Small-sized test machine for final test of memory chip

Abstract

The invention relates to the technical field of memory chip testing, and particularly discloses a small-sized testing machine for final testing of a memory chip, which comprises a socket module; and a temperature control assembly. During high-temperature and low-temperature simulation tests, the sizes of the heat exchange plates are different, and the volumes of the air cavities are equal, so that the heat exchange efficiency of the heat exchange plates with relatively large sizes is relatively high, the temperature in the corresponding air cavities is relatively low (in high-temperature air) or relatively high (in low-temperature air), and to-be-tested environments with different temperature gradients can be set at the same time; when temperature shock needs to be simulated, only the high-temperature box or the low-temperature box needs to be quickly moved, so that air with large temperature difference can be in contact with the chip to be tested, the chip is tested when the temperature shock occurs, the actual use environment can be simulated, and the accuracy and the reliability of a test result are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of storage chip testing, and in particular to a small test machine for final testing of storage chips. BACKGROUND

[0002] Final testing (FT) of storage chips is a key link for ensuring the performance and reliability of storage chips. In the final testing link of storage chips, a dedicated final test machine is used for chip testing. The dedicated final test machine for chips is configured according to the full production capacity of mass production, and the number of boards and the size of the machine are increased. A final test machine for mass production also needs to be used with a power cabinet, a sorting machine and other devices, which increases the overall floor space and compresses the user's operation space. When facing the iteration of new chip testing products or the testing process of new boards, the use of final test machines for mass production will greatly waste the use of machine resources and power costs. If the test machine is not used, the accurate test environment for product upgrading cannot be obtained.

[0003] Therefore, a small test machine for final testing of storage chips is needed. However, the small test machine on the market has the following defects: the temperature test of the existing small test machine only supports gradual temperature rise or fall, and cannot simulate the temperature sudden change (such as extreme high temperature impact or instantaneous extreme cold environment) that may occur in actual application, which leads to the disconnection of temperature test conditions and actual application scenarios, affecting the accuracy and reliability of test results. Therefore, it is urgent to develop a small test machine with precise temperature simulation capability. SUMMARY

[0004] The present application aims to solve the technical problem that the existing small test machine cannot simulate temperature sudden change when in use.

[0005] The object of the present application can be achieved by the following technical solutions: A small test machine for final testing of storage chips, comprising a test table body, the small test machine further comprising: a socket module, the socket module being installed on the test table body, the socket module comprising a protective shell and a socket board, the protective shell covering the socket board, the socket board protruding from the protective shell, and a chip under test being inserted into the socket board; The temperature control assembly comprises a guide plate, a high-temperature box and a low-temperature box, the guide plate is installed on a protective shell, the socket plate card is inserted from the top of the guide plate, the top of the guide plate is flush with the top of the socket plate card, sliding plates are slidably installed on both sides of the guide plate, the high-temperature box and the low-temperature box are installed between the two groups of sliding plates, a driving module is installed on the guide plate, the driving module drives the sliding plates to move, a plurality of fixing cylinders are arranged on the high-temperature box and the low-temperature box, heat exchange plates are installed in the fixing cylinders, the sizes of the heat exchange plates in the plurality of fixing cylinders are arranged in a gradient mode, a plurality of air cavities are formed in the high-temperature box and the low-temperature box, the air cavities are located between the fixing cylinders and the guide plate, a plurality of hot inlets and a plurality of hot outlets are installed on both sides of the high-temperature box, the hot inlets are connected with an external hot air supply unit, cold inlets and cold outlets are installed on both sides of the low-temperature box, the cold inlets are connected with an external cold air supply unit.

[0006] As a preferred form of the above technical solution, the volumes of the air cavities in the high-temperature box are equal, the volumes of the air cavities in the low-temperature box are equal, and the high-temperature box and the low-temperature box are made of heat insulation materials.

[0007] As a preferred form of the above technical solution, the bottom of the fixing cylinder is symmetrically and elastically rotatably installed with sealing plates, the heat exchange plates are separated from the air cavities when the two groups of sealing plates are combined, an extension piece is installed on the fixing cylinder, and the output end of the extension piece is connected with the heat exchange plate.

[0008] As a preferred form of the above technical solution, a humidity control assembly is installed on the fixing cylinder, the humidity control assembly comprises a water storage cavity, a plurality of water storage cavities are formed in the fixing cylinder, water is stored in the water storage cavities, a plurality of nozzles are arranged at the edge of the bottom of the fixing cylinder, the nozzles are communicated with the water storage cavities, a pressing plate is slidably arranged in the water storage cavity, a pressing rod is arranged on the pressing plate, the output end of the extension piece is fixed with a tooth ring, an ear plate is arranged on the tooth ring, the ear plate is used in cooperation with the pressing rod, a driving piece is installed on the fixing cylinder, a gear is installed on the driving piece, the gear is intermeshed with the tooth ring, and the length of the gear is greater than the maximum downward movement distance of the tooth ring.

[0009] As a preferred form of the above technical solution, the plurality of nozzles are directed towards the inner wall of the air cavity.

[0010] As a preferred form of the above technical solution, the test bench body comprises a base, a fixing frame, a machine bench body and a rotating module, the fixing frame is fixed on the base, the machine bench body is rotatably installed on the fixing frame, the rotating module is installed on the fixing frame and drives the machine bench body to rotate, and the socket plate card is installed on the machine bench body.

[0011] As a preferred form of the above technical solution, a machine bench switch and an emergency stop switch are installed on the machine bench body.

[0012] As the preferred technical solution of the above, the machine body is provided with an interface module and a board fixing member.

[0013] As the preferred technical solution of the above, the machine body is provided with a heat dissipation module.

[0014] The beneficial effects of the present application are: 1. In the present application, during high-temperature and low-temperature simulation testing, due to the different sizes of the heat exchange plates and the equal volume of the air cavities, the heat exchange efficiency of the larger heat exchange plates is higher, so the temperature in the corresponding air cavity is relatively lower (when the air is high-temperature) or relatively higher (when the air is low-temperature), while the temperature in the air cavity corresponding to the smaller heat exchange plate is relatively higher (when the air is high-temperature) or relatively lower (when the air is low-temperature), so that different temperature gradients of the test environment can be set at the same time, and when a sudden temperature change needs to be simulated, only the high-temperature chamber or the low-temperature chamber needs to be moved quickly, so that air with a large temperature difference can be in contact with the chip to be tested, thereby testing the chip when the temperature changes suddenly, which can simulate the actual use environment, thereby improving the accuracy and reliability of the test results. 2. In the present application, the machine body is rotated by the rotating module, so that the manual installation mode or the automatic mode can be switched when installing the chip to be tested, and the digital board card and the power supply board card providing test signals for the chip to be tested can also be conveniently installed on the board fixing member; by making the socket board card and the slot on the board fixing member in the form of a reduced version of the mass production machine, most of the interface board cards can be compatible and reused in the mass production test machine, thereby improving the utilization rate of the board cards to save design and manufacturing costs; by providing a multifunctional interface on the interface module, both manual testing mode and automatic testing mode with a small sorting machine can be used; during normal temperature testing, the board card is cooled by the heat dissipation module, air cooling is used in the case of non-full configuration, and liquid cooling is used in the case of near-full configuration, which improves the service life of the board card while considering energy saving. 3. In the present application, the extension of the telescopic member causes the heat exchange plate to move downward and push away the two sets of sealing plates, so that the heat exchange plate is in contact with the air in the cavity for heat exchange, which can make the two sets of sealing plates in a sealed state when preparing, thereby avoiding the rapid loss of heat or rapid heat absorption of the air introduced in front, causing uneven temperature gradient and affecting the accuracy and reliability of the test structure; at the same time, when the heat exchange plate moves downward and drives the two sets of sealing plates to rotate, the two sets of sealing plates will drive the air in the cavity to flow, and the heat exchange plate will reduce the pressure in the cavity, which can further promote the flow of air, so that the air can fully contact the chip to be tested, avoiding the inaccuracy and unreliability of the test results caused by insufficient contact between the air and the chip to be tested; in addition, the rapid flow of air can realize rapid heat exchange with the chip, thereby improving the temperature simulation efficiency and the test efficiency. 4、The present application, by driving gear rotation, so that the tooth ring ear plate rotation, until the ear plate rotation to the upper stop of the pressure bar, at this time, the extension of the telescopic member, so that the ear plate will move down extrusion pressure bar, so that the pressure plate down extrusion water in the water storage cavity, the water in the water storage cavity from several spray head, the water is in the state of atomization, so as to increase the humidity in the air cavity, humidity can be adjusted by the distance of heat exchange plate down, heat exchange plate down distance more, the more water, the humidity will be greater, in temperature simulation test, add humidity simulation, so as to restore the chip actual use environment more accurately, so as to further improve the accuracy and reliability of test results. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 is the whole structure schematic diagram of the present application; Figure 2 is the test bench structure schematic diagram; Figure 3 is the test bench bottom structure schematic diagram; Figure 4 is the temperature control assembly structure schematic diagram; Figure 5 is the temperature control assembly overhead structure schematic diagram; Figure 6 is the high temperature box section structure schematic diagram; Figure 7 is the humidity control assembly structure schematic diagram; Figure 8 is the sealing plate structure schematic diagram; Figure 9 is the sealing plate structure schematic diagram after turning over.

[0016] In the drawing: 1, test bench body;11, base;12, fixed frame;13, machine table body;14, rotating module;15, machine table switch;16, interface module;17, heat dissipation module;18, emergency stop switch;19, board card fixing piece;2, socket module;21, protective shell;22, socket board card;3, temperature control assembly;4, guide plate;41, driving module;42, sliding plate;5, high temperature box;51, hot import;52, hot export;6, low temperature box;61, cold import;62, cold export;7, fixed cylinder;71, heat exchange plate;72, telescopic member;73, sealing plate;8, air cavity;9, humidity control assembly;91, water storage cavity;92, pressure plate;93, pressure bar;94, spray head;95, tooth ring;96, ear plate;97, driving member;98, gear. DETAILED DESCRIPTION

[0017] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0018] like Figures 1-9 As shown, a small testing machine for final testing of memory chips includes a testing platform body 1, and the small testing machine further includes: Socket module 2 is installed on the test bench body 1. Socket module 2 includes a protective shell 21 and a socket board 22. The protective shell 21 covers the socket board 22, and the socket board 22 protrudes from the protective shell 21. The test chip is inserted into the socket board 22. Temperature control component 3 includes guide plate 4, high temperature chamber 5, and low temperature chamber 6. Guide plate 4 is installed on protective shell 21. Socket plate 22 protrudes from the top of guide plate 4. The top of guide plate 4 is flush with the top of socket plate 22. Slide plates 42 are slidably installed on both sides of guide plate 4. High temperature chamber 5 and low temperature chamber 6 are installed between two sets of slide plates 42. Drive component 41 is installed on guide plate 4. Drive component 41 drives slide plate 42 to move. Several fixed cylinders 7 are provided on both high temperature chamber 5 and low temperature chamber 6. Heat exchange plates 71 are installed in the fixed cylinders 7. The size of the heat exchange plates 71 in the fixed cylinders 7 is arranged in a gradient. Several air chambers 8 are opened in both high temperature chamber 5 and low temperature chamber 6. The air chambers 8 are located between the fixed cylinders 7 and guide plate 4. Several hot inlets 51 and several hot outlets 52 are installed on both sides of high temperature chamber 5. Hot inlets 51 are connected to an external hot air supply unit. Cold inlets 61 and cold outlets 62 are installed on both sides of low temperature chamber 6. Cold inlets 61 are connected to an external cold air supply unit.

[0019] The test bench body 1 includes a base 11, a mounting frame 12, a test bench body 13, and a rotating module 14. The mounting frame 12 is fixed to the base 11, and the test bench body 13 is rotatably mounted on the mounting frame 12. The rotating module 14 is mounted on the mounting frame 12 and drives the test bench body 13 to rotate. A socket board 22 is mounted on the test bench body 13. A test bench switch 15 and an emergency stop switch 18 are mounted on the test bench body 13. An interface module 16 and a board fixing component 19 are mounted on the test bench body 13. A heat dissipation module 17 is mounted on the test bench body 13.

[0020] The high-temperature chamber 5 has several air chambers 8 with equal volumes, and the low-temperature chamber 6 has several air chambers 8 with equal volumes. Both the high-temperature chamber 5 and the low-temperature chamber 6 are made of heat-insulating material.

[0021] In actual application, three temperatures (high temperature, normal temperature and low temperature) are needed in the temperature simulation test. In normal temperature test, the chip to be tested is directly inserted into the socket card 22 for test. In high temperature and low temperature simulation test, the chip to be tested is first inserted into the socket card 22, and then the temperature control assembly 3 is installed on the protective shell 21. The external hot air supply unit is used to fill the high temperature air into the air cavities 8 in the high temperature box 5, and the external cold air supply unit is used to fill the low temperature air into the air cavities 8 in the low temperature box 6. Since the sizes of the heat exchange plates 71 are different, and the volumes of the air cavities 8 are equal, the heat exchange efficiency of the heat exchange plates 71 with large size is high, so the temperature in the corresponding air cavity 8 is relatively low (when the high temperature air is used) or relatively high (when the low temperature air is used). The temperature in the air cavity corresponding to the heat exchange plate 71 with small size is relatively high (when the high temperature air is used) or relatively low (when the low temperature air is used). Therefore, different temperature gradients of the test environment can be set at the same time. When the test of gradually increasing or decreasing temperature needs to be simulated, the slide plate 42 is slowly moved by the driving member 41, so that different air cavities 8 are in communication with the socket card 22, thereby realizing the test of the chip in the stable and gradually increasing or decreasing temperature. When the temperature needs to be simulated, the high temperature box 5 or the low temperature box 6 is quickly moved, so that the air with large temperature difference is in contact with the chip to be tested, thereby realizing the test of the chip in the temperature shock. Therefore, the actual use environment can be simulated, thereby improving the accuracy and reliability of the test results.

[0022] When the next temperature shock simulation test is performed, the hot outlet 52 and the cold outlet 62 are opened, and the external hot air supply unit is used to inject high temperature air into the air cavities 8 in the high temperature box 5, and the external cold air supply unit is used to inject low temperature air into the air cavities 8 in the low temperature box 6. The injected high temperature air discharges the high temperature air in the original air cavity 8 from the hot outlet 52, so that the new high temperature air gradually fills the air cavity 8. The injected low temperature air discharges the low temperature air in the original air cavity from the cold outlet 62, so that the new low temperature air gradually fills the air cavity 8. As described above, the newly entered high temperature air or low temperature air can squeeze and discharge the original high temperature air and low temperature air, thereby effectively avoiding the influence of the high temperature air and low temperature air which have been cooled and heated in the last test on the results of this temperature shock test.

[0023] The machine body 13 is rotated by the rotating module 14, so that the manual installation mode or the automatic mode is switched when the chip to be tested is installed, and meanwhile, it is convenient to install the digital board and the power supply board which provide test signals for the chip to be tested on the board fixing member 19; the socket board 22 and the slot on the board fixing member 19 are made in a reduced version of the mass production machine, so that most of the interface boards can be compatible and reused in the mass production test machine, thereby improving the board utilization rate to save the design cost and the board manufacturing cost; the multifunctional interface is arranged on the interface module 16, so that the manual test mode can be used, and the automatic test mode can be matched with the small sorting machine; when the normal temperature test is performed, the board is cooled by the cooling module 17, the air cooling is used in the case of non-full configuration, and the liquid cooling is used in the case of close to full configuration, so that the service life of the board is improved under the consideration of energy saving.

[0024] Further, the sealing plates 73 are symmetrically and elastically rotatably installed at the bottom of the fixed cylinder 7, the heat exchange plates 71 are separated from the air cavities 8 when the two sets of sealing plates 73 are combined, the telescopic members 72 are installed on the fixed cylinder 7, and the output ends of the telescopic members 72 are connected with the heat exchange plates 71.

[0025] In actual application, the heat exchange plates 71 are pushed away from the two sets of sealing plates 73 by being moved downward by the telescopic members 72, so that the heat exchange plates 71 are in contact with the air in the air cavities 8 to exchange heat. In this way, the two sets of sealing plates 73 are in a sealed state when the preparation work is performed, so that the heat loss or heat absorption of the air introduced in advance is avoided, and the temperature gradient is not balanced, thereby avoiding affecting the accuracy and reliability of the test structure. Meanwhile, when the heat exchange plates 71 move downward to push the two sets of sealing plates 73 to rotate, the two sets of sealing plates 73 drive the air in the air cavities 8 to flow, and the heat exchange plates 71 reduce the pressure in the air cavities 8, so as to further promote the air flow. In this way, the air can be fully in contact with the chip to be tested, so as to avoid the test result being inaccurate and unreliable due to insufficient contact between the air and the chip to be tested. In addition, the rapidly flowing air can realize rapid heat exchange with the chip, thereby accelerating the temperature simulation efficiency and improving the test efficiency.

[0026] Further, the humidity control assembly 9 is installed on the fixed cylinder 7, the humidity control assembly 9 includes the water storage cavities 91, a plurality of water storage cavities 91 are formed in the fixed cylinder 7, water is stored in the water storage cavities 91, a plurality of nozzles 94 are arranged at the edge of the bottom of the fixed cylinder 7, the nozzles 94 are in communication with the water storage cavities 91, the pressure plates 92 are slidably arranged in the water storage cavities 91, the pressure rods 93 are arranged on the pressure plates 92, the tooth rings 95 are fixed to the output ends of the telescopic members 72, the ear plates 96 are arranged on the tooth rings 95, the ear plates 96 are used in cooperation with the pressure rods 93, the driving members 97 are installed on the fixed cylinder 7, the gear wheels 98 are installed on the driving members 97, the gear wheels 98 are in meshing with the tooth rings 95, and the length of the gear wheels 98 is greater than the maximum downward movement distance of the tooth rings 95.

[0027] In actual application, when humidity simulation is needed, the gear 98 is rotated by the driving member 97, so that the tooth ring 95 drives the lug plate 96 to rotate until the lug plate 96 stops above the pressure rod 93, at this time, the telescopic member 72 is elongated, so that the lug plate 96 moves downward to press the pressure rod 93, the pressing plate 92 moves downward to press the water in the water storage cavity 91, the water in the water storage cavity 91 is sprayed from the plurality of nozzles 94, the sprayed water is in atomized state, so that the humidity in the air cavity 8 is increased, the humidity can be adjusted by the downward moving distance of the heat exchange plate 71, the more the downward moving distance of the heat exchange plate 71, the more the sprayed water, and the greater the humidity, when temperature simulation test is added with humidity simulation, the actual use environment of the chip can be restored more accurately, so as to further improve the accuracy and reliability of the test result.

[0028] Further, the plurality of nozzles 94 are directed to the inner wall of the air cavity 8.

[0029] In actual application, the water mist sprayed by the nozzle 94 does not directly face the chip, so that the chip is effectively prevented from being damaged by direct water, the sprayed water mist contacts the inner wall of the air cavity 8, and when the water mist is sprayed, the two groups of sealing plates 73 rotate downward, and the pressure in the air cavity 8 is reduced, so that the water mist can be quickly attached in the air flow, so that the humidity distribution in the air cavity 8 is more uniform, so that the humidity simulation is more real, so as to further improve the accuracy and reliability of the test result.

[0030] The basic principle, main features and advantages of the present application are shown and described above. It should be understood by those skilled in the art that the present application is not limited by the above embodiments, the above embodiments and descriptions in the specification are only to illustrate the principle of the present application, various changes and improvements can be made without departing from the spirit and scope of the present application, and these changes and improvements all fall within the scope of the present application.

Claims

1. A compact test machine for final testing of memory chips, comprising a test machine body (1), characterized in that, The small test machine also includes: Socket module (2), socket module (2) is installed on the test bench body (1), socket module (2) includes protective shell (21) and socket board card (22); Temperature control assembly (3), temperature control assembly (3) includes guide plate (4), high temperature box (5) and low temperature box (6), guide plate (4) is installed on the protective shell (21), socket board card (22) is out of the top of guide plate (4), the top of guide plate (4) is flush with the top of socket board card (22), the both sides of guide plate (4) are slidably installed with slide plate (42), high temperature box (5) and low temperature box (6) are installed between the two groups of slide plates (42), drive module (41) is installed on the guide plate (4), high temperature box (5) and low temperature box (6) are provided with a plurality of fixed cylinders (7), heat exchange plates (71) are installed in the fixed cylinders (7), the sizes of the heat exchange plates (71) in the plurality of fixed cylinders (7) are set in gradient, a plurality of air cavities (8) are formed in high temperature box (5) and low temperature box (6), the air cavities (8) are located between the fixed cylinders (7) and the guide plate (4), a plurality of hot inlets (51) and hot outlets (52) are installed on the both sides of high temperature box (5), a plurality of cold inlets (61) and cold outlets (62) are installed on the both sides of low temperature box (6).

2. The compact test handler for final testing of memory chips as recited in claim 1, wherein, The volumes of the plurality of air cavities (8) in the high temperature box (5) are equal, the volumes of the plurality of air cavities (8) in the low temperature box (6) are equal, the high temperature box (5) and the low temperature box (6) are made of heat insulation material.

3. The compact test handler for final testing of memory chips as recited in claim 2, wherein, The bottom of the fixed cylinder (7) is symmetrically and elastically rotatably installed with a sealing plate (73), when the two groups of sealing plates (73) are combined, the heat exchange plates (71) are separated from the air cavities (8), the fixed cylinder (7) is installed with an expansion piece (72), the output end of the expansion piece (72) is connected with the heat exchange plate (71).

4. The compact test handler for final testing of memory chips as recited in claim 3, wherein, The fixed cylinder (7) is installed with a humidity control assembly (9), the humidity control assembly (9) includes a water storage cavity (91), a plurality of water storage cavities (91) are formed in the fixed cylinder (7), water is stored in the water storage cavities (91), a plurality of nozzles (94) are arranged at the edge position of the bottom of the fixed cylinder (7), the nozzles (94) are communicated with the water storage cavities (91), a pressing plate (92) is slidably arranged in the water storage cavity (91), a pressing rod (93) is arranged on the pressing plate (92), the output end of the expansion piece (72) is fixedly provided with a gear ring (95), an ear plate (96) is arranged on the gear ring (95), the ear plate (96) is used in cooperation with the pressing rod (93), a driving piece (97) is installed on the fixed cylinder (7), a gear wheel (98) is installed on the driving piece (97), the gear wheel (98) is intermeshed with the gear ring (95), the length of the gear wheel (98) is greater than the maximum downward movement distance of the gear ring (95).

5. The compact test handler for final testing of memory chips as recited in claim 4, wherein, A plurality of nozzles (94) are directed towards the inner wall of the air cavity (8).

6. The compact test handler for final testing of memory chips as recited in claim 1, wherein, The test bench body (1) comprises a base (11), a fixing frame (12), a bench body (13) and a rotating module (14), the fixing frame (12) is fixed on the base (11), the bench body (13) is rotatably installed on the fixing frame (12), the rotating module (14) is installed on the fixing frame (12) and drives the bench body (13) to rotate, and the socket board card (22) is installed on the bench body (13).

7. The compact test handler for final testing of memory chips as recited in claim 6, wherein, The bench body (13) is provided with a bench switch (15) and an emergency stop switch (18).

8. The compact test handler for final testing of memory chips as recited in claim 7, wherein, The bench body (13) is provided with an interface module (16) and a board card fixing piece (19).

9. The compact test handler for final testing of memory chips as recited in claim 8, wherein, The bench body (13) is provided with a heat dissipation module (17).

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