Light-cured organic silicon release agent as well as process method and application thereof

Abstract

The invention belongs to the technical field of organic silicon release agents, and particularly relates to a light-cured organic silicon release agent as well as a process method and application thereof. The release agent comprises the following components in percentage by mass: 58%-68% of matrix resin, 3%-5% of a dual photoinitiator, 3.5%-4.5% of an antistatic agent, 6%-9% of a high-temperature-resistant filler and 1.5%-4% of an auxiliary agent, wherein a photosensitive synergist in the auxiliary agent accounts for 0.5%-1.5% of the total mass of the release agent; the matrix resin comprises acrylate modified silicone oil and epoxy organic silicon, and the dual photoinitiator is a free radical-cation composite photoinitiator. The invention aims to provide the light-cured organic silicon release agent as well as the process method and the application thereof, so as to solve the problems that the curing efficiency and the high temperature resistance are difficult to consider, the antistatic property is insufficient, extraction and silicon transfer are easy and the like in the prior art, realize that a coating stably works at the temperature of more than or equal to 200 DEG C, and simultaneously have the characteristics of low extraction, antistatic property and no silicon transfer; complete separation of the material and the mold is ensured.

Description

Technical Field

[0001] This invention mainly relates to the field of organosilicon release agent technology, specifically a photocurable organosilicon release agent, its process method, and its application. Background Technology

[0002] In industrial production, release agents, as key auxiliary materials ensuring smooth separation of materials from molds, are widely used in electronics, optics, packaging, and other fields. Among them, UV-curable silicone release agents have become a research hotspot in recent years due to their advantages such as fast curing speed, low energy consumption, and good environmental performance. Their core principle is to induce cross-linking and curing of silicone resin through ultraviolet (UV) light, forming a coating with release properties, thus achieving efficient separation of materials from molds.

[0003] In existing technologies, the curing systems of photocurable silicone release agents mostly employ single free radical or cationic types. While free radical curing systems based on acrylate-modified silicone oils offer fast curing rates, they are significantly affected by oxygen inhibition, leading to incomplete coating curing. Furthermore, the resulting cross-linked network lacks high-temperature resistance (typically below 150°C) and is prone to degradation under high-temperature conditions, failing to meet the high-temperature requirements of high-end electronic component packaging. On the other hand, cationic curing systems based on epoxy silicones, while unaffected by oxygen and exhibiting good high-temperature resistance, suffer from slow curing speeds, sensitivity to moisture, and poor performance stability when stored or used in humid environments, limiting their application range.

[0004] Furthermore, existing release agents have significant shortcomings in terms of functional integration: firstly, their antistatic properties are insufficient, easily leading to damage to precision products such as electronic components due to static electricity accumulation; secondly, they contain a high content of small molecules, which can easily be extracted during use, contaminating the release material; and thirdly, the coating structure lacks density, allowing silicon to easily transfer to the surface of the release material, affecting subsequent processing performance (such as the circuit conductivity of electronic devices). These shortcomings make it difficult for existing photocurable silicone release agents to meet the comprehensive requirements of high-end industrial scenarios for high temperature resistance, low extraction, antistatic properties, and no silicon transfer. Summary of the Invention

[0005] One of the objectives of this invention is to provide a photocurable silicone release agent, its processing method, and its application, in order to solve the problems in the prior art such as difficulty in balancing curing efficiency and high temperature resistance, insufficient antistatic properties, easy extraction, and silicone transfer. This invention enables the coating to work stably at ≥200℃, while possessing low extraction, antistatic, and silicone-free characteristics, ensuring complete separation of the material from the mold.

[0006] Specifically, the technical solution of the present invention is as follows:

[0007] In a first aspect, the present invention provides a photocurable silicone release agent, comprising the following components by weight:

[0008] The photocurable silicone release agent of this invention comprises, by weight percentage, 58%-68% main resin, 3%-5% dual photoinitiators, 3.5%-4.5% antistatic agent, 6%-9% high-temperature resistant filler, and 1.5%-4% additives, wherein the photosensitive synergist among the additives accounts for 0.5%-1.5% of the total mass of the release agent. The main resin, as the base for coating formation, has the highest proportion to ensure the basic performance of the coating; the dual photoinitiators need to be applied in appropriate amounts to effectively initiate the curing reaction, while excessive amounts may leave residues affecting performance; the proportions of the antistatic agent and high-temperature resistant filler meet their respective functional requirements, while the additives help optimize the overall performance.

[0009] The main resins include acrylate-modified silicone oil and epoxy silicone. The molecular weight of the acrylate-modified silicone oil is 5500-9500, which balances the viscosity of the resin and the mechanical properties of the coating. The acrylate grafting rate is 12%-18%, ensuring sufficient free radical reaction sites.

[0010] In some feasible methods, acrylate-modified silicone oil is prepared by reacting hydroxyl-terminated polydimethylsiloxane with acrylate monomers (such as methyl methacrylate) at 70-90°C for 3-5 hours in the presence of a catalyst (such as dibutyltin dilaurate). The mass ratio of hydroxyl-terminated polydimethylsiloxane to acrylate monomers is 10:(1-3), and the amount of catalyst used is 0.5%-1.5% of the total mass of the reactants. This resin introduces acrylate groups, providing reaction sites for free radical curing, while the siloxane backbone imparts flexibility and release properties to the coating.

[0011] In some feasible methods, epoxy organosilicon is an oligomer containing an aromatic ring structure. Its preparation method involves ring-opening polymerization of methylphenylcyclosiloxane, octamethylcyclotetrasiloxane, and phenyl glycidyl ether siloxane at 80-100°C for 2-4 hours in the presence of a catalyst (such as tetramethylammonium hydroxide). The methylphenylcyclosiloxane accounts for 15%-25% of the total monomer mass, and the phenyl glycidyl ether siloxane accounts for 5%-10%. The aromatic ring structure (such as phenyl) enhances high-temperature resistance, while the epoxy group provides active sites for cationic curing. These parameters ensure the formation of oligomers with suitable molecular weight and structure to meet curing requirements.

[0012] In some feasible embodiments, the dual photoinitiator is a radical-cationic composite, wherein the radical photoinitiator is selected from at least one of 1-hydroxy-cyclohexyl-phenyl ketone, 2-hydroxy-2-methyl-1-phenyl-1-propanone, and 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, which can efficiently generate free radicals under UV irradiation; the cationic photoinitiator is selected from at least one of diaryliodomonium salts (such as diphenyliodomonium hexafluorophosphate) and triarylthionium salts (such as triphenylthionium hexafluoroantimonate), which can initiate the ring-opening polymerization of epoxy groups.

[0013] To improve the compatibility between free radical photoinitiators and the host resin, silane modification can be performed on the free radical photoinitiators. Specifically, the free radical photoinitiator and a vinyl-containing short-chain siloxane are reacted at 50-70°C for 1-2 hours under the action of a catalyst. The mass ratio of the free radical photoinitiator to the vinyl-containing short-chain siloxane is 10:1-2, and the catalyst dosage is 0.001%-0.005% of the total mass of the reactants. The short-chain siloxane is a polysiloxane segment containing 3-5 siloxane bonds. Silane modification enhances the compatibility between the photoinitiator and the host resin, allowing for uniform dispersion in the organosilicon system and avoiding uneven local curing. The selection of reaction parameters ensures sufficient modification without affecting photoinitiation activity. The photosensitizer is selected from at least one of tertiary amine compounds and anthraquinone derivatives, such as ethyl 4-dimethylaminobenzoate and 2-ethylanthraquinone. It can improve the initiation efficiency of the photoinitiator through energy transfer, reducing the amount of photoinitiator required.

[0014] In some feasible methods, the antistatic agent is a conductive nanoparticle, specifically a carbon nanotube surface-treated with a silane coupling agent (such as γ-aminopropyltriethoxysilane). The silane coupling agent treatment enhances its bonding with the resin, and the carbon nanotubes form a conductive network in the coating, thus providing an antistatic effect.

[0015] The high-temperature resistant filler is nano-silica with a particle size of 55-95nm, which has been surface-treated with silane coupling agent. The silane coupling agent treatment improves its compatibility with the resin. The nano-silica improves the high-temperature resistance and mechanical strength of the coating through filling and reinforcement. This particle size range can ensure uniform dispersion and significant reinforcement effect.

[0016] Additives also include at least one of leveling agents, polymerization inhibitors, and dispersants. Leveling agents, such as polyether-modified polydimethylsiloxane, can improve the leveling properties of the coating; polymerization inhibitors, such as p-hydroxyanisole, prevent premature polymerization of the resin during storage; and dispersants, such as high molecular weight polycarboxylate, promote the dispersion of fillers and nanoparticles.

[0017] In some feasible methods, the antistatic agent is carbon nanotubes surface-treated with a silane coupling agent (such as γ-aminopropyltriethoxysilane). Through surface modification, it forms a good bond with the host resin, constructs a conductive network in the coating, reduces surface resistance, and thus plays an antistatic role.

[0018] In some feasible methods, the high-temperature resistant filler is nano-silica treated with a silane coupling agent with a particle size of 55-95 nm. The silane coupling agent treatment improves its compatibility with the resin. The nano-silica enhances the high-temperature resistance and mechanical strength of the coating through filling and reinforcing effects. This particle size range ensures uniform dispersion and significant reinforcing effect.

[0019] In some feasible ways, the photosensitizer in the adjuvant is selected from tertiary amine compounds (such as ethyl 4-dimethylaminobenzoate) and anthraquinone derivatives (such as 2-ethylanthraquinone), which can enhance the activity of the photoinitiator through energy transfer and reduce its dosage.

[0020] In addition, additives include at least one of leveling agents, polymerization inhibitors, and dispersants. Leveling agents, such as polyether-modified polydimethylsiloxane, can improve the leveling properties of coatings; polymerization inhibitors, such as p-hydroxyanisole, prevent premature polymerization of resins during storage; and dispersants, such as high molecular weight polycarboxylate, promote the uniform dispersion of nanofillers and carbon nanotubes.

[0021] In some feasible methods, the coating formed by UV curing of a photocurable silicone release agent exhibits a mass loss rate of ≤1% and a surface resistivity of ≤10 after being placed at 200°C for 24 hours. 10 Ω / sq, release force is (5-20) N / 25 mm, and the extract content after soaking in toluene for 24 hours is ≤0.01%.

[0022] Secondly, the present invention also provides a process method for a photocurable silicone release agent, specifically including raw material preparation, mixing and stirring, coating and curing steps.

[0023] In raw material preparation, solid raw materials are pulverized using an air jet mill to a particle size of less than 10 μm to ensure uniform dispersion in the system. The surface modification of the high-temperature resistant filler nano-silica is performed as follows: nano-silica, a silane coupling agent (such as γ-aminopropyltriethoxysilane), and anhydrous ethanol are mixed at a mass ratio of 1:(0.06-0.07):5, and stirred at 52-58℃ for 2.2-2.8 hours. After separation, washing, and drying, surface-modified nano-silica is obtained. These parameters ensure the modification effect and enhance the bonding with the resin. Simultaneously, a silane-modified free radical photoinitiator is prepared to guarantee its performance.

[0024] The specific mixing process is as follows: First, add the main resin to the dispersion vessel and stir at 110-140 rpm for 35-55 minutes to ensure thorough mixing. Then, add the dispersant and stir for 8-15 minutes. Next, add the high-temperature resistant filler and conductive particles, increase the speed to 2100-2400 rpm, and disperse at high speed for 45-55 minutes to ensure uniform dispersion of the filler and conductive particles. Finally, reduce the speed to 110-140 rpm, add the dual photoinitiator, photosensitizing synergist, and other additives, and continue stirring for 45-55 minutes to ensure all components are evenly mixed. The different speed and time settings are to ensure effective mixing while avoiding problems such as bubbles caused by over-stirring.

[0025] In the coating and curing steps, the mixture is applied to the substrate surface and then UV-cured to form a coating. Controlling the coating parameters ensures uniform coating thickness, while UV curing, through appropriate intensity and time, allows the resin to fully cure, forming a high-performance coating and ensuring complete separation of the material from the mold.

[0026] In some feasible methods, the coating formed by UV curing of a photocurable silicone release agent exhibits a mass loss rate of ≤1% and a surface resistivity of ≤10 after being placed at 200°C for 24 hours. 10 Ω / sq, release force is (5-20) N / 25 mm, and the extract content after soaking in toluene for 24 hours is ≤0.01%.

[0027] In this invention, the acrylate-modified silicone oil and epoxy organosilicon form an interpenetrating cross-linked network in the main resin through dual photoinitiators. The phenyl structure in the epoxy organosilicon enhances the thermal stability of the molecular chain through conjugation, and combined with the dispersion strengthening effect of nano-silica, a dense and high-temperature resistant framework is constructed at the microscopic level, effectively inhibiting the breakage and volatilization of molecular chains at high temperatures, thereby reducing mass loss. Carbon nanotubes treated with silane coupling agents form continuous conductive pathways in the coating, shortening the charge migration path and achieving a stable antistatic effect. The high cross-linking density network structure (small spacing between cross-linking points) and the filling effect of nanofillers reduce the free space of small molecules, significantly reducing the extract content. The flexible segments provided by the acrylate-modified silicone oil and the rigid structure formed by the epoxy organosilicon synergistically regulate the interfacial forces, keeping the release force stable within a suitable range. Compared with the prior art, this coating achieves comprehensive performance of high temperature resistance, antistatic properties, low extraction, and stable release through molecular design and structural regulation, breaking through the limitations of single-performance optimization of traditional release agents, and is especially suitable for scenarios with stringent requirements for stability and cleanliness.

[0028] This invention, through the aforementioned raw material formulation and preparation method, solves many problems existing in photocurable silicone release agents in the prior art. From a microscopic perspective, the free radical and cationic polymerization initiated by the dual photoinitiators forms an interpenetrating network, giving the coating both good curing efficiency and high-temperature resistance. The modified photoinitiator, filler, and antistatic agent are uniformly dispersed in the system, synergistically improving the coating performance. Macroscopically, the coating exhibits excellent high-temperature resistance (stable at 200℃), antistatic properties, low extractability, and no silicon transfer, demonstrating significant advantages in overall performance improvement compared to existing technologies.

[0029] Thirdly, the present invention also provides an application of the above-mentioned photocurable silicone release agent, which is used as a release medium between the mold and the molding material in the process of electronic component packaging, optical film preparation or composite material molding.

[0030] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0031] (1) This invention employs a free radical-cationic composite photoinitiator matched with an acrylate-modified silicone oil / epoxy silicone composite main resin to achieve a dual curing mechanism at the molecular level: the free radical photoinitiator rapidly initiates the polymerization of acrylate groups to form flexible segments, while the cationic photoinitiator simultaneously initiates the ring-opening polymerization of epoxy groups to form a rigid network. The two intertwine to form an interpenetrating structure. The silane-modified free radical photoinitiator, due to the grafting of short-chain siloxanes, has significantly improved compatibility with silicone resin, avoiding uneven local curing; while the phenyl structure in the epoxy silicone enhances the thermal stability of the molecular chain through the conjugation effect, making the coating's mass loss rate ≤1% after 24 hours at 200℃. Compared with the existing single curing systems, which suffer from insufficient high-temperature resistance of the free radical type and slow curing of the cationic type, this invention can complete curing within 35-55 seconds, and improves high-temperature resistance by more than 40%, effectively solving the contradiction between efficiency and heat resistance.

[0032] (2) In this invention, the antistatic agent is carbon nanotubes treated with silane coupling agent. After the hydroxyl groups on their surface react with the silane coupling agent, they form chemical bonds, constructing a continuous conductive network in the coating (microscopically, the spacing between carbon nanotubes is ≤100nm), and macroscopically stabilizing the surface resistance at ≤10. 10 Ω / sq. Compared with existing physically mixed conductive fillers, this chemical bonding avoids the migration and aggregation of carbon nanotubes during curing or use. The antistatic performance still retains more than 90% after 100 rubs, solving the problem of rapid decay of the antistatic effect of traditional release agents.

[0033] (3) In this invention, the main resin forms a high cross-linking density network by precisely controlling the grafting rate of acrylate-modified silicone oil and the degree of polymerization of epoxy organosilicon, thereby reducing the free space of small molecules. After being treated with γ-aminopropyltriethoxysilane, nano-silica forms covalent bonds with the resin, further filling the gaps between molecules. The dense network structure at the microscopic level prevents the migration of small molecules. At the macroscopic level, the content of the extract after soaking in toluene for 24 hours is ≤0.01%, and the siloxane segments are wrapped by a rigid network. XPS detection shows that the silicon content on the surface of the release material is <0.1%, overcoming the product contamination problem caused by silicon transfer in traditional release agents.

[0034] (4) In this invention, 55-95nm nano-silica is embedded in the resin network through the "dispersion strengthening" effect, which effectively inhibits crack propagation and significantly improves the tensile strength of the coating. At the same time, the flexible segments provided by the acrylate-modified silicone oil ensure the toughness of the coating. Combined with the release force design of 5-20N / 25mm, a balance of "strong adhesion and easy peeling" is achieved. Compared with the defects of existing release agents, which either have excessive release force leading to material damage or easy coating breakage, the release force fluctuation of this invention is still ≤10% after 50 repeated uses, which significantly improves its industrial applicability.

[0035] (5) In this invention, the silane-modified free radical photoinitiator, surface-treated carbon nanotubes, and nano-silica form a homogeneous system with organosilicon resin through the principle of similar dissolves like. Combined with a graded stirring process (low-speed mixing - high-speed dispersion - low-speed compounding), defects such as pinholes and craters in the coating caused by poor compatibility in traditional systems are avoided. Macroscopically, the coating thickness deviation is <±1μm, and the batch performance fluctuation is ≤5%, solving the problem of insufficient stability in the industrial production of photocurable release agents.

[0036] (6) Existing technologies typically require sacrificing one performance attribute for another (e.g., improving high-temperature resistance reduces release efficiency). However, this invention achieves a multi-performance integration of high-temperature resistance, antistatic properties, low extraction, no silicon transfer, and high release stability through molecular design (e.g., synergistic effects of phenyl and epoxy groups in epoxy silicone), synergistic effects of additives (photosensitive synergists improve initiation efficiency while reducing photoinitiator dosage), and structural regulation (interpenetrating networks + nano-reinforcement). This balanced performance breaks through the performance bottleneck of traditional release agents, providing an integrated solution for high-end industrial scenarios.

[0037] In summary, this invention, through innovation in the curing system, modification of functional additives, and optimization of the process, achieves a comprehensive improvement in the high-temperature resistance, antistatic properties, low extraction, and silicon-free transfer of photocurable silicone release agents, which is significantly superior to existing technologies and possesses outstanding innovation and practical value.

[0038] The present invention will be explained in detail below with reference to the accompanying drawings and specific embodiments. Attached Figure Description

[0039] Figure 1 This is a comparison chart of the curing times of the release agents prepared in the embodiments and comparative examples of the present invention;

[0040] Figure 2 is a comparison of the mass loss rate of the coatings formed by UV curing of the release agent prepared in the embodiments of the present invention and the comparative examples after being placed at 200°C for 24 hours.

[0041] Figure 3 is a comparison diagram of the release force of the coatings formed after UV curing of the release agents prepared by the present invention embodiment and the comparative example. Detailed Implementation

[0042] To facilitate understanding of the present invention, a more comprehensive description of the present invention will be given below with reference to the accompanying drawings, which illustrate several embodiments of the present invention. However, the present invention can be implemented in different forms and is not limited to the embodiments described in the text. Rather, these embodiments are provided to make the disclosure of the present invention more thorough and complete.

[0043] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly associated with those skilled in the art to which this invention pertains. The terminology used herein in the specification of this invention is for the purpose of describing particular embodiments and is not intended to limit the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0044] Example 1: This example provides a photocurable silicone release agent, which, by weight percentage, comprises the following components: 58% main resin, 3% dual photoinitiator, 3.5% antistatic agent, 6% high-temperature resistant filler, and 1.5% additives, including 0.5% photosensitizer (ethyl 4-dimethylaminobenzoate), 0.4% leveling agent (polydimethylsiloxane), 0.3% polymerization inhibitor (p-hydroxyanisole), and 0.3% dispersant (polycarboxylate).

[0045] Specifically, in this embodiment, the main resin contains 35% acrylate-modified silicone oil and 23% epoxy silicone; the dual photoinitiator is a free radical-cationic composite photoinitiator, including 2% free radical photoinitiator and 1% cationic photoinitiator. The cationic photoinitiator is diphenyliodonium hexafluorophosphate, and the free radical photoinitiator is silane-modified 1-hydroxy-cyclohexyl-phenyl ketone.

[0046] In this embodiment, the high-temperature resistant filler is nano-silica with a particle size of 55nm, which has been surface-treated with a silane coupling agent; the antistatic agent is carbon nanotubes with a surface-treated silane coupling agent.

[0047] The preparation method of acrylate-modified silicone oil is as follows: Hydroxyl-terminated polydimethylsiloxane and methyl methacrylate are mixed at a mass ratio of 10:1, and 0.5% of dibutyltin dilaurate is added as a catalyst. The mixture is reacted at 70°C for 5 hours to obtain a product with a molecular weight of 5500 and an acrylate grafting rate of 12%. The preparation method of epoxy organosilicon is as follows: Methylphenylcyclosiloxane (15% of the total monomer mass), octamethylcyclotetrasiloxane (80% of the total monomer mass), and phenyl glycidyl ether siloxane (5% of the total monomer mass) are mixed, and tetramethylammonium hydroxide is added as a catalyst. The mixture is then subjected to ring-opening polymerization at 80°C for 4 hours to obtain an epoxy organosilicon oligomer containing methylphenylsiloxane linkages.

[0048] The preparation method of silane-modified free radical photoinitiator is as follows: 1-hydroxy-cyclohexyl-phenyl ketone and vinyl-containing short-chain siloxane (containing 3 siloxane bonds) are mixed at a mass ratio of 10:1, and 0.001% of the total mass of the reactants in isopropanol chloroplatinate solution is added as a catalyst, and the reaction is carried out at 50°C for 2 hours.

[0049] The modification method of the antistatic agent is as follows: carbon nanotubes and γ-aminopropyltriethoxysilane are mixed at a mass ratio of 10:1, and an appropriate amount of anhydrous ethanol is added (solid-liquid ratio 1:10). The mixture is stirred at 60°C for 3 hours. During this period, the alkoxy groups of the silane coupling agent are hydrolyzed to form hydroxyl groups, which undergo a condensation reaction with the hydroxyl groups on the surface of the carbon nanotubes. After centrifugation and washing with ethanol three times, the mixture is vacuum dried at 80°C for 5 hours to obtain carbon nanotubes with surface grafted siloxane segments.

[0050] The modification method of high temperature resistant filler is as follows: nano silica, γ-aminopropyltriethoxysilane and anhydrous ethanol are mixed at a mass ratio of 1:0.06:5 and stirred at 52°C for 2.8 hours. The silane coupling agent is grafted onto the surface of nano silica through hydrolysis-condensation reaction. After separation by vacuum filtration, washing with deionized water until neutral, and vacuum drying at 80°C for 4 hours, surface-modified nano silica is obtained.

[0051] The above-mentioned release agent process includes the following steps:

[0052] (1) Raw material preparation: The solid raw materials (cationic photoinitiator diphenyliodonium hexafluorophosphate and modified carbon nanotubes) were pulverized to a particle size of 8 μm using an air jet mill; at the same time, the above-mentioned silane-modified free radical photoinitiator and the modified high-temperature resistant filler were prepared.

[0053] (2) Mixing and stirring: Add the main resin to the dispersion vessel and stir at 110 rpm for 55 minutes. Add the dispersant and stir for 8 minutes. Then add the modified nano silica and modified carbon nanotubes, increase the speed to 2100 rpm for high-speed dispersion for 55 minutes, then reduce the speed to 110 rpm. Add the dual photoinitiator, photosensitizer and other additives, and continue stirring for 55 minutes.

[0054] (3) Coating and curing: The mixture obtained in step (2) is coated on the surface of the substrate and cured by UV to form a coating. This coating is used to ensure complete separation of the material from the mold.

[0055] The mixture obtained in step (2) is applied to the surface of the substrate using an automated spraying equipment and cured for 55 seconds by a multi-band UV curing machine to form a coating. The spraying pressure is 0.35 MPa, the distance is 11 cm, and the UV curing strength is 60 mW / cm².

[0056] The coating was tested and found to have a mass loss rate of 0.8% after being placed at 200°C for 24 hours, with a surface resistivity of 8 × 10⁻⁶. 9 Ω / sq, release force of 8N / 25mm, and extract content of 0.008% after soaking in toluene for 24 hours.

[0057] Example 2: This example provides a photocurable silicone release agent, which, by weight percentage, comprises the following components: 63% main resin, 4% dual photoinitiator, 4% antistatic agent, 7.5% high-temperature resistant filler, and 2.5% additives, wherein the 1% photosensitive synergist is 2-ethylanthraquinone, the leveling agent is polydimethylsiloxane, the polymerization inhibitor is p-hydroxyanisole, and the dispersant is polycarboxylate, which is 0.4%.

[0058] Specifically, in this embodiment, the main resin contains 38% acrylate-modified silicone oil and 25% epoxy silicone; the dual photoinitiator is a free radical-cationic composite photoinitiator, including 2.5% free radical photoinitiator and 1.5% cationic photoinitiator. The cationic photoinitiator is triphenylthionium hexafluoroantimonate, and the free radical photoinitiator is silane-modified 2,4,6-trimethylbenzoyl-diphenylphosphine oxide.

[0059] In this embodiment, the high-temperature resistant filler is nano-silica with a particle size of 75nm, which has been surface-treated with a silane coupling agent; the antistatic agent is carbon nanotubes with a surface-treated silane coupling agent.

[0060] The preparation method of acrylate-modified silicone oil is as follows: Hydroxyl-terminated polydimethylsiloxane and methyl methacrylate are mixed at a mass ratio of 10:2, and 1% (by mass) of dibutyltin dilaurate is added. The mixture is reacted at 80°C for 4 hours to obtain a product with a molecular weight of 7500 and an acrylate grafting rate of 15%. The preparation method of epoxy organosilicon is as follows: Methylphenylcyclosiloxane (20% of the total monomer mass), octamethylcyclotetrasiloxane (75% of the total monomer mass), and phenyl glycidyl ether siloxane (5% of the total monomer mass) are mixed, and tetramethylammonium hydroxide is added. The mixture is then subjected to ring-opening polymerization at 90°C for 3 hours to obtain an epoxy organosilicon oligomer containing methylphenylsiloxane linkages.

[0061] The preparation method of silane-modified free radical photoinitiator is as follows: 2,4,6-trimethylbenzoyl-diphenylphosphine oxide and vinyl-containing short-chain siloxane (containing 4 siloxane bonds) are mixed at a mass ratio of 10:1.5, and 0.003% of the total mass of the reactants in isopropanol chloroplatinate solution is added. The reaction is carried out at 60°C for 1.5 hours.

[0062] The modification method of the antistatic agent is as follows: carbon nanotubes and γ-aminopropyltriethoxysilane are mixed at a mass ratio of 10:1.2, anhydrous ethanol is added (solid-liquid ratio 1:12), and the mixture is stirred at 65°C for 2.5 hours. Surface modification is achieved through the hydrolysis and condensation of the silane coupling agent. After centrifugation and washing with ethanol, the mixture is vacuum dried at 85°C for 4 hours to obtain surface-modified carbon nanotubes.

[0063] The modification method of high temperature resistant filler is as follows: nano silica, γ-aminopropyltriethoxysilane and anhydrous ethanol are mixed at a mass ratio of 1:0.065:5 and stirred at 55°C for 2.5 hours to graft silane coupling agent onto the surface of nano silica. After filtration, washing and vacuum drying at 80°C for 4 hours, it is ready for use.

[0064] The above-mentioned release agent process includes the following steps:

[0065] (1) Raw material preparation: The solid raw material is crushed to a particle size of 5μm; the above-mentioned silane-modified free radical photoinitiator and modified antistatic agent and high temperature resistant filler are prepared.

[0066] (2) Mixing and stirring: The main resin is stirred at 125 rpm for 45 minutes, the dispersant is added and stirred for 12 minutes, then the modified nano silica and modified carbon nanotubes are added and dispersed at 2250 rpm for 50 minutes. Then the remaining components are added at 125 rpm and stirred for 50 minutes.

[0067] (3) Coating and curing: Spraying pressure 0.4MPa, distance 12.5cm, UV curing strength 75mW / cm², time 45 seconds, to form a coating.

[0068] The coating was tested and found to have a mass loss rate of 0.6% after being placed at 200°C for 24 hours, and a surface resistivity of 5 × 10⁻⁶. 9 Ω / sq, release force of 12N / 25mm, and extract content of 0.006% after soaking in toluene for 24 hours.

[0069] Example 3: This example provides a photocurable silicone release agent, which, by weight percentage, comprises the following components: 68% main resin, 5% dual photoinitiator, 4.5% antistatic agent, 9% high-temperature resistant filler, and 4% additives, including 1.5% photosensitizer (ethyl 4-dimethylaminobenzoate), 1% leveling agent (polydimethylsiloxane), 0.8% polymerization inhibitor (p-hydroxyanisole), and 0.7% dispersant (polycarboxylate).

[0070] Specifically, in this embodiment, the main resin contains 40% acrylate-modified silicone oil and 28% epoxy silicone; the dual photoinitiator is a free radical-cationic composite photoinitiator, including 3% free radical photoinitiator and 2% cationic photoinitiator. The cationic photoinitiator is diphenyliodonium hexafluorophosphate, and the free radical photoinitiator is silane-modified 2-hydroxy-2-methyl-1-phenyl-1-propanone.

[0071] In this embodiment, the high-temperature resistant filler is nano-silica with a particle size of 95nm, which has been surface-treated with a silane coupling agent; the antistatic agent is carbon nanotubes with a surface-treated silane coupling agent.

[0072] The preparation method of acrylate-modified silicone oil is as follows: Hydroxyl-terminated polydimethylsiloxane and methyl methacrylate are mixed at a mass ratio of 10:3, and 1.5% of dibutyltin dilaurate (by mass of the total reactants) is added. The mixture is reacted at 90°C for 3 hours to obtain a product with a molecular weight of 9500 and an acrylate grafting rate of 18%. The preparation method of epoxy organosilicon is as follows: Methylphenylcyclosiloxane (25% of the total monomer mass), octamethylcyclotetrasiloxane (70% of the total monomer mass), and phenyl glycidyl ether siloxane (10% of the total monomer mass) are mixed, and tetramethylammonium hydroxide is added. The mixture is then subjected to ring-opening polymerization at 100°C for 2 hours to obtain an epoxy organosilicon oligomer containing methylphenylsiloxane linkages.

[0073] The preparation method of silane-modified free radical photoinitiator is as follows: 2-hydroxy-2-methyl-1-phenyl-1-propanone and vinyl-containing short-chain siloxane (containing 5 siloxane bonds) are mixed at a mass ratio of 10:2, and 0.005% of the total mass of the reactants in isopropanol chloroplatinate solution is added, and the reaction is carried out at 70°C for 1 hour.

[0074] The modification method of the antistatic agent is as follows: carbon nanotubes and γ-aminopropyltriethoxysilane are mixed at a mass ratio of 10:1.5, anhydrous ethanol (solid-liquid ratio 1:15) is added, and the mixture is stirred at 70°C for 2 hours. Modification is achieved by surface grafting of silane coupling agent. After centrifugation and washing, the mixture is vacuum dried at 90°C for 3 hours to obtain surface-modified carbon nanotubes.

[0075] The modification method of high temperature resistant filler is as follows: nano silica, γ-aminopropyltriethoxysilane and anhydrous ethanol are mixed in a mass ratio of 1:0.07:5 and stirred at 58°C for 2.2 hours to allow the silane coupling agent to be fully grafted onto the surface of nano silica. After filtration, washing and vacuum drying at 80°C for 4 hours, it is ready for use.

[0076] The above-mentioned release agent process includes the following steps:

[0077] (1) Raw material preparation: The solid raw material is crushed to a particle size of 3μm; the above-mentioned silane-modified free radical photoinitiator and modified antistatic agent and high temperature resistant filler are prepared.

[0078] (2) Mixing and stirring: The main resin is stirred at 140 rpm for 35 minutes, the dispersant is added and stirred for 15 minutes, then the modified nano silica and modified carbon nanotubes are added and dispersed at 2400 rpm for 45 minutes, then the remaining components are added at 140 rpm and stirred for 45 minutes.

[0079] (3) Coating and curing: Spraying pressure 0.45MPa, distance 14cm, UV curing strength 90mW / cm², time 35 seconds, to form a coating.

[0080] The coating was tested and found to have a mass loss rate of 0.5% after being placed at 200°C for 24 hours, with a surface resistivity of 3 × 10⁻⁶. 9 Ω / sq, release force of 18N / 25mm, and extract content of 0.005% after soaking in toluene for 24 hours.

[0081] Comparative Example 1: This comparative example differs from Example 1 in that it does not use dual photoinitiators, but only ordinary free radical photoinitiators. Specifically, it uses unmodified 1-hydroxy-cyclohexyl-phenyl ketone at a content of 3% (consistent with the total content of dual photoinitiators in Example 1). Specifically, the photoinitiation system contains only 3% unmodified 1-hydroxy-cyclohexyl-phenyl ketone, without cationic photoinitiators. The types and contents of the remaining components (main resin 58%, antistatic agent 3.5%, high-temperature filler 6%, additives 1.5%) are consistent with those of Example 1.

[0082] In the preparation method of the release agent in this comparative example, there is no need to prepare a silane-modified photoinitiator or add a cationic photoinitiator. The unmodified 1-hydroxy-cyclohexyl-phenyl ketone is directly added to the system in proportion. The remaining steps (such as solid raw material crushing, nano silica modification, mixing and stirring parameters, coating and curing conditions, etc.) are the same as in Example 1.

[0083] Comparative Example 2: This comparative example differs from Example 1 in that it does not contain a free radical photoinitiator, but only a cationic photoinitiator. The total content of the dual photoinitiators remains 3%, all of which are diphenyliodonium hexafluorophosphate. The types and contents of the remaining components, such as the main resin, antistatic agent, high-temperature filler, and additives, are the same as in Example 1.

[0084] In the preparation method of the release agent in this comparative example, there is no need to prepare a silane-modified free radical photoinitiator in the raw material preparation stage. 3% of diphenyliodonium hexafluorophosphate is directly added during mixing and stirring. The remaining steps and parameters (such as solid raw material crushing, nano silica modification, stirring speed and time, coating and curing conditions, etc.) are the same as in Example 1.

[0085] Comparative Example 3: The difference between this comparative example and Example 1 is that it uses a conventional, unmodified free radical photoinitiator, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide. In the dual photoinitiator, 2% is unmodified 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, and 1% is diphenyliodonium hexafluorophosphate.

[0086] In the preparation method of the release agent in this comparative example, there is no need to modify the silane of the free radical photoinitiator. The unmodified free radical photoinitiator 2,4,6-trimethylbenzoyl-diphenylphosphine oxide is used directly. The other components, contents and steps (such as raw material processing, mixing and stirring parameters, curing conditions, etc.) are the same as in Example 1.

[0087] Comparative Example 4: This comparative example differs from Example 1 in that it does not contain a cationic photoinitiator, but only a silane-modified free radical photoinitiator, 1-hydroxy-cyclohexyl-phenyl ketone. The total content of the dual photoinitiators remains 3%, all of which are silane-modified 1-hydroxy-cyclohexyl-phenyl ketone. The preparation method of this silane-modified free radical photoinitiator is the same as that of Example 1; the types and contents of the remaining components (main resin, antistatic agent, high-temperature resistant filler, and additives) are consistent with those of Example 1.

[0088] The preparation method of the release agent in this comparative example has the same steps and parameters (such as raw material processing, mixing and stirring, coating and curing) as in Example 1.

[0089] Comparative Example 5: The difference between this comparative example and Example 1 is that the release agent of this comparative example, by mass percentage, includes the following components: 2% dual photoinitiator (1.3% silane-modified 1-hydroxy-cyclohexyl-phenyl ketone, 0.7% diphenyliodonium hexafluorophosphate), 5% high-temperature resistant filler (nano silica treated with γ-aminopropyltriethoxysilane, particle size 55nm), 60% main resin (36% acrylate-modified silicone oil, 24% epoxy silicone), and the types and contents of the remaining components (3.5% antistatic agent, 1.5% additives) are the same as in Example 1.

[0090] In the preparation method of the release agent in this comparative example, the raw material processing, mixing and stirring parameters (speed and time), coating and curing conditions are the same as in Example 1. However, due to the reduction in filler content, the dispersion effect in the high-speed dispersion stage is slightly different.

[0091] Comparative Example 6: The difference between this comparative example and Example 1 is that the release agent of this comparative example, by mass percentage, includes the following components: 7% dual photoinitiator (4.7% silane-modified 1-hydroxy-cyclohexyl-phenyl ketone, 2.3% diphenyliodonium hexafluorophosphate), 10% high-temperature resistant filler (nano-silica treated with γ-aminopropyltriethoxysilane, particle size 55nm), the main resin is adjusted accordingly to 54% (32% acrylate-modified silicone oil, 22% epoxy silicone), and the types and contents of the remaining components (3.5% antistatic agent, 1.5% additives) are the same as in Example 1.

[0092] In the preparation method of the release agent in this comparative example, due to the increase in the content of photoinitiator and filler, the high-speed dispersion stage during mixing and stirring is extended to 60 minutes to ensure uniform dispersion. The remaining steps (such as raw material processing, coating and curing parameters) are the same as in Example 1.

[0093] Comparative Example 7: The difference between this comparative example and Example 1 is that a conventional resin (ordinary polydimethylsiloxane, molecular weight 5500) is used to replace the acrylate-modified silicone oil and epoxy silicone in the main resin, while the content remains at 58%. The types and contents of the remaining components (3% dual photoinitiator, 3.5% antistatic agent, 6% high-temperature resistant filler, and 1.5% additives) are the same as in Example 1.

[0094] In the preparation method of the release agent in this comparative example, since conventional resins do not require specific polymerization steps, commercially available polydimethylsiloxane is directly used for mixing. The remaining steps (raw material processing, stirring parameters, curing conditions, etc.) are the same as in Example 1.

[0095] Comparative Example 8: The difference between this comparative example and Example 1 is that a common antistatic agent (carbon nanotubes without silane coupling agent treatment) is used, and the content is still 3.5%. The types and contents of the remaining components (main resin 58%, dual photoinitiator 3%, high-temperature resistant filler 6%, and additives 1.5%) are the same as in Example 1; in the preparation method, the carbon nanotubes do not require surface treatment and are directly crushed and added to the system, and the remaining steps (such as nano silica modification, mixing and stirring, curing conditions, etc.) are the same as in Example 1.

[0096] Comparative Example 9: This comparative example differs from Example 1 in that it does not contain acrylate-modified silicone oil, but only contains 58% epoxy silicone (the preparation method is the same as that of epoxy silicone in Example 1). The types and contents of the remaining components (3% dual photoinitiator, 3.5% antistatic agent, 6% high-temperature resistant filler, and 1.5% additives) are the same as in Example 1. In the preparation method, since there is no acrylate-modified silicone oil, pure epoxy silicone is used directly as the main resin. The initial stirring time of the resin during mixing is shortened to 30 minutes. The remaining steps (raw material processing, dispersion parameters, curing conditions, etc.) are the same as in Example 1.

[0097] Comparative Example 10: This comparative example differs from Example 1 in that it does not contain epoxy silicone, but only 58% acrylate-modified silicone oil (prepared using the same method as the acrylate-modified silicone oil in Example 1, with a molecular weight of 5500 and a grafting rate of 12%). The types and contents of the remaining components (3% dual photoinitiator, 3.5% antistatic agent, 6% high-temperature resistant filler, and 1.5% additives) are the same as in Example 1. In the preparation method, since there is no epoxy silicone, the main resin is directly pure acrylate-modified silicone oil, and the initial stirring time of the resin is shortened to 30 minutes. The remaining steps (raw material processing, dispersion parameters, curing conditions, etc.) are the same as in Example 1.

[0098] Table 1 compares the performance parameters of the release agents and coatings prepared in the examples and comparative examples.

[0099] project Curing time (seconds) Mass loss rate (%) at 200℃ for 24 hours Surface resistivity (Ω / sq) Release force (N / 25mm) Toluene extract content (%) Release force fluctuation after 50 uses (%) Example 1 55 0.8 <![CDATA[8×10 9 ]]> 8 0.008 8 Example 2 45 0.6 <![CDATA[5×10 9 ]]> 12 0.006 6 Example 3 35 0.5 <![CDATA[3×10 9 ]]> 18 0.005 5 Comparative Example 1 60 3.5 2×10¹² 25 0.05 25 Comparative Example 2 120 0.9 <![CDATA[9×10 9 ]]> 15 0.012 12 Comparative Example 3 58 1.2 <![CDATA[7×10 9 ]]> 10 0.02 15 Comparative Example 4 50 3.2 1.5×10¹² 22 0.045 22 Comparative Example 5 70 2.8 1×10¹¹ 28 0.035 30 Comparative Example 6 52 1.0 <![CDATA[6×10 9 ]]> 16 0.015 18 Comparative Example 7 80 5.0 3×10¹³ 30 0.08 40 Comparative Example 8 55 0.9 5×10¹¹ 9 0.01 20 Comparative Example 9 110 0.7 <![CDATA[8×10 9 ]]> 20 0.011 10 Comparative Example 10 40 4.0 9×10¹² 18 0.06 28

[0100] The performance parameter testing methods and standards in Table 1 above

[0101] Curing time: A multi-band UV curing machine (strength 60-90mW / cm²) was used to determine the complete curing time by observing the surface hardness of the coating in real time (measured by a Shore hardness tester ≥80D). The time from the completion of coating to the achievement of the curing standard was recorded.

[0102] Mass loss rate at 200℃ for 24 hours: Refer to GB / T2793-1995, take a cured coating sample (mass m1), place it in a 200℃ oven at a constant temperature for 24 hours, weigh it after cooling (m2), and calculate (m1-m2) / m1×100%.

[0103] Surface resistance: According to GB / T1410-2006, the surface resistance of the coating was measured using a high resistance meter at 25℃ and 50% humidity, and the average value of three parallel tests was taken.

[0104] Release force: According to ASTM D3359, the 180° peel force of a 25mm wide sample was measured using a peel tester at a speed of 300mm / min, and the average value of 5 tests was taken.

[0105] Toluene extract content: According to ISO 10545-12, the coating sample was immersed in toluene for 24 hours (solid-liquid ratio 1:50), the solvent was evaporated, the mass of the residue was weighed, and the ratio to the initial mass of the sample was calculated.

[0106] Release force fluctuation after 50 uses: Repeat the release test 50 times, record the maximum and minimum release forces, and calculate (maximum value - minimum value) / initial value × 100%.

[0107] Analysis of the relevant data in Table 1 above shows that the embodiments of the present invention achieve comprehensive performance optimization through the free radical-cationic dual curing system: the curing time is short (35-55 seconds), only 1 / 3-1 / 2 of that of the single cation system (Comparative Examples 2 and 9), solving the problem of low efficiency of traditional cation curing; the mass loss rate at 200℃ is ≤0.8%, which is significantly better than the 3.2%-4.0% of the single free radical system (Comparative Examples 1, 4, and 10). The main reason is the conjugated stabilizing effect of the phenyl structure in the epoxy organosilicon and the dispersion strengthening of nano-silica.

[0108] The surface resistivity of the coating obtained by this invention is as low as 3 × 10⁻⁶. 9 -8×10 9 The resistance was Ω / sq, and the fluctuation was small after 50 rubs, thanks to the stable conductive network formed by the silane-modified carbon nanotubes. In contrast, the resistance of the unmodified carbon nanotubes (Comparative Example 8) increased by 1-2 orders of magnitude due to agglomeration. The toluene extract content was ≤0.008%, which was much lower than that of the conventional system (0.08% in Comparative Example 7), demonstrating the confinement effect of the high cross-linking density network on small molecules. The release force was stable at 5-20N / 25mm, with a fluctuation of ≤8% after 50 uses, achieving a balance between strong adhesion and easy peeling performance. In contrast, the release force of the single resin system (Comparative Examples 9 and 10) fluctuated greatly due to the simple network structure.

[0109] In comparison, Comparative Examples 1, 4, and 10, due to the use of single free radical curing or unmodified photoinitiators, could not form interpenetrating networks, resulting in easy breakage of molecular chains at high temperatures, with a mass loss rate as high as 3.2%-4.0%, and a significant increase in extract content. Comparative Examples 2 and 9 relied on single cationic curing, which, although exhibiting good high-temperature resistance, had a curing time as long as 110-120 seconds, resulting in low efficiency. Comparative Example 3, due to the lack of silane modification of the photoinitiator, had poor compatibility with the resin, leading to uneven local curing and an extract content of 0.02%. Comparative Examples 5 and 6, due to the deviation of component content from the weight range, either had insufficient photoinitiator leading to incomplete curing (70 seconds) or excessive filler causing agglomeration, resulting in release force fluctuations increasing to 18%-30%. Comparative Example 7 used conventional resin, lacking a rigid skeleton and cross-linking network, resulting in comprehensive deterioration of all properties. Comparative Example 8, due to the lack of modification of carbon nanotubes, had a discontinuous conductive network, with surface resistance rising to 5×10¹¹Ω / sq, and rapid decay of antistatic properties.

[0110] In summary, the embodiments of the present invention achieve a synergistic improvement in curing efficiency, high temperature resistance, antistatic properties, low extraction, and release stability through the comprehensive innovation of dual curing system, modified functional additives, and composite resin, thus solving the pain points of the prior art, such as the contradiction between efficiency and heat resistance and the single function.

[0111] Any numerical values ​​cited herein include all values ​​ranging from a lower limit to an upper limit, increasing by one unit, with at least two units between any lower and any higher value. For example, if the quantity of a component or the value of a process variable (e.g., temperature, pressure, time, etc.) is described as being from 1 to 90, preferably from 20 to 80, more preferably from 30 to 70, the purpose is to illustrate that values ​​such as 15 to 85, 22 to 68, 43 to 51, 30 to 32 are also explicitly listed in this specification. For values ​​less than 1, a unit is appropriately considered to be 0.0001, 0.001, 0.01, 0.1, etc. These are merely examples intended for explicit expression, and it can be assumed that all possible combinations of values ​​listed between the minimum and maximum values ​​are similarly explicitly stated in this specification.

[0112] Unless otherwise stated, all ranges include the endpoints and all numbers between them. The terms "approximately" or "about" used with ranges apply to both endpoints of the range. Thus, "approximately 20 to 30" is intended to cover "approximately 20 to approximately 30," including at least the specified endpoints.

[0113] It should be understood that the above description is for illustrative purposes and not for limitation. Many embodiments and applications beyond the provided examples will be apparent to those skilled in the art upon reading the above description. Therefore, the scope of this teaching should not be determined by reference to the above description, but rather by reference to the appended claims and the full scope of their equivalents. For purposes of completeness, all articles and references, including patent applications and publications, are incorporated herein by reference. The omission of any aspect of the subject matter disclosed herein in the preceding claims is not intended as a waiver of that subject matter, nor should it be construed as an indication that the inventors have not considered that subject matter as part of the disclosed inventive subject matter.

[0114] The present invention has been described by way of example in conjunction with the accompanying drawings. Obviously, the specific implementation of the present invention is not limited to the above-described manner. Any non-substantial improvement made by adopting the inventive concept and technical solution of the present invention, or the direct application of the inventive concept and technical solution of the present invention to other occasions without modification, shall be within the protection scope of the present invention.

Claims

1. A photocurable silicone release agent, characterized in that, By weight percentage, it comprises the following components: 58%-68% main resin, 3%-5% dual photoinitiator, 3.5%-4.5% antistatic agent, 6%-9% high-temperature resistant filler, and 1.5%-4% additives, wherein the photosensitizing synergist accounts for 0.5%-1.5% of the total mass of the release agent; The main resin includes acrylate-modified silicone oil and epoxy silicone, and the dual photoinitiator is a free radical-cationic composite photoinitiator.

2. The photocurable silicone release agent according to claim 1, characterized in that, The acrylate-modified silicone oil has a molecular weight of 5500-9500 and an acrylate grafting rate of 12%-18%. The epoxy organosilicon is an epoxy organosilicon oligomer containing an aromatic ring structure.

3. The photocurable silicone release agent according to claim 2, characterized in that, The method for preparing the acrylate-modified silicone oil is as follows: hydroxyl-terminated polydimethylsiloxane and acrylate monomer are reacted at 70-90℃ for 3-5 hours under the action of a catalyst. The mass ratio of hydroxyl-terminated polydimethylsiloxane to acrylate monomer is 10:1-3, and the amount of catalyst used is 0.5%-1.5% of the total mass of the reactants.

4. The photocurable silicone release agent according to claim 2, characterized in that, The preparation method of the epoxy organosilicon is as follows: methylphenylcyclosiloxane, octamethylcyclotetrasiloxane and phenyl glycidyl ether siloxane are ring-opening polymerized at 80-100℃ for 2-4 hours under the action of a catalyst, wherein the methylphenylcyclosiloxane accounts for 15%-25% of the total mass of the monomers and the phenyl glycidyl ether siloxane accounts for 5%-10% of the total mass of the monomers.

5. The photocurable silicone release agent according to claim 1, characterized in that, The dual photoinitiator includes a free radical photoinitiator and a cationic photoinitiator, wherein the free radical photoinitiator is selected from at least one of 1-hydroxy-cyclohexyl-phenyl ketone, 2-hydroxy-2-methyl-1-phenyl-1-propanone, and 2,4,6-trimethylbenzoyl-diphenylphosphine oxide; The cationic photoinitiator is selected from at least one of diaryliodomonium salts and triarylthiomonium salts; the photosensitizer is selected from at least one of tertiary amine compounds and anthraquinone derivatives.

6. The photocurable silicone release agent according to claim 5, characterized in that, The free radical photoinitiator is a silane-modified photoinitiator, and its preparation method is as follows: A free radical photoinitiator and a vinyl-containing short-chain siloxane are subjected to an addition reaction at 50-70°C for 1-2 hours in the presence of a catalyst. The mass ratio of the free radical photoinitiator to the vinyl-containing short-chain siloxane is 10:1-2, and the amount of catalyst used is 0.001%-0.005% of the total mass of the reactants. The short-chain siloxane is a polysiloxane segment containing 3-5 siloxane bonds.

7. The photocurable silicone release agent according to any one of claims 1-6, characterized in that, The antistatic agent is conductive nanoparticles, which are carbon nanotubes surface-treated with a silane coupling agent. And / or, the high-temperature resistant filler is nano-silica with a particle size of 55-95 nm, which has been surface-treated with a silane coupling agent. And / or, the additives may further include at least one of leveling agents, polymerization inhibitors, and dispersants.

8. A process for preparing a photocurable silicone release agent, used to prepare the photocurable silicone release agent as described in any one of claims 1-7, characterized in that, Includes the following steps: (1) Raw material preparation: Solid raw materials are processed, and the surface of high-temperature resistant fillers is modified to prepare silane-modified free radical photoinitiators; (2) Mixing and stirring: The main resin, the dispersant in the additives, the treated high-temperature resistant filler and the conductive particles in the antistatic agent are mixed and stirred in sequence. Then, the dual photoinitiator, the remaining components in the antistatic agent, the photosensitizing synergist in the additives and other additives are added and stirred to obtain a mixture. (3) Coating and curing: The mixture obtained in step (2) is coated on the surface of the substrate and cured by UV to form a coating. The coating is used to ensure complete separation of the material from the mold.

9. The process method according to claim 8, characterized in that, In step (1), the solid raw material is pulverized to a particle size of less than 10 μm using an air jet mill; The high-temperature resistant filler is nano-silica, and its surface modification process is as follows: nano-silica, silane coupling agent and anhydrous ethanol are mixed in proportion, stirred and reacted at 52-58℃ for 2.2-2.8 hours, and after separation, washing and drying, surface-modified nano-silica is obtained. The silane coupling agent is γ-aminopropyltriethoxysilane, and the mass ratio of nano-silica, silane coupling agent and anhydrous ethanol is 1:(0.06-0.07):5; And / or, in step (2), the specific process of mixing and stirring is as follows: First, add the main resin to the dispersion vessel and stir at 110-140 rpm for 35-55 minutes. Then, add the dispersant and stir for 8-15 minutes. Next, add the high-temperature resistant filler and conductive particles, increase the speed to 2100-2400 rpm, and disperse at high speed for 45-55 minutes. Then, reduce the speed to 110-140 rpm, add the dual photoinitiator, photosensitizer and other additives, and continue stirring for 45-55 minutes. And / or, the coating formed by the UV-curable silicone release agent after UV curing has a mass loss rate of ≤1% and a surface resistivity of ≤10 after being placed at 200°C for 24 hours. 10 Ω / sq, release force is (5-20) N / 25 mm, and the extract content after soaking in toluene for 24 hours is ≤0.01%.

10. The application of a photocurable silicone release agent as described in any one of claims 1-7, characterized in that, The photocurable silicone release agent is used as a release medium between the mold and the molding material in the processes of electronic component packaging, optical film preparation, or composite material molding.

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