Processing system and method before typesetting of printed circuit board

Abstract

The invention discloses a processing system and method before typesetting of a printed circuit board, and relates to the technical field of typesetting processing. Comprising a contour data acquisition module, a minimum enclosing rectangle calculation module, a circuit board area calculation module, an effective proportion analysis module, a multi-circuit board combination optimization module, an effective typesetting area determination module, a typesetting quantity calculation module and a typesetting coordinate positioning module. According to the method, the outline of the irregular circuit board is scanned and recognized, the minimum surrounding rectangle, the area and the effective proportion are calculated, the board type with the low proportion is manually combined and optimized, and the utilization rate and the production efficiency of the substrate are remarkably improved; effective typesetting areas are accurately divided, coordinate positioning is standardized, positioning errors are reduced, and machining quality and stability are improved; and diversified plate type requirements are flexibly met, material waste and manual trial and error cost are reduced, and obvious economic benefits and environmental benefits are brought to enterprises.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of layout processing, in particular to a processing system and method for printed circuit board layout. BACKGROUND

[0002] In the field of electronic manufacturing, printed circuit board (PCB) is the core component of carrying electronic components and realizing circuit connection. In the production process of PCB, the technical level of the substrate layout link directly determines the cost control, material utilization rate and production cycle. With the upgrading of electronic devices to miniaturization and multifunctionalization, the design of circuit boards gradually breaks through the traditional rectangular structure, and a large number of customized products with irregular notches and asymmetric profiles emerge. The layout optimization of such irregular circuit boards has become a key bottleneck restricting the production capacity and cost reduction of the industry.

[0003] In the current technical scheme related to circuit board layout, there are obvious limitations in the processing of profile data of irregular circuit boards. Although some technologies introduce image scanning and recognition methods to obtain the shape information of the circuit board, they cannot accurately quantify the effective proportion of the irregular circuit board in the space occupation. When the circuit board has a large number of blank areas, resulting in a low effective proportion, it will cause a large amount of space in the effective area of the substrate to be idle, resulting in low material utilization and significantly increasing the cost of substrate raw materials.

[0004] With the continuous improvement of the requirements of the electronic manufacturing industry on batch production efficiency and cost control, the shortcomings of the existing layout technology in data processing depth are increasingly prominent, and it is difficult to meet the production needs of high efficiency and low cost. Therefore, it is urgent to develop a processing system and method for printed circuit board layout to solve the problem of low material utilization in the prior art and help upgrade the circuit board manufacturing process to intelligent and efficient. SUMMARY

[0005] In view of the shortcomings of the prior art, the present application provides a processing system and method for printed circuit board layout to solve the problems mentioned in the background art.

[0006] To achieve the above purpose, the present application realizes the following technical scheme: a processing method for printed circuit board layout, comprising the following steps: First step, single irregular circuit board profile data acquisition: An image scanning device is used to scan the irregular circuit board to obtain an image containing the profile of the circuit board. Then, an image recognition technology is used to extract a set of edge point coordinates of the circuit board profile. The edge point coordinates in the set of edge point coordinates take a fixed edge of the substrate as the x-axis and a direction perpendicular to the x-axis as the y-axis. Second step, calculation of the minimum enclosing rectangle area of a single irregular circuit board: In all edge points of x coordinate and y coordinate, the x coordinate of the rightmost edge point of the irregular circuit board in the horizontal direction and the x coordinate of the leftmost edge point are extracted as the maximum value x max and the minimum value x min respectively; and the y coordinate of the uppermost edge point of the irregular circuit board in the vertical direction and the y coordinate of the lowermost edge point are extracted as the maximum value y max and the minimum value y min respectively; then the minimum value x max is subtracted from the maximum value x min , and the minimum value y max is subtracted from the maximum value y min , to obtain the width and height of the minimum enclosing rectangle of the single irregular circuit board respectively, and then the width and height are multiplied to obtain the minimum enclosing rectangle area of the circuit board; Third step, area calculation of single irregular circuit board: The area of the irregular circuit board is calculated based on vector cross product, and the sum of the cross products of the vectors formed by the adjacent vertices is calculated in sequence, and then the half of the absolute value is obtained to obtain the polygon area; Fourth step, effective proportion calculation of single irregular circuit board: The effective proportion of the area of the irregular circuit board in the minimum enclosing rectangle area is determined by the ratio of the area of the irregular circuit board to the minimum enclosing rectangle area; Fifth step, multi-circuit board combination optimization analysis: If the effective proportion of the single irregular circuit board in the minimum enclosing rectangle is less than the corresponding preset effective proportion threshold, the multi-circuit board combination optimization analysis is performed by manual auxiliary layout; As a further scheme of the present application, the multi-circuit board combination optimization analysis is as follows: From the irregular circuit boards to be laid out, select 2 or more circuit boards; then manually rotate each selected circuit board, and simultaneously adjust the position of each circuit board on the basis of the rotation operation, and form a combined circuit board; Then, for the combined circuit board, the contour data of the combined circuit board is obtained in the manner of the first step, the minimum enclosing rectangle area of the combined circuit board is calculated in the manner of the second step, the area of the combined circuit board is calculated in the manner of the third step, and the effective proportion of the combined circuit board is calculated in the manner of the fourth step; Then, among the various combined circuit boards and single irregular circuit boards, the one with the smallest effective proportion value is selected to calculate the number of layoutable circuit boards and determine the circuit board layout coordinates; As a further aspect of the present invention: if the effective proportion of a single irregular circuit board within the minimum enclosing rectangle is less than the corresponding preset effective proportion threshold, then the number of circuit boards that can be arranged on the substrate and the circuit board layout coordinates are directly calculated.

[0007] As a further aspect of the present invention, the calculation of the number of circuit boards that can be arranged on a single irregular circuit board and the determination of the circuit board layout coordinates are consistent.

[0008] As a further aspect of the present invention, the calculation method for the number of circuit boards that can be arranged on the substrate is as follows: The overall length, overall width, and width of the invalid edge region of the substrate are collected. The overall length of the substrate is then labeled L, and the overall width is labeled B. The width of the invalid edge region includes the width of the invalid region at the substrate edge in the x-axis direction and the width in the y-axis direction, and these are labeled K respectively. x and K y ; where, on both the left and right sides along the x-axis, there is a width of K. x The invalid region has a width of K on both the top and bottom sides along the y-axis. y Invalid regions; Then subtract twice the value of K from the total length L. x And by subtracting twice the value of K from the overall width B. y The length LY and width BY of the effective layout area corresponding to the substrate are obtained respectively. Let W and H be the width and height of the minimum enclosing rectangle of a single irregular circuit board, respectively. pass: Calculate the total number N of circuit boards that can be arranged in the effective layout area corresponding to the substrate; In the formula, N x N represents the number of circuit boards that can be arranged along the x-axis in the effective layout area corresponding to the substrate. y This represents the number of circuit boards that can be arranged along the y-axis in the effective layout area corresponding to the substrate. This indicates the floor function.

[0009] As a further aspect of the present invention: the overall length of the substrate is determined along the x-axis direction, and the overall width of the substrate is determined along the y-axis direction; the effective layout area refers to the area on the substrate used for arranging and placing the printed circuit board to be processed, which is the remaining operable area after excluding the invalid areas of the corresponding edges of the substrate.

[0010] As a further aspect of the present invention, the method for determining the layout coordinates of a single irregular circuit board is as follows: pass: Calculate the coordinates (X, Y) of the bottom left corner of a single irregular circuit board. m，k ,Ym，k wherein, X m，u is the x coordinate of the left lower corner of the circuit board in the mth row and the u th column; Y m，u is the y coordinate of the left lower corner of the circuit board in the mth row and the u th column; m and u are respectively the row index and the column index used to identify the irregular circuit board in the effective layout area of the substrate along the y-axis direction and the x-axis direction.

[0011] As a further scheme of the present application: in the layout planning, the effective layout area of the substrate is divided into multiple rows along the vertical direction from bottom to top, and the value of m represents the row number of the current circuit board; meanwhile, the effective layout area of the substrate is divided into multiple columns along the horizontal direction from left to right, and the value of u represents the column number of the current circuit board.

[0012] As a further scheme of the present application: wherein the values of m and u both start from 0, that is, the 0th row is the lowest row in the vertical direction, and the 0th column is the leftmost column in the horizontal direction.

[0013] A processing system before the layout of a printed circuit board, which is used to execute a processing method before the layout of a printed circuit board, and the system comprises: a contour data acquisition module, configured to collect a contour image of an irregular circuit board through an image scanning device, and extract a set of edge point coordinates by using an image recognition technology; a minimum enclosing rectangle calculation module, configured to extract the maximum value and the minimum value in the x and y directions from the edge point coordinates, calculate the width and the height of the minimum enclosing rectangle of the circuit board, and obtain the area thereof; a circuit board area calculation module, configured to calculate the actual area of the irregular circuit board by using a polygon area calculation method based on vector cross multiplication; an effective proportion analysis module, configured to calculate the effective proportion by using the ratio of the actual area of the circuit board to the area of the minimum enclosing rectangle, and compare the effective proportion with a preset threshold value; and determine whether the single circuit board needs to be subjected to multi-circuit board combination optimization according to the comparison result; a multi-circuit board combination optimization module, configured to be started when the effective proportion is lower than the threshold value, provide an artificial auxiliary combination optimization function, support rotation and position adjustment of multiple circuit boards, and recalculate the contour, the area and the effective proportion after the combination; an effective layout area determination module, configured to collect the overall size of the substrate and the width of the edge invalid area, and calculate the length and the width of the effective area available for layout; a layout number calculation module, configured to calculate the total number of the substrates available for layout according to the size of the effective layout area and the size of the circuit board; ​The layout coordinate positioning module calculates the lower left corner coordinates of each circuit board in the effective area of the substrate by the row and column indexes and size parameters of the irregular circuit board in the effective layout area of the substrate.

[0014] The present application provides a processing system and method before the layout of printed circuit boards. Compared with the prior art, it has the following beneficial effects: The present application can identify the low utilization rate of the circuit board shape by accurately calculating the minimum enclosing rectangle and the actual area of the irregular circuit board, combined with effective proportion analysis. For low proportion boards, artificial assisted combinatorial optimization is introduced to form a combined circuit board through rotation and position adjustment, effectively reducing substrate waste. This process significantly increases the number of circuit boards that can be laid out per substrate, reduces production costs, and improves overall production efficiency.

[0015] Traditional layout methods often have difficulty handling irregularly shaped circuit boards, resulting in a large amount of material waste. The multi-circuit board combinatorial optimization analysis function of the present application allows flexible handling of circuit boards of various complex shapes. Through manual rotation and position adjustment, not only can circuit boards of different shapes be combined, but also the optimal layout can be achieved under the premise of ensuring electrical performance. This flexibility enables the production process to adapt to diverse product demands, enhancing the market competitiveness of enterprises.

[0016] The substrate effective layout area calculation method of the present application accurately considers the edge invalid area, ensuring that all laid-out circuit boards are within the machinable range. At the same time, the standardized coordinate calculation method ensures the accuracy of each circuit board position, reducing positioning errors in the production process. This not only simplifies subsequent processing steps, but also improves the stability of product quality and reduces the scrap rate caused by layout problems.

[0017] Through the effective proportion threshold judgment mechanism, the present application can automatically identify the type of circuit board that needs to be optimized and guide the operator to perform combinatorial optimization. This intelligent decision support system reduces the time and cost of manual trial and error, making the layout process more scientific and efficient. At the same time, by improving material utilization and production efficiency, it brings significant economic and environmental benefits to enterprises. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 is a system block diagram of a processing system for printed circuit board layout before the present application.

[0019] Figure 2 is a flowchart of a processing method for printed circuit board layout before the present application. DETAILED DESCRIPTION

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0021] Please see Figure 1 and Figure 2 As shown, the embodiments of the present invention provide the following technical solutions: Solve the problems of material waste and inaccurate positioning when laying out irregularly shaped printed circuit boards; As an embodiment of the present invention: This invention relates to a method for processing printed circuit boards before layout, comprising the following steps: Step 1: Obtaining the outline data of a single irregular circuit board: An image scanning device is used to scan an irregular circuit board to obtain an image containing the outline of the circuit board; Then, using image recognition technology, the set of edge point coordinates of the circuit board outline is extracted, and the number of extracted edge points is marked as n, while the coordinates of each edge point are marked as (x, y, y). i ,y i ), where i = 1, 2, ..., n; In this embodiment, image recognition technology utilizes edge detection algorithms, such as the Canny algorithm, which can accurately locate the edges of the circuit board outline by calculating the gradient changes in pixel grayscale in the image. After obtaining the edge information, a contour tracking algorithm is then used to sequentially collect the coordinates of edge points along the edge, thereby forming a set of edge point coordinates. Image recognition technology has long been widely used in many fields such as industrial visual inspection and image analysis, and is very mature and reliable. It can accurately and efficiently obtain the edge point coordinates of the circuit board outline, so it will not be elaborated further. The substrate is the basic material used to support and cut printed circuit boards; with a fixed edge of the substrate as the x-axis and the direction perpendicular to the x-axis as the y-axis, x... i This represents the horizontal coordinate of the i-th edge point, y. i This represents the vertical coordinate value of the i-th edge point; Step 2: Calculation of the minimum enclosing rectangle area of ​​a single irregular circuit board: Extract the minimum x-coordinate from the x and y coordinates of all edge points. min and maximum value x max and the minimum value of the y-coordinate y min and maximum value y max ; Where, xmax This represents the x-coordinate of the rightmost edge point of the irregular circuit board in the horizontal direction. min The x-coordinate of the leftmost edge point; y-coordinate. max This represents the y-coordinate of the uppermost edge point of the irregular circuit board in the vertical direction. min This represents the y-coordinate of the bottom edge point; Subsequently passed: Calculate the width W and height H of the minimum enclosing rectangle; For example: Suppose there is an irregular circuit board with edge points having x-coordinates of 1, 3, 5, 2 and y-coordinates of 2, 4, 6, 3; then x min =1, x max =5, so W=4; y min =2, y max =6, therefore H=4; Then, the width W and height H of the minimum enclosing rectangle are multiplied together to calculate the area S0 of the minimum enclosing rectangle of the circuit board. Step 3: Calculation of the area of ​​a single irregular circuit board: The area of ​​an irregular circuit board is calculated using a polygon area calculation method. The formula is as follows: In the formula, S B Refers to the area of ​​an irregularly shaped circuit board; In this embodiment, the polygon area calculation method is based on the cross product of vectors to calculate the polygon area. The polygon area is obtained by calculating the sum of the cross products of the vectors formed by adjacent vertices in turn, and then taking half of the absolute value. Step 4: Calculation of the effective proportion of a single irregular circuit board: The effective proportion of the irregular circuit board area in the minimum enclosing rectangle area is determined by the ratio of the area of ​​the irregular circuit board to the area of ​​the minimum enclosing rectangle. The formula is: In the formula, β refers to the effective proportion of the irregular circuit board within the minimum enclosing rectangle; In this embodiment, the value of β reflects the space utilization efficiency of the irregular circuit board within its minimum enclosing rectangle. The closer β is to 1, the closer the circuit board shape is to a rectangle and the less space is wasted; conversely, the less space is wasted. Step 5: Optimization Analysis of Multi-Circuit Board Combinations If the effective proportion β of a single irregular circuit board within the minimum enclosing rectangle is less than the corresponding preset effective proportion threshold, then the multi-circuit board combination optimization analysis is carried out through manual-assisted layout. The optimization analysis of multi-circuit board combinations is as follows: From the irregular circuit board to be laid out, select 2 or more circuit boards; then manually rotate each selected circuit board, and simultaneously adjust the position of each circuit board based on the rotation operation, and form a combined circuit board; In this embodiment, the shape characteristics of the circuit board can be visually judged by the human eye, and different rotation angles and position combinations can be tried according to experience, so that various irregular shapes can be flexibly coped with; at the same time, in the actual printed circuit board layout scene, for some relatively complex shapes but not too many circuit board combinations, manual operation can quickly try and adjust, without complex algorithms and large amounts of computing resources, and in a small range or under the condition that the layout efficiency requirement is not extremely high, the combination optimization can be effectively realized; Then, for the combined circuit board, the contour data of the combined circuit board is obtained in the first step, the minimum enclosing rectangle area of the combined circuit board is calculated in the second step, the area of the combined circuit board is calculated in the third step, and the effective proportion of the combined circuit board is calculated in the fourth step; Then, among the various combined circuit boards and single irregular circuit boards, the one with the smallest effective proportion value is selected to continue the subsequent operation steps; If the effective proportion β of the single irregular circuit board in the minimum enclosing rectangle is less than the corresponding preset effective proportion threshold, the subsequent operation steps are continued; Embodiment one realizes key data processing and combination optimization analysis before irregular circuit board layout through systematic steps, laying a precise foundation for subsequent layout. Firstly, the image scanning and recognition technology is used to obtain the circuit board contour edge point coordinates, ensuring the accuracy of the basic data; then the minimum enclosing rectangle area and the actual area of the circuit board are calculated, and then the effective proportion is obtained, which clearly quantifies the space utilization efficiency of the single circuit board, so that the staff can intuitively judge the influence of the circuit board shape on the layout. When the effective proportion is lower than the threshold, the combination optimization method of manual assisted multi-circuit board rotation and position adjustment is introduced, and the effective proportion of the single and combined circuit boards is compared through a unified calculation standard, and the scheme with the least space waste is selected, which effectively avoids the problem of substrate space waste caused by single layout method, and provides a scientific decision basis for improving the overall layout efficiency.

[0022] As an embodiment of the present application: In the specific implementation of the present application, compared with embodiment one, the technical solution of the present embodiment is only different from that of embodiment one in that in the present embodiment, the subsequent operation steps of the single irregular circuit board and the multiple combined circuit boards are consistent in logic, and the single irregular circuit board is selected as an example, and the subsequent operation steps are continued, which are as follows: Step 6, effective layout area of the circuit board substrate is determined: The overall length, overall width and edge invalid area width of the substrate are collected, and the overall length of the circuit board corresponding to the substrate is marked as L, and the overall width is marked as B; The overall length of the substrate is determined along the x-axis direction, and the overall width of the substrate is determined along the y-axis direction. The edge invalid area width includes the width of the invalid area of the edge of the substrate in the x-axis direction and the width in the y-axis direction, which are marked as K x and K y ; In actual production, the edge of the substrate has some areas that cannot be used for layout of the circuit board, such as clamping areas for fixing the substrate, so the invalid area needs to be determined. The left and right sides of the x-axis direction each have an invalid area with a width of K x , and the upper and lower sides of the y-axis direction each have an invalid area with a width of K y ; Then, the length LY and the width BY of the effective layout area corresponding to the substrate are calculated by: ; The effective layout area refers to the area on the substrate for arranging and placing the printed circuit board to be processed, which is the remaining operable area after excluding the edge invalid area corresponding to the substrate. Step 7, the number of circuit boards that can be laid out on the substrate is calculated: The total number N of single irregular circuit boards that can be laid out on the effective layout area corresponding to the substrate is calculated by: ; In the formula, N x is the number of circuit boards that can be arranged in the x-axis direction of the effective layout area corresponding to the substrate, N y is the number of circuit boards that can be arranged in the y-axis direction of the effective layout area corresponding to the substrate, and represents a down rounding operation.

[0023] In this embodiment, for the combined circuit board, the total number of combined circuit boards that can be laid out on the effective layout area corresponding to the substrate is determined first, and then the number of single irregular circuit boards combined in the combined circuit board is extracted. Then, the two number values are multiplied to obtain the total number of single irregular circuit boards that can be laid out on the effective layout area corresponding to the substrate. Embodiment two is based on embodiment one, focusing on the determination of the effective layout area of the substrate and the calculation of the number of layout, further promoting the standardization and efficiency of the layout process. By collecting the overall size of the substrate and the width of the edge invalid area, the length and width of the effective layout area are accurately calculated, fully considering the actual situation that the edge clamping area cannot be used in substrate production, avoiding the problem of disconnection between layout planning and actual production caused by ignoring the invalid area, ensuring the feasibility of the layout scheme. At the same time, based on the size of the effective layout area and the related parameters of the circuit board, the total number of circuit boards that can be laid out is obtained by using the downward rounding calculation method. This calculation method not only ensures the accuracy of the layout number, but also avoids the production loss caused by forcibly laying out beyond the effective area, so that the staff can clearly know the layout capacity of the substrate in advance, providing reliable data support for production planning and rational allocation of substrate resources, and improving the utilization efficiency of substrate resources.

[0024] As embodiment three of the present application: In the specific implementation of the present application, compared with embodiment one and embodiment two, the technical scheme of the present embodiment is to combine the schemes of embodiment one and embodiment two. The difference between the technical scheme of the present embodiment and embodiment one and embodiment two is that in the present embodiment, the logic of the subsequent operation steps of the single irregular circuit board and the multiple combined circuit boards is consistent. Taking the single irregular circuit board as an example, the subsequent operation steps are selected, which further include: Eighth step, single irregular circuit board layout coordinate determination: By: The left lower corner coordinates (X m，k ,Y m，k ) of the single irregular circuit board are calculated. Wherein, X m，u is the x-coordinate of the left lower corner of the circuit board in the mth row and the u-th column; Y m，u is the y-coordinate of the left lower corner of the circuit board in the mth row and the u-th column; m and u are respectively the row index number and the column index number used to identify the position of the irregular circuit board in the substrate effective layout area along the y-axis direction and along the x-axis direction; In the layout planning, the effective layout area of the substrate is divided into multiple rows along the vertical direction from bottom to top, and the value of m represents the row number of the current circuit board; at the same time, the effective layout area of the substrate is divided into multiple columns along the horizontal direction from left to right, and the value of u represents the column number of the current circuit board; The values of m and u both start from 0, that is, the 0th row is the lowest row in the vertical direction, and the 0th column is the leftmost column in the horizontal direction.

[0025] In this embodiment, for the combined circuit board, only the left lower corner coordinate of the combined circuit board needs to be calculated; for the combined circuit board, only the left lower corner coordinate of the whole combined circuit board needs to be calculated to complete the position positioning in the effective layout area of the substrate. The calculation logic of this coordinate is consistent with that of the single circuit board, which is determined based on the row and column indexes of the circuit board in the substrate and the size parameters of the circuit board itself, so as to ensure that the combined circuit board can be arranged in order on the substrate like a single circuit board. The relative position relationship between the single irregular circuit boards included in the combined circuit board does not need to be calculated separately. The relative position relationship between the single irregular circuit boards included in the combined circuit board has been determined in the artificial combination optimization stage, and the cutting path is used to realize the separation. The cutting path is specially defined according to the edge contour and relative position of each single circuit board during the combined layout, and can accurately distinguish the boundaries of different circuit boards. During production and processing, each independent single irregular circuit board can be completely separated from the combined circuit board by following the cutting path, which ensures the layout efficiency and the integrity of the single circuit board.

[0026] Embodiment three integrates the core content of embodiment one and embodiment two, adds a single irregular circuit board layout coordinate determination step, further improves the details of the layout planning, and makes the layout scheme more operable. Through the clear coordinate calculation formula, the specific coordinates of the left lower corner of each circuit board are accurately positioned in combination with the row and column number indexes of the circuit board in the effective layout area of the substrate, and the specific position of each circuit board on the substrate is clearly defined. This accurate coordinate positioning method avoids the problem of position confusion and mutual overlap of circuit boards during the layout process, and ensures that multiple circuit boards can be arranged in order in the effective area of the substrate. At the same time, the row and column number indexes start from 0 and the direction definition (row from bottom to top and column from left to right) is clear, which unifies the identification standard of the layout position, reduces the communication cost and operation error of the staff in the actual layout operation, provides a strong guarantee for the subsequent efficient and accurate circuit board processing and production, and further improves the standardization and accuracy of the overall layout process. As embodiment four of the present application: In the specific implementation of the present application, compared with embodiment one, embodiment two and embodiment three, the technical scheme of the present application is to combine the schemes of embodiment one, embodiment two and embodiment three.

[0027] Embodiment four forms a complete processing system covering data acquisition before irregular circuit board layout, space efficiency analysis, combination optimization, effective area determination of the substrate, layout quantity calculation and specific coordinate positioning by integrating all technical solutions of embodiment one, embodiment two and embodiment three. The complete system realizes full-process coverage from early-stage basic data processing to later-stage specific layout position planning, avoids possible poor connection problems when using scattered technical solutions in each link, and ensures the coherence and synergy between each step of pre-layout processing. The staff does not need to frequently switch between different technical solutions, and can complete all preparation work from data acquisition to layout positioning according to the unified system, greatly simplifying the pre-layout processing flow and reducing the operation complexity. At the same time, the technical integration of the whole process enables the layout scheme to comprehensively consider factors such as space utilization efficiency, production feasibility, position accuracy and the like, further improves the scientificity and rationality of the layout scheme, provides comprehensive and systematic technical support for efficient and high-quality layout production of printed circuit boards, and effectively improves the overall production efficiency and substrate resource utilization rate.

[0028] The application also provides a processing system before layout of a printed circuit board, which is used for executing a processing method before layout of a printed circuit board, and comprises: a contour data acquisition module, which is used for acquiring a contour image of an irregular circuit board through an image scanning device, and extracting a set of edge point coordinates by using image recognition technology; a minimum enclosing rectangle calculation module, which is used for extracting maximum and minimum values in x and y directions from the edge point coordinates, calculating the width and height of the minimum enclosing rectangle of the circuit board, and obtaining the area of the minimum enclosing rectangle; a circuit board area calculation module, which is used for calculating the actual area of the irregular circuit board by using a polygon area calculation method based on vector cross product; an effective proportion analysis module, which is used for calculating an effective proportion by using the ratio of the actual area of the circuit board to the area of the minimum enclosing rectangle, and comparing the effective proportion with a preset threshold value; and judging whether a single circuit board needs to be subjected to multi-circuit board combination optimization according to the comparison result; a multi-circuit board combination optimization module, which is started when the effective proportion is lower than the threshold value, provides an artificial aided combination optimization function, supports rotation and position adjustment of multiple circuit boards, and recalculates the contour, area and effective proportion after combination; an effective layout area determination module, which is used for acquiring the overall size of the substrate and the width of the edge invalid area, and calculating the length and width of the effective area available for layout; a layout quantity calculation module, which is used for calculating the total number of layouts of the substrate according to the size of the effective layout area and the size of the circuit board; and The layout coordinate positioning module calculates the lower left corner coordinate of each circuit board in the effective area of the substrate through the row and column index and size parameter of the irregular circuit board in the effective layout area of the substrate.

[0029] It should be noted that all user data collected in this application is collected with the consent and authorization of the user, and the use of user data is legal and compliant, and the use and processing of user data comply with relevant laws, regulations and standards in the relevant region.

[0030] Meanwhile, the contents not described in detail in the specification all belong to the prior art known to those skilled in the art.

[0031] It should be noted that in this paper, relational terms such as first and second are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations. Moreover, the terms "include", "contain" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or equipment.

[0032] The above formulas are dimensionless values calculated by introducing reference benchmarks such as maximum value, minimum value, standard deviation, theoretical extreme value, etc. to convert the original physical quantity into dimensionless relative value, which is usually mapped to a specific interval such as [0, 1] or [-1, 1], which not only eliminates the influence of units, but also retains the relative size relationship of physical quantities; The formula is obtained by collecting a large amount of data to simulate the most real situation, and the preset parameters and threshold values in the formula are set by those skilled in the art according to the actual situation.

[0033] Although embodiments of the present application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the application, and the scope of the present application is defined by the appended claims and their equivalents.

[0034] The above has described various embodiments of the present application, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and changes are obvious to those skilled in the art without departing from the scope and spirit of the described embodiments. The choice of terms used herein is intended to best explain the principles, practical applications or improvements to the technology in the market of the embodiments, or to enable other ordinary skilled persons in the art to understand the embodiments disclosed herein.

Claims

1. A method of processing before layout of a printed circuit board, characterized by, The method comprises the following steps: Firstly, an image scanning device is used to scan the irregular circuit board to obtain an image containing the outline of the circuit board; then an image recognition technique is used to extract a set of edge point coordinates of the outline of the circuit board; the edge point coordinates in the set of edge point coordinates take a fixed edge of the substrate as an x-axis and a direction perpendicular to the x-axis as a y-axis; Second step, in all edge points of x coordinate and y coordinate, extract the x coordinate of the rightmost edge point and the x coordinate of the leftmost edge point of the irregular circuit board in the horizontal direction as the maximum value x max and the minimum value x min ; and The y coordinate of the uppermost edge point and the y coordinate of the lowermost edge point of the extracted irregular circuit board in the vertical direction are extracted as the maximum value y max The minimum value y min ; then the maximum value x max is subtracted from the minimum value x min , and the maximum value y max is subtracted from the minimum value y min , respectively, to obtain the width and height of the minimum enclosing rectangle of the single irregular circuit board, and then the width and the height are multiplied to obtain the area of the minimum enclosing rectangle of the circuit board. Thirdly, the area of the irregular circuit board is calculated based on vector cross multiplication; the area of the polygon is obtained by sequentially calculating the sum of the cross multiplication of vectors formed by adjacent vertices and then taking half of the absolute value; Fourthly, the effective proportion of the area of the irregular circuit board in the area of the minimum enclosing rectangle is determined; Fifthly, if the effective proportion of the single irregular circuit board in the minimum enclosing rectangle is less than a preset effective proportion threshold, manual assistance is used for layout to perform multi-circuit board combination optimization analysis.

2. The method of claim 1, wherein: The multi-circuit board combination optimization analysis is as follows: Two or more circuit boards are selected from the irregular circuit boards to be laid out; then each selected circuit board is manually rotated, and the position of each circuit board is manually adjusted based on the rotation to form a combined circuit board; Then, the outline data of the combined circuit board is obtained in the first manner, the minimum enclosing rectangle area of the combined circuit board is calculated in the second manner, the area of the combined circuit board is calculated in the third manner, and the effective proportion of the combined circuit board is calculated in the fourth manner; Then, the combined circuit board with the smallest effective proportion is selected from the combined circuit boards and the single irregular circuit board to calculate the number of circuit boards that can be laid out on the substrate and determine the layout coordinates of the circuit boards.

3. The method of claim 2, wherein: If the effective proportion of the single irregular circuit board in the minimum enclosing rectangle is less than the preset effective proportion threshold, the number of circuit boards that can be laid out on the substrate and the layout coordinates of the circuit boards are directly calculated.

4. The method of claim 3, wherein: The logic of calculating the number of circuit boards that can be laid out on the substrate and determining the layout coordinates of the circuit boards is consistent for the single irregular circuit board and the combined circuit boards.

5. The method of claim 3, wherein: the step of applying a solder mask to the printed circuit board comprises applying a solder mask to the printed circuit board by screen printing. The number of circuit boards that can be laid out on the substrate is calculated as follows: The overall length, overall width and edge invalid area width of the substrate are collected, and then the overall length of the circuit board corresponding to the substrate is marked as L, the overall width is marked as B; the edge invalid area width includes the width of the invalid area of the substrate edge in the x-axis direction and the width in the y-axis direction, and is marked as K respectively x and K y ; wherein the left and right sides of the x-axis direction each have an invalid area with a width of K x , and the upper and lower sides of the y-axis direction each have an invalid area with a width of K y . Subsequently, the length LY and the width BY of the effective layout area corresponding to the substrate are obtained by subtracting 2K from the overall length L and the overall width B, respectively. x Subsequently, the length LY and the width BY of the effective layout area corresponding to the substrate are obtained by subtracting 2K from the overall length L and the overall width B, respectively. y Subsequently, the length LY and the width BY of the effective layout area corresponding to the substrate are obtained by subtracting 2K from The width and height of the minimum enclosing rectangle of the single irregular circuit board are denoted as W and H respectively; By: , the total number N of circuit boards that can be arranged in the effective layout area corresponding to the substrate is calculated; In the formula, N x is the number of circuit boards that can be arranged in the x-axis direction corresponding to the effective layout area of the substrate, N y is the number of circuit boards that can be arranged in the y-axis direction corresponding to the effective layout area of the substrate, and ⌊ ⌋ represents a down rounding operation.

6. The method of claim 5, wherein: wherein, The overall length of the substrate is determined along the x-axis direction, and the overall width of the substrate is determined along the y-axis direction; the effective layout area refers to an area on the substrate for arranging and placing the printed circuit boards to be processed, which is the remaining operable area after excluding the invalid area corresponding to the edge of the substrate.

7. The method of claim 3, wherein: the step of applying a solder mask to the printed circuit board comprises applying a solder mask to the printed circuit board by screen printing. The layout coordinates of the single irregular circuit board are determined as follows: By: The coordinates (X m，k ,Y m，k ) of the lower left corner of the single irregular circuit board are calculated. m，k m，k wherein X m，u is the x-coordinate of the lower left corner of the circuit board in the mth row and the u-th column; Y m，u is the y-coordinate of the lower left corner of the circuit board in the mth row and the u-th column; m and u are the row index and the column index, respectively, for identifying the position of the irregular circuit board in the effective layout area of the substrate along the y-axis direction and along the x-axis direction.

8. The method of claim 7, wherein: In the layout planning, the effective layout area of the substrate is divided into multiple rows along the vertical direction from bottom to top, and the value of m represents the row number of the current circuit board; meanwhile, the effective layout area of the substrate is divided into multiple columns along the horizontal direction from left to right, and the value of u represents the column number of the current circuit board. ​ 9. The method of claim 7, wherein: the step of applying a solder mask to the printed circuit board comprises applying a solder mask to the printed circuit board after the step of applying a solder paste to the printed circuit board. wherein, The values of m and u both start from 0, i.e. the 0th row is the lowest row in the vertical direction, and the 0th column is the leftmost column in the horizontal direction.

10. A system for processing a printed circuit board prior to layout, the system being for performing a method of processing a printed circuit board prior to layout as claimed in any one of claims 1 to 9, characterised in that, The system comprises: The contour data acquisition module is configured to acquire a contour image of the irregular circuit board by using an image scanning device and extract a set of edge point coordinates by using an image recognition technology; The minimum enclosing rectangle calculation module is configured to extract maximum and minimum values in x and y directions from the edge point coordinates, calculate a width and a height of a minimum enclosing rectangle of the circuit board, and obtain an area of the minimum enclosing rectangle; The circuit board area calculation module is configured to calculate an actual area of the irregular circuit board by using a polygon area calculation method based on vector cross multiplication; The effective proportion analysis module is configured to calculate an effective proportion by using a ratio of the actual area of the circuit board to the area of the minimum enclosing rectangle, and compare the effective proportion with a preset threshold value; and the comparison result is used to determine whether a single circuit board needs to be subjected to multi-circuit board combination optimization; The multi-circuit board combination optimization module is configured to be started when the effective proportion is lower than the threshold value, provide an artificial auxiliary combination optimization function, support rotation and position adjustment of the multi-circuit boards, and recalculate a contour, an area and an effective proportion after combination; The effective layout area determination module is configured to acquire overall dimensions of the substrate and a width of an edge invalid area, and calculate a length and a width of an effective area available for layout; The number of circuit boards available for layout calculation module is configured to calculate a total number of circuit boards available for layout of the substrate according to the effective layout area dimensions and the circuit board dimensions; The layout coordinate positioning module is configured to calculate a lower left corner coordinate of each circuit board in the effective area of the substrate by using row and column indexes and size parameters of the irregular circuit board in the effective layout area of the substrate.

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