Double-gantry chip mounting equipment and method thereof

Abstract

The invention relates to the technical field of chip mounting, and discloses double-gantry chip mounting equipment and a method thereof.The double-gantry chip mounting equipment comprises double-gantry structures and two sets of dispensing mounting modules which are independent of each other, the two sets of dispensing mounting modules are arranged on the two gantry structures respectively, and when the two sets of modules are mounted in parallel, the two sets of dispensing mounting modules are separated from each other; each set can independently finish dispensing and mounting work, so that different areas of the PCB can be processed in parallel; the double-gantry structure and the double-gantry structure can be respectively used for dispensing and chip mounting when the double-gantry structure and the double-gantry structure are matched with each other, so that parallel processing of different working procedures of a chip mounting process is realized, the space utilization rate of the chip mounting equipment is improved, the mounting efficiency of the chip mounting equipment is remarkably improved, inertia forces generated by symmetrical movement in the double-gantry structure can be partially offset, dynamic load balancing is realized, and the service life of the chip mounting equipment is prolonged. The vibration sensitivity of the whole equipment is reduced, and the chip mounting precision is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the chip mounting technical field, and in particular to a double-gantry chip mounting device and method thereof. BACKGROUND

[0002] The semiconductor chip mounter is an automatic device widely used in the electronic manufacturing field, mainly used in surface mount technology (SMT), and mainly used for accurately mounting electronic components on printed circuit boards (PCB). At present, the chip mounter mostly adopts turret type and arch type architecture. The turret type structure generally refers to configuring multiple mounting heads on a central rotating tower, and arranging component feeders in a ring around the rotating tower. The continuous motion mode of "mounting-take material" is adopted synchronously. This structure usually has the disadvantages of component type limitation, high mechanical complexity and poor scalability.

[0003] For the gantry type chip mounter, the core structure adopts an arch type design, which is a portal motion system composed of X / Y axes using a spanning mechanical frame. It follows the principle of Cartesian coordinate system motion. This structure can be configured with a single or multiple independent mounting heads and modularized feeders. The mounting shaft slides on the frame based on the X-Y axis movement system, and cooperates with the suction nozzle, feeding mechanism, conveying flow line and visual system to realize component picking, positioning and mounting.

[0004] However, the traditional gantry type chip mounter only contains one gantry frame, and adopts a one-way sequential mounting method, that is, the device only performs one process action to realize one-time mounting each time. The single mounting shaft needs to realize the entire mounting process, which has low mounting efficiency, poor running stability and low space utilization of the device. At the same time, the single gantry system has serious motion inertia problem, which cannot meet the mounting requirements of higher precision and higher speed. SUMMARY

[0005] The present application aims to overcome the shortcomings of the prior art and provide a double-gantry chip mounting device and method thereof. Two independent gantry systems can realize parallel mounting of the same process and can also divide the mounting process, which has the advantages of high mounting efficiency, high mounting precision and stable system operation.

[0006] To achieve the above-mentioned purpose, the technical scheme adopted by the present application is as follows: In a first aspect, a double-gantry chip mounting device is provided. The device comprises a base, wherein a double-gantry structure is arranged on the base. The double-gantry structure comprises an X-axis module connected to the base. Two sets of Y-axis modules are connected to the output end of the X-axis module. The output end of each set of Y-axis modules is connected to a Z-axis module. The output end of the Z-axis module is connected to a dispensing and mounting module for dispensing and / or chip mounting. The two sets of dispensing and mounting modules can be mounted in parallel or in a cooperative manner. The dispensing and mounting module comprises a mounting shaft for picking up chips. One side of the mounting shaft is provided with a dispensing mechanism and an upper vision system for identifying the dispensing and mounting position. A streamline conveying mechanism for conveying a jig is further arranged on the base. The streamline conveying mechanism passes through the double-gantry structure. Jig feeding and discharging mechanisms are arranged at the two ends of the streamline conveying mechanism. A chip feeding mechanism and a lower vision system for identifying chips are arranged on one side of the streamline conveying mechanism.

[0007] Optionally, the streamline conveying mechanism comprises a bottom plate connected to the base. The bottom plate is sequentially provided with independent feeding streamline, mounting streamline and discharging streamline. A discharging pushing mechanism is arranged below the discharging streamline to push the jig into the discharging mechanism. Streamline width adjusting mechanisms are arranged on the feeding streamline, mounting streamline and discharging streamline to adjust the width of the streamline.

[0008] Optionally, the mounting streamline comprises a second streamline main body for conveying the jig. A jacking mechanism is arranged on the inner side of the second streamline main body to jack up the jig. A second position sensing mechanism is arranged on one side of the jacking mechanism to sense the position of the jig. A second streamline stop mechanism is arranged on the other side of the jacking mechanism to stop the jig.

[0009] Optionally, the jacking mechanism comprises a jacking seat connected to the bottom plate. A camshaft is rotatably installed on the inner side of the jacking seat. A jacking plate is arranged above the camshaft to fix the jig. The bottom of the jacking plate is in contact with the camshaft. The jacking plate is slidably connected to the jacking seat.

[0010] Optionally, the jig feeding mechanism comprises a feeding fixed table and a feeding cage limiting assembly for receiving a feeding cage. The feeding fixed table is connected to the base. A feeding cage lifting mechanism is arranged on the feeding fixed table to drive the feeding cage limiting assembly to lift. A feeding pushing mechanism is arranged on one side of the feeding cage limiting assembly to push the jig in the feeding cage into the feeding streamline.

[0011] Optionally, the mounting shaft comprises a shaft seat connected with the output end of the Z-axis module, a Z-direction micro-motion table capable of moving along the Z-axis direction is installed on the shaft seat, and a hollow rotating platform is installed on the Z-direction micro-motion table, and the output end of the hollow rotating platform is connected with a mounting suction nozzle used for picking up the chip.

[0012] Optionally, the chip feeding mechanism adopts blue film feeding, and suction nozzle bank mechanisms for replacing the suction nozzles of the mounting shafts are arranged on the two sides of the chip feeding mechanism.

[0013] In a second aspect, a double-gantry chip mounting method is provided, which adopts the double-gantry chip mounting device of the first aspect and comprises the following steps: S1, the jig feeding mechanism pushes the jig with products to the streamline conveying mechanism; S2, the streamline conveying mechanism conveys the jig to the work station of the mounting streamline to realize positioning and fixing; S3, the two sets of dispensing and mounting modules respectively dispense and / or mount chips on the products on the jig; S4, after the products complete chip mounting, the jig is conveyed to the discharge streamline and pushed into the discharging mechanism by the discharge pushing mechanism.

[0014] Optionally, when the two sets of dispensing and mounting modules adopt parallel mounting, first, the upper visual system is moved to the position above the product to be dispensed to complete point recognition, and then the dispensing mechanism is moved to the position above the recognized position to dispense; after dispensing is completed, the mounting shaft picks up the chip from the chip feeding mechanism and performs chip recognition through the lower visual system, and then moves to the recognized position for chip mounting.

[0015] Optionally, when the two sets of dispensing and mounting modules adopt division and cooperation, the dispensing and mounting module close to the jig feeding mechanism is only used for dispensing, the other dispensing and mounting module is only used for chip mounting, and after dispensing is completed, the jig is moved to the next work station for chip mounting.

[0016] Compared with the prior art, the beneficial effects of the present application are as follows: (1) The double-gantry structure can realize parallel mounting under the double-gantry system, two independent dispensing and mounting modules can process different areas of the PCB substrate and different processes of the mounting process in parallel, improve the space utilization of the mounting equipment, significantly improve the mounting efficiency and equipment UPH value of the chip mounting equipment, and the inertial force generated by the symmetrical motion in the double-gantry structure can be partially offset, realizing dynamic load balancing, reducing the vibration sensitivity of the whole machine equipment, and improving the chip mounting precision; (2) The dispensing and mounting module of the application can dispense and / or mount chips under the guidance of vision, and when two sets of modules are mounted in parallel, each set can independently complete dispensing and mounting work, thereby processing different areas of the PCB in parallel; when the two sets of modules work together, they can be used for dispensing and chip mounting respectively, thereby realizing parallel processing of different processes of the mounting process; (3) In the application, the product size specification compatible with the device is greatly expanded by adjusting the width of the flow line, and different specifications of the PCB substrate can be adapted by adjusting the width of the flow line, thereby effectively improving the robustness of the device. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 is a structural schematic diagram of a double-gantry chip mounting device in an embodiment of the application; Figure 2 is a structural schematic diagram of a double-gantry structure in an embodiment of the application; Figure 3 is a structural schematic diagram of an X-axis module, a Y-axis module and a Z-axis module in an embodiment of the application; Figure 4 is a structural schematic diagram of a mounting shaft in an embodiment of the application; Figure 5 is a structural schematic diagram of an upper vision system in an embodiment of the application; Figure 6 is a structural schematic diagram of a lower vision system in an embodiment of the application; Figure 7 is a structural schematic diagram of a dispensing mechanism in an embodiment of the application; Figure 8 is a structural schematic diagram of a jig loading mechanism in an embodiment of the application; Figure 9 is a structural schematic diagram of an upper loading pushing mechanism in an embodiment of the application; Figure 10 is a structural schematic diagram of an upper loading cage lifting mechanism in an embodiment of the application; Figure 11 is a structural schematic diagram of a chip loading mechanism in an embodiment of the application; Figure 12 is a structural schematic diagram of a blue film disc in an embodiment of the application; Figure 13 is a structural schematic diagram of a blue film top head in an embodiment of the application; Figure 14 is a structural schematic diagram of a blue film planar motion mechanism in an embodiment of the application; Figure 15 is a structural schematic diagram of a lower loading mechanism in an embodiment of the application; Figure 16 is a structural schematic diagram of a lower loading cage lifting mechanism in an embodiment of the application; Figure 17 is a structural schematic diagram of a flow line conveying mechanism in an embodiment of the present application; Figure 18 is a structural schematic diagram of a feed flow line in an embodiment of the present application; Figure 19 is a structural schematic diagram of a first flow line width adjusting mechanism in an embodiment of the present application; Figure 20 is a structural schematic diagram of a first flow line main body in an embodiment of the present application; Figure 21 is a structural schematic diagram of a first driving mechanism in an embodiment of the present application; Figure 22 is a structural schematic diagram of a mounting flow line in an embodiment of the present application; Figure 23 is a structural schematic diagram of a jacking mechanism in an embodiment of the present application; Figure 24 is a structural schematic diagram of a discharge pushing mechanism in an embodiment of the present application; Figure 25 is a structural schematic diagram of a suction nozzle library mechanism in an embodiment of the present application; 1, base; 2, double-gantry structure; 21, X-axis module; 211, fixed front seat; 212, X-axis fixed rear seat; 213, X-axis crossbeam; 214, X-axis linear motor driving mechanism; 215, X-direction moving table; 22, Y-axis module; 221, Y-axis crossbeam; 222, Y-direction moving table; 223, Y-axis linear motor driving mechanism; 24, Z-axis module; 241, Z-direction moving table; 242, Z-axis linear motor driving mechanism; 3, mounting shaft; 31, shaft seat; 32, voice coil motor; 33, micro guide rail; 34, hollow rotating platform; 35, Z-direction micro moving table; 36, mounting suction nozzle; 4, upper visual system; 41, first support; 42, first camera; 43, first lens; 44, first point light source; 45, first ring light source; 5, lower visual system; 51, second support; 52, second camera; 53, second lens; 54, triangular prism; 55, second point light source; 56, second ring light source; 6, dispensing mechanism; 61, dispensing support; 62, dispensing cylinder; 63, linear guide rail I; 64, laser displacement sensor; 65, glue cylinder; 66, fixing piece; 67, tightening bolt; 7, jig feeding mechanism; 71, feeding pushing mechanism; 711, feeding fixing seat; 712, linear guide rail II; 713, step motor I; 714, synchronous belt assembly I; 715, pushing rod; 72, feeding cage lifting mechanism; 721, ball screw I; 722, guide assembly; 723, Z-direction moving plate; 724, feeding servo motor; 725, synchronous belt assembly II; 726, hand wheel; 73, feeding fixed table; 74, feeding cage limiting assembly; 8, chip feeding mechanism; 81, blue film disc; 811, blue film ring; 812, blue film limiting mechanism; 82, blue film ejector head; 821, blue film cylinder; 822, linear guide rail III; 823, ejector pin assembly; 824, stepper motor II; 826, ejector head support; 83, blue film planar motion mechanism; 831, X-direction driving mechanism; 832, X-direction guide mechanism; 833, Y-direction driving mechanism; 834, Y-direction guide mechanism; 835, blue film motion fixed table; 84, blue film fixed seat; 9, discharging mechanism; 91, discharging cage lifting mechanism; 911, ball screw II; 912, linear guide rail IV; 913, Z-direction moving block; 914, discharging servo motor; 915, synchronous belt assembly III; 916, lifting fixed table; 92, discharging cage limiting assembly; 93, discharging fixed table; 10, streamline conveying mechanism; 101, bottom plate; 102, feeding streamline; 1021, first streamline width adjusting mechanism; 10211, connecting block; 10212, adjusting bolt; 10213, fixed piece; 10214, linear guide rail V; 1022, first streamline main body; 10221, support seat; 1023, first position sensing mechanism; 1024, first stop blocking mechanism; 1025, first driving mechanism; 10251, stepper motor III; 10252, synchronous belt assembly IV; 10253, transmission shaft; 1026, transmission mechanism; 103, mounting streamline; 1031, second streamline main body; 1032, second stop blocking mechanism; 1033, jacking mechanism; 10331, jacking servo motor; 10332, synchronous belt assembly V; 10333, cam shaft; 10334, jacking seat; 10335, jacking plate; 1034, second position sensing mechanism; 1035, second streamline width adjusting mechanism; 1036, second driving mechanism; 104, discharging streamline; 105, discharging pushing mechanism; 1051, pushing support; 1052, synchronous belt assembly VI; 1053, linear guide rail VI; 1054, claw lifting cylinder; 1055, pushing claw; 11, suction nozzle library mechanism; 111, cylinder driving assembly; 112, translational table; 113, suction nozzle seat. DETAILED DESCRIPTION

[0018] The present application will now be described in further detail with reference to the drawings and embodiments, which are shown by way of illustration in the accompanying drawings, and wherein:

[0019] In one embodiment, as shown in the drawings, a double-gantry chip mounting device comprises a base 1, a double-gantry structure 2, a dispensing and mounting module, a lower vision system 5, a jig loading mechanism 7, a chip loading mechanism 8, a unloading mechanism 9, a streamline conveying mechanism 10 and a suction nozzle library mechanism 11. Figures 1-7 The double-gantry structure 2 is fixedly installed on the top side of the base 1, and the dispensing and mounting module is installed on the double-gantry structure 2; the lower vision system 5, the jig loading mechanism 7, the chip loading mechanism 8, the unloading mechanism 9, the streamline conveying mechanism 10 and the suction nozzle library mechanism 11 are all installed on the base 1.

[0020] The jig loading mechanism 7 and the unloading mechanism 9 are located on the same straight line at both ends of the streamline conveying mechanism 10 and are located on both sides of the streamline conveying mechanism 10, respectively; the lower vision system 5 is located in the middle of the chip loading mechanism 8 and the streamline conveying mechanism 10, and the suction nozzle library mechanism 11 is located on both sides of the chip loading mechanism 8.

[0021] The dispensing and mounting module comprises a mounting shaft 3, an upper vision system 4 and a dispensing mechanism 6, which can realize dispensing and / or chip mounting functions under the guidance of vision; in the present application, two sets of dispensing and mounting modules are provided, which are independently operated on two gantry structures, and the two sets of dispensing and mounting modules can realize parallel mounting or division and cooperation.

[0022] When the two sets of dispensing and mounting modules are used for parallel mounting, each set can independently complete dispensing and mounting work, thereby processing different areas of the PCB substrate in parallel; when the two sets of dispensing and mounting modules are used for division and cooperation, one set is only used for dispensing, and the other set is only used for chip mounting, thereby realizing parallel processing of different processes of the mounting process.

[0023] Therefore, the present application can realize parallel mounting under the double-gantry system, and the two independent dispensing and mounting modules can process different areas of the PCB substrate and different processes of the mounting process in parallel, thereby improving the space utilization of the mounting equipment and significantly improving the mounting efficiency and the UPH (output per hour) value of the chip mounting equipment; and the inertial forces generated by the symmetrical motion in the double-gantry structure can be partially offset, thereby realizing dynamic load balancing, reducing the vibration sensitivity of the whole machine equipment and improving the chip mounting precision.

[0024] Working principle:

[0025] ​The jig loading mechanism 7 pushes the jig with products to the streamline conveying mechanism 10, the streamline conveying mechanism 10 conveys the jig to the first station and realizes positioning and fixing, under the driving of the double-gantry structure, the dispensing and mounting module dispenses the products on the jig first, after dispensing is completed, the jig moves to the second station, after positioning and fixing are also realized, the dispensing and mounting module mounts the chip on the products on the jig, after the product completes chip mounting, under the action of the streamline conveying mechanism 10, is pushed into the unloading mechanism 9.

[0026] Among them, two sets of dispensing and mounting modules can respectively dispense and / or mount chips on the products on the jig, when two parallel processes different areas on the same PCB substrate, each dispensing and mounting module dispenses and mounts chips. When two parallel processes different processes of the same mounting process, dispensing is completed on the first station, then chip mounting is completed on the second station, at this time, each dispensing and mounting module is only used for dispensing or chip mounting.

[0027] In the embodiment two, on the basis of the embodiment one, the application also proposes the specific structure of each component of the double-gantry chip mounting equipment.

[0028] As shown in Figures 1-3 The double-gantry structure 2 includes the X-axis module 21 connected with the base 1, the output end of the X-axis module 21 is connected with two sets of Y-axis modules 22, the output end of each Y-axis module 22 is connected with the Z-axis module 24, and the dispensing and mounting module is arranged at the output end of the Z-axis module.

[0029] The X-axis module 21 includes the X-axis fixed front seat 211, the X-axis fixed rear seat 212, the X-axis crossbeam 213, the X-axis linear motor driving mechanism 214 and the X-direction moving table 215, the X-axis fixed front seat 211 and the X-axis fixed rear seat 212 are connected to the base 1, the X-axis crossbeam 213 is connected to the X-axis fixed rear seat 212, the X-direction moving table 215 is connected with the X-axis linear motor driving mechanism 214 and is fixed on the X-axis crossbeam 213, the X-direction moving table 215 moves left and right through the X-axis linear motor driving mechanism 214.

[0030] The Y-axis module 22 includes the Y-axis crossbeam 221, the Y-direction moving table 222 and the Y-axis linear motor driving mechanism 223, one end of the Y-axis crossbeam 221 is connected with the X-direction moving table 215, the other end is connected with the linear guide rail on the X-axis fixed front seat 211, the Y-direction moving table 222 moves forward and backward through the Y-axis linear motor driving mechanism 223, the structure and connection mode of the two sets of Y-axis modules 22 are completely consistent.

[0031] The Z-axis module 24 comprises a Z-direction moving table 241 and a Z-axis linear motor driving mechanism 242, the Z-direction moving table 241 is connected with the linear guide rail on the Y-direction moving table 222, the Z-axis linear motor driving mechanism 242 is fixedly connected on the Y-direction moving table 222, the Z-direction moving table 241 moves up and down through the Z-axis linear motor driving mechanism 242, and the structure and connection mode of the two sets of Z-axis linear modules 24 are completely consistent.

[0032] As shown in Figure 4 The mounting shaft 3 comprises a shaft seat 31 connected with the Z-direction moving table 241, the shaft seat 31 is provided with a Z-direction micro moving table 35 capable of moving along the Z-axis direction, the Z-direction micro moving table 35 is provided with a hollow rotating platform 34, and the output end of the hollow rotating platform 34 is connected with a mounting suction nozzle 36 for picking up the chip.

[0033] Specifically, the mounting shaft 3 comprises the shaft seat 31, the voice coil motor 32, the micro guide rail 33, the hollow rotating platform 34, the Z-direction micro moving table 35 and the mounting suction nozzle 36, the shaft seat 31 is fixed on the Z-direction moving table 241, the voice coil motor 32 is connected with the shaft seat 31, the shaft seat 31 is provided with the linear guide rail, the Z-direction micro moving table 35 is connected with the voice coil motor 32 and the hollow rotating platform 34, the hollow rotating platform 34 is connected with the mounting suction nozzle 36, the Z-direction micro moving table 35 moves up and down in a small range through the voice coil motor 32, thereby driving the mounting suction nozzle 36 to move up and down, and the mounting suction nozzle 36 rotates in a certain angle range through the hollow rotating platform 34.

[0034] As shown in Figure 5 The upper visual system 4 comprises the first support 41, the first camera 42, the first lens 43, the first point light source 44 and the first ring light source 45, and there are two groups in total. The first support 41 is fixed on the Z-direction moving table 241, the top end of the first lens 43 is connected with the first camera 42, the tail end is connected with the first ring light source 45, the lens body of the first lens 43 is connected with the first point light source 44, the Z-direction moving table 241 moves up and down, so that the focusing of the upper visual lens is realized, each first lens 43 of the upper visual system 4 corresponds to a light path, and an imaging area is formed on the product, and the number of the first lens 43 of the upper visual system 4 in the application is two.

[0035] As shown in Figure 6As shown, the lower vision system 5 includes a second support 51, a second camera 52, a second lens 53, a triangular prism 54, a second point light source 55 and a second ring light source 56. The lower vision system 5 is placed horizontally as a whole, the second camera 52 is connected to the upper end of the second lens 53, the second point light source 55 is connected to the side end of the lens body of the second lens 53, the triangular prism 54 is connected to the second support 51 and faces the second lens 53, and the second ring light source 56 is connected directly above the triangular prism 54. Each second lens 53 of the lower vision system 5 corresponds to a light path and forms an imaging area on the product. The number of second lenses 53 of the lower vision system 5 of the present application is 2.

[0036] As shown in Figure 7 , the dispensing mechanism 6 includes a dispensing support 61, a dispensing cylinder 62, a linear guide rail I 63, a laser displacement sensor 64, a glue barrel 65, a fixing part 66 and a tightening bolt 67. The dispensing support 61 is fixedly connected to the Z-direction moving table 241. The linear guide rail I 63 is installed on the dispensing support 61. The dispensing cylinder 62 is fixed to the dispensing support 61. The piston rod of the dispensing cylinder 62 is connected to the fixing part 66. The fixing part 66 is connected to the linear guide rail I 63. The glue barrel 65 has a dispensing needle at the tail end. The glue barrel 65 is connected to the fixing part 66 in cooperation with the tightening bolt 67. The tightness of the glue barrel 65 can be adjusted by the tightening bolt 67. The dispensing cylinder 62 can drive the dispensing needle to move up and down, thereby realizing dispensing on the surface of the product.

[0037] Specifically, after the X, Y and Z axes of the double-gantry structure 2 are sequentially operated, the dispensing mechanism 6 can realize dispensing on the surface of the product. After dispensing is completed, the upper vision system 4 identifies the material, the mounting shaft 3 picks up the material, and after identification by the lower vision system 5, the mounting shaft 3 mounts the picked material at the specified position on the surface of the product. The sequential process action can choose the same process parallel mounting, or use the dispensing and mounting distributed process mode. The process mode includes the mounting process for UV glue and the mounting process for the combination of UV glue and other types of glue. The left and right mounting modes can choose different combinations according to actual conditions.

[0038] As shown in Figures 8-10 , the jig loading mechanism 7 includes a loading pushing mechanism 71, a loading cage lifting mechanism 72, a loading fixed table 73 and a loading cage limiting assembly 74. The loading pushing mechanism 71, the loading cage lifting mechanism 72 and the loading cage limiting assembly 74 are all connected to the loading fixed table 73. The loading fixed table 73 is connected to the base 1. The cage is placed in the specified position of the loading cage limiting assembly 74.

[0039] The upper feeding pushing mechanism 71 comprises an upper feeding fixing base 711, a linear guide rail II 712, a stepping motor I 713, a synchronous belt assembly I 714, a pushing rod 715 and a photoelectric sensor. The upper feeding fixing base 711 is connected to the upper feeding fixing table 73. The linear guide rail II 712 is fixed to the top surface of the upper feeding fixing base 711. The stepping motor I 713 is connected to the side surface of the upper feeding fixing base 711. The synchronous belt assembly I 714 comprises a synchronous belt, a synchronous wheel and an idler wheel, and is connected to the other side surface of the upper feeding fixing base 711. The synchronous wheel of the synchronous belt assembly I 714 is connected to the stepping motor I 713. The pushing rod 715 is connected to the linear guide rail II 712 and is meshed with the synchronous belt of the synchronous belt assembly I 714. The synchronous belt assembly I 714 is driven by the rotation of the stepping motor I 713. The photoelectric sensor is connected to the side surface of the upper feeding fixing base 711 and is located at the same side as the stepping motor I 713. The pushing rod 715 moves along the linear guide rail II 712 by the synchronous belt assembly I 714. When the pushing rod 715 reaches the corresponding position, the photoelectric sensor signal is triggered, so that the pushing rod 715 is extended and retracted.

[0040] The upper feeding cage lifting mechanism 72 comprises a ball screw I 721, a guide assembly 722, a Z-direction moving plate 723, an upper feeding servo motor 724, a synchronous belt assembly II 725 and a hand wheel 726. The guide assembly 722 is composed of a guide shaft and a linear bearing, and is connected to the upper feeding fixing table 73. The ball screw I 721 is fixed to the center of the guide assembly 722 and is connected to the Z-direction moving plate 723. The top end is connected to the hand wheel 726, and the bottom end is connected to the synchronous wheel of the synchronous belt assembly II 725. The other synchronous wheel of the synchronous belt assembly II 725 is connected to the upper feeding servo motor 724. The Z-direction moving plate 723 is driven by the servo motor and moves up and down through the synchronous belt and the ball screw I 721.

[0041] Specifically, the upper feeding cage limiting assembly 74 is connected to the Z-direction moving plate 723. The product cage is placed in the fixed position of the upper feeding cage limiting assembly 74. During the upper feeding process, the product cage is lifted and lowered by the Z-direction moving plate 723 driven by the upper feeding servo motor 724.

[0042] As shown in Figures 11-14 The chip feeding mechanism 8 adopts blue film feeding, which comprises a blue film disc 81, a blue film top head 82, a blue film plane motion mechanism 83 and a blue film fixing base 84. The blue film fixing base 84 is connected to the base 1. The blue film top head 82 and the blue film plane motion mechanism 83 are connected to the blue film fixing base 84.

[0043] The blue film disc 81 comprises a blue film ring 811 and a blue film limiting mechanism 812. The blue film ring 811 is fixed by the spring expansion and contraction in the blue film limiting mechanism 812. The number of the blue film disc 81 on the device of the present application is 2.

[0044] The blue film top head 82 comprises a blue film cylinder 821, a linear guide rail III 822, a pin assembly 823, a step motor II 824 and a top head support 826. The top head support 826 is connected to the blue film fixing base 84. The blue film cylinder 821 and the linear guide rail III 822 are fixed to the top head support 826. The pin assembly 823 is connected to the blue film cylinder 821 and the linear guide rail III 822. The pin assembly 823 is composed of a tungsten pin, a pin seat, a pin cover and a linear bearing. The tungsten pin is fixed to the pin seat and can move along the linear bearing. The step motor II 824 is connected to a rolling bearing and is located below the pin assembly 823. The tungsten pin can be moved in a large range by the blue film cylinder 821 and can be extended or retracted from the pin cover in a small range by the step motor II 824.

[0045] The blue film planar motion mechanism 83 comprises an X-direction driving mechanism 831, an X-direction guiding mechanism 832, a Y-direction driving mechanism 833, a Y-direction guiding mechanism 834 and a blue film motion fixing table 835. The linear guide rails of the X-direction driving mechanism 831 and the Y-direction driving mechanism 833 are composed of a linear motor, a grating ruler and a reading head. The X-direction guiding mechanism 832 and the Y-direction guiding mechanism 834 are mainly composed of linear guide rails. The X-direction driving mechanism 831 and the X-direction guiding mechanism 832 are connected to the blue film motion fixing table 835. The Y-direction driving mechanism 833 and the Y-direction guiding mechanism 834 are connected to the X-direction driving mechanism 831 and the X-direction guiding mechanism 832. The blue film disc 81 can be moved and positioned in a certain range by the linear motor driving.

[0046] Specifically, the product chip is loaded on the blue film. The chip is placed on the surface of the blue film. The blue film planar motion mechanism 83 moves the chip to the top of the tungsten pin of the blue film top head 82. The tungsten pin ejects the chip to overcome the adhesion between the blue film and the chip. The chip is picked up in cooperation with the mounting shaft 3.

[0047] As shown in Figure 15 and Figure 16 , the unloading mechanism 9 comprises an unloading cage lifting mechanism 91, an unloading cage limiting assembly 92 and an unloading fixing table 93. The unloading fixing table 93 is connected to the base 1. The unloading cage lifting mechanism 91 is connected to the unloading fixing table 93. The unloading cage limiting assembly 92 is connected to the unloading cage lifting mechanism 91. The unloading cage lifting mechanism 91 moves up and down to drive the unloading cage limiting assembly 92 to move.

[0048] The blanking cage lifting mechanism 91 comprises a ball screw II 911, a linear guide IV 912, a Z-direction moving block 913, a blanking servo motor 914, a synchronous belt assembly III 915 and a lifting fixed table 916, the ball screw II 911 and the linear guide IV 912 are connected on the lifting fixed table 916, the ball screw II 911 is fixed at the center of the two linear guides IV 912 and connected with the Z-direction moving block 913, the top end is connected with the synchronous pulley of the synchronous belt assembly III 915, the other synchronous pulley of the synchronous belt assembly III 915 is connected with the blanking servo motor 914, the Z-direction moving block 913 is driven by the blanking servo motor 914, and after transmission through the synchronous belt and the ball screw II 911, the up-down movement is realized.

[0049] The blanking cage limiting assembly 92 has the same structure and installation mode as the feeding cage limiting assembly 74.

[0050] As shown in Figures 17-24 The streamline conveying mechanism 10 comprises a bottom plate 101, a feeding streamline 102, a mounting streamline 103, a discharging streamline 104 and a discharging pushing mechanism 105, the bottom plate 101 is fixedly connected on the base 1, the feeding streamline 102, the mounting streamline 103 and the discharging streamline 104 are sequentially connected on the bottom plate 101 from left to right, the discharging pushing mechanism 105 is connected on the base 1 and is directly below the discharging streamline 104, the conveying streamline of the present application comprises two groups of mounting streamlines 103 and is sequentially connected, that is, has a first station and a second station, and the feeding streamline 102, the mounting streamline 103 and the discharging streamline 104 are all provided with streamline width adjusting mechanisms for adjusting the width of the streamlines.

[0051] The feeding streamline 102 comprises two groups of first streamline width adjusting mechanisms 1021, a first streamline main body 1022, a first position sensing mechanism 1023, a first stop mechanism 1024, a first driving mechanism 1025 and a transmission mechanism 1026, the first streamline width adjusting mechanisms 1021 and the first streamline main body 1022 are both fixed on the bottom plate 101, and the end face of the first streamline main body 1022 is flush with the end face of the bottom plate 101, the two groups of first streamline width adjusting mechanisms 1021 are connected with one side of the first streamline main body 1022, the transmission mechanism 1026 is connected on the first streamline main body 1022, the first position sensing mechanism 1023 and the first stop mechanism 1024 are fixed on the bottom plate 101 and are in the middle of the first streamline main body 1022, the output shaft of the first driving mechanism 1025 is connected with the synchronous pulley of the transmission mechanism 1026, the feeding streamline 102 is rotated by the stepping motor of the first driving mechanism 1025, and the continuous horizontal movement is realized through the synchronous belt of the transmission mechanism 1026 to realize the conveying of the materials.

[0052] The mounting flow line 103 comprises a second flow line body 1031, a second stop mechanism 1032, a jacking mechanism 1033, a second position sensing mechanism 1034, a second flow line width adjusting mechanism 1035 and a second driving mechanism 1036, the second flow line body 1031, the second stop mechanism 1032 and the jacking mechanism 1033 are connected to the bottom plate 101 and located in the middle of the second flow line body 1031, the second flow line width adjusting mechanism 1035 is connected with the second flow line body 1031, and the second driving mechanism 1036 is connected with the synchronous pulley of the second flow line body 1031. The mounting flow line 103 realizes material conveying through the rotation of the motor of the second driving mechanism 1036, and realizes the lifting and fixing of the material through the rotation of the motor of the jacking mechanism 1033. In the application, the mounting flow line 103 comprises two groups and is connected in sequence.

[0053] The second flow line body 1031, the second stop mechanism 1032, the second position sensing mechanism 1034, the second flow line width adjusting mechanism 1035 and the second driving mechanism 1036 of the mounting flow line 103 are identical in structure, function and mounting mode to the feeding flow line 102; the function structure and mounting mode of the discharging flow line 104 are identical to those of the feeding flow line 102, except that the discharging flow line 104 is additionally connected with a surface light source illuminator above.

[0054] The position sensing mechanism is mainly composed of a photoelectric sensor, which is used for sensing and detecting the position information of the material on the flow line; the stop mechanism is mainly composed of a circular cylinder, which is extended after receiving the signal of the photoelectric sensor of the position sensing mechanism, thereby completing the stopping action of the material.

[0055] The jacking mechanism 1033 comprises a jacking servo motor 10331, a synchronous belt assembly V 10332, a camshaft 10333, a jacking seat 10334 and a jacking plate 10335, the jacking servo motor 10331 and the camshaft 10333 are connected by the synchronous belt assembly V 10332, the jacking plate 10335 is fixed on the linear guide rail of the jacking seat 10334 and is in contact with and located above the camshaft 10333, the jacking plate 10335 rotates through the jacking servo motor 10331 and is transmitted to the camshaft 10333 through the synchronous belt, thereby realizing the up-and-down movement of the jacking plate 10335 along the linear guide rail of the jacking seat 10334.

[0056] Further, the flow line body, the driving mechanism and the flow line width adjusting mechanism of the flow line conveying mechanism 10 are all identical in structure, and the first flow line width adjusting mechanism 1021, the first flow line body 1022 and the first driving mechanism 1025 are taken as examples for illustration.

[0057] The first streamline width adjusting mechanism 1021 comprises a connecting block 10211, an adjusting bolt 10212, a fixing sheet 10213 and a linear guide rail V 10214 fixed on the bottom plate 101, the connecting block 10211 is connected to the sliding block of the linear guide rail V 10214, the adjusting bolt 10212 is used to connect the fixing sheet 10213 and the linear guide rail V 10214, and the connecting block 10211 is moved or fixed on the linear guide rail by screwing the adjusting bolt 10212.

[0058] The first streamline body 1022 comprises a transmission mechanism 1026 and a support seat 10221, the synchronous belt conveying end of the transmission mechanism 1026 is fixed on the side of the support seat 10221, the motor driving end is fixed on the bottom plate 101, and the motor output force is output to the synchronous belt by the transmission shaft 10253.

[0059] The first driving mechanism 1025 comprises a stepping motor III 10251, a synchronous belt assembly IV 10252 and a transmission shaft 10253, one end of the synchronous belt assembly IV 10252 is connected with the stepping motor III 10251, the other end is connected with the transmission shaft 10253, the streamline synchronous belt is rotated by the stepping motor III 10251 and is sequentially transmitted by the synchronous belt assembly IV 10252 and the transmission shaft 10253 to realize translation.

[0060] The discharging pushing mechanism 105 comprises a pushing support 1051, a synchronous belt assembly VI 1052, a linear guide rail VI 1053, a claw lifting cylinder 1054, a pushing claw 1055 and a sensor, the pushing support 1051 is fixed on the bottom plate 101, the linear guide rail VI 1053, the synchronous belt assembly VI 1052 and the sensor are fixed on the side of the pushing support 1051, the claw lifting cylinder 1054 is connected to the pushing support 1051, the pushing claw 1055 is connected to the claw lifting cylinder 1054 and the linear guide rail VI 1053, the pushing claw 1055 is moved left and right by the synchronous belt assembly VI 1052 and is moved up and down by the claw lifting cylinder 1054.

[0061] As shown in Figure 25 The suction nozzle library mechanism 11 comprises a cylinder driving assembly 111, a translation table 112 and a suction nozzle seat 113, and is fixed on a workbench, and the workbench is fixed on the base 1. The cylinder driving assembly 111 comprises a spring and a single-shaft cylinder, the translation table 112 is moved left and right by the single-shaft cylinder and the spring, and finally the suction nozzle seat 113 is switched between the limiting state and the active state, and the number of the suction nozzle seat 113 is six.

[0062] The suction nozzle library mechanism 11 can store various types of mounting nozzles 36, and the mounting shaft 3 can complete the replacement of different types of nozzles under the joint action of the X-axis module 21, the Y-axis module 22 and the Z-axis module 24.

[0063] On the basis of the first and second embodiments, the application further provides a double-gantry chip mounting method, comprising jig loading, jig conveying, dispensing and mounting and jig unloading, wherein the product is loaded on the jig, and the jig is stored in the cage.

[0064] Jig loading: the jig loading mechanism 7 pushes the jig with the product to the streamline conveying mechanism 10.

[0065] The jig in the loading cage in the jig loading cage limiting assembly 74 is lifted to the streamline conveying synchronous belt level height by the loading cage lifting mechanism 72, and the loading pushing mechanism 71 extends the pushing rod 715 to push the jig into the feeding streamline 102.

[0066] Jig conveying: the streamline conveying mechanism 10 conveys the jig to the work station of the mounting streamline 103 to realize positioning and fixing.

[0067] The continuous rotation of the motor of the first driving mechanism 1025 conveys the jig to the mounting streamline 103, and the first work station triggers the photoelectric sensor signal to make the circular cylinder of the second stop mechanism 1032 extend, while the lifting servo motor 10331 in the lifting mechanism 1033 drives the cam shaft 10333 to rotate, and the cam shaft 10333 lifts the jig to cooperate with the streamline pressing plate to realize the positioning and fixing of the jig.

[0068] Dispensing and mounting: two sets of dispensing and mounting modules respectively dispense and / or mount the chip on the product on the jig.

[0069] After the jig is lifted and fixed, the X-axis module 21 of the double-gantry structure 2 and the Y-axis module 22 on the left move, the upper vision system 4 moves above the position where the product on the jig needs to be dispensed, and the subsequent dispensing mechanism 6 moves above the recognized position to complete a dispensing action by extending and retracting the dispensing cylinder 62.

[0070] After the product in the jig is dispensed, it is conveyed to the second work station by the streamline, the X-axis module 21 of the double-gantry structure 2 and the Y-axis module 22 on the right move, the upper vision system 4 moves above the product, and the subsequent mounting shaft 3 picks up the chip from the blue film of the chip loading mechanism 8, moves to the lower vision system 5 to identify the chip, and moves above the mounting position after correct identification and completes a chip mounting by moving up and down with the Z-axis module 24 on the right.

[0071] Jig unloading: after the product completes chip mounting, the jig is transported to the discharge flow line 104 and pushed into the unloading mechanism 9 by the discharge pushing mechanism 105. After the product completes chip mounting, it is transported to the discharge flow line 104, and the product jig is pushed into the cage of the unloading mechanism 9 as a whole by the pushing puller 1055 of the discharge pushing mechanism 105 driven by the motor.

[0072] As described above, the glue dispensing and mounting module can realize glue dispensing and chip mounting under the guidance of vision. Therefore, two independent glue dispensing and mounting modules can process different areas of the PCB substrate and different processes of the patch process in parallel, improve the space utilization of the patch equipment, and significantly improve the mounting efficiency and equipment UPH value of the chip mounting equipment.

[0073] When two sets of glue dispensing and mounting modules are used to process different areas of the PCB substrate in parallel, the upper vision system 4 is first moved above the position where the product needs to be dispensed, the point recognition is completed, and then the glue dispensing mechanism is moved above the recognized position to dispense glue. After dispensing, the mounting shaft 3 picks up the chip from the chip feeding mechanism 8 and performs chip recognition through the lower vision system 5, and then moves to the recognized position for chip mounting after correct recognition.

[0074] Specifically, after the jig is positioned and fixed at the first station, the first set (left side) of the upper vision system 4 moves above the position where the product needs to be dispensed to complete point recognition. The subsequent glue dispensing mechanism 6 moves above the recognized position to dispense glue to the product. Then the mounting shaft 3 picks up the chip from the blue film of the chip feeding mechanism 8 and moves to the position of the lower vision system 5 for chip recognition. After correct recognition, it moves to the mounting position to complete the mounting of the chip. When the partial area of the PCB substrate is processed, the jig is transported to the second station through the flow line, and the second set (right side) of the glue dispensing and mounting module repeats the action of the first set to process the other area of the PCB substrate.

[0075] When two sets of glue dispensing and mounting modules are used to process different processes of the patch process in parallel, the glue dispensing and mounting module near the jig feeding mechanism 7 is only used for glue dispensing, and the other set of glue dispensing and mounting module is only used for chip mounting. After glue dispensing, the jig moves to the next station for chip mounting.

[0076] Specifically, after the jig is positioned and fixed at the first station, the upper vision system 4 close to the jig product loading mechanism 7 moves to the position above the product on the jig that needs to be glued to complete point recognition, and then the subsequent glue dispensing mechanism 6 moves to the position above the recognized position to glue the product; after the product on the jig is glued, the product is conveyed to the second station in a streamline, the upper vision system 4 close to the product unloading mechanism 9 moves to the position above the product to complete the position recognition of the product, and then the subsequent mounting shaft 3 picks up the chip from the blue film of the chip loading mechanism 8 and moves to the position of the lower vision system 5 to complete the chip recognition, and then moves to the mounting position to complete the mounting of the chip.

[0077] In the application, the left and right stations can be switched between the glue dispensing mode and the mounting mode, and the product includes an optical module, and each jig can carry 5-8 optical modules.

[0078] In summary, the double-gantry chip mounting device and method can dispense glue and / or mount chips under the guidance of vision, and each set of modules can independently complete the dispensing and mounting when two sets of modules are mounted in parallel, so that different areas of the PCB can be processed in parallel; when the two sets of modules work together, one set can be used for dispensing and the other set can be used for mounting in the UV process, so that the different processes of the UV mounting process can be processed in parallel, thereby improving the space utilization of the mounting device and significantly improving the mounting efficiency and UPH value of the chip mounting device; and the inertial forces generated by the symmetrical motion in the double-gantry structure can be partially offset, dynamic load balancing is achieved, vibration sensitivity of the whole device is reduced, and chip mounting precision is improved.

[0079] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0080] In the description of the present application, it should be noted that unless otherwise specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integrated connection; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or the communication between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0081] In addition, the terms "first", "second", and the like are used only for the purpose of description, and are not to be construed as indicating or implying relative importance or a specific number of the indicated technical features. Thus, features defined with "first", "second", and the like can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise stated.

[0082] The above is based on the ideal embodiment of the present application, through the above description, the relevant personnel can make various changes and modifications within the scope of the technical idea of the present application. The technical scope of the present application is not limited to the content of the specification, and the technical scope must be determined according to the scope of claims.

Claims

1. A twin gantry die placement apparatus, characterized by: The base is provided with a double-gantry structure, the double-gantry structure comprises an X-axis module connected with the base, the output end of the X-axis module is connected with two sets of Y-axis modules, the output end of each set of Y-axis module is connected with a Z-axis module, the output end of the Z-axis module is connected with a dispensing and mounting module for dispensing and / or chip mounting, and the two sets of dispensing and mounting modules can be mounted in parallel or cooperated by division; the dispensing and mounting module comprises a mounting shaft for picking up chips, one side of the mounting shaft is provided with a dispensing mechanism and an upper vision system for identifying the dispensing and mounting position; The base is also provided with a streamline conveying mechanism for conveying a jig, the streamline conveying mechanism penetrates through the double-gantry structure, two ends of the streamline conveying mechanism are respectively provided with a jig loading mechanism and an unloading mechanism, and one side of the streamline conveying mechanism is provided with a chip loading mechanism and a lower vision system for identifying chips.

2. The twin gantry chip mounter according to claim 1, characterized by: The streamline conveying mechanism comprises a bottom plate connected with the base, the bottom plate is sequentially provided with independent feeding streamline, mounting streamline and discharging streamline, the lower side of the discharging streamline is provided with a discharging pushing mechanism capable of pushing the jig into the unloading mechanism, and the feeding streamline, mounting streamline and discharging streamline are all provided with a streamline width adjusting mechanism for adjusting the width of the streamline.

3. The twin gantry chip mounter according to claim 2, characterized by: The mounting streamline comprises a second streamline main body for conveying the jig, the inner side of the second streamline main body is provided with a jacking mechanism for jacking the jig, one side of the jacking mechanism is provided with a second position sensing mechanism for sensing the position of the jig, and the other side is provided with a second streamline stop mechanism for stopping the jig.

4. The twin gantry chip mounter according to claim 3, characterized by: The jacking mechanism comprises a jacking seat connected with the bottom plate, a cam shaft is rotatably installed on the inner side of the jacking seat, a jacking plate for fixing the jig is arranged above the cam shaft, the bottom of the jacking plate is in contact with the cam shaft, and the jacking plate is slidably connected with the jacking seat.

5. The twin gantry chip mounter according to claim 4, characterized by: The jig loading mechanism comprises a loading fixed table and a loading cage limiting assembly for receiving a cage, the loading fixed table is connected with the base, the loading fixed table is provided with a loading cage lifting mechanism for driving the loading cage limiting assembly to lift, and one side of the loading cage limiting assembly is provided with a loading pushing mechanism capable of pushing the jig in the cage into the feeding streamline.

6. The twin gantry chip mounter according to claim 1, characterized by: The mounting shaft comprises a shaft seat connected with the output end of the Z-axis module, a Z-direction micro-motion table capable of moving along the Z-axis direction is installed on the shaft seat, a hollow rotating platform is installed on the Z-direction micro-motion table, and a mounting suction nozzle for picking up chips is connected with the output end of the hollow rotating platform.

7. The twin gantry chip mounter according to claim 1, characterized by: The chip loading mechanism adopts blue film loading, and suction nozzle library mechanisms for replacing the suction nozzles of the mounting shafts are arranged on both sides of the chip loading mechanism.

8. A twin gantry die attach method using the twin gantry die attach apparatus according to any one of claims 1 to 7, characterized by, The method comprises the following steps: S1, the jig loading mechanism pushes the jig with products to the streamline conveying mechanism; S2, the streamline conveying mechanism conveys the jig to the work station of the mounting streamline to realize positioning and fixing; S3, two sets of dispensing and mounting modules dispense and / or mount chips on the products on the jig respectively; S4, after the product is completed chip mounting, the fixture is transported to the discharge flow line and pushed into the discharging mechanism by the discharge pushing mechanism.

9. The twin gantry die bonding method of claim 8, wherein, When the two dispensing and mounting modules are used in parallel, the upper vision system is used to move to the position above the product to be dispensed, the dispensing mechanism is moved to the position above the recognized position to dispense, the dispensing is completed, the mounting shaft picks up the chip from the chip feeding mechanism, and the chip is recognized by the lower vision system. After correct recognition, the chip is mounted at the recognized position.

10. The twin gantry die attach method of claim 8, wherein: When the two dispensing and mounting modules are used in cooperation, the dispensing and mounting module close to the fixture feeding mechanism is only used for dispensing, the other dispensing and mounting module is only used for chip mounting, and after the dispensing is completed, the fixture is moved to the next station for chip mounting.

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