An etching device for processing an instrument chip
By designing an etching device with clamping and vibration mechanisms, the problems of slow wet etching rate and impurity influence were solved, achieving a highly efficient etching effect.
Patent Information
- Application Number
- CN202511437433.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-09
- Publication Date
- 2025-12-09
- Estimated Expiration
- 2045-10-09
AI Technical Summary
Traditional wet etching has a slow rate, and impurities on the surface of the etched silicon wafer often affect the etching effect.
An etching apparatus for instrument chip processing is used. The chip is fixed by a clamping mechanism, the etching rate is increased by the up-and-down movement of the lifting platform and the rotation of the stirring blade, and the vibration wave is generated by the vibration mechanism to remove impurities and improve the etching effect.
This technology enables the chip to remain fixed during the etching process, increases the etching rate, removes impurities from the silicon wafer surface, and improves the etching effect.
Smart Images
Figure CN120914148B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application relates to the technical field of chip etching processing, in particular to an etching device for instrument chip processing. BACKGROUND
[0002] With the continuous development of microelectronic technology, the application range of instrument chips is more and more extensive, and the performance and size requirements of the chips are also higher and higher. As one of the key steps of chip manufacturing, the etching process has a crucial influence on the performance and yield of the chips. The traditional instrument chip etching device adopts a wet etching or dry etching process, but there are many deficiencies.
[0003] Although the wet etching process is simple in operation and low in cost, the etching rate is slow, and in the etching process, impurities often exist on the surface of the silicon wafer, which affects the etching effect of the chip. Therefore, the application provides an etching device for instrument chip processing to solve the above problems. SUMMARY
[0004] The purpose of the application is to solve the problems existing in the prior art, such as the slow rate of traditional wet etching and the existence of impurities on the surface of etched silicon wafers affecting the etching effect, and to provide an etching device for instrument chip processing.
[0005] In order to achieve the above purpose, the application adopts the following technical scheme:
[0006] An etching device for instrument chip processing, comprising a shell, a top plate is fixedly arranged on the shell, the top plate is connected with the upper wall of the shell through two supporting rods, a motor is fixedly arranged on the top plate, an output end of the motor is fixedly connected with a rotating rod, the rotating rod is rotatably arranged through the top plate, an upper end opening cavity is arranged on the shell, the rotating rod extends into the cavity, a lifting platform is slidably arranged in the cavity of the shell, the lifting platform is slidably arranged in the cavity of the shell through two sliding rods, two sliding grooves corresponding to the sliding rods are symmetrically arranged on the inner wall of the shell, a chip clamping mechanism is arranged on the lifting platform, a sleeve ring is rotatably arranged on the lifting platform, the sleeve ring is sleeved on the rotating rod, a rotating opening corresponding to the sleeve ring is arranged on the lifting platform, external threads are arranged on the rotating rod, internal threads corresponding to the rotating rod are arranged on the inner wall of the sleeve ring, a connecting mechanism corresponding to the sleeve ring is arranged on the lifting platform, a plurality of stirring blades are fixedly arranged on the end of the rotating rod away from the motor, a vibration mechanism corresponding to the shell is further arranged on the shell, a liquid outlet is fixedly arranged on the lower end side wall of the shell, and a sealing cover is fixedly arranged on the liquid outlet.
[0007] Preferably, the chip clamping mechanism comprises two clamping tables, both of which are connected with the lifting table through connecting rods, and a plurality of sliding grooves are formed in each of the two clamping tables, two clamping plates are slidably arranged in each of the sliding grooves, and both of the clamping plates are connected with the two side walls of the sliding groove through the second spring.
[0008] Preferably, the connecting mechanism comprises two clamping blocks, two telescopic grooves corresponding to the clamping blocks are symmetrically formed in the side wall of the rotating port, two clamping blocks are slidably arranged in the two telescopic grooves respectively, and both of the clamping blocks are connected with the inner wall of the telescopic groove through the first spring, a plurality of clamping grooves corresponding to the clamping blocks are circumferentially formed in the side wall of the sleeve ring, and both of the clamping blocks are provided with a corresponding control mechanism.
[0009] Preferably, the control mechanism comprises two pull ropes, both of which are fixedly arranged on the end side wall of the two clamping blocks close to the first spring, and both of the pull ropes are slidably arranged through the two side walls of the lifting table, two sliding plates are symmetrically slidably arranged on the upper wall of the shell, a baffle is rotatably arranged on one side of each of the two sliding plates close to the lifting table, and one end of each of the two pull ropes away from the clamping block is fixedly arranged on the two sliding plates.
[0010] Preferably, the vibration mechanism comprises two sliding seats, two sliding rails are fixedly arranged on the side wall of the shell, both of the sliding seats are slidably arranged on the two sliding rails, a stop block is fixedly arranged on one side of each of the two sliding rails away from the shell, a vibration impact head is fixedly arranged on the lower wall of each of the two sliding seats, both of the vibration impact heads are arranged close to the shell in an L shape, and each of the two sliding seats is provided with a corresponding transmission mechanism.
[0011] Preferably, the transmission mechanism comprises two rotating wheels, a transmission groove corresponding to the rotating wheel is formed in each of the two sliding seats, a semicircle of clamping teeth is circumferentially formed in the side wall of each of the two rotating wheels, a clamping tooth groove corresponding to the clamping teeth is formed in the two side walls of each of the two transmission grooves, each of the two rotating wheels is rotatably arranged in the two transmission grooves, a transmission rod is fixedly arranged on each of the two rotating wheels, and both of the transmission rods are drivingly connected with the upper end of the rotating rod through a transmission belt.
[0012] Compared with the prior art, the beneficial effects of the present application are: through the cooperation of the second spring and the clamping plate, the clamping and fixing of the chip on the clamping table is realized, and through the setting of the second spring, if the chip becomes smaller due to etching during the etching process, the clamping and fixing state can still be maintained, through the setting of multiple clamping plates, multiple chips can be etched at the same time, through the cooperation of the clamping block and the clamping groove, the connection of the sleeve ring and the lifting table is realized, when the sleeve ring and the lifting table are connected, the rotation of the rotating rod can drive the lifting table to move up and down, which is convenient for the lifting clamping table to load and unload, and is also convenient for the descending clamping table to enter the etching solution for etching, and after the lifting table descends into the etching solution, the pulling rope is pulled tight, thereby pulling the clamping block out of the clamping groove on the sleeve ring, at this time, the sleeve ring and the lifting table are no longer connected, the sleeve ring rotates in the rotating port, and the lifting table no longer descends and stops in the etching solution, and the stirring blade continuously rotates to improve the etching reaction rate, and if the lifting table is to be raised, the motor is first reversed, the baffle is rotated to enable the sliding plate to slide inward, thereby relaxing the tension of the clamping block, enabling the clamping block to be clamped into the clamping groove, thereby completing the reconnection of the sleeve ring and the lifting table, and thereby the lifting table can be driven to move upwards, and in the process of etching, the rotating rod continuously drives the stirring blade to rotate, and at the same time, the two transmission rods can be driven to rotate through the transmission belt, thereby the two rotating wheels can be driven to rotate in the two transmission grooves, the sliding seat can be driven to reciprocate by the clamping teeth pushing the clamping tooth grooves, thereby the vibration impact head can be continuously driven to impact and vibrate on the shell, thereby generating vibration waves, using the vibration waves to generate small cavities to carry away impurities on the surface of the silicon wafer, and improving the etching effect. BRIEF DESCRIPTION OF DRAWINGS
[0013] Figure 1 A perspective structural schematic diagram of an etching device for instrument chip processing is provided for the present application;
[0014] Figure 2 A perspective structural schematic diagram of a clamping table is provided for the present application;
[0015] Figure 3 A perspective structural schematic diagram of the inner wall of an etching device for instrument chip processing is provided for the present application;
[0016] Figure 4 A side structural schematic diagram of an etching device for instrument chip processing is provided for the present application;
[0017] Figure 5 A structural schematic diagram of A in the middle is provided for the present application; Figure 4
[0018] Figure 6 A top view structural schematic diagram of the sliding seat is provided for the present application.
[0019] In the figure: 1 housing, 2 strut, 3 top plate, 4 motor, 5 rotating rod, 6 sleeve ring, 7 lifting platform, 8 slide rod, 9 connecting rod, 10 clamping table, 11 clamping plate, 12 pull rope, 13 slide plate, 14 baffle, 15 slide rail, 16 slide seat, 17 rotating wheel, 18 transmission groove, 19 vibrating impact head, 20 slide groove, 21 transmission rod, 22 transmission belt, 23 liquid outlet, 24 rotating port, 25 stirring blade, 26 telescopic groove, 27 clamping block, 28 first spring, 29 second spring. DETAILED DESCRIPTION
[0020] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all the embodiments.
[0021] Reference Figures 1-6The utility model relates to an etching device for instrument chip processing, which comprises a shell 1, a top plate 3 fixedly arranged on the shell 1, two supporting rods 2 connecting the top plate 3 with the upper wall of the shell 1, a motor 4 fixedly arranged on the top plate 3, an output end of the motor 4 fixedly connected with a rotating rod 5, the rotating rod 5 rotatingly penetrating through the top plate 3 and being arranged in the cavity of the shell 1, a cavity with an open upper end being arranged on the shell 1, the rotating rod 5 extending into the cavity, a lifting platform 7 slidingly arranged in the cavity of the shell 1, two sliding grooves corresponding to the sliding rods 8 being symmetrically formed in the inner wall of the shell 1, a chip clamping mechanism arranged on the lifting platform 7, the chip clamping mechanism comprising two clamping tables 10, the two clamping tables 10 being connected with the lifting platform 7 through connecting rods 9, a plurality of sliding grooves 20 being formed in each clamping table 10, two clamping plates 11 slidingly arranged in each sliding groove 20, the two clamping plates 11 being connected with the two side walls of the sliding groove 20 through second springs 29 respectively, a sleeve ring 6 rotatingly arranged on the lifting platform 7, the sleeve ring 6 being sleeved on the rotating rod 5, a rotating opening 24 corresponding to the sleeve ring 6 being formed in the lifting platform 7, external threads being arranged on the rotating rod 5, internal threads corresponding to the rotating rod 5 being formed in the inner wall of the sleeve ring 6, a connecting mechanism corresponding to the sleeve ring 6 being arranged on the lifting platform 7, the connecting mechanism comprising two clamping blocks 27, two telescopic grooves 26 corresponding to the clamping blocks 27 being symmetrically formed in the side wall of the rotating opening 24, the two clamping blocks 27 being slidingly arranged in the two telescopic grooves 26 respectively, the two clamping blocks 27 being connected with the inner wall of the telescopic groove 26 through first springs 28 respectively, a plurality of clamping grooves corresponding to the clamping blocks 27 being circumferentially formed in the side wall of the sleeve ring 6, a control mechanism corresponding to each clamping block 27 being arranged on the clamping block 27, the control mechanism comprising two pull ropes 12, the two pull ropes 12 being fixedly arranged on the side wall of each clamping block 27 close to the first spring 28, the two pull ropes 12 slidingly penetrating through the two side walls of the lifting platform 7, two sliding plates 13 being symmetrically slidingly arranged on the upper wall of the shell 1, a baffle 14 rotatingly arranged on one side of each sliding plate 13 close to the lifting platform 7, one end of each pull rope 12 away from the clamping block 27 being fixedly arranged on the sliding plate 13, a plurality of stirring blades 25 being circumferentially fixedly arranged on the end of the rotating rod 5 away from the motor 4, a vibrating mechanism corresponding to the shell 1 being further arranged on the shell 1, the vibrating mechanism comprising two sliding seats 16, two sliding rails 15 being symmetrically fixedly arranged on the side wall of the shell 1, the two sliding seats 16 being slidingly arranged on the two sliding rails 15 respectively, a stop block being fixedly arranged on the side of each sliding rail 15 away from the shell 1, a vibrating impact head 19 being fixedly arranged on the lower wall of each sliding seat 16, the two vibrating impact heads 19 being L-shaped and arranged close to the shell 1, a transmission mechanism corresponding to each sliding seat 16 being arranged on the sliding seat 16, the transmission mechanism comprising two rotating wheels 17, a transmission groove 18 corresponding to the rotating wheel 17 being formed in each sliding seat 16, a plurality of half-circle clamping teeth being circumferentially formed in the side wall of each rotating wheel 17, a clamping tooth groove corresponding to the clamping teeth being formed in the two side walls of each transmission groove 18, each rotating wheel 17 rotatingly arranged in the transmission groove 18.And two rotating wheels 17 are fixedly provided with transmission rods 21, two transmission rods 21 are in transmission connection with the upper end of the rotating rod 5 through the transmission belt 22, the lower end side wall of the shell 1 is also fixedly provided with a liquid outlet 23, the liquid outlet 23 is fixedly provided with a sealing cover, the clamping and fixing of the chip on the clamping table 10 is realized through the cooperation of the second spring 29 and the clamping plate 11, and the clamping and fixing state can still be maintained if the chip becomes smaller due to etching during etching through the setting of the second spring 29, the simultaneous etching of multiple chips is realized through the setting of multiple clamping plates 11, the connection of the sleeve ring 6 and the lifting platform 7 is realized through the cooperation of the clamping block 27 and the clamping groove, when the sleeve ring 6 and the lifting platform 7 are connected, the rotating rod 5 rotates to drive the lifting platform 7 to move up and down, which is convenient for the lifting clamping table 10 to load and unload and also convenient for the descending clamping table 10 to enter the etching solution for etching, and after the lifting platform 7 descends to the clamping table 10 immersed in the etching solution, the pull rope 12 is pulled tight, thereby pulling the clamping block 27 to separate from the clamping groove on the sleeve ring 6, at this time, the sleeve ring 6 and the lifting platform 7 are no longer connected, the sleeve ring 6 rotates in the rotating port 24, and the lifting platform 7 no longer descends and stops in the etching solution, and the stirring blade 25 continuously rotates to improve the etching reaction rate, and if you want to lift the lifting platform 7, you only need to reverse the motor 4 first, rotate the baffle 14 to make the sliding plate 13 slide inward, thereby relaxing the tension of the clamping block 27, making the clamping block 27 clamped into the clamping groove, thereby completing the reconnection of the sleeve ring 6 and the lifting platform 7, and then the lifting platform 7 can be driven to move up, and in the process of etching, the rotating rod 5 continuously drives the stirring blade 25 to rotate, and at the same time, the two transmission rods 21 can be driven to rotate through the transmission belt 22, thereby the two rotating wheels 17 can be driven to rotate in the two transmission grooves 18 respectively, the sliding seat 16 can be driven to reciprocate by the clamping teeth pushing the clamping tooth groove, thereby the vibration impact head 19 can be continuously driven to impact and vibrate on the shell 1, thereby generating vibration waves, using the vibration waves to generate small cavities to carry away the impurities on the surface of the silicon wafer, improving the etching effect.
[0022] In the present application, when the chip etching is carried out, first, the multiple groups of chips are clamped between the groups of clamping plates 11, the motor 4 is started to drive the rotating rod 5 to rotate, through the cooperation of the clamping block 27 and the clamping groove, the connection of the sleeve ring 6 and the lifting platform 7 is realized, when the sleeve ring 6 and the lifting platform 7 are connected, the rotating rod 5 rotates to drive the lifting platform 7 to move up and down, which is convenient for the rising clamping table 10 to load and unload, and also convenient for the descending clamping table 10 to enter the etching solution for etching, and after the lifting platform 7 descends to the clamping table 10 immersed in the etching solution, the pull rope 12 is tightened to pull the clamping block 27 out of the clamping groove on the sleeve ring 6, at this time, the sleeve ring 6 and the lifting platform 7 are no longer connected, the sleeve ring 6 rotates in the rotating port 24, and the lifting platform 7 no longer descends and stops in the etching solution, and the stirring blade 25 continuously rotates to improve the etching reaction rate, and if the lifting platform 7 is to be lifted, the motor 4 is only reversed to rotate the baffle 14 to make the sliding plate 13 slide inward, so as to relax the tension of the clamping block 27, make the clamping block 27 clamped into the clamping groove, thereby re-connecting the sleeve ring 6 and the lifting platform 7, and further driving the lifting platform 7 to move up, and in the process of etching, the rotating rod 5 continuously drives the stirring blade 25 to rotate, and at the same time, the transmission belt 22 drives the two transmission rods 21 to rotate, thereby driving the two rotating wheels 17 to rotate in the two transmission grooves 18 respectively, through the clamping teeth to push the clamping tooth groove, the sliding seat 16 is driven to reciprocate, thereby continuously driving the vibration impact head 19 to impact and vibrate on the shell 1, thereby generating vibration waves, using the vibration waves to generate small cavities to carry away the impurities on the surface of the silicon wafer, and improving the etching effect.
[0023] The above is only the preferred specific embodiment of the present application, but the protection scope of the present application is not limited thereto, any skilled person in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered in the protection scope of the present application.
Claims
1. An etching device for processing of a meter chip, comprising a housing (1), characterized in that, The shell (1) is fixedly provided with a top plate (3), the top plate (3) is connected with the upper wall of the shell (1) through two supporting rods (2), the top plate (3) is fixedly provided with a motor (4), the output end of the motor (4) is fixedly connected with a rotating rod (5), the rotating rod (5) is rotatably arranged through the top plate (3), the shell (1) is provided with a cavity with an open upper end, the rotating rod (5) extends into the cavity, the shell (1) is slidably provided with a lifting platform (7), the lifting platform (7) is slidably arranged in the cavity of the shell (1) through two sliding rods (8), two sliding grooves corresponding to the sliding rods (8) are symmetrically formed in the inner wall of the shell (1), the lifting platform (7) is provided with a chip clamping mechanism, and a sleeve ring (6) is rotatably arranged on the lifting platform (7), the sleeve ring (6) is sleeved on the rotating rod (5), a rotating opening (24) corresponding to the sleeve ring (6) is formed in the lifting platform (7), the rotating rod (5) is provided with external threads, the inner wall of the sleeve ring (6) is provided with internal threads corresponding to the rotating rod (5), the lifting platform (7) is provided with a connecting mechanism corresponding to the sleeve ring (6), the rotating rod (5) is further circumferentially fixedly provided with a plurality of stirring blades (25) at the end away from the motor (4), the shell (1) is further provided with a corresponding vibration mechanism, a liquid outlet (23) is fixedly arranged on the lower end side wall of the shell (1), and a sealing cover is fixedly arranged on the liquid outlet (23). The vibration mechanism comprises two sliding seats (16), two sliding rails (15) are symmetrically fixedly arranged on the side wall of the shell (1), the two sliding seats (16) are slidably arranged on the two sliding rails (15) respectively, the two sliding rails (15) are fixedly provided with a stopper on the side away from the shell (1), the lower wall of each of the two sliding seats (16) is fixedly provided with a vibration impact head (19), the two vibration impact heads (19) are both L-shaped and arranged close to the shell (1), and each of the two sliding seats (16) is provided with a corresponding transmission mechanism. The transmission mechanism comprises two rotating wheels (17), each of the two sliding seats (16) is provided with a transmission groove (18) corresponding to the rotating wheel (17), a semicircle of clamping teeth is circumferentially arranged on the side wall of each of the two rotating wheels (17), clamping tooth grooves corresponding to the clamping teeth are formed in the side walls of the two transmission grooves (18), each of the two rotating wheels (17) is rotatably arranged in the corresponding transmission groove (18), and a transmission rod (21) is fixedly arranged on each of the two rotating wheels (17), and the two transmission rods (21) are in transmission connection with the upper end of the rotating rod (5) through a transmission belt (22).
2. The etching device for processing of an instrument chip according to claim 1, characterized in that, The chip clamping mechanism comprises two clamping tables (10), the two clamping tables (10) are connected with the lifting platform (7) through connecting rods (9), a plurality of sliding grooves (20) are formed in each of the two clamping tables (10), and two clamping plates (11) are slidably arranged in each of the sliding grooves (20).
3. The etching device for processing of an instrument chip according to claim 1, characterized in that, The connecting mechanism comprises two clamping blocks (27), two telescopic grooves (26) corresponding to the clamping blocks (27) are symmetrically formed on the side wall of the rotating port (24), the two clamping blocks (27) are respectively slidably arranged in the two telescopic grooves (26), and the two clamping blocks (27) are connected with the inner wall of the telescopic groove (26) through the first spring (28).
4. The etching device for processing of an instrument chip according to claim 3, characterized in that, The control mechanism comprises two pull ropes (12), the two pull ropes (12) are respectively fixedly arranged on the side wall of one end of the two clamping blocks (27) close to the first spring (28), and the two pull ropes (12) are slidably arranged through the two side walls of the lifting platform (7). The upper wall of the shell (1) is symmetrically provided with two sliding plates (13), and the side of the two sliding plates (13) close to the lifting platform (7) is rotatably provided with a baffle (14). The two pull ropes (12) are respectively fixedly arranged on the two sliding plates (13) away from the clamping blocks (27).
Citation Information
Patent Citations
Wafer slice etching equipment and method
CN120341141A
Multi-layer flexible circuit board etching combination device
CN213602896U