Simulation heat source device of thermal photoelectric conversion system

Abstract

The invention discloses a simulated heat source device of a thermal photoelectric conversion system. The simulated heat source device comprises a plurality of simulated heat source modules, and each simulated heat source module comprises a simulated heat source body; the heat source coating structure is arranged outside the simulated heat source body; a plurality of heat source wrapping structures are arranged in the first shell assembly. The simulation heat source device is high in input power, high in temperature, more uniform in heating and good in stability, and can provide a stable simulation heat source for the hectowatt-level thermophotoelectric isotope nuclear battery for experimental research.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat energy utilization, and in particular to a simulated heat source device of a thermo-opto-electric conversion system. BACKGROUND

[0002] The isotope thermo-opto-electric nuclear cell is a power generation device that utilizes the decay energy and its secondary effects (such as heat energy) generated by the decay of a radioactive isotope (commonly plutonium-238) to convert the heat energy into electric energy through a thermoelectric conversion component, and has the advantages of small size, high energy density, long service life, all-weather, high reliability, self-sustaining, and maintenance-free, and is the best choice for power supply of equipment systems such as space early warning radars, reconnaissance satellites, navigation satellites, and deep space probes. In order to study safety and convenience, the research on the isotope thermo-opto-electric nuclear cell is usually carried out by using a simulated heat source without a nuclear. The output power of the isotope thermo-opto-electric nuclear cell currently researched is about 50W, which cannot meet the research needs of the isotope thermo-opto-electric nuclear cell with an output power of more than 100W. SUMMARY

[0003] The present application aims to at least solve one of the problems in the prior art or related art.

[0004] In view of this, the present application provides a simulated heat source device of a thermo-opto-electric conversion system, wherein the input power of the simulated heat source device is high, the temperature is high, the heating is more uniform, the stability is good, and the simulated heat source device can provide a stable simulated heat source for a hundred-watt-level thermo-opto-electric isotope nuclear cell for experimental research.

[0005] Specifically, the technical scheme comprises the following:

[0006] The present application provides a simulated heat source device of a thermo-opto-electric conversion system, the simulated heat source device comprising a plurality of simulated heat source modules, wherein each simulated heat source module comprises:

[0007] a simulated heat source body;

[0008] a heat source covering structure arranged outside the simulated heat source body;

[0009] a first housing assembly in which a plurality of heat source covering structures are arranged.

[0010] Optionally, the simulated heat source body comprises a holder and a resistance wire wound on the holder, the holder is in a cylindrical shape, the cylindrical shape comprises a circular arc outer wall and two plane side walls, the circular arc outer wall is provided with a spiral wire groove, and the wire groove is configured to accommodate the resistance wire.

[0011] Optionally, the holder is in a hollow structure, the center of each plane side wall is provided with a first circular hole, and the two ends of the wire groove are provided with through holes, and the two ends of the resistance wire respectively pass through the through holes and the first circular holes to pass out of the holder.

[0012] Optionally, the material of the resistance wire is molybdenum wire, and the material of the retainer is boron nitride ceramic.

[0013] Optionally, the heat source covering structure comprises:

[0014] an inner shell assembly, the simulated heat source body is arranged in the inner shell assembly;

[0015] a second outer shell assembly, which is sleeved outside the inner shell assembly.

[0016] Optionally, the inner shell assembly comprises:

[0017] an inner shell, which is in the shape of a cylinder with one end open, and a first accommodating groove is arranged in the inner shell, the first accommodating groove is configured to place the simulated heat source body;

[0018] an inner shell cover, which is arranged at the open end of the inner shell, the inner shell cover is fixedly connected with the inner shell, a second circular hole is arranged on the inner shell cover, and the side opposite to the inner shell cover is also provided with the second circular hole.

[0019] Optionally, the second outer shell assembly comprises:

[0020] a second outer shell, which is in the shape of a cylinder with one end open, and a second accommodating groove is arranged in the second outer shell, the second accommodating groove is configured to place the inner shell assembly and the simulated heat source body;

[0021] a second outer shell cover, which is arranged at the open end of the second outer shell, the second outer shell cover is fixedly connected with the second outer shell, a plurality of third circular holes are arranged on the second outer shell cover, and the side opposite to the second outer shell cover is also provided with the plurality of third circular holes.

[0022] Optionally, the material of the inner shell assembly and the second outer shell assembly is boron nitride ceramic.

[0023] Optionally, the first outer shell assembly is configured to place a plurality of the second outer shell assemblies, when two second outer shell assemblies are arranged in the first outer shell assembly, the first outer shell assembly comprises:

[0024] a first outer shell, which is in the shape of a hollow cuboid, one side of the first outer shell is provided with a first opening, the other side of the first outer shell is provided with a second opening, the first opening and the second opening are oppositely and obliquely arranged, the first opening is configured to send in one second outer shell assembly, and the second opening is configured to send in one second outer shell assembly;

[0025] a first outer shell cover, which is arranged at the first opening and the second opening respectively.

[0026] Optionally, a fourth circular hole is arranged on the bottom wall of the first shell, and a slot is arranged in the height direction of the first shell and the first shell cover, and a plurality of the simulated heat source modules are stacked in the height direction of the first shell assembly, and the adjacent simulated heat source modules are connected through the insertion of the plug into the slot.

[0027] The material of the first shell assembly is graphite.

[0028] The simulated heat source device of the thermophotovoltaic conversion system provided by the embodiment of the present application, wherein the simulated heat source device comprises a plurality of simulated heat source modules, each of which is sequentially provided with a simulated heat source body, a heat source covering structure and a first shell assembly from inside to outside, the simulated heat source body is installed in the heat source covering structure, every two heat source covering structures with simulated heat source bodies are arranged in one first shell assembly, and usually a plurality of installed first shell assemblies are stacked together to finally form the simulated heat source device. The structure of the simulated heat source device can provide kilowatt-level input power, and provide stable simulated heat source for the hundred-watt-level thermophotovoltaic isotope nuclear battery for experimental research. The structure of the simulated heat source device can reach a high temperature, and the heating is more uniform. The simulated heat source device matches the actual isotope thermophotovoltaic nuclear battery to achieve the same effect, improves the accuracy and reliability of the experimental research, and has good stability, ensures the effectiveness of the experimental research, and improves the safety of the experimental personnel.

[0029] The above description is only a summary of the technical scheme of the present application. In order to more clearly understand the technical means of the present application, the content of the specification can be implemented, and in order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the following specific embodiments of the present application are described. BRIEF DESCRIPTION OF DRAWINGS

[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiment description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creating laborious work.

[0031] Figure 1 The schematic diagram of the simulated heat source device according to an embodiment of the present application;

[0032] Figure 2 The internal schematic diagram of the simulated heat source device according to an embodiment of the present application;

[0033] Figure 3 The schematic diagram of the first shell assembly according to an embodiment of the present application;

[0034] Figure 4 Schematic diagram of a resistance wire according to an embodiment of the application;

[0035] Figure 5 Schematic diagram of a retainer according to an embodiment of the application;

[0036] Figure 6 Schematic diagram of an inner shell assembly according to an embodiment of the application;

[0037] Figure 7 Schematic diagram of a second outer shell assembly according to an embodiment of the application.

[0038] wherein, Figures 1 to 7 The correspondence between the reference signs and the component names is as follows:

[0039] 100 simulated heat source device, 110 simulated heat source module, 111 simulated heat source body, 1111 retainer, 1112 resistance wire, 1113 first circular hole, 1114 wire slot, 112 heat source covering structure, 1121 inner shell assembly, 1122 inner shell, 1123 inner shell cover, 1124 second circular hole, 1125 second outer shell assembly, 1126 second outer shell, 1127 second outer shell cover, 1128 third circular hole, 113 first outer shell assembly, 1131 first outer shell, 1132 first outer shell cover, 1133 insertion slot, 1134 insertion pin, 114 hollow support tube. DETAILED DESCRIPTION

[0040] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present application.

[0041] Before the embodiments of the present application are described in further detail, the orientation nouns such as “upper part”, “lower part”, “side part” involved in the embodiments of the present application do not have the meaning of limiting the scope of protection of the present application.

[0042] In order to make the technical solutions and advantages of the present application clearer, the embodiments of the present application will be described in further detail below with reference to the drawings.

[0043] Figure 1 Schematic diagram of a simulated heat source device according to an embodiment of the application; Figure 2 Schematic diagram of a simulated heat source device according to an embodiment of the application;

[0044] As Figure 1 and Figure 2As shown, one embodiment of the present application provides a simulated heat source device 100 of a thermo-optical conversion system, the simulated heat source device comprising a plurality of simulated heat source modules 110, the simulated heat source module 110 comprising:

[0045] a simulated heat source body 111;

[0046] a heat source covering structure 112 arranged outside the simulated heat source body 111;

[0047] a first shell assembly 113 in which a plurality of heat source covering structures 112 are arranged.

[0048] In the simulated heat source device 100, a plurality of simulated heat source modules 110 are arranged, each simulated heat source module 110 sequentially comprises a simulated heat source body 111, a heat source covering structure 112 and a first shell assembly 113 from inside to outside, the simulated heat source body 111 is arranged in the heat source covering structure 112, every two heat source covering structures 112 with simulated heat source bodies 111 are arranged in one first shell assembly 113, and usually a plurality of installed first shell assemblies 113 are stacked together to form the simulated heat source device 100. The simulated heat source device 100 can provide kilowatt-level input power, and can provide stable simulated heat source for hundreds of watt-level thermo-optical isotope nuclear battery for experimental research. The simulated heat source device 100 can reach high temperature and uniform heating, and can match the actual isotope thermo-optical nuclear battery to achieve the same effect, improve the accuracy and reliability of the experimental research, and has good stability, ensures the effectiveness of the experimental research, and improves the safety of the experimental personnel.

[0049] Specifically, two heat source covering structures 112 are arranged in each first shell assembly 113, the simulated heat source body 111 is arranged in the heat source covering structure 112, and four first shell assemblies 113 are vertically stacked together, that is, eight simulated heat source bodies 111 and heat source covering structures 112 are arranged, so that the simulated heat source device 100 can realize the same replacement of the isotope thermo-optical nuclear battery with input power reaching 1000W and output power reaching 100W, and can realize the reliability of the simulated heat source device 100 of the high-power thermo-optical conversion system for experimental research, which is helpful to realize the working research of the high-power isotope thermo-optical nuclear battery and improve the accuracy of the research results.

[0050] Figure 4 a schematic view of a resistance wire according to one embodiment of the present application; Figure 5 a schematic view of a retainer according to one embodiment of the present application.

[0051] In one possible implementation, as shown in Figure 4 and Figure 5As shown, the analog heat source body 111 includes a holder 1111 and a resistance wire 1112 wound on the holder 1111, the holder 1111 is in a cylindrical shape, which includes a circular arc outer wall and two plane side walls, the circular arc outer wall is provided with a spiral wire groove 1114, and the wire groove 1114 is configured to accommodate the resistance wire 1112.

[0052] The resistance wire 1112 is limited and clamped through the spiral wire groove 1114, which improves the uniformity and reliability of winding of the resistance wire 1112. The uniformly wound resistance wire 1112 can ensure that the heat generation of each part of the resistance wire 1112 is consistent, avoid local overcooling or overheating, improve the heating efficiency, and prolong the service life of the resistance wire 1112. At the same time, the uniform winding pitch and density can also maintain the consistency of the resistance distribution, avoid the current concentration caused by local resistance difference, affect the circuit performance, improve the stability and reliability of the use of the resistance wire 1112, and thus improve the test research of the analog heat source device 100 replacing the isotope thermo-optic nuclear battery, and improve the reliability and stability of the test results.

[0053] In a feasible implementation, the holder 1111 is in a hollow structure, the first circular hole 1113 is arranged at the center of the plane side wall, and the through holes are arranged at both ends of the wire groove 1114, and the both ends of the resistance wire 1112 pass through the through holes and the first circular hole 1113 to pass out of the holder 1111.

[0054] In order to realize the function of the resistance wire 1112, the first circular hole 1113 is arranged at the center of the plane side wall of the holder 1111, and the through holes are arranged at both ends of the wire groove 1114, and the resistance wire 1112 passes through the through holes and the first circular hole 1113 in sequence, so that the both ends of the resistance wire 1112 can be located outside the holder 1111, which facilitates the connection of the resistance wire 1112 with the conductive material and realizes heating.

[0055] In a feasible implementation, the material of the resistance wire 1112 is molybdenum wire, and the material of the holder 1111 is boron nitride ceramic.

[0056] The resistance wire 1112 prepared from molybdenum wire can still maintain high mechanical strength under high temperature conditions and is not easy to soften and deform, thereby improving the service life of the resistance wire 1112, and can still maintain stable electrical properties under high temperature, thereby ensuring the stability and reliability of the analog heat source body 111, making it closer to the heating effect of the isotope thermo-optic nuclear battery, and improving the accuracy and reliability of the test. The holder 1111 is made of boron nitride ceramic, which has excellent high-temperature resistance, so that the holder can still stably support after the resistance wire 1112 generates heat. In addition, the boron nitride ceramic also has excellent electrical insulation, which can prevent the resistance wire 1112 from leaking electricity and improve the safety of the analog heat source device 100.

[0057] In an embodiment, the heat source covering structure 112 comprises:

[0058] an inner shell assembly 1121, in which the simulated heat source body 111 is arranged;

[0059] a second outer shell assembly 1125, which is sleeved outside the inner shell assembly 1121.

[0060] In the embodiment, the heat source covering structure 112 comprises the inner shell assembly 1121 and the second outer shell assembly 1125, and the simulated heat source body 111, the inner shell assembly 1121 and the second outer shell assembly 1125 are arranged from inside to outside. The heat source covering structure 112 formed by the inner shell assembly 1121 and the second outer shell assembly 1125 can prevent heat from being transferred to the first outer shell assembly 113, thereby improving the safety of the experiment.

[0061] Figure 6 A schematic view of the inner shell assembly according to an embodiment of the present application.

[0062] In an embodiment, as shown in Figure 6 the inner shell assembly 1121 comprises:

[0063] an inner shell 1122 in the shape of a cylinder with one end open, the inner shell 1122 is provided with a first accommodating groove configured to place the simulated heat source body 111;

[0064] an inner shell cover 1123 arranged at the open end of the inner shell 1122, the inner shell cover 1123 is fixedly connected with the inner shell 1122, and the inner shell cover 1123 is provided with a second circular hole 1124, and the side opposite to the inner shell cover 1123 of the inner shell 1122 is also provided with the second circular hole 1124.

[0065] In the embodiment, the inner shell assembly 1121 comprises the inner shell 1122 and the inner shell cover 1123 arranged at the open end of the inner shell 1122, and the inner shell cover 1123 is threadedly connected with the inner shell 1122. The threaded connection can ensure the integrity of the inner shell assembly 1121 and avoid the addition of other materials due to bolt connection, thereby affecting the insulation of the inner shell assembly 1121. In addition, the inner shell cover 1123 is provided with the second circular hole 1124, which is usually arranged at the center of the side opposite to the inner shell cover 1123, and is also convenient for the electric resistance wire 1112 to pass through and be connected with the conductive material.

[0066] It should be noted that the material of the inner shell assembly 1121 is boron nitride ceramic, which has high-temperature insulation performance and can prevent the electric resistance wire 1112 from contacting the first outer shell assembly 113 to cause electric leakage, thereby improving the safety of the simulated heat source device 100.

[0067] Figure 7A schematic view of a second housing assembly according to an embodiment of the present application.

[0068] In one possible implementation, as shown in Figure 7 The second housing assembly 1125 includes:

[0069] A second housing 1126 in the shape of an open-ended cylinder, the second housing 1126 having a second receiving groove configured to receive the inner housing assembly 1121 and the simulated heat source body 111;

[0070] A second housing cover 1127 disposed at the open end of the second housing 1126, the second housing cover 1127 being fixedly connected to the second housing 1126, the second housing cover 1127 having a plurality of third circular holes 1128, and the side of the second housing 1126 opposite the second housing cover 1127 also having a plurality of third circular holes 1128.

[0071] The second housing assembly 1125 includes the second housing 1126 and the second housing cover 1127 disposed at the open end of the second housing 1126, the second housing cover 1127 being threadedly connected to the second housing 1126, which ensures the integrity of the second housing assembly 1125 and avoids the addition of other materials due to bolt connections, which would affect the insulation of the second housing assembly 1125. In addition, the second housing cover 1127 has third circular holes 1128, which are typically disposed at the center of the side opposite the second housing cover 1127, which facilitates the passage of the resistance wire 1112 and the connection of the conductive material. It should be understood that the third circular holes 1128 at the center are provided for the passage of the resistance wire 1112, and the other third circular holes 1128 around the third circular holes 1128 at the center are provided for heat dissipation to avoid safety accidents caused by high temperatures. In actual applications, when the simulated heat source body 111 is replaced by an isotope nuclear battery, the other third circular holes 1128 are provided to dissipate heat while also releasing certain gases generated by the decomposition of the isotope nuclear battery.

[0072] It should be noted that the material of the second housing assembly 1125 is boron nitride ceramic. Boron nitride ceramic has high-temperature insulation properties, which can prevent the resistance wire 1112 from contacting the first housing assembly 113 and causing a short circuit, further improving the safety of the simulated heat source device 100.

[0073] Figure 3 A schematic view of a first housing assembly according to an embodiment of the present application.

[0074] In one possible implementation, as shown in Figure 3As shown, the first shell assembly 113 is configured to place multiple second shell assemblies 1125, when two second shell assemblies 1125 are arranged in the first shell assembly 113, the first shell assembly 113 comprises:

[0075] The first shell 1131 is in the shape of a hollow rectangular cuboid, one side of the first shell 1131 is provided with a first opening, and the other side of the first shell 1131 is provided with a second opening, the first opening and the second opening are opposite and inclined, the first opening is configured to send in one second shell assembly 1125, and the second opening is configured to send in one second shell assembly 1125;

[0076] The first shell cover 1132 is arranged at the first opening and the second opening respectively.

[0077] Among them, multiple stacked first shell assemblies 113 are provided with multiple hollow support tubes 114, which are convenient for the resistance wire 1112 to pass out and connect with the conductive material, so as to realize the heating performance of the resistance wire 1112.

[0078] It should be noted that the opposite sides of the first shell 1131 are respectively provided with the first opening and the second opening, and the first opening and the second opening are staggered, each opening can move in one second shell assembly 1125 (also including the inner shell assembly 1121 and the simulated heat source body 111 inside), avoiding the collision of two second shell assemblies 1125 moving in from one opening, the arrangement of two openings can improve the stability and safety of the second shell assembly 1125. The first opening and the second opening are staggered, which can make the heat distribution on the first shell 1131 more uniform. The square shape of the first shell assembly 113 meets the design requirements, and can convert thermal energy into electrical energy at the back end. The second shell assembly 1125 itself is a standard part of the simulated heat source module 110, so it needs to be prepared into a cylindrical shape. The first shell cover 1132 is connected with the first shell 1131 by bolts, four bolts can be used for connection, which improves the reliability of the connection between the first shell 1131 and the first shell cover 1132.

[0079] In a feasible implementation, the bottom wall of the first shell 1131 is provided with a fourth circular hole, the height direction of the first shell 1131 and the first shell cover 1132 is provided with a slot 1133, and multiple simulated heat source modules 110 are stacked in the height direction of the first shell assembly 113, and the adjacent simulated heat source modules 110 are connected by inserting the plug 1134 into the slot 1133;

[0080] The material of the first shell assembly 113 is graphite.

[0081] The first shell 1131 has a slot 1133, and the adjacent two first shell assemblies 113 are connected by the plug 1134 and the slot 1133, so as to realize the stability of the stacked first shell assemblies 113. It should be noted that the slot 1133 and the plug 1134 are clearance fit, and appropriate tolerance is selected to ensure the smoothness of the plug 1134 inserted into the slot 1133, and meanwhile, the plug 1134 can be prevented from falling out of the slot 1133. Alternatively, the plug 1134 and the slot 1133 can be interference fit, and the plug 1134 can be hammered into the slot 1133 vertically through a soft head, so as to ensure the stability and reliability of the connection between the stacked first shell assemblies 113. The bottom wall of the first shell 1131 is provided with a fourth circular hole, so as to facilitate the passing of the resistance wire 1112 therein, that is, the resistance wire 1112 passes through the hole, the first circular hole 1113, the second circular hole 1124, the third circular hole 1128 and the fourth circular hole in sequence, and then is exposed outside through the hollow support pipe 114, so as to be connected with the conductive material. It can be understood that the first shell 1131 has four fourth circular holes, which correspond to the two ends of the resistance wire 1112 passed out by the two second shell assemblies 1125 respectively.

[0082] Further, the material of the first shell assembly 113 is isotropic graphite, so that the external temperature distribution of the simulated heat source module 110 is more uniform, and the service life and experimental reliability of the simulated heat source module 110 are improved.

[0083] The present application converts multiple simulated heat source modules 110 into a large heat source, that is, the final simulated heat source device 100, and through the structure and material setting of the present application, the temperature distribution of the four sides of the front and back of the first shell assembly 113 is more uniform. In experimental use, the resistance wire 1112 is electrically heated to generate heat, so that the nuclear energy heat source can be simulated to facilitate the whole machine experiment when there is no nuclear energy heat source, and the nuclear energy heat source can be replaced when actually used. The shape of the internal heating body (resistance wire 1112) of the simulated heat source module 110 is an input condition and is fixed. The outermost part of the simulated heat source module 110 is the requirement of the power generation at the rear end. In the structure of the present application, a suitable path is established between the input voltage and the output voltage, so that the input voltage (provided by the power grid) can be smoothly converted into the output voltage (determined by the electric appliance).

[0084] In the present application, the terms "first" and "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance. The term "multiple" refers to two or more, unless otherwise explicitly limited.

[0085] Other embodiments of the application will be apparent to those skilled in the art from consideration of the specification and practice of the application disclosed herein. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.

[0086] The above are only preferred embodiments of the present application and are not used to limit the present application, and any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A simulated heat source device for a thermo-photovoltaic conversion system, characterized by, The simulation heat source device comprises a plurality of simulation heat source modules, the simulation heat source module comprises: a simulation heat source body; a heat source covering structure arranged outside the simulation heat source body; a first shell assembly in which a plurality of heat source covering structures are arranged.

2. The simulated heat source device of the thermophotovoltaic conversion system according to claim 1, wherein The simulation heat source body comprises a holder and a resistance wire wound on the holder, the holder is in a cylindrical shape, the cylindrical shape comprises a circular arc outer wall and two plane side walls, the circular arc outer wall is provided with a spiral wire slot configured to accommodate the resistance wire.

3. The simulated heat source apparatus of the thermophotovoltaic conversion system according to claim 2, wherein The holder is in a hollow structure, the center of the plane side wall is provided with a first circular hole, the two ends of the wire slot are provided with through holes, and the two ends of the resistance wire pass out of the holder through the through holes and the first circular hole.

4. The simulated heat source apparatus of the thermophotovoltaic conversion system according to claim 2, wherein The material of the resistance wire is molybdenum wire, and the material of the holder is boron nitride ceramic.

5. The simulated heat source apparatus of the thermophotovoltaic conversion system according to claim 1, wherein The heat source covering structure comprises: an inner shell assembly in which the simulation heat source body is arranged; a second shell assembly sleeved outside the inner shell assembly.

6. The simulated heat source apparatus of the thermophotovoltaic conversion system according to claim 5, wherein The inner shell assembly comprises: an inner shell in a cylindrical shape with one end open, the inner shell is provided with a first accommodating groove configured to place the simulation heat source body; an inner shell cover arranged at the open end of the inner shell, the inner shell cover is fixedly connected with the inner shell, the inner shell cover is provided with a second circular hole, and the side of the inner shell opposite to the inner shell cover is also provided with the second circular hole.

7. The simulated heat source apparatus of the thermophotovoltaic conversion system according to claim 5, wherein The second shell assembly comprises: a second shell in a cylindrical shape with one end open, the second shell is provided with a second accommodating groove configured to place the inner shell assembly and the simulation heat source body; a second shell cover arranged at the open end of the second shell, the second shell cover is fixedly connected with the second shell, the second shell cover is provided with a plurality of third circular holes, and the side of the second shell opposite to the second shell cover is also provided with a plurality of the third circular holes.

8. The simulated heat source apparatus of the thermophotovoltaic conversion system according to claim 5, wherein The materials of the inner shell assembly and the second shell assembly are boron nitride ceramic.

9. The simulated heat source apparatus of a thermophotovoltaic conversion system according to claim 1, wherein The first shell assembly is configured to place a plurality of the second shell assemblies, when two second shell assemblies are arranged in the first shell assembly, the first shell assembly comprises: a first shell in a hollow rectangular parallelepiped shape, one side of the first shell is provided with a first opening, the other side of the first shell is provided with a second opening, the first opening and the second opening are oppositely and obliquely arranged, the first opening is configured to send in one second shell assembly, and the second opening is configured to send in one second shell assembly; a first shell cover arranged at the first opening and the second opening, respectively.

10. The simulated heat source apparatus of a thermo-photovoltaic conversion system according to claim 9, wherein The bottom wall of the first shell is provided with a fourth circular hole, and the height direction of the first shell and the first shell cover is provided with a slot, a plurality of simulation heat source modules are stacked in the height direction of the first shell assembly, and adjacent simulation heat source modules are connected through a plug inserted into the slot. The material of the first shell assembly is graphite.

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