Automatic dispensing and die bonding device for diode packaging

Abstract

The invention belongs to the technical field of diode processing, and particularly relates to an automatic dispensing and die bonding device for diode packaging, which comprises a conveyor belt and a suspension, the suspension is fixedly connected with an external support, and the suspension is provided with a dispensing mechanism matched with the upper end face of the conveyor belt; the glue dispensing roller is a rotating shaft used for mounting a glue dispensing device in the glue dispensing mechanism; the glue dispenser is a glue dispensing device in the glue dispensing mechanism; the primary cleaner is a device used for cleaning the dispensing mechanism; through conveying cooperation of the dispensing roller, the dispensing device and the conveying belt on a material plate, continuous machining production can be effectively carried out in a continuous conveying mode, the production efficiency is improved, and the requirement for the accuracy of equipment is reduced; and through cooperation of the first-stage cleaner and the second-stage cleaner, the overall production quality and efficiency can be improved, redundant impurities are automatically removed and collected, and the requirement of automatic production is met.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of diode processing, and particularly relates to an automatic dispensing die bonding device for diode packaging. BACKGROUND

[0002] At present, in the diode packaging processing process, after the wafer is pasted on the bottom plate and fixed, dispensing packaging treatment needs to be performed on the wafer to realize packaging protection of the wafer. At present, the dispensing mode is mostly in the form of fixed-point dispensing, that is, the material plate is conveyed by the conveying belt, when the wafer on the material plate corresponds to the position of the dispensing head, the conveying belt stops, and dispensing is performed at this time. However, this mode has the problems of discontinuous dispensing processing, intermittent start and stop, high precision requirement of the linear stroke of the equipment, otherwise, dispensing deviation is easily caused to result in quality problems of the product, and at the same time, an additional positioning guide device or structure is also needed, which increases the debugging and operation difficulty of the equipment. SUMMARY

[0003] The application aims to provide an automatic dispensing die bonding device for diode packaging, which is used to solve the problems mentioned in the background.

[0004] To achieve the above technical purpose, the technical scheme adopted by the application is as follows:

[0005] An automatic dispensing die bonding device for diode packaging, comprising a conveying belt and a suspension, wherein the suspension is fixedly connected with an external support, and the suspension is provided with a dispensing mechanism matched with the upper end surface of the conveying belt;

[0006] A dispensing roller, which is a rotating shaft for installing a dispensing device in the dispensing mechanism, is rotatably arranged on the suspension and close to the upper end of the conveying belt, and the dispensing roller is a hollow structure;

[0007] A dispenser, which is a dispensing device in the dispensing mechanism, is uniformly provided with a plurality of installation grooves on the side of the dispensing roller, the dispenser is composed of a dispensing head and a glue supply ring, the number of the dispensing heads is the same as that of the installation grooves and is arranged one by one in correspondence, and the glue supply ring is arranged in the hollow area of the dispensing roller and matched with the plurality of dispensing heads;

[0008] A primary cleaner, which is a device for cleaning the dispensing mechanism, is arranged on the upper side of the suspension and matched with the dispensing roller.

[0009] The glue supply ring comprises a sealing ring, a glue supply pipe and glue distribution pipes. The sealing ring is concentrically arranged with the glue dispensing roller and fixedly connected with the suspension. The outer wall of the sealing ring is sealingly connected with the hollow inner wall of the glue dispensing roller. The number of the glue distribution pipes is several and they are evenly arranged along the length direction of the sealing ring. The glue supply pipe is liquidly connected with the several glue distribution pipes and extends out of the suspension to be liquidly connected with an external liquid pump. The glue distribution pipes are correspondingly arranged directly below the glue dispensing roller. The liquid outlets of the glue distribution pipes are located between the sealing ring and the hollow inner wall of the glue dispensing roller.

[0010] The glue dispenser comprises a carrier plate and glue dispensing heads. The number of the glue dispensing heads is several and they are evenly arranged on the carrier plate. The glue dispensing roller is provided with pipelines connected with the hollow structure and mounting grooves. The carrier plate is liquidly connected with the corresponding pipelines and the several glue dispensing heads.

[0011] The primary cleaner comprises a roller shaft, an electromagnet, a floating plate and cleaning cotton. The primary cleaner is arranged directly above the glue dispensing roller. The roller shaft is hollow and rotatably arranged on the suspension. The electromagnet is fixedly arranged on the suspension by a support and located in the hollow structure of the roller shaft. The electromagnet is provided with magnetic poles at the upper and lower ends. The roller shaft is evenly provided with several embedding grooves. The floating plate is elastically slidably arranged in the embedding grooves along the vertical roller shaft axis direction and is retracted into the embedding grooves in the static state. The floating plate is magnetically matched with the electromagnet. The cleaning cotton is arranged at one end of the floating plate facing the glue dispensing roller.

[0012] The cleaning cotton is evenly provided with recessed holes corresponding to the several glue dispensing heads.

[0013] The suspension is further provided with a secondary cleaner matched with the roller shaft. The secondary cleaner comprises a glue suction roller and a shielding ring. The glue suction roller is a hollow roller and is rotatably arranged on the suspension. The hollow part of the glue suction roller is in communication with an external vacuum suction mechanism. The glue suction roller is evenly provided with several glue suction holes in communication with the hollow part at the side. The shielding ring is a notched ring and is slidingly and sealingly arranged in the hollow part of the glue suction roller. The shielding ring is fixedly connected with the suspension. The notch of the shielding ring is correspondingly directed towards the roller shaft.

[0014] The notch of the shielding ring has a fan-shaped angle of 90°-160°.

[0015] Compared with the prior art, the application has at least the following advantages:

[0016] The application can effectively realize continuous processing and production in a continuous conveying mode, improve production efficiency and reduce the accuracy requirement of the equipment through the cooperation of the glue dispensing roller, the glue dispenser and the conveying belt. The cooperation of the primary cleaner and the secondary cleaner can improve the overall quality and efficiency of production, realize automatic removal and collection of redundant impurities and meet the needs of automatic production. BRIEF DESCRIPTION OF DRAWINGS

[0017] The present application can be further illustrated by the non-limiting embodiments shown in the accompanying drawings.

[0018] Fig. 1 The present application is a schematic diagram of the overall structure.

[0019] Fig. 2 The present application is a schematic diagram of the structure.

[0020] Fig. 3 The present application is a schematic diagram of the dispensing roller and the associated structure.

[0021] Fig. 4 The present application is a schematic diagram of the primary cleaner.

[0022] Fig. 5 The present application is a schematic diagram of the secondary cleaner.

[0023] Fig. 6 The present application is another perspective view of the overall structure.

[0024] Conveyor belt 1, suspension 11, dispensing roller 2, mounting groove 21, sealing ring 3, glue supply pipe 31, glue distribution pipe 32, carrier plate 33, dispensing head 34, pipe 35, roller shaft 4, electromagnet 41, floating plate 42, cleaning cotton 43, fitting groove 44, recess 45, glue suction roller 5, shielding ring 51, glue suction hole 52. DETAILED DESCRIPTION

[0025] In order for those skilled in the art to better understand the present application, the technical solutions of the present application are further described below in conjunction with the accompanying drawings and examples.

[0026] Example 1: As shown, an automatic dispensing die bonding device for diode packaging includes a conveyor belt 1 and a suspension, the suspension is fixedly connected with an external support, and the suspension is provided with a dispensing mechanism matched with the upper end surface of the conveyor belt 1. Figs. 1-6 Dispensing roller 2, the dispensing roller 2 is a rotating shaft for mounting a dispensing device in the dispensing mechanism, the dispensing roller 2 is rotatably arranged on the suspension and closely attached to the upper end of the conveyor belt 1, and the dispensing roller 2 is a hollow structure.

[0027] Dispenser, the dispenser is a dispensing device in the dispensing mechanism, a plurality of mounting grooves 21 are uniformly formed on the side of the dispensing roller 2, the dispenser is composed of a dispensing head 34 and a glue supply ring, the number of dispensing heads 34 is the same as that of the mounting grooves 21 and is arranged one by one in correspondence, and the glue supply ring is arranged in the hollow area of the dispensing roller 2 and is matched with the plurality of dispensing heads 34.

[0028] Primary cleaner, the primary cleaner is a device for cleaning the dispensing mechanism, and the primary cleaner is arranged on the upper side of the suspension and is matched with the dispensing roller 2.

[0029]

[0030] ​In diode packaging, conveyor belt 1 is used to transport the die-bonded substrate. Conveyor belt 1 is equipped with corresponding pressure belt or clamping conveyor clamps to ensure that the conveying position and state of the substrate are relatively stable. Of course, in this application, the substrate can be positioned by the initial position of the hopper and the roller structure of the dispensing roller. The dispensing roller can directly press and position the substrate. The dispensing roller and the conveyor belt can form a clamping and fixing of the substrate, thus eliminating the need for an additional positioning structure. Of course, using a positioning structure is not impossible. Since this stable conveying structure is a common technical means in the field and is not the technical problem to be solved in this application, it is not shown in the illustrations of this application and will not be described in detail here.

[0031] When the material plate is conveyed at a constant speed by the conveyor belt 1 until it reaches the dispensing roller 2, the dispensing nozzles on the dispensing roller 2 are spaced apart and their running speed is the same as the horizontal dispensing dots distributed along the length of the material plate. Therefore, the dispensing nozzles on the dispensing roller 2 and the material plate will move synchronously. When the dispensing head 34 in the dispensing nozzle corresponds to the position of the glue supply ring, that is, when the dispensing head 34 is exactly below the glue supply ring and the dispensing roller 2, that is, when the dispensing head 34 is completely aligned with the material plate, the glue supply ring supplies encapsulating glue, so that the wafer on the material plate is encapsulated. With the continuous operation of the dispensing roller 2 and the continuous constant speed conveying of the material plate, this method is more efficient than the planar intermittent conveying method, reduces the single-point dwell time, and reduces the requirements for the linear setting of the dispensing device or the interval opening and closing of the conveyor belt 1. It also reduces the linear wear requirements of the linear conveying device and lowers the equipment accuracy requirements, which is more conducive to the needs of mass production and is easier to operate. It only requires the synchronous conveying speed of the conveyor belt and the dispensing roller 2.

[0032] The dispensing roller 2 in this application can be driven directly by a motor, or indirectly by a motor driving a pulley, rack, or gear, as not shown in the figures in this application. The specific driving methods are not limited to the examples mentioned above. In order to reduce the wear error of indirect transmission, this application suggests using a direct motor drive, but it is not limited to this method. Therefore, no further technical details are provided here.

[0033] The glue supply ring includes a sealing ring 3, a glue supply tube 31, and a glue distribution tube 32. The sealing ring 3 is concentrically distributed with the glue dispensing roller 2 and fixedly connected to the suspension. The outer wall of the sealing ring 3 is in close contact with the hollow inner wall of the glue dispensing roller 2. There are several glue distribution tubes 32, which are evenly distributed along the length of the sealing ring 3. The glue supply tube 31 is connected to the liquid path of several glue distribution tubes 32 and extends out of the suspension to be connected to the liquid path of an external liquid pump. The glue distribution tubes 32 are correspondingly located directly below the glue dispensing roller 2. The liquid outlet of the glue distribution tube 32 is located between the sealing ring 3 and the hollow inner wall of the glue dispensing roller 2.

[0034] In the process of the operation of the dispensing roller 2, the dispensing device needs to be synchronized with the moving speed and position of the material plate on the conveying belt 1, so the dispensing roller 2 keeps rotating, and in this process, the container storing encapsulation glue outside is connected to the glue supply pipe 31 through a liquid pump to input encapsulation glue into the glue supply pipe 31, and the glue supply pipe 31 inputs the encapsulation glue into the glue distribution pipe 32, wherein the whole sealing ring 3 is fixedly connected with the suspension and is sealingly connected with the hollow inner wall of the dispensing roller 2, so the positions of the glue distribution pipe 32 and the glue supply pipe 31 arranged in the sealing ring 3 are also relatively fixed.

[0035] Therefore, when the dispensing device of the dispensing roller 2 does not correspond to the liquid outlet of the glue distribution pipe 32, the encapsulation glue in the glue distribution pipe 32 cannot be output at this time, and conversely, when the dispensing device corresponds to the liquid outlet of the glue distribution pipe 32, the encapsulation glue can be input into the dispensing device and the wafer can be dispensed and encapsulated.

[0036] The dispensing device includes a carrier plate 33 and dispensing heads 34, the number of the dispensing heads 34 is several and the dispensing heads 34 are uniformly arranged on the carrier plate 33, the dispensing roller 2 is provided with a pipe 35 connected with the hollow structure and the mounting groove 21, and the carrier plate 33 is connected with the corresponding pipe 35 and the dispensing heads 34 in liquid connection.

[0037] The carrier plate 33 is used for connecting the pipe 35 and the dispensing heads 34 and mounting the dispensing heads 34, wherein the dispensing heads 34 are detachably connected with the carrier plate 33, for example, quick-release joint connection or sealing plug connection, so different dispensing heads 34 can be replaced according to the size or spacing of the wafers on the specific material plate to meet different production needs, and of course, a one-way liquid discharge valve is arranged in the dispensing head 34 to avoid the dropping of encapsulation glue.

[0038] The primary cleaner is composed of a roller shaft 4, an electromagnet 41, a floating plate 42 and cleaning cotton 43, and is arranged above the dispensing roller 2, the roller shaft 4 is hollow and is rotatably arranged in the suspension, the electromagnet 41 is fixedly arranged on the suspension through a support and is located in the hollow structure of the roller shaft 4, the electromagnet 41 is provided with magnetic poles at the upper and lower ends, the roller shaft 4 is uniformly provided with a plurality of embedded grooves 44, the floating plate 42 is elastically and slidably arranged in the embedded groove 44 along the vertical axis direction of the roller shaft 4 and is withdrawn into the embedded groove 44 in the static state, the floating plate 42 is magnetically matched with the electromagnet 41, and the cleaning cotton 43 is arranged at one end of the floating plate 42 facing the dispensing roller 2.

[0039] To prevent impurities from adhering to the dispensing nozzle or the sealant from overflowing after multiple dispensing operations, which could affect subsequent dispensing processes, the roller shaft 4 will also operate synchronously during the rotation of the dispensing roller 2. The roller shaft 4 can be driven directly by an independent motor, and the running positions of several fitting slots 44 correspond to the mounting slots 21 of the dispensing roller 2. When the dispensing nozzle of the dispensing roller 2 approaches the roller shaft 4, the electromagnet 41 is energized and generates magnetic force. It is worth noting that the electromagnet 41 itself is fixed in the suspension by a bracket, so the position of the magnetic poles of the electromagnet 41 is relatively fixed. The magnetic force of the electromagnet 41 and the magnetic force of the float 42 are of the same pole. Therefore, under the repulsive force of the magnetic force, the float 42 will move away from the roller shaft 4 and push out the cleaning cotton 43. At this time, the cleaning cotton 43 will rotate with the roller shaft 4 and extend into the mounting slot 21 of the dispensing roller 2, thereby cleaning the dispensing head 34 in the mounting slot 21 through the cleaning cotton 43. The cleaning cotton 43 can be an industrial sponge or other materials with good water absorption and strength.

[0040] In this application, the engagement state of the mounting groove 21 of the primary cleaner and the dispensing roller 2 is similar to gear meshing. At the same time, the cleaning cotton 43 itself is extensible, thus ensuring effective cleaning and avoiding affecting the dispensing head 34. After cleaning, the float plate 42 also leaves the magnetic pole area of ​​the electromagnet 41. At this time, it can be reset by the elastic sliding action of the float plate 42 itself. The elastic sliding connection of the float plate 42 can be achieved by means such as springs or spring sheets set in the slide rail of the float plate 42 (not shown in the figure of this application). This is a common means of resetting sliding in the art, so it will not be described in detail.

[0041] The cleaning cotton 43 has evenly spaced recesses 45 corresponding to several dots of adhesive 34.

[0042] This makes it easier to clean the dispensing head 34.

[0043] Example 2: As Figs. 1-2 As shown in Figure 6, in a further improvement based on Embodiment 1, the suspension is also equipped with a secondary cleaner that matches the roller shaft 4. The secondary cleaner includes a suction roller 5 and a shielding ring 51. The suction roller 5 is a hollow roller that is rotatably mounted on the suspension. The hollow part of the suction roller 5 is connected to an external vacuum suction mechanism. The side of the suction roller 5 is evenly provided with several suction holes 52 that are connected to the hollow part. The shielding ring 51 is a notched ring that is slidably sealed inside the hollow part of the suction roller 5. The shielding ring 51 is fixedly connected to the suspension, and the notch of the shielding ring 51 faces the roller shaft 4.

[0044] The notch fan-shaped angle of the shielding ring 51 is 90°-160°.

[0045] Further, in order to avoid the situation that the cleaning cotton 43 is penetrated by the encapsulation glue after absorbing a large amount of the encapsulation glue, when the floating plate 42 moves to the upper side of the roller shaft 4, the upper magnetic pole of the electromagnet 41 is driven again, so that the cleaning cotton 43 extends out of the fitting groove 44 and is pressed between the glue absorption roller 5 and the roller shaft 4. The glue absorption roller 5 is also kept rotating by the external motor, and the rotating direction of the glue absorption roller 5 is opposite to that of the roller shaft 4. Therefore, the encapsulation glue in the cleaning cotton 43 can be squeezed out, and the excess encapsulation glue can be absorbed through the glue absorption hole 52 on the side of the glue absorption roller 5 by the external vacuum suction mechanism. In order to avoid that part of the encapsulation glue is adhered, a scraper can also be arranged on the side of the glue absorption roller 5 to prevent part of the encapsulation glue which is not sucked in time from returning to the cleaning cotton 43 again.

[0046] The shielding ring 51 is used to limit the suction area of the glue absorption roller 5, so that the area with the vacuum suction function always corresponds to the area where the glue absorption roller 5 and the roller shaft 4 press the cleaning cotton 43, so as to sufficiently improve the suction force.

[0047] The above embodiments only exemplarily illustrate the principles and effects of the present application, and are not used to limit the present application. Any person skilled in the art can modify or change the above embodiments without departing from the spirit and scope of the present application. Therefore, all equivalent modifications or changes completed by those skilled in the art without departing from the spirit and technical thought of the present application should be covered by the claims of the present application.

Claims

1. An automatic dispensing die bonding apparatus for diode packaging, comprising a conveyor belt and a suspension, the suspension being fixedly connected with an external support, characterized in that: The suspension is provided with a dispensing mechanism matched with the upper end surface of the conveying belt; The dispensing roller is a rotating shaft for mounting the dispensing device in the dispensing mechanism, is rotatably arranged on the suspension and close to the upper end of the conveying belt, and is a hollow structure; The dispensing device is a dispensing device in the dispensing mechanism, a plurality of mounting grooves are uniformly formed in the side of the dispensing roller, the dispensing device is composed of a dispensing head and a glue supply ring, the number of the dispensing head is the same as that of the mounting grooves and is arranged one by one, and the glue supply ring is arranged in the hollow area of the dispensing roller and matched with the plurality of dispensing heads; The first cleaner is a device for cleaning the dispensing mechanism, and is arranged on the upper side of the suspension and matched with the dispensing roller.

2. The apparatus according to claim 1, wherein the apparatus is used for the automatic dispensing and die bonding of diode package. The glue supply ring comprises a sealing ring, a glue supply pipe and a glue distribution pipe, the sealing ring is concentrically distributed with the dispensing roller and fixedly connected with the suspension, the outer wall of the sealing ring is sealingly connected with the hollow inner wall of the dispensing roller, the number of the glue distribution pipes is several and they are uniformly distributed along the length direction of the sealing ring, the glue supply pipe is connected with the plurality of glue distribution pipes in liquid path and extends out of the suspension to be connected with an external liquid pump in liquid path, the glue distribution pipes are arranged below the dispensing roller, and the liquid outlets of the glue distribution pipes are located between the sealing ring and the hollow inner wall of the dispensing roller.

3. The apparatus according to claim 1, wherein the apparatus is used for automatic dispensing and die bonding of diode package. The dispensing device comprises a carrier plate and a dispensing head, the number of the dispensing head is several and they are uniformly arranged on the carrier plate, the dispensing roller is provided with a pipeline connected with the hollow structure and the mounting groove, and the carrier plate connects the corresponding pipeline and the plurality of dispensing heads in liquid path.

4. The apparatus according to claim 1, wherein the apparatus is used for automatic dispensing and die bonding of diode package. The first cleaner is composed of a roller shaft, an electromagnet, a floating plate and cleaning cotton, the first cleaner is arranged above the dispensing roller, the roller shaft is hollow and rotatably arranged on the suspension, the electromagnet is fixedly arranged on the suspension through a support and located in the hollow structure of the roller shaft, the electromagnet is provided with magnetic poles at the upper and lower ends, the roller shaft is uniformly provided with a plurality of fitting grooves, the floating plate is elastically and slidingly arranged in the fitting grooves along the vertical roller shaft axis direction and is withdrawn into the fitting grooves in the static state, the floating plate is magnetically matched with the electromagnet, and the cleaning cotton is arranged at one end of the floating plate facing the dispensing roller.

5. The apparatus according to claim 4, wherein the apparatus is used for the automatic dispensing and die bonding of diode package. The cleaning cotton is uniformly provided with recessed holes corresponding to the plurality of dispensing heads.

6. The apparatus according to claim 4, wherein the apparatus is used for automatic dispensing and die bonding of diode package. The suspension is further provided with a second cleaner matched with the roller shaft, the second cleaner comprises a glue suction roller and a shielding ring, the glue suction roller is a hollow roller and is rotatably arranged on the suspension, the hollow part of the glue suction roller is communicated with an external vacuum suction mechanism, a plurality of glue suction holes communicated with the hollow part are uniformly formed in the side of the glue suction roller, the shielding ring is a notched ring and is slidingly and sealingly arranged in the hollow part of the glue suction roller, the shielding ring is fixedly connected with the suspension, and the notch of the shielding ring is correspondingly directed to the roller shaft.

7. The apparatus according to claim 6, wherein the apparatus is used for automatic dispensing and die bonding of diode package. The notch of the shielding ring has a fan angle of 90°-160°.

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