A semiconductor lead frame processing equipment and product for expanding the bonding area

Abstract

This invention discloses a semiconductor lead frame processing equipment and product for expanding the bonding area, relating to the field of semiconductor lead frame technology. It includes: a moving unit, with a processing unit movably disposed at the top and a forming unit movably disposed at the bottom; the processing unit includes an arc-shaped plate, with clamping plates symmetrically fixedly connected to its sides; by pressing down the arc-shaped plate in conjunction with the movement of the wrapping film and support plate, residual plastic in the lead frame during injection molding can be eliminated. Furthermore, the movement and pressing down of the wrapping film and support plate further improve the surface quality and internal filling effect of the lead frame. The wrapping film and support plate protrude into the mold cavity and are vibrated at their top, further enhancing the filling and flow effects of the raised strips and concave areas, thus facilitating the forming of the raised strips and improving the overall strength of the lead frame.

Description

Technical Field

[0001] This invention relates to the field of semiconductor lead frame technology, and more particularly to a semiconductor lead frame processing equipment and product for expanding the bonding area. Background Technology

[0002] In high-precision leadframes, the limited number of solder pads often results in insufficient solder wire positions, which affects the use of the leadframe.

[0003] In existing technologies, injection molding is used to encapsulate solder pads, meeting the requirements of high-precision electronic devices. However, during the injection molding process, the injection gate leaves residue after molding, and existing leadframes lack sufficient strength to withstand the complex usage scenarios that follow. Therefore, improving the strength and surface quality of leadframes and expanding the soldering area are problems that need to be addressed in the development of leadframes. Summary of the Invention

[0004] The purpose of this section is to outline some aspects of embodiments of the present invention and to briefly describe some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be construed as limiting the scope of the invention.

[0005] To solve the above-mentioned technical problems, the present invention provides the following technical solution:

[0006] A semiconductor lead frame processing apparatus for expanding the bonding area, comprising:

[0007] A mobile unit, wherein a processing unit is movably disposed on the top of the mobile unit and a forming unit is movably disposed on the bottom of the mobile unit;

[0008] The processing unit includes an arc-shaped plate, with clamping plates symmetrically fixedly connected to the sides of the arc-shaped plate. The symmetrical clamping plates are fixedly connected to each other by connecting folding plates. A wrapping film is movably arranged between the arc-shaped plate and the connecting folding plate at its bottom, and a support plate is wrapped in the middle of the wrapping film.

[0009] The molding unit includes a bottom mold, an upper mold is snapped onto the top of the bottom mold, an outer frame sleeve is movably fitted on the outside of the upper mold, a wrapping film is movable on the top of the outer frame sleeve and the upper mold to flatten the injection surfaces of the outer frame sleeve and the top of the upper mold, and a support plate drives the wrapping film to press the outer frame sleeve closer to the bottom mold to squeeze the injection melt inside the upper mold and the bottom mold.

[0010] As a preferred embodiment of the semiconductor lead frame processing equipment and its product for expanding the bonding area described in this invention, wherein:

[0011] The processing unit also includes a top frame, which is fixedly connected to the top of the arc-shaped plate. The top of the arc-shaped plate is provided with a material inlet, and the top of the material inlet is connected to a material conveying pipe.

[0012] A clamping movable plate is movably provided on the outer side of the clamping fixed plate, and the clamping fixed plate and the clamping movable plate close to clamp the side of the wrapping film and the support plate.

[0013] As a preferred embodiment of the semiconductor lead frame processing equipment and its product for expanding the bonding area described in this invention, wherein:

[0014] The clamping fixed plate and the clamping moving plate are provided with mounting grooves on their opposite surfaces. A rolling roller is rotatably installed inside the mounting groove. A bolt is provided on the top surface of the clamping fixed plate. The bolt passes through the clamping moving plate and is threadedly connected to a nut.

[0015] The connecting folding plates are symmetrically arranged on the front and rear sides of the clamping plate. Several auxiliary wheel plates are provided on the opposite surfaces of the connecting folding plates and the arc plate. Rollers are rotatably embedded in the surface of the auxiliary wheel plates.

[0016] As a preferred embodiment of the semiconductor lead frame processing equipment and its product for expanding the bonding area described in this invention, wherein:

[0017] The bottom of the top frame is symmetrically fixedly connected to a frame plate. The front and rear sides of the frame plate are symmetrically rotated and arranged with take-up rollers. The central axis of the take-up roller passes through the frame plate and is fixedly connected to the output shaft of the take-up drive source. The take-up drive source is fixed to the surface of the frame plate. The front and rear sides of the wrapping film are respectively wound around the symmetrical take-up roller surfaces.

[0018] As a preferred embodiment of the semiconductor lead frame processing equipment and its product for expanding the bonding area described in this invention, wherein:

[0019] The two layers of wrapping film and the support plate constitute an isolation element, and the support plate is disposed in the middle of the two layers of wrapping film. An interface is provided in the middle of the support plate and the wrapping film, and the wrapping film is adhered to the surface of the support plate.

[0020] As a preferred embodiment of the semiconductor lead frame processing equipment and its product for expanding the bonding area described in this invention, wherein:

[0021] A vibration table is fixedly connected to the bottom of the top frame, and a vibration drive source is installed on the top of the vibration table. The output shaft of the vibration drive source passes through the vibration table and is fixedly connected to the drive gear. A driven gear is symmetrically meshed with the side of the drive gear. A middle frame is rotatably connected to the middle of the driven gear. The middle frame is fixedly connected to the bottom of the vibration table. A movable column is eccentrically installed on the outside of the driven gear. A transmission sleeve is sleeved on the outside of the movable column. A connecting rod is fixedly connected to the bottom of the transmission sleeve. A vibration head is fixedly connected to the bottom of the connecting rod. The vibration head is movably set on the top surface of the arc plate to impact the arc plate and generate vibration.

[0022] As a preferred embodiment of the semiconductor lead frame processing equipment and its product for expanding the bonding area described in this invention, wherein:

[0023] The molding unit also includes a stepped groove formed on the side of the bottom mold and surrounding the outer contour of the bottom mold. Several elastic elements are provided at the bottom of the stepped groove. The stepped groove is elastically connected to the outer frame through the elastic elements. The top surface of the outer frame is higher than the top surface of the upper mold.

[0024] As a preferred embodiment of the semiconductor lead frame processing equipment and its product for expanding the bonding area described in this invention, wherein:

[0025] The top of the upper mold has an opening;

[0026] The top of the upper mold is provided with an slanted opening, and the interior of the bottom mold is provided with a support frame.

[0027] As a preferred embodiment of the semiconductor lead frame processing equipment and its product for expanding the bonding area described in this invention, wherein:

[0028] The mobile unit includes a device frame, a top and bottom control source is mounted on the top of the device frame, the output shaft of the top and bottom control source is rotatably mounted on the surface of the device frame, a moving block is movably connected to the surface of the top and bottom control source, a second transmission shaft is horizontally arranged in the middle of the moving block, a connecting plate is movably connected to the middle of the second transmission shaft, and a top frame is fixedly connected to the bottom of the connecting plate.

[0029] A bottom control source is installed at the bottom of the equipment frame. The output shaft of the bottom control source passes through the equipment frame and is fixedly connected to the third transmission shaft. A placement plate is movably connected to the surface of the third transmission shaft. The bottom mold is set in the recess of the surface of the placement plate.

[0030] Another object of the present invention is to address the shortcomings of the prior art by providing a semiconductor lead frame product with an expanded bonding area, comprising the following steps:

[0031] The pad has a raised area on its top, and a shaped cup is wrapped around its outer side. The outer side of the bottom of the shaped cup has symmetrical raised strips, and the surface of the raised strips is wrapped with a foot. The middle of the bottom of the shaped cup has a concave area.

[0032] The beneficial effects of this invention are:

[0033] By pressing down the arc plate in conjunction with the movement of the wrapping film and support plate, residual plastic in the lead frame during injection molding can be eliminated. Furthermore, the movement and pressing down of the wrapping film and support plate will further improve the surface quality and internal filling effect of the lead frame. The protrusion of the wrapping film and support plate into the mold cavity and the vibration on its top can further enhance the filling and flow effect of the raised strips and concave areas, thereby facilitating the forming of the raised strips and improving the overall strength of the lead frame. Attached Figure Description

[0034] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below, wherein:

[0035] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0036] Figure 2 for Figure 1 A magnified structural diagram of part A in the middle;

[0037] Figure 3 This is a schematic diagram of the connection structure of the processing unit of the present invention;

[0038] Figure 4 for Figure 3 A magnified structural diagram of part B in the middle section;

[0039] Figure 5 This is a schematic diagram showing the connection between the processing unit and the molding unit of the present invention;

[0040] Figure 6 for Figure 5 An enlarged structural diagram of section C, where the separator is positioned between the connecting folded plate and the arc-shaped plate;

[0041] Figure 7 for Figure 6 An enlarged structural diagram of part D shows that the clamping moving plate and the clamping fixed plate are closed to clamp the wrapping film and the support plate.

[0042] Figure 8 This is a schematic diagram showing the internal structural connections between the processing unit and the molding unit;

[0043] Figure 9 for Figure 8An enlarged structural diagram of section E, where the isolation element is located at the bottom of the arc-shaped plate;

[0044] Figure 10 This is a schematic diagram showing the connection between the driving gear and the driven gear structure of the present invention;

[0045] Figure 11 This is a schematic diagram showing the connection between the movable column and the transmission sleeve of the present invention;

[0046] Figure 12 This is a schematic diagram of the lead frame structure connection of the present invention;

[0047] Figure 13 This is a schematic diagram of the side structure connection of the lead frame of the present invention.

[0048] In the picture:

[0049] 1. Moving unit; 101. Equipment frame; 1011. Upper and lower control source; 1012. Transfer axis one; 1013. Moving block; 102. Mounting plate; 1021. Lateral control source; 1022. Transfer axis two; 1023. Connecting plate; 103. Placement plate; 1031. Transfer axis three; 1032. Bottom control source;

[0050] 2. Processing Unit; 201. Top Frame; 202. Arc Plate; 2021. Injection Port; 2022. Clamping Fixed Plate; 2023. Clamping Moving Plate; 2024. Connecting Folding Plate; 20241. Auxiliary Wheel Plate; 2025. Mounting Slot; 2026. Rolling Roller; 203. Feed Pipe; 204. Frame Plate; 2041. Rewinding Drive Source; 2042. Rewinding Roller; 205. Isolator; 2051. Docking Interface; 2052. Wrapping Film; 2053. Support Plate; 206. Vibration Table; 2061. Vibration Drive Source; 2062. Drive Gear; 2063. Driven Gear; 20631. Movable Column; 2064. Constraint Plate; 2065. Middle Frame; 207. Vibration Head; 2071. Connecting Rod; 2072. Transmission Sleeve;

[0051] 3. Molding unit; 301. Outer frame; 302. Stepped groove; 303. Bottom mold; 304. Elastic element; 305. Upper mold; 3051. Angled opening; 306. Support frame;

[0052] 4. Pad; 401. Raised area; 402. Irregular cup; 403. Raised strip; 404. Concave area; 405. Foot wrap. Detailed Implementation

[0053] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention are described clearly and completely. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0054] Example 1: This embodiment is an example Figure 1 - Figure 11 As shown, a semiconductor lead frame processing apparatus for expanding the bonding area includes:

[0055] The moving unit 1 has a processing unit 2 movably disposed on its top and a forming unit 3 movably disposed on its bottom.

[0056] The processing unit 2 includes an arc-shaped plate 202, and clamping plates 2022 are symmetrically fixedly connected to the sides of the arc-shaped plate 202. The symmetrical clamping plates 2022 are fixedly connected to each other by connecting folding plates 2024. A wrapping film 2052 is movably arranged between the arc-shaped plate 202 and the connecting folding plate 2024 at its bottom. A support plate 2053 is wrapped in the middle of the wrapping film 2052.

[0057] The molding unit 3 includes a bottom mold 303, with an upper mold 305 snapped onto the top of the bottom mold 303. An outer frame sleeve 301 is movably sleeved on the outer side of the upper mold 305. A wrapping film 2052 is movable on the top of the outer frame sleeve 301 and the upper mold 305 to flatten the injection surfaces of the top of the outer frame sleeve 301 and the upper mold 305. The support plate 2053 drives the wrapping film 2052 to press the outer frame sleeve 301 closer to the bottom mold 303 to squeeze the injection melt inside the upper mold 305 and the bottom mold 303.

[0058] like Figure 1 - Figure 4 As shown, the processing unit 2 also includes a top frame 201, which is fixedly connected to the top of the arc plate 202. The top of the arc plate 202 is provided with an injection port 2021, and the top of the injection port 2021 is connected to a conveying pipe 203, which is connected to an external injection molding machine.

[0059] A clamping movable plate 2023 is movably provided on the outer side of the clamping fixed plate 2022. The clamping fixed plate 2022 and the clamping movable plate 2023 close and clamp the side of the wrapping film 2052 and the support plate 2053.

[0060] like Figure 5 - Figure 9As shown, the opposing surfaces of the clamping fixed plate 2022 and the clamping movable plate 2023 are each provided with a mounting groove 2025. A rolling roller 2026 is rotatably arranged inside the mounting groove 2025. A bolt is provided on the top surface of the clamping fixed plate 2022. The bolt passes through the clamping movable plate 2023 and is threadedly connected to a nut. Thus, through the design of the rolling roller 2026, after the clamping fixed plate 2022 and the clamping movable plate 2023 close and clamp the sides of the wrapping film 2052 and the support plate 2053, the wrapping film 2052 and the support plate 2053 can still move inside the clamping fixed plate 2022 and the clamping movable plate 2023.

[0061] The connecting folding plate 2024 is symmetrically arranged on the front and rear sides of the clamping plate 2022. The cross-sectional shapes of the connecting folding plate 2024, the arc plate 202, and the support plate 2053 are matched. Several auxiliary wheel plates 20241 are provided on the opposite surfaces of the connecting folding plate 2024 and the arc plate 202. Rollers are rotatably embedded on the surface of the auxiliary wheel plate 20241. The auxiliary wheel plate 20241 is preferably arranged at the bend of the connecting folding plate 2024 and the arc plate 202.

[0062] like Figure 1 - Figure 3 As shown, a frame plate 204 is symmetrically fixedly connected to the bottom of the top frame 201. A take-up roller 2042 is symmetrically rotatably arranged on the front and rear sides of the frame plate 204. The central axis of the take-up roller 2042 passes through the frame plate 204 and is fixedly connected to the output shaft of the take-up drive source 2041. The take-up drive source 2041 is fixed to the surface of the frame plate 204. The front and rear sides of the wrapping film 2052 are respectively wound around the symmetrical take-up roller 2042. The take-up drive source 2041 is preferably a servo motor and is controlled by a PLC. The shape of the take-up roller 2042 is preferably a symmetrical funnel shape or a cylindrical shape.

[0063] like Figure 5 - Figure 9 As shown, the two layers of wrapping film 2052 and support plate 2053 constitute the isolation member 205, and the support plate 2053 is disposed in the middle of the two layers of wrapping film 2052, so that the wrapping film 2052 wraps the support plate 2053. An interface 2051 is provided in the middle of the support plate 2053 and the wrapping film 2052, and the wrapping film 2052 is adhered to the surface of the support plate 2053.

[0064] By sandblasting the opposing surfaces of the two layers of wrapping film 2052, the outer surface of the wrapping film 2052 is made relatively smooth, forming a low coefficient of friction, while the back side is sandblasted to be rougher, which facilitates hot pressing after applying glue. The diameter of the interface 2051 is larger than the diameter of the injection port 2021. The winding length of the wrapping film 2052 is controlled by the winding drive source 2041, so that the interface 2051 moves to correspond to the bottom of the injection port 2021.

[0065] To reduce wrinkles in the wrapping film 2052 during its movement at the bottom of the curved plate 202, the support plate 2053 is positioned in the middle of the wrapping film 2052. The areas on either side of the wrapping film 2052 not wrapped with the support plate 2053 are wound around the surface of the take-up roller 2042. Adhesive is applied to the surface of the support plate 2053, and the wrapping film 2052 is then adhered to its surface. After being smoothed by a scraper and subjected to heat pressing, the support plate 2053 is wrapped around the middle of the two layers of wrapping film 2052. Finally, the wrinkle-free composite of the wrapping film 2052 and the support plate 2053 is installed onto two take-up rollers 2042. Between the rollers 2042, the wrapping film 2052 is preferably a glass fiber reinforced PTFE film, which allows it to work in an environment with a temperature of up to 260°C while meeting the requirements of the molding process. Moreover, PTFE itself has a relatively low coefficient of friction among known materials, which allows the wrapping film 2052 to move between the arc plate 202 and the connecting folding plate 2024. The support plate 2053 is preferably a thin steel plate, and the outer surfaces of the arc plate 202 and the connecting folding plate 2024 are wrapped with fluororubber with added PTFE, which reduces friction and also reduces accidental wear on the wrapping film 2052.

[0066] like Figure 5 and Figure 10 - Figure 11As shown, a vibration table 206 is fixedly connected to the bottom of the top frame 201. A vibration drive source 2061 is mounted on the top of the vibration table 206. The output shaft of the vibration drive source 2061 passes through the vibration table 206 and is fixedly connected to the drive gear 2062. A driven gear 2063 is symmetrically meshed with the side of the drive gear 2062. A middle frame 2065 is rotatably connected to the middle of the driven gear 2063. The middle frame 2065 is fixedly connected to the bottom of the vibration table 206. A movable column 20631 is eccentrically mounted on the outer side of the driven gear 2063. A transmission sleeve 2072 is fitted on the outer side of the plate 202. A connecting rod 2071 is fixedly connected to the bottom of the transmission sleeve 2072. A vibration head 207 is fixedly connected to the bottom of the connecting rod 2071. The vibration head 207 is movably disposed on the top surface of the arc plate 202 for impacting the arc plate 202 to generate vibration. The connecting rod 2071 slides through the bottom of the constraint plate 2064. The constraint plate 2064 is fixedly connected to the bottom of the vibration table 206. The vibration drive source 2061 is preferably a servo motor and controlled by a PLC. The driving gear 2062 and the driven gear 2063 are both preferably bevel gears.

[0067] like Figure 5 and Figure 8 As shown, the molding unit 3 further includes a stepped groove 302 formed on the side of the bottom mold 303 and surrounding the outer contour of the bottom mold 303. The bottom of the stepped groove 302 is provided with a plurality of elastic elements 304. The stepped groove 302 is elastically connected to the outer frame sleeve 301 through the elastic elements 304. The top surface of the outer frame sleeve 301 is higher than the top surface of the upper mold 305. The elastic element 304 is preferably a spring.

[0068] like Figure 5 and Figure 8 As shown, the top of the upper mold 305 has an opening, and the cross-section of the top opening of the upper mold 305 matches the contour of the cross-section of the arc plate 202, the wrapping film 2052 and the support plate 2053.

[0069] The upper mold 305 has a slanted opening 3051 at its top, and the bottom mold 303 has a support frame 306 inside.

[0070] It should be noted that the four corners of the upper mold 305 are connected to the round holes at the bottom of the lower mold 303 via guide pillars.

[0071] like Figure 1 and Figure 2As shown, the moving unit 1 includes a device frame 101. A vertical control source 1011 is mounted on the top of the device frame 101. The output shaft of the vertical control source 1011 is rotatably mounted on the surface of the device frame 101. A moving block 1013 is movably connected to the surface of the vertical control source 1011. A second transmission shaft 1022 is laterally arranged in the middle of the moving block 1013. A connecting plate 1023 is movably connected to the middle of the second transmission shaft 1022. A slide rail is provided on the side of the device frame 101. The surface of the slide rail is connected to the side plate through a slider. A horizontal control source 1021 is mounted on the surface of the side plate. The output shaft of the horizontal control source 1021 passes through the side and is rotatably connected to the second transmission shaft 1022, which facilitates the adjustment of the position of the connecting plate 1023. A top frame 201 is fixedly connected to the bottom of the connecting plate 1023.

[0072] The bottom of the equipment rack 101 is equipped with a bottom control source 1032. The output shaft of the bottom control source 1032 passes through the equipment rack 101 and is fixedly connected to the transfer shaft 1031. The surface of the transfer shaft 1031 is movably connected to a placement plate 103. The bottom mold 303 is set in a recess on the surface of the placement plate 103.

[0073] The upper and lower control source 1011, the lateral control source 1021, and the bottom control source 1032 are preferably servo motors and controlled by a PLC. The first transmission shaft 1012, the second transmission shaft 1022, and the third transmission shaft 1031 are preferably ball screws. The moving block 1013, the connecting plate 1023, and the placement plate 103 are preferably movably connected to the ball screw through a ball screw nut and a ball screw seat.

[0074] Operation process:

[0075] The bottom mold 303 is manually placed into the recess on the top surface of the placement plate 103, so that the bottom mold 303 snaps into the top surface of the placement plate 103. Then, the solder pad 4 to be processed is placed on the top of the support frame 306, so that the raised area 401 and the inner wall of the support frame 306 fit together to place the solder pad 4. Of course, the support frame 306 can also be designed as a round block, with a groove for the raised area 401 to be inserted on the top of the round block, which can also achieve placement. Then, the upper mold 305 is placed on top of the bottom mold 303. At this time, the placement plate 103 has not moved to the direct underside of the arc plate 202. After the bottom mold 303 and the upper mold 305 are closed, the bottom control source 1032 drives the transfer shaft 1031 to rotate. The transfer shaft 3 1031 drives the placement plate 103 to move below the arc plate 202, so that the top opening of the upper mold 305 is aligned with the bottom of the arc plate 202. Then, the upper and lower control source 1011 is activated, which drives the transfer shaft 1 1012 to rotate. The transfer shaft 1 1012 drives the moving block 1013 to move down. When the moving block 1013 moves down, it drives the transfer shaft 2 1022 and the connecting plate 1023 to move down. This causes the arc plate 202 connected to the top frame 201 at the bottom of the connecting plate 1023 to drive the isolation piece 205 to cover the top opening of the upper mold 305, so that the material conveying pipe 203 and the injection port 2021 are aligned with the middle of the upper mold 305.

[0076] Then start the injection molding machine or extruder connected to the external feed pipe 203, so that the molten plastic enters the internal space of the bottom mold 303 and the upper mold 305 through the feed pipe 203 and the injection port 2021. After injecting the preset amount of raw material, the raw material inside the bottom mold 303 and the upper mold 305 has not yet come into contact with the wrapping film 2052 of the support plate 2053. Then start the winding drive source 2041, so that the winding drive source 2041 on one side of the arc plate 202 rotates to wind up the wrapping film 2052, so that the arc plate On the other side of 202, the winding drive source 2041 reverses and releases the wrapping film 2052, thereby driving the wrapping film 2052 covering the support plate 2053 to pass through the bottom of the arc plate 202 through the winding wrapping film 2052, so that the interface 2051 opened on the surface of the wrapping film 2052 and the support plate 2053 is away from the injection port 2021, thereby cutting off the residual plastic bundles between the injection port 2021 and the bottom mold 303 and the upper mold 305, reducing the residual material on the surface of the subsequent lead frame and the burrs in the gate area;

[0077] The wrapping film 2052, with its relatively low coefficient of friction and non-stick properties compared to metal, does not excessively pull on the molten plastic inside the upper mold 305 when sliding on top of the upper mold 305. This maintains the relatively intact shape of the plastic on top of the upper mold 305, and a gap exists between the plastic on top of the upper mold 305 and the wrapping film 2052, further preventing unevenness caused by the wrapping film 2052 pulling on the plastic on top of the upper mold 305 during movement. The elastic material of the wrapping film 2052, relative to metal, can work with the support plate 2053 at the bottom of the curved plate 202 to seal the top of the upper mold 305. This sealing means that the opening at the top of the upper mold 305 is covered and sealed by the elastic wrapping film 2052 covering the support plate 2053, improving the sealing of the injection molding environment. Furthermore, the wrapping film 2052 covering the support plate 2053 in the middle can achieve a flexible-rigid-... The soft composite properties further reduce the wrinkles of the wrapping film 2052, allowing the wrapping film 2052 to be supported by the support plate 2053. At the same time, the wrapping film 2052 can slide more smoothly between the top of the upper mold 305 and between the arc plate 202 and the connecting folding plate 2024 due to its low coefficient of friction.

[0078] Both the curved plate 202 and the connecting folding plate 2024 are coated with PTFE powder-modified fluororubber. This reduces their own coefficient of friction and further reduces wear on the wrapping film 2052 during movement, allowing the wrapping film 2052 to be reused. The gap between the connecting folding plate 2024 and the front and rear ends of the curved plate 202 allows the connecting folding plate 2024 to also allow for friction on the bottom surface of the wrapping film 2052 during the movement of the wrapping film 2052 and the support plate 2053, while simultaneously constraining the wrapping film 2052 and the support plate 2053. Scraping is used to avoid plastic residue on the surface of the wrapping film 2052. In conjunction with regular manual cleaning of the surfaces of the connecting folding plate 2024 and the arc plate 202, and replacement of the isolation component 205, the stable operation of the equipment is ensured. The gap between the connecting folding plate 2024 and the arc plate 202 also ensures that the wrapping film 2052 and the support plate 2053 will not shift or wrinkle excessively during movement. The recycling of the isolation component 205 only requires replacing the reused wrapping film 2052, so that the new wrapping film 2052 is re-attached to the surface of the support plate 2053.

[0079] When the wrapping film 2052 moves the interface 2051 at the top of the support plate 2053 away from the upper mold 305, the support plate 2053 and the wrapping film 2052, which are not top-closed with the interface 2051, move to the top of the upper mold 305. Then, the upper and lower control source 1011 is activated, causing the upper and lower control source 1011 to drive the transmission shaft 1012 to rotate. This causes the transmission shaft 1012 to move the moving block 1013 and the connecting plate 1023 downward. During the downward movement of the connecting plate 1023, it will drive the arc plate 202 at its bottom to move downward. The downward movement of the arc plate 202 will drive the wrapping film 2052 and the support plate 2053, which are not at their bottoms with the interface 2051, to move downward. This will cause the wrapping film 2052 and the support plate 2053 to push the outer frame 30. 1. Moving towards the bottom of the stepped groove 302, thereby compressing the elastic element 304, and the downward movement of the wrapping film 2052 and the support plate 2053 will squeeze the plastic injected into the bottom mold 303 and the upper mold 305 downward, so that the plastic originally injected into the part of the outer frame sleeve 301 protruding from the upper mold 305 is compressed. In the compression, the molten plastic can fully fill the bottom space of the wrapping film 2052 and the support plate 2053, and the molten plastic can flow along the arc of the support plate 2053 and the wrapping film 2052 to the outside of the support plate 2053. After the molten plastic cools on the outside of the bottom of the wrapping film 2052 and the support plate 2053, it forms a raised strip 403, and after cooling in the middle of its bottom, it forms a concave area 404.

[0080] During the pressing process of the wrapping film 2052 and the support plate 2053, the molten plastic can be forced to fill the gaps inside the upper mold 305 and the lower mold 303, eliminating insufficient filling. The protruding strip 403 formed by extrusion further improves the overall structural strength and resistance to bending and torsion of the lead frame due to its thickness. During the pressing process of the wrapping film 2052 and the support plate 2053, the bevel 3051, along with the pressing of the outer frame sleeve 301, scrapes and guides the residual molten plastic on the inner surface of the outer frame sleeve 301, thereby reducing the residue of residual molten plastic on the inner surface of the outer frame sleeve 301.

[0081] After the wrapping film 2052 and the support plate 2053 have moved down, the vibration drive source 2061 is activated. The vibration drive source 2061 drives the drive gear 2062 to rotate, which in turn drives the two driven gears 2063 to rotate. The rotation of the driven gears 2063 causes the movable column 20631 to rotate eccentrically. The movable column 20631 moves with the driven gears 2063 inside the transmission sleeve 2072, thereby causing the movable column 20631 to drive the transmission sleeve 2072 to move up and down. This causes the transmission sleeve 2072 to drive the connecting rod 2071 and the vibrating head 207 to reciprocate up and down on the top of the arc plate 202, thus causing the vibrating head 207 to move up and down. The 07 intermittently impacts the top of the arc plate 202, causing the arc plate 202 to vibrate. This further vibrates and flattens the plastic inside the upper mold 305 and the bottom mold 303. The arc plate 202 and the wrapping film 2052 are recessed into the interior of the upper mold 305 to form a concave area 404. This allows the vibration of the vibrating head 207 to penetrate more fully into the interior of the mold cavity, that is, the interior space of the upper mold 305 and the bottom mold 303. This makes the material distribution inside the mold cavity more uniform. Furthermore, it can locally enhance the vibration at the concave area 404 and the raised strip 403, thereby improving the fluidity and filling effect of the molten plastic in that area.

[0082] After the pressing is completed and cooled, the lead frame is initially formed inside the bottom mold 303 and the upper mold 305. Then, the arc plate 202 is moved away from the top of the upper mold 305, so that the lead frame can be demolded inside the upper mold 305.

[0083] In summary:

[0084] By pressing down the arc plate 202 in conjunction with the movement of the wrapping film 2052 and the support plate 2053, residual plastic in the lead frame during injection molding can be eliminated. Furthermore, the movement and pressing down of the wrapping film 2052 and the support plate 2053 further improve the surface quality and internal filling effect of the lead frame. The protrusion of the wrapping film 2052 and the support plate 2053 into the mold cavity and the vibration on their tops can further enhance the filling and flow effects of the raised strip 403 and the concave area 404, thereby facilitating the molding of the raised strip 403 and improving the overall strength of the lead frame.

[0085] Example 2: This implementation is as follows Figure 12 - Figure 13 As shown, this embodiment provides a semiconductor lead frame product with an expanded bonding area, comprising:

[0086] The solder pad 4 has a raised area 401 on its top and a shaped cup 402 wrapped around its outer side. The shaped cup 402 is preferably made of epoxy molding compound. Raised strips 403 are symmetrically arranged on the outer side of the bottom of the shaped cup 402. The surface of the raised strips 403 is wrapped with a foot 405. In subsequent processing, a character groove is also provided in the middle of the surface of the raised strips 403 to facilitate individual product differentiation. A concave area 404 is provided in the middle of the bottom of the shaped cup 402. The middle of the concave area 404 is the injection molding area. The concavity of the concave area 404 facilitates the flatness of its injection gate area, while the protrusion of the raised strips 403 helps to strengthen the strength of the lead frame. The raised area 401 increases the soldering range of the solder pad 4.

Claims

1. A semiconductor lead frame processing device for expanding the bonding area, characterized in that, include: A moving unit (1) is provided with a processing unit (2) on its top and a forming unit (3) on its bottom. The processing unit (2) includes an arc-shaped plate (202), and clamping plates (2022) are symmetrically fixedly connected to the side of the arc-shaped plate (202). The symmetrical clamping plates (2022) are fixedly connected to each other by connecting folding plates (2024). A wrapping film (2052) is movably arranged between the arc-shaped plate (202) and the connecting folding plate (2024) at its bottom. A support plate (2053) is wrapped in the middle of the wrapping film (2052). The molding unit (3) includes a bottom mold (303), an upper mold (305) is snapped onto the top of the bottom mold (303), an outer frame sleeve (301) is movably sleeved on the outside of the upper mold (305), and a wrapping film (2052) is movable on the top of the outer frame sleeve (301) and the upper mold (305) to flatten the injection surfaces of the top of the outer frame sleeve (301) and the upper mold (305), and the support plate (2053) drives the wrapping film (2052) to press the outer frame sleeve (301) closer to the bottom mold (303) to squeeze the injection melt inside the upper mold (305) and the bottom mold (303); The processing unit (2) also includes a top frame (201), which is fixedly connected to the top of the arc plate (202). The top of the arc plate (202) is provided with a material inlet (2021), and the top of the material inlet (2021) is connected to a material conveying pipe (203). A clamping movable plate (2023) is movably provided on the outside of the clamping fixed plate (2022). The clamping fixed plate (2022) and the clamping movable plate (2023) close and clamp the sides of the wrapping film (2052) and the support plate (2053). The clamping fixed plate (2022) and the clamping moving plate (2023) are provided with mounting grooves (2025) on their opposite surfaces. A rolling roller (2026) is rotatably installed inside the mounting groove (2025). A bolt is provided on the top surface of the clamping fixed plate (2022). The bolt passes through the clamping moving plate (2023) and is threadedly connected to a nut. The connecting folding plate (2024) is symmetrically arranged on the front and rear sides of the clamping plate (2022). Several auxiliary wheel plates (20241) are provided on the opposite surfaces of the connecting folding plate (2024) and the arc plate (202). Rollers are rotatably embedded in the surface of each auxiliary wheel plate (20241). A frame plate (204) is symmetrically fixedly connected to the bottom of the top frame (201). A winding roller (2042) is symmetrically rotatably arranged on the front and rear sides of the frame plate (204). The central axis of the winding roller (2042) passes through the frame plate (204) and connects to the winding drive source (2041). The output shaft is fixedly connected, the winding drive source (2041) is fixed to the surface of the frame plate (204), and the front and rear sides of the wrapping film (2052) are respectively wound around the symmetrical surface of the winding roller (2042); the two layers of wrapping film (2052) and the support plate (2053) constitute the isolation member (205), and the support plate (2053) is disposed in the middle of the two layers of wrapping film (2052). The support plate (2053) and the wrapping film (2052) have a connecting interface (2051) in the middle, and the wrapping film (2052) is adhered to the surface of the support plate (2053).

2. The semiconductor lead frame processing equipment for expanding the bonding area as described in claim 1, characterized in that: A vibration table (206) is fixedly connected to the bottom of the top frame (201). A vibration drive source (2061) is installed on the top of the vibration table (206). The output shaft of the vibration drive source (2061) passes through the vibration table (206) and is fixedly connected to the drive gear (2062). A driven gear (2063) is symmetrically meshed with the side of the drive gear (2062). A middle frame (2065) is rotatably connected to the middle of the driven gear (2063). The middle frame (2065) is fixedly connected to... Attached to the bottom of the vibration table (206), a movable column (20631) is eccentrically mounted on the outer side of the driven gear (2063). A transmission sleeve (2072) is sleeved on the outer side of the movable column (20631). A connecting rod (2071) is fixedly connected to the bottom of the transmission sleeve (2072). A vibration head (207) is fixedly connected to the bottom of the connecting rod (2071). The vibration head (207) is movably disposed on the top surface of the arc plate (202) for impacting the arc plate (202) to generate vibration.

3. The semiconductor lead frame processing equipment for expanding the bonding area as described in claim 2, characterized in that: The molding unit (3) further includes a stepped groove (302) opened on the side of the bottom mold (303) and surrounding the outer contour of the bottom mold (303). The bottom of the stepped groove (302) is provided with a plurality of elastic elements (304). The stepped groove (302) is elastically connected to the outer frame sleeve (301) through the elastic elements (304). The top surface of the outer frame sleeve (301) is higher than the top surface of the upper mold (305).

4. The semiconductor lead frame processing equipment for expanding the bonding area as described in claim 3, characterized in that: The top of the upper mold (305) has an opening; The upper mold (305) has a slanted opening (3051) at its top, and the bottom mold (303) has a support frame (306) inside.

5. The semiconductor lead frame processing equipment for expanding the bonding area as described in claim 4, characterized in that: The mobile unit (1) includes a device frame (101), a top and bottom control source (1011) is mounted on the top of the device frame (101), the output shaft of the top and bottom control source (1011) is rotatably mounted on the surface of the device frame (101), a moving block (1013) is movably connected to the surface of the top and bottom control source (1011), a second transmission shaft (1022) is horizontally arranged in the middle of the moving block (1013), a connecting plate (1023) is movably connected to the middle of the second transmission shaft (1022), and a top frame (201) is fixedly connected to the bottom of the connecting plate (1023). The bottom of the equipment rack (101) is equipped with a bottom control source (1032). The output shaft of the bottom control source (1032) passes through the equipment rack (101) and is fixedly connected to the transfer shaft three (1031). The surface of the transfer shaft three (1031) is movably connected to a placement plate (103). The bottom mold (303) is set in the recess on the surface of the placement plate (103).

6. A semiconductor lead frame product with an enlarged bonding area, applied to the semiconductor lead frame processing equipment with an enlarged bonding area as described in any one of claims 1-5, characterized in that, include: The pad (4) has a raised area (401) on its top. The pad (4) is wrapped with a shaped cup (402) on its outer side. The shaped cup (402) has raised strips (403) symmetrically arranged on the outer side of its bottom. The raised strips (403) are wrapped with a foot (405) on their surface. The shaped cup (402) has a concave area (404) in the middle of its bottom.

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