Aging test system, solid-state storage device and related method

Abstract

The invention discloses an aging test system, which is applied to solid-state storage equipment, and the solid-state storage equipment comprises at least one solid-state storage chip to be tested. The aging test system comprises a controller. The at least one radiator is electrically connected with the controller, and each radiator is used for radiating the corresponding solid-state storage chip to be tested; the at least one temperature sensor is electrically connected with the controller, and each at least one temperature sensor is used for sensing the current operation temperature of the corresponding solid-state storage chip to be detected; and the controller is used for determining a target operation parameter of the radiator corresponding to the to-be-tested solid-state storage chip according to the target operation temperature and the current operation temperature of the to-be-tested solid-state storage chip so as to perform an aging test on the to-be-tested solid-state storage chip based on the target operation parameter. The invention also discloses a solid-state storage device and a related method. The aging test efficiency is improved.

Description

TECHNICAL FIELD

[0001] The disclosed embodiments of the present application relate to the technical field of storage devices, and more particularly, to an aging test system, a solid state storage device, and related methods. BACKGROUND

[0002] As a new type of storage medium, a solid state drive (SSD) uses NAND particles as data storage and has been widely used in various fields such as PCs, notebooks, and servers. In existing SSD product testing, aging tests need to be performed on NAND particles, for example, under high-temperature conditions, the SSD master issues read-write services to perform aging tests on on-board NAND Flash particles, that is, by simulating harsh scenarios in real use to accelerate potential failure exposure and screen out SSD samples that do not meet the requirements. A temperature chamber is usually used as a test device to perform SSD aging tests. However, the temperature chamber scheme has relatively limited load capacity, and when the power consumption of a single SSD sample is too high, the temperature uniformity in the temperature chamber is poor. SUMMARY

[0003] According to embodiments of the present application, an aging test system, a solid state storage device, and related methods are provided to solve the above problems.

[0004] A first aspect of the present application discloses an aging test system applied to a solid state storage device, the solid state storage device including at least one to-be-tested solid state storage chip; the aging test system including: a controller; at least one heat sink electrically connected to the controller and corresponding to each to-be-tested solid state storage chip, each heat sink being used to dissipate heat from the corresponding to-be-tested solid state storage chip; and at least one temperature sensor electrically connected to the controller and corresponding to each to-be-tested solid state storage chip, each temperature sensor being used to sense the current operating temperature of the corresponding to-be-tested solid state storage chip; wherein the controller is used to: determine the target operating temperature of each to-be-tested solid state storage chip in the at least one to-be-tested solid state storage chip; obtain the current operating temperature of the to-be-tested solid state storage chip from the temperature sensor corresponding to the to-be-tested solid state storage chip; determine the target operating parameter of the heat sink corresponding to the to-be-tested solid state storage chip based on the target operating temperature and the current operating temperature of the to-be-tested solid state storage chip, so that the to-be-tested solid state storage chip is subjected to an aging test based on the target operating parameter of the heat sink corresponding to the to-be-tested solid state storage chip.

[0005] In some embodiments, the controller is further configured to determine an initial operating parameter of the heat sink corresponding to the to-be-tested solid state storage piece; and determine the target operating parameter of the heat sink corresponding to the to-be-tested solid state storage piece according to the target operating temperature and the current operating temperature of the to-be-tested solid state storage piece, including: determining an operating adjustment parameter of the heat sink corresponding to the to-be-tested solid state storage piece according to the target operating temperature and the current operating temperature of the to-be-tested solid state storage piece; and determining the target operating parameter of the heat sink corresponding to the to-be-tested solid state storage piece according to the initial operating parameter of the heat sink corresponding to the to-be-tested solid state storage piece and the operating adjustment parameter of the heat sink corresponding to the to-be-tested solid state storage piece.

[0006] In some embodiments, the controller is configured to determine the operating adjustment parameter of the heat sink corresponding to the to-be-tested solid state storage piece according to the target operating temperature and the current operating temperature of the to-be-tested solid state storage piece, including: determining a preset temperature range of the target operating temperature according to the target operating temperature; determining a temperature difference between the current operating temperature and the target operating temperature in response to the current operating temperature being outside the preset temperature range; and determining the operating adjustment parameter of the heat sink corresponding to the to-be-tested solid state storage piece according to the temperature difference between the current operating temperature and the target operating temperature.

[0007] In some embodiments, the controller is further configured to determine an initial operating parameter of the heat sink corresponding to the to-be-tested solid state storage piece; and determine the target operating parameter of the heat sink corresponding to the to-be-tested solid state storage piece according to the target operating temperature and the current operating temperature of the to-be-tested solid state storage piece, including: determining a preset temperature range of the target operating temperature according to the target operating temperature; and determining the initial operating parameter of the heat sink corresponding to the to-be-tested solid state storage piece as the target operating parameter of the heat sink corresponding to the to-be-tested solid state storage piece in response to the current operating temperature being within the preset temperature range.

[0008] In some embodiments, the initial operating parameter of the heat sink corresponding to the to-be-tested solid state storage piece is determined based on a capacity of the to-be-tested solid state storage piece and a preset operating temperature for the to-be-tested solid state storage piece.

[0009] In some embodiments, the aging test system further comprises at least one auxiliary heating module electrically connected to the at least one controller and corresponding to the at least one to-be-tested solid state storage piece one-to-one, each of the at least one auxiliary heating module being configured to heat the corresponding to-be-tested solid state storage piece; wherein the controller is further configured to: in response to a temperature difference between a target operating temperature and a current operating temperature of the to-be-tested solid state storage piece being greater than a preset value and the current operating temperature being less than the target operating temperature, determine a target operating parameter of a corresponding heat sink and the corresponding auxiliary heating module of the to-be-tested solid state storage piece, so that the to-be-tested solid state storage piece is subjected to the aging test based on the target operating parameter of the corresponding heat sink and the corresponding auxiliary heating module of the to-be-tested solid state storage piece.

[0010] In some embodiments, the to-be-tested solid state storage piece comprises a main controller, a power supply circuit and at least one solid state storage particle, wherein the main controller is connected to the power supply circuit and the at least one solid state storage particle, and the power supply circuit is further connected to the at least one solid state storage particle; the aging test of the to-be-tested solid state storage piece based on the target operating parameter of the corresponding heat sink comprises: performing an aging read-write operation on the at least one solid state storage particle to determine heat for the aging test; and dissipating the heat for the aging test based on the target operating parameter of the corresponding heat sink to achieve the aging test.

[0011] The second aspect of the present application discloses an aging test method of a solid state storage device, comprising: being applied to an aging test system, the solid state storage device comprising at least one to-be-tested solid state storage piece, the method comprising: determining a target operating temperature of each to-be-tested solid state storage piece in the at least one to-be-tested solid state storage piece; obtaining a current operating temperature of the to-be-tested solid state storage piece; determining a target operating parameter of a corresponding heat sink of the to-be-tested solid state storage piece according to the target operating temperature and the current operating temperature of the to-be-tested solid state storage piece, so that the to-be-tested solid state storage piece is subjected to the aging test based on the target operating parameter of the corresponding heat sink.

[0012] The third aspect of the present application discloses a solid state storage device comprising at least one to-be-tested solid state storage piece, wherein each to-be-tested solid state storage piece in the at least one to-be-tested solid state storage piece is subjected to the aging test by the aging test system as described in the first aspect or the aging test method of the solid state storage device as described in the second aspect.

[0013] In some embodiments, the to-be-tested solid state storage piece comprises a main controller, a power supply circuit and at least one solid state storage particle, wherein the main controller is connected with the power supply circuit and the at least one solid state storage particle, and the power supply circuit is further connected with the at least one solid state storage particle.

[0014] The application has the following beneficial effects: an aging test system is applied to a solid state storage device, the aging test system comprises a controller, at least one heat sink and at least one temperature sensor, the solid state storage device comprises at least one to-be-tested solid state storage piece, the heat sink is used for dissipating heat from the corresponding to-be-tested solid state storage piece, and the temperature sensor is used for sensing the current operating temperature of the corresponding to-be-tested solid state storage piece. By determining the target operating temperature of each to-be-tested solid state storage piece in the at least one to-be-tested solid state storage piece, obtaining the current operating temperature of the to-be-tested solid state storage piece from the temperature sensor corresponding to the to-be-tested solid state storage piece, and further determining the target operating parameter of the heat sink corresponding to the to-be-tested solid state storage piece according to the target operating temperature and the current operating temperature of the to-be-tested solid state storage piece, the to-be-tested solid state storage piece can be subjected to aging test, wherein the current operating temperature of the to-be-tested solid state storage piece is obtained through the at least one temperature sensor, so as to more accurately control the sample temperature in the aging test, and the corresponding to-be-tested solid state storage piece is subjected to heat dissipation through the at least one heat sink, so that the temperature distribution in the aging test process is uniform, and the aging test efficiency is improved. BRIEF DESCRIPTION OF DRAWINGS

[0015] The application will be further described below in combination with the drawings and embodiments. In the drawings:

[0016] Figure 1 is a structural schematic diagram of an aging test system according to an embodiment of the application;

[0017] Figure 2 is a structural schematic diagram of a solid state storage device according to an embodiment of the application;

[0018] Figure 3 is a structural schematic diagram of a solid state storage piece according to an embodiment of the application;

[0019] Figure 4 is a structural schematic diagram of an aging test system according to another embodiment of the application;

[0020] Figure 5 is a flowchart of an aging test method of a solid state storage device according to an embodiment of the application. DETAILED DESCRIPTION

[0021] Reference to "an embodiment" or "the embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase "in one embodiment" or "in an embodiment" in various places in the specification are not necessarily all referring to the same embodiment, nor are they necessarily all referring to a common embodiment, or an embodiment that is independent of all other embodiments. One of skill in the art will understand that the embodiments described herein can be combined with other embodiments in various ways.

[0022] The term "and / or" in this application merely describes an association relationship of associated objects, which means that there can be three relationships, for example, A and / or B can represent the following three cases: A exists alone, A and B exist together, and B exists alone. In addition, the character " / " in this application generally represents an "or" relationship between the front and rear associated objects. In addition, "multiple" in this application means two or more than two. In addition, the term "at least one" in this application means any one of multiple or any combination of at least two of multiple, for example, including at least one of A, B and C can mean including any one or more elements selected from the set consisting of A, B and C. In addition, the terms "first", "second", "third" in this application are only for description purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features.

[0023] Generally, a temperature box is used as a test device for SSD aging test, and the configuration of a standard temperature box is designed to detect and ensure the temperature of the inlet of the cavity. The temperature effect of the samples at various positions in the cavity cannot be fully guaranteed, and the temperature and wind speed of the wind flow of the disk near the return air inlet cannot be well guaranteed relative to the inlet. Temperature control is relatively difficult. In addition, high and low temperature box devices require compressors and other key components, which are high in cost. Therefore, the environmental temperature as a control condition cannot accurately reflect the actual running temperature effect of the disk NAND. Further, the temperature box scheme has limited load capacity, and the temperature uniformity is poor when the power consumption of a single sample is too high. In addition, the NAND aging temperature control strategy using only firmware will also cause the problem of reduced aging efficiency.

[0024] Therefore, the application provides an aging test system, an aging test method and a solid state storage device. In order to enable those skilled in the art to better understand the technical solutions of the application, the technical solutions of the application will be further described in detail below with reference to the drawings and specific embodiments.

[0025] Please refer to Figures 1-3 shown, Figure 1 is a structural schematic diagram of an aging test system according to an embodiment of the application, Figure 2 is a structural schematic diagram of a solid state storage device according to an embodiment of the application, Figure 3 is a structural schematic diagram of a solid state storage disk according to an embodiment of the application.

[0026] The aging test system 100 is applied to a solid state storage device 200, and the aging test system 100 comprises a controller 110, at least one heat sink 120 and at least one temperature sensor 130, and the solid state storage device 200 comprises at least one to-be-tested solid state storage chip 210.

[0027] Specifically, the at least one heat sink 120 is electrically connected to the controller 110 and corresponds to the at least one to-be-tested solid state storage chip 210 one by one, and each of the at least one heat sink 120 is used for dissipating heat of the to-be-tested solid state storage chip 210 corresponding to the heat sink 120. The heat sink 120 can be a fan, for example, a PWM (Pulse Width Modulation) speed-controlled fan. The at least one temperature sensor 130 is electrically connected to the controller 110 and corresponds to the at least one to-be-tested solid state storage chip 210 one by one, and each of the at least one temperature sensor 130 is used for sensing a current operating temperature of the to-be-tested solid state storage chip 210 corresponding to the temperature sensor 130.

[0028] The solid state storage device 200 comprises the at least one to-be-tested solid state storage chip 210, and the to-be-tested solid state storage chip 210 comprises a main controller 211, a power supply circuit 212 and at least one solid state storage grain 213, wherein the main controller 211 is connected to the power supply circuit 212 and the at least one solid state storage grain 213, and the power supply circuit 212 is further connected to the at least one solid state storage grain 213.

[0029] The controller 110 of the aging test system 100 is configured to determine a target operating temperature of each to-be-tested solid state storage chip 210 in the at least one to-be-tested solid state storage chip 210, acquire a current operating temperature of the to-be-tested solid state storage chip 210 from the temperature sensor 130 corresponding to the to-be-tested solid state storage chip 210, and determine a target operating parameter of the heat sink 120 corresponding to the to-be-tested solid state storage chip 210 according to the target operating temperature and the current operating temperature of the to-be-tested solid state storage chip 210, so that the to-be-tested solid state storage chip 210 is subjected to the aging test based on the target operating parameter of the heat sink 120 corresponding to the to-be-tested solid state storage chip 210.

[0030] The target operating temperature of each of the at least one to-be-tested solid state storage piece 210 is determined, wherein the target operating temperature can be a temperature point for performing the aging test, i.e., the to-be-tested solid state storage piece 210 performs the aging test based on the target operating temperature. The current operating temperature of the to-be-tested solid state storage piece 210 is obtained from the temperature sensor 130 corresponding to the to-be-tested solid state storage piece 210, for example, the actual operating temperature of the to-be-tested solid state storage piece 210 is obtained from the temperature sensor 130 corresponding to the to-be-tested solid state storage piece 210 at a time interval of 6s. According to the target operating temperature and the current operating temperature of the to-be-tested solid state storage piece 210, the target operating parameter of the heat sink 120 corresponding to the to-be-tested solid state storage piece 210 is determined, which can be the power or the rotating speed of the fan, so that the to-be-tested solid state storage piece 210 is tested based on the target operating parameter of the heat sink 120 corresponding to the to-be-tested solid state storage piece 210, for example, the target operating parameter A1 of the heat sink 120 corresponding to the to-be-tested solid state storage piece 210 is determined based on the preset target operating temperature and the actual operating temperature of the to-be-tested solid state storage piece 210, and the operating temperature of the to-be-tested solid state storage piece 210 is regulated by the heat sink 120 based on the target operating parameter A1, thereby achieving the aging test.

[0031] In the embodiment, an aging test system is applied to a solid state storage device, which includes a controller, at least one heat sink and at least one temperature sensor. The solid state storage device includes at least one to-be-tested solid state storage piece. The heat sink is used to dissipate heat from the corresponding to-be-tested solid state storage piece. The temperature sensor is used to sense the current operating temperature of the corresponding to-be-tested solid state storage piece. The target operating temperature of each of the at least one to-be-tested solid state storage piece is determined, and the current operating temperature of the to-be-tested solid state storage piece is obtained from the temperature sensor corresponding to the to-be-tested solid state storage piece. Further, according to the target operating temperature and the current operating temperature of the to-be-tested solid state storage piece, the target operating parameter of the heat sink corresponding to the to-be-tested solid state storage piece is determined, thereby achieving the aging test of the to-be-tested solid state storage piece. The current operating temperature of the to-be-tested solid state storage piece is obtained by the at least one temperature sensor, so as to more accurately control the temperature of the sample in the aging test. The at least one heat sink is used to dissipate heat from the corresponding to-be-tested solid state storage piece, so that the temperature distribution in the aging test process is uniform, thereby improving the aging test efficiency.

[0032] In some embodiments, the controller 110 is further configured to determine the initial operating parameter of the heat sink 120 corresponding to the to-be-tested solid state storage piece 210, which is determined based on the capacity of the to-be-tested solid state storage piece 210 and the preset operating temperature for the to-be-tested solid state storage piece 210.

[0033] determining the initial operation parameter of the heat sink 120 corresponding to the to-be-tested solid state storage piece 210, i.e., determining the default rotating speed of the PWM speed control fan corresponding to the to-be-tested solid state storage piece 210, for example, the default rotating speed is 0.7 m / S, wherein the initial operation parameter of the heat sink 120 corresponding to the to-be-tested solid state storage piece 210 is determined based on the capacity of the to-be-tested solid state storage piece 210 and the preset operation temperature for the to-be-tested solid state storage piece 210, i.e., according to the capacity of the to-be-tested solid state storage piece 210 and the preset operation temperature of the to-be-tested solid state storage piece 210, the initial operation parameter of the heat sink 120 corresponding to the to-be-tested solid state storage piece 210 is determined, and the preset operation temperature can be the target operation temperature of the to-be-tested solid state storage piece 210.

[0034] At this time, the controller 110 determines the target operation parameter of the heat sink 120 corresponding to the to-be-tested solid state storage piece 210 according to the target operation temperature and the current operation temperature of the to-be-tested solid state storage piece 210, including: the controller 110 determines the operation adjustment parameter of the heat sink 120 corresponding to the to-be-tested solid state storage piece 210 according to the target operation temperature and the current operation temperature of the to-be-tested solid state storage piece 210; and determines the target operation parameter of the heat sink 120 corresponding to the to-be-tested solid state storage piece 210 according to the initial operation parameter of the heat sink 120 corresponding to the to-be-tested solid state storage piece 210 and the operation adjustment parameter of the heat sink 120 corresponding to the to-be-tested solid state storage piece 210.

[0035] For example, the target operation temperature T1 of each to-be-tested solid state storage piece in at least one to-be-tested solid state storage piece 210 is determined, and the current operation temperature T2 of the to-be-tested solid state storage piece 210 is obtained from the temperature sensor 130 corresponding to the to-be-tested solid state storage piece 210. The controller 110 determines the operation adjustment parameter of the heat sink 120 corresponding to the to-be-tested solid state storage piece 210 according to the target operation temperature T1 and the current operation temperature T2 of the to-be-tested solid state storage piece 210, for example, there is a large temperature difference between the target operation temperature T1 and the current operation temperature T2, and the temperature regulation is performed on the heat sink 120 based on the operation adjustment parameter. Specifically, the target operation parameter of the heat sink 120 corresponding to the to-be-tested solid state storage piece 210 is determined according to the initial operation parameter of the heat sink 120 corresponding to the to-be-tested solid state storage piece 210 and the operation adjustment parameter of the heat sink 120 corresponding to the to-be-tested solid state storage piece 210, i.e., the initial operation parameter is adjusted by the operation adjustment parameter to obtain the target operation parameter of the heat sink 120 corresponding to the to-be-tested solid state storage piece 210, so that the to-be-tested solid state storage piece 210 is subjected to aging test based on the target operation parameter of the heat sink 120 corresponding to the to-be-tested solid state storage piece 210.

[0036] Further, in some embodiments, the controller 110 determines the operation adjustment parameter of the heat dissipator 120 corresponding to the to-be-tested solid state storage piece 210 according to the target operating temperature and the current operating temperature of the to-be-tested solid state storage piece 210, including: the controller 110 determines a preset temperature range of the target operating temperature according to the target operating temperature of the to-be-tested solid state storage piece 210; in response to the current operating temperature being located outside the preset temperature range, determining a temperature difference between the current operating temperature and the target operating temperature, and determining the operation adjustment parameter of the heat dissipator 120 corresponding to the to-be-tested solid state storage piece 210 according to the temperature difference between the current operating temperature and the target operating temperature.

[0037] The controller 110 determines a preset temperature range of the target operating temperature according to the target operating temperature of the to-be-tested solid state storage piece 210, for example, determines that the target operating temperature of the to-be-tested solid state storage piece 210 is 80℃, and determines that the temperature variation interval of the target operating temperature is ±5℃, that is, the preset temperature range is 75℃-85℃. In response to the current operating temperature being located outside the preset temperature range, a temperature difference between the current operating temperature and the target operating temperature is determined, and the operation adjustment parameter of the heat dissipator 120 corresponding to the to-be-tested solid state storage piece 210 is determined according to the temperature difference between the current operating temperature and the target operating temperature, for example, the current operating temperature of the to-be-tested solid state storage piece 210 is 90℃, at this time, in response to the current operating temperature 90℃ being located outside the preset temperature range 75℃-85℃, the temperature difference between the current operating temperature and the target operating temperature is determined, and the operation adjustment parameter of the heat dissipator 120 corresponding to the to-be-tested solid state storage piece 210 is determined according to the temperature difference between the current operating temperature and the target operating temperature, for example, the current operating parameter of the heat dissipator 120 is adjusted upward based on the operation condition parameter to increase the speed and speed up the cooling.

[0038] In some embodiments, the controller 110 determines the target operating parameter of the heat dissipator 120 corresponding to the to-be-tested solid state storage piece 210 according to the target operating temperature and the current operating temperature of the to-be-tested solid state storage piece 210, including: the controller 110 determines a preset temperature range of the target operating temperature according to the target operating temperature of the to-be-tested solid state storage piece 210; in response to the current operating temperature being located within the preset temperature range, the initial operating parameter of the heat dissipator 120 corresponding to the to-be-tested solid state storage piece 210 is determined as the target operating parameter of the heat dissipator 120 corresponding to the to-be-tested solid state storage piece 210.

[0039] The controller 110 determines a preset temperature range of the target operating temperature according to the target operating temperature of the to-be-tested solid state storage piece 210, for example, determines that the target operating temperature of the to-be-tested solid state storage piece 210 is 80℃, and determines that the temperature variation interval of the target operating temperature is ±5℃, that is, the preset temperature range is 75℃-85℃. Further, in response to that the current operating temperature is located in the preset temperature range, for example, the current operating temperature of the to-be-tested solid state storage piece 210 is 81℃, that is, the current operating temperature of the to-be-tested solid state storage piece 210 is located in the preset temperature range, the initial operating parameter of the heat sink 120 corresponding to the to-be-tested solid state storage piece 210 can be determined as the target operating parameter of the heat sink 120 corresponding to the to-be-tested solid state storage piece 210, so that the to-be-tested solid state storage piece 210 is subjected to the aging test based on the target operating parameter of the heat sink 120 corresponding to the to-be-tested solid state storage piece 210, wherein the initial operating parameter of the heat sink 120 corresponding to the to-be-tested solid state storage piece 210 is determined based on the capacity of the to-be-tested solid state storage piece 210 and the preset operating temperature for the to-be-tested solid state storage piece 210.

[0040] In some embodiments, as shown in FIG. 1, Figure 4 Figure 4 FIG. 1 is a structural schematic diagram of an aging test system according to an embodiment of the present application, the aging test system 100 comprising a controller 110, at least one heat sink 120, at least one temperature sensor 130, and at least one auxiliary heating module 140, wherein the at least one auxiliary heating module 140 is electrically connected to the at least one controller 110 and corresponds to the at least one to-be-tested solid state storage piece 210 one by one, and each of the at least one auxiliary heating module 140 is used for heating the to-be-tested solid state storage piece 210 corresponding thereto.

[0041] It can be understood that the aging test system 100 can comprise the controller 110, the at least one heat sink 120, the at least one temperature sensor 130, and the at least one auxiliary heating module 140, wherein each of the auxiliary heating modules is used for heating the to-be-tested solid state storage piece 210 corresponding thereto; or the aging test system 100 can comprise the controller 110, the at least one heat sink 120, the at least one temperature sensor 130, and one auxiliary heating module 140, that is, the at least one to-be-tested solid state storage piece 210 is heated by the one auxiliary heating module 140.

[0042] ​Further, the controller 110 is further configured to: in response to a temperature difference between the target operating temperature and the current operating temperature of the to-be-tested solid state storage piece 210 being greater than a preset value and the current operating temperature being less than the target operating temperature, determine the target operating parameters of the heat sink 120 corresponding to the to-be-tested solid state storage piece 210 and the auxiliary heating module 140 corresponding thereto, so that the to-be-tested solid state storage piece 210 is subjected to the aging test based on the target operating parameters of the heat sink 120 corresponding to the to-be-tested solid state storage piece 210 and the auxiliary heating module 140 corresponding thereto.

[0043] The target operating temperature T1 of each to-be-tested solid state storage piece 210 is determined, and the current operating temperature T2 of the to-be-tested solid state storage piece 210 is obtained from the temperature sensor 130 corresponding to the to-be-tested solid state storage piece 210. In response to a temperature difference between the target operating temperature and the current operating temperature of the to-be-tested solid state storage piece 210 being greater than a preset value and the current operating temperature being less than the target operating temperature, for example, in response to a temperature difference between the target operating temperature T1 and the current operating temperature T2 of the to-be-tested solid state storage piece 210 being greater than a preset value and T1 being greater than T2, the target operating parameters of the heat sink 120 corresponding to the to-be-tested solid state storage piece 210 and the target operating parameters of the auxiliary heating module 140 corresponding thereto can be determined, so that the to-be-tested solid state storage piece 210 is subjected to the aging test based on the target operating parameters of the heat sink 120 corresponding to the to-be-tested solid state storage piece 210 and the target operating parameters of the auxiliary heating module 140 corresponding thereto.

[0044] In this embodiment, the target operating parameters of the heat sink 120 corresponding to the to-be-tested solid state storage piece and the auxiliary heating module corresponding thereto are determined, so that the to-be-tested solid state storage piece is subjected to the aging test based on the target operating parameters of the heat sink 120 corresponding to the to-be-tested solid state storage piece and the auxiliary heating module corresponding thereto. That is, under the condition that the SSD aging firmware is stably running, if thermal equilibrium at the maximum aging temperature cannot be achieved through natural heat dissipation, the rotation speed of the external fan is controlled through the feedback of the measurement of the internal temperature sensor of the to-be-tested solid state storage piece, so that the temperature condition during the SSD aging test is achieved, and the demand for the aging temperature range of the NAND particles is simultaneously met. If the self-generated heat is insufficient to maintain the aging temperature in the ideal interval relative to the environmental heat dissipation, the fan is turned on and the auxiliary heating module works to supplement the heat supply for the aging of the disk piece.

[0045] In some embodiments, the to-be-tested solid state storage piece 210 is subjected to the aging test based on the target operating parameters of the heat sink 120 corresponding to the to-be-tested solid state storage piece 210, which includes: performing aging read-write operations on at least one solid state storage particle 213 to determine the heat for the aging test; and dissipating the heat for the aging test based on the target operating parameters of the heat sink 120 corresponding to the to-be-tested solid state storage piece 210 to achieve the aging test.

[0046] The at least one solid state storage particle 213 is operated to perform aging read-write operation to determine the heat for the aging test. The solid state storage chip 210 under test generates heat spontaneously based on the aging read-write operation of the at least one solid state storage particle 213, and then the heat for the aging test is dissipated by the heat sink 120 based on the target operating parameters of the heat sink 120 corresponding to the solid state storage chip 210 under test, so as to achieve the aging test.

[0047] In some embodiments, the heat for the aging test includes at least one of the heat generated by the power consumption of the main controller 211, the heat generated by the power consumption of the power supply circuit 212, and the heat generated by the power consumption of the at least one solid state storage particle 213 operated to perform the aging read-write operation.

[0048] The at least one solid state storage particle 213 is operated to perform aging read-write operation to determine the heat for the aging test, that is, the main controller 211, the power supply circuit 212 and the at least one solid state storage particle 213 provide heating power for the aging test when the at least one solid state storage particle 213 is operated to perform the aging read-write operation, specifically, the heat generated by the power consumption of the main controller 211, the heat generated by the power consumption of the power supply circuit 212, and the heat generated by the power consumption of the at least one solid state storage particle 213 operated to perform the aging read-write operation. It can be understood that for some product test cases with large spontaneous heat, the heat generated by the aging read-write operation of the at least one solid state storage particle can be used for aging test, and only the heat sink 120 is needed for auxiliary heat dissipation; and for some product test cases with relatively small spontaneous heat, auxiliary heating power can be increased according to the configuration related to mass production. The auxiliary heating power of the auxiliary heating module can be realized in a default value configuration mode, that is, the heat generated by the aging read-write operation of the at least one solid state storage particle and the heat generated by the auxiliary heating module are used for aging test, and the heat sink 120 is used for auxiliary heat dissipation.

[0049] In some embodiments, the correspondence between the current operating temperature of the solid state storage chip 210 under test sensed by the temperature sensor 130 and the temperature of the solid state storage particle 213 is determined based on a preset rule.

[0050] The correspondence between the current operating temperature of the solid state storage chip 210 under test sensed by the temperature sensor 130 and the temperature of the solid state storage particle 213 is determined based on a preset rule, for example, the correspondence between the current operating temperature of the solid state storage chip 210 under test sensed by the temperature sensor 130 and the temperature of the solid state storage particle 213 can be determined by the results of research and development tests.

[0051] Please refer to Figure 5 , Figure 5is a flowchart of an aging test method of a solid state storage device according to an embodiment of the present application. The execution subject of the method can be the aging test system 100 described above, for example, to perform aging test on the solid state storage device 200, which comprises at least one to-be-tested solid state storage chip 210.

[0052] It should be noted that the method of the present application is not limited to the flow sequence shown Figure 5 The flow sequence shown is not limiting.

[0053] In some possible implementations, the method can be implemented by a processor invoking computer readable instructions stored in a memory, such as Figure 5 The method can comprise the following steps, as shown in the flowchart:

[0054] S51: Determine the target operating temperature of each to-be-tested solid state storage chip in the at least one to-be-tested solid state storage chip.

[0055] Determine the target operating temperature of each to-be-tested solid state storage chip in the at least one to-be-tested solid state storage chip 210. The target operating temperature can be a temperature point for performing aging test, i.e., the to-be-tested solid state storage chip 210 performs aging test based on the target operating temperature.

[0056] S52: Obtain the current operating temperature of the to-be-tested solid state storage chip.

[0057] Obtain the current operating temperature of the to-be-tested solid state storage chip 210, for example, by a temperature sensor 130 corresponding to a to-be-tested solid state storage chip 210 to obtain the actual operating temperature of the to-be-tested solid state storage chip 210 at regular intervals, and the time interval can be 6s.

[0058] S53: Determine the target operating parameter of the heat sink corresponding to the to-be-tested solid state storage chip according to the target operating temperature and the current operating temperature of the to-be-tested solid state storage chip, so that the to-be-tested solid state storage chip is tested based on the target operating parameter of the heat sink corresponding to the to-be-tested solid state storage chip.

[0059] Determine the target operating parameter of the heat sink 120 corresponding to the to-be-tested solid state storage chip 210 according to the target operating temperature and the current operating temperature of the to-be-tested solid state storage chip 210, which can be power, speed, etc., so that the to-be-tested solid state storage chip 210 is tested based on the target operating parameter of the heat sink 120 corresponding to the to-be-tested solid state storage chip 210, for example, based on the preset target operating temperature and the actual operating temperature of the to-be-tested solid state storage chip 210, to determine the target operating parameter A1 of the heat sink 120 corresponding to the to-be-tested solid state storage chip 210, and based on the target operating parameter A1, to regulate the operating temperature of the to-be-tested solid state storage chip 210 by using the corresponding heat sink 120, thereby realizing aging test.

[0060] Those skilled in the art can understand that, in the above method of the specific embodiment, the writing order of each step does not mean a strict execution order and does not constitute any limitation on the implementation process. The specific execution order of each step should be determined according to its function and possible internal logic.

[0061] The above description of each embodiment tends to emphasize the differences between each embodiment, and the same or similar parts can be referred to each other, which will not be repeated here for the sake of brevity.

[0062] In several embodiments provided in the present application, it should be understood that the disclosed method and related device can be implemented in other ways. For example, the above-described device implementation is only schematic; for example, the division of the modules or units is only a logical function division, and there can be another division manner in actual implementation; for example, a unit or component can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the displayed or discussed coupling or direct coupling or communication connection between each other can be indirect coupling or communication connection through some interface, device or unit, and can be electrical, mechanical or in other forms.

[0063] In addition, each functional unit in the various embodiments of the present application can be integrated into one processing unit, or each unit can exist physically, or two or more units can be integrated into one unit. The above-mentioned integrated unit can be realized in the form of hardware or in the form of a software functional unit.

[0064] If the integrated unit is realized in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer readable storage medium. Based on such an understanding, the technical solutions of the present application essentially or the part that makes a contribution to the prior art or the whole or part of the technical solutions can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes several instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) or a processor to execute all or part of the steps of the methods in the various embodiments of the present application. The foregoing storage medium includes: a U disk, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk, and various media that can store program codes.

[0065] Those skilled in the art can easily make modifications and changes to the device and method while keeping the teachings of the present application. Therefore, the above disclosure should be regarded as limited only by the scope of the appended claims.

Claims

1. An aging test system, characterized by, The application is applied to a solid-state storage device, which comprises at least one to-be-tested solid-state storage chip; the aging test system comprises: a controller; at least one heat sink, which is electrically connected to the controller and corresponds to the at least one to-be-tested solid-state storage chip, and each of the at least one heat sink is used for dissipating heat from the corresponding to-be-tested solid-state storage chip; and at least one temperature sensor, which is electrically connected to the controller and corresponds to the at least one to-be-tested solid-state storage chip, and each of the at least one temperature sensor is used for sensing the current operating temperature of the corresponding to-be-tested solid-state storage chip; wherein the controller is used for: determining the target operating temperature of each to-be-tested solid-state storage chip in the at least one to-be-tested solid-state storage chip; acquiring the current operating temperature of the to-be-tested solid-state storage chip from the temperature sensor corresponding to the to-be-tested solid-state storage chip; determining the target operating parameter of the heat sink corresponding to the to-be-tested solid-state storage chip according to the target operating temperature and the current operating temperature of the to-be-tested solid-state storage chip, so that the to-be-tested solid-state storage chip is subjected to the aging test based on the target operating parameter of the heat sink corresponding to the to-be-tested solid-state storage chip.

2. The system of claim 1, wherein, The controller is further used for determining the initial operating parameter of the heat sink corresponding to the to-be-tested solid-state storage chip; the controller determines the target operating parameter of the heat sink corresponding to the to-be-tested solid-state storage chip according to the target operating temperature and the current operating temperature of the to-be-tested solid-state storage chip, including: the controller determines the operating adjustment parameter of the heat sink corresponding to the to-be-tested solid-state storage chip according to the target operating temperature and the current operating temperature of the to-be-tested solid-state storage chip; the target operating parameter of the heat sink corresponding to the to-be-tested solid-state storage chip is determined according to the initial operating parameter of the heat sink corresponding to the to-be-tested solid-state storage chip and the operating adjustment parameter of the heat sink corresponding to the to-be-tested solid-state storage chip.

3. The system of claim 2, wherein, the controller determines the operating adjustment parameter of the heat sink corresponding to the to-be-tested solid-state storage chip according to the target operating temperature and the current operating temperature of the to-be-tested solid-state storage chip, including: the controller determines the preset temperature range of the target operating temperature according to the target operating temperature of the to-be-tested solid-state storage chip; in response to the current operating temperature being located outside the preset temperature range, a temperature difference between the current operating temperature and the target operating temperature is determined, and the operating adjustment parameter of the heat sink corresponding to the to-be-tested solid-state storage chip is determined according to the temperature difference between the current operating temperature and the target operating temperature.

4. The system of claim 1, wherein, The controller is further used for determining the initial operating parameter of the heat sink corresponding to the to-be-tested solid-state storage chip; the controller determines the target operating parameter of the heat sink corresponding to the to-be-tested solid-state storage chip according to the target operating temperature and the current operating temperature of the to-be-tested solid-state storage chip, including: the controller determines the preset temperature range of the target operating temperature according to the target operating temperature of the to-be-tested solid-state storage chip; in response to the current operating temperature being located within the preset temperature range, the initial operating parameter of the heat sink corresponding to the to-be-tested solid-state storage chip is determined as the target operating parameter of the heat sink corresponding to the to-be-tested solid-state storage chip.

5. The system according to any of claims 2-4, characterized in that, The initial operating parameter of the radiator corresponding to the to-be-tested solid-state storage piece is determined based on a capacity of the to-be-tested solid-state storage piece and a preset operating temperature for the to-be-tested solid-state storage piece.

6. The system of claim 1, wherein, The aging test system further comprises at least one auxiliary heating module, which is electrically connected to the at least one controller and corresponds to the at least one to-be-tested solid-state storage piece one by one, and each of the at least one auxiliary heating module is configured to heat the corresponding to-be-tested solid-state storage piece. The controller is further configured to: determine the target operating parameter of the radiator corresponding to the to-be-tested solid-state storage piece and the corresponding auxiliary heating module, so that the to-be-tested solid-state storage piece is subjected to the aging test based on the target operating parameter of the radiator corresponding to the to-be-tested solid-state storage piece and the corresponding auxiliary heating module, in response to the temperature difference between the target operating temperature and the current operating temperature of the to-be-tested solid-state storage piece being greater than a preset value and the current operating temperature being less than the target operating temperature.

7. The system of claim 1, wherein, The to-be-tested solid-state storage piece comprises a main controller, a power supply circuit, and at least one solid-state storage particle, wherein the main controller is connected to the power supply circuit and the at least one solid-state storage particle, and the power supply circuit is further connected to the at least one solid-state storage particle. The to-be-tested solid-state storage piece is subjected to the aging test based on the target operating parameter of the radiator corresponding to the to-be-tested solid-state storage piece, comprising: performing an aging read-write operation on the at least one solid-state storage particle to determine heat for the aging test; performing heat dissipation on the heat for the aging test based on the target operating parameter of the radiator corresponding to the to-be-tested solid-state storage piece to achieve the aging test.

8. A method of aging test of a solid state storage device, characterized by, The solid-state storage device applied to an aging test system comprises at least one to-be-tested solid-state storage piece, and the method comprises: determining a target operating temperature of each to-be-tested solid-state storage piece in the at least one to-be-tested solid-state storage piece; obtaining a current operating temperature of the to-be-tested solid-state storage piece; determining a target operating parameter of a radiator corresponding to the to-be-tested solid-state storage piece according to the target operating temperature and the current operating temperature of the to-be-tested solid-state storage piece, so that the to-be-tested solid-state storage piece is subjected to the aging test based on the target operating parameter of the radiator corresponding to the to-be-tested solid-state storage piece.

9. A solid state storage device, comprising: The at least one to-be-tested solid-state storage piece is subjected to the aging test by the aging test system of any one of claims 1-7 or the aging test method of the solid-state storage device of claim 8.

10. The solid state storage device of claim 9, wherein, The to-be-tested solid-state storage piece comprises a main controller, a power supply circuit, and at least one solid-state storage particle, wherein the main controller is connected to the power supply circuit and the at least one solid-state storage particle, and the power supply circuit is further connected to the at least one solid-state storage particle.

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