A semiconductor component surface polishing device

Abstract

The application relates to the polishing technical field, in particular to a semiconductor part surface polishing device, which comprises a puncher body, a main starting assembly for polishing the punched part of the semiconductor part is arranged on a bearing rod, a transmission shaft and a rotating strip are arranged in the main starting assembly, the transmission shaft and the rotating strip can provide power for polishing the semiconductor part, the main starting assembly, a main delivery assembly and a vibration assembly are used in cooperation, when the semiconductor part needs to be polished, the rotating strip is rotated to move the translation table to the punched part of the semiconductor part, the rack drives the polishing strip on the rotating column to rotate when the rack moves, then the burrs at the inner circle of the punched part of the semiconductor part are polished and removed, and the polishing depth reaches the preset threshold value to automatically stop, stress concentration of the burrs is avoided to form the starting point of cracks, the hole diameter is prevented from being enlarged due to excessive polishing, and the reliability of semiconductor part machining is improved.

Description

TECHNICAL FIELD

[0001] The application relates to the polishing technical field, in particular to a semiconductor part surface polishing device. BACKGROUND

[0002] The semiconductor part surface polishing device is a device specially used for precisely machining the surface of semiconductor materials (such as wafers, monocrystalline silicon wafers and the like), and the core function is to remove the defects and excess parts on the surface of the materials through physical friction or combined chemical action, so as to improve the performance and reliability of the semiconductor device. At present, when the semiconductor parts are processed, in order to meet the high-density integration demand, holes are opened on the packaging substrate to pass through different conductive layers and construct a three-dimensional wiring system. However, when the semiconductor parts are holed, the drilling device rotates at high speed to drill through the product. In the drilling process, burrs are formed on the semiconductor part and the drill bit due to friction, and the burrs on the inner circle of the hole are prone to stress concentration. In the use process, these parts will become the starting point of cracks, gradually expand, and cause the fatigue life of the part to decrease, thereby reducing the service life and reliability of the semiconductor part. SUMMARY

[0003] In order to overcome the defects of the prior art, the application provides a semiconductor part surface polishing device.

[0004] To solve the above technical problems, the application provides the following technical scheme: a semiconductor part surface polishing device, comprising a hole puncher body, the bottom of the hole puncher body is fixedly connected with a fixing table, the bottom of the fixing table is fixedly connected with a bearing rod, the bottom of the bearing rod is fixedly connected with a bearing table, the outer side of the bearing table is fixedly connected with a supporting leg, a main starting assembly for polishing the hole punched part of the semiconductor part is arranged on the bearing rod, a transmission shaft and a rotating strip are arranged in the main starting assembly, the transmission shaft and the rotating strip can provide power for polishing the semiconductor part, a positioning block is arranged in the main starting assembly, the positioning block is fixedly connected to the bearing rod, the bearing rod is L-shaped, a machine shell is fixedly connected to the side of the positioning block close to the bearing rod, a stepping motor is arranged in the machine shell, a bearing is arranged on the positioning block, the inner ring of the bearing of the positioning block is fixedly connected with the transmission shaft, the output shaft of the stepping motor is fixedly connected with the transmission shaft, one end of the transmission shaft away from the stepping motor is fixedly connected with the rotating strip, a movable hole for placing a translation table is arranged on the limiting frame, the translation table is inserted into the movable hole of the limiting frame, a fixed frame is fixedly connected to the outer side of the translation table, the fixed frame is T-shaped, a placing hole for placing a moving block is arranged on the fixed frame, the moving block is inserted into the placing hole of the fixed frame, a positioning column is fixedly connected to the moving block, the positioning column is movably connected with the rotating strip, a wind starting blade is fixedly connected to one end of the positioning column away from the rotating strip.

[0005] By the above technical scheme, when the semiconductor part needs to be punched, the semiconductor part is placed on the top of the placement table, and then the puncher body is started to punch. When the puncher body finishes punching the semiconductor part and needs to be polished, the stepping motor is started, the stepping motor drives the transmission shaft to rotate, the transmission shaft drives the rotating strip to revolve around the transmission shaft when rotating, the rotating strip drives the positioning column to move when revolving, the positioning column moves the fixed frame towards the placement table through the moving block when moving, the fixed frame drives the translation table to move along the limiting frame when moving, and the positioning column drives the moving block to translate along the placement hole of the fixed frame at the same time of rotating the rotating strip, the moving block drives the wind blade to translate through the positioning column at the same time of translating, and the wind blade generates wind force blowing towards the punched hole of the semiconductor part when translating.

[0006] As a preferred technical scheme of the present application, the bottom of the fixed table is fixedly connected with a limiting frame, the limiting frame is provided with a main delivery assembly matched with the main starting assembly, the main delivery assembly is provided with a rotating column and a rack, the main delivery assembly can be automatically moved to the punched hole of the semiconductor part through cooperation of the rotating column and the rack, the main delivery assembly is provided with a secondary supporting column, the secondary supporting column is fixedly connected to the outer side of the limiting frame, the limiting frame is fixedly connected with a primary supporting column on the outer side, the secondary supporting column and the primary supporting column are arranged on the same side of the limiting frame, the length of the primary supporting column is greater than that of the secondary supporting column, one end of the primary supporting column away from the limiting frame is fixedly connected with a track column, the other end of the track column away from the primary supporting column is fixedly connected with the secondary supporting column, the track column is movably connected with a movable block, the top of the movable block is fixedly connected with a connecting column, the outer side of the connecting column is movably connected with the rack, the top of the translation table is provided with a limiting groove for limiting the rack, the rack is inserted into the limiting groove of the translation table, the top of the translation table is fixedly connected with a bearing frame, the bearing frame is composed of a ring and a long strip, the ring part of the bearing frame is provided with a bearing, the inner ring of the bearing of the bearing frame is fixedly connected with the rotating column, the outer side of the rotating column is fixedly connected with a gear, and the gear is engaged with the rack.

[0007] The main delivery assembly further comprises a fixed shell fixedly connected with the rotating column, the inside of the fixed shell is provided with a cavity, the cavity of the fixed shell is provided with two translation frames, the two translation frames are correspondingly inserted into the cavity of the fixed shell, each translation frame is provided with a movable hole, each translation frame is movably connected with an insertion strip in the movable hole, each insertion strip is fixedly connected with the inner wall of the fixed shell, the inside of the fixed shell is provided with a plurality of springs, the two ends of each spring are fixedly connected with the two translation frames, the end of each translation frame away from the spring is provided with a clamping groove for placing a clamping strip, each clamping groove of each translation frame is clamped with a clamping strip, and the end of each clamping strip away from the translation frame is fixedly connected with a polishing strip.

[0008] Through the technical scheme, when the translation table moves, the translation table drives the rack to move, the rack drives the connecting column to move when moving, the connecting column drives the movable block to move along the trajectory column when moving, the trajectory column is placed obliquely, and then the movable block drives the connecting column to shorten the interval in the direction of the limiting frame when moving along the trajectory column, and then the connecting column pushes the rack to translate in the direction of the translation table while shortening the interval, the rack drives the rotating column to rotate through the meshing gear while translating, the rotating column drives the fixed shell to rotate when rotating, and then the fixed shell moves to the punching inner circle of the semiconductor part, and the fixed shell drives the grinding strip to grind the punching inner circle of the semiconductor part under the action of rotation, when the grinding strip needs to be replaced, the clamping state of the clamping strip and the translation frame is released, and then the grinding strip is taken down for replacement.

[0009] As a preferred technical scheme of the present application, the movable block is provided with a chip removal assembly for cleaning the surface grinding chips of the semiconductor parts, the chip removal assembly is provided with a push rod, the push rod is L-shaped, one end of the push rod away from the connecting column is fixedly connected to the movable block, a secondary supporting column is fixedly connected to the sealing cylinder, the secondary supporting column can fix the sealing cylinder, the inside of the sealing cylinder is provided with a sealing gasket, the sealing gasket is fixedly connected to one end of the push rod away from the movable block, the push rod is inserted into the sealing cylinder, the outside of the fixed table is fixedly connected with a placing table, and the outside of the sealing cylinder is fixedly connected with an air outlet pipe.

[0010] Through the technical scheme, when the movable block moves along the trajectory column, the movable block drives the push rod to move, the push rod drives the sealing gasket to move when moving, the sealing gasket compresses the air in the sealing cylinder when moving, and then the compressed air in the sealing cylinder flows out along the air outlet pipe, and the air flowing out of the air outlet pipe cleans the chips generated during the grinding of the semiconductor.

[0011] As a preferred technical scheme of the present application, the bearing rod is provided with a vibration assembly for cooperating with the main delivery assembly, the vibration assembly is provided with a sound emitting shell and an extension column, the cooperation of the sound emitting shell and the extension column can clean the chips generated during the punching of the semiconductor parts, the vibration assembly is provided with a striker, one end of the bearing rod away from the limiting frame is provided with a positioning groove for placing the sound emitting shell, the sound emitting shell is fixedly connected in the positioning groove of the bearing rod, the inside of the sound emitting shell is provided with a plurality of extension columns, each extension column is correspondingly movably connected to the bearing rod, each extension column is composed of a cylinder and an elliptical block, each extension column is fixedly connected with a striker, the inside of the sound emitting shell is provided with a plurality of tension springs, each tension spring is sleeved outside the corresponding extension column, and the two ends of each tension spring are fixedly connected with the corresponding striker and the inner wall of the bearing rod, respectively, one end of the translation table away from the bearing frame is fixedly connected with a trigger block, the trigger block is semicircular, when the translation table moves to the position corresponding to the extension column, the trigger block is attached to the corresponding extension column elliptical block part.

[0012] Through the technical scheme, when the translation table moves towards the limiting frame, the translation table drives the trigger block to move, when the trigger block moves to the position of the telescopic column, the trigger block is attached to the telescopic column, and then the trigger block extrudes the corresponding telescopic column to move towards the inside of the sound shell, when the telescopic column moves, the telescopic column drives the tension spring to stretch, when the telescopic column moves to the maximum distance, the telescopic column drives the impact piece to impact the inner wall of the sound shell, when the trigger block leaves the position of the corresponding telescopic column, the trigger block releases the limiting of the telescopic column, and then the stretched tension spring rebounds to drive the telescopic column to reset, when the trigger block is far away from the telescopic column closest to the placement table, the translation table drives the polishing strip and does not reach the hole punching position of the semiconductor part.

[0013] The bottom of the placement table is provided with an adjusting assembly for adjusting the aperture size of the polishing hole, the adjusting assembly is internally provided with a placement shell, the placement shell is fixedly connected to the bottom of the placement table, a double-headed threaded column is movably connected to the inside of the placement shell, two threaded blocks are correspondingly threadedly connected to the outer side of the double-headed threaded column, and one adjusting strip is fixedly connected to each end of each threaded block away from the double-headed threaded column, and each adjusting strip is semicircular, when the polishing strip moves to the position corresponding to the adjusting strip, the polishing strip is attached to the adjusting strip.

[0014] Through the technical scheme, when the translation table moves towards the limiting frame, the translation table drives the trigger block to move, when the trigger block moves to the position of the telescopic column, the trigger block is attached to the telescopic column, and then the trigger block extrudes the corresponding telescopic column to move towards the inside of the sound shell, when the telescopic column moves, the telescopic column drives the tension spring to stretch, when the telescopic column moves to the maximum distance, the telescopic column drives the impact piece to impact the inner wall of the sound shell, when the trigger block leaves the position of the corresponding telescopic column, the trigger block releases the limiting of the telescopic column, and then the stretched tension spring rebounds to drive the telescopic column to reset, when the trigger block is far away from the telescopic column closest to the placement table, the translation table drives the polishing strip and does not reach the hole punching position of the semiconductor part.

[0015] Compared with the prior art, the present application has the following beneficial effects:

[0016] When the semiconductor part needs to be polished, the translation table is moved to the hole punching position of the semiconductor part by rotating the rotating strip, then the polishing strip on the rotating column is rotated by the movement of the rack, and the burrs in the inner circle of the hole punching position of the semiconductor part are polished and removed, and the machine is automatically stopped when the polishing depth reaches the preset threshold, thereby avoiding the stress concentration of the burrs to form the starting point of the crack, and avoiding the expansion of the aperture caused by excessive polishing, and improving the reliability of the semiconductor part processing.

[0017] The present application uses the cooperation of the main starting assembly, the main delivery assembly and the vibration assembly, and the moving block drives the wind blade to move and generate wind power after the punching process is completed and before the translation table is moved to the punching position of the semiconductor part by the rotation of the rotating rod, so that the debris generated in the punching process can be quickly cleaned, and a clean environment is created for the accurate alignment of the subsequent translation table and related processes.

[0018] The present application uses the cooperation of the main starting assembly, the main delivery assembly and the vibration assembly, and the moving block drives the wind blade to move and generate wind power after the punching process is completed and before the translation table is moved to the punching position of the semiconductor part by the rotation of the rotating rod, so that the debris generated in the punching process can be quickly cleaned, and a clean environment is created for the accurate alignment of the subsequent translation table and related processes.

[0019] The present application uses the cooperation of the main starting assembly, the main delivery assembly and the vibration assembly, and the moving block drives the wind blade to move and generate wind power after the punching process is completed and before the translation table is moved to the punching position of the semiconductor part by the rotation of the rotating rod, so that the debris generated in the punching process can be quickly cleaned, and a clean environment is created for the accurate alignment of the subsequent translation table and related processes.

[0020] The present application uses the cooperation of the main starting assembly, the main delivery assembly and the vibration assembly, and the moving block drives the wind blade to move and generate wind power after the punching process is completed and before the translation table is moved to the punching position of the semiconductor part by the rotation of the rotating rod, so that the debris generated in the punching process can be quickly cleaned, and a clean environment is created for the accurate alignment of the subsequent translation table and related processes.

[0021] The present application uses the cooperation of the main starting assembly, the main delivery assembly and the vibration assembly, and the moving block drives the wind blade to move and generate wind power after the punching process is completed and before the translation table is moved to the punching position of the semiconductor part by the rotation of the rotating rod, so that the debris generated in the punching process can be quickly cleaned, and a clean environment is created for the accurate alignment of the subsequent translation table and related processes. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 It is a schematic diagram of the overall structure of the present application;

[0023] Figure 2 It is a schematic diagram of the placement table structure of the present application;

[0024] Figure 3 It is a schematic diagram of the bearing rod structure of the present application;

[0025] Figure 4 It is a schematic diagram of the main support column structure of the present application;

[0026] Figure 5 It is a schematic diagram of the translation table structure of the present application;

[0027] Figure 6 It is a schematic diagram of the main support column structure of the present application;

[0028] Figure 7 Sealing tube structure schematic diagram of the present application;

[0029] Figure 8 Polishing strip structure schematic diagram of the present application;

[0030] Figure 9 Trigger block structure schematic diagram of the present application;

[0031] Figure 10 Placement shell structure schematic diagram of the present application.

[0032] Wherein: 1, punch body; 2, support leg; 3, bearing table; 4, bearing rod; 5, fixed table; 6, placement table; 7, machine shell; 8, positioning block; 9, stepper motor; 10, transmission shaft; 11, rotating strip; 12, fixed frame; 13, moving block; 14, positioning column; 15, wind blade; 16, translation table; 17, limit frame; 18, trigger block; 19, bearing frame; 20, rotating column; 21, vice supporting column; 22, track column; 23, movable block; 24, connecting column; 25, rack; 26, main supporting column; 27, push rod; 28, sealing gasket; 29, sealing tube; 30, air outlet pipe; 31, placement shell; 32, fixed shell; 33, translation frame; 34, insertion strip; 35, clamping strip; 36, polishing strip; 37, spring; 38, sound production shell; 39, impact sheet; 40, tension spring; 41, telescopic column; 42, double-headed threaded column; 43, threaded block; 44, adjusting strip; 45, gear. DETAILED DESCRIPTION

[0033] In order to make the technical means, creative features, purposes and effects realized by the present application easy to understand, the following further describes the present application in combination with specific embodiments, but the following embodiments are only preferred embodiments of the present application, not all. Based on the embodiments in the embodiments, other embodiments obtained by those skilled in the art without creative labor are within the protection scope of the present application. In the following embodiments, the experimental methods are conventional methods, and the materials and reagents used in the following embodiments are commercially available unless otherwise specified.

[0034] Embodiment: as Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5As shown, a semiconductor parts surface polishing device, including a puncher body 1, the bottom of the puncher body 1 is fixedly connected with a fixed table 5, the bottom of the fixed table 5 is fixedly connected with a bearing rod 4, the bottom of the bearing rod 4 is fixedly connected with a bearing table 3, the outer side of the bearing table 3 is fixedly connected with a supporting leg 2, the bearing rod 4 is provided with a main starting assembly for polishing the punched part of the semiconductor part, the main starting assembly is provided with a transmission shaft 10 and a rotating strip 11, the cooperation of the transmission shaft 10 and the rotating strip 11 can provide power for the polishing of the semiconductor part, the main starting assembly is provided with a positioning block 8, the positioning block 8 is fixedly connected on the bearing rod 4, the bearing rod 4 is L-shaped, the side close to the bearing rod 4 of the positioning block 8 is fixedly connected with a machine shell 7, the inside of the machine shell 7 is provided with a stepping motor 9, the positioning block 8 is provided with a bearing, the inner ring of the bearing of the positioning block 8 is fixedly connected with the transmission shaft 10, the output shaft of the stepping motor 9 is fixedly connected with the transmission shaft 10, the end away from the stepping motor 9 of the transmission shaft 10 is fixedly connected with the rotating strip 11, the limiting frame 17 is provided with a movable hole for placing the translation table 16, the translation table 16 is inserted in the movable hole of the limiting frame 17, the outer side of the translation table 16 is fixedly connected with a fixed frame 12, the fixed frame 12 is T-shaped, the fixed frame 12 is provided with a placing hole for placing the moving block 13, the moving block 13 is inserted in the placing hole of the fixed frame 12, the moving block 13 is fixedly connected with a positioning column 14, the positioning column 14 is movably connected with the rotating strip 11, the end away from the rotating strip 11 of the positioning column 14 is fixedly connected with a wind blade 15.

[0035] As Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 shown, when the semiconductor parts need to be punched, the semiconductor parts are placed on the top of the placing table 6, and then the puncher body 1 is started to punch, when the puncher body 1 finishes punching the semiconductor parts, the stepping motor 9 is started, the stepping motor 9 drives the transmission shaft 10 to rotate, the transmission shaft 10 drives the rotating strip 11 to revolve around the transmission shaft 10 when rotating, the rotating strip 11 drives the positioning column 14 to move when revolving, the positioning column 14 moves along the placing hole of the fixed frame 12 by the moving block 13 pressing the fixed frame 12 when moving, the fixed frame 12 drives the translation table 16 to move along the limiting frame 17 when moving, and the positioning column 14 drives the moving block 13 to translate along the placing hole of the fixed frame 12 while rotating with the rotating strip 11, the moving block 13 drives the wind blade 15 to translate while translating through the positioning column 14, the wind blade 15 generates wind force blowing to the punched part of the semiconductor parts when translating.

[0036] As Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7As shown, the bottom of the fixed table 5 is fixedly connected with a limiting box 17, the limiting box 17 is provided with a main delivery assembly matched with the main starting assembly, the main delivery assembly is provided with a rotating column 20 and a rack 25, the rotating column 20 and the rack 25 can be matched to automatically move to the semiconductor part punching position, the main delivery assembly is provided with a secondary supporting column 21, the secondary supporting column 21 is fixedly connected to the outside of the limiting box 17, the limiting box 17 is fixedly connected with a main supporting column 26 on the outside, the secondary supporting column 21 and the main supporting column 26 are arranged on the same side of the limiting box 17, and the length of the main supporting column 26 is greater than that of the secondary supporting column 21, one end of the main supporting column 26 away from the limiting box 17 is fixedly connected with a track column 22, one end of the track column 22 away from the main supporting column 26 is fixedly connected with the secondary supporting column 21, the track column 22 is movably connected with a movable block 23, the top of the movable block 23 is fixedly connected with a connecting column 24, the outer side of the connecting column 24 is movably connected with the rack 25, the top of the translation table 16 is provided with a limiting groove for limiting the rack 25, the rack 25 is inserted into the limiting groove of the translation table 16, the top of the translation table 16 is fixedly connected with a bearing frame 19, the bearing frame 19 is composed of a ring and a long strip, the ring part of the bearing frame 19 is provided with a bearing, the inner ring of the bearing of the bearing frame 19 is fixedly connected with the rotating column 20, the outer side of the rotating column 20 is fixedly connected with a gear 45, and the gear 45 is engaged with the rack 25;

[0037] As Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8 As shown, the main delivery assembly further comprises a fixed shell 32, the fixed shell 32 is fixedly connected to the rotating column 20, the inside of the fixed shell 32 is provided with a cavity, the cavity of the fixed shell 32 is provided with two translation frames 33, the two translation frames 33 are correspondingly inserted into the cavity of the fixed shell 32, each translation frame 33 is provided with a movable hole, each translation frame 33 is movably connected with an insertion strip 34 in the movable hole, each insertion strip 34 is fixedly connected with the inner wall of the fixed shell 32, the inside of the fixed shell 32 is provided with a plurality of springs 37, the two ends of each spring 37 are fixedly connected with the two translation frames 33 respectively, one end of each translation frame 33 away from the spring 37 is provided with a clamping groove for placing a clamping strip 35, each translation frame 33 is clamped with a clamping strip 35 in the clamping groove, one end of each clamping strip 35 away from the translation frame 33 is fixedly connected with a polishing strip 36, and each polishing strip 36 is semilunar.

[0038] As Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8As shown, when the translation table 16 moves, the translation table 16 drives the rack 25 to move, the rack 25 drives the connecting column 24 to move when moving, the connecting column 24 drives the movable block 23 to move along the track column 22 when moving, and the track column 22 is inclined, so that the movable block 23 drives the connecting column 24 to shorten the distance in the direction of the limiting frame 17 when moving along the track column 22, and the connecting column 24 drives the rack 25 to translate in the direction of the translation table 16 when shortening the distance, and the rack 25 drives the rotating column 20 to rotate through the meshing gear 45 when translating, and the rotating column 20 drives the fixed shell 32 to rotate when rotating, and the rotating fixed shell 32 moves to the inner hole of the semiconductor part, and the fixed shell 32 drives the grinding strip 36 to grind the inner hole of the semiconductor part under the action of rotation, and when the grinding strip 36 needs to be replaced, the clamping state of the clamping strip 35 and the translation frame 33 is released, and then the grinding strip 36 is removed and replaced.

[0039] As shown in Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7 , the movable block 23 is provided with a chip removal assembly for cleaning the surface of the semiconductor part, the chip removal assembly is provided with a push rod 27, the push rod 27 is L-shaped, the push rod 27 is fixedly connected to one end of the movable block 23 away from the connecting column 24, the secondary supporting column 21 is fixedly connected with a sealing cylinder 29, the sealing cylinder 29 is fixed through the secondary supporting column 21, the sealing cylinder 29 is provided with a sealing gasket 28, the sealing gasket 28 is fixedly connected to one end of the push rod 27 away from the movable block 23, and the push rod 27 is inserted into the sealing cylinder 29, the outer side of the fixed table 5 is fixedly connected with a placing table 6, and the outer side of the sealing cylinder 29 is fixedly connected with an air outlet pipe 30.

[0040] As shown in Figure 8 , Figure 3 , Figure 4 , Figure 5 and Figure 6 , when the movable block 23 moves along the track column 22, the movable block 23 drives the push rod 27 to move, the push rod 27 drives the sealing gasket 28 to move when moving, the sealing gasket 28 compresses the air in the sealing cylinder 29 when moving, and then the compressed air in the sealing cylinder 29 flows out along the air outlet pipe 30, and the air flowing out of the air outlet pipe 30 cleans the chips generated during the grinding of the semiconductor.

[0041] As shown in Figure 7 , Figure 5 , Figure 6 and Figure 7As shown, the carrier rod 4 is provided with a vibration assembly for matching the main delivery assembly, the vibration assembly is provided with a sound emitting shell 38 and an extension column 41, the cooperation of the sound emitting shell 38 and the extension column 41 can clean the debris when the semiconductor parts are punched, the vibration assembly is provided with a striker 39, the end of the carrier rod 4 away from the limiting frame 17 is provided with a positioning groove for placing the sound emitting shell 38, the sound emitting shell 38 is fixedly connected in the positioning groove of the carrier rod 4, the inside of the sound emitting shell 38 is provided with a plurality of extension columns 41, and each extension column 41 is correspondingly movably connected to the carrier rod 4, each extension column 41 is composed of a cylinder and an oval block, the cylinder part of each extension column 41 is fixedly connected with a striker 39, the inside of the sound emitting shell 38 is provided with a plurality of tension springs 40, each tension spring 40 is sleeved outside the corresponding extension column 41, and the two ends of each tension spring 40 are fixedly connected with the corresponding striker 39 and the inner wall of the carrier rod 4, respectively, the end of the translation table 16 away from the carrier frame 19 is fixedly connected with a trigger block 18, the trigger block 18 is semicircular, when the translation table 16 moves to the position corresponding to the extension column 41, the trigger block 18 is attached to the oval block part of the corresponding extension column 41.

[0042] As shown in Figure 9 , Figure 5 , Figure 6 and Figure 7 , when the translation table 16 moves towards the limiting frame 17, the translation table 16 drives the trigger block 18 to move, when the trigger block 18 moves to the position of the extension column 41, the trigger block 18 is attached to the extension column 41, and then the trigger block 18 extrudes the corresponding extension column 41 to move towards the inside of the sound emitting shell 38, when the extension column 41 moves, the extension column 41 drives the tension spring 40 to stretch, when the extension column 41 moves to the maximum distance, the extension column 41 drives the striker 39 to hit the inner wall of the sound emitting shell 38, when the trigger block 18 leaves the position of the corresponding extension column 41, the trigger block 18 releases the limiting of the extension column 41, and then the stretched tension spring 40 rebounds to drive the extension column 41 to reset, when the trigger block 18 is away from the extension column 41 closest to the placement table 6, the translation table 16 drives the polishing strip 36 and does not reach the punching position of the semiconductor parts.

[0043] As shown in Figure 9 , Figure 7 , Figure 8 and Figure 9 , the bottom of the placement table 6 is provided with an adjusting assembly for adjusting the size of the polishing hole, the adjusting assembly is provided with a placement shell 31, the placement shell 31 is fixedly connected to the bottom of the placement table 6, the inside of the placement shell 31 movably connects a double-headed threaded column 42, the outside of the double-headed threaded column 42 correspondingly threadedly connects two threaded blocks 43, and the end of each threaded block 43 away from the double-headed threaded column 42 is fixedly connected with an adjusting strip 44, each adjusting strip 44 is semicircular, when the polishing strip 36 moves to the position corresponding to the adjusting strip 44, the polishing strip 36 is attached to the adjusting strip 44.

[0044] As Figure 10 , Figure 7 , Figure 8 and Figure 9 shown, when the need to polish the semiconductor parts hole, turn the double-headed threaded column 42, and the double-headed threaded column 42 turns the two threaded blocks 43 shrink, two threaded blocks 43 in the contraction to adjust the same diameter with the semiconductor hole, immediately when the translation table 16 driven polishing strip 36 to move to the corresponding position with the adjustment strip 44, the inner ring of the adjustment strip 44 extrusion polishing strip 36, polishing strip 36 after extrusion by the adjustment strip 44 to move towards the fixed shell 32 cavity, polishing strip 36 in the movement at the same time driven spring 37 compression, immediately polishing strip 36 in the extrusion of the adjustment strip 44 to adjust to the same size with the semiconductor parts hole diameter.

[0045] Working principle:

[0046] The first step, as Figure 10 , Figure 1 , Figure 2 , Figure 3 and Figure 4 shown, when the need to punch the semiconductor parts, the semiconductor parts placed on the top of the placement table 6, and then start the punch body 1 to punch, when the punch body 1 will be finished after the semiconductor parts hole, need to polish, start the stepper motor 9, the stepper motor 9 driven transmission shaft 10 to rotate, transmission shaft 10 in the rotation of the rotating strip 11 around the transmission shaft 10 revolution, rotating strip 11 in the revolution driven positioning column 14 activity, positioning column 14 in the activity by moving block 13 extrusion fixed frame 12 to the direction of the placement table 6 moves, fixed frame 12 in the movement of the translation table 16 along the limit frame 17 moves, and positioning column 14 in the rotating strip 11 driven at the same time to promote the movement of the block 13 along the fixed frame 12 placement hole translation, moving block 13 in the translation by positioning column 14 driven wind blade 15 translation, wind blade 15 in the translation of the wind power to the semiconductor parts hole;

[0047] The second step, as Figure 5 , Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7As shown, when the translation table 16 moves, the translation table 16 drives the rack 25 to move, the rack 25 drives the connecting column 24 to move when moving, the connecting column 24 drives the movable block 23 to move along the track column 22 when moving, and the track column 22 is placed obliquely, so that the movable block 23 drives the connecting column 24 to shorten the distance towards the limiting frame 17 when moving along the track column 22, and the connecting column 24 drives the rack 25 to translate towards the translation table 16 when shortening the distance, and the rack 25 drives the rotating column 20 to rotate through the meshing gear 45 when translating, and the rotating column 20 drives the fixed shell 32 to rotate when rotating, so that the fixed shell 32 drives the grinding strip 36 to grind the inner hole of the semiconductor part when moving to the inner hole of the semiconductor part, and when the grinding strip 36 needs to be replaced, the clamping state of the clamping strip 35 and the translation frame 33 is released, and then the grinding strip 36 is removed for replacement;

[0048] The third step, as shown in Figure 8 、 Figure 3 、 Figure 4 、 Figure 5 and Figure 6 , when the movable block 23 moves along the track column 22, the movable block 23 drives the push rod 27 to move, the push rod 27 drives the sealing gasket 28 to move when moving, and the sealing gasket 28 compresses the air in the sealing cylinder 29 when moving, and then the compressed air in the sealing cylinder 29 flows out along the air outlet pipe 30, and the air flowing out of the air outlet pipe 30 cleans the debris generated during the grinding of the semiconductor;

[0049] The fourth step, as shown in Figure 7 、 Figure 5 、 Figure 6 and Figure 7 , when the translation table 16 moves towards the limiting frame 17, the translation table 16 drives the trigger block 18 to move, when the trigger block 18 moves to the position of the telescopic column 41, the trigger block 18 is attached to the telescopic column 41, and then the trigger block 18 extrudes the corresponding telescopic column 41 to move towards the inside of the sound emitting shell 38, and the telescopic column 41 drives the pull spring 40 to stretch when moving, and when the telescopic column 41 moves to the maximum distance, the telescopic column 41 drives the impact piece 39 to impact the inner wall of the sound emitting shell 38, and when the trigger block 18 leaves the position of the corresponding telescopic column 41, the trigger block 18 releases the limiting of the telescopic column 41, and then the stretched pull spring 40 rebounds to drive the telescopic column 41 to reset, and when the trigger block 18 is far away from the telescopic column 41 closest to the placement table 6, the translation table 16 drives the grinding strip 36 to not reach the hole of the semiconductor part;

[0050] The fifth step, as shown in Figure 9 、 Figure 7 、 Figure 8 and Figure 9 Figure 10As shown, when the semiconductor part hole needs to be polished, the double-threaded column 42 is rotated, and then the double-threaded column 42 drives the two threaded blocks 43 to shrink, and the two threaded blocks 43 are adjusted to the same diameter as the semiconductor hole when shrinking. Then, when the translation table 16 drives the polishing strip 36 to move to the position corresponding to the adjusting strip 44, the inner ring of the adjusting strip 44 extrudes the polishing strip 36, and the polishing strip 36 moves towards the cavity of the fixed shell 32 after being extruded by the adjusting strip 44. The polishing strip 36 drives the spring 37 to compress while moving, and then the polishing strip 36 is adjusted to the same size as the diameter of the semiconductor part hole under the extrusion of the adjusting strip 44.

[0051] The embodiments of the present application are described in detail above with reference to the drawings, but the present application is not limited thereto, and various changes can be made within the knowledge of those skilled in the art without departing from the spirit of the present application.

Claims

1. A semiconductor part surface polishing device, comprising a puncher body, a fixed table is fixedly connected to the bottom of the puncher body, characterized in that, The bottom of the fixing table is fixedly connected with a bearing rod, the bottom of the bearing rod is fixedly connected with a bearing table, the outer side of the bearing table is fixedly connected with a supporting leg, a main starting assembly for polishing the punched hole of the semiconductor part is arranged on the bearing rod, a transmission shaft and a rotating strip are arranged in the main starting assembly, the cooperation of the transmission shaft and the rotating strip can provide power for polishing the semiconductor part, the bottom of the fixing table is fixedly connected with a limiting frame, a main delivery assembly for cooperating with the main starting assembly is arranged on the limiting frame, a rotating column and a rack are arranged in the main delivery assembly, the cooperation of the rotating column and the rack can automatically move to the punched hole of the semiconductor part, a vibration assembly for cooperating with the main delivery assembly is arranged on the bearing rod, a sound producing shell and an extension column are arranged in the vibration assembly, the cooperation of the sound producing shell and the extension column can clean the debris when the semiconductor part is punched; A positioning block is arranged in the main starting assembly, the positioning block is fixedly connected to the bearing rod, the bearing rod is L-shaped, a machine shell is fixedly connected to the side of the positioning block close to the bearing rod, a stepping motor is arranged in the machine shell, a bearing is arranged on the positioning block, the inner ring of the bearing of the positioning block is fixedly connected to the transmission shaft, the output shaft of the stepping motor is fixedly connected to the transmission shaft, one end of the transmission shaft away from the stepping motor is fixedly connected to the rotating strip, a movable hole for placing the translation table is arranged on the limiting frame, the translation table is inserted into the movable hole of the limiting frame, a fixed frame is fixedly connected to the outer side of the translation table, the fixed frame is T-shaped, a placing hole for placing the moving block is arranged on the fixed frame, the moving block is inserted into the placing hole of the fixed frame, a positioning column is fixedly connected to the moving block, the positioning column is movably connected to the rotating strip, a wind generating blade is fixedly connected to one end of the positioning column away from the rotating strip; A vice supporting column is arranged in the main delivery assembly, the vice supporting column is fixedly connected to the outer side of the limiting frame, a main supporting column is fixedly connected to the outer side of the limiting frame, the vice supporting column and the main supporting column are arranged on the same side of the limiting frame, and the length of the main supporting column is greater than that of the vice supporting column, a track column is fixedly connected to one end of the main supporting column away from the limiting frame, the other end of the track column away from the main supporting column is fixedly connected to the vice supporting column, a movable block is movably connected to the track column, a connecting column is fixedly connected to the top of the movable block, the outer side of the connecting column is movably connected to the rack, a limiting groove for limiting the rack is arranged on the top of the translation table, the rack is inserted into the limiting groove of the translation table, a bearing frame is fixedly connected to the top of the translation table, the bearing frame is composed of a ring and a long strip, a bearing is arranged in the ring part of the bearing frame, the inner ring of the bearing of the bearing frame is fixedly connected to the rotating column, a gear is fixedly connected to the outer side of the rotating column, and the gear is engaged with the rack.

2. The semiconductor component surface polishing apparatus according to claim 1, wherein The main delivery assembly further comprises a fixed shell fixedly connected to the rotating column, the fixed shell is internally provided with a cavity, two translation frames are provided in the cavity of the fixed shell, the two translation frames are correspondingly inserted into the cavity of the fixed shell, each translation frame is provided with a movable hole, each translation frame is movably connected with a plug, each plug is fixedly connected to the inner wall of the fixed shell, the inner part of the fixed shell is provided with a plurality of springs, the two ends of each spring are fixedly connected to the two translation frames, the end of each translation frame away from the spring is provided with a clamping groove for placing a clamping strip, each clamping groove is clamped with a clamping strip, and the end of each clamping strip away from the translation frame is fixedly connected with a polishing strip.

3. The semiconductor device surface polishing apparatus according to claim 2, wherein The movable block is provided with a chip removal assembly for cleaning the surface polishing debris of the semiconductor parts, the chip removal assembly is provided with a push rod, the push rod is L-shaped, the push rod is fixedly connected to the end of the movable block away from the connecting column, the secondary supporting column is fixedly connected with a sealing cylinder, the sealing cylinder is fixed through the secondary supporting column, the inner part of the sealing cylinder is provided with a sealing gasket, the sealing gasket is fixedly connected to the end of the push rod away from the movable block, the push rod is inserted into the sealing cylinder, the outer side of the fixed table is fixedly connected with a placing table, and the outer side of the sealing cylinder is fixedly connected with an air outlet pipe.

4. The semiconductor device surface polishing apparatus according to claim 3, wherein The vibration assembly is provided with a striker, the end of the bearing rod away from the limiting frame is provided with a positioning groove for placing a sound production shell, the sound production shell is fixedly connected in the positioning groove of the bearing rod, the inner part of the sound production shell is provided with a plurality of telescopic columns, and each telescopic column is correspondingly movably connected to the bearing rod, each telescopic column is composed of a cylinder and an elliptical block, the cylinder part of each telescopic column is fixedly connected with a striker, the inner part of the sound production shell is provided with a plurality of tension springs, each tension spring is sleeved outside the corresponding telescopic column, and the two ends of each tension spring are fixedly connected with the corresponding striker and the inner wall of the bearing rod.

5. The semiconductor device surface polishing apparatus according to claim 1, wherein The end of the translation table away from the bearing frame is fixedly connected with a trigger block, the trigger block is semicircular, when the translation table moves to the position corresponding to the telescopic column, the trigger block is attached to the corresponding elliptical block part of the telescopic column.

6. The semiconductor device surface polishing apparatus according to claim 4, wherein The bottom of the placing table is provided with an adjusting assembly for adjusting the size of the polishing hole, the adjusting assembly is provided with a placing shell fixedly connected to the bottom of the placing table, the inner part of the placing shell is movably connected with a double-headed threaded column, the outer side of the double-headed threaded column is correspondingly threaded connected with two threaded blocks, and the end of each threaded block away from the double-headed threaded column is fixedly connected with an adjusting strip, and each adjusting strip is semicircular, when the polishing strip moves to the position corresponding to the adjusting strip, the polishing strip is attached to the adjusting strip.

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