Optical module coupling mounting equipment and ultrahigh precision grounding method thereof

Abstract

The invention discloses an ultra-high precision grounding method for optical module coupling mounting equipment, which comprises the following steps of: in a rough leveling stage, controlling a to-be-leveled element to move downwards by taking a pre-leveling height as a starting point, and monitoring the pressure variation of the to-be-leveled element in real time by adopting a continuous acquisition mode; when the pressure variable quantity is larger than a preset pressure threshold value, the element to be flattened is controlled to move upwards to the first flattening and lifting height; in a fine leveling stage, controlling the element to be leveled to move downwards by taking the first leveling lifting height as a starting point, and switching to a single-step acquisition mode to monitor the pressure variation of the element to be leveled in real time; and when the pressure variation is larger than the preset pressure threshold value again, the element to be flattened is controlled to move upwards to the second flattening and lifting height, and the element to be flattened is mounted at the second flattening and lifting height. On the basis, the precision, the efficiency and the stability of the optical module coupling mounting equipment in precision machining are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of intelligent manufacturing and automation control, in particular to a light module coupling and mounting device and an ultra-high precision bottoming method thereof. BACKGROUND

[0002] With the rapid development of the semiconductor light module industry, the size of components is becoming smaller and smaller, and the precision requirement of the coupling position is becoming higher and higher. The traditional double-precision floating-point calculation method cannot meet the demand of modern high-precision processing, especially in nanometer-scale ultra-precision processing, the precision and stability of numerical calculation become key problems. The existing algorithm often faces problems such as poor numerical stability, low calculation efficiency, slow convergence speed, etc. when processing high-precision calculation, which leads to insufficient processing precision and affects product quality.

[0003] At present, there has been certain research on ultra-precision machining and measurement technology at home and abroad, but there are still great challenges in high-precision numerical calculation, numerical stability, algorithm efficiency, etc. In particular, in the machining process of the semiconductor light module coupling and mounting device, the motion control of the existing semiconductor light module coupling and mounting device is under the premise that it does not know where the to-be-machined component needs to go, only knows how far away from the target object. The conventional method is to increase the pressure feedback in the motion control, and to perceive the arrival of the target position through the pressure feedback. However, in order to achieve high precision, the speed must be sacrificed, and the overall cycle will be affected, while the actual demand is both fast and high precision. SUMMARY

[0004] In order to overcome the shortcomings of poor stability, low calculation efficiency and poor precision of the existing bottoming method, the present application provides a light module coupling and mounting device and an ultra-high precision bottoming method thereof, which combines rough mounting and precise mounting to improve the precision, efficiency and stability of the light module coupling and mounting device in precision machining.

[0005] According to one aspect of the present application, an ultra-high precision bottoming method of a light module coupling and mounting device is provided, comprising: in the rough mounting stage, controlling the to-be-mounted component to move downward from the pre-mounting height as the starting point, and using the continuous acquisition mode to monitor the pressure change of the to-be-mounted component in real time; when the pressure change is greater than the preset pressure threshold, controlling the to-be-mounted component to move upward to the first mounting lifting height; in the precise mounting stage, controlling the to-be-mounted component to move downward from the first mounting lifting height as the starting point, and switching to the single-step acquisition mode to monitor the pressure change of the to-be-mounted component in real time; when the pressure change is greater than the preset pressure threshold again, controlling the to-be-mounted component to move upward to the second mounting lifting height, and mounting the to-be-mounted component at the second mounting lifting height.

[0006] Further, before the rough flattening stage, the bottom-touching method further comprises: configuring working parameters of the acquisition card; the working parameters comprise a sampling rate, a data segment length, a reading data amount, and an acquisition mode; setting flattening parameters; the flattening parameters comprise a pre-flattening height, a flattening movement speed, a flattening movement protection distance, a flattening lifting distance, and a pressure threshold; the flattening lifting distance comprises a first flattening lifting distance and a second flattening lifting distance; the flattening movement speed comprises a first flattening movement speed and a second flattening movement speed.

[0007] Further, before the rough flattening stage, the bottom-touching method further comprises: clamping the element to be flattened by the gripper.

[0008] Controlling the gripper to move the element to be flattened until the element to be flattened moves to a pre-flattening position; controlling the gripper to move the element to be flattened up and down in a vertical direction until the element to be flattened moves to a pre-flattening height.

[0009] Further, controlling the element to be flattened to move downward from the pre-flattening height and monitoring a pressure change amount of the element to be flattened in real time by using a continuous acquisition mode, comprising: controlling the acquisition card to acquire pressure data of the element to be flattened at the pre-flattening height, and recording the pressure data as a pressure initial value; controlling the element to be flattened to move downward at the first flattening movement speed, and controlling the acquisition card to synchronously acquire current pressure data of the element to be flattened; obtaining the pressure change amount of the element to be flattened by using a difference between the current pressure data and the pressure initial value.

[0010] Further, controlling the element to be flattened to move downward from the first flattening lifting height and switching to a single-step acquisition mode to monitor a pressure change amount of the element to be flattened in real time, comprising: controlling the element to be flattened to move downward from the first flattening lifting height at the second flattening movement speed; after the element to be flattened moves by a preset step length, controlling the acquisition card to acquire current pressure data of the element to be flattened once; obtaining the pressure change amount of the element to be flattened by using a difference between the current pressure data and the pressure initial value.

[0011] Further, the bottom-touching method further comprises: acquiring and storing pressure data of the element to be flattened according to the sampling rate; when the stored pressure data reaches the data segment length, reading the pressure data according to the reading data amount.

[0012] Further, the bottom-touching method further comprises: when the pressure sensor fails, controlling the element to be flattened to move to the flattening movement protection distance.

[0013] According to an aspect of the present application, a light module coupling mounting device is provided, and an ultra-high precision bottoming method is realized by using the light module coupling mounting device, the mounting device comprises a clamp jaw, a pressure sensor, a collection card and a controller, the pressure sensor is arranged on the clamp jaw, the collection card is connected with the pressure sensor, and the clamp jaw and the collection card are both connected to the controller; the controller controls the clamp jaw to clamp a to-be-mounted flat element and drives the to-be-mounted flat element to move towards a substrate; the pressure sensor is used for sensing the pressure between the to-be-mounted flat element and the substrate and outputting a pressure signal; the controller further controls the collection card to collect the pressure signal output by the pressure sensor to obtain pressure data, and then real-time monitors the pressure change amount of the to-be-mounted flat element.

[0014] Further, the clamp jaw comprises an x motion axis, a y motion axis and a z motion axis, the controller drives the to-be-mounted flat element to move through the x motion axis and the y motion axis of the clamp jaw until the to-be-mounted flat element moves to a pre-mounting flat position; the controller drives the to-be-mounted flat element to move up and down in a vertical direction through the z motion axis of the clamp jaw until the to-be-mounted flat element moves to a pre-mounting flat height.

[0015] Further, the mounting device further comprises a user operation interface, the user operation interface is used for allowing a user to change mounting parameters of the mounting device; the mounting parameters comprise a pre-mounting flat height, a mounting movement speed, a mounting movement protection distance, a mounting lifting distance and a pressure threshold; the mounting lifting distance comprises a first mounting lifting distance and a second mounting lifting distance; and the mounting movement speed comprises a first mounting movement speed and a second mounting movement speed.

[0016] The above technical solution realizes that the to-be-mounted flat element approaches the substrate at a faster speed from the pre-mounting flat height through a continuous collection mode in a coarse mounting flat stage, and then the height of the to-be-mounted flat element relative to the substrate is adjusted at a lower speed and higher precision through a single-step collection mode in a fine mounting flat stage.

[0017] Compared with the prior art, the present application has the following beneficial effects:

[0018] (1) The present application realizes that the height of the to-be-mounted flat element relative to the substrate is adjusted at a lower speed and higher precision in the fine mounting flat stage, thereby improving the mounting flat precision and mounting flat stability.

[0019] (2) The present application realizes that the to-be-mounted flat element approaches the substrate at a faster speed in the coarse mounting flat stage, thereby improving the mounting flat efficiency.

[0020] (3) The present application realizes the accurate precision of the pressure change amount of the to-be-mounted flat element, reduces the pressure alarm times, and thereby improves the mounting flat stability. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 A flow chart of an ultra-high-precision bottom-touching method of a light module coupling and mounting equipment is provided for the embodiments of the present application.

[0022] Figure 2 A structural diagram of a light module coupling and mounting equipment is provided for the embodiments of the present application. DETAILED DESCRIPTION

[0023] The technical solutions of the embodiments of the present application will be described in detail below with reference to the drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of the present application.

[0024] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0025] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected or can communicate with each other; it can be directly connected, or indirectly connected through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0026] Please refer to Figure 1 The present application provides an ultra-high-precision bottom-touching method of a light module coupling and mounting equipment, comprising the following steps (steps S10-S30):

[0027] Step S10, in the rough mounting stage, the to-be-mounted element is controlled to move downward from the pre-mounting height as the starting point, and a continuous acquisition mode is used to monitor the pressure change of the to-be-mounted element in real time; when the pressure change is greater than a preset pressure threshold, the to-be-mounted element is controlled to move upward to a first mounting lifting height.

[0028] Before performing the flattening action, the bottom-touching method further comprises: ① installation of a collection card hardware, including a PXIe chassis built-in collection card and a wiring terminal; ② installation of a collection card driver, including installation of a correct version of a DAQ collection driver; ③ peripheral hardware wiring, including a single-end 16-way and a differential 8-way two wiring methods supported by the collection card; ④ setting of working parameters of the collection card, including a sampling rate, a data segment length, a number of read data, and a collection mode; ⑤ setting of flattening parameters, including a pre-flattening height, a flattening movement speed, a flattening movement protection distance, a flattening lifting distance, and a pressure threshold, and the flattening lifting height includes a first flattening lifting height and a second flattening lifting height, and the flattening movement speed includes a first flattening movement speed and a second flattening movement speed.

[0029] It should be noted that the sampling rate (i.e., convert clock rate) refers to the number of points collected per channel per second, the data segment length (i.e., Samples per channel) refers to the size of the buffer area, and the number of read data (i.e., number of samples per channel to read) refers to the number of data read each time. If there is no special requirement, the data segment length and the number of read data can be set to the same value, and at the same time, the sampling rate / data segment length cannot be too large to avoid the occurrence of data overflow (i.e., overrun). The collection mode includes a continuous collection mode and a single-step collection mode. In the embodiment, the collection process of the collection card is: the collection card collects the pressure signal output by the pressure sensor to obtain pressure data and transmit the pressure data to the controller; the controller stores the collected pressure data in the FIFO; and the pressure data is moved from the FIFO to the software buffer; when the pressure data in the software buffer reaches the data segment length, the pressure data is read from the software buffer according to the number of read data. It can be understood that the sampling rate, the data segment length, the number of read data, and the collection mode can be set according to actual needs, which are not limited herein.

[0030] It should be noted that the pre-flattening height refers to the height of the bottom of the element to be flattened from the substrate before the flattening action is performed. The flattening lifting height refers to the height of the bottom of the element to be flattened after being lifted after contacting the substrate. The flattening action of the present application includes rough flattening and fine flattening. In the rough flattening stage, the element to be flattened is quickly approached to the substrate at a relatively fast speed. In the fine flattening stage, the position of the element to be flattened relative to the substrate is adjusted at a lower speed and higher accuracy. The first flattening lifting height refers to the height of the bottom of the element to be flattened after being lifted after contacting the substrate in the rough flattening stage, which is used to prevent overpressure under high-speed movement and provide a reference for fine flattening. The second flattening lifting height refers to the height of the bottom of the element to be flattened after being lifted after contacting the substrate in the fine flattening stage, which is used to meet the high-precision mounting height requirement. The flattening movement speed refers to the moving speed during flattening. The first flattening movement speed refers to the moving speed in the rough flattening stage (i.e. the moving speed between the pre-flattening height and the substrate of the element to be flattened). The second flattening movement speed refers to the moving speed in the fine flattening stage (i.e. the moving speed between the first flattening lifting height and the substrate of the element to be flattened). The flattening movement protection distance is a safety distance to prevent the failure of the pressure sensor. When the pressure sensor fails (the way of judging the failure of the pressure sensor is not limited here), the controller will control the element to be flattened to move to the flattening movement protection distance. Understandably, the controller judges whether the element to be flattened contacts the substrate by the pressure change amount, provided that the pressure sensor is in a normal working state. If the pressure sensor fails, a reasonable distance needs to be provided as a stop signal for the movement of the z-axis of the gripper (used to move the element to be flattened up and down), otherwise the movement of the z-axis will be continuous and there is a risk of damaging the product.

[0031] In the present embodiment, the element to be flattened is a lens (i.e. Lens). The specific height of the pre-flattening height is determined according to the actual product performance. If the size tolerance of the actual product is well controlled, the pre-flattening height is between 30um and 50um. If the size tolerance of the actual product exceeds 100um, the pre-flattening height is greater than 100um, and the pre-flattening height is about 150um. The flattening movement protection distance is generally set to 1000um. The flattening lifting height is set according to customer requirements and process, and the general range is 50um to 80um. Understandably, the type of the element to be flattened, the pre-flattening height, the flattening movement protection distance, the first flattening lifting height and the second flattening lifting height can be set according to actual needs, which are not limited here.

[0032] The following will illustrate the way of setting the second flat mounting height according to actual needs through an example. Assuming that the substrate of the customer product is a horizontal plane (i.e. the height is 0), the height from the light emitting chip on the substrate to the substrate is 810 um, and the length, width and height of the customer Lens are 1000 um, 800 um and 1500 um respectively. Since the light emitted by the light emitting chip needs to pass through the center of the Lens, the height from the center of the Lens to the substrate needs to be consistent with the height from the light emitting chip to the substrate. And the distance from the center of the Lens to the bottom of the Lens is half of the height of the Lens (i.e. 1500 um / 2 = 750 um), so the ideal height from the bottom of the Lens to the substrate is 810-750 = 60 um, i.e. the second flat mounting height is 60 um.

[0033] In step S10, the controller clamps the to-be-flattened element by the gripper. The controller controls the gripper to move the to-be-flattened element until the to-be-flattened element moves to the pre-flattening position. The controller controls the gripper to move the to-be-flattened element up and down in the vertical direction until the to-be-flattened element moves to the pre-flattening height. The controller controls the to-be-flattened element to move downward from the pre-flattening height as the starting point, and monitors the pressure change of the to-be-flattened element in real time in the continuous acquisition mode. Specifically, the controller controls the acquisition card to acquire the pressure data of the to-be-flattened element at the pre-flattening height, and records the pressure data as the initial pressure value. The controller controls the to-be-flattened element to move downward at the first flattening speed, while controlling the acquisition card to synchronously acquire the current pressure data of the to-be-flattened element. The controller obtains the pressure change of the to-be-flattened element by the difference between the current pressure data and the initial pressure value.

[0034] Further, the controller judges whether the to-be-flattened element is in contact with the substrate by the pressure change. When the pressure change is less than or equal to the preset pressure threshold, it indicates that the bottom of the to-be-flattened element is not in contact with the substrate at this time, and the to-be-flattened element is controlled to continue to move downward. When the pressure change is greater than the preset pressure threshold, it indicates that the bottom of the to-be-flattened element is in contact with the substrate at this time, and the to-be-flattened element is controlled to move upward to the first flat mounting height. Understandably, the rough flattening combined with the continuous acquisition mode quickly approaches the substrate from the pre-flattening height at a relatively fast speed, that is, the rapid bottom detection is realized. However, since the continuous acquisition mode is to acquire the pressure data while moving, the acquired pressure data is not accurate enough, which may cause overshoot, and the height of the to-be-flattened element relative to the substrate is not accurate enough. Therefore, the to-be-flattened element needs to be lifted by a certain height, and then the fine flattening is used to adjust the height of the to-be-flattened element relative to the substrate at a lower speed and higher accuracy.

[0035] In step S30, the controller controls the element to be leveled to move downward from the first leveling up-lift height as a starting point, and switches to a single-step collection mode to monitor the pressure change of the element to be leveled in real time. When the pressure change is greater than the preset pressure threshold value again, the controller controls the element to be leveled to move upward to the second leveling up-lift height, and mounts the element to be leveled at the second leveling up-lift height.

[0036] In step S30, the controller controls the element to be leveled to move downward from the first leveling up-lift height as a starting point, and switches to a single-step collection mode to monitor the pressure change of the element to be leveled in real time. Specifically, the controller controls the element to be leveled to move downward from the first leveling up-lift height as a starting point according to a second leveling movement speed; after the element to be leveled moves a preset step length, the controller controls the collection card to collect current pressure data of the element to be leveled once; and the controller obtains the pressure change of the element to be leveled by using a difference between the current pressure data and the initial pressure value. Understandably, since the single-step collection mode is adopted in the fine leveling stage, the single-step collection mode is to move once (i.e., move a preset step length) and collect once, and the collected pressure data is more accurate. Compared with the coarse leveling, the fine leveling is to explore slowly, and the overshoot is smaller, so that the fine leveling realizes adjusting the height of the element to be leveled relative to the substrate at a lower speed and higher accuracy.

[0037] Please refer to the accompanying drawings Figure 2 Based on the same inventive concept as the foregoing embodiments, the application further provides an optical module coupling mounting device. The mounting device comprises a gripper, a pressure sensor and a controller. The gripper is used to hold an element to be leveled. The pressure sensor is arranged on the gripper and is used to sense the pressure between the element to be leveled and a substrate and output a pressure signal. A collection card is connected with the pressure sensor and is used to collect the pressure signal output by the pressure sensor to obtain pressure data. The controller is connected with the gripper and the collection card. The controller controls the gripper to move to drive the element to be leveled to move. The controller also controls the collection card to collect the pressure data to monitor the pressure change of the element to be leveled in real time. Understandably, the pressure sensor collects the pressure signal (i.e., an analog signal) of the element to be leveled, and the collection card collects the pressure signal output by the pressure sensor and converts the pressure signal into a voltage signal (i.e., a digital signal).

[0038] In this embodiment, the mounting device is used to mount the element to be leveled at a preset position on the substrate so that the light-emitting chip is opposite to the center of the element to be leveled. The preset position comprises a pre-leveling position and a pre-leveling height. The gripper comprises an x movement axis, a y movement axis and a z movement axis. The controller drives the element to be leveled to move through the x movement axis and the y movement axis of the gripper until the element to be leveled moves to the pre-leveling position. The controller drives the element to be leveled to move up and down in the vertical direction through the z movement axis of the gripper until the element to be leveled moves to the pre-leveling height.

[0039] The mounting device further comprises a user operation interface for a user to change the tacking parameters of the mounting device. The tacking parameters include a pre-tacking height, a tacking movement speed, a tacking movement protection distance, a tacking lifting distance, and a pressure threshold. It should be noted that the previous user operation interface is not only used for setting the tacking parameters, but also used for setting the working parameters of the collection card. Too many parameters make the user operation interface appear crowded and messy. The present application places the parameters that do not need to be frequently changed (i.e. the working parameters of the collection card) in the software backend (set once), and places the parameters that need to be adjusted according to the customer's product (i.e. the tacking parameters) in the software front end (i.e. the user operation interface). The number of parameter setting items is reduced, and the ease of use of the user operation interface is improved. For example, the settings of the tacking lifting distance, the safety distance, the running speed, and the pressure change threshold.

[0040] In summary, in the rough tacking stage, the present application uses a continuous collection mode to make the tacking element approach the substrate at a faster speed from the pre-tacking height. Then in the fine tacking stage, a single-step collection mode is used to adjust the height of the tacking element relative to the substrate at a lower speed and higher accuracy, thereby improving the precision, efficiency, and stability of the optical module coupling mounting device in precision machining.

[0041] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement to part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the technical solutions of the present application.

Claims

1. An ultra-high precision bottom-touching method of an optical module coupling mounting equipment, characterized in that, The method comprises the following steps: In the rough tacking stage, the to-be-tacked element is controlled to move downward from the pre-tacking height as the starting point, and the pressure change of the to-be-tacked element is monitored in real time by using the continuous acquisition mode; when the pressure change is greater than the preset pressure threshold, the to-be-tacked element is controlled to move upward to the first tacking lifting height; In the fine tacking stage, the to-be-tacked element is controlled to move downward from the first tacking lifting height as the starting point, and the pressure change of the to-be-tacked element is monitored in real time by switching to the single-step acquisition mode; when the pressure change is greater than the preset pressure threshold again, the to-be-tacked element is controlled to move upward to the second tacking lifting height, and the to-be-tacked element is tacked at the second tacking lifting height.

2. The method of claim 1, wherein the method further comprises: Before the rough tacking stage, the bottom-touching method further comprises the following steps: Configure the working parameters of the acquisition card; the working parameters include the sampling rate, the data segment length, the number of read data, and the acquisition mode; Set the tacking parameters; the tacking parameters include the pre-tacking height, the tacking movement speed, the tacking movement protection distance, the tacking lifting distance, and the pressure threshold; the tacking lifting height includes the first tacking lifting height and the second tacking lifting height; the tacking movement speed includes the first tacking movement speed and the second tacking movement speed.

3. The method of claim 2, wherein the method further comprises: Before the rough tacking stage, the bottom-touching method further comprises the following steps: Use the gripper to hold the to-be-tacked element; Control the gripper to move the to-be-tacked element until the to-be-tacked element moves to the pre-tacking position; Control the gripper to move the to-be-tacked element up and down in the vertical direction until the to-be-tacked element moves to the pre-tacking height.

4. The super-high-precision bottom-touching method of the optical module coupling and mounting equipment according to claim 2, characterized in that, Control the to-be-tacked element to move downward from the pre-tacking height as the starting point, and monitor the pressure change of the to-be-tacked element in real time by using the continuous acquisition mode, which comprises the following steps: Control the acquisition card to acquire the pressure data of the to-be-tacked element at the pre-tacking height, and record the pressure data as the initial pressure value; Control the to-be-tacked element to move downward at the first tacking movement speed, and control the acquisition card to synchronously acquire the current pressure data of the to-be-tacked element; Obtain the pressure change of the to-be-tacked element by using the difference between the current pressure data and the initial pressure value.

5. The method of claim 3, wherein the method further comprises: Control the to-be-tacked element to move downward from the first tacking lifting height as the starting point, and monitor the pressure change of the to-be-tacked element in real time by switching to the single-step acquisition mode, which comprises the following steps: Control the to-be-tacked element to move downward from the first tacking lifting height as the starting point at the second tacking movement speed; After the to-be-tacked element moves a preset step length, control the acquisition card to acquire the current pressure data of the to-be-tacked element once; Obtain the pressure change of the to-be-tacked element by using the difference between the current pressure data and the initial pressure value.

6. The super-high-precision bottom-touching method of the optical module coupling and mounting equipment according to claim 2, characterized in that, The bottom-touching method further comprises the following steps: Acquire the pressure data of the to-be-tacked element according to the sampling rate and store it; When the stored pressure data reaches the data segment length, read the pressure data according to the number of read data.

7. The super-high-precision bottom-touching method of the optical module coupling and mounting equipment according to claim 2, characterized in that, The bottom-touching method further comprises the following steps: When the pressure sensor fails, control the to-be-tacked element to move to the tacking movement protection distance.

8. An optical module coupling and mounting apparatus, characterized by comprising: The ultra-high precision bottom-touching method of the optical module coupling and mounting equipment is realized by using the method according to any one of claims 1 to 7, the mounting equipment comprises a clamp jaw, a pressure sensor, a collection card and a controller, the pressure sensor is arranged on the clamp jaw, the collection card is connected with the pressure sensor, and the clamp jaw and the collection card are both connected to the controller; the controller controls the clamp jaw to clamp a to-be-mounted flat element and drives the to-be-mounted flat element to move towards a substrate; the pressure sensor is used for sensing the pressure between the to-be-mounted flat element and the substrate and outputting a pressure signal; the controller further controls the collection card to collect the pressure signal output by the pressure sensor to obtain pressure data, and then real-time monitors the pressure change amount of the to-be-mounted flat element.

9. The optical module coupling and mounting apparatus according to claim 8, wherein The clamp jaw comprises an x motion axis, a y motion axis and a z motion axis, the controller drives the to-be-mounted flat element to move through the x motion axis and the y motion axis of the clamp jaw until the to-be-mounted flat element moves to a pre-mounting flat position; the controller drives the to-be-mounted flat element to move up and down in the vertical direction through the z motion axis of the clamp jaw until the to-be-mounted flat element moves to a pre-mounting flat height.

10. The optical module coupling and mounting apparatus according to claim 8, wherein The mounting equipment further comprises a user operation interface, the user operation interface is used for a user to change mounting parameters of the mounting equipment; the mounting parameters comprise a pre-mounting flat height, a mounting motion speed, a mounting motion protection distance, a mounting lifting distance and a pressure threshold; the mounting lifting distance comprises a first mounting lifting distance and a second mounting lifting distance; and the mounting motion speed comprises a first mounting motion speed and a second mounting motion speed.

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