Dispensing device with rapid curing function for semiconductor packaging

Abstract

The invention provides a semiconductor packaging glue dispensing device with a rapid curing function, which comprises a first glue dispensing mechanism, a second glue dispensing mechanism, a third glue dispensing mechanism, a curing mechanism, a conveying mechanism and a positioning mechanism, and is characterized in that the right side of the first glue dispensing mechanism is provided with the second glue dispensing mechanism, and the right side of the second glue dispensing mechanism is provided with the third glue dispensing mechanism; the curing mechanism is arranged on the left side of the first dispensing mechanism, the first dispensing mechanism, the second dispensing mechanism and the curing mechanism are located on the same horizontal line, the third dispensing mechanism is perpendicular to the first dispensing mechanism, the curing means is single, the occupied space is saved, meanwhile, the conveying precision can be visually observed, and therefore a large number of detection devices are avoided.

Description

Technical Field

[0001] This invention relates to a dispensing device for semiconductor packaging with a rapid curing function, specifically a dispensing device for semiconductor packaging with a rapid curing function, belonging to the field of dispensing devices. Background Technology

[0002] In the booming development of the semiconductor industry, semiconductor packaging, as a key downstream process in chip manufacturing, is becoming increasingly important. As electronic products continue to move towards miniaturization, high performance, and high reliability, stringent requirements are placed on the precision, efficiency, and quality of semiconductor packaging. Dispensing technology, as one of the core processes in semiconductor packaging, undertakes critical tasks such as chip fixation, underfilling, and sealing protection; its process level directly affects the performance and reliability of the packaged chip. Traditional dispensing equipment often employs a single curing method after dispensing, with rapid curing primarily relying on specific physical or chemical means, such as ultraviolet (UV) irradiation or thermal curing, to accelerate the curing process within a very short time. For example, UV-cured adhesives, irradiated with specific wavelengths of ultraviolet light, trigger a photochemical reaction in the photoinitiator, causing it to rapidly cross-link and cure. Compared to traditional natural curing, curing time can be drastically reduced from hours or even days to seconds or minutes. Thermal curing uses heating elements to heat the adhesive to a specific temperature, accelerating the curing reaction rate. This rapid curing characteristic significantly shortens the production cycle of semiconductor packaging, greatly improving production efficiency and providing strong support for the efficient development of the semiconductor industry. However, each single curing method has its own drawbacks. For instance, UV curing suffers from energy dispersion, and existing equipment uses conveyor belts, which occupy a large space. Furthermore, the deviation of the conveyor fixtures is detected using specialized equipment, resulting in high costs. Summary of the Invention

[0003] The purpose of this invention is to provide a dispensing device for semiconductor packaging with a rapid curing function in order to solve the above-mentioned problems, thereby addressing the limitations of existing technologies where curing methods are limited and the dimensions of the conveying mechanism cannot be flexibly adjusted according to fixtures and workstations.

[0004] This invention is achieved through the following technical solution: a dispensing device for semiconductor packaging with rapid curing function, comprising a first dispensing mechanism 1, a second dispensing mechanism 2, a third dispensing mechanism 3, a curing mechanism 4, a conveying mechanism, and a positioning mechanism. The second dispensing mechanism 2 is arranged to the right of the first dispensing mechanism 1, and the third dispensing mechanism 3 is arranged to the right of the second dispensing mechanism 2. The curing mechanism 4 is arranged to the left of the first dispensing mechanism 1. The first dispensing mechanism 1, the second dispensing mechanism 2, and the curing mechanism 4 are basically horizontally aligned on the same horizontal line. The third dispensing mechanism 3 is vertically aligned with the aforementioned horizontal line. The conveying mechanism includes a conveying slide, which includes an inlet slide 5, a middle slide 7, and an outlet slide 9. The inlet slide 5 and the outlet slide 9 are both perpendicular to the middle slide 7. The third dispensing mechanism 3 is arranged next to the inlet slide 5, and the first dispensing mechanism 1, the second dispensing mechanism 2, and the curing mechanism 4 are arranged next to the middle slide 7.

[0005] Preferably, the inlet slide 5, the middle slide 7, and the outlet slide 9 are all composed of a track plate, and a track section 14 is provided in the middle of the track plate. The track section is formed on the protrusion of the track plate, and the track sections of the inlet slide 5, the middle slide 7, and the outlet slide 9 are assembled to form a conveyor line.

[0006] Preferably, the inlet slide 5 is provided with an inlet drive track groove 11 and an intermediate slide drive track groove 12. The inlet drive track groove 11 is longitudinally distributed and is located at the beginning of the inlet slide 5. The intermediate slide drive track groove 12 is transversely distributed and is located at the end of the inlet slide 5.

[0007] Preferably, the inlet drive track groove 11 and the intermediate slide drive track groove 12 are both provided through the track section 14.

[0008] Preferably, an outlet drive track groove 13 is provided on the outlet slide 9. The outlet drive track groove 13 is longitudinally distributed and is located at the beginning section of the outlet slide 9.

[0009] Preferably, the outlet drive track groove 13 is disposed through the track section 14.

[0010] Preferably, the conveying mechanism further includes a fixed clamping platform, which includes a fixed base plate 20, a fixed support platform 25, a drive through hole 21, a horizontal limiting plate 22, a vertical limiting block 24, and a correction plate 23. The fixed support platform 25 is vertically arranged on the fixed base plate 20, and the drive through hole 21 is arranged through the fixed base plate 20. The top of the fixed support platform 25 is provided with a receiving platform for the glue to be applied. The horizontal limiting plate 22 is elastically connected to the fixed support platform 25, and the vertical limiting plate 24 is elastically connected to the fixed support platform 25.

[0011] Preferably, the conveying mechanism further includes multiple sets of conveying drive structures, each set of conveying drive structures including a hydraulic cylinder 26. The hydraulic cylinder 26 is connected to the lower end of the track plate through a lifting mechanism. The end of the hydraulic cylinder 26 is provided with a vertically upward bent drive hook 27. The drive hook 27 can pass through the inlet drive track groove 11, the intermediate slide drive track groove 12, the outlet drive track groove 13 and cooperate with the drive through hole 21.

[0012] Preferably, the drive through hole 21 is located on the other three sides of the fixed base plate 20, and not on the side of the error correction plate 23.

[0013] Preferably, the error correction plate 23 is magnetic.

[0014] Preferably, the top of the error correction plate 23 has an aiming protrusion.

[0015] Preferably, the curing mechanism 4 includes a curing tube 31, with end face teeth on the right end of the curing tube 31 and multiple circumferentially distributed curing rods extending axially along the curing tube 31 on the left end. Each curing rod has multiple hot air nozzles and / or heating lamps inside for curing the parts to be cured therein.

[0016] Preferably, the curing mechanism 4 further includes a curing tube 32, the left end of which is provided with end face teeth, and the right end of which is provided with multiple circumferentially distributed curing rods 32 extending along the axial direction of the curing tube 32. Each curing rod 32 is provided with multiple hot air nozzles and / or heating lamps inside for curing the parts to be cured therein.

[0017] Preferably, the curing mechanism 4 further includes a drive gear 33, which simultaneously engages with the end face teeth of the first curing tube 31 and the second curing tube 32.

[0018] Preferably, the curing mechanism 4 further includes an outer frame, which is connected to a fixed sleeve 34. The second curing tube 32 is rotatably connected to the right outer side of the fixed sleeve 34, and the first curing tube 31 is rotatably connected to the left outer side of the fixed sleeve 34. A drive motor is mounted on the outer frame to drive the drive gear 33 to rotate. A UV curing optical fiber is provided inside the fixed sleeve 34.

[0019] Preferably, the intermediate slide 7 passes through the interior of the second curing tube 32, the first curing tube 31, and the fixing sleeve 34.

[0020] This invention provides a dispensing device for semiconductor packaging with rapid curing function, which has the following beneficial effects: The conveying method is simple, lighter and more space-saving than the traditional belt conveyor method, and the positioning is accurate. There is no need to set up too many detection mechanisms to detect the position of the conveying fixtures. This is also because the fixtures are placed one next to the other, which ensures accurate positioning.

[0021] This application offers multiple curing methods, avoiding the drawbacks of a single curing method. The rotating sleeve structure can also generate wind, further accelerating the curing process and saving curing time.

[0022] This application also features an aiming structure that replaces the conventional electronic detection structure, allowing the accuracy of the transmission process to be easily observed with the human eye or through simple X-ray methods.

[0023] The entrance slide and exit slide are set perpendicular to the middle slide to form a concave space, which can be equipped with structures such as handling robots, thus saving more equipment space. Attached Figure Description

[0024] Figure 1 This is a three-dimensional schematic diagram of the entire invention; Figure 2 This is a schematic diagram of the conveying mechanism of the present invention; Figure 3 This is a schematic diagram of the fixed clamping platform of the present invention; Figure 4 This is a schematic diagram of the conveying drive structure of the present invention; Figure 5 This is a schematic diagram of the curing structure of the present invention. Detailed Implementation

[0025] This invention provides a dispensing device for semiconductor packaging with rapid curing function.

[0026] See Figure 1-5This invention relates to a dispensing device for semiconductor packaging with rapid curing function, comprising a first dispensing mechanism 1, a second dispensing mechanism 2, a third dispensing mechanism 3, a curing mechanism 4, a conveying mechanism, and a positioning mechanism 8. The second dispensing mechanism 2 is located to the right of the first dispensing mechanism 1, and the third dispensing mechanism 3 is located to the right of the second dispensing mechanism 2. The curing mechanism 4 is located to the left of the first dispensing mechanism 1. The first dispensing mechanism 1, the second dispensing mechanism 2, and the curing mechanism 4 are substantially horizontally aligned on the same horizontal line. The third dispensing mechanism 3 is located vertically and is substantially perpendicular to the aforementioned horizontal line. The conveying mechanism includes a conveying slide, which includes an inlet slide 5, a middle slide 7, and an outlet slide 9. The inlet slide 5 and the outlet slide 9 are substantially perpendicular to the middle slide 7. The third dispensing mechanism 3 is located next to the inlet slide 5, and the first dispensing mechanism 1, the second dispensing mechanism 2, and the curing mechanism 4 are located next to the middle slide 7. In the semiconductor packaging process, the main workflow involves dispensing adhesive between the circuit board and the substrate at the third dispensing mechanism, between the semiconductor and the circuit board at the second dispensing mechanism, and between the cover plate and the substrate at the first dispensing mechanism. A robotic arm (not shown in the diagram, representing existing technology) continuously dispenses the items to be glued at the three dispensing points and then presses them to achieve adhesion. The fixed clamping stage follows the sequence of inlet slide 5, middle slide 7, and outlet slide 9, passing through the third dispensing mechanism 3, the second dispensing mechanism 2, and the first dispensing mechanism 1, and finally exits after passing through the curing mechanism.

[0027] This application further configures the inlet slide 5, intermediate slide 7, and outlet slide 9 as rail plates, with a track section 14 located in the middle of the track plate. The track section is formed by recessing the track plate, and the track sections of the inlet slide 5, intermediate slide 7, and outlet slide 9 are assembled to form a complete conveyor line. A fixed clamping table is set inside the recess and fits against the inner wall of the recess. The fixed clamping table 6 moves along the recess to transport the adhesive parts to be dispensed.

[0028] Furthermore, this application provides an inlet drive track groove 11 and an intermediate track drive track groove 12 on the inlet slide 5. The inlet drive track groove 11 is longitudinally distributed and located at the beginning of the inlet slide 5, while the intermediate track drive track groove 12 is transversely distributed and located at the end of the inlet slide 5. Both the inlet drive track groove 11 and the intermediate track drive track groove 12 penetrate the track section 14. An outlet drive track groove 13 is provided on the outlet slide 9. The outlet drive track groove 13 is longitudinally distributed and located at the beginning of the outlet slide 9, penetrating the track section 14.

[0029] The conveying mechanism also includes a fixed clamping platform 6, which includes a fixed base plate 20, a fixed support platform 25, a drive through hole 21, a horizontal limiting plate 22, a vertical limiting block 24, and an error correction plate 23. The fixed support platform 25 is vertically arranged on the fixed base plate 20, and the drive through hole 21 is arranged through the fixed base plate 20. The top of the fixed support platform 25 is provided with a receiving platform for the object to be glued. The horizontal limiting plate 22 is elastically connected to the fixed support platform 25, and the vertical limiting plate 24 is elastically connected to the fixed support platform 25. The horizontal limiting plate 22 and the vertical limiting plate 24 realize the locking and limiting of the object to be glued.

[0030] The fixed base plate 20 is square, and the correction plate 23 is vertically fixed to one side of the fixed base plate 20. The conveying mechanism also includes multiple sets of conveying drive structures, each of which includes a hydraulic cylinder 26. The hydraulic cylinder 26 is connected to the lower end of the track plate through a lifting mechanism. The lifting mechanism is existing technology, such as a telescopic rod or a scissor mechanism. The end of the hydraulic cylinder 26 is provided with a vertically upward bent drive hook 27. The drive hook 27 can pass through the inlet drive track groove 11, the intermediate slide drive track groove 12, or the outlet drive track groove 13 and cooperate with the drive through hole 21. There can be multiple drive hooks 27, and there can also be multiple drive through holes 21 on one side of the fixed base plate 20, so as to better stabilize the pushing. In this application, multiple fixed clamping platforms 6 are arranged one after another on the inlet slide 5, the middle slide 7, and the outlet slide 9. The feeding mechanism and the unloading mechanism are omitted here. This is very common in production lines. Manual loading and unloading are also possible. When the innermost fixed clamping platform of each slide moves to the next slide, a gap will be left at the innermost side. At this time, the hydraulic cylinder 26 of the slide drives the hydraulic rod to descend through the lifting mechanism. The drive hook 27 is extended and retracted under the drive through hole 21 of the outer fixed clamping platform driven by the hydraulic cylinder 26. At this time, the lifting mechanism is raised, and the drive hook 27 passes through the inlet drive track groove 11, the middle slide drive track groove 12, or the outlet drive track groove 13 and engages with the drive through hole 21. At this time, the extension and retraction of the hydraulic cylinder 26 drives the fixed clamping platform to move along the slide. Thus, the fixed clamping platform will squeeze the adjacent fixed clamping platforms on the inner side one by one and move further inward, realizing the overall one-by-one conveying. Since the fixed clamping platforms are close together, the positioning is relatively accurate and the detection mechanism can be omitted.

[0031] Furthermore, the drive through holes 21 are located on the other three sides of the fixed base plate 20, not on the side of the correction plate 23. The three-sided drive through holes 21 enable three-way driving of the fixed clamping stage along the inlet slide 5, the middle slide 7, and the outlet slide 9. In addition, the correction plate 23 is magnetic to prevent adjacent fixed clamping stages from being placed in the wrong orientation. When adjacent correction plates 23 come into contact, the repulsive force will indicate to the operator that the fixed clamping stage is placed in the wrong orientation. The top of the correction plate 23 has aiming protrusions. When multiple correction plates 23 are installed on the inlet slide 5, the middle slide 7, and the outlet slide 9, by measuring with an instrument beam or visually, if the aiming protrusions on the same slide are in a straight line, it indicates that the fixed clamping stage has not deviated from the track and meets the accuracy requirements. If they are not in a straight line, timely adjustment is required.

[0032] Preferably, the curing mechanism 4 includes a first curing tube 31, with end face teeth on the right end and multiple circumferentially distributed curing rods extending axially along the left end of the first curing tube 31. Each curing rod has multiple hot air nozzles and / or heating lamps inside for curing the workpiece located on the central axis. The curing mechanism 4 also includes a second curing tube 32, with end face teeth on the left end and multiple circumferentially distributed curing rods extending axially along the right end of the second curing tube 32. Each curing rod has multiple hot air nozzles and / or heating lamps inside for curing the workpiece therein. The curing mechanism 4 also includes a drive gear 33, which simultaneously engages with the end face teeth of both the first curing tube 31 and the second curing tube 32. The curing mechanism 4 also includes an outer frame, which is connected to a supporting fixed sleeve 34. Curing tube 2 32 is rotatably connected to the right outer side of the fixed sleeve 34, and curing tube 1 31 is rotatably connected to the left outer side of the fixed sleeve 34. A drive motor is mounted on the outer frame to drive the drive gear 33 to rotate. A UV curing optical fiber is installed inside the fixed sleeve 34. A central slide 7 passes through the interiors of curing tube 2 32, curing tube 1 31, and the fixed sleeve 34. When the fixed clamping platform passes through the curing mechanism 4, both curing tube 2 32 and curing tube 1 31 rotate under the drive of the drive gear 33, thereby rotating the heating device to achieve uniform heating. Simultaneously, the rotation process generates airflow, and because the two curing tubes rotate in opposite directions, the airflow on the surface becomes more turbulent, which helps accelerate the curing process. Furthermore, the UV curing optical fiber inside the fixed sleeve 34 enables multiple curing methods, avoiding the defects of single-method curing. Compared to single curing methods, these methods save time and improve the quality of adhesive curing.

[0033] The positioning mechanism 8 is set next to the inlet slide 5, the middle slide 7, and the outlet slide 9. Through holes are provided on the sides of the inlet slide 5, the middle slide 7, and the outlet slide 9. Multiple limiting holes are also provided on the side wall of the fixed base plate 20 of the fixed clamping table 6. The positioning mechanism 8 includes a telescopic cylinder. The telescopic rod on the telescopic cylinder can pass through the through holes and extend into the limiting holes to lock the position of the fixed clamping table 6, so as to prevent it from moving during dispensing.

[0034] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of this invention is defined by the appended claims and their equivalents.

Claims

1. A dispensing device for semiconductor packaging with rapid curing function, comprising a first dispensing mechanism, a second dispensing mechanism, a third dispensing mechanism, a curing mechanism, a conveying mechanism, and a positioning mechanism, wherein the second dispensing mechanism is disposed to the right of the first dispensing mechanism, the third dispensing mechanism is disposed to the right of the second dispensing mechanism, and the curing mechanism is disposed to the left of the first dispensing mechanism, wherein... The first dispensing mechanism, the second dispensing mechanism, and the curing mechanism are located on the same horizontal line. The third dispensing mechanism is perpendicular to the first dispensing mechanism. The conveying mechanism includes a conveying slide, which includes an inlet slide, a middle slide, and an outlet slide. The inlet slide and the outlet slide are both perpendicular to the middle slide. The third dispensing mechanism is located next to the inlet slide, and the first dispensing mechanism, the second dispensing mechanism, and the curing mechanism are located next to the middle slide.

2. The dispensing device for semiconductor packaging with rapid curing function according to claim 1, characterized in that: The entrance slide, intermediate slide, and exit slide are all made of rail plates. A track section is set in the middle of the track plate. The track section is formed by the protrusion of the track plate. The track sections of the entrance slide, intermediate slide, and exit slide are assembled to form a conveyor line.

3. The dispensing device for semiconductor packaging with rapid curing function according to claim 2, characterized in that: The entrance slide is equipped with an entrance drive track groove 1 and an intermediate slide drive track groove 1. The entrance drive track groove is longitudinally distributed and is located at the beginning of the entrance slide. The intermediate slide drive track groove 1 is transversely distributed and is located at the end of the entrance slide.

4. A dispensing device for semiconductor packaging with rapid curing function according to claim 3, characterized in that: Both the inlet drive track groove 1 and the intermediate slide drive track groove 1 are installed through the track section.

5. A dispensing device for semiconductor packaging with rapid curing function according to claim 2, characterized in that: An exit drive track trough 1 is provided on the exit slide. The exit drive track trough 1 is distributed longitudinally and is located at the beginning section of the exit slide.

6. A dispensing device for semiconductor packaging with rapid curing function according to claim 5, characterized in that: The outlet drive track groove is set through the track section.

7. A dispensing device for semiconductor packaging with rapid curing function according to claim 4, characterized in that: The conveying mechanism also includes a fixed clamping platform, which includes a fixed base plate, a fixed support platform, a drive through hole, a horizontal limiting plate, a vertical limiting block, and a correction plate. The fixed support platform is vertically arranged on the fixed base plate, and the drive through hole is arranged through the fixed base plate. The top of the fixed support platform 25 is provided with a receiving platform for the glue to be applied. The horizontal limiting plate is elastically connected to the fixed support platform, and the vertical limiting plate is elastically connected to the fixed support platform.

8. A dispensing device for semiconductor packaging with rapid curing function according to claim 7, characterized in that: The conveying mechanism also includes multiple sets of conveying drive structures. Each set of conveying drive structures includes a hydraulic cylinder. The hydraulic cylinder is connected to the lower end of the track plate through a lifting mechanism. The end of the hydraulic cylinder is provided with a drive hook that bends vertically upward. The drive hook can pass through the inlet drive track groove 1, the intermediate slide drive track groove 1, or the outlet drive track groove 1 and cooperate with the drive through hole.

9. A dispensing device for semiconductor packaging with rapid curing function according to claim 9, characterized in that: The drive through holes are located on the other three sides of the fixed base plate, not on the error correction plate.

10. A dispensing device for semiconductor packaging with rapid curing function according to claim 7, characterized in that: The error correction board is magnetic.

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