Advanced substrate grinding, positioning and conveying system

By designing a high-generation substrate grinding positioning and conveying system, the problem of removing powder and slurry during the grinding process was solved, achieving efficient positioning and cleaning of the substrate, ensuring that the substrate surface is free of scratches and contamination, and improving processing quality.

CN120901840APending Publication Date: 2025-11-07RAINBOW (HEFEI) LIQUID CRYSTAL GLASS CO LTD
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Patent Information

Application Number
CN202511231713.3
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-08-31
Publication Date
2025-11-07

AI Technical Summary

Technical Problem

In existing glass substrate grinding methods, the powder and grinding slurry generated during the grinding process are difficult to remove effectively, resulting in scratches on the substrate surface and contamination of subsequent processes.

Method used

A high-generation substrate grinding positioning and conveying system was designed. Through the coordinated operation of the positioning unit and the cleaning unit, the substrate can be scraped on both sides and cleaned by spraying liquid. Combined with the coordinated pick-and-place of the rotary table, it ensures that there are no blind spots in the cleaning process of the substrate.

Benefits of technology

This technology enables efficient simultaneous positioning and cleaning of the substrate, avoids residual polishing slurry, ensures a clean substrate surface, and improves processing efficiency and product yield.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention provides an advanced substrate grinding, positioning and conveying system which comprises a supporting table, a first rotating table is fixedly mounted at the top of the supporting table, a guide channel is fixedly mounted at the top of the first rotating table, two carrier plates are slidably mounted at the top of the guide channel, and loading units are assembled at the tops of the carrier plates; an edge grinding unit and a corner grinding unit are arranged on the two sides of the guide channel correspondingly, positioning units are assembled on the tops in the edge grinding unit and the corner grinding unit, a cleaning unit is assembled on the positioning units and the carrier plate jointly, a mounting opening is formed in the front face of the supporting table, and an extraction unit is assembled in the mounting opening. The positioning unit comprises a positioning plate, a guide plate and a lifting plate. The positioning unit and the cleaning unit cooperate with each other for synchronous operation, parallel operation of positioning and cleaning is achieved, and single-time machining time is saved; and double-sided scraping and liquid spraying cleaning on the substrate are formed, and grinding liquid residues are avoided.
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Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of glass substrate processing, in particular to a high-generation substrate grinding positioning conveying system. BACKGROUND

[0002] With the rapid development of electronic information technology, thin film transistor liquid crystal displays have been widely used in smart phones, tablet computers, televisions and other consumer electronic products. As the core component of TFT-LCD, the processing quality of liquid crystal display substrate directly determines the display performance and product yield of the final display screen.

[0003] In the production and manufacturing process of liquid crystal substrate, grinding is a crucial finishing process. The main purpose is to precisely polish the fragile edge and corner of the glass substrate to eliminate defects such as micro-cracks, edge collapse and stress concentration generated during cutting, thereby significantly improving the mechanical strength and anti-break performance of the substrate to meet the reliability requirements of subsequent transportation, assembly and application. Therefore, the grinding quality of the edge and corner of the substrate is one of the key indicators for evaluating the overall quality of the substrate.

[0004] However, the existing polishing method has the following defects: during the grinding process, whether it is the glass powder generated by mechanical grinding or the grinding slurry left by chemical mechanical polishing, a large amount of these grinding impurities will adhere to the surface of the glass substrate. If these grinding impurities are not removed in time and effectively, they will not only scratch the precise substrate surface, but also contaminate the subsequent process. SUMMARY

[0005] In view of the deficiencies of the prior art, the present application provides a high-generation substrate grinding positioning conveying system, which solves the problems mentioned in the background art.

[0006] To achieve the above purpose, the present application realizes the following technical scheme:

[0007] A high-generation substrate grinding positioning conveying system, comprising: a support table, a rotating table one is fixedly installed on the top of the support table, a guide channel is fixedly installed on the top of the rotating table one, two groups of carrier plates are slidably installed on the top of the guide channel, a loading unit is assembled on the top of the carrier plate, an edge polishing unit and a corner polishing unit are respectively arranged on the two sides of the guide channel, a positioning unit is assembled on the top of the edge polishing unit and the corner polishing unit, a cleaning unit is jointly assembled on the positioning unit and the carrier plate, an installation opening is arranged on the front of the support table, and an extraction unit is assembled in the installation opening.

[0008] The positioning unit comprises a positioning plate, a guide plate and a hanging plate, the hanging plate is slidably installed on the top of the machine table one and the machine table two, the guide plate for lifting is slidably installed on the front of the hanging plate, and the positioning plate is fixedly installed on the bottom of the guide plate. The positioning plate is used for clamping and positioning the glass substrate.

[0009] The cleaning unit comprises a lower cleaning assembly and an upper cleaning assembly, the top of the positioning plate is provided with the upper cleaning assembly, the bottom of the carrier plate is fixedly provided with two groups of lower cleaning assemblies, and the upper cleaning assembly and the lower cleaning assembly are in butt joint combination with each other;

[0010] The loading unit comprises a loading assembly one and a loading assembly two, the front and rear sides of the top of the carrier plate are provided with the loading assembly one, the two sides of the top of the carrier plate are provided with the loading assembly two, and the top of the loading assembly one and the loading assembly two are jointly provided with a glass substrate polishing device.

[0011] Further, the edge polishing unit comprises a machine table one and a polishing assembly one, one side of the guide channel is provided with the machine table one, the inside of the machine table one is provided with the polishing assembly one, and the polishing assembly one is used for linear polishing of the glass substrate.

[0012] The corner polishing unit comprises a machine table two and a polishing assembly two, the other side of the guide channel is provided with the machine table two, the machine table two is provided with the polishing assembly two, and the polishing assembly two is used for chamfer polishing of the glass substrate. The polishing assembly one and the polishing assembly two are the same in principle.

[0013] Further, the inside of the machine table one is fixedly provided with two groups of telescopic cylinders one, the output ends of the telescopic cylinders one are jointly fixedly provided with a side plate, the side plate is electrically slidably provided with a driving plate, the side surface of the driving plate is fixedly provided with a polishing machine, the front and rear sides of the polishing machine are fixedly provided with rubber baffles, the rubber baffles are provided with a butt joint for scraping the glass substrate, the bottom of the side surface of the side plate is fixedly provided with a collecting groove, and the bottom of the collecting groove is butt jointed and provided with a communicating water suction fan.

[0014] Further, the top of the guide channel is slidably provided with a guide seat one, the inside of the guide channel is fixedly provided with an electric sliding rail one for linear driving of the guide seat one, the top of the guide seat one is fixedly provided with a rotary table two, the bottom of the carrier plate is provided on the rotary end of the rotary table two, and the rotary table two drives the carrier plate to rotate.

[0015] Further, the extraction unit comprises a movable rod one, the inner wall of the mounting port is fixedly provided with an electric sliding rail two, the electric sliding rail two is electrically slidably provided with a guide seat two, the top of the guide seat two is fixedly provided with a movable seat, the inside of the movable seat is electrically rotatably provided with the movable rod one, the top of the movable rod one is electrically rotatably provided with two groups of movable rods three, the bottom of the movable rod three is electrically rotatably provided with a movable rod two, the movable rod two, the movable rod three and the movable rod one form an electric movable arm, the bottom of the movable rod two is fixedly provided with a suction disc, and the suction disc is used for adsorbing the glass substrate.

[0016] Further, the positioning unit further comprises a servo motor, the back surface of the hanging plate is fixedly installed with the servo motor, the output end of the servo motor penetrates through the hanging plate and is connected with the gear one, the inner side of the guide plate is fixedly installed with the rack one, and the rack one is meshed with the gear one; the top of the machine table one and the machine table two.

[0017] Further, the lower cleaning assembly comprises a lower mounting plate, a mounting sleeve, the front and rear sides of the bottom of the carrier plate are fixedly installed with the mounting sleeves, the inside of the mounting sleeve is connected with the extending push rod, the push rod is sleeved with the spring piece for buffering and resetting the push rod, the outer end of the push rod is fixedly installed with the lower mounting plate, the top of the lower mounting plate is fixedly connected with the lower rubber scraper, the lower mounting plate on the front and rear sides of the lower rubber scraper is provided with the connecting port, the outer side of the lower mounting plate is fixedly installed with the lower liquid spraying rod, and the port of the lower liquid spraying rod is inclined upward.

[0018] Further, the upper cleaning assembly comprises two groups of telescopic cylinders two and an upper mounting plate, the top of the positioning plate is fixedly installed with the two groups of telescopic cylinders two, the output ends of the telescopic cylinders two are fixedly connected with the upper mounting plate, the bottom of the upper mounting plate is fixedly connected with the upper rubber scraper, the front and rear sides of the bottom of the upper mounting plate are fixedly installed with the connecting rods, the connecting rods are connected with the connecting ports, the outer side of the upper mounting plate is fixedly installed with the upper liquid spraying rod, and the port of the upper liquid spraying rod is inclined downward.

[0019] Further, the loading assembly one comprises a suction rod, the front and back surfaces of the carrier plate are provided with the mounting ports, the front and rear sides of the top of the carrier plate are slidably installed with the suction rods, the suction rods are located above the mounting ports, the bottom of the suction rod is fixedly installed with the guide block extending into the mounting port, the bottom of the carrier plate is fixedly installed with the electric screw rod for driving the guide block.

[0020] The loading assembly two comprises a sliding rod, the top of the carrier plate is slidably installed with the sliding rods on the two sides, the top of the sliding rod is fixedly installed with three groups of supporting frames, the inner side of the sliding rod is fixedly installed with the rack two, the top of the carrier plate is rotatably installed with the gear two for driving the rack two, and the gear two is driven by the motor.

[0021] The application provides a high-generation substrate grinding positioning and conveying system.

[0022] 1. Through the cooperation between the positioning unit and the cleaning unit: when the positioning plate is pressed down, the connecting rod of the upper cleaning assembly is automatically inserted into the connecting port of the lower cleaning assembly, the parallel operation of positioning and cleaning is realized, the single processing time is saved, the mutual connection between the connecting rod and the connecting port is utilized, the synchronous connection in the positioning process is realized, the double-sided scraping and liquid spraying cleaning of the substrate are formed, the grinding liquid residue is avoided, the cooperation between the upper liquid spraying rod and the lower liquid spraying rod forms the cross spraying, the grinding liquid coverage area is expanded to the outside of the substrate edge, and the cleaning blind area is ensured to be free.

[0023] 2. The extraction unit and the rotating table 2 are cooperated to take and place: the suction cup of the extraction unit keeps vertical to the normal direction of the substrate when the rotating table 2 rotates, so as to avoid the attenuation of the suction force and ensure the stable grabbing of the substrate; the movable rod of the extraction unit is automatically turned down to the lowest position when the rotating table 1 rotates, so as to keep a safe distance from the rotating path of the guide channel. BRIEF DESCRIPTION OF DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0025] Figure 1 The overall structure of the present application is shown in the schematic diagram;

[0026] Figure 2 The structure of the conveying system of the present application is shown in the schematic diagram;

[0027] Figure 3 The structure of the extraction unit of the present application is shown in the schematic diagram;

[0028] Figure 4 The structure of the positioning unit of the present application is shown in the schematic diagram;

[0029] Figure 5 The structure of the positioning unit and the upper cleaning assembly of the present application is shown in the schematic diagram;

[0030] Figure 6 The structure of the loading unit and the lower cleaning assembly of the present application is shown in the schematic diagram;

[0031] Figure 7 The structure of the loading assembly 1 and the loading assembly 2 of the present application is shown in the schematic diagram;

[0032] Figure 8 The structure of the loading assembly 1 and the loading assembly 2 of the present application is shown in the schematic diagram;

[0033] Figure 9 The structure of the lower cleaning assembly of the present application is shown in the schematic diagram;

[0034] Figure 10 The structure of the polishing assembly of the present application is shown in the schematic diagram;

[0035] Shown in the figure: 100, support table; 101, mounting port;

[0036] 200, guide channel; 201, rotating table 1; 202, electric sliding rail 1;

[0037] 300, edge polishing unit; 301, machine table 1;

[0038] 310, polishing assembly one; 311, side plate; 312, telescopic cylinder one; 313, collecting groove; 314, water suction fan; 315, driving plate; 316, rubber baffle; 317, polisher;

[0039] 400, angle polishing unit; 401, machine table two; 410, polishing assembly two;

[0040] 500, carrier plate; 501, rotary table two; 502, mounting port; 503, guide seat one;

[0041] 600, extraction unit; 601, movable rod one; 602, electric sliding rail two; 603, guide seat two; 604, movable seat; 605, suction cup; 606, movable rod two; 607, movable rod three;

[0042] 700, positioning unit; 701, positioning plate; 702, rack one; 703, guide plate; 704, gear one; 705, servo motor; 706, hanging plate;

[0043] 800, cleaning unit;

[0044] 810, lower cleaning assembly; 811, lower mounting plate; 812, lower liquid spraying rod; 813, lower rubber scraper; 814, butt joint port; 815, mounting sleeve; 816, push rod; 817, spring member;

[0045] 820, upper cleaning assembly; 821, telescopic cylinder two; 822, upper liquid spraying rod; 823, upper rubber scraper; 824, butt joint rod; 825, upper mounting plate;

[0046] 900, loading unit;

[0047] 910, loading assembly one; 911, suction rod; 912, guide block; 913, electric screw;

[0048] 920, loading assembly two; 921, sliding rod; 922, support frame; 923, gear two; 924, rack two. DETAILED DESCRIPTION

[0049] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application are described clearly and completely. Obviously, the described embodiments are some but not all of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0050] EMBODIMENT

[0051] To solve the technical problems in the background art, the following high-generation substrate grinding positioning and conveying system is provided:

[0052] In combination Figures 1-10 As shown in the figure, the high-generation substrate grinding positioning and conveying system provided by the application comprises a support table 100, a rotating table 201 fixedly installed on the top of the support table 100, a guide channel 200 fixedly installed on the top of the rotating table 201, two groups of loading plates 500 slidably installed on the top of the guide channel 200, a loading unit 900 assembled on the top of the loading plate 500, an edge polishing unit 300 and an angle polishing unit 400 respectively arranged on the two sides of the guide channel 200, a positioning unit 700 assembled on the top of the edge polishing unit 300 and the angle polishing unit 400, a cleaning unit 800 jointly assembled on the positioning unit 700 and the loading plate 500, a mounting port 101 arranged on the front of the support table 100, and an extraction unit 600 assembled in the mounting port 101; the positioning unit 700 comprises a positioning plate 701, a guide plate 703, and a hanging plate 706, the hanging plate 706 is slidably installed on the top of a machine table 301 and a machine table 401, the guide plate 703 for lifting is slidably arranged on the front of the hanging plate 706, and the positioning plate 701 is fixedly installed on the bottom of the guide plate 703 and used for clamping and positioning the glass substrate; the cleaning unit 800 comprises a lower cleaning assembly 810 and an upper cleaning assembly 820, the upper cleaning assembly 820 is assembled on the top of the positioning plate 701, two groups of the lower cleaning assembly 810 are fixedly installed on the bottom of the loading plate 500, and the upper cleaning assembly 820 and the lower cleaning assembly 810 are mutually butted and combined; the loading unit 900 comprises a loading assembly 910 and a loading assembly 920, the loading assembly 910 is assembled on the front and rear sides of the top of the loading plate 500, the loading assembly 920 is assembled on the two sides of the top of the loading plate 500, and the top of the loading assembly 910 and the loading assembly 920 jointly arranges a polishing unit for polishing the glass substrate.

[0053] Through the mutual cooperation between the positioning unit 700 and the cleaning unit 800:

[0054] Synchronous operation: when the positioning plate 701 is pressed down, the butt joint rod 824 of the upper cleaning assembly 820 is automatically inserted into the butt joint port 814 of the lower cleaning assembly 810, realizing parallel operation of positioning and cleaning and saving single processing time;

[0055] Double-sided processing: through the mutual butt joint between the butt joint rod 824 and the butt joint port 814, synchronous butt joint in the positioning process is realized, forming double-sided scraping and liquid spraying cleaning of the substrate, and avoiding residual polishing liquid;

[0056] Gradient cleaning: the cooperation between the upper liquid spraying rod 822 and the lower liquid spraying rod 812 forms cross spraying, the polishing liquid coverage area is expanded to the outside of the substrate edge, and no cleaning blind area is ensured;

[0057] Extraction unit 600 and rotating table two 501

[0058] Cooperative taking and placing: the suction cup 605 of the extraction unit 600 remains perpendicular to the normal direction of the substrate when the rotating table two 501 rotates, avoiding attenuation of the suction force and ensuring stable grabbing of the substrate; interference-free design: when the rotating table one 201 rotates, the movable rod one 601 of the extraction unit 600 automatically flips down to the lowest position, maintaining a safe distance from the rotating path of the guide channel 200.

[0059] Loading unit 900 and electric slide rail one 202

[0060] The suction rod 911 and the slide rod 921 are compatible with the polishing size of the substrate, and do not need to manually replace the clamp.

[0061] In this embodiment, the edge polishing unit 300 includes a machine table one 301 and a polishing assembly one 310, the machine table one 301 is arranged on one side of the guide channel 200, the polishing assembly one 310 is arranged inside the machine table one 301, and the polishing assembly one 310 is used for linear polishing of the glass substrate.

[0062] The corner polishing unit 400 includes a machine table two 401 and a polishing assembly two 410, the machine table two 401 is arranged on the other side of the guide channel 200, the polishing assembly two 410 is arranged on the machine table two 401, and the polishing assembly two 410 is used for chamfer polishing of the glass substrate. The polishing assembly one 310 and the polishing assembly two 410 have the same principle.

[0063] Functional division: the edge polishing unit realizes linear polishing through the machine table one and the polishing assembly one, and the corner polishing unit realizes chamfer polishing through the machine table two and the polishing assembly two, forming a clear division of labor processing system.

[0064] Process adaptation: the polishing assembly one and the polishing assembly two have the same principle but different installation positions, and can realize diversified processing through unified control logic, reducing maintenance complexity.

[0065] Spatial reuse: the polishing unit is integrated on both sides of the guide channel, reducing the equipment floor area and improving the space utilization.

[0066] In this embodiment, two groups of telescopic cylinders one 312 are fixedly installed inside the machine table one 301, the output ends of the telescopic cylinders one 312 are jointly fixedly installed with a side plate 311, a driving plate 315 is electrically slidably installed on the side plate 311, a polishing machine 317 is fixedly installed on the side surface of the driving plate 315, rubber baffles 316 are fixedly installed on the front and rear sides of the polishing machine 317, and the rubber baffles 316 are provided with abutting interfaces for scraping the glass substrate. A collecting groove 313 is fixedly installed on the bottom of the side surface of the side plate 311, and a communicating water suction fan 314 is installed at the bottom of the collecting groove 313.

[0067] Dynamic collection: when the telescopic cylinder pushes the side plate forward, the collection groove moves synchronously under the base plate, and the waste liquid is extracted in real time by cooperating with the water suction fan to realize cleaning while polishing;

[0068] Protection design: the rubber baffle is attached to the edge of the base plate through the interface to prevent the grinding liquid from splashing, and at the same time, the travel of the polisher is limited to ensure the edge processing precision;

[0069] Flexible adjustment: the driving plate is electrically slid on the side plate, which can finely adjust the position of the polisher to adapt to the edge processing needs of different base plate sizes.

[0070] In this embodiment, the top of the guide channel 200 is slidably mounted with a guide seat one 503, the inside of the guide channel 200 is fixedly installed with an electric slide rail one 202 for linearly driving the guide seat one 503, the top of the guide seat one 503 is fixedly installed with a rotary table two 501, and the bottom of the carrier plate 500 is assembled to the rotating end of the rotary table two 501, and the rotary table two 501 drives the carrier plate 500 to rotate.

[0071] Two-dimensional driving: the guide seat one moves linearly through the electric slide rail one, and the rotary table two drives the carrier plate to rotate, forming a translation and rotation compound motion in the plane to meet the positioning needs of multi-surface polishing;

[0072] Path planning: the sliding structure of the guide channel cooperates with the electric slide rail to ensure seamless switching of the carrier plate between the polishing units and reduce the idle travel time;

[0073] Self-adaptive adjustment: the rotating end of the rotary table two is directly connected to the carrier plate to avoid transmission gap and improve positioning accuracy.

[0074] In this embodiment, the extraction unit 600 includes a movable rod one 601, the inner wall of the mounting port 101 is fixedly installed with an electric slide rail two 602, the electric slide rail two 602 is electrically slidably mounted with a guide seat two 603, the top of the guide seat two 603 is fixedly installed with a movable seat 604, the inside of the movable seat 604 is electrically and rotatably installed with the movable rod one 601, the top of the movable rod one 601 is electrically and rotatably installed with two groups of movable rods three 607, the bottom of the movable rod three 607 is electrically and rotatably installed with a movable rod two 606, the movable rod two 606, the movable rod three 607 and the movable rod one 601 form an electric movable arm, and the bottom of the movable rod two 606 is fixedly installed with a suction cup 605 for adsorbing the glass substrate.

[0075] Multi-joint cooperation: the movable rod one, the movable rod two and the movable rod three form an electric movable arm, which adjusts the spatial position of the suction cup through multi-axis linkage to adapt to the grasping needs of different heights and angles;

[0076] Flexible adsorption: the vacuum adsorption mode is adopted to avoid damage to the substrate surface caused by mechanical clamping, and the placement posture of the substrate is adjusted through the turning of the movable arm.

[0077] Modular installation: the combination of the electric sliding rail two and the guide base two allows the extraction unit to slide along the front surface of the support table, thereby expanding the operation range.

[0078] In this embodiment, the positioning unit 700 further comprises a servo motor 705, the back surface of the hanging plate 706 is fixedly installed with the servo motor 705, the output end of the servo motor 705 penetrates through the hanging plate 706 and is connected with the gear one 704, the inner side of the guide plate 703 is fixedly installed with the rack one 702, and the rack one 702 and the gear one 704 are in meshing connection; the top of the machine table one 301 and the machine table two 401.

[0079] Servo drive: the servo motor converts the rotary motion into the linear motion of the guide plate through the meshing transmission of the gear one and the rack one, thereby realizing the micron-level lifting precision of the positioning plate.

[0080] Closed-loop feedback: the rigid connection of the gear and the rack can realize real-time feedback of the position of the positioning plate, and the dynamic deviation correction is realized in cooperation with the control system.

[0081] Synchronous linkage: when the positioning plate is lowered, the docking rod of the cleaning unit is synchronously inserted into the docking port, thereby realizing the timing cooperation of the positioning and cleaning actions.

[0082] In this embodiment, the lower cleaning assembly 810 comprises a lower mounting plate 811 and a mounting sleeve 815, the front and rear sides of the bottom of the carrier plate 500 are fixedly installed with the mounting sleeve 815, the inside of the mounting sleeve 815 is connected with the extending push rod 816, the push rod 816 is sleeved with the spring member 817 for buffering and resetting the push rod 816, the outer end of the push rod 816 is fixedly installed with the lower mounting plate 811, the top of the lower mounting plate 811 is fixedly connected with the lower rubber scraper 813, the docking port 814 is arranged on the lower mounting plate 811 on the front and rear sides of the lower rubber scraper 813, the lower liquid spraying rod 812 is fixedly installed on the outer side of the lower mounting plate 811, and the port of the lower liquid spraying rod 812 is inclined upward.

[0083] Elastic contact: the push rod is connected with the mounting sleeve through the spring member, so that the lower rubber scraper is attached to the bottom surface of the substrate with flexible pressure, thereby avoiding hard scraping damage;

[0084] Directional liquid spraying: the port of the lower liquid spraying rod is inclined upward, so that the grinding liquid is uniformly sprayed to the bottom surface of the substrate, thereby assisting the scraper in cleaning;

[0085] Quick reset: the spring member automatically pushes the push rod to reset after cleaning is completed, thereby reducing mechanical wear and tear and improving the cycle efficiency.

[0086] In the embodiment, the upper cleaning assembly 820 comprises two groups of telescopic cylinders two 821, an upper mounting plate 825, the top of the positioning plate 701 is fixedly installed with two groups of telescopic cylinders two 821, the output ends of the telescopic cylinders two 821 are fixedly installed with the upper mounting plate 825 in common, the bottom of the upper mounting plate 825 is fixedly connected with an upper rubber scraper plate 823, the front and rear sides of the bottom of the upper mounting plate 825 are fixedly installed with butt joints 824, and the butt joints 824 and the butt joints 814 are mutually butted and matched, the outer side of the upper mounting plate 825 is fixedly installed with an upper liquid spraying rod 822, and the port of the upper liquid spraying rod 822 is inclined downward.

[0087] Double scraper cooperation: the upper rubber scraper plate and the lower rubber scraper plate form a superposition structure, synchronously scrape off the polishing liquid on the upper and lower surfaces of the substrate, and ensure double-side cleaning;

[0088] Dynamic butt joint: the cooperation of the butt joints and the butt joints enables the upper and lower cleaning assemblies to be automatically aligned when the positioning plate is lowered, without the need for additional calibration.

[0089] Anti-dripping design: the port of the upper liquid spraying rod is inclined downward, the polishing liquid is concentratedly sprayed on the action area of the scraper, and splashing is reduced.

[0090] In the embodiment, the loading assembly one 910 comprises suction rods 911, the front and back surfaces of the carrier plate 500 are provided with mounting ports 502, the front and rear sides of the top of the carrier plate 500 are slidably installed with the suction rods 911, and the suction rods 911 are located above the mounting ports 502; the bottom of the suction rod 911 is fixedly installed with a guide block 912 extending into the mounting port 502; and the bottom of the carrier plate 500 is fixedly installed with an electric lead screw 913 for driving the guide block 912.

[0091] The loading assembly two 920 comprises sliding rods 921, the top of the carrier plate 500 is slidably installed with the sliding rods 921 on both sides; the top of the sliding rod 921 is fixedly installed with three groups of support frames 922; the inner side of the sliding rod 921 is fixedly installed with a rack two 924; the top of the carrier plate 500 is rotatably installed with a gear two 923 for driving the rack two 924; and the gear two 923 is driven by a motor.

[0092] Multi-directional adjustment: the loading assembly one adjusts the spacing of the suction rods through the electric lead screw, and the loading assembly two adjusts the spacing of the sliding rods through the gear and the rack, so that two-dimensional self-adaptive clamping of the length and the width of the substrate is formed.

[0093] Flexible fixing: the suction rods fix the bottom of the substrate in a vacuum adsorption mode, and the support frames provide lateral support through sliding of the sliding rods, so that stress concentration is avoided.

[0094] Synchronous driving: the gear two is uniformly driven by the motor, so that the opposite movements of the sliding rods on both sides are synchronized, and the central positioning of the substrate is maintained.

[0095] Working principle and use process of the application:

[0096] S1, the carrier plate 500 needs to slide on the guide channel 200, and the middle position of the guide channel 200 is the loading position, which ensures that it cooperates with the extraction unit 600, starts the extraction unit 600, and drives the movable joint on the movable rod one 601, the movable rod three 607 and the movable rod two 606, drives the movable arm composed of the three to drive and adjust the suction cup 605, promotes the suction cup 605 to adsorb and extract the glass substrate to be polished, and places it on the loading assembly one 910 and the loading assembly two 920 through the overturning mode, and the front and rear sides of the bottom of the glass substrate are adsorbed and fixed through the suction rod 911. It is worth noting that when adsorbing and fixing, personnel can start the electric screw 913, the electric screw 913 drives the guide block 912, promotes the real-time adjustment of the distance between the suction rods 911, ensures that the length meets the bearing requirement of the glass substrate, and drives the rotation of the motor on the gear two 923, promotes the synchronous driving of the rack two 924 of the gear two 923 to move oppositely, promotes the opposite sliding of the slide rod 921 on the top of the carrier plate 500, and ensures that the width meets the bearing requirement of the glass substrate;

[0097] The carrier plate 500 is driven by the electric sliding rail one 202 to move linearly to the end of the guide channel 200, so that it enters the machine table one 301, and waits for the polishing work of the polishing assembly one 310;

[0098] S2, before polishing, the servo motor 705 drives the gear one 704 to rotate, drives the guide plate 703 through the rack one 702, promotes the guide plate 703 to descend, realizes that the positioning plate 701 at the bottom of the guide plate 703 presses and positions the glass substrate, and at the same time of descending, the connecting rod 824 is inserted into the connecting port 814, at this time, the upper rubber scraper 823 and the lower rubber scraper 813 respectively abut against the top surface and the bottom surface of the glass substrate, so that a shielding structure can be formed;

[0099] Start the telescopic cylinder one 312 to push the side plate 311, promote the side plate 311 to push the front end assembly, at this time, the collecting groove 313 moves to the lower side of the glass substrate, and the polisher 317 moves to one corner of the glass substrate first, so that the polishing can start from the edge of the glass substrate;

[0100] S3, when polishing, start the polisher 317 to move and polish the edge of the glass substrate, and when polishing, the lower liquid jet rod 812 and the upper liquid jet rod 822 are connected with the external polishing liquid pipe group, so that the lower liquid jet rod 812 and the upper liquid jet rod 822 can guide out by using the nozzles on them when polishing, so that the polishing liquid can assist the polisher 317 to polish the glass substrate, complete the polishing work of the edge of the glass substrate, and the waste liquid can enter the collection tank 313 and be discharged by the water suction fan 314;

[0101] S4, after polishing, start the telescopic cylinder two 821 to synchronously move the front end of the upper mounting plate 825 and the lower mounting plate 811, so that the upper rubber scraper 823 and the lower rubber scraper 813 on the upper mounting plate 825 and the lower mounting plate 811 can drive the glass substrate to be scraped, so that the polishing liquid on the glass substrate can be pushed out to ensure the cleanliness of the glass substrate during polishing, and after finishing, the guide plate 703 rises, the connecting rod 824 separates from the connecting port 814, the spring member 817 pushes the push rod 816 to reset, and the lower mounting plate 811 is synchronously reset;

[0102] After finishing, the sliding adjustment hanging plate 706 adjusts the positioning position of the positioning plate 701, and then starts the rotary table two 501 to drive the carrier plate 500 to rotate and switch the position of the glass substrate, and the other side of the glass is polished;

[0103] S5, start the rotary table one 201 to drive the guide channel 200 to rotate and switch positions, so that the edge of the glass substrate can enter the chamfer polishing process after being polished, so that it can enter the machine table two 401, and then polish the four corners of the glass substrate according to the above polishing process, and then the suction cup 605 can be used to extract it; It should be noted that when the rotary table one 201 rotates, the movable rod one 601 is lowered to the lowest state to avoid interference with the rotation of the guide channel 200.

[0104] It is to be noted that, in the present text, relational terms such as first and second and the like can be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can also include other elements not expressly listed or inherent to such process, method, article, or apparatus. An element proceeded by "comprises... a" does not, without more constraints, exclude the existence of additional identical elements in the process, method, article, or apparatus that comprises the element.

[0105] The above examples are merely used to illustrate the technical solutions of the present application, but not to limit it; although the present application has been described in detail with reference to the foregoing examples, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing examples, or make equivalent replacements for some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A high-generation substrate grinding positioning and conveying system, characterized in that, Include: Supporting table, the top of supporting table is fixedly installed with rotating table one, the top of rotating table one is fixedly installed with guide channel, two groups of loading plates are slidably installed on the top of guide channel, loading unit is assembled on the top of loading plate, edge polishing unit and corner polishing unit are respectively arranged on the two sides of guide channel, positioning unit is assembled on the top of edge polishing unit and corner polishing unit, cleaning unit is jointly assembled on loading plate and positioning unit, the front of supporting table is provided with mounting port, and extraction unit is assembled in mounting port; The positioning unit includes a positioning plate, a guide plate and a hanging plate, the top of the machine table one and the machine table two is slidably installed with the hanging plate, the front of the hanging plate is slidably installed with the guide plate for lifting, and the bottom of the guide plate is fixedly installed with the positioning plate for clamping and positioning the glass substrate; The cleaning unit includes a lower cleaning assembly and an upper cleaning assembly, the top of the positioning plate is assembled with the upper cleaning assembly, the bottom of the loading plate is fixedly installed with two groups of lower cleaning assemblies, and the upper cleaning assembly and the lower cleaning assembly are mutually butted and combined; The loading unit includes a loading assembly one and a loading assembly two, the front and rear sides of the top of the loading plate are assembled with the loading assembly one, the two sides of the top of the loading plate are assembled with the loading assembly two, and the top of the loading assembly one and the loading assembly two is jointly arranged for polishing the glass substrate.

2. A high generation substrate polishing positioning and transport system as defined in claim 1, wherein: The edge polishing unit includes a machine table one and a polishing assembly one, one side of the guide channel is arranged with the machine table one, the inside of the machine table one is assembled with the polishing assembly one, and the polishing assembly one is used for linear polishing of the glass substrate; The corner polishing unit includes a machine table two and a polishing assembly two, the other side of the guide channel is arranged with the machine table two, the machine table two is assembled with the polishing assembly two, and the polishing assembly two is used for chamfer polishing of the glass substrate, and the polishing assembly one and the polishing assembly two have the same principle.

3. A high generation substrate polishing positioning and transport system as defined in claim 2, wherein: The inside of the machine table one is fixedly installed with two groups of telescopic cylinders one, the output end of the telescopic cylinder one is fixedly installed with a side plate, the side plate is electrically slidably installed with a driving plate, the side surface of the driving plate is fixedly installed with a polishing machine, the front and rear sides of the polishing machine are fixedly installed with rubber baffles, the rubber baffles are provided with a butt joint for scraping the glass substrate, the bottom of the side surface of the side plate is fixedly installed with a collecting groove, and the bottom of the collecting groove is connected with a water suction fan.

4. A high generation substrate polishing positioning and transport system as defined in claim 2, wherein: The top of the guide channel is slidably installed with a guide seat one, the inside of the guide channel is fixedly installed with an electric sliding rail one for linear driving of the guide seat one, the top of the guide seat one is fixedly installed with a rotating table two, and the bottom of the loading plate is assembled with a rotating end of the rotating table two, and the rotating table two drives the loading plate to rotate.

5. A high generation substrate polishing positioning and transport system as claimed in claim 1, wherein: The inside wall of the mounting port is fixedly installed with an electric sliding rail two, the electric sliding rail two is electrically slidably installed with a guide seat two, the top of the guide seat two is fixedly installed with a movable seat, the inside of the movable seat is electrically rotatably installed with a movable rod one, the top of the movable rod one is electrically rotatably installed with two groups of movable rods three, the bottom of the movable rod three is electrically rotatably installed with a movable rod two, the movable rod two and the movable rod three and the movable rod one form an electric movable arm, the bottom of the movable rod two is fixedly installed with a suction disc for adsorbing the glass substrate.

6. A high generation substrate polishing positioning and transport system as claimed in claim 1, wherein: The positioning unit further comprises a servo motor, the back of the hanging plate is fixedly provided with the servo motor, the output end of the servo motor penetrates through the hanging plate and is connected with a gear one, the inner side of the guide plate is fixedly provided with a rack one, and the rack one is engaged with the gear one; the top of the machine table one and the machine table two.

7. A high generation substrate polishing positioning and transport system as claimed in claim 1 wherein: The lower cleaning assembly comprises a lower mounting plate, a mounting sleeve, the front and rear sides of the bottom of the carrier plate are fixedly provided with the mounting sleeves, the inside of the mounting sleeve is connected with a push rod extending out, a spring piece for buffering and resetting the push rod is sleeved on the push rod, the outer end of the push rod is fixedly provided with the lower mounting plate, the top of the lower mounting plate is fixedly connected with a lower rubber scraper, the lower mounting plate on the front and rear sides of the lower rubber scraper is provided with a connecting port, the outer side of the lower mounting plate is fixedly provided with a lower liquid injection rod, and the port of the lower liquid injection rod is inclined upward.

8. A high generation substrate polishing positioning and transport system as claimed in claim 7, wherein: The upper cleaning assembly comprises a telescopic cylinder two and an upper mounting plate, the top of the positioning plate is fixedly provided with two groups of telescopic cylinders two, the output end of the telescopic cylinder two is fixedly provided with the upper mounting plate, the bottom of the upper mounting plate is fixedly connected with an upper rubber scraper, the front and rear sides of the bottom of the upper mounting plate are fixedly provided with connecting rods, the connecting rods are connected with the connecting ports, the outer side of the upper mounting plate is fixedly provided with an upper liquid injection rod, and the port of the upper liquid injection rod is inclined downward.

9. A high generation substrate polishing positioning and transport system as claimed in claim 1, wherein: The loading assembly one comprises a suction rod, the front and back surfaces of the carrier plate are provided with mounting ports, the front and rear sides of the top of the carrier plate are slidably provided with the suction rods, the suction rods are located above the mounting ports, the bottom of the suction rod is fixedly provided with a guide block extending into the mounting port, the bottom of the carrier plate is fixedly provided with an electric screw rod for driving the guide block. The loading assembly two comprises a sliding rod, the top of the carrier plate is slidably provided with the sliding rods on both sides, the top of the sliding rod is fixedly provided with three groups of supporting frames, the inner side of the sliding rod is fixedly provided with a rack two, the top of the carrier plate is rotatably provided with a gear two for driving the rack two, and the gear two is driven by a motor.