Device and method for detecting bonding strength of wafer

Abstract

The invention discloses a device and method for detecting the bonding strength of a wafer, the device comprises a bonding wafer, a base, a fixed seat, a sliding seat, a fixed column, a sleeve and a detection spring, and the detection method comprises the following steps: S1, calibration; s2, mounting a bonding wafer; s3, detecting; and S4, calculating. The wafer bonding strength measuring device has the beneficial effects that the bonding strength of the wafer body is measured by adopting a czochralski method, in the measuring process, a pulling force is applied to the sliding seat by pulling the sleeve, so that the pulling force is transmitted to the bonding position of the wafer body, the pulling force can be intuitively reflected through the detection spring, and in the measuring process, the bonding strength of the wafer body is measured. By reading the reading of the detection spring when the bonded wafer is broken, the tensile force applied to the bonded wafer when the bonded wafer is broken can be measured, and compared with a traditional measurement mode, the device and the detection method are more visual and convenient to use.

Description

Technical Field

[0001] This invention relates to the field of wafer inspection technology, and specifically to a device and method for detecting wafer bonding strength. Background Technology

[0002] Wafer bonding is the process of joining two or more wafer bodies together in a bonding machine. In wafer bonding technology, bonding strength is one of the most important measurement characteristics and an important indicator of bonding quality. If the bonding strength is low, the two bonded wafers are likely to crack during processing, leading to failure.

[0003] There are various methods for measuring wafer bonding strength, among which the crack propagation and diffusion method is the most common. The crack propagation and diffusion method is also known as the blade insertion method or the double cantilever beam test method. It separates two wafers by inserting a thin blade into the bonding interface. The thin blade will cause serious damage to the wafer. The crack length measured at the end is a characterization of the bonding strength. However, the crack length needs to be observed through infrared detection or ultrasonic detection systems, and the bonding strength of the wafer cannot be directly measured. Summary of the Invention

[0004] To address the aforementioned problems, this invention provides a device and method for detecting wafer bonding strength, which is achieved through the following technical solutions.

[0005] An apparatus for detecting wafer bonding strength includes a bonding wafer, a base, a fixed base, a sliding base, a fixed post, a sleeve, and a detection spring;

[0006] The bonding wafer is formed by bonding two disk-shaped wafer bodies together, and the bonding positions of the two wafer bodies are machined with annular grooves by a circular cutter.

[0007] The fixed seat is fixed to the right side of the upper surface of the base, and the sliding seat is slidably connected to the left side of the fixed seat. The front and rear side plates of the fixed seat are symmetrically fixed with first support plates, and the front and rear side plates of the sliding seat are symmetrically fixed with second support plates. The right side of the second support plate is vertically and evenly fixed with a sliding rod. The sliding rod is slidably connected to the corresponding first support plate, and the head of the sliding rod is fixed with a limit block. A U-shaped placement groove is opened on the side of the fixed seat and the sliding seat that are close to each other. The diameter of the semicircle at the bottom of the placement groove is equal to the diameter of the wafer body. A semicircular snap-fit ​​plate is fixed on the side of the two placement grooves that are close to each other.

[0008] The fixed column is fixed to the outer wall of the left side plate of the sliding seat, the sleeve is sleeved on the fixed column and slidably connected to the fixed column, and U-shaped handles are symmetrically fixed to the upper and lower outer walls of the left side plate of the sleeve.

[0009] The two ends of the detection spring are symmetrically fixed with spring seats, and the detection spring is fixed between the left side of the fixed column and the inner wall of the left side plate of the sleeve through the spring seats.

[0010] Further, the detection spring is circumferentially and evenly provided with a plurality of.

[0011] Further, the guide rod is fixedly connected to the bottom of the sleeve through the left and right symmetrical ear plates on the bottom of the sleeve.

[0012] Further, the upper part of the outer wall of the fixed column is provided with a scale groove, the reading of the scale groove increases in the direction from right to left, the side plate of the sleeve is provided with an observation port corresponding to the position of the scale groove, and a pointer is fixedly connected in the observation port.

[0013] Further, the first support plates are symmetrically fixed on the left side of the upper surface of the base, a placing frame is slidably connected between the first support plates, a first guide roller and a second guide roller are rotatably connected between the first support plates above the placing frame, a plurality of pairs of second support plates are fixedly connected on the base between the first support plates and the sleeve, a fixed pulley is rotatably connected between the pairs of second support plates, and a rigid pull rope and a weight are further included.

[0014] Further, the first support plates are symmetrically fixed on the left side of the upper surface of the base, a placing frame is slidably connected between the first support plates, a first guide roller and a second guide roller are rotatably connected between the first support plates above the placing frame, a plurality of pairs of second support plates are fixedly connected on the base between the first support plates and the sleeve, a fixed pulley is rotatably connected between the pairs of second support plates, and a rigid pull rope and a weight are further included.

[0015] Further, a pair of fixed plates are fixedly connected to the front and rear sides of the base, and mounting bolts are inserted into the fixed plates.

[0016] A detection method for detecting the bonding strength of a wafer, characterized in that the detection method comprises the following steps:

[0017] S1: calibration, the fixed seat, the sliding seat, and the placing frame are empty, the reading of the pointer at this time is recorded as L1;

[0018] S2: bonding wafer installation, first, a circular cutting machine is used to process an annular clamping groove at the bonding position of the two wafer bodies, the fixed seat and the sliding seat are folded, then the bonded wafer is placed in the placing groove of the fixed seat and the sliding seat, and the two clamping plates are placed in the clamping groove.

[0019] S3: detection, constantly add the weight in the placing frame until the bonding wafer is broken;

[0020] S4: calculation, the bonding strength of two wafer bodies is calculated according to the formula, and the formula is as follows:

[0021] P=(L1*N*k+G) / S, wherein P is the tensile and compressive strength of the reaction of the bonding strength of two wafer bodies; N is the number of detection springs; K is the elastic coefficient of the detection spring; S is the bonding area of the two wafer bodies at the card slot position; G is the total weight of the weight in the placing frame.

[0022] The beneficial effects of the present application are that the bonding strength of the wafer body is measured by the direct pulling method, in the measurement process, the sliding seat is pulled by the sleeve to apply tension, so that the tension is transmitted to the bonding position of the wafer body, and the tension can be directly reacted by the detection spring, in the measurement process, the reading of the detection spring when the bonding wafer is broken can be read, so that the tension when the bonding wafer is broken can be measured, compared with the traditional measurement method, the device and the detection method are more intuitive and convenient in use. BRIEF DESCRIPTION OF DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the present application, the following will briefly introduce the drawings needed to be used in the specific implementation manner. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0024] Figure 1 The structure diagram of the bonded wafer is shown in the present application.

[0025] Figure 2 The axonometric view of the device for detecting the bonding strength of the wafer is shown in the present application.

[0026] Figure 3 The sectional view of the device for detecting the bonding strength of the wafer is shown in the present application.

[0027] Figure 4 : Figure 3 The local enlarged view at A shown in the figure.

[0028] Figure 5 The installation schematic diagram of the sliding seat, the fixed column and the detection spring is shown in the present application.

[0029] Figure 6 The structure schematic diagram of the fixed seat is shown in the present application.

[0030] Figure 7 The internal structure schematic diagram of the sleeve is shown in the present application.

[0031] The reference signs are as follows:

[0032] 1-bonding wafer, 11-wafer body, 12-slot, 2-base, 21-fixing plate, 22-mounting bolt, 3-fixing seat, 31-first supporting plate, 4-sliding seat, 41-second supporting plate, 42-sliding rod, 43-limiting block, 44-placing slot, 45-clamping plate, 5-fixing column, 51-scale slot, 6-sleeve, 61-handle, 62-ear plate, 63-guide rod, 64-guide block, 65-viewing hole, 66-pointer, 7-detection spring, 71-spring seat, 81-first supporting plate, 82-placing frame, 83-first guide roller, 84-second guide roller, 85-second supporting plate, 86-fixed pulley, 87-rigid pull rope, 88-weight, 89-rail slot, 810-rail rod, 811-rail block. DETAILED DESCRIPTION

[0033] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0034] As shown in the drawings, the device has the following two specific embodiments. Figures 1-7

[0035] Embodiment 1

[0036] A device for detecting the bonding strength of a wafer, comprising a bonding wafer 1, a base 2, a fixing seat 3, a sliding seat 4, a fixing column 5, a sleeve 6 and a detection spring 7.

[0037] The bonding wafer 1 is formed by bonding two disc-shaped wafer bodies 11, and the bonding positions of the two wafer bodies 11 are machined by a circular cutter to have annular slots 12;

[0038] The fixing seat 3 is fixed to the upper surface of the base 2 on the right side, the sliding seat 4 is slidingly connected to the left side of the fixing seat 3, the outer walls of the front and rear side plates of the fixing seat 3 are symmetrically fixed with first supporting plates 31, the outer walls of the front and rear side plates of the sliding seat 4 are symmetrically fixed with second supporting plates 41, the right side of each second supporting plate 41 is vertically and uniformly fixed with a sliding rod 42, the sliding rod 42 is slidingly connected with the corresponding first supporting plate 31, and the head of the sliding rod 42 is fixed with a limiting block 43, the side of the fixing seat 3 and the sliding seat 4 close to each other is provided with a U-shaped placing slot 44, the diameter of the semicircle at the bottom of the placing slot 44 is equal to the diameter of the wafer body 11, and the side of the two placing slots 44 close to each other is fixed with a semicircular clamping plate 45;

[0039] ​The fixed column 5 is fixed to the left side plate outer wall of the sliding seat 4, the sleeve 6 is sleeved on the fixed column 5 and is in sliding connection with the fixed column 5, and the left side plate outer wall of the sleeve 6 is fixedly connected with a U-shaped handle 61 symmetrically upwards and downwards;

[0040] The both ends of the detection spring 7 are fixedly connected with spring seats 71 symmetrically, and the detection spring 7 is fixed between the left side of the fixed column 5 and the inner wall of the left side plate of the sleeve 6 through the spring seats 71.

[0041] Preferably, a pair of fixed plates 21 is fixed to each of the front and rear sides of the base 2, and the fixed plates 21 are inserted with mounting bolts 22.

[0042] Preferably, the detection spring 7 is uniformly provided with a plurality of around the axis of the fixed column 5 and the sleeve 6.

[0043] Preferably, a guide rod 63 is fixed to the base 2 below the sleeve 6 through left and right symmetrical ear plates 62, and a guide block 64 in sliding connection with the guide rod 63 is fixed to the lower part of the sleeve 6.

[0044] Preferably, a scale groove 51 is arranged on the outer wall of the fixed column 5, the reading of the scale groove 51 increases in the direction from right to left, an observation hole 65 is arranged on the side plate of the sleeve 6 corresponding to the position of the scale groove 51, a pointer 66 is fixed in the observation hole 65, and the pointer 66 is aligned with the “0” reading position of the scale groove 51 when each detection spring 7 is in the natural length.

[0045] In the embodiment:

[0046] The base 2 is fixed through the mounting bolts 22, the bonded wafer 1 is placed in the placing groove 44 during detection, the two clamping plates 45 are placed in the clamping groove 12, the sleeve 6 is pulled through the handle 61, the pulling force of the sleeve 6 is transmitted to the fixed column 5 through the detection spring 7, so that the pulling force is applied to the movable column, and the pulling force is transmitted to the bonding position of the wafer body 11, the pulling force can be directly reacted through the detection spring 7, and the reading of the detection spring 7 when the bonded wafer 1 is broken is read during measurement.

[0047] Embodiment 2

[0048] The upper surface of the base 2 is symmetrically fixed with a first support plate 81 on the left side, a placing frame 82 is slidably connected between the first support plates 81, a first guide roller 83 and a second guide roller 84 are rotatably connected between the first support plates 81 above the placing frame 82, a plurality of pairs of second support plates 85 are fixed on the base 2 between the first support plates 81 and the sleeve 6, a fixed pulley 86 is rotatably connected between the pairs of second support plates 85, and a rigid pull rope 87 and a weight 88 are further included, one end of the rigid pull rope 87 is fixedly connected to the left center of the sleeve 6, and the free end of the rigid pull rope 87 is fixedly connected to the top center of the placing frame 82 in sequence after being guided by the fixed pulleys 86, the second guide roller 84, and the first guide roller 83.

[0049] Preferably, a track groove 89 is formed on the first support plate 81 corresponding to the position of the placing frame 82, a track rod 810 is fixedly connected in the track groove 89, and track blocks 811 are symmetrically fixed on the front and back sides of the placing frame 82, the track blocks 811 are located in the track groove 89 and are slidably connected with the track rod 810.

[0050] In the embodiment:

[0051] In the embodiment 1, the friction and other factors will affect the detection results, and when the pulling force is applied by the hand, the pulling force is not stable, which will cause errors in the detection results. In the embodiment 2, the above problems can be improved, that is, the pulling force is applied by the gravity of the weight 88, and the application of the pulling force is more intuitive and stable.

[0052] A detection method for detecting the bonding strength of a wafer, the detection method comprising the following steps:

[0053] S1: calibration, the fixed seat 3, the sliding seat 4, and the placing frame 82 are empty, the reading of the pointer 66 at this time is recorded as L1;

[0054] Due to the gravity of the placing frame 82, the gravity of the placing frame 82 will pull the sleeve 6 during the emptying process, so that the reading of the pointer 66 changes, the reading of the pointer 66 is L1, which reflects the comprehensive pulling force of the placing frame 82 after overcoming various frictional resistance, the number of detection springs 7 is recorded as N, and the elastic coefficient of the detection spring 7 is recorded as k, that is, in the empty state, the comprehensive pulling force on the sliding seat 4 is L1*N*k.

[0055] S2: bonding wafer 1 installation, first, a circular cutting machine is used to process a ring-shaped clamping groove 12 at the bonding position of the two wafer bodies 11, the fixed seat 3 and the sliding seat 4 are folded, then the bonding wafer 1 is placed in the placing groove 44 of the fixed seat 3 and the sliding seat 4, and the two clamping plates 45 are placed in the clamping groove 12;

[0056] Before the mounting of the bonding wafer 1, the diameter of the position of the clamping slot 12 can be measured, so as to calculate the bonding area S of the two wafer bodies 11.

[0057] S3: detecting, continuously adding the weight 88 in the placing frame 82 until the bonding wafer 1 is broken;

[0058] S4: calculating, calculating the bonding strength of the two wafer bodies 11 according to the formula as follows:

[0059] P=(L1*N*k+G) / S, wherein P is the tensile and compressive strength reflecting the bonding strength of the two wafer bodies 11; N is the number of the detecting springs 7; k is the elastic coefficient of the detecting springs 7; S is the bonding area of the two wafer bodies 11 at the position of the clamping slot 12; and G is the total weight of the weights 88 in the placing frame 82.

[0060] When the bonding wafer 1 is broken, the total weight of the weights 88 in the placing frame 82 is G, that is, the total tensile force borne by the sliding seat 4 after the correction is (L1*N*k+G), and then the total tensile force is divided by S, so as to measure the compressive strength borne by the bonding position of the two wafer bodies 11 when broken, that is, P=(L1*N*k+G) / S.

[0061] The preferred embodiments disclosed above are only used for helping to explain the present application. The preferred embodiments do not describe all the details and limit the present application to the specific embodiments. Obviously, according to the content of the present application, many modifications and changes can be made. The present application is selected and described in detail, so as to better explain the principles and practical application of the present application, so that the persons skilled in the art can well understand and utilize the present application. The present application is limited by the claims and the whole scope and equivalents thereof.

Claims

1. An apparatus for detecting a bond strength of a wafer, comprising a bonded wafer, characterized by: The base, the fixed seat, the sliding seat, the fixed column, the sleeve and the detection spring are further included. The bonded wafer is formed by bonding two disc-shaped wafer bodies, and the bonding positions of the two wafer bodies are machined by a circular cutter to have annular clamping grooves. The fixed seat is fixed on the upper surface of the base, the sliding seat is slidably connected to the left side of the fixed seat, the outer walls of the front and rear side plates of the fixed seat are symmetrically fixed with first supporting plates, the outer walls of the front and rear side plates of the sliding seat are symmetrically fixed with second supporting plates, the right side of each second supporting plate is vertically and uniformly fixed with a slide rod, the slide rod is slidably connected to the corresponding first supporting plate, the head of the slide rod is fixed with a limiting block, the side of the fixed seat and the sliding seat close to each other is provided with a U-shaped placement groove, the diameter of the semicircle at the bottom of the placement groove is equal to the diameter of the wafer body, and the side of the two placement grooves close to each other is fixed with a semicircular clamping plate. The fixed column is fixed to the outer wall of the left side plate of the sliding seat, the sleeve is sleeved on the fixed column and slidably connected to the fixed column, and the outer wall of the left side plate of the sleeve is symmetrically fixed with U-shaped handles. The two ends of the detection spring are symmetrically fixed with spring seats, and the detection spring is fixed between the left side of the fixed column and the inner wall of the left side plate of the sleeve through the spring seats.

2. The apparatus for detecting the strength of wafer bonding according to claim 1, wherein: The detection spring is circumferentially and uniformly provided with a plurality of spring seats around the axis of the fixed column and the sleeve.

3. The apparatus for detecting the strength of wafer bonding according to claim 2, wherein: A guide rod is fixed to the base below the sleeve through left and right symmetrical ear plates, and a guide block slidably connected to the guide rod is fixed to the lower side of the sleeve.

4. The apparatus for detecting the strength of wafer bonding according to claim 3, wherein: A scale groove is arranged on the outer wall of the fixed column, the reading of the scale groove increases in the direction from right to left, an observation hole is arranged on the side plate of the sleeve at the position corresponding to the scale groove, a pointer is fixed in the observation hole, and when the detection spring is at a natural length, the pointer is aligned with the "0" reading position of the scale groove.

5. The apparatus for detecting the strength of wafer bonding according to claim 4, wherein: The upper surface of the base is symmetrically fixed with first supporting plates on the left side, a placement frame is slidably connected between the first supporting plates, first and second guide rollers are further rotatably connected between the first supporting plates above the placement frame, a plurality of pairs of second supporting plates are transversely and uniformly fixed to the base between the first supporting plates and the sleeve, a fixed pulley is rotatably connected between the second supporting plates, and a rigid pull rope and a weight are further included, one end of the rigid pull rope is fixedly connected to the left center of the sleeve, and the free end of the rigid pull rope is fixedly connected to the top center of the placement frame after being guided by the fixed pulleys, the second guide rollers and the first guide rollers in sequence.

6. The apparatus for detecting the strength of wafer bonding according to claim 5, wherein: A track groove is arranged on the first supporting plate at the position corresponding to the placement frame, a track rod is fixed in the track groove, and track blocks are symmetrically fixed on the front and rear sides of the placement frame and located in the track groove and slidably connected to the track rod.

7. The apparatus for testing the strength of wafer bonding according to claim 1, wherein: A pair of fixed plates is fixed to the front and rear sides of the base, and mounting bolts are inserted into the fixed plates.

8. A method of detecting the strength of a wafer bond, the method comprising: The detection method comprises the following steps: S1: calibration, the fixed seat, the sliding seat and the placement frame are empty, the reading of the pointer at this time is recorded as L1; S2: bonded wafer installation, first, an annular clamping groove is machined at the bonding position of the two wafer bodies by a circular cutter, the fixed seat and the sliding seat are folded, then the bonded wafer is placed in the placement groove of the fixed seat and the sliding seat, and the two clamping plates are placed in the clamping groove. S3: detection, constantly add the weight in the placement frame until the bonding wafer is broken; S4: calculation, according to the formula to calculate the bonding strength of two wafer bodies, the formula is as follows: P=(L1*N*k+G) / S, wherein: P is the tensile and compressive strength of the reaction of the bonding strength of two wafer bodies; N is the number of detection springs; K is the elastic coefficient of the detection spring; S is the bonding area of the two wafer bodies at the card slot position; G is the total weight of the weight in the placement frame.

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