Heat dissipation structure of heating element and heat medium heater
By incorporating pockets and heat transfer paths within the frame, the design addresses the issue of insufficient design freedom around the heating element, achieving the effects of simplified structure, improved heat dissipation, and enhanced cooling efficiency.
Patent Information
- Application Number
- CN202480019736.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-06-15
- Filing Date
- 2024-06-13
- Publication Date
- 2025-11-07
AI Technical Summary
In existing heat dissipation structures for heat-generating elements, there is insufficient design freedom around the heat-generating element.
The frame design features a pocket that opens on the side facing the substrate and recesses on the side away from the substrate. The heating element is positioned inside the pocket with its protruding wire facing the substrate. A heat medium flow path and a heater are also provided within the frame. The pocket is positioned laterally to the side of the heat medium flow path.
It increases the design freedom around the heating element, enhances heat dissipation and cooling efficiency, simplifies the structure, reduces manufacturing costs, and improves the cooling efficiency of the heating element.
Smart Images
Figure CN120917569A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to a heat dissipating structure of a heat generating element and a heat medium heater. BACKGROUND
[0002] In the past, as a heat dissipating structure of a heat generating element including a frame body in which a heat generating element such as an IGBT mounted on a substrate is arranged and heat generated by the heat generating element is released to the frame body, the structure disclosed in Patent Literature 1 is known. PRIOR ART DOCUMENT PATENT LITERATURE
[0003] Patent Literature 1: Specification of Chinese Utility Model Publication No. 211788988 SUMMARY PROBLEMS TO BE SOLVED BY THE INVENTION
[0004] However, in the heat dissipating structure of the heat generating element disclosed in Patent Literature 1, there is room for improvement in design freedom around the heat generating element.
[0005] Therefore, in order to solve the above problems, an object of the present application is to provide a heat dissipating structure of a heat generating element and a heat medium heater capable of improving design freedom around the heat generating element with a simple structure. SOLUTION TO PROBLEMS
[0006] The heat dissipating structure of the heat generating element of the present application includes a frame body in which a heat generating element mounted on a substrate is arranged and heat generated by the heat generating element is released to the frame body, wherein the frame body has a pocket hole which is opened in a substrate opposite surface of a substrate side facing the substrate and is recessed toward a substrate side away from the substrate, and the heat generating element is arranged in the pocket hole in a state in which a lead protrusion surface thereof faces the substrate side, to solve the foregoing problems. The heat medium heater of the present application includes the heat dissipating structure of the heat generating element, wherein a heat medium flow path is provided in the frame body, and a heater for heating a heat medium flowing in the heat medium flow path, and the pocket hole is provided laterally to the heat medium flow path in a lateral direction orthogonal to a substrate vertical direction perpendicular to the substrate, to solve the foregoing problems. EFFECT OF THE INVENTION
[0007] According to the present application, design freedom around the heat generating element can be improved with a simple structure. BRIEF DESCRIPTION OF DRAWINGS
[0008] Figure 1 is a explanatory diagram showing a heat medium heater of an embodiment of the present application in a cross-sectional manner. Figure 2is a diagram showing the configuration relationship of each part as viewed from a direction perpendicular to the substrate. DETAILED DESCRIPTION
[0009] Hereinafter, a heat medium heater 10 according to an embodiment of the present application will be described based on the drawings.
[0010] First, the heat medium heater 10 is incorporated into an air conditioning device installed in a vehicle such as an automobile, and heats a heat medium such as coolant (water), and includes a heat dissipation structure of the heat generating element 40 that releases heat generation of the heat generating element 40 described below.
[0011] Hereinafter, a specific structure of the heat medium heater 10 will be described based on the drawings.
[0012] As shown in Figure 1 , the heat medium heater 10 includes a frame 20 for arranging various components, a substrate 30 arranged separately from the frame 20, a heat generating element 40 mounted to the substrate 30, a heat medium flow path 50 provided inside the frame 20, a heater 60 for heating a heat medium flowing in the heat medium flow path 50, a fixing member 70 for fixing the heat generating element 40, an insulating sheet 80 insulating between the frame 20 and the heat generating element 40, and a heat dissipation filler 90 filled into a pocket 21 of the frame 20.
[0013] The frame 20 is formed of metal or the like, and has the pocket 21 as shown in Figure 1 , which is opened in a substrate opposing surface 20a of the frame 20 facing the substrate 30 and is recessed so as to extend toward a side away from the substrate 30. The pocket 21 is a site for arranging the heat generating element 40 or the like, and is formed so as to be opened only on the substrate opposing surface 20a side (substrate 30 side) as shown in Figure 1 , and has, as its inner wall, a bottom surface 21a, inner side surfaces 21b on both sides in the lateral direction X, and inner side surfaces 21c on both sides in the flow path extension direction Z as shown in Figure 1 , Figure 2 The pocket 21 is provided laterally to the side of the heat medium 50 as shown in Figure 1 , Figure 2 in the embodiment, on both sides (specifically, positions opposite each other in the lateral direction X) in the lateral direction so as to sandwich the heat medium flow path 50.
[0014] In addition, the aforementioned transverse direction X is orthogonal to the substrate vertical direction Y, which is perpendicular to the substrate 30, and the flow path extension direction Z is the direction in which the heat medium flow path 50 extends, which is orthogonal to the transverse direction X and the substrate vertical direction Y.
[0015] The substrate 30 is configured as a rigid type of printed circuit board (electronic board), which has printed wiring of wires 42 electrically connected to heating element 40 and various electronic components. like Figure 1 As shown, the substrate 30 is fixedly disposed relative to the frame 20 and other peripheral members at a position that is spaced apart from the frame 20 (the substrate-facing surface 20a) in the vertical direction Y of the substrate.
[0016] The heating element 40 is configured as a semiconductor element mounted on the substrate 30 and generating heat by energizing it. In this embodiment, it is configured as an IGBT (Insulated Gate Bipolar Transistor) for controlling the power switch of the heater 60. like Figure 1 , Figure 2 As shown, the heating element 40 has: a housing 41 made of synthetic resin or the like; and a wire 42 protruding from the wire protrusion surface 41a of the housing 41 and made of metal. like Figure 1 As shown, the wire 42 is electrically connected to the electronic circuitry (printed wiring, etc.) of the substrate 30 when it extends toward the substrate 30 side and is inserted into the through hole formed in the substrate 30.
[0017] Heating element 40 via, for example Figure 1 As shown, with the wire protrusion 41a (wire 42) facing the substrate 30, a portion of the heating element 40 is disposed in each pocket 21, and an insulating sheet 80 is sandwiched between the side of the heating element 40 on the heat medium flow path 50 side and the inner side 21b of the pocket 21. The fixing member 70 presses the heating element 40 towards the heat medium flow path 50 side (insulating sheet 80 side) in the transverse X direction, thereby fixing it relative to the frame 20. Furthermore, with the heating element 40 disposed within the pocket 21, such as Figure 1 , Figure 2 As shown, the bottom surface 21a of the pocket 21 is spaced apart from the heating element 40, the inner surfaces 21c of the pocket 21 are spaced apart from the heating element 40, and the inner surface 21b of the pocket 21 is spaced apart from the heating element 40 on the opposite side of the heat medium flow path 50 side, and the spaced apart is filled with heat dissipation filler 90.
[0018] The heater 60 is configured to heat a heat medium such as cooling water flowing in the heat medium flow path 50. In this embodiment, for example... Figure 1 , Figure 2 As shown, it is arranged to extend along the flow path extension direction Z on the inner circumferential side of the heat medium flow path 50. Furthermore, the specific method and configuration of the heater 60 can be any method or configuration as long as it can heat the heat medium flowing in the heat medium flow path 50.
[0019] The fixing member 70 is a member used to fix the heating element 40 to the frame 20. In this embodiment, for example... Figure 1 The device shown consists of a leaf spring located on the side of the pocket 21 (heating element 40) on the horizontal X, specifically on the opposite side of the heat medium flow path 50 on the horizontal X, in a manner that clamps the pocket 21 (heating element 40). Furthermore, as long as the heating element 40 can be fixed to the frame 20, the specific method and configuration of the fixing component 70 can be arbitrary. Furthermore, regarding the installation method of mounting the fixing component 70 to the frame 20, it can be as follows: Figure 1 The mounting method shown on the right side, where the fixing member 70 is installed on the frame 20 using bolts or the like, is as follows: Figure 1 The mounting method can be any method, such as the mounting member 70 shown on the left, where a portion of the frame 20 is clamped in by using the mounting member 70 to install the mounting member 70 onto the frame 20.
[0020] Insulating sheet 80 is made of highly insulating materials such as silicon, for example... Figure 1 As shown (at least a portion thereof), it is disposed within pocket 21 between frame 20 and heating element 40 to insulate frame 20 from heating element 40. The insulating sheet 80 also serves to transfer the heat from the heating element 40 to the frame 20 for dissipation (heat dissipation).
[0021] like Figure 1 As shown, the heat dissipation filler 90 is a filler that fills the pocket 21 (specifically, the gap between the heating element 40 disposed in the pocket 21 and the inner wall of the pocket 21). In this embodiment, it is configured as a filler such as silicone grease that is fluid during the stage of filling the pocket 21 with the heat dissipation filler 90 and solidifies after a certain period of time after filling. The heat dissipation filler 90 serves to transfer the heat from the heat-generating element 40 to the frame 20 for dissipation (heat dissipation), and also serves to insulate the heat-generating element 40 from the frame 20. In addition, in the present embodiment, the heat dissipation filler 90 is configured as a filler that is cured after a certain time elapses after the filling, but as for the specific manner of the heat dissipation filler 90, as long as the heat of the heat generating element 40 can be released to the frame 20, it can be any manner, for example, it can also be a manner that still has fluidity after a time elapses after the filling.
[0022] The heat dissipation structure (heat medium heater 10) of the heat generating element 40 of the present embodiment obtained in the above-described manner can achieve the effects described below.
[0023] (1) That is, in the heat dissipation structure (heat medium heater 10) of the heat generating element 40 of the present embodiment, the frame 20 has the pocket 21 that is opened in the substrate facing surface 20a on the side facing the substrate 30 and is recessed toward the side away from the substrate 30, and the heat generating element 40 is disposed in the pocket 21 in a state where the lead protrusion surface 41a faces the substrate 30 side. Thus, the heat generating element 40 can be housed in the pocket 21 to simplify the space between the frame 20 and the substrate 30, and in the case where, for example, the lead protrusion surface 41a is disposed toward the lateral direction X, the lead 42 needs to be bent by about 90 degrees toward the substrate 30 side when mounted on the substrate 30, in contrast to which, in the present embodiment, the lead 42 does not need to be bent (or the degree of bending is small) to change the orientation in which the lead 42 extends when mounted on the substrate 30, and thus, the interval between the substrate facing surface 20a of the frame 20 and the substrate 30 can be ensured to be large. Further, by ensuring the interval between the frame 20 and the substrate 30 to be large, it is easy to ensure the insulation of the substrate 30 and to use the space between the substrate facing surface 20a of the frame 20 and the substrate 30 as a space for disposing various electronic components and the like, and thus, the design freedom of the surrounding environment of the heat generating element 40 can be improved, and the device structure can be designed to be compact.
[0024] (2) Further, the pocket 21 that is opened in the substrate facing surface 20a and is recessed toward the side away from the substrate 30 is filled with the heat dissipation filler 90. Thus, at the time of manufacturing, when the heat dissipation filler 90 is filled into the pocket 21 in which the heat generating element 40 is disposed, by filling the heat dissipation filler 90 into the pocket 21 in a state where the substrate facing surface 20a side faces upward, the heat dissipation filler 90 can be received by the pocket 21, and the heat dissipation filler 90 can be prevented from flowing to the surroundings, and thus, the heat dissipation filler 90 can be reliably disposed in the desired manner, and the heat dissipation property of the heat generating element 40 can be improved. Further, the temperature rise of each heat generating element 40 can be suppressed by the improvement of the heat dissipation, and therefore, the number of heat generating elements 40 determined by the relationship with the temperature allowable range can be reduced, whereby the manufacturing cost can be reduced, and the space can be secured in correspondence with the reduction of the number of mountings, so that the design freedom of the surrounding environment can be improved. Further, since the structure for improving the heat dissipation of the heat generating element 40 by the heat dissipation filler 90 is adopted, a complicated mechanism for dissipating the heat of the heat generating element 40 is not required, and in this respect, the surrounding environment of the heat generating element 40 can also be simplified.
[0025] (3) Further, the heat generating element 40 is disposed in the pocket 21 on the side of the heat medium flow path 50 provided on the lateral direction X in a state where the wire protrusion surface 41a faces the substrate 30 side. Therefore, since there is no particular limitation in the design of the lateral position of the heat generating element 40 (pocket 21), the interval between the heat medium flow path 50 on the lateral direction X and the heat generating element 40 (pocket 21) can be easily designed to be narrow, and as a result, the cooling efficiency of the heat generating element 40 by the heat medium flowing in the heat medium flow path 50 can be improved.
[0026] (4) Further, since the pockets 21 in which the heat generating elements 40 are disposed are respectively provided on both sides sandwiching the heat medium flow path 50 on the lateral direction X, the cooling efficiency of the heat generating elements 40 by the heat medium flowing in the heat medium flow path 50 can be improved. That is, the heat medium in the heat medium flow path 50 is gradually heated by the heating by the heater 60 extending along the flow path extension direction Z, and therefore, the temperature of the heat medium on the upstream side (the inlet side) of the heat medium flow path 50 is lower than the temperature of the heat medium on the downstream side (the outlet side) of the heat medium flow path 50. Further, in the present embodiment, the structure in which the pockets 21 (heat generating elements 40) are disposed on the side of the lateral direction of the heat medium flow path 50 is adopted, and therefore, the lateral direction both sides of the upstream side (the inlet side) of the heat medium flow path 50 in which the heat medium temperature is low can be used as the mounting place of the heat generating elements 40, so that the cooling efficiency of the heat generating elements 40 by the heat medium flowing in the heat medium flow path 50 can be improved.
[0027] (5) Further, the heat generating element 40 is disposed in the pocket 21 in a state where the wire protrusion portion 41a faces the substrate 30 side, and the fixing member 70 is disposed on the opposite side of the heat medium flow path 50 in a manner of sandwiching the pocket 21 (heat generating element 40) on the lateral direction X. Thus, since it is not necessary (or the necessity is low) to worry about the interference between the lead 42 of the heat generating element 40 and the fixing member 70, it is possible to secure the design freedom in relation to the fixing member 70, and in addition, by arranging the fixing member 70 to the side of the lateral line X of the heat generating element 40, it is possible to avoid the fixing member 70 from becoming a main cause of hindering the insulation of the substrate 30.
[0028] The above describes the embodiments of the present application in detail, but the present application is not limited to the above-described embodiments, and each structure of the above or the following embodiments, modification examples can be arbitrarily combined to constitute the heat medium radiator 10, the heat dissipation structure of the heat generating element 40, and the like, and various design changes can be made without departing from the present application described in the claims.
[0029] For example, in the above-described embodiments, the case where the heat dissipation structure of the heat generating element 40 is applied to the heat medium heater 10 is described, but the heat dissipation structure of the heat generating element 40 can also be applied to other devices and equipment.
[0030] In addition, in the above-described embodiments, the case where the heat generating element 40 (pocket 21) is arranged on the lateral line X on both sides sandwiching the heat medium flow path 50 is described, but the specific arrangement of the heat generating element 40 (pocket 21) can be any arrangement, for example, the heat generating element 40 (pocket 21) can be arranged on only one side of the lateral line X sandwiching the heat medium flow path 50, or a plurality of heat generating elements 40 (pockets 21) can be arranged in the flow path extension direction Z.
[0031] In addition, in the above-described embodiments, the frame 20 is formed as an integrally formed member, but the specific form of the frame 20 is not limited to an integrally formed member, for example, a part of the peripheral wall of the pocket 21 constituting the pocket 21 can be formed in a separate body, and the part of the frame 20 formed in a separate body can be mounted to the remaining frame 20 to constitute the frame 20. (Explanation of symbols)
[0032] 10 heat medium heater; 20 frame; 20a substrate opposing surface; 21 pocket; 21a bottom surface; 21b inner side surface; 21c inner side surface; 30 substrate; 40 heat generating element; 41 housing; 41a lead protruding surface; 42 lead; 50 heat medium flow path; 60 heater; 70 fixing member; 80 insulating sheet; 90 heat dissipation filler; X transverse direction; Y substrate vertical direction; Z flow path extension direction.
Claims
1. A heat dissipating structure of a heat generating element, comprising a frame configured to house a heat generating element mounted on a substrate, and releasing heat generated by the heat generating element to the frame, characterized in that the frame has a pocket opening in a substrate opposite surface facing the substrate, and recessed toward a side away from the substrate, and the heat generating element is housed in the pocket in a state in which a lead protrusion thereof faces the substrate side.
2. The heat dissipating structure of a heat generating element according to claim 1, characterized in that a heat dissipating filler is filled in the pocket.
3. A heat medium heater comprising the heat dissipating structure of a heat generating element according to claim 1, characterized in that the heat medium heater comprises a heat medium flow path provided in the frame, and a heater for heating a heat medium flowing in the heat medium flow path, and the pocket is provided laterally to the heat medium flow path in a lateral direction orthogonal to a substrate vertical direction perpendicular to the substrate.
4. The heat medium heater according to claim 3, characterized in that the pocket is provided on both sides sandwiching the heat medium flow path in the lateral direction, respectively, and the heat generating element is provided in each of the pockets, respectively.
5. The heat medium heater according to claim 3, characterized in that it further comprises a fixing member for fixing the heat generating element to the frame, and the fixing member is provided on opposite sides of the heat medium flow path in the lateral direction in a manner sandwiching the pocket.