performed at the first exposed corner C11. Figure 9

[0028] As shown in the electronic component 10e, no chamfering is performed at the first outer corner C1. C-chamfering is performed at the first exposed corner C11. Figure 10

[0029] As shown in the electronic component 10f, R-chamfering is performed at the first outer corner C1. R-chamfering is performed at the first exposed corner C11. However, the distance between the first outer corner C1 and the first exposed corner C11 is larger than the distance between the outer edge OE of the substrate layer 142a and the outer edge of the exposed portion Pa. Thus, the stress concentration in the first exposed corner C11 is suppressed, and the occurrence of a crack in the protective component 16a is suppressed. Figure 11

[0030] As shown in the electronic component 10g, R-chamfering is performed at the first outer corner C1. R-chamfering is performed at the first exposed corner C11. However, the distance between the first outer corner C1 and the first exposed corner C11 is larger than the distance between the outer edge OE of the substrate layer 142a and the outer edge of the exposed portion Pa. Thus, the stress concentration in the first exposed corner C11 is suppressed, and the occurrence of a crack in the protective component 16a is suppressed. Figure 12 ​​​​​​In the electronic component 10g, a C chamfer is implemented at the first outer edge corner C1. A C chamfer is implemented at the first exposed portion corner C11. However, the distance between the first outer edge corner C1 and the first exposed portion corner C11 is greater than the distance between the outer edge OE of the base layer 142a and the outer edge of the exposed portion Pa. Thus, it is possible to suppress the situation in which stress is concentrated at the first exposed portion corner C11, and it is possible to suppress the situation in which a crack is generated in the protective member 16a.

[0031] In addition, Figure 13 is a cross-sectional view of the electronic component 10h. As Figure 13 indicated, the periphery of the external electrode 14a can also be collapsed.

[0032] (Other Embodiments) The electronic component of the present application is not limited to the electronic components 10, 10a to 10h, and can be changed within the scope of the gist thereof. In addition, the structures of the electronic components 10, 10a to 10h can be arbitrarily combined.

[0033] Further, instead of the Ni layer, an Au layer can be provided.

[0034] Further, the lower end of the protective member 16a can be located above the second flat portion F2.

[0035] The material of the protective members 16a to 16d can not be ceramic.

[0036] The material of the component main body 12 can not be ceramic.

[0037] The material of the protective members 16a to 16d can be different from the material of the component main body 12.

[0038] Further, the protective member 16a can not have a ring shape when viewed in the upward direction.

[0039] Further, the external electrode 14a can have a shape other than a rectangular shape when viewed in the upward direction. Further, the rectangular shape includes a square shape. The shape other than the rectangular shape is, for example, a circular shape or an elliptical shape.

[0040] The present application has the following structure.

[0041] (1) An electronic component, The electronic component has a component main body, an external electrode, and a protective member, the above component main body has a lower face of a rectangular shape, the above external electrode includes a base layer, the above base layer is in contact with the above lower face, The protective member is in contact with the lower surface and the base layer, surrounds the base layer along the outer edge of the base layer, and has an inner edge with a rectangular shape and an outer edge with a rectangular shape. The first outer edge corner, which is farthest from the intersection of the two diagonal lines of the lower surface, among the four outer edge corners of the outer edge, is chamfered, and / or the first exposed portion corner, which is farthest from the intersection of the two diagonal lines of the lower surface, among the four exposed portion corners of the exposed portion of the base layer exposed from the protective member, is chamfered.

[0042] (2) The electronic component according to (1), The first outer edge corner, which is farthest from the intersection of the two diagonal lines of the lower surface, among the four outer edge corners of the outer edge, is chamfered, and / or the first exposed portion corner, which is farthest from the intersection of the two diagonal lines of the lower surface, among the four exposed portion corners of the exposed portion of the base layer exposed from the protective member, is chamfered.

[0043] (3) The electronic component according to (1) or (2), The first outer edge corner, which is farthest from the intersection of the two diagonal lines of the lower surface, among the four outer edge corners of the outer edge, is chamfered, and / or the first exposed portion corner, which is farthest from the intersection of the two diagonal lines of the lower surface, among the four exposed portion corners of the exposed portion of the base layer exposed from the protective member, is chamfered.

[0044] (4) The electronic component according to any one of (1) to (3), The first outer edge corner, which is farthest from the intersection of the two diagonal lines of the lower surface, among the four outer edge corners of the outer edge, is chamfered, The first exposed portion corner, which is farthest from the intersection of the two diagonal lines of the lower surface, among the four exposed portion corners of the exposed portion of the base layer exposed from the protective member, is chamfered, The distance between the first outer edge corner and the first exposed portion corner is greater than the distance between the outer edge of the base layer and the outer edge of the exposed portion. Explanation of Reference Numerals

[0045] 10, 10a-10h: electronic component, 12: component main body, 14a-14d: external electrode, 16a-16d: protective member, 142a: base layer, 143a: plating layer, C1: first outer edge corner, C11: first exposed portion corner, E1: outer edge, E1a: opposite portion, E2a: non-opposite portion, Ea: outer edge, SB: back surface, SD: lower surface, SF: front surface, SL: left surface, SR: right surface, SU: upper surface.

Claims

1. An electronic component, wherein, Electronic components consist of a main body, external electrodes, and protective components. The main body of the aforementioned component has a rectangular shape on the bottom. The aforementioned external electrode includes a substrate layer. The aforementioned base layer is in contact with the aforementioned underlying layer. The aforementioned protective member is in contact with the aforementioned lower surface and the aforementioned base layer, and extends along the outer edge of the aforementioned base layer to surround the aforementioned base layer. The protective member has an inner edge with a rectangular shape and an outer edge with a rectangular shape. The first outer edge angle, which is furthest from the intersection of the two diagonals below, among the four outer edge angles of the aforementioned outer edge, is chamfered, and / or the first exposed angle, which is furthest from the intersection of the two diagonals below, among the four exposed angles of the exposed portion of the aforementioned base layer exposed from the aforementioned protective member, is chamfered.

2. The electronic component according to claim 1, wherein, Chamfering was not performed on the three outer edge angles other than the first outer edge angle mentioned above.

3. The electronic component according to claim 1 or claim 2, wherein, Chamfering was not performed on three of the four exposed corners, except for the first exposed corner.

4. The electronic component according to any one of claims 1 to 3, wherein, Chamfer the first outer angle, which is furthest from the intersection of the two diagonals below, among the four outer angles of the aforementioned outer edge. The first exposed corner, which is furthest from the intersection of the two diagonals below, among the four exposed corners of the base layer exposed from the protective member, is chamfered. The distance between the first outer edge angle and the first exposed portion angle is greater than the distance between the outer edge of the base layer and the outer edge of the exposed portion.

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