Feeding device, film forming device, and holding member

Abstract

The invention provides a supply device, a film forming device and a holding member which can uniformly expose a part of a large number of electronic components for film forming through a simple mechanism. The supply apparatus according to an embodiment supplies an electronic component to a film forming processing unit of a film forming apparatus for forming a film on the electronic component, and includes: a mask having a mask hole covering a portion of the electronic component, the mask being supplied to the film forming processing unit in a state in which the electronic component is passed through the mask hole and held; a first holder that holds one surface of the mask and contacts one end of the electronic component that passes through the mask hole; a second holder that holds the other surface of the mask and contacts the other end of the electronic component that passes through the mask hole; and an inversion mechanism that inverts the mask in a state in which the mask is sandwiched between the first stage and the second stage.

Description

[0001] This application is a divisional application of the original application, application number 202211593491.6, filed on December 13, 2022, entitled "Supply Device, Film Forming Device and Holding Member". Technical Field

[0002] The present invention relates to a supply device, a film-forming device, and a holding member. Background Technology

[0003] Currently, chip-shaped electronic components with external electrodes at both ends are very common in various electronic circuits. For example, a chip capacitor is formed by dividing a block of dielectric sheet with internal electrodes formed thereon into rectangular parallelepiped-shaped pieces. External electrodes are formed by covering the two sides of this rectangular parallelepiped-shaped component and connecting it to the internal electrodes with a conductive material.

[0004] As shown in Patent Document 1, the method for forming an external electrode involves the following steps: inserting and holding a strip that covers a portion of an electronic component into a through hole; using a part press-in pin of a part press-in machine to move the electronic component apart within the through hole, thereby exposing a portion of the electronic component (head exposed); and attaching (forming a film) a conductive material paste to the exposed portion to form an external electrode.

[0005] [Existing Technical Documents]

[0006] [Patent Literature]

[0007] [Patent Document 1] Japanese Patent Application Publication No. 09-22846 Summary of the Invention

[0008] [The problem the invention aims to solve]

[0009] However, in the method described above, the protruding length (length of the exposed portion) of each electronic component's head is determined based on the pressing amount of the pressing pins, etc. Therefore, in order to form an external electrode for each electronic component while suppressing deviation, the protruding lengths of all electronic components need to be aligned within a certain range. However, adjusting the movement of the pressing pins in the component pressing machine is very difficult. Since most electronic components are very small, the mask used to cover a portion of them must be very thin. Therefore, the mask may bend and deform due to pressing, and the relative positions of the electronic components and the pressing pins in each mask hole, which are through holes, can easily become different. As a result, the movement of the pressing pins must be changed according to the deformed area, making the adjustment complicated. This situation becomes even more problematic when a large number of electronic components are inserted into the mask holes and fed to a film-forming device for uniform film-forming processing.

[0010] The embodiments of the present invention are proposed to solve the problems of the prior art as described above, and the purpose is to provide a supply device, a film forming device and a holding member that can uniformly expose a portion of a large number of electronic components from a mask for film formation through a simple mechanism.

[0011] [Technical means to solve the problem]

[0012] To achieve the aforementioned objective, one embodiment is a supply device that supplies the electronic component to a film-forming processing unit of a film-forming apparatus for forming a film on an electronic component. The supply device includes: a mask having a mask aperture covering a portion of the electronic component, such that the electronic component passes through the mask aperture and is held in place while being supplied to the film-forming processing unit; a first receiving platform holding one side of the mask and contacting one end of the electronic component passing through the mask aperture therewith; a second receiving platform holding the other side of the mask and contacting the other end of the electronic component passing through the mask aperture therewith; and a reversing mechanism that reverses the mask while it is held between the first receiving platform and the second receiving platform.

[0013] Furthermore, the film-forming apparatus of the embodiment includes: the supply device; and a film-forming processing unit for forming a film on the electronic component.

[0014] Moreover, one embodiment is a holding member for holding the electronic component by sputtering a film onto a portion of the electronic component. The holding member includes: a mask having a plurality of mask holes covering a portion of the electronic component, through which the electronic component passes and is held; and a support platform holding the mask and contacting the end of the electronic component passing through the mask holes, the mask holes being an inner diameter through which the electronic component can pass, and the axial length being the same as the length of the unsputtered area of ​​the electronic component.

[0015] [The effects of the invention]

[0016] According to embodiments of the present invention, a supply device, a film-forming device, and a holding member are provided that can uniformly expose a portion of a large number of electronic components for film formation through a simple mechanism. Attached Figure Description

[0017] Figure 1 These are perspective views (A), sectional views (B), and perspective views (C) showing the state in which the electronic component, which is the object of supply, is inserted into the mask hole in the embodiment.

[0018] Figure 2 This is a partial perspective plane showing the structure of the film-forming apparatus in the embodiment.

[0019] Figure 3These are a plan view (A) and a partial cross-sectional side view (B) of the supply device according to the embodiment.

[0020] Figure 4 It means Figure 3 (A) and Figure 3 Partial cross-sectional side view (A) of the electronic component (B) during its storage, and partial cross-sectional side view (B) showing its supply.

[0021] Figure 5 These are the plan view (A) and the arrow view (B) of the slide.

[0022] Figure 6 These are the plan view (A) and the BB arrow view (B) of the mask.

[0023] Figure 7 These are the plan view (A) and the sectional view (B) shown by the arrow of the bearing platform.

[0024] Figure 8 This is a partial cross-sectional side view showing the following states: (A) the bearing table is held on the temporary platform by the bearing table placement part; (B) the bearing table is placed in the bearing table placement station by the held bearing table placement part; (C) the bearing table on the upper side of the bearing table removal station is removed by the bearing table removal part; and (D) the bearing table that has been removed is placed on the temporary platform.

[0025] Figure 9 This is a partial cross-sectional side view showing the following states: standby state of the reversing mechanism (A), state in which the bearing platform is transferred from the thruster to the reversing mechanism (B), retraction state of the thruster (C), state in which the bearing platform is reversing (D), state in which the reversal is completed (E), state in which the bearing platform is transferred from the reversing mechanism to the thruster (F), and state in which the thruster places the bearing platform on the rotary table (G).

[0026] Figure 10 It is a plan view showing the release state (A), holding state (B), reversing state (C), and release state (D) of the bearing platform using the reversing mechanism.

[0027] Figure 11 The diagram shows a plan view of the standby state of the discharge mechanism (A), a partial cross-sectional side view of the adsorption state of the electronic components (B), and a partial cross-sectional side view of the release state of the electronic components (C).

[0028] Figure 12 These are a plan view (A) and a partial sectional side view (B) of the inspection device.

[0029] Figure 13 A cross-sectional view showing the pretreatment section and film-forming section of the film-forming apparatus.

[0030] Figure 14 (A) Figure 14 (D) is an explanatory diagram showing the operation of moving electronic components into and out of the film-forming section via the loading interlock vacuum chamber using the infeed and outfeed section.

[0031] Figure 15 This is a cross-sectional view showing the mask in standby state (A) and the mask assembled in the slide (B).

[0032] Figure 16 This is a cross-sectional view showing the state (A) where the adsorption part is positioned on the mask and the state (B) where the electronic component is dropped.

[0033] Figure 17 This is a cross-sectional view showing the state of the mask leaving the slide (A) and the state of the slide moving horizontally (B).

[0034] Figure 18 This is a cross-sectional view showing the state (A) where excess electronic components have been adsorbed, and the state (B) where the thruster is lowered and the support platform 250 is held in the holding hole.

[0035] Figure 19 (A) Figure 19 (G) is an explanatory diagram showing the sequence of supplying electronic components to the mask.

[0036] Figure 20 (A) Figure 20 (C) is an explanatory diagram showing the order in which the mask is reversed.

[0037] Figure 21 (A) Figure 21 (H) is an explanatory diagram showing the sequence of mounting and dismounting the support platform.

[0038] [Explanation of Symbols]

[0039] 1: Film forming device

[0040] 2: Supply device

[0041] 2a: Shell

[0042] 3: Film Forming Processing Section

[0043] 4: Control device

[0044] 31: Chamber

[0045] 32: Transport Department

[0046] 33: Pre-processing Department

[0047] 34, 35: Film-forming part

[0048] 210: Containment Department

[0049] 211: Container

[0050] 211a, 225, 245: Partitions

[0051] 211b: Inclined surface

[0052] 212, 510: Support platform

[0053] 212a: Feet

[0054] 220: Slide

[0055] 221, 241, 251: plate body

[0056] 222: Slide hole

[0057] 223: next door

[0058] 230: Vibration Mechanism

[0059] 231: Vibration table

[0060] 231b: Reception port

[0061] 232: Abutment

[0062] 240: Mask

[0063] 242: Mask hole

[0064] 243: Restriction Hole

[0065] 244: Beam section

[0066] 250, 250A, 250B: Supporting platform

[0067] 252, 261c: Support section

[0068] 253: Restriction Section

[0069] 260: Interval Adjustment Section

[0070] 261, 294, 295, 296, 324, 371: Thrusters

[0071] 261a: Platform

[0072] 261b, 551a, Axc, Axm, Axs: Axes

[0073] 261d: Conductor

[0074] 261e: Movable body

[0075] 262, 322, 520: Driver source

[0076] 270: Mobile mechanism

[0077] 280: Transfer mechanism

[0078] 281, 601: Picking mechanism

[0079] 282, 602: Guiding institutions

[0080] 283, 603: Moving bodies

[0081] 284, 604: Adsorption section

[0082] 284a, 604a: Adsorption plates

[0083] 284b, 604b: Support plate

[0084] 284c, 293a, 411, 421, 604c: Supports

[0085] 285, 605: Adsorption force imparting part

[0086] 285a, 605a: Magnetic components

[0087] 285b, 605b: Retention plate

[0088] 285c, 605c: Connecting / Disconnecting Mechanism

[0089] 286, 606: Supporting sections

[0090] 287, 607: Arm

[0091] 288, 608: Guidance Department

[0092] 290: Transporting organization

[0093] 291: Motor

[0094] 291a, 530: Rotation axis

[0095] 292, 321: Rotary table

[0096] 292a: Retaining Hole

[0097] 293: Temporary Table

[0098] 311: Exhaust section

[0099] 323: Sealing body

[0100] 331: Processing Room

[0101] 341, 351: Film-forming chamber

[0102] 342, 352: Target

[0103] 360: Moving in and out department

[0104] 361, 412, 422: Arm

[0105] 362: Maintain body

[0106] 370: Loading the interlocked vacuum chamber

[0107] 400: Moving mechanism of the bearing platform

[0108] 410: Supporting platform mounting section

[0109] 413, 423: Maintaining the section

[0110] 420: Disassembly section of bearing platform

[0111] 500: Reversing Mechanism

[0112] 540: Conducting part

[0113] 550: Maintaining the organization

[0114] 551: Keep arm

[0115] 552: Drive Unit

[0116] 600: Discharge mechanism

[0117] 610: Recycling Containers

[0118] 700: Testing Agency

[0119] 710: Supporting Frame

[0120] 720: Filming Department

[0121] C: Electronic components

[0122] Dx: Distance traveled

[0123] Dz: Interval

[0124] E: Electrode

[0125] En: Internal electrode

[0126] F: Face

[0127] H: Retaining component

[0128] h: position

[0129] P1: Transfer location

[0130] P2: Supply Location

[0131] P3: Position of the support platform

[0132] P4: Reverse position

[0133] P5: Disassembly location of the bearing platform

[0134] P6: Discharge Location

[0135] P7: Check location

[0136] R: Electrode formation region

[0137] X, Y, Z: Direction. Detailed Implementation

[0138] The embodiments of the present invention (hereinafter referred to as the embodiments) will be described in detail with reference to the accompanying drawings.

[0139] [Electronic Components]

[0140] like Figure 1 As shown in (A), the electronic component C formed by the film in this embodiment is a chip-shaped electronic component C with electrodes E formed at both ends using conductive material. Thus, the electronic component C has one end forming the electrode E and the other end forming the electrode E. Components such as capacitors, resistors, coils, and inductors are included in the electronic component C. The electronic component C has a cuboid shape, a cube shape, or a thin plate shape, and the electrodes E are formed in close proximity to each other in a box-like manner, covering a region containing a pair of opposite side surfaces. The region where the electrode E is formed is designated as the electrode forming region R.

[0141] Figure 1 (B) is a cross-sectional view of an electronic component C formed by stacking dielectric sheets with internal electrodes En. A pair of electrodes E formed on the outer surface of the electronic component C is a multilayer structure consisting of overlapping layers of conductive material, electrically connected to the internal electrodes En. In this embodiment, copper (Cu) is deposited on titanium (Ti), which serves as a seed layer for electrodes E, on the titanium (Ti) base layer used to improve adhesion. Subsequently, copper (Cu) is deposited on the electrode formation region R using electrolytic plating, with the seed layer as a seed, thereby completing the formation of the electronic component C with electrodes E. Since the base layer or seed layer also becomes part of the electrodes E, the deposition of these layers will be described as "deposition of electrodes E" in the following description of this embodiment.

[0142] Furthermore, in the following description, the straight line passing through the center of the pair of sides covered by electrode E will be referred to as the axis Axc of electronic component C. In this embodiment, for example, electronic component C can be a very small electronic component with a length of 0.6 mm in the axis Axc direction, a length of 0.2 mm in the axis Axc direction of electrode E, and a rectangular cross-section of 0.3 mm × 0.3 mm orthogonal to the axis Axc of electrode E. However, the present invention can be applied to electronic components C that are smaller or larger than the aforementioned electronic component.

[0143] [summary]

[0144] like Figure 2 As shown, the film-forming apparatus 1 of this embodiment includes a supply device 2, a film-forming treatment unit 3, and a control device 4. For example... Figure 1 As shown in (C), the supply device 2 supplies the electronic component C to the film forming processing unit 3 by inserting it into the mask hole 242, covering the area other than one of the electrode forming regions R. The film forming processing unit 3 forms a film of electrode material in the exposed electrode forming region R. Furthermore, in the following description, the horizontal alignment direction of the supply device 2 and the film forming processing unit 3 is defined as the Y direction, the horizontal direction orthogonal to it is defined as the X direction, and the vertical direction is defined as the Z direction. The electronic component C is inserted into the mask hole 242 with its axis Axc along the Z direction. Furthermore, as described below, the mask hole 242 is provided in the mask 240.

[0145] [Supply device]

[0146] like Figure 2 , Figure 3 (A) Figure 3 (B) Figure 4 (A) Figure 4 As shown in (B), the supply device 2 includes a receiving section 210 housed within the housing 2a, a slide 220, a vibration mechanism 230, a mask 240, a receiving platform 250, an interval adjustment section 260, a moving mechanism 270, a transfer mechanism 280, a conveying mechanism 290, a receiving platform moving mechanism 400, a reversing mechanism 500, a discharge mechanism 600, and a detection mechanism 700. Hereinafter, the conveying mechanism 290, which conveys the mask 240 and the like to each structural part, will be described, followed by descriptions of the other structural parts.

[0147] (Transportation agency)

[0148] like Figure 2 , Figure 3 (A) Figure 3 As shown in (B), the conveying mechanism 290 is a mechanism that conveys a mask 240 with electronic components C inserted in the mask hole 242 between the supply device 2 and the film forming processing unit 3. The conveying mechanism 290 of this embodiment includes a rotary table 292 that rotates intermittently by a motor 291. The rotation shaft 291a of the motor 291 is a hollow cylindrical shape (see reference). Figure 8 (A) Figure 8(D)). A plurality of holding holes 292a, which serve as through holes, are formed at equal intervals on the rotary table 292. The support table 250 is held through the holding holes 292a. For example, each holding hole 292a is arranged with an orientation parallel to the tangent of the circle in the circumferential direction of the rotary table 292, and is provided at equal intervals in the circumferential direction. Furthermore, in this embodiment, eight holding holes 292a are provided, so eight masks 240 are held on the rotary table 292 at 45° intervals. A step (see reference) is formed on the inner edge of the holding holes 292a to hold the support table 250 on which the masks 240 are placed. Figure 3 (B)

[0149] Furthermore, as described below, a temporary stage 293 is provided at the center of the rotary table 292. The temporary stage 293 serves as a platform for temporarily placing either the support stage 250A or the support stage 250B of the mask 240. For example... Figure 8 (A) Figure 8 As shown in (D), the temporary platform 293 is a circular plate-like body, which is horizontally supported and fixed by the support column 293a. The support column 293a is erected independently of the rotation axis 291a by passing through the interior of the rotation axis 291a, so that even if the rotating platform 292 rotates, the temporary platform 293 does not rotate.

[0150] like Figure 2 As shown, the supply device 2 is equipped with a transfer station P1, a supply station P2, a receiving table placement station P3, a reversal station P4, a receiving table disassembly station P5, a discharge station P6, and an inspection station P7. Each station P1 to P7 is a station in the supply device 2 that performs various processes on the mask holding the electronic component C before or after film formation using the film formation processing unit 3. The rotary table 292 repeatedly rotates and stops intermittently to ensure that each holding hole 292a of the rotary table 292 is located at each station. In this embodiment, Figure 2 Rotate clockwise. The following describes each workstation from P1 to P7.

[0151] The transfer station P1 is a station equipped with the transfer mechanism 280 described below, which transfers the electronic component C between the receiving part 210 and the slide 220 before film formation.

[0152] The supply station P2 is a station for transferring electronic components C between the film-forming treatment unit 3 and the supply device 2. That is, the supply station P2 is a station for supplying electronic components C from the supply device 2 to the film-forming treatment unit 3, or for returning electronic components C that have completed film formation by the film-forming treatment unit 3 to the supply device 2.

[0153] The bearing platform placement station P3 is a bearing platform placement part 410 equipped with the bearing platform moving mechanism 400 described below, which places the bearing platform 250B placed on the temporary stage 293 onto the mask 240 of the rotary stage 292.

[0154] Reversing station P4 is a station equipped with the reversing mechanism 500 described below, which reverses the mask 240, into which the electronic component C is inserted, so that it is held by two support tables 250A and 250B. Reversing station P4 is provided with a pusher 295 (see reference) that moves the support tables 250A and 250B holding the mask 240 between the holding hole 292a of the rotary table 292 and the reversing mechanism 500. Figure 9 (A) Figure 9 (G)).

[0155] The bearing table disassembly station P5 is a bearing table disassembly unit 420 equipped with the bearing table moving mechanism 400 described below. It is a station where the bearing table 250A, which is reversed to the upper side, is disassembled from the mask 240 and placed on the temporary stage 293.

[0156] The discharge station P6 is equipped with the discharge mechanism 600 described below, which removes and discharges the film-coated electronic component C from the mask 240. The discharge station P6 is provided with a pusher 296 (see below) that moves the receiving platform 250 carrying the mask 240 between the holding hole 292a of the rotary table 292 and the discharge mechanism 600. Figure 11 (A) Figure 11 (C)).

[0157] Inspection station P7 is equipped with the inspection mechanism 700 described below, and is a station for inspecting whether there are any electronic components C that have not been discharged by the discharge mechanism 600 and remain in the mask 240 (see reference). Figure 12 (A) and Figure 12 (B)

[0158] Next, the mechanisms configured at each station P1 to station P7 of the supply device 2 will be explained. First, the main use... Figure 3 (A) Figure 5 (B) describes the transfer station P1 and the receiving part 210, chute 220, vibration mechanism 230, interval adjustment part 260, moving mechanism 270 and transfer mechanism 280 arranged nearby.

[0159] (Containment Department)

[0160] The receiving section 210 houses multiple electronic components C before electrode E is formed, i.e., before film formation. The receiving section 210 includes a container 211 and a support platform 212. The container 211 is a box-shaped body with an open top, and multiple recessed sections 211a are provided at its horizontal inner bottom. The multiple sections 211a are arranged in a matrix, and each section 211a houses multiple pre-placed electronic components C. A portion of the inner surface of the container 211 is structured as an inclined surface 211b sloping inwards towards the bottom, allowing electronic components C placed from the upper edge of the container 211 to slide inwards towards the bottom. The support platform 212 is a platform that supports the container 211 horizontally, such as... Figure 3 As shown in (B), it is provided on the mounting surface of the supply device 2 by means of four feet 212a.

[0161] (Slide)

[0162] The chute 220 guides the multiple electronic components C transferred from the receiving section 210 to each of the multiple mask holes 242. For example... Figure 5 (A) Figure 5 As shown in (B), the slide 220 includes a plate 221, slide holes 222, and partition walls 223. The plate 221 is a rectangular plate. The slide holes 222 are multiple holes through which electronic components C can pass one by one. Each slide hole 222 extends along a direction orthogonal to the surface of the plate 221, guiding the passing electronic component C to the mask hole 242. The slide hole 222 is a frustum-shaped quadrangular pyramid that expands towards the side where the electronic component C is inserted, i.e., the upper end side, to facilitate the entry of the electronic component C. Furthermore, the straight line in the Z direction passing through the center of the slide hole 222 is designated as axis Axs.

[0163] The partition walls 223 are arranged in a grid pattern on the surface of the plate 221. Multiple rectangular areas surrounded by the partition walls 223 constitute multiple partitions 225 arranged in a matrix. Multiple sliding holes 222 are formed in a matrix within each partition 225. That is, the partition walls 223 include multiple sliding holes 222, forming partitions 225 for supplying electronic components C. The positions of each partition 225 correspond one-to-one with the positions of each partition 211a of the receiving portion 210.

[0164] The interior of the slide 220 is divided into multiple sections 225 by the partition walls 223. Thus, when the electronic component C is guided to the mask hole 242, as described below, even if the slide 220 vibrates, the electronic component C supplied to each section 225 is prevented from moving to other sections 225 by the partition walls 223, and instead enters the slide hole 222 within each section 225. Therefore, when the slide 220 vibrates, it is possible to suppress the uneven distribution of the electronic component C by moving to other areas.

[0165] Furthermore, in order to supply and arrange a large number of electronic components C at once, the plate 221 of the chute 220 has a large area, which may lead to deflection, bending, or strain. If deflection, bending, or strain occurs, the electronic components C will shift towards a specific part of the plate 221 and cannot be supplied evenly to the mask holes 242. Spacer walls 223 are provided throughout the area of ​​the plate 221 where the electronic components C are supplied, thereby acting as beams to increase the strength of the plate 221 and prevent deflection, bending, or strain.

[0166] Furthermore, the positions of each partition 225 of the slide 220 correspond one-to-one with the positions of each partition 211a of the receiving section 210. In addition, multiple electronic components C are pre-quantitatively allocated to each partition 211a of the receiving section 210 for reception. The electronic components C received in each partition 211a are adsorbed and moved to the corresponding partition 225 of the slide 220, thereby enabling multiple electronic components C to be evenly distributed within the surface of the slide 220.

[0167] (Vibration Mechanism)

[0168] The vibration mechanism 230 facilitates the insertion of the electronic component C into the mask hole 242 by vibrating the slide 220 or the mask 240 described below. Figure 3 (A) Figure 3 As shown in (B), the vibration mechanism 230 includes a vibration table 231 and a base 232. The vibration table 231 is a horizontally oriented plate. The base 232 is disposed on the mounting surface of the supply device 2 and supports the vibration table 231 at a position offset from the slide 220 along the X direction. That is, it is arranged in conjunction with the conveying mechanism 290 described below. Furthermore, the vibration table 231 is supported on the base 232 such that one end coincides with the mask 240 conveyed by the conveying mechanism 290 when viewed from above. A receiving hole 231b is provided in the portion of the vibration table 231 that coincides with the mask 240 conveyed by the conveying mechanism 290 when viewed from above, for the mask 240 and the receiving platform 250 described below to be inserted. The slide 220 is supported on the vibration table 231 in the horizontal direction above the receiving hole 231b.

[0169] The vibration table 231 is configured to vibrate by actuating an oscillator built into the base 232. Thus, the slide 220 supported by the vibration table 231 vibrates together with the vibration table 231. Furthermore, the vibration is transmitted to the mask 240 and the support platform 250, which are in contact with the slide 220, causing them to vibrate as well. The oscillator can be, for example, an electromagnetic coil, a motor, or a piezoelectric element. The vibration direction and intensity can be appropriately set.

[0170] (mask)

[0171] like Figure 6 (A) Figure 6As shown in (B), the mask 240 includes a plate 241, mask holes 242, limiting holes 243, and beams 244. The plate 241 is a circular plate-shaped member. The mask holes 242 are multiple holes through which electronic components C are inserted one by one via groove holes 222 overlapping grooves 220 of the mask 240, and covering a portion of the electronic components C. Each mask hole 242 is a prismatic shape that penetrates in a direction orthogonal to the surface of the plate 241 and whose vertical axis Axc is consistent with that of the inserted electronic component C. The vertical line passing through the center of the mask hole 242 is designated as axis Axm. The length of the mask hole 242 in the direction of axis Axm is shorter than the length of the electronic component C in the direction of axis Axc. More specifically, the length of the mask hole 242 in the direction of axis Axm is the same as the length of the electronic component C in the direction of axis Axc other than one of the electrode forming regions R. That is, the length of the mask hole 242 in the Axm direction is the same as the length of the unsputtered area in the Axc direction of the electronic component C (refer to...). Figure 1 (C)).

[0172] The size of the cross-section orthogonal to the axis Axm of the mask hole 242 is sufficient to allow the electronic component C to be inserted due to its own weight, with axis Axc in a vertical direction. Specifically, the inner diameter of the mask hole 242 should be large enough for the electronic component C to pass through. The cross-section orthogonal to the axis Axm of the mask hole 242 should be slightly larger than the cross-section orthogonal to the axis Axc of the electronic component C, but smaller than the size required for the component to be inserted at an angle relative to the vertical direction. However, it should be set to be larger than the size required for insertion.

[0173] Furthermore, when the electrode E is formed by sputtering as described below, the size of the cross section orthogonal to the axis Axm of the mask hole 242 is preferably smaller than the size of the film-forming material entering from the gap formed between the mask hole 242 and the electronic component C.

[0174] In this embodiment, the mask hole 242 connects to the support platform 250 through the lower end of the inserted electronic component C, while covering other areas with only the electrode forming area R on the upper side exposed (see reference). Figure 1 (C)). Multiple mask holes 242 are arranged in a matrix within multiple partitions 245 arranged in a matrix. The position of each partition 245 is consistent with the position of the partition 225 of the slide 220 that overlaps with it, and the position of the mask hole 242 in each partition 245 is consistent with the position of the slide hole 222 in each partition 225. That is, the axis Axm of the mask hole 242 is consistent with the axis Axs of the slide hole 222, and the opening at the lower end of the mask hole 242 matches the opening at the upper end of the slide hole 222 without any horizontal offset (XY direction, θ direction), so the electronic component C can pass through.

[0175] The limiting hole 243 is a through hole used to align the mask 240 with the support platform 250 and prevent positional displacement by inserting the limiting portion 253 of the support platform 250 described below. In this embodiment, the limiting hole 243 is cylindrical in shape, corresponding to the shape of the limiting portion 253. The beam portion 244 is a thin plate that is fixed on the lower surface of the plate 241 in such a way that the wall thickness increases in areas other than the partition 245, thereby increasing the strength of the plate 241 and preventing bending or strain.

[0176] (Supporting platform)

[0177] The support platform 250 is a platform that holds one or more sides of the mask 240 and is in contact with one or more ends of the electronic component C inserted into the mask hole 242. In this embodiment, the electronic component C is inserted into the mask hole 242 in a vertical direction, so one end of the electronic component C in contact with the support platform 250 is the lower end, and the other end on the opposite side is the upper end. In the following description, one end of the electronic component C and the end of the corresponding mask hole 242 are referred to as the lower end, and the other end of the electronic component C and the end of the corresponding mask hole 242 are referred to as the upper end. Moreover, one side of the mask 240 held from below by the support platform 250 is referred to as the lower surface, and the other side on the opposite side is referred to as the upper surface. However, the orientation of the electronic component C, the mask 240, and the mask hole 242 is not limited to this. Furthermore, it is possible that either end of the electronic component C becomes one end (lower end) and the other end (upper end) due to its insertion toward the mask hole 242. There is a possibility that either side of the mask 240 can become one side (lower surface) or the other side (upper surface) due to inversion.

[0178] In this embodiment, as described below, when the mask 240 is reversed, a pair of support platforms 250A and 250B are used to clamp the mask 240 (see reference). Figure 20 (A) Figure 20 (C)). A pair of support platforms 250A and 250B can be switched to the following states: a state in which the lower end of the electronic component C passing through the mask hole 242 contacts the lower surface of the mask 240; and a state in which the upper end of the electronic component C passing through the mask hole 242 contacts the upper surface of the mask 240.

[0179] The bearing platforms 250A and 250B, which serve as the first bearing platform 250 and the second bearing platform 250, have the same shape. In the following description, bearing platforms 250A and 250B are referred to as bearing platform 250 without distinguishing between them. The bearing platforms 250 in this embodiment are all of the same size and shape, and the function is the same regardless of which one is used. However, for the sake of easy understanding of the reversing operation, Figure 10 (A) Figure 10 (D) Figure 21(A) Figure 21 In (H), the shaded circle represents the bearing platform 250A, and the black circle represents the bearing platform 250B.

[0180] Furthermore, the so-called electronic component C penetrates through the mask hole 242, such as Figure 1 As shown in (C), as long as the lower end face of the electronic component C inserted into the mask hole 242 is at least in the same plane as the surface of the mask 240, the lower end face of the electronic component C does not necessarily protrude from the mask hole 242.

[0181] like Figure 7 (A) Figure 7 As shown in (B), the support platform 250 includes a plate 251, a support portion 252, and a limiting portion 253. The plate 251 is a circular plate-shaped member with the same diameter as the mask 240. The support portion 252 is a rectangular plate-shaped body fixed to one side of the plate 251. When the mask 240 is overlapped on the support platform 250, the support portion 252 is provided at the lower end of the mask holes 242 in each section 245. Furthermore, the support portion 252 is provided at a position where the mask 240 does not overlap with the beam portion 244.

[0182] The limiting unit 253 limits (specifies) the spacing between the overlapping bearing platforms 250A and 250B (see reference). Figure 20 (A) Figure 20 (B)). In this embodiment, the limiting part 253 is provided such that it protrudes from the opposing surfaces of the overlapping support platforms 250A and 250B, and is at the same height. More specifically, the limiting part 253 is a cylindrical pin that protrudes in the same direction as the support part 252 fixed to one side of the plate 251. The limiting parts 253 of the support platforms 250A and 250B are in contact with each other when the support platforms 250A and 250B are clamped in the mask 240 into which the electronic component C is inserted. The front ends of the pins protruding from the limiting parts 253 of the support platforms 250A and 250B are at the same height from the respective support parts 252. Furthermore, the limiting part 253 is provided at a position corresponding to the limiting hole 243 of the mask 240, and by inserting it into the limiting hole 243, the support platform 250 and the mask 240 are aligned during movement, and positional displacement is prevented.

[0183] Furthermore, the holding member H is formed by either the support platform 250A or the support platform 250B and the mask 240 supported thereon. That is, with the electronic component C inserted into the mask hole 242 of the mask 240 of the holding member H, a film is formed in the film forming process unit 3 for the electrode forming region R exposed from the mask hole 242.

[0184] (Interval Adjustment Section)

[0185] Interval adjustment section 260 (reference) Figure 3 (B) The spacing between the opposing surfaces of the slide 220 and the mask 240 is adjusted. Specifically, as described below, the spacing between the slide 220 and the mask 240 is adjusted in a manner that includes a position where the mask 240 contacts the slide 220 (first position), a position where the slide 220 and the mask 240 move horizontally relative to each other (second position), and a position where the mask 240 and the support platform 250 are held in the holding hole 292a (third position). That is, the spacing adjustment unit 260 of this embodiment is a lifting mechanism that moves the support platform 250 and the mask 240 up and down between the first position, the second position, and the third position.

[0186] Furthermore, the first position is the position where the electronic component C is inserted from the groove 220 into the mask 240 by vibration (see reference). Figure 9 (A) Figure 9 The second position is when the mask 240 is separated from the groove 220 by an interval Dz, so that the upper end of the electronic component C inserted into the mask 240 does not interfere with the groove 220 (the position where the groove 220 and the mask 240 can move horizontally relative to each other) (see reference). Figure 10 (A) Figure 10 (D)), the third position is the standby position when the slide 220 and the mask 240 are separated (refer to... Figure 18 (B)

[0187] Furthermore, in order to ensure that the upper end of the electronic component C in the second position does not interfere with the groove 220, the moving distance (the amount of the interval Dz) when the groove 220 and the mask 240 move relative to each other in the vertical direction (Z direction, the axis Axs direction of the groove hole 222) via the interval adjustment part 260 is more than or equal to the length of the electrode forming region R in the axis Axc direction and less than or equal to the length of the electronic component C in the axis Axc direction (see reference). Figure 17 (A) Figure 19 (D)).

[0188] The electrode forming region R is the region where the electrode E is formed, and therefore corresponds to a pair of electrodes. Therefore, a region is needed between the pair of electrode forming regions R where the + and - of the two electrodes E are separated. Thus, the electrode forming region R becomes a region that retains the interval necessary to achieve this electrode separation. For example, it could also be only on the lower surface F (refer to...). Figure 1One electrode E is formed by (C), and a gap is provided at the corner where the side surface connects to the surface F. The rest of the portion is used as the other electrode E. That is, if the film-forming region (electrode-forming region R) is used as a reference, the interval Dz will not exceed the length of the electronic component C in the axis Axc direction. It is preferable to set the position as close as possible to the length of the electrode-forming region R in the axis Axc direction, taking into account positioning errors during movement. Furthermore, it is preferable to set the interval Dz to a distance that allows the electronic component C contained in the mask hole 242 to be absorbed without being absorbed when suctioned from above.

[0189] The interval adjustment unit 260 includes a pusher 261 and a drive source 262. The pusher 261 includes a mounting platform 261a that carries the support platform 250 and a shaft 261b that supports the mounting platform 261a. The drive source 262 is a motor that raises and lowers the shaft 261b.

[0190] (Mobile organization)

[0191] The moving mechanism 270 is a mechanism that moves the slide 220 and the mask 240 relative to each other in the horizontal direction without interfering with the upper end of the electronic component C and the slide 220, by offsetting the axis Axs of the slide hole 222 from the axis Axm of the mask hole 242 (see reference). Figure 17 (B) Figure 19 (E)). In this embodiment, the moving mechanism 270 is provided between the mounting stage 261a and the shaft 261b, and the bearing stage 250 and the mask 240 are moved along the X direction by moving the mounting stage 261a. The moving mechanism 270 can be, for example, a cylinder.

[0192] To achieve this movement, a support 261c, a guide 261d, and a movable body 261e (see reference) are further provided between the platform 261a and the shaft 261b. Figure 15 (A) Figure 17 (B) The support 261c is a plate-shaped member connected to the shaft 261b in a manner facing the mounting platform 261a. The guide 261d is a rod-shaped member fixed to the support 261c in a manner extending along the X direction. The movable body 261e is a member having a recess that can be slidably inserted into the guide 261d. The recessed portion of the movable body 261e is inserted into the guide 261d, and the portion on the opposite side of the recessed portion is fixed to the mounting platform 261a.

[0193] The cylinder, serving as the moving mechanism 270, is fixed to the support 261c at a position capable of pressing the movable body 261e. By pressing the movable body 261e using the moving mechanism 270, the movable body 261e and the mounting platform 261a connected thereto move along the guide 261d. For example, the moving mechanism 270 moves a distance Dx approximately half the horizontal length of the mask hole 242, causing the axis Axs of the slide hole 222 to be misaligned with the axis Axm of the mask hole 242.

[0194] (Transfer mechanism)

[0195] The transfer mechanism 280 is a mechanism for transferring electronic components C between the receiving section 210 and the slide 220. The transfer mechanism 280 is also a removal mechanism for removing electronic components C other than those inserted into the mask hole 242 from the slide 220. Figure 3 (A) Figure 3 (B) Figure 4 (A) Figure 4 As shown in (B), the transfer mechanism 280 includes a picking mechanism 281 and a guiding mechanism 282.

[0196] The pickup mechanism 281 is a mechanism for picking up electronic component C from the receiving section 210 or the slide 220. The pickup mechanism 281 includes a moving body 283, an adsorption section 284, and an adsorption force applying section 285. The moving body 283 moves between the receiving section 210 and the slide 220. The moving body 283 is shaped like a prism on a sector-shaped pyramid and serves as a base member supporting the adsorption section 284 and the adsorption force applying section 285. The moving body 283 is configured to move between the receiving section 210 and the slide 220 via a guide mechanism 282.

[0197] The adsorption unit 284 is a unit for adsorbing electronic component C in order to pick up electronic component C. The adsorption unit 284 includes an adsorption plate 284a, a support plate 284b, and a support column 284c. The adsorption plate 284a is a component for adsorbing electronic component C. The adsorption plate 284a is a rectangular plate-shaped body respectively disposed in the slide groove 220 at positions corresponding to each partition 225, and adsorbs electronic component C by applying magnetic force from the adsorption force imparting unit 285 described below. The horizontal plane of the adsorption plate 284a is smaller than the area surrounded by the partition wall 223 so as to be able to approach the slide groove hole 222 of each partition 225. In addition, the position of each adsorption plate 284a also corresponds to each partition 211a of the container 211.

[0198] The support plate 284b is a rectangular plate-shaped body on which the adsorption plate 284a is mounted. The support plate 284b is the entire size of the area covering the groove hole 222 where the groove 220 is formed. The adsorption plate 284a and the support plate 284b are formed in such a way that they are thick enough to allow magnetic force to pass through. The material of the adsorption plate 284a and the support plate 284b is not particularly limited and can be metal or non-metal such as resin. For example, stainless steel can be used as the adsorption plate 284a and the support plate 284b. The pillar 284c is a pillar that fixes the support plate 284b to the movable body 283. The upper end of the pillar 284c is fixed to the bottom of the movable body 283, and the lower end is fixed to the support plate 284b. Thus, the support plate 284b is supported horizontally at a distance from the bottom surface of the movable body 283.

[0199] The adsorption force applying part 285 applies an adsorption force to the adsorption plate 284a. The adsorption force applying part 285, via the support plate 284b, applies a magnetic force to the surface of the adsorption plate 284a facing the receiving part 210 for adsorbing the electronic component C. The adsorption force applying part 285 includes a magnetic member 285a, a holding plate 285b, and a contact / separation mechanism 285c. The magnetic member 285a is, for example, a permanent magnet. The horizontal plane of the magnetic member 285a is the same size as that of the adsorption plate 284a. The holding plate 285b is the same size as the support plate 284b of the adsorption part 284 and is disposed between the support plate 284b and the bottom of the moving body 283. On the holding plate 285b, the magnetic members 285a are respectively mounted at positions corresponding to each adsorption plate 284a, via the support plate 284b.

[0200] The contact / separation mechanism 285c performs the adsorption and release of electronic component C by moving the magnetic member 285a relative to the adsorption plate 284a. In this embodiment, the contact / separation mechanism 285c is provided at the bottom of the moving body 283 and supports the magnetic member 285a in a way that allows it to be raised and lowered. For example, a cylinder is used as the contact / separation mechanism 285c. The contact / separation mechanism 285c supports the holding plate 285b in the horizontal direction, causing the magnetic member 285a to descend and contact the support plate 284b, thereby allowing the adsorption plate 284a to exert the magnetic force through the support plate 284b. Furthermore, the contact / separation mechanism 285c raises the magnetic member 285a and removes it from the support plate 284b, thereby losing the magnetic force in the adsorption plate 284a.

[0201] The guiding mechanism 282 is a mechanism that moves the movable body 283 between the receiving section 210 and the slide 220. The guiding mechanism 282 includes a support section 286, an arm section 287, and a guiding section 288. The support section 286 is a pair of corner pillar members erected on the support platform 212 of the receiving section 210. The arm section 287 is a horizontal corner pillar member supported by the support section 286, extending from above the container 211 to above the receiving hole 231b of the vibration table 231. The guiding section 288 is a dual-axis movement mechanism composed of linear guides in the X and Z directions, and is provided on the arm section 287. The movable body 283 is supported on the guiding section 288 via a slider. Thus, the guiding mechanism 282 can transfer the electronic component C adsorbed by the adsorption section 284 between the receiving section 210 and the slide 220.

[0202] Furthermore, the supply device 2 includes a transfer section that transfers a mask 240, which holds the electronic component C in a certain state, to the film forming processing section 3. For example... Figure 14 (A) Figure 14 As shown in (D), this embodiment includes a pusher 294 as a conveying unit. That is, a pusher 294 is provided at the supply station P2, which moves the receiving platform 250A carrying the mask 240 between the holding hole 292a of the rotary table 292 and the loading / unloading unit 360 described below.

[0203] like Figure 14 (A) Figure 14 As shown in (D), the pusher 294 includes a lifting mechanism (not shown) that is in the raised position when the receiving platform 250 carrying the mask 240 is transferred to the loading / unloading section 360. Figure 14 (A)) and the retracted position below the retaining hole 292a of the rotary table 292 ( Figure 14 (B) Figure 14 The rise and fall between (D)).

[0204] Main use Figure 8 (A) Figure 8 (D) describes the bearing platform moving mechanism 400, which is configured with the bearing platform at the loading station P3 and the bearing platform disassembly station P5.

[0205] (Moving mechanism of the receiving platform)

[0206] The support platform moving mechanism 400 is a mechanism that moves other support platforms 250 from the temporary stage 293 and places them on the support platform 250 on which the mask 240 is mounted. That is, the support platform moving mechanism 400 is configured such that the mask 240 is held between two support platforms 250, causing the support platforms 250 to overlap vertically. Furthermore, the support platform moving mechanism 400 uses the reversing mechanism 500 described below to reverse the vertically overlapping pair of support platforms 250, thereby moving the upper support platform 250 of the pair to the temporary stage 293. Figure 2 As shown, the bearing platform moving mechanism 400 includes a bearing platform mounting part 410 and a bearing platform disassembly part 420.

[0207] The bearing table placement unit 410 is positioned so that the bearing table 250 can move between the bearing table placement station P3 and the temporary stage 293. Figure 8 (A) indicates that the receiving platform 250 (250B) on the temporary platform 293 is held in place by the receiving platform mounting section 410. Figure 8 (B) indicates the state of the bearing table 250 placed in the bearing table placement station P3 (the state of bearing table 250B placed on bearing table 250A through mask 240).

[0208] As mentioned above, such as Figure 8 (A) Figure 8 As shown in (B), the receiving table placement unit 410 moves the receiving table 250 from the temporary table 293 and places it on the receiving table 250 on which the mask 240 is mounted for inversion. Thus, at the receiving table placement station P3, the mask 240 is clamped between the two receiving tables 250. The receiving table placement unit 410 includes a support column 411, an arm 412, and a holding part 413. The support column 411 is a member erected vertically near the rotary table 292 in the receiving table placement station P3. The arm 412 is a member with one end supported by the support column 411 and the other end extending horizontally to the temporary table 293. The holding part 413 is a robotic arm that is movable horizontally along the arm 412 and is capable of being raised and lowered. The holding part 413 includes a suction mechanism that holds and releases the receiving table 250 from above. In addition to a suction mechanism that uses negative pressure, the mechanism for holding the bearing platform 250 in the holding section 413 can also be an adsorption mechanism that uses electrostatic force or magnetic force, or a mechanical holding mechanism.

[0209] The bearing table disassembly unit 420 is positioned to allow the bearing table 250 to move between the bearing table disassembly station P5 and the temporary table 293. Figure 8 (C) is a partial cross-sectional side view showing the state of the upper support table 250 (250A) in the support table disassembly station P5, which is disassembled by the support table disassembly section 420. Figure 8(D) is a partial cross-sectional side view showing the state in which the bearing platform 250 (250A) is placed on the temporary platform 293.

[0210] like Figure 8 (C) Figure 8 As shown in (D), the bearing platform disassembly unit 420 reverses the overlapping pair of bearing platforms 250, moving the upper bearing platform 250 of the pair to the temporary stage 293. Thus, at the bearing platform disassembly station P5, a mask 240 is mounted on a bearing platform 250 different from the one mounted before the reversal. For example, a mask 240 with an electronic component mounted on bearing platform 250A is reversed and mounted on bearing platform 250B. The bearing platform disassembly unit 420 includes a support column 421, an arm 422, and a retaining part 423. The support column 421 is a member erected vertically near the rotary table 292 in the bearing platform disassembly station P5. The arm 422 is a member with one end supported by the support column 421 and the other end extending horizontally to the temporary stage 293. The retaining part 423 is a robotic arm that is movable horizontally along the arm 422 and capable of being raised and lowered. The holding part 423 includes a suction mechanism that holds and releases the support platform 250 from above. The holding mechanism of the holding part 423 is the same as that of the holding part 413, and can be an adsorption mechanism or a holding mechanism.

[0211] Main use Figure 9 (A) Figure 9 (G) describes the reversing mechanism 500 configured at the reversing station P4.

[0212] (Reversal mechanism)

[0213] The reversing mechanism 500 is a mechanism that reverses the mask 240 by having it held in place by a pair of support platforms 250. For example... Figure 9 (A) Figure 9 As shown in (G), the reversing mechanism 500 includes a support platform 510, a drive source 520, a rotating shaft 530, a transmission part 540, and a holding mechanism 550. The support platform 510 is a component erected near the rotary table 292 in the reversing station P4. The drive source 520 is a motor that rotates a horizontally oriented shaft supported by the support platform 510. The rotating shaft 530 is a shaft supported horizontally by the upper end of the support platform 510 in a rotatable manner.

[0214] The transmission unit 540 transmits the rotation of the shaft of the drive source 520 to the rotating shaft 530. The transmission unit 540 is a belt drive mechanism that transmits power via belts mounted on pulleys respectively mounted on the shaft of the drive source 520 and the rotating shaft 530. Alternatively, the drive source 520 can be a motor directly connected to the rotating shaft 530, i.e., the rotating shaft 530 is rotated by direct drive. In this case, the transmission unit 540 can be omitted.

[0215] like Figure 10 (A) Figure 10 As shown in (D), the holding mechanism 550 is a mechanism for holding a pair of support platforms 250 of the clamping mask 240. The holding mechanism 550 includes a pair of holding arms 551, a shaft 551a, and a drive unit 552.

[0216] A pair of retaining arms 551 can grip and release the pair of support tables 250 of the mask 240 by moving relative to the drive unit 552 along the direction of contact / separation with the edges of the pair of support tables 250 via a shaft 551a. The retaining arms 551 have a first contact surface that contacts the upper surface of the upper support table 250 and a second contact surface that contacts the lower surface of the lower support table 250, and the first contact surface and the second contact surface grip the edges of the pair of support tables 250 from above and below.

[0217] Shafts 551a are respectively mounted between a pair of retaining arms 551 and connected to a drive unit 552. The drive unit 552 includes a pressure cylinder and a compression spring, which can move the pair of shafts 551a respectively mounted on the pair of retaining arms 551 along their axial direction to adjust the distance between the pair of retaining arms 551.

[0218] Thus, the pair of retaining arms 551 move relative to each other in a direction that is in contact with / separated from the edges of the pair of bearing tables 250, for example, to a retaining position that can hold the bearing tables 250. Figure 10 (B) Figure 10 (C) and the release position that is released upon separation from the bearing platform 250. Figure 10 (A) Figure 10 The movement between (D) is configured such that the holding position and the release position of the bearing platform 250 on the holding arm 551 of the rotary table 292 are the same in the Z-axis direction (height direction). The movement of the bearing platform 250 between the rotary table 292 and position h is as follows: Figure 9 (A) Figure 9 As shown in (B), this is done by using the pusher 295 to raise and lower the support platform 250.

[0219] Main use Figure 11 (A) Figure 11 (C) describes the discharge mechanism 600 configured at the discharge station P6.

[0220] (Discharge mechanism)

[0221] The discharge mechanism 600 is a mechanism that discharges and recycles the completed film-forming electronic component C through the mask hole 242. For example... Figure 11 (A) Figure 11 (B) Figure 11 As shown in (C), the discharge mechanism 600 includes a pick-up mechanism 601, a guide mechanism 602, and a recovery container 610. The electronic component C, after film formation, is recovered into the recovery container 610. The pick-up mechanism 601 picks up the electronic component C by adsorbing and holding it using a mask 240, and releases the adsorption and holding using the recovery container 610, opening it. The guide mechanism 602 moves the pick-up mechanism 601 between the mask 240 and the recovery container 610 located at the discharge station P6. The pick-up mechanism 601 includes a moving body 603, an adsorption section 604, and an adsorption force application section 605. Furthermore, the discharge mechanism 600 has essentially the same structure as the transfer mechanism 280. That is, the pickup mechanism 601 and the guide mechanism 602 have the same structure as the pickup mechanism 281 and the guide mechanism 282, and the moving body 603, the adsorption part 604, and the adsorption force imparting part 605 have the same structure as the moving body 283, the adsorption part 284, and the adsorption force imparting part 285 of the transfer mechanism 280.

[0222] The movable body 603 is configured to move between the mask 240 and the recovery container 610 on the receiving table 250 located at the discharge station P6 via the guide mechanism 602. The recovery container 610 is a box-shaped body with an open top. The adsorption section 604 includes an adsorption plate 604a, a support plate 604b, and a support column 604c. The adsorption plate 604a is provided corresponding to each section 245 of the mask 240. The adsorption force imparting section 605 includes a magnetic member 605a, a holding plate 605b, and a contact / separation mechanism 605c. The adsorption plate 604a, support plate 604b, and support column 604c have the same structure as the adsorption plate 284a, support plate 284b, and support column 284e. The magnetic member 605a, holding plate 605b, and contact / separation mechanism 605c have the same structure as the magnetic member 295a, holding plate 285b, and contact / separation mechanism 285e.

[0223] The guiding mechanism 602 includes the same support portion 606, arm portion 607, and guiding portion 608 as the support portion 286, arm portion 287, and guiding portion 288. The guiding mechanism 602 can transfer the electronic component C adsorbed by the adsorption portion 604 between the mask 240 and the recycling container 610.

[0224] Main use Figure 12 (A) and Figure 12 (B) describes the testing mechanism 700 configured at the inspection station P7.

[0225] (Testing agency)

[0226] The testing unit 700 checks whether any electronic component C remains on the mask 240 after being discharged through the discharge mechanism 600. For example... Figure 12 (A) Figure 12 As shown in (B), the detection mechanism 700 includes a support frame 710 extending from near the rotary table 292 to above the holding hole 292a, and an imaging unit 720 supported by the support frame 710. The imaging unit 720 is a camera configured to face downwards so as to have a field of view capable of capturing the entire area of ​​the mask hole 242 where the mask 240 is formed.

[0227] Next, use Figure 2 , Figure 13 The film-forming treatment unit 3 will be described below. Furthermore, for ease of understanding and convenience, Figure 13 Will Figure 2 The diagram shows the arrangement of the pretreatment section 33, the film-forming section 34, and the film-forming section 35.

[0228] [Film Forming Treatment Department]

[0229] The film formation processing unit 3 is an apparatus that uses plasma to form a film on the portion exposed from the mask hole 242 of the electronic component C, namely the electrode formation region R. For example... Figure 2 , Figure 13 As shown, the film-forming treatment unit 3 includes a chamber 31, a conveying unit 32, a pretreatment unit 33, a film-forming unit 34, and a film-forming unit 35. The chamber 31 is a container capable of creating a vacuum inside through exhaust from the exhaust unit 311. The exhaust unit 311 includes piping (not shown) and an exhaust circuit connected to the exhaust port. The conveying unit 32 includes a rotary table 321, a drive source 322, a sealing body 323, and a pusher 324.

[0230] The rotary table 321 is a circular platform that intermittently rotates and moves the receiving table 250, which is loaded into the chamber 31, to various parts such as the pretreatment section 33, the film-forming section 34, the film-forming section 35, and the loading interlocking section described below. The sealing body 323 is a component used to seal each part and isolate it from the chamber 31. The sealing body 323 is placed on the receiving table 250 and held by holding holes equally spaced on the rotary table 321. The pusher 324 moves the sealing body 323 up and down at positions corresponding to each part of the film-forming treatment section 3.

[0231] The pretreatment unit 33 performs surface treatment on the electrode formation region R using plasma. Surface treatment, for example, is ion bombardment treatment, in which the surface of the electrode formation region R is cleaned by ions generated by the plasma in the process gas. The pretreatment unit 33 includes a processing chamber 331 disposed on the top side of the chamber 31 and sealed by a rising sealing body 323, which performs surface treatment on the electrode formation region R exposed from the mask 240.

[0232] Film-forming sections 34 and 35 perform film-forming treatment on the electrode formation region R of electronic component C through sputtering. Sputtering is a process in which film-forming material ejected from targets 342 and 352 is deposited on the surface of the electrode formation region R by ions generated by plasma in the sputtering gas. Film-forming sections 34 and 35 include film-forming chambers 341 and 351, which are disposed on the top side of chamber 31 and sealed by a rising sealing body 323, and perform film-forming treatment on the electrode formation region R exposed from mask 240.

[0233] Targets 342 and 352, containing film-forming material, are provided in film-forming chambers 341 and 351. Targets 342 and 352 are components formed from film-forming material deposited onto electronic component C by sputtering. Targets 342 and 352 are held by a backing plate (not shown) and connected to a power source via electrodes. For example, Ti is used as the base layer film-forming material, and Cu, Au, Ag, etc., are used as the seed layer of electrode E. However, various materials can be used as long as they are materials capable of forming a film by sputtering. Furthermore, in this embodiment, the base layer is formed in film-forming section 34, and the seed layer of electrode E is formed in film-forming section 35. For example, titanium (Ti) is used as the base layer material, and copper (Cu) is used as the seed layer material of electrode E.

[0234] Furthermore, in this embodiment, two film-forming sections 34 and 35 are provided to form the base layer and the seed layer. However, if the base layer is not required, only one film-forming section may be provided. Moreover, if more layers of film are required, two or more film-forming sections may be provided.

[0235] Furthermore, such as Figure 2 and Figure 14 (A) Figure 14 As shown in (D), the film forming processing unit 3 includes a loading interlock vacuum chamber 370, which realizes the loading and unloading of the receiving platform 250 carrying the mask 240 while maintaining the vacuum in the loading and unloading section 360 and the chamber 31 where the receiving platform 250 carrying the mask 240 is loaded and unloaded relative to the chamber 31.

[0236] The loading / unloading section 360 includes an arm 361 and a holding body 362. The arm 361 is an elongated member disposed between the supply device 2 and the chamber 31 along a direction parallel to the plane of the rotary table 321. The arm 361 is configured such that it can be rotated intermittently in 180° increments around an axis parallel to the rotation axis of the rotary table 321 by a drive mechanism (not shown) and can move along said axis.

[0237] The retainer 362 is a component disposed at both ends of the arm 361 and holds the bearing platform 250. The retainer 362 holds the bearing platform 250 by a retaining mechanism such as a vacuum chuck, an electrostatic chuck, or a mechanical chuck. The retainer 362 also functions as a cover for the switch-load interlock vacuum chamber 370. That is, the retainer 362 is provided with sealing materials such as O-rings to seal the load interlock vacuum chamber 370.

[0238] The loading interlock vacuum chamber 370 enables the loading and unloading of the receiving platform 250 while maintaining a vacuum within the chamber 31. The loading interlock vacuum chamber 370 is a space that can be sealed by being surrounded by a through hole in the chamber 31, a retainer 362 of the loading / unloading section 360, and the inner surface of a sealing body 323 of the chamber 31. A thruster 371 is provided within the chamber 31 to move the sealing body 323 up and down at a position corresponding to the loading interlock vacuum chamber 370.

[0239] In addition, although not shown, the loading interlock vacuum chamber 370 is provided with an exhaust line connected to the air pressure circuit as a path for depressurizing the sealed loading interlock vacuum chamber 370, and a ventilation line connected to a valve or the like for breaking the vacuum in the loading interlock vacuum chamber 370.

[0240] [Control Device]

[0241] Control device 4 is a device that controls the various parts of film-forming apparatus 1 (see reference). Figure 2 The control device 4 may include, for example, a computer running a predetermined program. The control device 4 is executed by a processing device such as a programmable logic controller (PLC) or a central processing unit (CPU).

[0242] For example, the control device 4 controls the vibration of the vibration table 231 caused by the vibration mechanism 230 through the procedure described above, the lifting and lowering of the support table 250 and the mask 240 by the interval adjustment section 260, the movement of the slide 220 by the moving mechanism 270, the input and removal of electronic components C by the transfer mechanism 280, the conveying by the support table 250 by the conveying mechanism 290, the input and output of the support table 250 relative to the chamber 31 by the inlet and outlet section 360 and the loading interlock vacuum chamber 370, the plasma treatment by the pretreatment section 33, the film formation treatment by the film formation section 35, and the conveying by the support table 250 by the conveying section 32.

[0243] Furthermore, the control device 4 controls the movement of the bearing platform 250 using the bearing platform moving mechanism 400, the reversal of the mask 240 using the reversing mechanism 500, the discharge of the electronic component C using the discharge mechanism 600, and the detection of the presence or absence of the electronic component C using the detection mechanism 700.

[0244] [action]

[0245] In addition to the above Figure 1 (A) Figure 14 In addition to (D), refer to Figure 15 (A) Figure 21 The explanatory diagram (H) illustrates the process of forming a film on the electronic component C using the film-forming apparatus 1 of this embodiment as described above. Furthermore, as a prerequisite for this explanation, such as... Figure 4 As shown in (A), multiple electronic components C are pre-placed into the container 211 of the receiving section 210, and the multiple electronic components C are housed in each partition 211a. The number of electronic components C housed in each partition 211a is greater than the number of groove holes 222 in each partition 225 of the groove 220 and the number of mask holes 242 in each partition 245 of the mask 240. Moreover, by grinding or the like using a flat plate, the positions of the electronic components C housed in each partition 211a can be averaged so that they are evenly close within each partition 211a.

[0246] Moreover, such as Figure 15 As shown in (A), a receiving platform 250 on which a mask 240 is mounted is placed on the mounting platform 261a of the thruster 261. At this time, the mask 240 and the receiving platform 250 are aligned and misalignment is prevented by inserting the limiting portion 253 of the receiving platform 250 into the limiting hole 243 of the mask 240. Furthermore, as... Figure 15As shown in (B), the stage 261a is raised by the pusher 261 at the transfer station P1, thus setting it to the first position where the lower surface of the mask 240 contacts the slide 220. At this time, the lower end of the slide hole 222 matches the upper end of the mask hole 242. Moreover, at this time, the overlapping area of ​​the slide hole 222 and the mask hole 242 becomes a plane F (refer to the direction orthogonal to the axis Axc of the electronic component C). Figure 1 The area of ​​(C) is larger than the area of ​​(C).

[0247] also, Figure 21 (A) Figure 21 (H) is an explanatory diagram showing the sequence of mounting and dismounting of the receiving platform 250. More specifically, it is a diagram explaining the process of transporting the receiving platform 250, which holds the mask 240 with the completed film of the electronic component C, from the supply station P2 through the reversing station P4 to the discharge station P6. Figure 21 (A) Figure 21 (H) focuses on a particular mask 240 to explain the process. In the supply device 2 of this embodiment, when all masks 240 are mounted on the holding holes 292a of the rotary table 292, the rotary table 292 stops (positions) at each station P1 to station P7 and performs repeated rotational transport.

[0248] First, the operation of supplying electronic component C to mask 240 will be explained. For example... Figure 4 As shown in (A), the moving part 283 of the pickup mechanism 281 moves horizontally via the guide mechanism 282 and is positioned above the container 211. At this time, the holding plate 285b is lowered by the contact / separation mechanism 285c, and the magnetic component 285a contacts the support plate 284b. As a result, the magnetic attraction force acts on the adsorption plate 284a via the support plate 284b.

[0249] The retaining hole 292a is positioned directly below the receiving hole 231b of the vibration table 231 whenever the rotary table 292 stops due to intermittent rotation. Figure 3 (A) Figure 3 (B) indicates that the support platform 250, on which the mask 240 containing the inserted electronic component C is mounted, is held by the holding hole 292a and positioned directly below the receiving hole 231b. In this state, as Figure 4 As shown in (A), the pusher 261 of the interval adjustment unit 260 moves the receiving platform 250 carrying the mask 240 between the holding hole 292a and the receiving hole 231b of the rotary table 292. As a result, it is brought into a state where the slide 220 is in approximately contact with the mask 240.

[0250] Next, the guide mechanism 282 lowers the movable body 283 of the pickup mechanism 281, thereby bringing each adsorption plate 284a close to each section 211a of the container 211. Thus, each adsorption plate 284a magnetically attracts and holds multiple electronic components C. Then, the guide mechanism 282 raises the movable body 283 of the pickup mechanism 281 to pick up the electronic components C from the container 211. Afterward, the movable body 283 moves horizontally via the guide mechanism 282 and is positioned above the chute 220. Furthermore, as... Figure 4 (B) Figure 16 (A) Figure 19 As shown in (A), the moving body 283 descends and the adsorption plate 284a approaches each section 225 of the chute 220.

[0251] Subsequently, as Figure 16 (B) Figure 19 As shown in (B), the holding plate 285b is raised by the contact / separation mechanism 285c, and the magnetic member 285a leaves the support plate 284b, thereby releasing the magnetic force acting on each adsorption plate 284a. Therefore, the electronic component C adsorbed by each adsorption plate 284a falls into each section 225 of the chute 220. Then, the moving body 283 is raised by the guide mechanism 282, thereby retracting the adsorption plates 284a from each section 225 of the chute 220. In this way, the electronic component C is supplied to the chute 220. Afterwards, the holding plate 285b is lowered by the contact / separation mechanism 285c, and the magnetic member 285a contacts the support plate 284b, thereby restoring the state where the magnetic force acts on each adsorption plate 284a.

[0252] Then, the vibration table 231 is vibrated by the vibration mechanism 230, thereby causing the slide 220, the mask 240, and the support platform 250 to vibrate. Thus, as... Figure 19 As shown in (C), the electronic components C housed in each partition 225 of the slide 220 enter one by one from the upper end of the slide hole 222. As they pass through the slide hole 222, they are guided to fall into the mask hole 242 with the axis Axc in a vertical direction.

[0253] The electronic component C entering the mask hole 242 is connected to the support portion 252 of the support platform 250 through its lower end, with only the electrode forming region R on the upper side exposed from the mask hole 242. However, the electrode forming region R exposed from the mask hole 242 enters the slide hole 222. Moreover, sometimes the electronic component C entering the slide hole 222 is also mounted on the electronic component C entering the mask hole 242.

[0254] Next, as Figure 17 (A) Figure 19As shown in (D), the stage 261a is lowered by the spacing adjustment part 260, thereby causing the mask 240 to move away from the lower surface of the slide 220 to a second position. The distance Dz at this time is set to be equal to the height of the electrode forming region R exposed from the mask hole 242. Therefore, the boundary between the electronic component C entering the slide hole 222 and the electronic component C entering the mask hole 242 is on the same plane as the lower surface of the slide 220, allowing the slide 220 to move horizontally.

[0255] Then, as Figure 17 (B) Figure 19 As shown in (E), the support platform 250, on which the mask 240 is mounted, is moved along the X direction by a distance Dx via the moving mechanism 270. The moving distance Dx is approximately half the horizontal length of the mask hole 242. In this way, by misaligning the axis Axs of the slide hole 222 with the axis Axm of the mask hole 242, the electronic component C entering the mask hole 242 is prevented from falling out, and the bottom surface of the slide 220 restricts the vertical movement of the electronic component C entering the mask hole 242.

[0256] Furthermore, the moving distance Dx is not limited to half the horizontal length of the mask hole 242. It is sufficient to prevent the electronic component C from falling out of the slide hole 222 and to limit the vertical movement of the electronic component C entering the mask hole 242. To prevent the electronic component C from moving between the slide hole 222 and the mask hole 242, it is sufficient to move to a position where the area of ​​the overlapping surface of the slide hole 222 and the mask hole 242 is smaller than the area of ​​the surface F in the direction orthogonal to the axis Axc of the electronic component C.

[0257] In the stated state, such as Figure 18 (A) Figure 19 As shown in (F), the moving body 283 is moved above the chute 220 by the guide mechanism 282 and then descends, thereby causing the adsorption plates 284a to descend and approach the sections 225 of the chute 220. Thus, each adsorption plate 284a uses magnetic force to adsorb and hold the electronic components C in each section 225. At this time, the magnetic force to be adsorbed acts not only on the electronic components C entering the chute hole 222, but also on the electronic components C entering the mask hole 242. However, the electronic components C entering the mask hole 242 are not adsorbed because their movement is restricted by the chute 220. Then, the moving body 283 is raised by the guide mechanism 282, picking up the electronic components C from the chute 220 and removing them. Afterwards, the moving body 283 moves horizontally by the guide mechanism 282 and moves horizontally above the container 211. Then, the moving body 283 descends, and the adsorption plates 284a approach the sections 211a of the container 211 (see reference). Figure 4 (B) Figure 4(A)).

[0258] Subsequently, the holding plate 285b is raised by the contact / separation mechanism 285c, and the magnetic component 285a moves away from the support plate 284b, thereby releasing the magnetic force acting on each adsorption plate 284a. As a result, the electronic component C adsorbed by each adsorption plate 284a falls into each section 211a of the container 211. Then, the moving body 283 is raised by the guide mechanism 282, thereby retracting the adsorption plates 284a from each section 211a of the container 211. This removes the electronic component C from the chute 220.

[0259] Next, as Figure 18 (B) Figure 19 As shown in (G), the mounting stage 261a of the pusher 261 descends, and the receiving stage 250 on which the mask 240 is mounted descends, reaching a third position where the receiving stage 250 is held in the holding hole 292a of the rotary table 292. Thus, the mask 240, with the electronic component C inserted into the mask hole 242, is supplied to the rotary table 292 together with the receiving stage 250. Furthermore, the moving mechanism 270 returns the receiving stage 250 on which the mask 240 is mounted to its initial position.

[0260] Then, it descends via the pusher 261, retracting from the receiving platform 250 and the rotary table 292. Furthermore, by intermittently rotating the rotary table 292, the receiving platform 250, held by the holding hole 292a, is positioned at the supply station P2. The loading / unloading unit 360 moves the receiving platform 250, positioned at the supply station P2 and carrying the mask 240 holding the electronic component C, into the chamber 31 via the loading interlock vacuum chamber 370. The moved-in receiving platform 250 is held on the rotary table 321 in a state of being mounted on the sealing body 323.

[0261] Specifically, when the support stage 250, which holds the mask 240 containing the electronic component C, is moved in, such as Figure 14 As shown in (A), in the chamber 31 of the film-forming treatment unit 3, the lower end of the loading interlock vacuum chamber 370 is sealed by the sealing body 323, which is subjected to force by the pusher 371. Furthermore, the chamber 31 is made into a vacuum through exhaust treatment by the air pressure circuit. Moreover, the loading / unloading unit 360 positions the retaining bodies 362, which are provided at both ends of the arm 361, at the upper part of the loading interlock vacuum chamber 370 and the supply station P2.

[0262] In the supply station P2, the pusher 294 applies force to the support platform 250, which holds the mask 240 containing the electronic component C, causing it to rise. This pushes the support platform 250 to a raised position for conveying to the loading / unloading section 360, and then to the holding body 362 of the loading / unloading section 360. The holding body 362 holds the conveyed support platform 250. After the support platform 250 is conveyed to the loading / unloading section 360, the pusher 294 descends, retracting to a retracted position below the holding hole 292a of the rotary table 292. Figure 14 (B) Figure 14 (D)).

[0263] like Figure 14 As shown in (B), by rotating the arm 361 of the loading / unloading section 360, the receiving platform 250 is positioned facing the opening at the top of the loading interlock vacuum chamber 370. Then, as... Figure 14 As shown in (C), arm 361 descends, and retainer 362 seals the upper end of load-interlocked vacuum chamber 370. Thus, load-interlocked vacuum chamber 370 is sealed by sealer 323 and retainer 362.

[0264] In this state, air is exhausted from the exhaust line via an air pressure circuit (not shown), thereby depressurizing the loaded interlock vacuum chamber 370 to the same level as that inside chamber 31. The retainer 362 releases the retainer 250, placing the retainer 250 onto the sealing body 323 that seals the loaded interlock vacuum chamber 370. Furthermore, as... Figure 14 As shown in (D), the support platform 250 is mounted on the holding hole of the rotary table 321 by the thruster 371 as it descends.

[0265] In this way, the support stage 250, which holds the mask 240 containing the electronic component C, is moved into the chamber 31 of the film forming processing unit 3.

[0266] like Figure 13 As shown, the rotary table 321 transports the receiving table 250 to the pre-processing section 33 and uses the pusher 324 to raise the sealing body 323, thereby housing the receiving table 250, which carries the mask 240 with the inserted electronic component C, into the processing chamber 331 and sealing it. In the processing chamber 331, the electrode forming area R of the electronic component C exposed from the mask hole 242 is subjected to surface treatment.

[0267] Then, the rotary table 321 sequentially transports the receiving table 250 to the film-forming section 34 and the film-forming section 35. Similarly, the sealing body 323 is raised and sealed by using the pusher 324, and a film is formed on the electrode forming region R in the film-forming chambers 341 and 351. In this embodiment, titanium is formed in the film-forming section 34, and copper is formed in the film-forming section 35.

[0268] Subsequently, the rotary table 321 transports the receiving platform 250, which holds the mask 240 containing the completed electronic component C, to the loading and unloading position corresponding to the loading interlock vacuum chamber 370. Through an action opposite to the loading, the loading and unloading unit 360 removes the receiving platform 250 from the chamber 31 via the loading interlock vacuum chamber 370 (see reference). Figure 14 (D)→ Figure 14 (C)→ Figure 14 (B)→ Figure 14 (A)). The receiving table 250 that is moved out is held by the holding hole 292a of the rotary table 292 located at the supply station P2 of the supply device 2. At this time, in the following description, the receiving table 250 held by the holding hole 292a will be referred to as the receiving table 250A.

[0269] Next, as Figure 21 As shown in (A), the bearing table 250A is positioned at the bearing table placement station P3 by means of the rotary table 292. Then, as... Figure 8 (A) Figure 8 (B) Figure 21 As shown in (B), the receiving platform 250B, which is pre-loaded on the temporary stage 293, is held by the holding part 413 of the receiving platform placement part 410 and overlaps on the mask 240 on the receiving platform 250A.

[0270] Figure 20 (A) is a diagram showing the state in which the bearing platform 250 is superimposed on the mask 240 mounted on the bearing platform 250A by the bearing platform mounting part 410. Figure 20 As shown in (A), the mask 240 is held between a pair of support platforms 250A and support platforms 250B. The limiting portion 253 of the newly overlapping support platform 250B enters the limiting hole 243 of the mask 240 for alignment and to prevent displacement. Moreover, the distance between the two support platforms 250 is defined by abutting against the limiting portion 253 of the opposite support platform 250A.

[0271] The spacing between the two overlapping support platforms 250 is set to be the same as or slightly larger than the axial length of the electronic component C. The two support platforms 250 are of the same shape and size. Therefore, the protrusion of the limiting portion 253 of each support platform 250 is the same. Furthermore, the protrusion of the support portion 252 of each support platform 250 is the same. Therefore, twice the difference in protrusion between the limiting portion 253 and the support portion 252 is set to be the same as or slightly larger than the axial length of the electronic component C. That is, the difference in protrusion between the limiting portion 253 and the support portion 252 is set to be half the length set to be the same as or slightly larger than the axial length of the electronic component C. Moreover, the thickness of the plate body 241 of the mask 240 is thicker than the difference in protrusion between the limiting portion 253 and the support portion 252, but thinner than twice the difference in protrusion between the limiting portion 253 and the support portion 252. This thickness is also the thickness at which the electrode forming region R of the electronic component C is exposed when it overlaps the support portion 252. Because of this dimensional relationship, the limiting part 253 of the other support platform 250 can be inserted into the limiting hole 243 provided in the plate 241 of the mask 240 mounted on one of the support platforms 250. Furthermore, even if the two overlapping support platforms 250 are reversed as a whole, the electrode forming area R at the other end of the electronic component C that is in contact with the other support platform 250 is the same as the amount of exposure before reversal.

[0272] like Figure 9 (A) Figure 21 As shown in (C), the pair of bearing platforms 250A and 250B holding the mask 240 are positioned at the reversing station P4 by the rotary table 292. Then, as... Figure 9 As shown in (B), the pusher 295 raises a pair of support platforms 250A and 250B of the clamping mask 240, such that the distance between the pusher 295 and the holding mechanism 550 is such that the support platforms 250A and 250B can be transferred (the distance between the pusher 295 and the lower support platform 250B in contact), i.e., positioned at position h. The pusher 295 moves upward. Then, a pair of holding arms 551 of the holding mechanism 550 clamp the pair of support platforms 250A and 250B. That is, the pair of holding arms 551 move from... Figure 10 The open position shown in (A) is moved to Figure 10 The position of (B) is maintained. Then, as... Figure 9 As shown in (C), the pusher 295 moves downward in such a way that the distance between the pusher 295 and the holding mechanism 550 is such that a pair of bearing platforms 250A and bearing platform 250B can be reversed.

[0273] Next, as Figure 9 (D) Figure 9 (E) Figure 10 (C) Figure 21As shown in (D), by rotating the retaining arm 551 by 180°, the pair of bearing platforms 250A and 250B are reversed. Figure 20 (B) is a diagram showing the state of the inverted mask 240 and the support platforms 250A and 250B at this point. Through this inversion, the mask 240 is also inverted, therefore... Figure 20 As shown in (B), the mask 240 descends due to its own weight and comes into contact with the support platform 250 (support platform 250B), which becomes the lower side. As a result, the electrode forming region R on the opposite side of the film formed in the electronic component C is exposed from the upper end of the mask hole 242.

[0274] Then, as Figure 9 As shown in (F), the pusher 295 moves upward with the distance between the pusher 295 and the holding mechanism 550 becoming the distance that allows the transmission of the support platform 250A and the support platform 250B (the distance between the pusher 295 and the lower support platform 250B), i.e., the distance positioned at position h. Then, as... Figure 10 As shown in (D), the pair of retaining arms 551 of the retaining mechanism 550 release the pair of bearing platforms 250A and 250B to the release position, as shown in (D). Figure 9 As shown in (G), the pair of bearing platforms 250A and 250B of the clamping mask 240 are lowered by the pusher 295 and returned to the holding hole 292a of the rotary table 292.

[0275] like Figure 21 As shown in (E), the pair of support platforms 250A and 250B holding the mask 240 are positioned at the support platform disassembly station P5 by the rotary table 292. Then, as... Figure 8 (C) Figure 21 As shown in (F), the support platform 250A, which is held on the upper side by the holding part 423 of the support platform disassembly part 420, is disassembled, as shown in (F). Figure 8 (D) Figure 21 As shown in (G), move it to temporary stage 293 and place it.

[0276] Figure 20 (C) is a diagram showing the state in which the support platform 250A is detached from the mask 240 mounted on the support platform 250B via the support platform removal part 420. Figure 20 As shown in (C), the mask 240 is mounted on a support platform 250B, which is a different support platform from the support platform 250A mounted before the reversal.

[0277] Furthermore, such as Figure 21 As shown in the supply station P2 of (F), the receiving table 250B carrying the reversed mask 240 is moved through the discharge station P6, the inspection station P7, and the transfer station P1 by the rotary table 292 and positioned at the supply station P2.

[0278] Then, at the supply station P2, as described above, the receiving table 250B carrying the inverted mask 240 is moved into the chamber 31 of the film formation processing unit 3 via the loading interlock vacuum chamber 370 through the loading and unloading section 360. Inside the chamber 31, as described above, film formation processing is performed on the exposed electrode formation regions R. That is, film formation processing is performed on the electrode formation regions R at the opposite ends of the electronic component C from the ends where film formation processing has been completed. Thus, electrodes E are formed in the electrode formation regions R at both ends of the electronic component C. Afterwards, the rotating table 292 is returned to the holding hole 292a of the rotating table 292 in the supply station P2 via the loading interlock vacuum chamber 370 through the loading and unloading section 360.

[0279] Furthermore, by means of the rotary table 292, the receiving table 250B, which is equipped with a mask 240 holding an electronic component C and which has undergone film formation treatment on a pair of electrode forming regions R at both ends, rotates intermittently while passing through the receiving table placement station P3, the reversal station P4, the receiving table disassembly station P5, and is positioned at the discharge station P6.

[0280] At the discharge station P6, the electronic component C is discharged from the mask 240 via the discharge mechanism 600. That is, as... Figure 11 As shown in (B), the moving body 603 of the pickup mechanism 601 is in standby position at the discharge station P6. The magnetic component 605a is brought into contact with the support plate 604b via the contact / separation mechanism 605c, resulting in a magnetic attraction force acting on the adsorption plate 604a. In this state, the mask 240 and the receiving platform 250B are raised together and approach the adsorption plate 604a by the pusher 261 at the discharge station P6. Thus, each adsorption plate 604a uses magnetic force to attract and hold multiple electronic components C.

[0281] Then, the mask 240 is lowered and returned to the rotary table 292 by the pusher 261, thereby picking up the electronic component C from the mask 240. As the mask 240 descends, the moving body 603 begins to move horizontally without changing its height via the guide mechanism 602. At this time, in order to allow the electronic component C held by the adsorption plate 604a to pass through without collision, the upper surface of the recovery container 610 is at the same height as the upper surface of the table 292. Thus, when discharging the electronic component C, the time required for the moving body 603 to rise to pick up the electronic component C is eliminated, reducing cycle time. Moreover, by returning the mask 240 to the rotary table 292 while performing this picking action, the rotary table 292 can turn to the next rotation, thus eliminating the need to wait for the action of recovering the moving body 603 to the recovery container 610.

[0282] like Figure 11As shown in (C), after the moving body 603 stops above the recycling container 610, it descends to enter the recycling container 601, and the adsorption plates 604a stop near the bottom of the recycling container 610. The holding plate 605b is raised by the contact / separation mechanism 605c, releasing the magnetic force acting on each adsorption plate 604a, thereby causing the electronic components C adsorbed by each adsorption plate 604a to fall into the recycling container 610. In this way, the electronic components C are released near the bottom of the recycling container 610, thereby reducing damage to the electronic components C. The moving body 603, with the electronic components C released, rises and moves horizontally to above the discharge station P6 and waits. While the moving body 603 returns to the discharge station P6, the mask 240 can be moved to the discharge station P6 via the rotary table 292, thus eliminating the need for additional waiting time.

[0283] Next, the receiving table 250B, which carries the mask 240, is positioned at inspection station P7 using the rotary table 292. At inspection station P7, as... Figure 12 (A) Figure 12 As shown in (B), the imaging unit 720 of the inspection mechanism 700 takes an image of the mask 240. If the control device 4 can extract the electronic component C from the image, and the electronic component C remains, the device is stopped, and the operator removes the electronic component C. Furthermore, the operator can also identify the presence or absence of the electronic component C based on the image displayed on the display device. If no electronic component C remains, the rotary table 292 positions the receiving platform 250B at the transfer station P1. Thereafter, similarly, the electronic component C is transferred to the chute 220 using the transfer mechanism 280. Furthermore, when the processing state of each part of the rotary table 292 is such that the rotary table 292 can rotate, the rotary table 292 can be reversed, thereby expelling the electronic component C, considered to be a remaining component during inspection, again at the discharge station P6 via the discharge mechanism 600.

[0284] [Effect]

[0285] (1) This embodiment is a supply device 2 that supplies electronic component C to the film forming processing section 3 of film forming apparatus 1 for forming film of electronic component C. The supply device 2 includes: a mask 240 having a mask hole 242 covering a portion of the electronic component C, so that the electronic component C is supplied to the film forming processing section 3 in a state where it passes through the mask hole 242 and is held; a first support platform 250 that holds one side of the mask 240 and contacts one end of the electronic component C passing through the mask hole 242 therewith; a second support platform 250 that holds the other side of the mask 240 and contacts the other end of the electronic component C passing through the mask hole 242 therewith; and a reversing mechanism 500 that reverses the mask 240 in a state where the mask 240 is held by the first support platform 250 and the second support platform 250.

[0286] The film-forming apparatus 1 of this embodiment includes a supply device 2 and a film-forming processing unit 3 for forming films on electronic components C.

[0287] Therefore, a supply device 2, a film-forming device 1, and a holding member H can be manufactured that can uniformly expose a portion of a large number of electronic components C for film formation through a simple mechanism. Specifically, the protruding length of the head of the electrode formation region R exposed from the mask hole 242 at the upper end of the electronic component C can be defined by the receiving table 250 that contacts the lower end of the electronic component C, so the position can be easily adjusted by a simple mechanism. This is effective when a portion of a large number of electronic components C is uniformly exposed from the mask 240 for film formation. Moreover, by using the receiving table 250 to clamp the mask 240 and reverse it, it is possible to switch which end of the electronic component C's electrode formation region R is exposed without replacing the electronic component C in the mask hole 242, thus making film formation at both ends of the electronic component C easier. Furthermore, since there is no situation where the surface of the completed film formation of the electronic component C is squeezed out and the opposite side protrudes, it is possible to prevent damage to the surface of the completed film formation of the electronic component C when replacing the electronic component C.

[0288] (2) The first support platform 250 and the second support platform 250 have the same shape. Therefore, it is not necessary to distinguish between the upper support platform 250 and the lower support platform 250, and there is no need to prepare different support platforms 250. Thus, the placement positions of the support platforms 250 can be common, thereby suppressing the expansion of the installation area of ​​the device and making the management of the support platforms 250 easier. In particular, the upper surface of the support platform 250 is covered by the mask 240 during film formation, so there is less adhesion of film-forming material, and it is not necessary to distinguish between used and unused materials.

[0289] (3) When the mask 240 is reversed, the distance between the first support platform 250 and the second support platform 250 that are in contact with the electronic component C is the same as or slightly larger than the length of the electronic component C in the axis Axc direction. Therefore, not only the lower end of the electronic component C that has completed film formation, but also the upper end can be made to contact the support platform 250 or be reversed with a slight gap. This prevents the upper end from colliding strongly with the support platform 250 during reversal, and prevents friction or damage to the film formation surface caused by the collision.

[0290] (4) The first support platform 250 and the second support platform 250 include a limiting part 253, which limits (defines) the distance between the position of contact with the electronic component C by being in contact with each other in a state of clamping the mask 240. Therefore, the first support platform 250 and the second support platform 250 can be positioned relative to the mask 240 to prevent displacement. Moreover, there is no need to make special adjustments to the distance between the first support platform 250 and the second support platform 250, as a certain distance is formed by overlapping each other, and the distance can be maintained during movement. In addition, if the distance limited by the limiting part 253 is greater than the length of the electronic component C in the axis Axc direction, the electronic component C will not contact the support platform 250, thus minimizing damage caused by friction.

[0291] (5) The limiting portions 253 of the first support platform 250 and the second support platform 250 are provided in such a way that they protrude from the opposing surfaces of the first support platform 250 and the second support platform 250, and are at the same height. Therefore, a pair of support platforms 250 including the limiting portions 253 with the same amount of protrusion can be reversed and used as the first support platform 250 and the second support platform 250 respectively.

[0292] (6) The supply device 2 includes: a temporary stage 293, a temporary first receiving stage 250 or a second receiving stage 250; and a receiving stage moving mechanism 400, which moves the first receiving stage 250 or the second receiving stage 250 from the temporary stage 293 to the mask 240 to be reversed and overlapped. After reversal, the upper one of the first receiving stage 250 and the second receiving stage 250 moves to the temporary stage 293.

[0293] Therefore, by processing the new support platform 250 and the old support platform 250 via the common temporary stage 293, the movement path of the support platform 250 can be shortened, and the reversing-related operations can be performed efficiently. Furthermore, in this embodiment, by placing the temporary stage 293 in the center of the rotary table 292, the expansion of space is prevented.

[0294] (7) The holding member H of this embodiment is used to hold the electronic component C in order to form a film on a portion of the electronic component C by sputtering. The holding member H includes: a mask 240 having a plurality of mask holes 242 covering a portion of the electronic component C, through which the electronic component C passes and is held; and a support platform 250, which holds the mask 240 and contacts the end of the electronic component C that passes through the mask holes 242. The mask holes 242 are the inner diameter through which the electronic component C can pass, and the length in the axis Axm direction is the same as the length of the unsputtered area of ​​the electronic component C.

[0295] Therefore, by inserting the electronic component C into the mask hole 242 and bringing its end into contact with the support platform 250 holding the mask 240, the electronic component C can be held in the mask hole 242, and the height of the electronic component C can be set to a constant. Furthermore, since the length of the mask hole 242 in the Axm direction is the same as the length of the electronic component C outside the electrode forming region R in the Axc direction, it is easy to expose the head of the electronic component C from the mask hole 242. Thus, a large number of electronic components C can be uniformly exposed using a simple mechanism.

[0296] [Variation Example]

[0297] This embodiment also considers the following variations.

[0298] (1) The support platform 250 may be flat without the support portion 252. Furthermore, the mask 240 may be flat without the beam portion 244 and only include the plate 241. The support platform 250 and the mask 240 may be fixed together or formed integrally.

[0299] The limiting part 253 can be a component like a pin as described above, or it can be a wall surrounding the mask 240. Furthermore, the limiting part 253 can be omitted, and the spacing of the support platforms 250 can be limited by the electronic component C. In this case, one support platform 250 is placed on one support platform 250 and reversed, with the support platforms 250 supported by both ends of the electronic component C. Since the limiting part 253 is not required, the structure can be simplified.

[0300] (2) In the above configuration, the bearing table moving mechanism 400 includes two parts: the bearing table mounting part 410 and the bearing table disassembly part 420. However, it can also be made into a device that moves the bearing table 250 from the temporary table 293 and moves the bearing table 250 on the mask 240 to the temporary table 293 by means of a bearing table moving mechanism 400.

[0301] (3) In the described configuration, the magnetic components 285a and 605a of the adsorption force imparting part 285 and the adsorption force imparting part 605 are permanent magnets, but electromagnets can also be used. In this case, there is no need to provide a mechanism for connecting / disconnecting the magnetic components 285a and 605a; the presence or absence of the magnetic force can be switched by switching the current. Moreover, even if the magnetic component 285a is an electromagnet, it can be combined with a mechanism for connecting / disconnecting the magnetic components 285a and 605a. In this case, the influence of the magnetic force can be reliably blocked by the mechanism for connecting / disconnecting the magnetic components 285a, and even small and lightweight electronic components C can be reliably released from adsorption and retention.

[0302] (4) The adsorption unit may include a suction port for holding the electronic component C by negative pressure suction, and a suction pipe for supplying negative pressure to the suction port. In this case, the adsorption force imparting unit is configured as a negative pressure generating circuit that imparts suction force by negative pressure, and is connected to the suction pipe. Thus, even electronic components C made of materials or shapes that are difficult to be magnetically adsorbed can be adsorbed and held by negative pressure, and adsorption can be released by stopping the negative pressure, thereby supplying electronic components C. The opening area of ​​the suction port is set to be less than or equal to the area of ​​the smallest surface of the electronic component C. The suction port may be configured as a large number of holes formed in the adsorption plate, or the suction port may be covered by a porous material with air permeability. Thus, the suction port can be reduced in size, thereby suppressing the possibility of electronic components C being sucked into the suction pipe.

[0303] (5) The moving mechanism 270 only needs to move the mask 240 and the support table 250 relative to the slide 220. In this embodiment, the moving mechanism 270 is provided in the spacing adjustment part 260 to move the mask 240 and the support table 250, but it can also be configured to move the slide 220. In this case, the slide 220 is supported by the vibration table 231 of the vibration mechanism 230 in a way that allows relative movement. Furthermore, the moving mechanism 270 is provided between the vibration table 231 and the slide 220. The moving mechanism 270 can be, for example, a cylinder, and the slide 220 is moved along the X direction by moving the slide 220 relative to the vibration table 231. Thus, the slide 220 can be configured to move relative to the mask 240.

[0304] (6) The film forming processing unit 3 is not limited to an apparatus for forming a film by sputtering. It can be an apparatus for forming an electrode E by coating a conductive material on the electrode forming region R exposed from the mask hole 242 of the mask 240, or an apparatus for forming an electrode E by immersing the electrode forming region R in a conductive material.

[0305] (7) There may be at least one partition 225 in the slide 220. That is, there may be one or more. There may be at least one partition 245 in the mask 240 and at least one partition 211a in the housing section 210. That is, there may be one or more.

[0306] (8) The electrode forming region R is only required to be the region on the outer surface of the electronic component C that is electrically connected to the internal electrode En, and thus it can be the region at least one end of the electronic component C. For example, the electrode forming region R can be the region at both ends or only one end of the electronic component C in the axial direction Axc. That is, the film forming processing unit 3 only needs to be able to form a film at least one end of the electronic component C.

[0307] Furthermore, the electrode forming region R can be a portion of the electronic component C. For example, it can be a box-shaped region including the surface F along the axis Axc of the electronic component C, or it can be only the surface F along the axis Axc of the electronic component C (see reference). Figure 1 (A) Figure 1 (C) That is, the mask hole 242 may cover a portion of the electronic component C, specifically including a configuration that covers part or all of the side surface (the surface along the axis Axc) of the electronic component C. When the mask hole 242 covers the entire side surface of the electronic component C, the electronic component C is held by the mask hole 242 in a state where only the surface F in the direction orthogonal to the axis Axc is exposed.

[0308] (9) In the described embodiment, the following has been addressed: Figure 9 When (E) reverses, the case where the pusher 295 retracts (descends) to a position below position h is described, such that the distance between the pusher 295 and the holding mechanism 550 becomes the distance that allows reversal. However, the retraction position can also be below the rotary table 292. Even during the reversal operation, the rotary table 292 can be rotated as needed. Of course, unless otherwise assumed, such as... Figure 9 (A) Figure 9 As shown in (G), the retraction position can be made as close as possible to the holding mechanism 550. This shortens the receiving time. Furthermore, a lifting mechanism can be provided in the reversing mechanism 500 to retract (raise) the holding mechanism 550 to a position above position h. In this case, Figure 9 (C)~ Figure 9 During (F), the thruster 295 remains at position h, and the holding mechanism 550 remains in position h. Figure 9 Rise in (C), in Figure 9 The thruster 295 can be lowered in (F). Furthermore, the thruster 295 can be coordinated with the reversing mechanism 500 to form the distance required for reversal. As a result, the time required for reversal can be shortened.

[0309] [Other Implementation Methods]

[0310] The embodiments and variations of the present invention have been described above. However, these embodiments and variations are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, combinations, and modifications can be made without departing from the spirit of the invention. These embodiments or variations thereof are included in the scope or spirit of the invention, and are also included in the invention as described in the claims.

Claims

1. A supply device for supplying the electronic component to a film-forming processing unit of a film-forming apparatus for forming a film on an electronic component, and comprising: A mask having a mask aperture covering a portion of the electronic component, such that the electronic component passes through the mask aperture and is supplied to the film forming processing unit. A first support platform holds one side of the mask and contacts one end of the electronic component that passes through the mask hole; A second support platform holds the other side of the mask, and the other end of the electronic component passing through the mask hole contacts it; and The reversing mechanism reverses the mask while it is held between the first support platform and the second support platform.

2. The supply device according to claim 1, wherein The first support platform and the second support platform have the same shape.

3. The supply device according to claim 1, wherein The first support platform and the second support platform include a limiting part that is in contact with each other in a state of clamping the mask, thereby defining the interval between the positions in contact with the electronic component.

4. The supply device according to claim 3, wherein The limiting portions of the first support platform and the second support platform are provided in such a way that they protrude from the opposing surfaces of the first support platform and the second support platform, and are at the same height.

5. The supply device according to claim 1, comprising: A temporary platform for temporarily placing either the first or the second receiving platform; as well as The bearing platform moving mechanism moves either the first bearing platform or the second bearing platform from the temporary platform to the mask to be reversed and overlapped. After reversal, the uppermost of the first bearing platform and the second bearing platform moves to the temporary platform.

6. A film-forming apparatus, comprising: The supply device as described in any one of claims 1 to 5; as well as The film forming processing unit forms a film on the electronic components.

7. A holding member for holding the electronic component by sputtering a film onto a portion of the electronic component, and comprising: A mask having a plurality of mask holes covering a portion of the electronic component, allowing the electronic component to pass through and be held in place by the mask holes; as well as A support platform holds the mask, and the end of the electronic component passing through the mask aperture contacts it. The mask hole is the inner diameter through which the electronic component can pass, and its axial length is the same as the length of the unsputtered area of ​​the electronic component.

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