Ultrahigh-precision magnetron sputtering angle control method and system

Abstract

The invention belongs to the technical field of semiconductor processes, and relates to a method and a system for controlling an ultrahigh-precision magnetron sputtering angle. The method comprises the following steps: arranging a laser reflection metal ball; the laser measuring device detects laser reflected light through a laser receiver; the laser measuring device determines the position deviation between the axis of a solid rotating shaft perpendicular to the magnetron sputtering target material and the axis of a virtual rotating shaft in the vertical direction; the magnetic control device controls the rotary connecting rod to rotate, and the included angle between the solid rotating shaft and the axis of the virtual rotating shaft in the vertical direction is adjusted according to the position deviation between the solid rotating shaft and the axis of the virtual rotating shaft so that the magnetron sputtering target position can be adjusted. The effect of improving the coverage rate of sputtering materials on the side wall can be achieved, and the sputtering angle can be accurately controlled through laser measurement and rotation of the connecting rod.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of semiconductor process, and particularly relates to a method and system for controlling the angle of magnetron sputtering with ultra-high precision. BACKGROUND

[0002] Magnetron sputtering is widely used in the fields of semiconductor manufacturing and optical coating. In special applications such as the preparation of high-aspect-ratio micro-nano structures, the control of sputtering angle is extremely high, and good film adhesion is crucial to product performance. The device aims to meet such needs with high-precision measurement and feedback methods.

[0003] Current magnetron sputtering angle control mainly relies on mechanical adjustment or simple angle positioning devices. Mechanical adjustment relies on manual or basic mechanical structures, which is cumbersome and low in precision. Although the simple angle positioning device has a certain degree of automation, it lacks real-time monitoring and accurate feedback. In advanced equipment, the sensor precision and stability are insufficient, and it is difficult to accurately control the angle when dealing with complex structures.

[0004] The existing technology cannot achieve ultra-high precision sputtering angle control. In special applications, it may cause uneven film coverage at different positions of the structure, affecting product performance and yield. Most equipment lacks real-time monitoring and feedback systems, and angle deviations cannot be adjusted in time, leading to error accumulation and reducing film quality and consistency. In the face of complex shapes and high-aspect-ratio structures, existing technology cannot achieve uniform film sputtering, limiting the improvement of product performance and application expansion. SUMMARY

[0005] To solve the above technical problems, the application provides a method and system for controlling the angle of magnetron sputtering with ultra-high precision.

[0006] In a first aspect, the application provides a method for controlling the angle of magnetron sputtering with ultra-high precision, comprising: A laser-reflecting metal ball is arranged on the physical rotating shaft, and a rotating connecting rod controlled by a laser magnetron device is arranged on the physical rotating shaft; A laser spot is shot on the laser-reflecting metal ball, and a laser measuring device detects the laser reflection light through a laser receiver; During the rotation of the physical rotating shaft, the rotating part on the physical rotating shaft rotates in the cavity in the magnetron device, so that the physical rotating shaft rotates; The laser measuring device calculates the optical path difference data of the laser incident light and the laser reflection light; The laser measuring device determines the positional deviation between the physical rotating shaft perpendicular to the magnetron sputtering target and the virtual rotating shaft axis in the vertical direction according to the optical path difference data; The magnetic control device controls the rotation of the rotating connecting rod to adjust the angle between the physical rotating shaft and the virtual rotating shaft axis according to the position deviation between the physical rotating shaft and the virtual rotating shaft axis, so as to adjust the magnetic control sputtering target. The magnetic control device controls the rotation of the rotating connecting rod to adjust the angle between the physical rotating shaft and the virtual rotating shaft axis according to the position deviation between the physical rotating shaft and the virtual rotating shaft axis, so as to adjust the magnetic control sputtering target.

[0007] In a second aspect, the application provides an ultra-high precision magnetic control sputtering angle control system, which comprises a physical rotating shaft, a rotating connecting rod, a laser measuring device, a magnetic control device and a magnetic control sputtering target. The laser reflecting metal ball is arranged on the physical rotating shaft; one end of the rotating connecting rod is connected to the physical rotating shaft, and the other end is connected to the laser measuring device. The magnetic control device is provided with a cavity, and the physical rotating shaft is provided with a rotating part; the rotating part rotates in the cavity of the magnetic control device, so that the physical rotating shaft rotates around the rotating part. The magnetic control sputtering target is perpendicular to and fixedly connected to the physical rotating shaft. The laser measuring device is electrically connected to the magnetic control device.

[0008] On the basis of the above technical scheme, the application can also be improved as follows.

[0009] Further, the angle between the magnetic control sputtering target and the horizontal plane is equal to the angle between the physical rotating shaft and the virtual rotating shaft axis.

[0010] Further, the change amount of the position of the metal ball is determined according to the change amount of the frequency of the reflected light of the measuring light and the measuring light according to the Doppler effect.

[0011] Further, the rotating connecting rod is horizontally arranged, and the rotating connecting rod is fixedly connected to the physical rotating shaft; the rotation angle range of the rotating connecting rod and the physical rotating shaft is 360°.

[0012] Further, the rotating connecting rod is horizontally arranged, and one end of the physical rotating shaft is in contact with the rotating connecting rod, and the rotating connecting rod pushes the physical rotating shaft to move.

[0013] Further, the laser measuring device comprises a laser emitter, a laser receiver and a data processor; the laser emitter and the laser receiver are respectively electrically connected to the data processor; and the data processor is electrically connected to the magnetic control device.

[0014] Further, the magnetic control device comprises a controller, a driver and a motor; the controller is electrically connected to the motor through the driver; the output shaft of the motor is connected to one end of the rotating connecting rod; and the controller is electrically connected to the magnetic control device.

[0015] Further, the laser emitter and the laser receiver are horizontally arranged at one side of the laser reflection metal ball.

[0016] Further, the rotating member is a universal joint ball.

[0017] The beneficial effects of the present application are: the present application controls the rotating connecting rod, so that the physical rotating shaft can rotate around the same central rotating shaft during rotation, and the fixed included angle between the physical rotating shaft and the virtual rotating shaft axis can be maintained, the magnetic control sputtering target also presents the same rotation amplitude, that is, the included angle between the magnetic control sputtering target and the horizontal plane is equal to the included angle between the physical rotating shaft and the virtual rotating shaft axis, so that the material sputtering around the circular hole of the magnetic control sputtering target can be performed at an angle, the required material can be uniformly sputtered around the circular hole, the effect of improving the coverage rate of the sputtered material of the side wall is achieved, and the sputtering angle can be accurately controlled through laser measurement and the rotating connecting rod. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 The principle diagram of the ultra-high precision magnetic control sputtering angle control method provided for embodiment 1 of the present application is shown in the figure; Figure 2 The structural schematic diagram of the ultra-high precision magnetic control sputtering angle control system when the magnetic control sputtering target is located at a horizontal position is shown in the figure; Figure 3 The schematic diagram of the sputtering direction when the magnetic control sputtering target is located at a rotating and inclined position is shown in the figure; Figure 4 The schematic diagram of the sputtering direction when the ion bombardment magnetic control sputtering target is located at a horizontal position is shown in the figure; Figure 5 The schematic diagram of the sputtering direction when the ion bombardment magnetic control sputtering target is rotated is shown in the figure; Figure 6 The structural schematic diagram of the ultra-high precision magnetic control sputtering angle control system provided for embodiment 2 of the present application is shown in the figure.

[0019] Figure legend: 1-physical rotating shaft; 2-laser reflection metal ball; 3-rotating connecting rod; 4-laser measurement device; 5-magnetic control device; 6-magnetic control sputtering target; 7-cavity; L1-physical rotating shaft; L2-virtual rotating shaft axis. DETAILED DESCRIPTION

[0020] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0021] Example 1 As an example, see the attached document. Figure 1 As shown, to solve the above-mentioned technical problems, this embodiment provides an ultra-high precision magnetron sputtering angle control method, including: A laser-reflecting metal ball is set on a solid rotating shaft, and a rotating connecting rod controlled by a laser magnetron is also set on the solid rotating shaft. The laser beam is directed onto a laser-reflecting metal sphere, and the laser measuring device detects the reflected laser light through a laser receiver. During the rotation of the solid rotating shaft, the rotating parts on the solid rotating shaft rotate in the cavity of the magnetic control device, causing the solid rotating shaft to rotate; The laser measurement device calculates the optical path difference between the incident laser beam and the reflected laser beam. The laser measurement device determines the positional deviation between the physical rotation axis perpendicular to the magnetron sputtering target and the axis of the virtual rotation axis in the vertical direction based on the optical path difference data. The magnetron sputtering device adjusts the positional deviation between the physical and virtual rotation axes to zero by controlling the rotation of the rotating connecting rod based on the positional deviation between the physical and virtual rotation axes, making the physical and virtual rotation axes coaxial and the magnetron sputtering target in a horizontal position. The magnetron sputtering device controls the rotation of the rotating connecting rod, and adjusts the angle between the physical rotation axis and the vertical virtual rotation axis based on the positional deviation between the physical rotation axis and the virtual rotation axis, thereby adjusting the magnetron sputtering target position.

[0022] This invention involves placing a high-precision, round laser-reflecting metal sphere on a solid rotating axis. This metal sphere can reflect the laser beam, causing the laser beam to strike the metal sphere.

[0023] As attached Figure 2As shown, the ultra-high precision magnetron sputtering angle control system includes a solid rotating shaft 1, a laser-reflecting metal sphere 2, a rotating connecting rod 3, a laser measuring device 4, a magnetron control device 5, and a magnetron sputtering target 6. The laser-reflecting metal sphere 2 is mounted on the solid rotating shaft 1. One end of the rotating connecting rod 3 is connected to the solid rotating shaft 1, and the other end is connected to the laser measuring device 4. A cavity 7 is provided in the magnetron control device, and a rotating component is provided on the solid rotating shaft 1. The rotating component rotates in the cavity 7 of the magnetron control device, causing the solid rotating shaft 1 to rotate around the rotating component. Figure 2 The rotating component is a sphere, and the outline of the sphere coincides with that of the cavity 7. The magnetron sputtering target 6 is perpendicular to and fixedly connected to the solid rotation axis 1; the laser measuring device 4 is electrically connected to the magnetron device 5.

[0024] As attached Figure 3 As shown, during the rotation of the physical rotating shaft 1, if no optical path difference occurs in the reflected laser light, it indicates that the physical rotating shaft axis L1 and the vertical virtual rotating shaft axis L2 are coaxial. If an optical path difference occurs, the laser measuring device feeds back the optical path difference data to the pushing device (magnetic control device) of the rotating connecting rod, which pulls in the opposite direction to achieve coaxiality between the physical rotating shaft axis L1 and the virtual rotating shaft axis L2. At this time, the magnetron sputtering target 6 at the bottom of the physical rotating shaft 1 is in a horizontal position. The virtual rotating shaft axis L1 is in a vertical position.

[0025] Specifically, the angle between the magnetron sputtering target 6 and the horizontal plane is equal to the angle between the solid rotation axis L1 and the virtual rotation axis L2.

[0026] In practical applications, if it is necessary to adjust the angle for sputtering, the magnetron control device sets an angle value and controls the rotating connecting rod 3 to make the included angle between the physical rotating axis 1 and the virtual rotating axis L2 reach the set value.

[0027] As attached Figure 4 As shown, when the magnetron sputtering target 6 is placed horizontally, the sputtering direction of the ion bombardment magnetron sputtering target 6 is vertical. At this time, the sputtered material will only be deposited on the upper and lower surfaces. Due to scattering issues, a small amount of sputtered material will remain on the sides, resulting in poor uniformity. (See attached image) Figure 5As shown, when the magnetron sputtering target 6 rotates, by controlling the rotating connecting rod 3, the one end of the physical rotating shaft 1 drives the magnetron sputtering target 6 to rotate, so that the physical rotating shaft 1 can rotate around the same center rotating shaft during the rotating process, and the fixed included angle between the physical rotating shaft 1 and the virtual rotating shaft axis can be kept, and the magnetron sputtering target 6 also presents the same rotating amplitude, that is, the included angle between the magnetron sputtering target 6 and the horizontal plane is equal to the included angle between the physical rotating shaft 1 and the virtual rotating shaft axis, so that the material sputtering can be carried out at an angle around the circular hole of the magnetron sputtering target 6, the required material can be uniformly sputtered around the circular hole, the effect of improving the coverage rate of the sputtered material of the side wall is achieved, and the sputtering angle can be accurately controlled in a manner that the sputtering angle is measured by the laser measuring device and adjusted by the rotating connecting rod 3.

[0028] As an optional embodiment, the change amount of the frequency of the reflected light of the measuring light and the measuring light is calculated according to the Doppler effect to determine the position deviation of the metal ball.

[0029] The state at the initial moment is set as the initial position of the metal ball, when the rotating connecting rod swings horizontally, the physical rotating shaft is pulled to rotate synchronously, and the physical rotating shaft and the metal ball will be displaced relative to the initial position. The metal ball has the characteristic of reflecting the laser spot, and the reflected light of the laser spot measuring light will produce the Doppler effect, that is, when the reflection point position of the spot moves away along the direction of the laser light path, the frequency of the laser light wave will become smaller, and vice versa. The change amount of the frequency is used to judge the change of the position of the metal ball, and the wavelength of the laser is used as the calculation unit, so that the nanometer-level precision measurement can be realized.

[0030] Embodiment 2 Based on the same principle as the method shown in Embodiment 1 of the present application, as shown in the accompanying drawings, Figure 6 As shown, the super-high-precision magnetron sputtering angle control system in the embodiment of the present application comprises a physical rotating shaft 1, a laser reflection metal ball 2, a rotating connecting rod 3, a laser measuring device 4, a magnetron device 5 and a magnetron sputtering target 6. The laser reflection metal ball 2 is arranged on the physical rotating shaft 1; one end of the rotating connecting rod 3 is connected to the physical rotating shaft 1, and the other end is connected to the laser measuring device 4; The magnetron device is provided with a cavity 7, and the physical rotating shaft is provided with a rotating part; the rotating part rotates in the cavity 7 of the magnetron device, so that the physical rotating shaft 1 rotates around the rotating part; The magnetron sputtering target 6 is perpendicular to and fixedly connected to the physical rotating shaft 1; The laser measuring device 4 and the magnetron device 5 are electrically connected.

[0031] As an optional implementation, the rotating connecting rod is horizontally arranged, and the rotating connecting rod is fixedly connected with the solid rotating shaft; the rotating angle range of the rotating connecting rod and the solid rotating shaft is 360°.

[0032] As an optional implementation, the rotating connecting rod is horizontally arranged, and one end of the solid rotating shaft is in contact with the rotating connecting rod, and the rotating connecting rod pushes the solid rotating shaft to move.

[0033] As an optional implementation, the laser measuring device comprises a laser emitter, a laser receiver and a data processor; the laser emitter and the laser receiver are respectively electrically connected with the data processor; the data processor is electrically connected with the magnetic control device.

[0034] As an optional implementation, the magnetic control device comprises a controller, a driver and a motor; the controller is electrically connected with the motor through the driver; an output shaft of the motor is connected with one end of the rotating connecting rod; the controller is electrically connected with the magnetic control device.

[0035] As an optional implementation, the laser emitter and the laser receiver are horizontally arranged on one side of the laser reflection metal ball.

[0036] As an optional implementation, the rotating part is a universal joint ball.

[0037] As an optional implementation, the magnetic control device and the laser measuring device realize long-distance data transmission in a wireless data transmission mode.

[0038] The above is only the preferred embodiment of the present application, and is not used to limit the present application. For those skilled in the art, the present application can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A method for angle control of ultra-high precision magnetron sputtering, characterized in that, The application relates to a magnetic control sputtering target material position adjusting device. The device comprises the following parts: A laser reflection metal ball is arranged on a physical rotating shaft, and a rotating connecting rod controlled by a laser magnetic control device is arranged on the physical rotating shaft; A laser spot is shot on the laser reflection metal ball, and a laser measuring device detects laser reflection light through a laser receiver; During the rotation of the physical rotating shaft, a rotating part on the physical rotating shaft rotates in a cavity in the magnetic control device, so that the physical rotating shaft rotates; The laser measuring device calculates the optical path difference data of the incident laser and the reflected laser; The laser measuring device determines the position deviation between the physical rotating shaft perpendicular to the magnetic control sputtering target material and the virtual rotating shaft axis in the vertical direction according to the optical path difference data; The magnetic control device adjusts the position deviation between the physical rotating shaft and the virtual rotating shaft axis to zero by controlling the rotation of the rotating connecting rod, so that the physical rotating shaft is coaxial with the virtual rotating shaft axis, and the magnetic control sputtering target material is in a horizontal position; 2. The method of claim 1, wherein the angle of incidence is controlled by adjusting the angle of the substrate with respect to the target. The magnetic control device controls the rotation of the rotating connecting rod, adjusts the included angle between the physical rotating shaft and the virtual rotating shaft axis in the vertical direction according to the position deviation between the physical rotating shaft and the virtual rotating shaft axis, and adjusts the magnetic control sputtering target position.

3. The method of claim 1, wherein the angle of incidence is controlled by adjusting the angle of the substrate with respect to the target. The included angle between the magnetic control sputtering target material and the horizontal plane is equal to the included angle between the physical rotating shaft and the virtual rotating shaft axis.

4. The system for controlling the angle of the ultra-high precision magnetron sputtering according to claim 1, characterized in that, The change amount of the position of the metal ball is determined according to the change amount of the frequency of the reflected light of the measuring light and the measuring light according to the Doppler effect. The device comprises a physical rotating shaft, a rotating connecting rod, a laser measuring device, a magnetic control device and a magnetic control sputtering target material; The laser reflection metal ball is arranged on the physical rotating shaft; one end of the rotating connecting rod is connected with the physical rotating shaft, and the other end is connected with the laser measuring device; The magnetic control device is provided with a cavity, and the physical rotating shaft is provided with a rotating part; the rotating part rotates in the cavity in the magnetic control device, so that the physical rotating shaft rotates around the rotating part; The magnetic control sputtering target material is perpendicular to and fixedly connected with the physical rotating shaft; 5. The ultra-high precision magnetron sputtering angle control system of claim 4, wherein, The laser measuring device is electrically connected with the magnetic control device.

6. The ultra-high precision magnetron sputtering angle control system of claim 4, wherein, The rotating connecting rod is horizontally arranged and fixedly connected with the physical rotating shaft; the rotating angle range of the rotating connecting rod and the physical rotating shaft is 360 degrees.

7. The ultra-high precision magnetron sputtering angle control system of claim 4, wherein, The rotating connecting rod is horizontally arranged, one end of the physical rotating shaft is in contact with the rotating connecting rod, and the rotating connecting rod pushes the physical rotating shaft to move.

8. The ultra-high precision magnetron sputtering angle control system of claim 4, wherein, The laser measuring device comprises a laser emitter, a laser receiver and a data processor; the laser emitter and the laser receiver are electrically connected with the data processor; the data processor is electrically connected with the magnetic control device.

9. The ultra-high precision magnetron sputtering angle control system of claim 4, wherein, The magnetic control device comprises a controller, a driver and a motor; the controller is electrically connected with the driver and the motor; one end of the output shaft of the motor is connected with the rotating connecting rod; the controller is electrically connected with the magnetic control device.

10. The ultra-high precision magnetron sputtering angle control system of claim 4, wherein, The laser emitter and the laser receiver are horizontally arranged on one side of the laser reflection metal ball. The rotating part is a universal joint ball.

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