Protective MOS tube

Abstract

The utility model discloses a protective MOS tube, and relates to the technical field of MOS tubes. Comprising an MOS tube main body, the back surface of the MOS tube main body is provided with an assembly groove, a metal protection sheet is clamped through the assembly groove, the metal protection sheet is provided with a strip-shaped clamping groove, the MOS tube main body comprises a plastic package shell, a lead frame and an MOS chip, the lead frame is installed in the plastic package shell, and the MOS chip is welded on a bonding pad of the lead frame. According to the protection type MOS tube, when the protection type MOS tube needs to be transported or carried, the metal protection sheets are detached from the assembling grooves and clamped at the pins under the action of the strip-shaped clamping grooves, the stress surface is increased, the structural strength of the pins is improved, and therefore the protection effect is achieved, and when the protection type MOS tube is used, the metal protection sheets are detached from the pins and reassembled into the assembling grooves, so that the metal protection sheets are not damaged. And the heat-conducting copper sheet is attached to the heat-conducting copper sheet, so that the heat dissipation area can be enlarged, heat convection can be accelerated, efficient heat dissipation can be realized, and stable work of the MOS tube can be ensured.

Description

Technical Field

[0001] This utility model relates to the field of MOSFET technology, specifically a protective MOSFET. Background Technology

[0002] MOSFET, or Insulating Field-Effect Transistor in integrated circuits, has multiple functions, such as switching and blocking. In general electronic circuits, MOSFETs are usually used in amplifier circuits or switching circuits. The use of MOSFETs has brought great convenience to electronic devices. MOSFETs are commonly used in various electronic products such as inverters, solar controllers, electronic transformers, and power adapters.

[0003] However, existing MOSFETs have the following drawbacks: the leads of most MOSFETs are exposed, making them susceptible to compression or bending due to external forces during transportation or carrying, which affects their normal use and reduces their lifespan. Therefore, it is necessary to improve existing MOSFETs. Utility Model Content

[0004] This invention provides a protective MOSFET to solve the problems in the prior art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a protective MOSFET, comprising a MOSFET body, wherein a mounting groove is provided on the back of the MOSFET body, and a metal protective sheet is snapped into place through the mounting groove, and the metal protective sheet is provided with a strip-shaped locking groove; the MOSFET body comprises a plastic encapsulation shell, a lead frame, and a MOSFET chip, wherein the lead frame is installed in the plastic encapsulation shell, the MOSFET chip is soldered to the pads of the lead frame, the lead frame is provided with pins, and a thermally conductive copper sheet is embedded on the back of the plastic encapsulation shell, and one side of the thermally conductive copper sheet is in contact with the lead frame.

[0006] Furthermore, the upper part of the MOS transistor body is provided with a through hole, and the top of the metal protective sheet is provided with a notch, and the notch corresponds to the position of the through hole.

[0007] Furthermore, the upper part of the assembly groove is provided with finger positions, and the finger positions are located on both sides of the assembly groove.

[0008] Furthermore, the positions of the strip-shaped slots correspond one-to-one with the pins, and the bottom of the strip-shaped slots is provided with positioning sockets.

[0009] Furthermore, the pins are provided at least three, and the pins extend outward from the inner wall of the plastic-encapsulated housing.

[0010] Furthermore, one side of the heat-conducting copper sheet is flush with the bottom of the mounting groove and adheres to the back of the metal protective sheet.

[0011] Compared with the prior art, this utility model provides a protective MOSFET, which has the following advantages:

[0012] When transporting or carrying this protective MOSFET, the metal protective plate is removed from the mounting groove and secured to the pin by the strip-shaped locking groove, increasing the force-bearing surface and improving the structural strength of the pin, thus achieving a protective effect. When in use, the metal protective plate is removed from the pin and reinstalled into the mounting groove, where it is attached to the heat-conducting copper plate. This expands the heat dissipation area, accelerates heat convection, achieves efficient heat dissipation, and ensures the stable operation of the MOSFET. Attached Figure Description

[0013] Figure 1 This is a rear view of the present invention;

[0014] Figure 2 This is a side sectional view of the present invention;

[0015] Figure 3 This is a front view of the present invention.

[0016] In the diagram: 1. MOSFET body; 11. Plastic encapsulation shell; 12. Lead frame; 13. MOSFET chip; 14. Pin; 15. Thermally conductive copper sheet; 2. Assembly groove; 3. Metal protective sheet; 4. Strip-shaped slot; 5. Through hole; 6. Notch; 7. Finger position; 8. Positioning socket. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0018] Please see Figures 1-3 This utility model discloses a protective MOSFET, including a MOSFET body 1. The back of the MOSFET body 1 is provided with an assembly groove 2, and a metal protective sheet 3 is snapped into place through the assembly groove 2. The metal protective sheet 3 is provided with a strip-shaped locking groove 4. When it is necessary to transport or carry, the metal protective sheet 3 is removed from the assembly groove 2 and is snapped into place at the pin 14 by the strip-shaped locking groove 4, thereby increasing the force-bearing surface and improving the structural strength at the pin 14, thus achieving a protective effect. When in use, the metal protective sheet 3 is removed from the pin 14 and reinstalled into the assembly groove 2, and is attached to the heat-conducting copper sheet 15, which can expand the heat dissipation area, accelerate heat convection, achieve efficient heat dissipation, and ensure the stable operation of the MOSFET.

[0019] The MOS transistor body 1 includes a plastic encapsulation shell 11, a lead frame 12, and a MOS chip 13. The lead frame 12 is installed in the plastic encapsulation shell 11, and the MOS chip 13 is soldered to the pads of the lead frame 12. The lead frame 12 is provided with pins 14. A thermally conductive copper sheet 15 is embedded on the back of the plastic encapsulation shell 11, and one side of the thermally conductive copper sheet 15 is in contact with the lead frame 12.

[0020] Specifically, the upper part of the MOS transistor body 1 is provided with a through hole 5, and the top of the metal protective sheet 3 is provided with a notch 6, and the notch 6 corresponds to the position of the through hole.

[0021] In this implementation scheme, the through hole 5 is mainly for facilitating vertical fixation, and the notch 6 is an orientation design to avoid structural interference.

[0022] Specifically, the upper part of the assembly groove 2 is provided with finger positions 7, and the finger positions 7 are located on both sides of the assembly groove 2.

[0023] In this embodiment, the finger position 7 is mainly designed to facilitate the user to remove the metal protective plate 3 from the assembly groove 2.

[0024] Specifically, the positions of the strip slot 4 and the pin 14 correspond one-to-one, and the bottom of the strip slot 4 is provided with a positioning socket 8.

[0025] In this embodiment, the metal protective sheet 3 is secured to the pin 14 by the strip-shaped slot 4, increasing the force-bearing surface and improving the structural strength of the pin 14, thereby achieving a protective effect.

[0026] Specifically, at least three pins 14 are provided, and the pins 14 extend outward from the inner wall of the plastic-encapsulated housing 11.

[0027] In this embodiment, the lead frame 12 serves as the chip carrier of the integrated circuit. It is a key structural component that uses bonding materials (gold wire, aluminum wire, copper wire) to realize the electrical connection between the internal circuit leads of the chip and the external leads, forming an electrical circuit. It acts as a bridge to connect with external wires. The pins 14 are slender metal strips on the lead frame 12 that extend from inside the MOS transistor and are used to connect with external circuits.

[0028] Specifically, one side of the heat-conducting copper sheet 15 is flush with the bottom of the mounting groove 2 and is in contact with the back of the metal protective sheet 3.

[0029] In this embodiment, the thermally conductive copper sheet 15 is a metal material with excellent thermal conductivity, which can quickly conduct heat away, thereby preventing the chip from overheating, ensuring the normal operation of the chip and extending its service life.

[0030] When in use, the metal protective sheet 3 is removed from the assembly groove 2 and secured to the pin 14 by the strip-shaped locking groove 4, increasing the force-bearing surface and improving the structural strength of the pin 14, thereby achieving a protective effect. When in use, the metal protective sheet 3 is removed from the pin 14 and reinstalled into the assembly groove 2, and it is attached to the heat-conducting copper sheet 15, which can expand the heat dissipation area, accelerate heat convection, achieve efficient heat dissipation, and ensure the stable operation of the MOSFET.

[0031] In summary, when this protective MOSFET needs to be transported or carried, the metal protective sheet 3 is removed from the mounting groove 2 and secured at the pin 14 by the strip-shaped locking groove 4, increasing the force-bearing surface and improving the structural strength of the pin 14, thereby achieving a protective effect. When in use, the metal protective sheet 3 is removed from the pin 14, reinstalled into the mounting groove 2, and attached to the heat-conducting copper sheet 15, which can expand the heat dissipation area, accelerate heat convection, achieve efficient heat dissipation, and ensure the stable operation of the MOSFET.

[0032] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A protective MOSFET, comprising a MOSFET body (1), characterized in that: The back of the MOS transistor body (1) is provided with an assembly groove (2), and a metal protective sheet (3) is snapped into place through the assembly groove (2). The metal protective sheet (3) is provided with a strip-shaped slot (4). The MOS transistor body (1) includes a plastic encapsulation shell (11), a lead frame (12), and a MOS chip (13). The lead frame (12) is installed in the plastic encapsulation shell (11), and the MOS chip (13) is soldered to the pads of the lead frame (12). The lead frame (12) is provided with pins (14). A thermally conductive copper sheet (15) is embedded on the back of the plastic encapsulation shell (11), and one side of the thermally conductive copper sheet (15) is in contact with the lead frame (12).

2. The protective MOSFET according to claim 1, characterized in that: The upper part of the MOS transistor body (1) is provided with a through hole (5), and the top of the metal protective sheet (3) is provided with a notch (6), and the notch (6) corresponds to the position of the through hole.

3. A protective MOSFET according to claim 1, characterized in that: The upper part of the assembly groove (2) is provided with a finger position (7), and the finger position (7) is located on both sides of the assembly groove (2).

4. A protective MOSFET according to claim 1, characterized in that: The positions of the strip slot (4) and the pin (14) are in one-to-one correspondence, and the bottom of the strip slot (4) is provided with a positioning socket (8).

5. A protective MOSFET according to claim 1, characterized in that: The pins (14) are provided with at least 3 pins, and the pins (14) extend outward from the inner wall of the plastic-encapsulated shell (11).

6. A protective MOSFET according to claim 1, characterized in that: One side of the heat-conducting copper sheet (15) is flush with the bottom of the mounting groove (2) and fits against the back of the metal protective sheet (3).

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