Semiconductor chip sorting system and semiconductor chip sorting method

Abstract

The application provides a semiconductor chip classification system and a semiconductor chip classification method. The semiconductor chip classification system comprises a test machine, a production management system, a memory and a sorting machine. The test machine is used for testing semiconductor chips and performing online preliminary classification on the semiconductor chips. The sorting machine performs offline secondary classification according to first text information generated by the memory. In the application, the sorting machine and the test machine can be arranged in different spaces, so that the space of a second unloading area of the sorting machine can be increased, the number of the second unloading area can be increased, and more specifications of classification can be met, thereby meeting the test requirements and classification requirements of users. Moreover, the offline secondary classification process of the sorting machine does not affect the online test and output of the test machine, the test efficiency of the test machine can be ensured, and the test cost can be reduced.

Description

Technical Field

[0001] This application relates to the field of semiconductor testing technology, and in particular to a semiconductor chip classification system and a semiconductor chip classification method. Background Technology

[0002] For semiconductor finished product testing, screening is mainly performed using testing equipment, which includes testing machines and sorting machines. Currently, the sorting machine automatically feeds the chip to be tested. After the chip enters the testing machine and completes the test, the testing machine sends back bin information for bin sorting. The current sorting machine can perform screening at a maximum of 16 bin levels, and the equipment hardware supports 3 automatic feeding areas and 3 manual feeding areas.

[0003] However, due to space limitations, it is currently possible to have a maximum of 6 feeding zones, making it impossible to separate a larger number of bins. Summary of the Invention

[0004] In view of this, the purpose of this application is to propose a semiconductor chip classification system to solve the above-mentioned technical problems.

[0005] To achieve the above objectives, this application provides a semiconductor chip classification system, comprising:

[0006] The testing machine includes a testing machine, a sorting machine, and multiple first unloading areas. The testing machine is used to test semiconductor chips to obtain chip grades and test data. The testing machine matches the identification information of the semiconductor chips with the chip grades. The sorting machine is used to perform online preliminary classification of the semiconductor chips according to the chip grades to form multiple first categories. Each semiconductor chip in a first category is placed in a corresponding first unloading area.

[0007] The production management system is used to acquire the identification information, the chip grade, and the test data, and to generate target files;

[0008] A memory is used to receive and store the target file, and to process the target file to generate first text information;

[0009] The sorting machine includes multiple second unloading areas. The sorting machine is used to retrieve the first text information and perform offline secondary classification based on the first text information, dividing the semiconductor chips in each first category into multiple second categories. The semiconductor chips in each second category are placed in a corresponding second unloading area.

[0010] Optionally, the sorting machine generates second text information based on the secondary classification result, and the semiconductor chip classification system further includes:

[0011] The reporting module is used to compare the first text information with the second text information and generate a report.

[0012] Optionally, the semiconductor chip classification system further includes:

[0013] The display terminal is used to receive the name, quantity, and chip grade of the semiconductor chips, and to display the name, quantity, and chip grade of the semiconductor chips.

[0014] Optionally, the memory includes an information transmission port for receiving the target file.

[0015] Based on the same inventive concept, this application also provides a semiconductor chip classification method, which is applied to the above-mentioned semiconductor chip classification system, the semiconductor chip classification method comprising:

[0016] The identification information of the semiconductor chip is obtained by using the testing equipment, and the semiconductor chip is tested by the testing equipment to obtain the chip grade and the test data.

[0017] The identification information is matched with the chip grade using the aforementioned testing equipment;

[0018] The semiconductor chips are preliminarily classified online according to the chip grade using the sorting machine to form multiple first categories, and the semiconductor chips of each first category are placed in a first unloading area.

[0019] The target file is generated using the production management system based on the identification information, the chip grade, and the test data.

[0020] The target file is stored in the memory, and the first text information is generated based on the target file using the memory.

[0021] The sorting machine retrieves the first text information and performs offline secondary classification based on the first text information, dividing each semiconductor chip in the first category into multiple second categories, and placing each semiconductor chip in the second category in a corresponding second unloading area.

[0022] Optionally, the step of using the testing equipment to obtain the identification information of the semiconductor chip, and using the testing equipment to test the semiconductor chip to obtain the chip grade and the test data includes:

[0023] The QR code markings on the semiconductor chip are scanned in batches using the aforementioned testing equipment to generate the marking information.

[0024] The semiconductor chips are tested in batches using the testing machine to obtain the chip grade and the test data.

[0025] Optionally, before generating the target file using the production management system based on the identification information, the chip grade, and the test data, the following steps are included:

[0026] The production management system is used to detect the sorting progress of the testing machine, and a batch end signal is generated after each batch of semiconductor chips is sorted.

[0027] Upon receiving the batch end signal, the testing machine is controlled to stop testing and sorting.

[0028] Optionally, after receiving the batch end signal and controlling the testing machine to stop testing and sorting, the following steps are included:

[0029] The production management system is used to upload the name, quantity, and chip grade of the semiconductor chips to the display terminal in batches.

[0030] Determine whether the name, quantity, and chip level of the semiconductor chips have been successfully uploaded. If not, generate a failure list.

[0031] Optionally, the step of retrieving the first text information using the sorting machine and performing offline secondary classification based on the first text information to divide the semiconductor chips in each first category into multiple second categories, with each semiconductor chip in each second category corresponding to a second unloading area, includes:

[0032] The first text information is searched and retrieved based on the production batch number of the semiconductor chip to be sorted a second time;

[0033] The semiconductor chip corresponding to the first unloading area is retrieved to the sorting area based on the first text information.

[0034] The sorting machine performs offline secondary classification of the semiconductor chips in the sorting area based on the first text information, dividing each semiconductor chip in the first category into multiple second categories, and placing each semiconductor chip in the second category in a corresponding second unloading area.

[0035] Optionally, the step of retrieving the first text information using the sorting machine and performing offline secondary classification based on the first text information to divide the semiconductor chips in each first category into multiple second categories, with each semiconductor chip in each second category placed after a corresponding second unloading area, includes:

[0036] The report module generates second text information based on the secondary classification results, compares the first text information with the second text information, and generates a report.

[0037] The semiconductor chip classification system provided in this application stores the identification information, chip grade, and test data of semiconductor chips in a memory. A testing machine is used for testing and online preliminary classification, while a sorting machine is used for offline secondary classification. The sorting machine and the testing machine can be located in different spaces, thus increasing the space and number of secondary unloading areas on the sorting machine. This allows for the accommodating of more grade classifications, meeting the user's testing and classification requirements. Furthermore, the offline secondary classification process of the sorting machine does not affect the online testing and output of the testing machine, ensuring the testing efficiency of the testing machine and reducing testing costs. Attached Figure Description

[0038] To more clearly illustrate the technical solutions in this application or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0039] Figure 1 This is a schematic structural diagram of a semiconductor chip classification system according to a specific embodiment of this application;

[0040] Figure 2 This is a schematic flowchart of a semiconductor chip classification method according to a specific embodiment of this application.

[0041] Explanation of reference numerals in the attached figures:

[0042] 100. Semiconductor chip classification system; 10. Testing equipment; 20. Production management system; 30. Memory; 40. Sorting equipment; 50. Reporting module; 60. Display terminal. Detailed Implementation

[0043] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with specific embodiments and the accompanying drawings.

[0044] It should be noted that, unless otherwise defined, the technical or scientific terms used in the embodiments of this application should have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms "first," "second," and similar terms used in the embodiments of this application do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word covers the element or object listed following the word and its equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect.

[0045] The inventors discovered that ATE (Automatic Test Equipment) includes a tester and a sorter. After the tester completes the test, the sorter places semiconductor chips of different bin levels into different trays based on the different test results. This process is also called bin sorting (bin refers to a container or box; in the semiconductor manufacturing industry, "bin sorting" means "tray sorting").

[0046] In standard operating procedures, due to space limitations of the ATE testing machine, the sorting machine has a limited unloading area, with a maximum of six unloading areas: three automatic unloading areas and three manual unloading areas. However, when product models change or customer demands arise, the test results may show a greater number of grades, affecting the testing machine's output, reducing production efficiency, and, due to the hardware limitation of six unloading areas, it is impossible to separate all the additional bins.

[0047] Based on this, embodiments of this application provide a semiconductor chip classification system 100 to solve the above-mentioned problems.

[0048] like Figure 1 As shown in the figure, this application embodiment provides a semiconductor chip classification system 100, which includes a testing machine 10, a production management system 20, a memory 30, and a sorting machine 40. The testing machine 10 includes a testing machine, a sorting machine, and multiple first unloading areas. The testing machine is used to test semiconductor chips to obtain chip grades and test data. The testing machine 10 matches the identification information of the semiconductor chips with their chip grades. The sorting machine is used to perform online preliminary classification of the semiconductor chips according to their chip grades, forming multiple first categories. Each first category of semiconductor chips is placed in a corresponding first unloading area.

[0049] The production management system 20 is used to acquire identification information, chip grade, and test data, and generate target files. The memory 30 is used to receive and store the target files, and process the target files to generate first text information. The sorting machine 40 includes multiple second unloading areas. The sorting machine 40 is used to retrieve the first text information and perform offline secondary classification based on the first text information, dividing the semiconductor chips in each first category into multiple second categories. The semiconductor chips in each second category are placed in a corresponding second unloading area.

[0050] In this embodiment, the identification information, chip grade, and test data of the semiconductor chip are stored in the memory 30. The testing machine 10 is used for testing and online preliminary classification, while the sorting machine 40 is used for offline secondary classification. The sorting machine 40 can be located in a different space from the testing machine 10, thus increasing the space and number of the second unloading area of ​​the sorting machine 40. This allows for the accommodating of more grade classifications, meeting the user's testing and classification requirements. Furthermore, the offline secondary classification process of the sorting machine 40 does not affect the online testing and output of the testing machine 10, ensuring the testing efficiency of the testing machine 10 and reducing testing costs.

[0051] The testing equipment 10 includes a testing machine and a sorting machine. The testing machine is used to test semiconductor chips to obtain chip grades, and the sorting machine is used to perform online preliminary classification of semiconductor chips according to their chip grades. After the testing equipment 10 completes the testing of semiconductor chips, it matches the identification information of each semiconductor chip with the obtained chip grades to facilitate subsequent classification and management of the semiconductor chips.

[0052] Specifically, the testing machine performs comprehensive performance testing on the semiconductor chip under test based on preset semiconductor chip performance standards, such as electrical parameters and functional integrity, accurately identifying and outputting the chip grade corresponding to each semiconductor chip. Then, through the built-in linkage mechanism between the testing machine and the sorting machine, the test grade data with matched identification information is synchronized to the sorting machine. The sorting machine then uses its own mechanical transmission and gripping components to perform online preliminary classification of the chips according to preset preliminary classification rules, such as grouping qualified chips into one category and unqualified chips into another, or dividing them into multiple categories according to basic functional levels.

[0053] In some embodiments, the test equipment 10 can be an ATE tester. The tester and the sorter in the test equipment 10 are integrated into one unit. The sorting process of the sorter is synchronized with the electrical testing process of the tester, reducing the latency of cross-device data transmission, ensuring that the preliminary sorting can quickly respond to the test results, reducing the dwell time of semiconductor chips waiting for sorting after testing, and ensuring the operating temperature environment required for semiconductor chips during the preliminary sorting process.

[0054] This simplifies the initial process of the semiconductor chip sorting system 100 and reduces the pressure of real-time sorting. Compared to direct multi-bin fine sorting, this embodiment first completes online preliminary sorting through a sorting machine. This avoids the complex operation of multi-bin sorting immediately after the test machine 10 outputs data, reduces the real-time load on the sorting machine during the testing phase, improves the synergistic efficiency of testing and preliminary sorting, and thus improves overall production efficiency. Preliminary sorting can coarsely screen semiconductor chips, pre-grouping semiconductor chips of different grades, which can reduce the processing load of the subsequent sorting machine 40 and further improve overall production efficiency.

[0055] In some embodiments, the sorting machine can hardware support six first feeding zones to meet the needs of preliminary sorting.

[0056] The production management system 20 can integrate and process various information it acquires to generate target files that guide the classification of semiconductor chips. Specifically, the production management system 20 acquires identification information, chip grade, and test data from the testing machine 10, then analyzes and organizes this information, generating target files according to preset rules and formats. These files contain detailed information about each chip and the corresponding classification criteria.

[0057] The memory 30, acting as a data storage carrier, receives and saves the target files generated by the production management system 20, and converts them into first text information that the sorting machine 40 can recognize. Specifically, the memory 30 receives the target files sent by the production management system 20, stores them in its own storage unit, and then processes the target files to generate first text information for the sorting machine 40 to retrieve.

[0058] In some embodiments, the first text information may include identification information, classification information, test data, etc. of the semiconductor chip.

[0059] The production management system 20 generates target files and stores them in the memory 30, so that the chip identification information, chip grade and test data can be matched one by one, which facilitates the subsequent traceability and query of the chip production process.

[0060] The sorting machine 40 can use a robotic arm or other device to offline grasp and classify semiconductor chips that have undergone online preliminary classification, based on the first text information obtained from the memory 30. Specifically, the sorting machine 40 retrieves the first text information and, based on the chip classification information in the first text information, controls the robotic arm or other actuators to accurately grasp semiconductor chips of the first category, divide each category into multiple second categories, and place each second category into a corresponding second unloading area.

[0061] In this way, through the information transmission and processing of the production management system 20 and the memory 30, the sorting machine 40 can obtain the classification information of semiconductor chips in advance, realize the automated classification and offline classification of semiconductor chips, achieve fast and accurate classification and grasping, reduce the waiting time in the classification process, and improve the overall production efficiency.

[0062] Since the sorting station 40 and the testing station 10 can be separated in space, the number of unloading areas of the sorting station 40 is not limited by the space of the testing station 10, and the number of unloading areas can be increased, so that the sorting station 40 can classify semiconductor chips at multiple bin levels more flexibly, thereby improving the efficiency and accuracy of classification.

[0063] The semiconductor chip sorting system 100 of this application embodiment, under the premise of meeting the basic conditions of semiconductor testing, incorporates an offline sorting machine 40 that can be used for multi-bin screening. This can meet customer testing needs, improve testing efficiency, reduce testing costs, and broaden the sales range of high-specification products. The semiconductor chip sorting system 100 offers high spatial flexibility. The testing machine 10 is used for testing and online preliminary sorting, while the sorting machine 40 is used for offline secondary sorting. The sorting machine 40 and the testing machine 10 can be located in different spaces, allowing users to flexibly arrange them according to their actual production layout. This expands the number of unloading areas, breaking through the limitations of traditional ATE machines in terms of the number of hardware unloading areas. It can meet the needs of multi-bin sorting, separating chips at more bin levels and improving the accuracy and detail of chip sorting.

[0064] Furthermore, the process can be transformed from complex, multi-tasking to simple, single-station processing. Semiconductor chips that have passed testing at test station 10 can be directly sorted and categorized by level at sorting station 40, eliminating the need for sorting operations at each test station of test station 10, thus reducing processing time and costs.

[0065] In some embodiments, the semiconductor chip classification system 100 can define bin-level distinctions for high-specification products according to testing conditions, such as functional testing, design-for-test, high-speed / high-frequency waveform testing, storage capacity / speed, etc., and can achieve 20 hardware unloading areas to cover the application scenarios of semiconductor chips.

[0066] In some embodiments, the chip grade may include bin-level information, such as qualified grade, specific function compliant grade, unqualified grade, etc.

[0067] In some embodiments, test data may include specific test items, specific test parameters and result values, and whether there are any anomalies.

[0068] In some embodiments, the identification information can be a QR code or a barcode. The QR code identification can be formed during packaging before the semiconductor chip enters the testing machine 10, or the testing machine 10 can affix a QR code identification to each semiconductor chip after testing.

[0069] In some embodiments, the sorting machine 40 can generate second text information based on the secondary classification result. The semiconductor chip classification system 100 also includes a report module 50, which is used to compare the first text information and the second text information and generate a report. Here, a closed-loop verification of the chip classification process is formed by comparing the preset classification instructions with the actual execution results.

[0070] Specifically, in the initial process, the first text information generated by the memory 30 is instruction data, which includes the matching relationship between the preset identification information based on the test results and the corresponding second unloading area. This serves as the basis for the sorting machine 40 to classify and pick up the chips. After the sorting machine 40 completes the chip picking and places it into the corresponding second unloading area, it automatically records the actual operation data of the semiconductor chips, including the chip identification, the actual unloading area number, and the number of semiconductor chips placed in each unloading area. This data is integrated to form the second text information, which is the execution data.

[0071] The report module 50, as an independent verification unit, uses a preset comparison algorithm, such as matching one by one according to chip identifier and grouping statistics according to material area, to verify the classification results in the first text information against the actual classification results in the second text information.

[0072] On the one hand, it can verify whether the identification of a single semiconductor chip corresponds to the actual unloading area. For example, chip number A01 should be placed in unloading area 1, section 2, but it is not actually placed there. On the other hand, it can also calculate the overall matching rate of the classification. For example, if there are a total of 100 chips, how many meet the preset instructions and how many deviate? The comparison results are output in the form of visual reports such as difference lists and pass rate statistical charts, realizing information traceability and deviation identification in the classification process.

[0073] This allows for accurate verification of the offline secondary sorting process, reducing the risk of missorting. If mechanical malfunctions cause gripping position deviations or information transmission delays leading to semiconductor chips being placed in the wrong material handling area, these errors often require subsequent manual sampling to detect, easily resulting in batch missorting. The report module 50, by comparing the first and second text information in real time, can quickly locate semiconductor chips with deviations, reducing material waste and rework costs caused by missorting.

[0074] Furthermore, if it is necessary to trace the classification of a certain batch of semiconductor chips, such as the actual distribution of a certain bin-level chip, or to investigate quality problems, such as whether unqualified chips were mistakenly placed in the qualified area, the comparison records can be retrieved directly through the report module 50 without manual verification, which helps to improve overall production efficiency.

[0075] In some embodiments, the semiconductor chip classification system 100 may further include a display terminal 60, which is used to receive the name, quantity and chip grade of the semiconductor chips and display the name, quantity and chip grade of the semiconductor chips.

[0076] In some embodiments, the display terminal 60 can be a visual webpage, a human-computer interaction interface, etc.

[0077] Specifically, the production management system 20 integrates the identification information, chip level and related test data obtained from the test machine 10, and the web terminal establishes real-time or near real-time data communication with the production management system 20 through the interface protocol, and automatically receives chip information data packets sent by the production management system 20.

[0078] The built-in data parsing module on the web interface performs format conversion and field matching on the received data packets, transforming the structured raw data (such as coded test levels) in the Production Management System 20 into intuitive information that users can understand, such as "Pass Level (Bin1)". Then, through a pre-defined front-end display interface (such as a list page or details page), the chip names and corresponding chip levels are presented in categories by batch, time, or test status, allowing users to quickly locate information about target chips through search, filtering, and other operations, thus achieving data visualization.

[0079] This embodiment sets up a display terminal 60 to display the name, quantity, and chip grade of semiconductor chips, forming a visual interactive channel for semiconductor chip information. This breaks down information barriers and improves information acquisition efficiency. Users can access this information simply through a browser, without needing to master complex operations, to quickly query the name and test grade of a specific chip, significantly shortening information acquisition time and avoiding production decisions being affected by information delays.

[0080] The real-time display of semiconductor chip names and grades on the web interface makes the chip status during the production process transparent and traceable. Production managers can monitor the test grade distribution of each batch of chips in real time through the web interface. If a sudden increase in the proportion of defective chips in a batch is detected, production can be suspended in a timely manner to investigate the testing equipment or chip raw materials. When subsequent quality traceability is required, the original test grade can be quickly retrieved by entering the chip name on the web interface to trace whether the chip belongs to a specific batch with abnormal testing, providing direct evidence for locating quality problems and further improving the quality control system.

[0081] In some embodiments, the web interface can be customized to suit the needs of different user roles, such as production supervisors, quality inspectors, and operators. Production supervisors can view the test grade distribution of all chips in a batch, such as the percentage of qualified chips in a particular batch; quality inspectors can view the names and grade details of unqualified chips; and operators can query information about chips currently awaiting processing. This personalized display not only makes the information more relevant to the usage scenario but also promotes collaboration between different roles. For example, when a quality inspector discovers an abnormal test grade for a certain type of chip, they can quickly locate the corresponding chip name and batch through the web interface and directly synchronize this information with production schedulers to adjust the production plan, reducing cross-role communication costs.

[0082] In some embodiments, the memory 30 may include an information transmission port for receiving target files. Here, after the production management system 20 generates the target files, the information transmission port converts the digital resources in different formats, such as documents and images, contained in the target files into signals recognizable by the memory through a standardized transmission protocol, thereby completing the reception and initial temporary storage of the data. Subsequently, the memory 30 internally performs storage, indexing, and analysis of the information.

[0083] In this way, the test results and classification results of the test machine 10 can be stored offline in the memory 30. The sorting machine 40 can perform offline classification of semiconductor chips by retrieving the first text information generated by the memory 30. The sorting machine 40 can be set up in a different space from the test machine 10, which can increase the space of the second feeding area of ​​the sorting machine 40 and increase the number of the second feeding areas, thereby meeting the classification of more specifications and satisfying the user's testing and classification needs.

[0084] This application embodiment also provides a semiconductor chip classification method, which is applied to the aforementioned semiconductor chip classification system 100. The semiconductor chip classification method includes:

[0085] Step S100: Use the testing machine 10 to obtain the identification information of the semiconductor chip, and use the testing machine to test the semiconductor chip to obtain the chip grade and test data.

[0086] Step S200: Use the test equipment 10 to match the identification information with the chip level;

[0087] Step S300: The semiconductor chips are initially classified online according to their chip grade using a sorting machine to form multiple first categories. Each first category of semiconductor chips is placed in a first unloading area.

[0088] Step S400: The production management system 20 generates a target file based on the identification information, chip grade, and test data.

[0089] Step S500: Store the target file in the memory 30, and use the memory 30 to generate first text information based on the target file;

[0090] In step S600, the sorting machine 40 retrieves the first text information and performs offline secondary classification based on the first text information, dividing the semiconductor chips in each first category into multiple second categories, and placing the semiconductor chips in each second category in a corresponding second unloading area.

[0091] In step S100, the test equipment 10 performs performance testing on the chip under test, generates chip grade and detailed test data, and obtains a unique identifier for each chip using identification technology.

[0092] In step S200, the identity and grade information of the semiconductor chip are bound.

[0093] In step S300, the classifier performs an online preliminary classification of the semiconductor chips based on the test results of the tester, and can classify the semiconductor chips into a maximum of 6 first categories.

[0094] In step S400, the raw information is transformed into executable classification criteria. Specifically, after receiving the raw information, the production management system 20 performs structured integration of the data according to preset rules to generate target files.

[0095] In step S500, the memory 30 receives and saves the target file, converting the structured file into first text information that the sorting machine 40 can directly read, eliminating format barriers between devices and ensuring that classification instructions can be accurately parsed. The memory 30 can analyze the data and associate the identification information, chip grade, and test data of each semiconductor chip one by one to avoid information confusion.

[0096] In step S600, the sorting machine 40 retrieves the first text information from the memory 30, matches the corresponding classification instructions by recognizing the identification information, and then drives the robotic arm and other actuators to accurately grab the semiconductor chip and place it into the designated second unloading area.

[0097] The semiconductor chip classification method of this application embodiment is applied to a semiconductor chip classification system 100. In this system 100, the testing machine of the testing station 10 is used to test the semiconductor chips to obtain chip grades and test data. The testing station 10 matches the identification information of the semiconductor chips with the chip grades. The sorting station 40 is used to perform online preliminary classification of the semiconductor chips according to the chip grades, dividing them into multiple first categories, each first category corresponding to a first unloading area. The production management system 20 is used to acquire the identification information, chip grades, and test data, and generate target files. The memory 30 is used to receive and store the target files, and process the target files to generate first text information. The sorting station 40 is used to retrieve the first text information and perform offline secondary classification based on the first text information, dividing each first category into multiple second categories, each second category corresponding to a second unloading area.

[0098] In this embodiment, the identification information, chip grade, and test data of the semiconductor chip are stored in the memory 30. The testing machine 10 is used for testing and online preliminary classification, while the sorting machine 40 is used for offline secondary classification. The sorting machine 40 can be located in a different space from the testing machine 10, thus increasing the space and number of the second unloading area of ​​the sorting machine 40. This allows for the accommodating of more grade classifications, meeting the user's testing and classification requirements. Furthermore, the offline secondary classification process of the sorting machine 40 does not affect the online testing and output of the testing machine 10, ensuring the testing efficiency of the testing machine 10 and reducing testing costs.

[0099] In some embodiments, step S100 may involve using the testing machine 10 to obtain the identification information of the semiconductor chip, and using the testing machine to test the semiconductor chip to obtain chip grade and test data, including:

[0100] Step S110: Use the testing machine to scan the QR code markings on the semiconductor chip in batches and generate marking information;

[0101] Step S120: Semiconductor chips are tested in batches using a testing machine to obtain chip grade and test data.

[0102] In step S110, the testing equipment 10 includes a QR code scanning module, which performs batch scanning of the chips to be tested according to production batches. Since each chip's QR code contains unique encoded information, scanning automatically generates identification information corresponding to each chip. Compared to traditional numbered stickers, QR code identification stores richer information, is easier to read, and the identification information generated by the testing equipment 10 is unique. Batch operation avoids confusion between identifications of chips from different batches, facilitating accurate location of the required semiconductor chip during subsequent traceability.

[0103] In step S120, after determining the identification information, the test machine 10 performs performance tests on the chips in batches and generates chip grade and detailed test data.

[0104] In some embodiments, the testing machine matches the identification information with the chip grade in batches, and the sorting machine performs online preliminary classification of the semiconductor chips in batches according to the chip grade.

[0105] Batch-based collaborative operations help improve the efficiency and accuracy of information collection. This reduces cross-stage information transmission time, ensures real-time binding of chip identification information and test data within the same batch, and guarantees the operating temperature environment for online preliminary classification. It also avoids misalignment risks, reduces the processing pressure on a single batch, and improves overall information collection efficiency.

[0106] In some embodiments, step S400, before generating the target file using the production management system 20 based on identification information, chip grade, and test data, may include:

[0107] Step S350: The production management system 20 is used to detect the testing and sorting progress of the testing machine 10, and a batch end signal is generated after each batch of semiconductor chips has been tested and sorted.

[0108] In step S360, after receiving the batch end signal, the test machine 10 is controlled to stop testing and sorting.

[0109] In step S350, after the testing machine 10 completes testing according to a preset batch division rule, such as 100 semiconductor chips per batch, the production management system 20 automatically detects the testing status of all chips in that batch. Once the testing and preliminary classification of the last chip are confirmed, a batch end signal (“LOTEND” signal) is triggered and output. This signal indicates the completion of a single batch test and also serves as the instruction switch to start subsequent verification steps, preventing batches that have not completed testing from entering the next process and preventing process chaos.

[0110] In step S360, after receiving the batch end signal, the test machine 10 stops testing the semiconductor chips of that batch, confirms that the testing of the current batch is completed, and allows the next batch of chips to enter, thus avoiding mixed batch testing.

[0111] In some embodiments, after the online preliminary classification of a batch of semiconductor chips is completed, the production management system 20 can automatically retrieve the information of the preset semiconductor chips to be tested and the information of the tested semiconductor chips. Specifically, it obtains the identification information of all chips in the batch from the testing machine 10, generates the theoretical test quantity, and obtains the actual number of chips in the batch that enter the testing process through the hardware counting module of the testing machine 10, such as the sensor counting of the chip transfer track, or the previous QR code scanning record, to form the actual test quantity.

[0112] The production management system first verifies whether the chip names in the theoretical test list are consistent with the batch chip names in the production plan to avoid mixed batch testing. Then it verifies whether the actual test quantity matches the theoretical test quantity to prevent chip omissions or overtesting. Finally, after confirming that there are no omissions or mismatches in the batch test data, it proceeds to the subsequent step of generating target files.

[0113] In some embodiments, step S360, after receiving the batch end signal and controlling the testing machine 10 to stop testing and sorting, may include:

[0114] Step S370: The name, quantity, and chip grade of the semiconductor chips are uploaded to the display terminal 60 in batches using the production management system 20.

[0115] Step S380: Determine whether the name, quantity, and chip level of the semiconductor chips have been successfully uploaded. If not, generate a failure list.

[0116] In step S370, after the testing machine 10 stops testing and sorting, the production management system 20 organizes the name of each batch of chips, the actual number of chips tested, and the number of chips corresponding to each test level into a structured data packet, and uploads it synchronously to the display terminal 60 through a preset data interface.

[0117] In some embodiments, the display terminal 60 can be a web page. The production management system 20 uploads the name, quantity, and chip grade of the semiconductor chips to the web page in batches, which can achieve accurate data transmission, avoid upload lag, and ensure stable information transmission.

[0118] In step S380, the production management system 20 uploads the name, quantity, and chip grade of the semiconductor chips to the web page and monitors the upload results. If the display terminal 60 successfully parses and loads the data, it will send back an "upload successful" confirmation signal. If the information fails to load due to network interruption, incorrect data format, or display terminal 60 malfunction, the production management system 20 will immediately trigger a judgment mechanism to identify the batch that failed to upload.

[0119] Subsequently, the production management system 20 will automatically generate a failure list, which can include the batch number of the failed upload, as well as a detailed record of the chip name, quantity, chip grade and preliminary cause of failure for that batch, such as "network timeout" or "missing data field". This provides a clear basis for subsequent re-upload and avoids the loss or untraceability of key information due to upload failure.

[0120] This embodiment enables the visualization of semiconductor chip information by uploading the name, quantity, and chip grade of the semiconductor chips to the display terminal 60. Uploading information in batches facilitates information traceability. Furthermore, setting up verification of the upload results ensures the integrity and accuracy of the information. The generation of a failure list can promptly remind users and supports quick re-uploading of failed batches, avoiding data gaps.

[0121] In some embodiments, step S600 may involve retrieving first text information using the sorting machine 40, performing offline secondary classification based on the first text information, and dividing the semiconductor chips in each first category into multiple second categories. Each semiconductor chip in a second category is placed in a corresponding second unloading area. This includes:

[0122] Step S610: Search and retrieve the first text information based on the production batch number of the semiconductor chip to be sorted a second time;

[0123] Step S620: Retrieve the corresponding semiconductor chip from the first unloading area to the sorting area based on the first text information;

[0124] In step S630, the sorting machine 40 performs offline secondary classification of the semiconductor chips in the sorting area according to the first text information, dividing the semiconductor chips in each first category into multiple second categories, and placing the semiconductor chips in each second category in a corresponding second unloading area.

[0125] In step S610, the first text information under the specified path is checked according to the production batch number. If the corresponding first text information is not found, the sorting machine 40 cannot enter the station for offline secondary sorting. If the corresponding first text information is found, the sorting machine 40 acquires the first text information.

[0126] In step S620, since the first text information contains the identification information and chip grade of each chip, the chip can be accurately located in the first unloading area using the identification information. The corresponding physical chip can be found from the first category of chips that have been preliminarily classified online. Then, the chip is transferred to the sorting area in the space where the sorting machine 40 is located, ensuring that the chips subsequently picked up by the sorting machine 40 completely correspond to the classification instructions, thereby improving the accuracy of semiconductor chip classification.

[0127] In step S630, the sorting machine 40 drives the robotic arm and other actuators to perform offline secondary sorting of semiconductor chips in the sorting area according to the first text information, dividing each first category into multiple second categories, and placing the chips into the designated second unloading area according to the instructions.

[0128] In this embodiment, the sorting machine 40 is used for offline secondary sorting. The sorting machine 40 can be located in a different space from the testing machine 10. This allows for an increase in the space of the second feeding area of ​​the sorting machine 40 and an increase in the number of second feeding areas, thereby accommodating more grade classifications and meeting the user's testing and sorting requirements. Furthermore, the offline secondary sorting process of the sorting machine 40 does not affect the online testing and output of the testing machine 10, ensuring the testing efficiency of the testing machine 10 and reducing testing costs.

[0129] In some embodiments, step S600 may involve retrieving first text information using the sorting machine 40, performing offline secondary classification of semiconductor chips based on the first text information, dividing semiconductor chips in each first category into multiple second categories, and placing semiconductor chips in each second category in a corresponding second unloading area, including:

[0130] In step S700, the report module 50 generates second text information based on the secondary classification result, compares the first text information with the second text information, and generates a report.

[0131] In step S700, after the sorting machine 40 completes the sorting and grabbing of semiconductor chips, it will automatically record key execution data, including identification information, grabbing quantity, actual placement area, grabbing time, etc. These data are integrated by batch to form second text information, which fully reflects the actual results of sorting and grabbing.

[0132] After the classification and data capture are completed, the report module 50 compares the first text information with the second text information, and then binds and archives the comparison results, providing original evidence for subsequent traceability. The archived first text information, second text information, and comparison results completely record the entire process data of each chip from instruction generation to actual classification. When quality traceability needs arise later, the classification records of the corresponding batch can be quickly retrieved through the identification information.

[0133] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of this application (including the claims) is limited to these examples; within the framework of this application, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of the embodiments of this application as described above, which are not provided in the details for the sake of brevity.

[0134] The embodiments of this application are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the embodiments of this application should be included within the protection scope of this application.

Claims

1. A semiconductor chip classification system, characterized in that, include: The testing machine includes a testing machine, a sorting machine, and multiple first unloading areas. The testing machine is used to test semiconductor chips to obtain chip grades and test data. The testing machine matches the identification information of the semiconductor chips with the chip grades. The sorting machine is used to perform online preliminary classification of the semiconductor chips according to the chip grades to form multiple first categories. Each semiconductor chip in a first category is placed in a corresponding first unloading area. The production management system is used to acquire the identification information, the chip grade, and the test data, and to generate target files; A memory is used to receive and store the target file, and to process the target file to generate first text information; The sorting machine includes multiple second unloading areas. The sorting machine is used to retrieve the first text information and perform offline secondary classification based on the first text information, dividing the semiconductor chips in each first category into multiple second categories. The semiconductor chips in each second category are placed in a corresponding second unloading area. The first text information includes a matching relationship between the identification information preset based on test results and the corresponding second unloading area. The sorting machine generates second text information based on the secondary classification result, and the semiconductor chip classification system further includes: The reporting module is used to compare the first text information with the second text information and generate a report; After the sorting machine completes the chip grabbing and places it into the corresponding second unloading area, it records the actual operation data of the semiconductor chip, including the chip identification, the actual unloading area number, and the number of semiconductor chips placed in each unloading area. The data is then integrated to form the second text information.

2. The semiconductor chip classification system according to claim 1, characterized in that, Also includes: The display terminal is used to receive the name, quantity, and chip grade of the semiconductor chips, and to display the name, quantity, and chip grade of the semiconductor chips.

3. The semiconductor chip classification system according to claim 1, characterized in that, The memory includes an information transmission port for receiving the target file.

4. A method for classifying semiconductor chips, characterized in that, The semiconductor chip classification method, applied to any one of claims 1-3, comprises: The identification information of the semiconductor chip is obtained by using the testing equipment, and the semiconductor chip is tested by the testing equipment to obtain the chip grade and the test data. The identification information is matched with the chip grade using the aforementioned testing equipment; The semiconductor chips are preliminarily classified online according to the chip grade using the sorting machine to form multiple first categories, and the semiconductor chips of each first category are placed in a first unloading area. The target file is generated using the production management system based on the identification information, the chip grade, and the test data. The target file is stored in the memory, and the first text information is generated based on the target file using the memory. The sorting machine retrieves the first text information and performs offline secondary classification based on the first text information, dividing the semiconductor chips in each first category into multiple second categories, and placing the semiconductor chips in each second category in a corresponding second unloading area; The report module generates second text information based on the secondary classification results, compares the first text information with the second text information, and generates a report.

5. The semiconductor chip classification method according to claim 4, characterized in that, The process of acquiring the identification information of the semiconductor chip using the testing equipment, and testing the semiconductor chip using the testing equipment to obtain the chip grade and the test data includes: The QR code markings on the semiconductor chip are scanned in batches using the aforementioned testing equipment to generate the marking information. The semiconductor chips are tested in batches using the testing machine to obtain the chip grade and the test data.

6. The semiconductor chip classification method according to claim 5, characterized in that, Before generating the target file using the production management system based on the identification information, the chip grade, and the test data, the process includes: The production management system is used to detect the sorting progress of the testing machine, and a batch end signal is generated after each batch of semiconductor chips is sorted. Upon receiving the batch end signal, the testing machine is controlled to stop testing and sorting.

7. The semiconductor chip classification method according to claim 6, characterized in that, After receiving the batch end signal, the step of controlling the testing machine to stop testing and sorting includes: The production management system is used to upload the name, quantity, and chip grade of the semiconductor chips to the display terminal in batches. Determine whether the name, quantity, and chip level of the semiconductor chips have been successfully uploaded. If not, generate a failure list.

8. The semiconductor chip classification method according to claim 4, characterized in that, The step of retrieving the first text information using the sorting machine and performing offline secondary classification based on the first text information to divide the semiconductor chips in each first category into multiple second categories, with each semiconductor chip in each second category corresponding to a second unloading area, includes: The first text information is searched and retrieved based on the production batch number of the semiconductor chip to be sorted a second time; The semiconductor chip corresponding to the first unloading area is retrieved to the sorting area based on the first text information. The sorting machine performs offline secondary classification of the semiconductor chips in the sorting area based on the first text information, dividing each semiconductor chip in the first category into multiple second categories, and placing each semiconductor chip in the second category in a corresponding second unloading area.

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